Semiconductor process apparatus and method of controlling the same

Abstract

The application discloses a semiconductor process equipment, which comprises a first working cavity, a second working cavity, an isolation valve, a main driving mechanism, an auxiliary driving mechanism and a sealing ring, wherein the isolation valve comprises a valve body and a valve door; the valve body is provided with a valve cavity, a first transmission port and a second transmission port; the first transmission port and the second transmission port are both communicated with the valve cavity; the first working cavity is communicated with the first transmission port; the second working cavity is communicated with the second transmission port; the valve door is movably arranged in the valve cavity; the main driving mechanism is used for driving the valve door body to selectively move to a closed position and an open position; and the auxiliary driving mechanism is used for driving the valve door body to move towards the first transmission port or away from the first transmission port when the valve door body is at the closed position, so that the compression amount of the sealing ring is maintained within a preset threshold range. The above scheme can solve the problem that the compression amount of the sealing ring is not within the preset threshold range when the valve door body seals the first transmission port.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a semiconductor process equipment and a control method thereof. BACKGROUND

[0002] The semiconductor process equipment is an equipment for performing a preset process on a semiconductor device (for example, a silicon wafer). The semiconductor process equipment usually includes a plurality of working cavities, and two adjacent working cavities are connected through an isolation valve. The isolation valve is usually connected with the chamber of the working cavity through a wafer transfer port. When the silicon wafer is processed in the working cavity, the wafer transfer port connected with the working cavity usually needs to be sealed. In the actual working process, the sealing of the wafer transfer port by the isolation valve is usually performed by a valve, and a sealing ring is arranged between the valve and the wafer transfer port. Different silicon wafers have different processing environments when processed in the working cavity, and the pressure in the working cavity is also different, so the force acting on the valve by the pressure in the working cavity is also different. Since the valve is always sealed to the wafer transfer port under the action of the driving force, the driving force acting on the valve is always constant, and the compression amount of the sealing ring is also different when the working cavity is in different working environments, and the compression amount of the sealing ring exceeds the preset threshold range, which causes damage to the sealing ring. SUMMARY

[0003] The present application discloses a semiconductor process equipment and a control method thereof to solve the problem that the compression amount of the sealing ring is not within the preset threshold range when the valve body seals the first wafer transfer port.

[0004] To solve the above problems, the present application adopts the following technical solutions:

[0005] In a first aspect, the present application discloses a semiconductor process equipment, comprising a first working cavity, a second working cavity, an isolation valve, a main driving mechanism, an auxiliary driving mechanism and a sealing ring, wherein:

[0006] The isolation valve comprises a valve body and a valve, the valve body is provided with a valve cavity, a first wafer transfer port and a second wafer transfer port, the first wafer transfer port and the second wafer transfer port are both connected with the valve cavity, the first working cavity is connected with the first wafer transfer port, and the second working cavity is connected with the second wafer transfer port;

[0007] The valve is movably arranged in the valve cavity, and the valve comprises a valve body, the valve body has a first surface and a second surface opposite to each other, and the first surface seals the first wafer transfer port through the sealing ring;

[0008] The main driving mechanism is used for driving the valve body to selectively move to a closed position and an open position, the closed position is a position where the valve body closes the first wafer transfer port, and the open position is a position where the valve body opens the first wafer transfer port;

[0009] The auxiliary driving mechanism is used for driving the valve body to move towards or away from the first transmission port when the valve body is in the closed position, so that the compression amount of the sealing ring is maintained within a preset threshold range.

[0010] In a second aspect, the application also discloses a control method of a semiconductor process equipment, the semiconductor process equipment being the semiconductor process equipment described in the first aspect, and the control method of the semiconductor process equipment comprising:

[0011] detecting a first gas pressure in the first working cavity and detecting a second gas pressure in the second working cavity;

[0012] calculating a first pressure on the first surface and calculating a second pressure on the second surface;

[0013] in the case that the first pressure is greater than the second pressure, controlling the auxiliary driving mechanism to drive the valve body to move towards the first transmission port until the compression amount of the sealing ring is maintained within a preset threshold range;

[0014] in the case that the first pressure is less than the second pressure, controlling the auxiliary driving mechanism to drive the valve body to move away from the first transmission port until the compression amount of the sealing ring is maintained within a preset threshold range.

[0015] The technical scheme adopted by the application can achieve the following technical effects:

[0016] The semiconductor process equipment disclosed by the application is provided with an isolation valve, the isolation valve comprising a valve body and a valve door, the valve body being provided with a valve cavity, a first transmission port and a second transmission port, so that the first transmission port and the second transmission port are both in communication with the valve cavity, and then the first working cavity is in communication with the first transmission port, and the second working cavity is in communication with the second transmission port, finally the first working cavity is in communication with the second working cavity through the first transmission port, the valve cavity and the second transmission port in sequence, so that the silicon wafer can be transmitted between the first working cavity and the second working cavity; the valve door comprises a valve body, the valve door is movably arranged in the valve cavity, so that the first surface of the valve body seals the first transmission port through a sealing ring, and then the silicon wafer can be processed in a sealed environment in the first working cavity.

