Wafer storage library

Abstract

The application discloses a wafer storage and taking library, which comprises a storage and taking library, a conveying line, a wafer storing machine and a wafer taking machine. The wafer storage and taking library is used for storing wafers to be stored, and comprises a storage and taking frame and a transfer machine. The storage and taking frame is used for storing wafers, and the transfer machine is used for storing and taking wafers on the storage and taking frame. The conveying line is used for conveying wafers. The wafer storing machine is used for transferring wafers to the conveying line. The wafer taking machine is used for taking wafers from the conveying line. The wafer storage and taking library has the beneficial effect that a cassette containing wafers is placed into the wafer storing machine, the cassette containing wafers in the wafer storing machine is conveyed to the input end of the transfer machine, the cassette containing wafers is stored on the storage and taking frame by the transfer machine, when used, the cassette containing wafers on the storage and taking frame is transferred to the conveying line by the transfer machine, and the wafer is taken out to the next process by the wafer taking machine.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer storage technology, and in particular to a wafer storage library. Background Technology

[0002] In the semiconductor industry, wafers are a crucial component. A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot is formed into a silicon wafer.

[0003] Semiconductor wafer (or wafer cassette) storage facilities typically include several storage compartments. Stacker cranes are used to retrieve and place wafer cassettes within these compartments. However, in practice, some wafer cassettes require manual intervention during storage and retrieval, such as workers placing and retrieving them. Furthermore, given the potential for uncontrollable factors during worker access—such as chip collisions and breakage or contact with the stacker crane—direct access to wafer cassettes is inconvenient, leading to low overall storage and retrieval efficiency and a low level of automation. Therefore, we provide a wafer storage and retrieval facility to address these issues. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer access library.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A wafer storage and retrieval warehouse includes: a storage and retrieval warehouse for storing wafers to be stored, the storage and retrieval warehouse including storage racks and a transfer machine, the storage racks storing wafers, the transfer machine storing and retrieving wafers located on the storage racks; a conveyor line for conveying wafers; a wafer storage machine for transferring wafers to the conveyor line; and a wafer retrieval machine for retrieving wafers from the conveyor line; wherein the conveyor line is located between the wafer storage machine, the wafer retrieval machine, and the storage and retrieval warehouse arranged in parallel, transferring wafers to the wafer storage machine, placing the wafers transferred from the wafer storage machine to the conveyor line by the transfer machine onto the storage racks, and when wafer retrieval is required, the transfer machine retrieves the wafers and transfers them to the conveyor line, and the wafer retrieval machine picks up the wafers located on the conveyor line.

[0007] Preferably, the chip storage machine includes a first frame for mounting, on which a feeding turntable mechanism is mounted. The feeding turntable mechanism includes a first fixed frame fixedly mounted on the first frame, on which a first DD motor is mounted. A first turntable is mounted on the power output end of the first DD motor. The first turntable is provided with a plurality of first fixtures evenly spaced about the axis of the first turntable. Each first fixture is provided with at least one first stopper. A detector is provided below the feeding end of the first turntable. The first frame is also provided with a conveying mechanism and a barcode reader. The conveying mechanism conveys the first stoppers on the first turntable to the conveyor line. The barcode reader is located on one side of the conveying mechanism.

[0008] Preferably, the wafer picker includes a second frame, on which a detection turntable mechanism is provided. A first code reading detection mechanism is provided at one detection position of the detection turntable mechanism. A transport mechanism and a first wafer picker mechanism are provided at the input position of the detection turntable mechanism. A second wafer picker mechanism is provided at the output position of the detection turntable mechanism. A placement rack is provided on one side of the second wafer picker mechanism. An outbound buffer mechanism is also provided on the second frame, and the outbound buffer mechanism is located on one side of the transport mechanism. The outbound buffer mechanism includes a second fixed frame mounted on the second frame. A third servo motor is mounted on the bottom surface of the second fixed frame. At least one fourth fixture is provided on a carrier plate mounted on the power output end of the third servo motor. A fifth chuck is provided on the fourth fixture. A fourth chuck is provided on the other side of the second wafer picker mechanism. The first wafer picker mechanism transfers the wafer in the fifth chuck to the input position of the detection turntable mechanism.

[0009] The detection turntable mechanism includes a first mounting plate mounted on a second frame. A sixth servo motor is fixedly mounted on one side of the first mounting plate. A second turntable is mounted on the power output end of the sixth servo motor. The second turntable has several placement slots evenly spaced around its center. A third cylinder is fixedly mounted on the other side of the first mounting plate. A first code reading detection camera is mounted on the mounting bracket of the third cylinder.

[0010] Preferably, it also includes a film rewinding machine, which includes a third frame for mounting. The upper surface of the third frame is provided with a plurality of third film picking mechanisms. A first code reading detection mechanism is provided on the side of another adjacent third film picking mechanism. A third fixture is provided on one side of the third film picking mechanism. The third fixture is provided with a plurality of third clips, the same number as the third film picking mechanism. A first code reading detection mechanism is also provided between the third fixture and the third film picking mechanism.

