Substrate leveling device and leveling fixture

Abstract

A substrate leveling device includes a robotic arm and a leveling jig, wherein the leveling jig is movable vertically relative to the robotic arm. The leveling jig comprises a main body, a plurality of flattening units, and an alignment unit. The main body is mounted on the robotic arm and has an observation window. The flattening units are spaced apart around the main body. The alignment units are mounted on the main body and correspond to the observation window.

Description

Technical Field

[0001] The present invention relates to the technical field of substrate processing, and in particular to a substrate leveling device and a leveling jig. Background Art

[0002] With technological advancements, the manufacturing processes for various electronic device components have become increasingly complex. For example, semiconductor wafers, printed circuit boards, and display panels undergo multiple processes, including grinding, machining, etching, and high-temperature heating. Furthermore, during cleaning or etching processes, substrates are typically secured to a spin chuck using vacuum suction or edge clamping. The substrate is then rotated at high speed while the cleaning or etching liquid is sprayed over it.

[0003] However, after the substrate has undergone the aforementioned multiple grinding, machining, and high-temperature processes, it will deform due to mechanical forces or thermal stresses. This is especially true for thin substrates (such as silicon wafers or flexible printed circuit boards), which are more susceptible to severe deformation after undergoing various machining and high-temperature processes, causing the substrate as a whole to exhibit irregular warping. Therefore, when a warped substrate undergoes cleaning or etching processes, it is not placed flat on the rotary chuck, resulting in the rotary chuck being unable to successfully secure the substrate to the rotary chuck by vacuum suction using the vacuum suction cup. Alternatively, the warped edge of the substrate may interfere with the structure of the rotary chuck's jaws, preventing the jaws from successfully clamping and securing the substrate to the rotary chuck. Summary of the Invention

[0004] The present invention provides a substrate leveling device and a leveling jig, which are helpful in solving the problem of substrate warping caused by various processing.

[0005] The substrate leveling device disclosed in the present invention includes at least one robotic arm and a leveling jig. The leveling jig is mounted on the robotic arm and is movable vertically relative to the robotic arm. The leveling jig comprises a main body, a plurality of flattening units, and an alignment unit. The main body is mounted on the robotic arm and has an observation window. The flattening units are spaced apart around the main body. The alignment units are mounted on the main body and correspond to the observation window.

[0006] The present invention also discloses a flattening jig comprising a main body, at least one flattening unit, and an alignment unit. The main body has an observation window. The flattening unit is disposed in a peripheral area of ​​the main body. The alignment unit is disposed in the main body and corresponds to the observation window.

[0007] According to the substrate leveling device and leveling jig disclosed in the present invention, the leveling jig is movable vertically relative to a robotic arm. The robotic arm moves the leveling jig above the substrate, which is then lowered vertically to bring the leveling jig into physical contact with the substrate surface. As the robotic arm continues to descend vertically, the leveling jig is no longer supported by the robotic arm. At this point, the weight of the leveling jig is applied to the warped areas of the substrate, flattening them.

[0008] The above description of the disclosed contents and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. 4 is a schematic diagram of a leveling jig according to an embodiment of the present invention.

[0010] Figure 2 for Figure 1 Schematic cross-section of the intermediate leveling jig.

[0011] Figure 3 for Figure 1 Another cross-sectional diagram of the middle leveling fixture.

[0012] Figure 4 for Figure 1 Schematic diagram of the intermediate leveling jig installed on the robotic arm.

[0013] Figure 5 for Figure 4 Exploded diagram of the leveling jig and robotic arm.

[0014] Figure 6 for Figure 4 Schematic cross-section of the leveling jig and robotic arm.

[0015] Figure 7 and Figure 8 For use Figure 4 Schematic diagram of the leveling fixture flattening the substrate.

[0016] Figure 9 FIG. 4 is a schematic diagram of a substrate leveling device according to an embodiment of the present invention.

[0017] Figure 10 For use Figure 9 Schematic diagram of the substrate leveling device flattening the substrate. DETAILED DESCRIPTION

[0018] The following detailed description of the features and advantages of the present invention is provided in the following embodiments. The details are sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly. Furthermore, based on the disclosure of this specification, the claims, and the accompanying drawings, any person skilled in the art can readily understand the relevant objects and advantages of the present invention. The following examples are provided to further illustrate the present invention and are not intended to limit the scope of the present invention in any way.

[0019] Please refer to Figures 1 to 3 ,in Figure 1 FIG. 4 is a schematic diagram of a leveling jig according to an embodiment of the present invention. Figure 2 and Figure 3 for Figure 1 In this embodiment, the leveling jig 1 includes a main body 10 , a flattening unit 20 , and an alignment unit 30 .