[0017] The main driving mechanism is arranged to drive the valve body to selectively move to the closed position and the open position, so that the valve body seals the first transmission port in the closed position, and the valve body opens the first transmission port in the open position; the auxiliary driving mechanism is arranged to drive the valve body to move towards or away from the first transmission port when the valve body is in the closed position, so that the compression amount of the sealing ring can be maintained within a preset threshold range, and the problems of damage of the sealing ring caused by excessive pressure when the valve body seals the first transmission port and the problem of poor sealing caused by insufficient pressure when the valve body seals the first transmission port can be effectively prevented. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and serve to explain the principles of the application. In the drawings:

[0019] Figure 1 A first semiconductor process equipment structure schematic view disclosed by the embodiment of the application is provided;

[0020] Figure 2 A second semiconductor process equipment structure schematic view disclosed by the embodiment of the application is provided;

[0021] Figure 3 A valve structure schematic view in a first view disclosed by the embodiment of the application is provided;

[0022] Figure 4 A valve structure schematic view in a second view disclosed by the embodiment of the application is provided;

[0023] Figure 5 An auxiliary driving mechanism and a connecting bracket connection structure schematic view disclosed by the embodiment of the application is provided;

[0024] Figure 6 A control schematic view of the auxiliary driving mechanism disclosed by the embodiment of the application is provided.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] 100 - first working cavity,

[0027] 200 - second working cavity,

[0028] 300 - isolation valve, 310 - valve body, 311 - valve cavity, 312 - first transmission port, 313 - second transmission port, 321 - valve body, 321a - first surface, 321b - second surface, 322 - valve rod, 323 - connecting protrusion,

[0029] 400 - auxiliary drive mechanism, 410 - cylinder, 411 - first sub-cavity, 412 - second sub-cavity, 420 - piston rod,

[0030] 500 - sealing ring,

[0031] 600 - connecting bracket, 610 - guide portion,

[0032] 700 - first fluid pipeline, 710 - electric proportional valve,

[0033] 800 - second fluid pipeline, 810 - pressure reducing valve,

[0034] 900 - elastic sealing member. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely below in combination with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0036] The technical solutions disclosed in the various embodiments of the present application will be described in detail below in combination with the drawings.

[0037] Please refer to Figures 1 to 6 The embodiments of the present application disclose a semiconductor process equipment which can be used for processing silicon wafers. The disclosed semiconductor process equipment includes a first working cavity 100, a second working cavity 200, an isolation valve 300, a main drive mechanism, an auxiliary drive mechanism 400 and a sealing ring 500.

[0038] The first working cavity 100 and the second working cavity 200 can be a cavity for processing silicon wafers, or a transmission cavity. The isolation valve 300 can be arranged between the first working cavity 100 and the second working cavity 200, and the isolation valve 300 is used to separate or communicate the cavities of the first working cavity 100 and the second working cavity 200. The isolation valve 300 includes a valve body 310 and a valve.

[0039] The valve body 310 is provided with a valve cavity 311, a first transmission port 312 and a second transmission port 313. The first transmission port 312 and the second transmission port 313 are both in communication with the valve cavity 311. The first working cavity 100 is in communication with the first transmission port 312, and the second working cavity 200 is in communication with the second transmission port 313. Specifically, the silicon wafer can pass through the first transmission port 312, the valve cavity 311 and the second transmission port 313 in sequence from the first working cavity 100 to the second working cavity 200 for processing. After processing, the silicon wafer enters the first working cavity 100 through the second transmission port 313, the valve cavity 311 and the first transmission port 312.

[0040] A valve is movably arranged in the valve cavity 311. The valve includes a valve body 321 having opposite first and second surfaces 321a and 321b. The first surface 321a seals the first transmission port 312 by a sealing ring 500. The valve body 321 can also be used to seal the second transmission port 313. The valve can be movably connected to the valve body 310, such as being hinged. The valve can also be movably connected to the valve body 310 by a main driving mechanism. The sealing ring 500 can be arranged on the valve body 321 or on the inner wall of the first transmission port 312. When the valve body 321 seals the first transmission port 312, the sealing ring 500 is located between the first surface 321a and the inner wall of the first transmission port 312.

[0041] The main driving mechanism is used to drive the valve body 321 to selectively move to a closed position and an open position. The closed position is a position where the valve body 321 seals the first transmission port 312. The open position is a position where the valve body 321 opens the first transmission port 312. Specifically, the closed position is a position where the valve body 321 seals the first transmission port 312, and the open position is a position where the valve body 321 opens the first transmission port 312 and avoids the first transmission port 312. In actual operation, the main driving mechanism can drive the valve body 321 to move up and down. When the valve body 321 is opposite to the first transmission port 312, the main driving mechanism can drive the valve body 321 to move left and right to seal the first transmission port 312. The main driving mechanism can be of various types, such as a hydraulic telescopic member, a pneumatic telescopic member, a shape memory alloy member, etc. The specific type of the main driving mechanism is not limited in the present application.