[0011] The third wafer picking mechanism includes a seventh linear module mounted on a third frame, an eighth linear module at the power output end of the seventh linear module, and a third suction cup at the power output end of the eighth linear module.

[0012] Preferably, the transfer machine includes a base located on one side of the storage rack, a guide rail on the base, a sliding frame slidably mounted on the guide rail, a second linear module for vertical movement on the sliding frame, a rack mounted on the base, a first servo motor fixedly mounted on the sliding frame, and a gear adapted to the rack mounted on the power output end of the first servo motor, the gear meshing with the rack for transmission; at least one mounting bracket is provided on the power output end of the second linear module, and a second DD motor is mounted on each mounting bracket; a third linear module is mounted on the output end of the second DD motor, a first cylinder is provided on the third linear module, and a gripper is provided on the power output end of the first cylinder.

[0013] Preferably, the conveying mechanism includes a support frame, on which a three-axis linear motion module is mounted. A second servo motor is fixedly mounted on the mounting bracket at the power end of the three-axis linear motion module. A rotating plate is mounted on the power output end of the second servo motor. Two sliders are slidably arranged below the rotating plate. A sliding plate is fixedly connected to the bottom surface of each slider. A rotary cylinder is mounted on the outer side of each sliding plate. The power output end of the rotary cylinder extends to the inner side of the sliding plate. A clamping plate is mounted on the power output end of the rotary cylinder. A drive motor is fixedly mounted on one side of the upper surface of the rotating plate. A lead screw is driven between the two sliding plates, and the power input end of the lead screw is driven to the power output end of the drive motor.

[0014] Preferably, a chip picking and code reading detection mechanism is also installed on the first frame. The chip picking and code reading detection mechanism is located on one side of the feeding turntable mechanism. The chip picking and code reading detection mechanism includes a first linear module installed on the first frame. A first chip picking mechanism is provided at the power output end of the first linear module. A first code reading detection mechanism is also provided on the first linear module. A bracket is provided on one side of the first linear module. A second fixture is provided on the bracket. A plurality of second clips are placed on the second fixture.

[0015] Preferably, the first wafer picking mechanism includes a fourth linear module, a fifth linear module is mounted on the power output end of the fourth linear module, a fifth servo motor is mounted on the output end mounting bracket of the fifth linear module, and a first suction cup for picking up wafers is provided on the power output end of the fifth servo motor.

[0016] Preferably, the first code reading detection mechanism includes a second mounting plate, a second cylinder is mounted on the second mounting plate, and a second code reading detection camera is disposed on the mounting bracket at the power output end of the second cylinder.

[0017] Preferably, the second wafer picking mechanism includes a third fixed frame mounted on a second frame, a fourth servo motor mounted on the bottom surface of the third fixed frame, the power output end of the fourth servo motor extending above the third fixed frame, and a sixth linear module mounted on the power output end of the fourth servo motor, with a second suction cup provided on the power output end of the sixth linear module.

[0018] The present invention has the following advantages:

[0019] 1. This invention places wafer-loaded cassettes into a wafer storage machine, then transports them to the input of a transfer machine. The transfer machine then stores the wafer-loaded cassettes on a retrieval rack. When needed, the transfer machine moves the wafer-loaded cassettes from the retrieval rack to the conveyor line, where a wafer retrieval machine removes the wafers for the next process. The entire process, from the retrieval rack to the wafer retrieval machine, is fully automated, eliminating the need for manual operation. This reduces the risk of wafer collisions caused by human intervention and improves overall storage and retrieval efficiency, achieving complete automation.

[0020] 2. The present invention uses a first servo motor to drive a sliding frame and a second linear module to move, thereby moving the wafer-containing cassette held by the clamping claw to a predetermined position. Then, the second linear module transfers the wafer-containing cassette to the storage rack, thereby realizing automatic storage of wafer-containing cassettes and achieving automatic storage and retrieval. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 This is a schematic diagram of the chip storage machine structure of the present invention.

[0023] Figure 3 This is a schematic diagram of the wafer take-up machine of the present invention.

[0024] Figure 4 This is a schematic diagram of the wafer turning machine of the present invention.

[0025] Figure 5 This is a schematic diagram of the access library structure of the present invention.

[0026] Figure 6 This is a schematic diagram of the transfer machine structure of the present invention.

[0027] Figure 7 This is a schematic diagram of the handling mechanism of the present invention.

[0028] Figure 8 This is a schematic diagram of the outbound caching mechanism of the present invention.

[0029] Figure 9 This is a schematic diagram of the chip picking and code reading detection mechanism of the present invention.

[0030] Figure 10 This is a schematic diagram of the first wafer-taking mechanism of the present invention.

[0031] Figure 11 This is a schematic diagram of the second wafer-taking mechanism of the present invention.

[0032] Figure 12 This is a schematic diagram of the conveyor line structure of the present invention.

