An integrated circuit triode and its testing method

Abstract

The present invention discloses an integrated circuit triode and a testing method thereof, including a triode component. The triode component includes a base component, and a core component is clamped on the outer wall of the top of the base component. The base component includes a base, a raised ring is integrally formed on the outer wall of the top of the base, and placement grooves are formed on the outer walls on both sides of the raised ring. Elastic pieces are integrally formed on the inner walls of the bottoms of the placement grooves, and a clamping block is integrally formed near the top on one outer wall of the elastic piece. Two springs are installed between one outer wall of the elastic piece and one inner wall of the placement groove through bolts. The beneficial effect of the present invention is that when the triode is damaged and needs to be disassembled and assembled, the structure composed of the elastic member, the clamping block and the spring can reduce the difficulty of disassembling and assembling between the core component and the base component, realize the rapid disassembly and assembly of the triode packaging structure, so as to facilitate the subsequent preservation of the undamaged structure and realize the utilization of resources.

Description

Technical Field

[0001] The present invention relates to the technical field of triodes, and particularly relates to an integrated circuit triode and a testing method thereof. Background Art

[0002] An integrated circuit is a way of miniaturizing a circuit. By using a certain process, components such as transistors, resistors, capacitors, inductors, and triodes required in a circuit, as well as the wiring, are interconnected and fabricated on a small piece or a few small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a tube shell to form a micro-structure with the required circuit functions. Existing integrated circuits generally have triodes. The triode in the integrated circuit is used to amplify a weak signal into an electrical signal with a larger amplitude value and also serves as a non-contact switch.

[0003] For example, a waterproof voltage-stabilizing triode with the authorization announcement number CN207852648U and the authorization announcement date September 11, 2018, includes a triode main body. A triode fixing hole is opened on the top surface of the triode main body. The triode fixing hole is of a circular structure. A main body texture is provided on the surface of the triode main body. A triode base is provided at the bottom of the triode main body. An electrode turning groove is opened on the bottom surface of the triode main body. A main body texture is connected and provided on one side of the bottom of the triode main body where the triode base is located. The collector and emitter of the triode are set as rotatable structures. By rotating its electrodes, it is more convenient during connection and fixing, and has a higher applicability, improving the practicality of the triode. Moreover, the texture provided on the surface of the triode main body can prevent slipping during use, avoid damage to the triode, and can also increase the surface area of the triode, thereby improving the heat dissipation effect of the triode and enhancing the practicality of the triode.

[0004] In the above-mentioned and existing technologies, the triode housing and the internal pn structure are generally encapsulated together by bolts or glue, resulting in a relatively high difficulty in subsequent disassembly. Therefore, it is urgent to design an integrated circuit triode and a testing method thereof to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide an integrated circuit triode and a testing method thereof to solve the above-mentioned deficiencies in the prior art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] An integrated circuit triode includes a triode component, and the triode component includes a base component. A core component is clamped on the outer wall of the top of the base component. The base component includes a base. A raised ring is integrally formed on the outer wall of the top of the base, and placement grooves are formed on the outer walls of both sides of the raised ring. Elastic pieces are integrally formed on the inner wall of the bottom of the placement groove, and a clamping block is integrally formed on the outer wall of one side of the elastic piece near the top. Two springs are installed between the outer wall of one side of the elastic piece and the inner wall of one side of the placement groove by bolts.

[0008] Further, three plug-in components are inserted into the inner wall of the bottom of the base and are distributed in an equidistant structure, and pins are integrally formed on the outer wall of the bottom of the plug-in components.

[0009] Further, the core component includes a box shell. A plug-in groove is formed on the inner wall of the side of the box shell near the bottom, and a sealing gasket is bonded inside the plug-in groove. The raised ring is inserted into the sealing gasket.

[0010] Further, limiting holes are formed on the outer walls of both sides of the box shell near the bottom, and the clamping block is clamped inside the limiting holes.

[0011] Further, a heat dissipation component is inserted into the inner wall of the top of the box shell. A core that is in contact with the heat dissipation component is inserted into the box shell. The bottom end of the core is inserted into the base and the raised ring.

[0012] Further, three plug-in holes are formed on the outer wall of one side of the core and are distributed in an equidistant structure, and the plug-in components are inserted into the plug-in holes.

[0013] Further, the heat dissipation component includes a heat pipe, and liquid ammonia is filled inside the heat pipe.

[0014] Further, a shell is welded on the outer wall of the top of the heat pipe, and the shell communicates with the heat pipe. Through holes are formed on the outer wall of one side of the shell and are distributed in an equidistant structure.

[0015] Further, the box shell includes a metal layer, a plastic layer is wrapped outside the metal layer, and a flame retardant layer is sprayed on the outer wall of one of the plastic layers.