[0042] The auxiliary driving mechanism 400 is used to drive the valve body 321 to move towards or away from the first transmission port 312 when the valve body 321 is in the closed position, so that the compression amount of the sealing ring 500 is maintained within a preset threshold range. The type of auxiliary driving mechanism 400 can be various, for example, the auxiliary driving mechanism 400 can be a hydraulic telescopic piece, a pneumatic telescopic piece, a shape memory alloy piece, etc., and the embodiment of the present application does not limit the specific type of auxiliary driving mechanism 400.

[0043] The size of the sealing ring 500 can be set according to the size of the first transmission port 312, and the thickness of the sealing ring 500 is proportionally adjusted according to the size of the first transmission port 312. When the valve body 321 is in the closed position, the preset threshold of the compression amount of the sealing ring 500 can be a compression amount of 12% to 18% in the thickness direction.

[0044] In the specific implementation process, the isolation valve 300 includes a valve body 310 and a valve, the valve body 310 is provided with a valve cavity 311, a first transmission port 312 and a second transmission port 313, and the first working cavity 100 and the second working cavity 200 are communicated in sequence through the first transmission port 312, the valve cavity 311 and the second transmission port 313. The valve is movably arranged in the valve cavity 311, and the valve includes a valve body 321, the valve body 321 has opposite first and second surfaces 321a and 321b, the first surface 321a seals the first transmission port 312 through a sealing ring 500, and a main driving mechanism drives the valve body 321 to selectively move to a closed position and an open position. When the valve body 321 is in the closed position, the valve body 321 seals the first transmission port 312, and an auxiliary driving mechanism 400 drives the valve body 321 to move towards or away from the first transmission port 312, so that the compression amount of the sealing ring 500 is maintained within a preset threshold range.

[0045] The semiconductor process equipment disclosed in the present application is provided with an isolation valve 300, the isolation valve 300 includes a valve body 310 and a valve, the valve body 310 is provided with a valve cavity 311, a first transmission port 312 and a second transmission port 313, so that the first transmission port 312 and the second transmission port 313 are both communicated with the valve cavity 311, and then the first working cavity 100 is communicated with the first transmission port 312, and the second working cavity 200 is communicated with the second transmission port 313, finally the first working cavity 100 is communicated with the second working cavity 200 in sequence through the first transmission port 312, the valve cavity 311 and the second transmission port 313, so that the silicon wafer can be transmitted between the first working cavity 100 and the second working cavity 200; the valve includes a valve body 321, the valve is movably arranged in the valve cavity 311, so that the first surface 321a of the valve body 321 seals the first transmission port 312 through a sealing ring 500, and then the silicon wafer is processed in a sealed environment in the first working cavity.

[0046] The main driving mechanism is arranged to drive the valve body 321 to selectively move to the closed position and the open position, so that the valve body 321 seals the first flapper port 312 when in the closed position, and the valve body 321 opens the first flapper port 312 when in the open position. The auxiliary driving mechanism 400 is arranged to drive the valve body 321 to move towards or away from the first flapper port 312 when the valve body 321 is in the closed position, so that the compression amount of the sealing ring 500 can be maintained within a preset threshold range. By maintaining the compression amount of the sealing ring 500 within the preset threshold range, the problem of damage to the sealing ring 500 caused by excessive pressure when the valve body 321 seals the first flapper port 312 can be effectively prevented, and the problem of poor sealing caused by insufficient pressure when the valve body 321 seals the first flapper port 312 can also be avoided.

[0047] When the valve body 321 switches between the closed position and the open position, the sealing ring 500 is in a compressed state between the valve body 321 and the inner wall of the first flapper port 312. Moving the sealing ring 500 in the compressed state can cause damage to the sealing ring 500. To solve the problem of damage to the sealing ring 500, an optional embodiment of the main driving mechanism can be used to drive the valve body 321 to switch between the closed position and the open position via a transfer position. When the valve body 321 is in the transfer position, the valve body 321 is opposite to the first flapper port 312, and a gap is left between the sealing ring 500 and the first surface 321a or between the sealing ring 500 and the inner wall of the first flapper port 312. Specifically, when the sealing ring 500 is arranged on the valve body 321, a gap is left between the sealing ring 500 and the inner wall of the first flapper port 312, and when the sealing ring 500 is arranged on the inner wall of the first flapper port 312, a gap is left between the sealing ring 500 and the first surface 321a.

[0048] By arranging the transfer position for the valve body 321, the valve body 321 is opposite to the first flapper port 312, and a gap is left between the sealing ring 500 and the first surface 321a or between the sealing ring 500 and the inner wall of the first flapper port 312. Thus, when the valve body 321 switches between the closed position and the open position, it can first switch to the transfer position, which can effectively prevent damage to the sealing ring 500 caused by the sealing ring 500 being tightly attached to the inner wall of the first flapper port 312 when the valve body 321 switches directly from the closed position to the open position or from the open position to the closed position.