[0033] Figure 13 This is a schematic diagram of the detection turntable mechanism of the present invention.

[0034] Figure 14 This is a schematic diagram of the third wafer-taking mechanism of the present invention.

[0035] Figure 15 This is a schematic diagram of the feeding turntable mechanism of the present invention.

[0036] Figure 16 This is a schematic diagram of the fixture structure of the present invention.

[0037] Figure 17 This is a schematic diagram of the stopper structure of the present invention.

[0038] Figure 18 This is a schematic diagram of the clamping plate structure of the present invention.

[0039] In the diagram, 1. Wafer storage machine; 11. First frame; 12. Feeding turntable mechanism; 121. First fixed frame; 122. First DD motor; 123. Detector; 124. First turntable; 125. First fixture; 126. First stopper; 13. Wafer picking and code reading detection mechanism; 131. First linear module; 132. Support; 133. Second fixture; 134. Second stopper; 14. Code reader; 2. Wafer picking machine; 21. Second frame; 22. Placement rack; 23. Detection turntable mechanism; 231 1. First mounting plate; 232. Sixth servo motor; 233. Second turntable; 234. Placement slot; 235. Third cylinder; 236. First code reading and detection camera; 24. Second film picking mechanism; 241. Third fixing frame; 242. Fourth servo motor; 243. Sixth linear module; 244. Second suction cup; 25. Outbound buffer mechanism; 251. Second fixing frame; 252. Third servo motor; 253. Fourth fixture; 254. Fifth stopper; 26. Fourth stopper; 3. Storage and retrieval bin; 3 1. Storage rack; 32. Transfer machine; 320. Base; 321. Guide rail; 322. Rack; 323. Second linear module; 324. Sliding frame; 325. First servo motor; 326. Second DD motor; 327. Third linear module; 328. First cylinder; 329. Gripper; 4. Conveyor line; 5. Film rewinding machine; 51. Third frame; 52. Third film picking mechanism; 521. Seventh linear module; 522. Eighth linear module; 523. Third suction cup; 53. Third fixture; 5 4. Third cassette; 6. Transport mechanism; 61. Support frame; 62. Three-axis linear motion module; 63. Second servo motor; 64. Rotating plate; 65. Rotary cylinder; 66. Clamping plate; 67. Drive motor; 68. Slider; 69. Sliding plate; 7. First chip picking mechanism; 71. Fourth linear module; 72. Fifth linear module; 73. Fifth servo motor; 74. First suction cup; 8. First code reading and detection mechanism; 81. Second mounting plate; 82. Second cylinder; 83. Second code reading and detection camera. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0042] like Figure 1 The embodiment shown in —17,

[0043] A wafer storage and retrieval warehouse includes: a storage and retrieval warehouse 3 for storing wafers to be stored, the storage and retrieval warehouse 3 including a storage rack 31 and a transfer machine 32, the storage rack 31 storing wafers, and the transfer machine 32 storing and retrieving wafers located on the storage rack 31; a conveyor line 4 for conveying wafers; a wafer storage machine 1 for transferring wafers to the conveyor line 4; and a wafer retrieval machine 2 for retrieving wafers from the conveyor line 4; wherein, the conveyor line 4 is located between the wafer storage machine 1, the wafer retrieval machine 2, and the storage and retrieval warehouse 3 arranged in parallel, transferring wafers to the wafer storage machine 1, placing the wafers transferred from the wafer storage machine 1 to the conveyor line 4 by the transfer machine 32 onto the storage rack 31, and when wafer retrieval is required, the transfer machine 32 retrieves the wafers and transfers them to the conveyor line 4, and the wafer retrieval machine 2 retrieves the wafers located on the conveyor line 4.

[0044] The conveyor line 4 can move in both directions to achieve linear conveying. Specifically, a linear motor can be used as the motion power source to drive the cassettes. The conveyor line 4 can be set as a single layer or a double layer. When it is a double layer, one layer is dedicated to connecting to the wafer storage machine 1, and the other layer is connected to the wafer retrieval machine 2. For example, the upper layer can be connected to the wafer storage machine 1, and the lower layer can be connected to the wafer retrieval machine 2. When storage is required, the wafer storage machine 1 transfers the cassettes containing wafers to the upper conveyor line 4. The transfer machine 32 transfers the cassettes containing wafers from the upper layer to the storage rack 31. When retrieval is required, the transfer machine 32 removes the cassettes containing wafers from the storage rack 31 and sends them to the lower conveyor line 4. Then, the wafer retrieval machine 2 removes the cassettes containing wafers from the lower conveyor line 4 and proceeds to the next process.

[0045] When the conveyor line 4 has only one layer, it is responsible for both storing and retrieving the wafer-containing cassettes. Depending on the actual needs, the choice between a double layer or a single layer, and specifically using a linear motor as the power source to move the wafer-containing cassettes, is something that those skilled in the art can easily conceive of based on their needs.

