A test system for detecting single-bar strip performance and method of use

Abstract

The application relates to a test system for detecting the performance of a single-bar and a use method, and belongs to the technical field of laser production equipment, which comprises an integrating sphere test set, a three-dimensional adjusting frame, a sample platform with a TEC temperature control system, and a rapid pressing clamp with a TEC temperature control system. The real-time temperature of a single-bar unit to be detected is accurately controlled through a double-TEC temperature control system, so that the stability of the temperature during the test is ensured. The single-bar unit can be tested under a large current when being secondarily packaged due to the high-efficiency and accurate temperature control capacity of the TEC. The three-dimensional adjusting frame ensures that the integrating sphere can accurately and reliably test the power, wavelength and other data of the single-bar unit, so that the pre-selection of the single-bar is realized, and the technical problem that the single-bar selection capability is poor and the single-bar unit with poor packaging cannot be selected in advance after being once packaged in the prior art is solved.

Description

Technical Field

[0001] This invention relates to a testing system and method for intelligently testing the performance of a single bar under high current, belonging to the technical field of laser production equipment. Background Technology

[0002] Semiconductor lasers are characterized by their small size, long lifespan, and high energy density. They can operate using a simple injection current method, are compatible with integrated circuits, and can therefore be monolithically integrated. Furthermore, they can be directly modulated with current at frequencies up to GHz to achieve high-speed modulated laser output. Currently, semiconductor lasers are widely used in laser marking, laser cutting, laser cosmetic procedures, laser lighting, and radar. In industrial applications such as laser marking, multiple lasers are typically used as a pump combination, and the central crystal usually only absorbs light sources within a narrow spectral range. Therefore, to generate higher-energy emitted laser light, these lasers require a high degree of wavelength uniformity in the power bars.

[0003] Currently, the screening of laser bars during laser production typically relies on either bare bar tack testing or cold wavelength testing. Bare bar tack testing causes some damage to the bars and, due to the inability to guarantee consistent heat dissipation, the results are prone to error. Cold wavelength testing does not damage the bars themselves, but the results under cold wavelength cannot be guaranteed to be completely consistent with those under actual operating conditions, potentially leading to errors after laser assembly and consequently lower work efficiency.

[0004] Chinese patent document CN105334024B discloses a real-time single-bar testing system and method for semiconductor laser arrays. This system can easily and effectively test the single-bar power and / or spectrum of the array under operating conditions. The beam splitter in this testing system corresponds to the output of only one bar, ensuring that the light from that bar is reflected at least once by the beam splitter and exited in a direction different from the original optical path. However, this method requires refraction within the beam splitter along the path from the bar to the integrating sphere, inevitably leading to energy loss. Furthermore, this system requires a chip for sintering, and lacks good heat dissipation capabilities. Summary of the Invention

[0005] To address the shortcomings of existing bar strip testing systems, this invention provides a testing system with higher control precision, thereby solving the technical problem of poor bar strip screening capability and the inability to screen out defective single-bar units after bar strip packaging.

[0006] Terminology Explanation:

[0007] 1. Pump bar: A laser chip used to package the pump source of a semiconductor laser;

[0008] 2. Single bar unit: The product of integral sintering of a bar bar with a thermally conductive material such as a tungsten copper heat sink;

[0009] 3. TEC: Semiconductor Refrigeration Unit;

[0010] 4. Indium vapor deposition: A uniform and dense layer of indium solder is pre-formed on the surface of the fixture through a vapor deposition process.

[0011] The technical solution of the present invention is as follows:

[0012] A testing system for detecting the performance of a single bar, the testing system comprising an integrating sphere test kit, a three-dimensional adjustment frame, a loading platform with a TEC temperature control system, and a quick-pressing fixture with a TEC temperature control system;

[0013] The three-dimensional adjustment frame and the integrating sphere test kit are placed side by side. The three-dimensional adjustment frame is equipped with a platform with a TEC temperature control system and a quick-pressing clamp with a TEC temperature control system. The single-bar unit is placed on the platform with the TEC temperature control system, and the quick-pressing clamp with the TEC temperature control system fixes the single-bar unit to the platform. The clamp and the platform respectively contact the P / N sides of the single-bar unit. The three-dimensional adjustment frame adjusts the relative position of the single-bar unit and the integrating sphere to ensure the consistency of the relative position of the light source and the integrating sphere, so that the integrating sphere has a good capturing ability of the emitted light source, so as to obtain highly consistent power and wavelength data. The integrating sphere test kit is a fully automatic test kit, which automatically measures and records power, wavelength, voltage and other data. The clamp uses quick-pressing to fix the unit under test, and at the same time, it ensures good contact between the P / N sides of the single-bar unit and the test stage, ensuring its excellent heat dissipation capacity.