[0049] An optional embodiment, the valve further comprises a valve stem 322, the main drive mechanism is connected with the valve body 321 through the valve stem 322. Specifically, the main drive mechanism can be arranged on the valve body 310, the main drive mechanism can be connected with one end of the valve stem 322, and the other end of the valve stem 322 can be connected with the valve body 321. The main drive mechanism can drive the valve body 321 to switch between the closed position and the open position through the valve stem 322.

[0050] The auxiliary drive mechanism 400 is connected with the valve stem 322 through the connecting bracket 600, and the auxiliary drive mechanism 400 can be connected with the end of the valve stem 322 or the middle of the valve stem 322. When the valve body 321 is in the closed position, the auxiliary drive mechanism 400 drives the valve body 321 to move towards or away from the first transmission port 312 through the connecting bracket 600 and the valve stem 322, so that the compression amount of the sealing ring 500 is within the preset threshold range. Specifically, when the valve body 321 is in the closed position, the valve stem 322 can have a contact fulcrum between the valve body 310 or the main drive mechanism, and the valve stem 322 can rotate relative to the fulcrum. The connecting bracket 600 can be connected with the valve stem 322, the connecting position of the connecting bracket 600 and the valve stem 322 is away from the fulcrum, the auxiliary drive mechanism 400 is connected with the connecting bracket 600, the auxiliary drive mechanism 400 drives the valve stem 322 to rotate through the connecting bracket 600, and through the lever principle, the valve stem 322 drives the valve body 321 to move towards or away from the first transmission port 312. Since the auxiliary drive mechanism 400 drives the valve body 321 only controls the compression amount of the sealing ring 500, the sealing ring 500 itself has a small thickness, therefore, the moving distance of the valve body 321 is short, and the moving route can be approximately a straight line.

[0051] By arranging the valve stem 322, the main drive mechanism can be connected with the valve body 321 through the valve stem 322, and the auxiliary drive mechanism 400 can be connected with the valve stem through the connecting bracket 600, so that the main drive mechanism can drive the valve body 321 to switch between the closed position and the open position through the valve stem 322; by arranging the connecting bracket 600, the auxiliary drive mechanism 400 can be connected with the valve stem 322 through the connecting bracket 600, so that the auxiliary drive mechanism 400 drives the valve stem 322 to move through the connecting bracket 600, and the valve stem 322 drives the valve body 321 to move towards or away from the first transmission port 312, so that the compression amount of the sealing ring 500 is within the preset threshold range. Moreover, by directly or indirectly connecting the main drive mechanism and the auxiliary drive mechanism 400 with the valve stem 322, the problem of complex processing caused by too concentrated installation of components can be avoided.

[0052] In an alternative embodiment, the valve rod 322 is sleeved with an elastic sealing member 900, the top end of the elastic sealing member 900 is sealingly connected with the side wall of the valve cavity 311, and the bottom end of the elastic sealing member 900 is sealingly connected with the side wall of the valve rod 322. By arranging the elastic sealing member 900, the transmission part of the valve rod 322 and the chambers can be isolated when the valve rod 322 moves in the valve cavity 311, so as to avoid affecting the normal work of the transmission part and reduce the service life of the transmission part. Specifically, the elastic sealing member can be a bellows.

[0053] Further, the connecting bracket 600 is provided with a guide portion 610, and the valve rod 322 is slidingly connected with the guide portion 610. Specifically, the guide portion 610 can be a through hole penetrating through the connecting bracket 600, the valve rod 322 passes through the through hole and is slidingly connected with the connecting bracket 600, and the valve rod 322 can rotate relative to the connecting bracket; the guide portion 610 can also be a groove structure, and a sliding portion matched with the groove can be arranged on the valve rod 322, the sliding portion can slide along the groove, and the sliding portion can also rotate relative to the groove. The valve body 321 can be switched between the open position and the closed position through the transfer position under the cooperation of the valve rod 322 and the guide portion 610. Specifically, the main driving mechanism can drive the valve rod 322 to slide along the guide portion 610, so as to switch the valve body 321 between the closed position and the open position through the transfer position. When the valve rod 322 moves in a direction not guided by the guide portion 610, the guide portion 610 can limit the valve rod 322. In the closed position, the guide portion 610 does not slide with the valve rod 322, and the connection between the guide portion 610 and the valve rod 322 can rotate relative to each other. At this time, the connection between the guide portion 610 and the valve rod 322 is equivalent to a lever fulcrum, and the auxiliary driving mechanism 400 can drive the valve rod 322 to rotate relative to the guide portion 610, so as to drive the valve body 321 to move towards or away from the first transmission port 312.

[0054] By arranging the guide portion 610 on the connecting bracket 600, the valve rod 322 can be slidingly connected with the guide portion 610, and the valve body 321 can be switched between the open position and the closed position through the transfer position under the cooperation of the valve rod 322 and the guide portion 610. Through the cooperation of the connecting bracket 600 and the valve rod 322, the problem that the valve body 321 is switched between the open position and the closed position is effectively solved, and the problem that the auxiliary driving mechanism 400 drives the valve body 321 to move towards or away from the first transmission port 312 is also solved.