[0046] By placing wafer-loaded cassettes into the wafer storage machine 1, and then conveying them to the input of the transfer machine 32 via the transfer machine 4, the wafer-loaded cassettes are stored on the retrieval rack 31 via the transfer machine 32. When in use, the wafer-loaded cassettes on the retrieval rack 31 are transferred to the conveyor line 4 via the transfer machine 32, and then the wafer retrieval machine removes the wafers for the next process. The entire process, from the wafer-loaded cassettes in the wafer storage machine 1 to the conveyor line, the retrieval rack, and then from the retrieval rack to the wafer retrieval machine, is completed automatically without manual operation. This reduces the risk of wafer collisions caused by human intervention and improves the overall storage and retrieval efficiency, thus achieving full automation.

[0047] The chip storage machine 1 includes a first frame 11 for mounting, on which a feeding turntable mechanism 12 is mounted. The feeding turntable mechanism 12 includes a first fixed frame 121 fixedly mounted on the first frame 11. A first DD motor 122 is mounted on the first fixed frame 121. A first turntable 124 is mounted on the power output end of the first DD motor 122. A plurality of first fixtures 125 are evenly spaced about the axis of the first turntable 124. At least one first stopper 126 is provided on each first fixture 125. A detector 123 is provided below the feeding end of the first turntable 124. The first frame 11 is also provided with a conveying mechanism 6 and a barcode reader 14. The barcode reader 14 scans the first stopper 126 carried by the conveying mechanism 6 to facilitate knowing the position when the stopper is removed later. The conveying mechanism 6 carries the first stopper 126 on the first turntable 124 to the conveyor line 4. The barcode reader 14 is located on one side of the conveying mechanism 6.

[0048] The first cassette 126 containing the wafer is manually placed on the first fixture 125. After placement, the detector 123 detects the presence of the first cassette 126 on the first fixture 125, and the indicator light on the detector 123 will illuminate. The detector 123 is used to determine whether the first cassette 126 is placed on the first fixture 125. Alternatively, the detector 123 can be used to determine whether the first DD motor 122 is working. When the first DD motor 122 transports the first cassette 126 containing the wafer to the inlet end of the transport mechanism 6, the transport mechanism 6 transfers the first cassette 126 to the conveyor line 4, and then the conveyor line 4 transfers the first cassette 126 to the inlet end of the transfer machine 32. Finally, the transfer machine 32 transfers the cassette containing the wafer to the storage rack 31.

[0049] The wafer picker 2 includes a second frame 21, on which a detection turntable mechanism 23 is mounted. A first code reading detection mechanism 8 is mounted at one detection position of the detection turntable mechanism 23. A transport mechanism 6 and a first wafer picker 7 are mounted at the input position of the detection turntable mechanism 23. A second wafer picker 24 is mounted at the output position of the detection turntable mechanism 23. A placement rack 22 is mounted on one side of the second wafer picker 24. An outbound buffer mechanism 25 is also mounted on the second frame 21 and is located near the transport mechanism 6. On one side, the outbound buffer mechanism 25 includes a second fixed frame 251 mounted on the second frame 21. A third servo motor 252 is mounted on the bottom surface of the second fixed frame 251. At least one fourth fixture 253 is provided on the carrier plate mounted on the power output end of the third servo motor 252. A fifth chuck 254 is provided on the fourth fixture 253. A fourth chuck 26 is provided on the other side of the second wafer picking mechanism 24. The first wafer picking mechanism 7 transfers the wafer in the fifth chuck 254 to the input position of the detection turntable mechanism 23.

[0050] The wafer picker 2 uses a conveying mechanism 6 to remove the wafer from the conveyor line 4 and place it into the fourth fixture 253. In this embodiment, the fourth fixture 253 has two stations, meaning it can hold two wafers. Next, the first code reading and detection mechanism 8 removes the wafer from the fifth wafer pick 254 on the fourth fixture 253 and places it into the feed position of the adjacent detection turntable mechanism 23. Then, the first code reading and detection mechanism 8 reads and detects the code. Finally, the second wafer picker 24 places the wafer after code reading and detection into the feed position. The wafers are placed in the slots on the placement rack 22. The placement rack 22 can be automatically raised and lowered, or the placement rack 22 can be automatically raised and lowered. The specific raising mechanism can be a linear drive mechanism such as a cylinder, a servo motor screw module, etc. The fourth slot 26 is used to place unwanted wafers or defective wafers. After the wafers are transferred in the outbound buffer mechanism 25, the empty slots can be transferred to the empty positions on the second rack 21 by the handling mechanism 6. After that, these empty slots can be manually transferred out to prevent the empty slots from accumulating on the second rack 21.

[0051] The detection turntable mechanism 23 includes a first mounting plate 231 mounted on a second frame 21. A sixth servo motor 232 is fixedly mounted on one side of the first mounting plate 231. A second turntable 233 is mounted on the power output end of the sixth servo motor 232. A plurality of placement slots 234 are evenly spaced around the center of the second turntable 233. A third cylinder 235 is fixedly mounted on the other side of the first mounting plate 231. A first code reading detection camera 236 is mounted on the mounting bracket of the third cylinder 235.