[0020] The main body 10 is, for example but not limited to, a plate-shaped body made of a rigid material, such as a metal plate or a marble plate, and has an observation window 110 . The observation window 110 is a through hole formed in a peripheral area of ​​the main body 10 . Figure 1 The main body 10 is shown to be formed with a plurality of oval observation windows 110 (through holes), but the number and shape of the observation windows 110 are not intended to limit the present invention.

[0021] The flattening unit 20 is disposed in the peripheral area of ​​the main body 10. Specifically, the flattening jig 1 of this embodiment includes a plurality of flattening units 20, and these flattening units 20 are disposed at intervals in the peripheral area of ​​the main body 10. Each flattening unit 20 has a buffer material portion on the side away from the main body 10. In this embodiment, the flattening unit 20 is disposed on the lower surface of the main body 10, and has a silicone pad, rubber pad, or latex pad at the end as a buffer material portion. The observation window 110 does not overlap with the flattening unit 20, that is, the flattening unit 20 cannot be seen when observing downward from the top of the main body 10 through the observation window 110.

[0022] The alignment unit 30 is disposed on the main body 10 and corresponds to the observation window 110 of the main body 10. In this embodiment, the alignment unit 30 is disposed on the lower surface of the main body 10 and includes a mark or a protrusion with a special shape, which can be observed through the observation window 110. The alignment unit 30 is disposed between two adjacent flattening units 20. Figure 2 and Figure 3 As shown, in a direction from the center (central area) of the body 10 to the edge (peripheral area) of the body 10 , a thickness D1 of the alignment unit 30 is smaller than a thickness D2 of the flattening unit 20 .

[0023] The leveling fixture 1 can be installed on the robot arm. Please refer to Figures 4 to 6 ,in Figure 4 for Figure 1 Schematic diagram of the middle leveling fixture installed on the robotic arm. Figure 5 for Figure 4 Schematic diagram of the exploded view of the leveling fixture and the robotic arm, and Figure 6 for Figure 4 Schematic diagram of the cross section of the leveling jig and the robotic arm. The leveling jig 1 is set on the robotic working arm 2, and the leveling jig 1 can move vertically relative to the robotic working arm 2. Furthermore, the main body 10 of the leveling jig 1 can include guide posts 120, and the robotic working arm 2 has a through slot 21 for accommodating these guide posts 120. The guide posts 120 are set in the through slot 21. Figure 5 As shown, in the vertical direction H, the length L of the guide column 120 is greater than the thickness D3 of the mounting portion at the end of the robotic working arm 2 .

[0024] In this embodiment, the main body 10 of the leveling jig 1 further has strip-shaped locking holes 130, and the robotic arm 2 has grooves 22 corresponding in number to the strip-shaped locking holes 130. The strip-shaped locking holes 130 are located closer to the center of the main body 10. Screws can be used to lock into the strip-shaped locking holes 130 and grooves 22 to limit the horizontal displacement of the leveling jig 1.

[0025] Figure 7 and Figure 8 For use Figure 4 Schematic diagram of the leveling fixture flattening the substrate. Figure 7 The warped substrate 3 is shown placed on a carrier, wherein the substrate 3 is, for example but not limited to, a silicon wafer, a printed circuit board, or a glass plate.

[0026] like Figure 7 As shown, the leveling jig 1 is moved to the top of the substrate 3 by the robotic arm 2, and then the robotic arm 2 is vertically lowered to allow the flattening unit 20 of the leveling jig 1 to physically contact the surface of the substrate 3. Figure 8 As shown, since the length of the guide post 120 of the leveling jig 1 is greater than the thickness of the robotic arm 2, if the robotic arm 2 continues to drop vertically after the leveling jig 1 contacts the substrate 3, the leveling jig 1 will no longer be supported by the robotic arm 2. At this time, the weight of the leveling jig 1 (e.g., about 2 to 5 kilograms) is applied to the warped portion of the substrate 3 via the flattening unit 20, thereby flattening the warped portion. Figure 7 In the embodiment, the leveling jig 1 flattens the substrate 3 by its own weight, and the robotic working arm 2 does not exert any force on the substrate 3 .

[0027] When the leveling jig 1 contacts the substrate 3, a user or a camera can observe the alignment unit 30 through the observation window 110 of the leveling jig 1 to confirm whether the flattening unit 20 is pressed into the correct position. For example, the end of the alignment unit 30 may have a recessed profile that matches the edge of the substrate. If the recessed profile of the alignment unit 30 is aligned with the edge of the substrate 3, it can be determined that the flattening unit 20 is pressed into the correct position. Conversely, if a gap is observed between the recessed profile of the alignment unit 30 and the edge of the substrate, it can be determined that the flattening unit 20 has deviated from the predetermined flattening position. In this case, the position of the flattening jig 1 can be adjusted by translating the leveling jig 1.