[0055] Further, the guide portion 610 can be a strip-shaped guide hole, and the valve can further include a connecting protrusion 323 fixed on the valve rod 322, the connecting protrusion 323 can be in sliding fit with the strip-shaped guide hole, and the connecting protrusion 323 can also rotate relative to the strip-shaped guide hole, and the auxiliary driving mechanism 400 can be connected with the valve driving through the fit of the connecting protrusion 323 and the strip-shaped guide hole. Specifically, the connecting protrusion 323 can slide along the strip-shaped guide hole to drive the valve rod 322 to switch the valve body 321 between the closed position and the open position. When the connecting protrusion 323 does not move along the guiding direction of the strip-shaped guide hole, the strip-shaped guide hole has the function of limiting the movement of the connecting protrusion 323. In the closed position, the connecting protrusion 323 can rotate with the strip-shaped guide hole, and the valve body 321 can move towards or away from the first transmission port 312 under the limiting and rotating effects of the connecting protrusion 323 and the strip-shaped guide hole. The auxiliary driving mechanism 400 can be connected with the valve driving through the limiting effect of the connecting protrusion 323 and the strip-shaped guide hole.

[0056] By setting the guide portion as a strip-shaped guide hole and setting the connecting protrusion 323 on the valve rod 322 to fit with the strip-shaped guide hole, the connecting bracket 600 can be connected with the valve rod 322 in sliding manner, and then the auxiliary driving mechanism 400 can be connected with the valve driving through the limiting fit of the connecting protrusion 323 and the strip-shaped guide hole. Moreover, the structure of the strip-shaped guide hole is simple, and the structure of the connecting protrusion 323 fitting with the strip-shaped guide hole is also relatively simple, which can reduce the processing cost.

[0057] In an alternative embodiment, the connecting bracket 600 can further include a groove-shaped structural member, the groove-shaped structural member can be provided with a through groove space, and the valve rod 322 can pass through the groove space along the through direction of the groove-shaped structural member. The two side walls of the groove space are both provided with strip-shaped guide holes, the extension direction of the strip-shaped guide holes can be consistent with the through direction, and the valve rod 322 is provided with connecting protrusions 323 on the two opposite sides, the connecting protrusions 323 can be in sliding fit with the corresponding strip-shaped guide holes. The connecting protrusions 323 and the strip-shaped guide holes can be in limiting fit in the direction perpendicular to the sliding direction.

[0058] By setting the groove-shaped structural member, the valve rod 322 can pass through the groove space of the groove-shaped structural member, by setting the strip-shaped guide holes on the two side walls of the groove space and making the extension direction of the strip-shaped guide holes consistent with the through direction, and by setting the connecting protrusions 323 on the two opposite sides of the valve rod 322, the valve rod 322 can be moved in the through direction of the groove-shaped structural member through the sliding fit of the strip-shaped guide holes and the connecting protrusions 323, and then the auxiliary driving mechanism 400 can be connected with the valve driving through the limiting fit of the connecting protrusions 323 and the strip-shaped guide holes, and then the large deflection of the valve rod 322 can be avoided.

[0059] An optional embodiment, the connecting bracket 600 is connected between the two ends of the valve rod 322, the first end of the valve rod 322 is connected with the valve body 321, and the second end of the valve rod 322 is connected with the main driving mechanism. By connecting the second end of the valve rod 322 with the main driving mechanism, the main driving mechanism can drive the valve body 321 to switch between the open position and the closed position through the valve rod 322. In the closed position, the main driving mechanism can also serve as a rotation fulcrum of the valve rod 322. The connecting bracket 600 is arranged between the two ends of the valve rod 322, so that the auxiliary driving mechanism 400 can drive the connecting bracket 600 to move, so that the valve rod 322 rotates relative to the rotation fulcrum, and under the action of the lever principle, the valve rod 322 drives the valve body 321 to move towards or away from the first transmission port 312, so that the compression amount of the sealing ring 500 is maintained within the preset threshold range.

[0060] An optional embodiment, the first end of the valve rod 322 can be connected with the valve body 321, the connecting bracket 600 can be connected at the second end of the valve rod 322, and the main driving mechanism can be connected between the two ends of the valve rod 322. By connecting the main driving mechanism between the two ends of the valve rod 322, the main driving mechanism can drive the valve body 321 to switch between the open position and the closed position through the valve rod 322. In the closed position, the main driving mechanism can also serve as a rotation fulcrum of the valve rod 322. The connecting bracket 600 is arranged at the second end of the valve rod 322, so that the auxiliary driving mechanism 400 can drive the connecting bracket 600 to move, so that the valve rod 322 rotates relative to the rotation fulcrum, and under the action of the lever principle, the valve rod 322 drives the valve body 321 to move towards or away from the first transmission port 312, so that the compression amount of the sealing ring 500 is maintained within the preset threshold range.