[0052] The first code reading and inspection mechanism 8 transfers the wafer in the fifth cassette 254 to the feeding port of the placement slot 234. Then, the sixth servo motor 232 starts to drive the second turntable 233 to rotate. As it rotates, it is inspected when it passes the first code reading and inspection camera 236. After the inspection is completed, the second wafer picking mechanism 24 takes the wafer out of the placement slot 234 at the discharge port and transfers it to the cassette on the placement rack 22 or places it on the fourth cassette 26.

[0053] It also includes a film rewinding machine 5, which includes a third frame 51 for mounting. The upper surface of the third frame 51 is provided with a plurality of third film picking mechanisms 52. A first code reading detection mechanism 8 is provided on the side of another adjacent third film picking mechanism 52. A third fixture 53 is provided on one side of the third film picking mechanism 52. The third fixture 53 is provided with a plurality of third clips 54, the same number as the third film picking mechanism 52. A first code reading detection mechanism 8 is also provided between the third fixture 53 and the third film picking mechanism 52.

[0054] The third wafer picking mechanism 52 includes a seventh linear module 521 mounted on a third frame 51, an eighth linear module 522 provided at the power output end of the seventh linear module 521, and a third suction cup 523 provided at the power output end of the eighth linear module 522.

[0055] The third cassette 54 containing wafers is manually placed into the third fixture 53. At this time, the third suction cup 523 is aligned with the wafer in the third cassette 54 under the linkage of the seventh linear module 521 and the eighth linear module 522, and the wafer is picked up by the third suction cup 523 and moved to the first code reading and detection mechanism 8 for detection. Then, the first code reading and detection mechanism 8, located between the third fixture 53 and the third wafer picking mechanism 52, reads the code and transmits the information to the corresponding controller, which can be a computer, mobile phone, microcontroller, PLC, etc., to facilitate subsequent wafer removal and location finding. After all wafers have been detected and read, the third cassette 54 containing wafers is manually transferred to the wafer storage machine 1. This step of transferring the third cassette 54 to the wafer storage machine 1 can be done manually or by a robot, transfer line, or other device. In this embodiment, manual transfer is used.

[0056] The transfer machine 32 includes a base 320 located on one side of the storage rack 31. A guide rail 321 is provided on the base 320, and a sliding frame 324 is slidably arranged on the guide rail 321. A second linear module 323 for vertical movement is provided on the sliding frame 324. A rack 322 is also installed on the base 320. A first servo motor 325 is fixedly installed on the sliding frame 324, and a gear adapted to the rack 322 is installed at the power output end of the first servo motor 325. The gear meshes with the rack 322 for transmission. At least one mounting bracket is provided at the power output end of the second linear module 323, and a second DD motor 326 is installed on each mounting bracket. A third linear module 327 is installed at the output end of the second DD motor 326. A first cylinder 328 is provided on the third linear module 327, and a gripper 329 is provided at the power output end of the first cylinder 328.

[0057] When it is necessary to transfer the wafer-loaded cassette from conveyor line 4 to the retrieval rack 31 or to transfer the cassette from the retrieval rack 31 to conveyor line 4, the first servo motor 325 is activated, and the sliding frame 324 slides on the guide rail 321 through the meshing of the gear and rack 322, thereby moving the gripper 329 to conveyor line 4. Under the linkage of the second linear module 323, the second DD motor 326, the third linear module 327 and the first cylinder 328, the cassette is clamped and transferred. Then, the first servo motor 325 is activated again to transfer the clamped cassette to the predetermined retrieval rack 31. Similarly, under the linkage of the second linear module 323, the second DD motor 326, the third linear module 327 and the first cylinder 328, the clamped cassette is placed on the retrieval rack 31. After placement, all components return to their initial positions.

[0058] The conveying mechanism 6 includes a support frame 61, on which a three-axis linear motion module 62 is mounted. A second servo motor 63 is fixedly mounted on the mounting bracket at the power end of the three-axis linear motion module 62. A rotating plate 64 is mounted on the power output end of the second servo motor 63. Two sliders 68 are slidably arranged below the rotating plate 64. A sliding plate 69 is fixedly connected to the bottom surface of each slider 68. A rotary cylinder 65 is mounted on the outer side of each sliding plate 69. The power output end of the rotary cylinder 65 extends to the inner side of the sliding plate 69. A clamping plate 66 is mounted on the power output end of the rotary cylinder 65. A drive motor 67 is fixedly mounted on one side of the upper surface of the rotating plate 64. Specifically, the drive motor 67 is a servo motor. A lead screw is connected between the two sliding plates 69, and the power input end of the lead screw is connected to the power output end of the drive motor 67.