[0028] Figure 9 Schematic diagram of a substrate leveling device according to an embodiment of the present invention. The substrate leveling device 4 includes the aforementioned leveling fixture 1 and a mechanical working arm 2. The specific structure of the leveling fixture 1 and the mechanical working arm 2 can be referred to. Figures 1 to 4 , which will not be repeated here. Furthermore, the number of the robotic working arms 2 is two or more, and the leveling jig 1 is provided on one of the robotic working arms 2 (the first robotic working arm). The substrate leveling device 4 may further include a substrate picking jig 2", which is provided on another robotic working arm 2 (the second robotic working arm). The substrate picking jig 2" is, for example but not limited to, a gripper or a carrier plate, which is used to pick up the substrate and place the substrate at a specified position. These robotic working arms 2 can be mounted on the same carrier, and the movement of each robotic working arm 2 can be independently controlled by a central controller.

[0029] Figure 10 For use Figure 9 Schematic diagram of the substrate flattening device in FIG. The mechanical working arm 2 equipped with a substrate picking fixture 2" places the substrate 3 into the working chamber. Thereafter, the mechanical working arm 2 equipped with a leveling fixture 1 extends into the working chamber and performs the operation of flattening the substrate. The operation of flattening the substrate can be referred to Figure 7 and Figure 8 After the operation of flattening the substrate is completed, the mechanical working arm 2 provided with the substrate picking fixture 2" enters the working chamber again to take out the flattened substrate 3.

[0030] In summary, according to the substrate leveling device and leveling jig disclosed herein, the leveling jig is movable vertically relative to the robotic arm. The robotic arm moves the leveling jig above the substrate, which is then lowered vertically to bring the leveling jig into physical contact with the substrate surface. As the robotic arm continues to descend vertically, the leveling jig is no longer supported by the robotic arm. At this point, the weight of the leveling jig is applied to the warped areas of the substrate, flattening them.

[0031] Furthermore, the substrate leveling device disclosed herein can include at least two robotic working arms, one equipped with a substrate pickup jig and the other equipped with a leveling jig. These two robotic working arms can jointly perform the tasks of placing and leveling substrates. Compared to the current industry practice of requiring dedicated machines for leveling substrates, the present invention allows both the pickup and leveling arms to be installed within the same machine, allowing both substrate processing and leveling operations to be completed within a single machine.

[0032]

Explanation of symbols

[0033] 1…leveling jig

[0034] 2…Robotic working arm

[0035] 2”…Substrate pick-up fixture

[0036] 3…Substrate

[0037] 4…Substrate leveling device

[0038] 10…Main body

[0039] 110…Observation window

[0040] 120…Guide column

[0041] 130…Strip keyhole

[0042] 20…flattening unit

[0043] 21…grooving

[0044] 22…Groove

[0045] 30…Alignment unit

[0046] D1, D2, D3...Thickness

[0047] L…length

[0048] H…vertical direction.

Claims

1. A substrate leveling device, characterized in that: Include: at least one robotic working arm; and A leveling jig is movable vertically relative to the at least one mechanical working arm, and the leveling jig comprises: A main body, disposed on the at least one mechanical working arm, and having an observation window; A plurality of flattening units are arranged at intervals in the peripheral area of ​​the main body; as well as an alignment unit, disposed on the main body and corresponding to the observation window; The main body of the leveling jig has at least one guide post, the at least one mechanical working arm has a through slot, and the at least one guide post is disposed in the through slot; The at least one robotic working arm moves the leveling jig above the substrate, and then the at least one robotic working arm vertically descends to allow the leveling jig to physically contact the substrate surface. As the at least one robotic working arm continues to vertically descend, the leveling jig is no longer supported by the at least one robotic working arm, and the weight of the leveling jig is applied to the warped portion of the substrate, thereby flattening the warped portion. 2 . The substrate leveling device according to claim 1 , wherein the leveling jig is movable along a vertical direction, and a length of the at least one guide pillar in the vertical direction is greater than a thickness of the at least one robotic working arm. 3 . The substrate leveling device according to claim 1 , wherein the main body of the leveling jig has at least one linear locking hole, and the at least one robotic working arm has at least one groove corresponding to the at least one linear locking hole. 4 . The substrate leveling device according to claim 1 , wherein each of the flattening units of the leveling jig has a buffer material portion on a side away from the main body. The substrate leveling device according to claim 1 , wherein the observation window does not overlap with the leveling units. 6 . The substrate leveling device according to claim 5 , wherein the alignment unit is disposed between two adjacent ones of the leveling units.

7. The substrate leveling device according to claim 1 further comprises a substrate picking jig, wherein the at least one robotic working arm comprises a first robotic working arm and a second robotic working arm, the leveling jig is disposed on the first robotic working arm, and the substrate picking jig is disposed on the second robotic working arm.

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