[0061] An optional embodiment, the auxiliary driving mechanism 400 can be a fluid driving system, which can be a driving system using gas as medium or a driving system using liquid as medium. The fluid driving system includes a cylinder body 410 and a piston rod 420. The piston rod 420 is arranged in the cylinder body 410 and can slide along the cylinder body 410. The piston rod 420 is connected with the valve, and the cylinder body 410 is fixed in the valve wall of the valve body 310. By arranging the auxiliary driving mechanism 400 as a fluid driving system, the piston rod 420 can slide smoothly relative to the cylinder body 410 under the action of the fluid medium, avoiding the piston rod 420 moving too fast relative to the cylinder body 410, which can cause the piston rod 420 to exert too much force on the valve, thereby causing the compression amount of the sealing ring 500 to exceed the preset threshold range.

[0062] Further, the fluid driving system can further include a first fluid pipeline 700 and a second fluid pipeline 800, and the piston rod 420 can separate the internal space of the cylinder 410 into a first sub-cavity 411 and a second sub-cavity 412. Specifically, the piston rod 420 can be a T-shaped structure. The first fluid pipeline 700 is in communication with the first sub-cavity 411, and the second fluid pipeline 800 is in communication with the second sub-cavity 412. The first fluid pipeline 700 is provided with an electric proportional valve 710, and the second fluid pipeline 800 is provided with a pressure reducing valve 810. Specifically, the electric proportional valve 710 and the pressure reducing valve 810 can control the pressure of the first sub-cavity 411 and the second sub-cavity 412, respectively, so as to control the force acting on the piston rod 420 on both sides in the cylinder 410, and then control the force output by the piston rod 420 to the valve, and finally effectively control the compression amount of the sealing ring 500 when the valve body 321 is in the closed position to maintain within a preset threshold range.

[0063] An optional embodiment is that the first working cavity 100 can be a process cavity, and the second working cavity 200 can be a transmission cavity. The first working cavity 100 is set as a process cavity, so that the silicon wafer can be processed in the process cavity. The second working cavity 200 is set as a transmission cavity, so that the silicon wafer can pass through the transmission cavity when being transmitted to the process cavity, so that the silicon wafer is always in the chamber environment, thereby effectively protecting the silicon wafer in the transmission process.

[0064] The embodiment of the present application further discloses a control method of a semiconductor process equipment, and the semiconductor process equipment is the semiconductor process equipment disclosed in the above embodiment. The semiconductor process equipment includes a first working cavity 100, a second working cavity 200, an isolation valve 300, a main driving mechanism, an auxiliary driving mechanism 400 and a sealing ring 500.

[0065] The isolation valve 300 includes a valve body 310 and a valve, the valve body 310 is provided with a valve cavity 311, a first transmission port 312 and a second transmission port 313, the first transmission port 312 and the second transmission port 313 are both in communication with the valve cavity 311, the first working cavity 100 is in communication with the first transmission port 312, and the second working cavity 200 is in communication with the second transmission port 313.

[0066] The valve is movably arranged in the valve cavity 311, and the valve includes a valve body 321, the valve body 321 has opposite first and second surfaces 321a and 321b, and the first surface 321a seals the first transmission port 312 through the sealing ring 500.

[0067] The main driving mechanism is used for driving the valve body 321 to selectively move to a closed position and an open position, the closed position is a position where the valve body 321 closes the first transmission port 312, and the open position is a position where the valve body 321 opens the first transmission port 312.

[0068] The auxiliary driving mechanism 400 is used to drive the valve body 321 to move towards or away from the first flange port 312 when the valve body 321 is in the closed position, so as to maintain the compression amount of the sealing ring 500 within a preset threshold range.

[0069] The control method of the semiconductor process equipment can be used to control the compression amount of the sealing ring 500 to maintain within a preset threshold range when the valve body 321 is in the closed position. Specifically, the preset threshold range of the sealing ring 500 can be a compression amount of 12% to 18% in the thickness direction.

[0070] The control method of the semiconductor process equipment includes:

[0071] Detecting the first gas pressure in the first working chamber 100 and detecting the second gas pressure in the second working chamber 200;

[0072] Calculating the first pressure on the first surface 321a and calculating the second pressure on the second surface 321b;

[0073] In the case where the first pressure is greater than the second pressure, the auxiliary driving mechanism 400 is controlled to drive the valve body 321 to move towards the first flange port 312 until the compression amount of the sealing ring 500 is maintained within the preset threshold range;

[0074] In the case where the first pressure is less than the second pressure, the auxiliary driving mechanism 400 is controlled to drive the valve body 321 to move away from the first flange port 312 until the compression amount of the sealing ring 500 is maintained within the preset threshold range.

[0075] For the convenience of understanding, the first working chamber 100 is taken as a process chamber, the second working chamber 200 is taken as a transfer chamber, and the driving point of the auxiliary driving mechanism 400 is taken between the two ends of the valve rod 322.