[0059] When the jammed plug needs to be transferred, the three-axis linear motion module 62 performs three-axis movement, which involves movement in the X, Y, and Z directions in space. This movement method is existing technology and can be easily conceived by those skilled in the art. Then, the second servo motor 63 is started to drive the rotating plate 64 to rotate at a certain angle. Finally, the rotating cylinders 65 on both sides of the rotating plate 64 are started to drive the clamping plate 66 to rotate. When the jammed plug is located between the two clamping plates 66, the drive motor 67 is started to drive the lead screw connected to the sliding plate 69 to rotate via the synchronous belt. Under the guidance of the slider 68, the two sliding plates 69 move towards each other, thereby clamping the jammed plug to be transferred. Finally, the rotating cylinder 65 is started to rotate the clamped jammed plug.

[0060] The first frame 11 is also equipped with a chip picking and code reading detection mechanism 13, which is located on one side of the feeding turntable mechanism 12. The chip picking and code reading detection mechanism 13 includes a first linear module 131 installed on the first frame 11. A first chip picking mechanism 7 is provided on the power output end of the first linear module 131. A first code reading detection mechanism 8 is also provided on the first linear module 131. A bracket 132 is provided on one side of the first linear module 131. A second fixture 133 is provided on the bracket 132. A plurality of second clips 134 are placed on the second fixture 133.

[0061] When testing is required, the first linear module 131 is activated to move the first wafer picking mechanism 7 to the predetermined position and pick up the wafer and place it at the first code reading and testing mechanism 8 for code reading. After the code reading and testing is completed, the sampled wafer is placed into the second cassette 134.

[0062] The first wafer picking mechanism 7 includes a fourth linear module 71, a fifth linear module 72 is installed at the power output end of the fourth linear module 71, a fifth servo motor 73 is installed on the output end mounting bracket of the fifth linear module 72, and a first chuck 74 for picking up wafers is provided at the power output end of the fifth servo motor 73.

[0063] When picking up the wafer, the fourth linear module 71, the fifth linear module 72, and the fifth servo motor 73 are first activated. With the linkage of the three, the first suction cup 74 is moved to the wafer and picked up the wafer. In this mechanism, the fourth linear module 71 and the fifth linear module 72 realize two-axis movement, that is, movement in two directions: up, down, left and right. Then the fifth servo motor 73 is activated to drive the first suction cup 74 to rotate, which facilitates the transfer of the picked-up wafer.

[0064] The first code reading detection mechanism 8 includes a second mounting plate 81, on which a second cylinder 82 is mounted, and a second code reading detection camera 83 is mounted on the mounting bracket at the power output end of the second cylinder 82.

[0065] The second cylinder 82 drives the second code reading and detection camera 83 to move toward the wafer. When it moves to the predetermined position, the second code reading and detection camera 83 reads or detects the wafer.

[0066] The second wafer picking mechanism 24 includes a third fixed frame 241 mounted on the second frame 21. A fourth servo motor 242 is mounted on the bottom surface of the third fixed frame 241. The power output end of the fourth servo motor 242 extends above the third fixed frame 241, and a sixth linear module 243 is mounted on the power output end of the fourth servo motor 242. A second suction cup 244 is provided on the power output end of the sixth linear module 243.

[0067] The fourth servo motor 242 is activated to drive the sixth linear module 243 to rotate. After rotating to a suitable angle, the sixth linear module 243 is activated to move the second suction cup 244 to the wafer direction. After the second suction cup 244 is moved to the predetermined position, the wafer is picked up and transferred by the second suction cup 244. After the wafer is picked up, the sixth linear module 243 is activated again to drive the second suction cup 244 containing the wafer to return to the initial position. Alternatively, while driving the second suction cup 244 to return to the initial position, the fourth servo motor 242 is activated to rotate the second suction cup 244 containing the wafer to the predetermined position. Then, the wafer is moved to the predetermined chuck by the sixth linear module 243.

[0068] The second wafer picking mechanism 24 can also work in coordination with the lifting mechanism to transport wafers to cassettes of different heights.

[0069] In this embodiment, the linear modules such as the first linear module 131 and the second linear module 323 mentioned above can be linear drive devices such as motor lead screw assemblies, cylinders, synchronous belt linear modules (motor synchronous belt modules), and linear motor modules. In this embodiment, each of the code reading and detection cameras mentioned above has the functions of detection and code scanning. It can both detect wafers and scan codes. The code scanning can transmit information to the processor, which makes it easy to know the placement position of each wafer or cassette. The processor system marks and determines its position, which facilitates the subsequent removal of wafers or cassettes.

[0070] Reference Figure 16 and Figure 17 It can be seen that each fixture in this embodiment has a placement groove on its surface, and the plug is placed in the placement groove on the fixture.

[0071] In this embodiment, the movement of each component is controlled and coordinated by the controller.