[0014] Preferably, the side of the quick-pressing clamp with TEC temperature control system that contacts the single bar unit is treated with indium vapor deposition to ensure that the quick-pressing clamp and the bar bar contact surface are tightly fitted to ensure good heat dissipation capacity; the side of the test platform with TEC temperature control system that contacts the single bar unit is treated with indium vapor deposition to ensure that the test unit and the test platform are in full contact to achieve common temperature as much as possible and maximize the TEC temperature control capability.

[0015] Preferably, the quick-pressing clamp with TEC temperature control system has a TEC feedback thermistor inside the end that contacts the single bar unit, and the loading platform with TEC temperature control system has a TEC feedback thermistor inside the side that contacts the single bar unit.

[0016] Preferably, the quick-pressing clamp with TEC temperature control system is located above the loading platform and includes an operating handle, a pressing rail, and a fixed pressure block. The fixed pressure block moves vertically within the pressing rail. The operating handle is connected to the fixed pressure block. When the operating handle is pressed down, it drives the fixed pressure block to move and descend within the pressing rail. The fixed pressure block presses and fixes the single bar unit, allowing for the testing of single bar units of various package types without replacing the fixed pressure block.

[0017] Preferably, the three-dimensional adjustment frame includes a base, a stand, and a movable frame. The stand is provided with a Z-axis track, and the movable frame moves vertically in the Z-axis track. The movable frame is an L-shaped frame, and the movable frame is provided with an XY-axis moving mechanism. A loading platform with a TEC temperature control system is connected above the XY-axis moving mechanism, and the loading platform is moved horizontally by the XY-axis moving mechanism.

[0018] A method of using the above-mentioned testing system for detecting the performance of a single bar includes the following steps:

[0019] The single-bar unit is placed on the platform and stably fixed to it using a quick-pressing clamp with a TEC temperature control system. The platform and clamp are in contact with the P / N surfaces of the single-bar unit, fully utilizing the excellent temperature control capabilities of the dual TEC system to ensure the temperature stability of the single-bar unit. By adjusting the three-dimensional adjustment frame, the single-bar unit is positioned in the center relative to the integrating sphere, ensuring the accuracy and consistency of its test data. With the external dual TEC activated, the TEC feedback thermistors inside the platform and clamp are located near the P / N surfaces of the single-bar unit, ensuring the immediacy of its temperature feedback and maximizing the temperature stability of the single-bar unit during testing.

[0020] The loading platform and pressing clamp are connected to the positive and negative terminals of the external power supply, respectively, and are connected in series with a rated resistor. When the single bar unit malfunctions, the resistor ensures the normal operation of the circuit, thus protecting the power supply and ensuring that the operator is not injured.

[0021] The beneficial effects of this invention are as follows:

[0022] 1. This invention consists of a pre-set program and optimized components, which saves labor costs and improves production efficiency, and is the general trend of future high-precision products.

[0023] 2. The present invention has extremely high temperature control accuracy, ensuring the consistency between test data and post-assembly data to the greatest extent.

[0024] 3. This invention can greatly improve the product qualification rate, shift risks forward, screen out defective strips in advance, avoid material waste caused by single defective strips, and reduce the material production cost and labor production cost of the product. Attached Figure Description

[0025] Figure 1 This is a detailed view of the fixing area of ​​the single-bar unit clamp of the present invention.

[0026] Figure 2 This is an overall view of the fixed end of the single-bar unit of the present invention.

[0027] Figure 3 This is an overall diagram of the single-bar unit test system of the present invention.

[0028] Figure 4 Comparison of 50W single-bar unit, 10mm, 10Hz test.

[0029] Figure 5 Comparison of 100W single-bar unit, 10mm, 10Hz test.