[0076] Suppose the pressure read by the transfer chamber is P1, and the pressure read by the process chamber is P2. P2-P1 is the pressure difference between the two ends of the valve body 321. The area surrounded by the sealing ring 500 is S. At this time, because of the pressure difference, the force △F acting on the valve body 321 is (P2-P1)×S. △F is positive, indicating that the valve plate receives a leftward force, and △F is negative, indicating that the valve plate receives a rightward force.

[0077] The auxiliary driving mechanism 400 adjusts the force applied to the valve rod 322 without affecting the original action and function of the cylinder. The fulcrum is fixed horizontally, and the relationship between F and AF is F = AF x (L1 + L2) / L2, wherein F is the adjusting force of the driving point of the auxiliary driving mechanism 400 to the valve rod 321, L1 is the distance between the driving point of the auxiliary driving mechanism 400 and the center of the sealing ring 500, and L2 is the distance between the fulcrum and the driving point of the auxiliary driving mechanism 400. Further, F = (P2 - P1) x S x (L1 + L2) / L2 is obtained.

[0078] As shown in Figure 6 the size of F can be achieved by a fluid driving system. The pressure reducing valve 810 is used to adjust the pressure P4 of the second fluid pipeline 800, and the electric proportional valve 710 is used to adjust the pressure P3 of the first fluid pipeline 700. In this way, the force F output by the cylinder is F = P3 x S3 - P4 x S4, wherein S3 and S4 are the areas of the two sides of the piston. P4 is adjusted to a constant pressure by the pressure reducing valve 810, and the left side pressure P3 of the cylinder is adjusted by the electric proportional valve 710, so that the change of the force F can be realized. When P1 < P2, the pressure difference force AF received by the valve body 321 is to the left, and F needs to be pressed to the right. The calculation formula of P3 is P3 = [(P2 - P1) x S x (L1 + L2) / L2 + P4 x S4] / S3. If the pressure of the transmission chamber or the process chamber changes when the valve is closed, P1 gradually increases or P2 gradually decreases, and the difference P2 - P1 gradually decreases. When P1 = P2, P3 = P4 x S4 / S3, at this time, the cylinder is in a balanced state and does not output a horizontal force. When P2 > P1, the pressure AF received by the valve body 321 changes to the right, and F pulls the valve rod 322 to the left. To realize that F pulls the valve rod 322 to the left, P4 needs to meet certain conditions: P3 is within the adjustment range of the electric proportional valve 710, P3 > 0, [(P2 - P1) x S x (L1 + L2) / L2 + P4 x S4] / S3 > 0, and P4 > (P1 - P2) x S x (L1 + L2) / (L2 x S4) is obtained by calculation, wherein (P1 - P2) takes the maximum value under actual working conditions. That is, when P3 > P4 x S4 / S3, the cylinder outputs a rightward force; when P3 = P4 x S4 / S3, the cylinder does not output a force; and when P3 < P4 x S4 / S3, the cylinder outputs a leftward force.

[0079] In addition, when the driving point of the auxiliary driving mechanism 400 is located at the end of the valve rod 322, the principle is similar and will not be described again.

[0080] The first gas pressure in the first working cavity 100 is detected, and the second gas pressure in the second working cavity 200 is detected, so that the first pressure borne by the first surface 321a and the second pressure borne by the second surface 321b can be calculated, and then in the case that the first pressure is greater than the second pressure, the auxiliary driving mechanism 400 is controlled to drive the valve body 321 to move towards the first transmission port 312 until the compression amount of the sealing ring is maintained within a preset threshold range, or in the case that the first pressure is less than the second pressure, the auxiliary driving mechanism 400 is controlled to drive the valve body 321 to move away from the first transmission port 312 until the compression amount of the sealing ring 500 is maintained within a preset threshold range, thereby solving the problem of controlling the compression amount of the sealing ring 500 within a preset threshold range.

[0081] The differences between the various embodiments are mainly described in the above embodiments, and the optimization features different between the various embodiments can be combined to form a better embodiment without contradiction, and the combination is not described herein in the interest of brevity.

[0082] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, and all the forms belong to the protection of the present application.

Claims

1. A semiconductor process apparatus, characterized in that, It includes a first working chamber (100), a second working chamber (200), an isolation valve (300), a main drive mechanism, an auxiliary drive mechanism (400), and a sealing ring (500), wherein: The isolation valve (300) includes a valve body (310) and a valve. The valve body (310) is provided with a valve cavity (311), a first transfer port (312) and a second transfer port (313). The first transfer port (312) and the second transfer port (313) are both connected to the valve cavity (311). The first working chamber (100) is connected to the first transfer port (312), and the second working chamber (200) is connected to the second transfer port (313). The valve is movably disposed within the valve cavity (311). The valve includes a valve body (321) and a valve stem (322). The main drive mechanism is connected to the valve body (321) via the valve stem (322). The valve body (321) has a first surface (321a) and a second surface (321b) facing away from each other. The first surface (321a) seals the first transfer port (312) via the sealing ring (500). The main drive mechanism is used to drive the valve body (321) to selectively move to a closed position and an open position. The closed position is the position where the valve body (321) closes the first transfer port (312), and the open position is the position where the valve body (321) opens the first transfer port (312). The auxiliary drive mechanism (400) is used to drive the valve stem (322) to rotate around the fulcrum when the valve body (321) is in the closed position, with the main drive mechanism as the fulcrum, according to the first pressure on the first surface (321a) and the second pressure on the second surface (321b). The valve stem (322) drives the valve body (321) to move towards or away from the first transfer port (312), so that the compression of the sealing ring (500) is maintained within a preset threshold range.