[0072] The working process of this invention is as follows: First, the third cassette 54 containing the wafer is manually placed into the third fixture 53. The wafer is then removed from the third cassette 54 by the third wafer removal mechanism 52 and placed into the two first code reading and detection mechanisms 8 for code reading and scanning detection. Finally, the wafer is placed back into the third cassette 54, and the data obtained from the code scanning is transmitted to the controller.

[0073] Then, the third cassette 54 containing the wafer is manually transferred to the loading turntable mechanism 12. During the process of the loading turntable mechanism 12 transferring the cassette to the conveying mechanism 6, the wafer is sampled and inspected by the wafer picking and code reading detection mechanism 13 to determine the quality of the wafer. Finally, the cassette containing the wafer is transferred to the conveyor line 4 by the conveyor mechanism 6. When the cassette is transferred to the conveyor line 4 by the conveyor mechanism 6, the code reader 14 scans the code of the cassette so that the subsequent controller system knows the position of the cassette. After that, the cassette containing the wafer is transferred to the feed port of the transfer machine 32 by the conveyor line.

[0074] The transfer machine 32 transfers the wafer-loaded cassettes from the wafer storage machine 1 to the conveyor line 4 and stores them in the storage rack 31;

[0075] When a wafer needs to be retrieved from the storage rack 31, the transfer machine 32 first removes the wafer-containing cassette from the storage rack 31 and transfers it to the conveyor line 4. The conveyor line 4 then transfers the retrieved cassette to the entrance of the wafer picker 2. When the retrieved cassette is at the entrance of the wafer picker 2, the transport mechanism 6 in the wafer picker 2 first removes the cassette from the conveyor line 4 and places it in the outgoing buffer mechanism 25. Then, the first wafer picker mechanism 7 removes the wafer from the cassette in the outgoing buffer mechanism 25 and sends it to the inspection turntable mechanism 23. While the inspection turntable mechanism 23 is rotating, the first barcode detection mechanism 8 and the first barcode detection camera 236 scan and read the barcodes on the wafer. After the inspection is completed, the wafer is transferred to the output end, and the second wafer picker mechanism 24 transfers the scanned and read wafer to the cassette on the placement rack 22.

[0076] The above describes the process for storing and retrieving wafers.

[0077] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer access library, characterized in that, include: The storage warehouse (3) stores wafers that are about to be stored. The storage warehouse (3) includes a storage rack (31) and a transfer machine (32). The storage rack (31) stores the wafers, and the transfer machine (32) stores and retrieves the wafers located in the storage rack (31). The conveyor line (4) transports the wafers; The wafer storage machine (1) transfers the wafers to the transport line (4). Wafer picker (2), which picks up wafers from the conveyor line (4); The conveyor line (4) is located between the wafer storage machine (1), the wafer retrieval machine (2) and the storage and retrieval warehouse (3) arranged in parallel. The wafer is transferred to the wafer storage machine (1), and the wafer transferred from the wafer storage machine (1) to the conveyor line (4) is placed on the storage rack (31) by the transfer machine (32). When it is necessary to retrieve the wafer, the wafer is taken out by the transfer machine (32) and transferred to the conveyor line (4). The wafer retrieval machine (2) transports and retrieves the wafer located on the conveyor line (4). The chip storage machine (1) includes a first frame (11) for mounting, on which a feeding turntable mechanism (12) is mounted. The feeding turntable mechanism (12) includes a first fixed frame (121) fixedly mounted on the first frame (11). A first DD motor (122) is mounted on the first fixed frame (121). A first turntable (124) is mounted on the power output end of the first DD motor (122). The first turntable (124) is provided with a plurality of points related to the first turntable (12). 4) A first fixture (125) with uniformly spaced axes, each first fixture (125) is provided with at least one first plug (126), and a detector (123) is provided below the feed end of the first turntable (124); a conveying mechanism (6) and a barcode reader (14) are also provided on the first frame (11), the conveying mechanism (6) conveys the first plug (126) on the first turntable (124) to the conveyor line (4), and the barcode reader (14) is located on one side of the conveying mechanism (6); The wafer picker (2) includes a second frame (21), on which a detection turntable mechanism (23) is provided. A first code reading detection mechanism (8) is provided at one detection position of the detection turntable mechanism (23). A transport mechanism (6) and a first wafer picker mechanism (7) are provided at the input position of the detection turntable mechanism (23). A second wafer picker mechanism (24) is provided at the output position of the detection turntable mechanism (23). A placement rack (22) is provided on one side of the second wafer picker mechanism (24). An outbound buffer mechanism (25) is also provided on the second frame (21), and the outbound buffer mechanism (25) is located on the transport mechanism. On one side of (6), the outbound buffer mechanism (25) includes a second fixed frame (251) mounted on the second frame (21), a third servo motor (252) mounted on the bottom surface of the second fixed frame (251), and at least one fourth fixture (253) mounted on the carrier plate at the power output end of the third servo motor (252). A fifth chuck (254) is provided on the fourth fixture (253). A fourth chuck (26) is provided on the other side of the second wafer picking mechanism (24), wherein the first wafer picking mechanism (7) transfers the wafer in the fifth chuck (254) to the input position of the detection turntable mechanism (23); The detection turntable mechanism (23) includes a first mounting plate (231) mounted on a second frame (21). A sixth servo motor (232) is fixedly mounted on one side of the first mounting plate (231). A second turntable (233) is mounted on the power output end of the sixth servo motor (232). A plurality of placement slots (234) are evenly spaced about the center of the second turntable (233) on the second turntable (233). A third cylinder (235) is fixedly mounted on the other side of the first mounting plate (231). A first code reading detection camera (236) is mounted on the mounting bracket of the third cylinder (235).