[0030] In the diagram: 1. Single bar unit to be tested: The diagram shows a single bar unit with two tungsten copper hot-sink sintered bar strips as an example; 2. Loading platform with TEC temperature control system and indium evaporation treatment; 3. Feedback thermistor of TEC temperature control system of loading platform; 4. Three-dimensional adjustment frame; 4-1. Base; 4-2. Stand; 4-3. Moving frame; 4-4. XY moving mechanism; 5. Quick-pressing fixture with TEC temperature control system; 5-1. Operating handle; 5-2. Pressing track; 5-3. Fixed pressure block; 5-4. Feedback thermistor of TEC temperature control system of pressing fixture; 6. High-precision automatic test data recording integrating sphere. Detailed Implementation

[0031] The present invention will be further described below with reference to the embodiments and accompanying drawings, but is not limited thereto.

[0032] Example 1:

[0033] A testing system for detecting the performance of a single bar, the testing system comprising an integrating sphere test kit, a three-dimensional adjustment frame 4, a loading platform 2 with a TEC temperature control system, and a quick-pressing clamp 5 with a TEC temperature control system, such as... Figure 1-3 As shown.

[0034] The three-dimensional adjustment frame and the integrating sphere test kit are placed side by side. The three-dimensional adjustment frame is equipped with a platform with a TEC temperature control system and a quick-pressing clamp with a TEC temperature control system. The single bar unit 1 is placed on the platform with the TEC temperature control system. The quick-pressing clamp with the TEC temperature control system fixes the single bar unit 1 to the platform. The clamp and the platform respectively contact the P / N sides of the single bar unit. The three-dimensional adjustment frame adjusts the relative position of the single bar unit and the integrating sphere to ensure the consistency of the relative position of the light source and the integrating sphere, so that the integrating sphere has a good capturing ability of the emitted light source, so as to obtain highly consistent power and wavelength data. The integrating sphere test kit is a fully automatic test kit, which automatically measures and records power, wavelength, voltage and other data. The clamp uses quick-pressing to fix the unit under test, and at the same time, it ensures good contact between the P / N sides of the single bar unit and the test stage, ensuring its excellent heat dissipation capacity.

[0035] The quick-pressing fixture 5 with TEC temperature control system is located above the platform and includes an operating handle 5-1, a pressing rail 5-2, and a fixed pressure block 5-3. The fixed pressure block moves vertically within the pressing rail. The operating handle is connected to the fixed pressure block. When the operating handle is pressed down, it drives the fixed pressure block to move and descend within the pressing rail. The fixed pressure block presses and fixes the single bar unit, allowing for testing of single bar units of various package types without replacing the fixed pressure block.

[0036] The three-dimensional adjustment frame 4 includes a base 4-1, a vertical frame 4-2, and a movable frame 4-3. The vertical frame is equipped with a Z-axis rail, and the movable frame moves vertically in the Z-axis rail. The movable frame is an L-shaped frame, and the movable frame is equipped with an XY-axis moving mechanism 4-4. The loading platform 2 with a TEC temperature control system is connected above the XY-axis moving mechanism, and the loading platform moves in the horizontal plane driven by the XY-axis moving mechanism 4-4.

[0037] Example 2:

[0038] A testing system for detecting the performance of a single bar is described in Example 1, except that the side of the quick-pressing clamp with a TEC temperature control system that contacts the single bar unit is treated with indium vapor deposition to ensure a tight fit between the quick-pressing clamp and the bar contact surface, thereby ensuring good heat dissipation. The side of the platform with a TEC temperature control system that contacts the single bar unit is also treated with indium vapor deposition to ensure full contact between the unit under test and the platform, achieving co-temperature as much as possible and maximizing the TEC temperature control capability.

[0039] Example 3:

[0040] A testing system for detecting the performance of a single bar is described in Example 2, except that the quick-pressing clamp with TEC temperature control system has a TEC feedback thermistor 5-4 inside the end that contacts the single bar unit, and the loading platform with TEC temperature control system has a TEC feedback thermistor 3 inside the side that contacts the single bar unit.

[0041] Example 4:

[0042] A method for using the testing system for detecting the performance of a single bar as described in Embodiment 3 above includes the following steps:

[0043] The single bar unit 1 is placed on the platform 2 and is stably fixed on the platform 2 by the quick-pressing clamp 5 with a TEC temperature control system. The platform 2 and the clamp 5 are in contact with the P / N surface of the single bar unit, giving full play to the good temperature control capability of the dual TEC of this system and ensuring the temperature stability of the single bar unit. By adjusting the three-dimensional adjustment frame 4, the single bar unit 1 is positioned in the center relative to the integrating sphere 6 to ensure the accuracy and consistency of its test data. The external dual TEC is turned on, and the TEC feedback thermistors inside the platform and the clamp are located near the P / N surfaces of the single bar unit to ensure the immediacy of its temperature feedback to the single bar unit, so as to maximize the temperature stability of the single bar unit during the test process.