2. The semiconductor process equipment according to claim 1, characterized in that, The main drive mechanism is used to drive the valve body (321) to switch between the closed position and the open position via a transfer position; When the valve body (321) is in the intermediate position, the valve body (321) is opposite to the first transfer port (312), and there is a gap between the sealing ring (500) and the first surface (321a) or between the sealing ring (500) and the inner wall where the first transfer port (312) is located.

3. The semiconductor process equipment according to claim 2, characterized in that, The valve also includes a valve stem (322), and the main drive mechanism is connected to the valve body (321) through the valve stem (322); The auxiliary drive mechanism (400) is connected to the valve stem (322) via a connecting bracket (600), and via the connecting bracket (600) drives the valve body (321) to move toward or away from the first transfer port (312) when the valve body (321) is in the closed position.

4. The semiconductor process equipment according to claim 3, characterized in that, The connecting bracket (600) is provided with a guide (610), the valve stem (322) slides with the guide (610), and the valve body (321) can switch between the open position and the closed position through the transfer position with the cooperation of the valve stem (322) and the guide (610).

5. The semiconductor process equipment according to claim 4, characterized in that, The guide part (610) is a strip-shaped guide hole. The valve also includes a connecting protrusion (323) fixed on the valve stem (322). The connecting protrusion (323) slides with the strip-shaped guide hole. The auxiliary drive mechanism (400) is connected to the valve drive through the cooperation between the connecting protrusion (323) and the strip-shaped guide hole.

6. The semiconductor process equipment according to claim 5, characterized in that, The connecting bracket (600) includes a groove-shaped structural component with a through-hole space. The valve stem (322) passes through the through-hole space along the through-hole direction of the groove-shaped structural component. The two side walls of the through-hole space are provided with strip-shaped guide holes. The extension direction of the strip-shaped guide holes is consistent with the through-hole direction. The valve stem (322) is provided with connecting protrusions (323) on both opposite sides. The connecting protrusions (323) slide with the corresponding strip-shaped guide holes.

7. The semiconductor process equipment according to claim 5, characterized in that, The connecting bracket (600) is connected between the two ends of the valve stem (322), the first end of the valve stem (322) is connected to the valve body (321), and the second end of the valve stem (322) is connected to the main drive mechanism.

8. The semiconductor process equipment according to claim 5, characterized in that, The first end of the valve stem (322) is connected to the valve body (321), the connecting bracket (600) is connected to the second end of the valve stem (322), and the main drive mechanism is connected between the two ends of the valve stem (322).

9. The semiconductor process equipment according to claim 1, characterized in that, The auxiliary drive mechanism (400) is a fluid drive system, which includes a cylinder (410) and a piston rod (420). The piston rod (420) is disposed in the cylinder (410) and can slide along the cylinder (410). The piston rod (420) is connected to the valve, and the cylinder (410) is fixed inside the valve wall of the valve body (310).

10. The semiconductor process equipment according to claim 9, characterized in that, The fluid drive system includes a first fluid line (700) and a second fluid line (800). The piston rod (420) divides the internal space of the cylinder (410) into a first sub-cavity (411) and a second sub-cavity (412). The first fluid line (700) is connected to the first sub-cavity (411), and the second fluid line (800) is connected to the second sub-cavity (412). The first fluid line (700) is provided with an electro-proportional valve (710), and the second fluid line (800) is provided with a pressure reducing valve (810).

11. The semiconductor process equipment according to claim 1, characterized in that, The first working chamber (100) is a process chamber, and the second working chamber (200) is a transmission chamber.

12. A control method for semiconductor process equipment, characterized in that, The semiconductor process equipment is the semiconductor process equipment according to claim 1, and the control method includes: The first gas pressure in the first working chamber (100) and the second gas pressure in the second working chamber (200) are detected; Calculate the first pressure on the first surface (321a) and the second pressure on the second surface (321b); When the first pressure is greater than the second pressure, the auxiliary drive mechanism (400) is controlled to drive the valve body (321) to move toward the first transfer port (312) until the compression of the sealing ring (500) is maintained within the preset threshold range. When the first pressure is less than the second pressure, the auxiliary drive mechanism (400) is controlled to drive the valve body (321) to move away from the first transfer port (312) until the compression of the sealing ring (500) is maintained within the preset threshold range.

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