2. The wafer access library according to claim 1, characterized in that: It also includes a film rewinding machine (5), which includes a third frame (51) for installation. The upper surface of the third frame (51) is provided with a plurality of third film picking mechanisms (52). The side of another adjacent third film picking mechanism (52) is provided with a first code reading detection mechanism (8). A third fixture (53) is provided on one side of the third film picking mechanism (52). The third fixture (53) is provided with a plurality of third clips (54) in the same number as the third film picking mechanism (52). The first code reading detection mechanism (8) is also provided between the third fixture (53) and the third film picking mechanism (52). The third wafer picking mechanism (52) includes a seventh linear module (521) mounted on a third frame (51), and an eighth linear module (522) is provided at the power output end of the seventh linear module (521), and a third suction cup (523) is provided at the power output end of the eighth linear module (522).

3. The wafer access library according to claim 1, characterized in that: The transfer machine (32) includes a base (320) located on one side of the storage rack (31). A guide rail (321) is provided on the base (320), and a sliding frame (324) is slidably provided on the guide rail (321). A second linear module (323) for vertical movement is provided on the sliding frame (324). A rack (322) is also installed on the base (320). A first servo motor (325) is fixedly installed on the sliding frame (324), and the first servo motor (325) moves... The power output end is equipped with a gear adapted to the rack (322), and the gear meshes with the rack (322) for transmission; the power output end of the second linear module (323) is provided with at least one mounting bracket, and each mounting bracket is equipped with a second DD motor (326), the output end of the second DD motor (326) is equipped with a third linear module (327), the third linear module (327) is equipped with a first cylinder (328), and the power output end of the first cylinder (328) is equipped with a gripper (329).

4. A wafer access library according to claim 1, characterized in that: The conveying mechanism (6) includes a support frame (61), on which a three-axis linear motion module (62) is provided. A second servo motor (63) is fixedly installed on the mounting bracket at the power end of the three-axis linear motion module (62). A rotating plate (64) is installed at the power output end of the second servo motor (63). Two sliders (68) are slidably arranged below the rotating plate (64). A sliding plate (69) is fixedly connected to the bottom surface of each slider (68). A rotary cylinder (65) is installed on the outer side of each sliding plate (69). The power output end of the rotary cylinder (65) extends to the inner side of the sliding plate (69). A clamping plate (66) is installed at the power output end of the rotary cylinder (65). A drive motor (67) is fixedly installed on one side of the upper surface of the rotating plate (64). A lead screw is connected between the two sliding plates (69). The power input end of the lead screw is connected to the power output end of the drive motor (67).

5. A wafer access library according to claim 2, characterized in that: A chip picking and code reading detection mechanism (13) is also installed on the first frame (11). The chip picking and code reading detection mechanism (13) is located on one side of the feeding turntable mechanism (12). The chip picking and code reading detection mechanism (13) includes a first linear module (131) installed on the first frame (11). A first chip picking mechanism (7) is provided on the power output end of the first linear module (131). A first code reading detection mechanism (8) is also provided on the first linear module (131). A bracket (132) is provided on one side of the first linear module (131). A second fixture (133) is provided on the bracket (132). A plurality of second clips (134) are placed on the second fixture (133).

6. A wafer access library according to claim 1 or 5, characterized in that: The first wafer picking mechanism (7) includes a fourth linear module (71), a fifth linear module (72) is installed on the power output end of the fourth linear module (71), a fifth servo motor (73) is installed on the output end mounting bracket of the fifth linear module (72), and a first chuck (74) for picking up wafers is provided on the power output end of the fifth servo motor (73).

7. A wafer access library according to claim 1, 2, or 5, characterized in that: The first code reading detection mechanism (8) includes a second mounting plate (81), a second cylinder (82) is mounted on the second mounting plate (81), and a second code reading detection camera (83) is mounted on the mounting bracket at the power output end of the second cylinder (82).

8. A wafer access library according to claim 1, characterized in that: The second wafer picking mechanism (24) includes a third fixed frame (241) mounted on a second frame (21). A fourth servo motor (242) is mounted on the bottom surface of the third fixed frame (241). The power output end of the fourth servo motor (242) extends above the third fixed frame (241), and a sixth linear module (243) is mounted on the power output end of the fourth servo motor (242). A second suction cup (244) is provided on the power output end of the sixth linear module (243).

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