[0044] The loading platform and pressing clamp are connected to the positive and negative terminals of the external power supply, respectively, and are connected in series with a rated resistor. When the single bar unit malfunctions, the resistor ensures the normal operation of the circuit, thus protecting the power supply and ensuring that the operator is not injured.

[0045] Experimental Example 1

[0046] The following is a test example of this test system:

[0047] Two single-bar units are packaged: a 50W chip and a 100W chip.

[0048] Under 10mm and 10Hz conditions, bare cell testing, system testing, and module assembly testing were performed on single-bar units respectively. The results are compared as follows: Figure 4 , Figure 5 As shown in the figure. This system can maximize the output performance of the single-bar unit. Compared with the test data after the single-bar unit is repackaged, only slight thermal saturation is observed under high current, which is a significant improvement over the data from conventional single-bar unit testing methods. This system can perform pre-screening after the first packaging, avoiding the additional material and labor waste caused by rejecting unqualified products after the second packaging.

Claims

1. A testing system for detecting the performance of a single bar, characterized in that, The testing system includes an integrating sphere test kit, a three-dimensional adjustment frame, a loading platform with a TEC temperature control system, and a quick-pressing fixture with a TEC temperature control system. The three-dimensional adjustment frame and the integrating sphere test kit are placed side by side. The three-dimensional adjustment frame is equipped with a loading platform with a TEC temperature control system and a quick-pressing clamp with a TEC temperature control system. The single bar unit is placed on the loading platform with a TEC temperature control system. The quick-pressing clamp with a TEC temperature control system fixes the single bar unit to the loading platform. The pressing clamp and the loading platform respectively contact the P / N sides of the single bar unit. The three-dimensional adjustment frame adjusts the relative position of the single bar unit and the integrating sphere. The quick-pressing clamp with TEC temperature control system is located above the loading platform. It includes an operating handle, a pressing rail, and a fixed pressing block. The fixed pressing block moves vertically within the pressing rail. The operating handle is connected to the fixed pressing block. When the operating handle is pressed down, it drives the fixed pressing block to move and descend within the pressing rail. The quick-pressing clamp with TEC temperature control system has a TEC feedback thermistor inside the end that contacts the single bar unit, and the loading platform with TEC temperature control system has a TEC feedback thermistor inside the side that contacts the single bar unit.

2. The testing system for detecting the performance of a single bar according to claim 1, characterized in that, The side of the quick-pressing clamp with TEC temperature control system that contacts the single bar unit is treated with indium vapor deposition; the side of the loading platform with TEC temperature control system that contacts the single bar unit is also treated with indium vapor deposition.

3. The testing system for detecting the performance of a single bar according to claim 1, characterized in that, The three-dimensional adjustment frame includes a base, a vertical frame, and a movable frame. The vertical frame is equipped with a Z-axis rail, and the movable frame moves vertically in the Z-axis rail. The movable frame is an L-shaped frame and is equipped with an XY-axis moving mechanism. A loading platform with a TEC temperature control system is connected above the XY-axis moving mechanism, and the loading platform is moved horizontally by the XY-axis moving mechanism.

4. A method of using the testing system for detecting the performance of a single bar as described in any one of claims 1, characterized in that, The steps include the following: The single bar unit is placed on the platform and fixed to the platform by a quick-pressing clamp with a TEC temperature control system. The platform and the pressing clamp are in contact with the P / N surface of the single bar unit, giving full play to the good temperature control capability of the dual TEC of this system and ensuring the temperature stability of the single bar unit. By adjusting the three-dimensional adjustment frame, the single bar unit is positioned in the center relative to the integrating sphere. The external dual TEC is turned on. The TEC feedback thermistors inside the platform and the pressing clamp are located near the P / N surfaces of the single bar unit. The loading platform and pressing clamp are respectively connected to the positive and negative terminals of the external power supply, and a rated resistor is connected in series to ensure the normal operation of the circuit when the single bar unit malfunctions.

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