[0016] An integrated circuit triode testing method includes the following steps:

[0017] S1. Preliminary preparation: According to the measurement requirements, prepare the measuring tool multimeter and the corresponding triode.

[0018] S2. Start measurement:

[0019] S2.1. Measuring the inter-electrode resistance: Set the multimeter to the R×100 or R×1K range and test according to the six different connections of the red and black test leads. Among them, the forward resistance values of the emitter junction and the collector junction are relatively low, and the resistance values measured by the other four connections are very high, about several hundred kiloohms to infinity. However, whether it is low resistance or high resistance, the inter-electrode resistance of a silicon transistor is much larger than that of a germanium transistor;

[0020] S2.2. Measuring the value of ICEO: The resistance range of the multimeter is generally selected as R×100 or R×1K. For a PNP transistor, the black test lead is connected to the e electrode and the red test lead is connected to the c electrode. For an NPN transistor, the black test lead is connected to the c electrode and the red test lead is connected to the e electrode. The larger the measured resistance, the better. The larger the resistance between e and c, the smaller the ICEO of the transistor; conversely, the smaller the measured resistance, the larger the ICEO of the measured transistor. Generally speaking, for medium and small power silicon transistors and germanium low-frequency transistors, their resistance values should be above several hundred kiloohms, several tens of kiloohms and more than ten kiloohms respectively. If the resistance value is very small or the pointer of the multimeter swings back and forth during the test, it indicates that the ICEO is very large and the performance of the transistor is unstable;

[0021] S2.3. Measuring the amplification ability: First, turn the function switch of the multimeter to the R×100 or R×1K range, turn the range switch to the ADJ position, short-circuit the red and black test leads, and adjust the zero-adjustment knob to make the pointer of the multimeter indicate zero. Then turn the range switch to the hFE position and separate the two short-circuited test leads. Insert the measured transistor into the test socket, and the amplification factor of the transistor can be read from the hFE scale line;

[0022] S2.4. Determining the base, collector electrode c and emitter electrode e: Measure the forward and reverse resistance values between every two of the three electrodes of the transistor with the multimeter in the R×100 or R×1k range. When the first test lead is connected to a certain electrode and the second test lead measures low resistance values when contacting the other two electrodes successively, the electrode connected by the first test lead is the base b. Then, set the multimeter to the R×100 or R×1K range, with the red test lead connected to the base b. When the black test lead contacts the other two pins respectively, the two measured resistance values will be one larger and one smaller. In the measurement with the smaller resistance value, the pin contacted by the black test lead is the collector; in the measurement with the larger resistance value, the pin contacted by the black test lead is the emitter.

[0023] In the above technical solution, an integrated circuit triode and its testing method provided by the present invention are as follows: (1) For the elastic member, clamping block and spring designed by the present invention, when the triode is damaged and needs to be disassembled and assembled, the structure composed of the elastic member, clamping block and spring can reduce the difficulty of disassembling and assembling between the core component and the base component, realize the rapid disassembly and assembly of the triode packaging structure, so as to facilitate the subsequent preservation of the undamaged structure and realize the utilization of resources; (2) For the heat dissipation component designed by the present invention, when using this triode, the liquid ammonia in the heat dissipation component can be heated and evaporated, and then condensed after releasing heat at the top of the housing. This process speeds up the heat dissipation efficiency of the triode compared with the original triode heat dissipation method; (3) The triode testing method designed by the present invention can comprehensively measure various parameters of the triode, and the measured triode fully meets the circuit requirements. Under different input voltage conditions, the integrated circuit can work normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a three-dimensional structure schematic diagram provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0026] Figure 2 It is a schematic diagram of the core component structure provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0027] Figure 3 It is a schematic diagram of the base component structure provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0028] Figure 4 It is a top view structure schematic diagram of the core provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0029] Figure 5 It is a schematic diagram of the heat dissipation component structure provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0030] Figure 6 It is a schematic diagram of the box shell material structure provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0031] Figure 7 It is a schematic diagram of Structure A provided by an embodiment of an integrated circuit triode and its testing method of the present invention.

[0032] Figure 8 The flowchart of the method provided by an embodiment of a triode of an integrated circuit and its testing method according to the present invention.

[0033] Explanation of the reference numerals:

[0034] 1 Triode assembly, 2 Core assembly, 3 Base assembly, 4 Box shell, 5 Insertion slot, 6 Sealing gasket, 7 Heat dissipation assembly, 8 Limiting hole, 9 Core, 10 Insertion hole, 11 Heat sink plate, 12 Housing, 13 Through hole, 14 Liquid ammonia, 15 Base, 16 Protruding ring, 17 Pin, 18 Connector, 19 Placement groove, 20 Spring, 21 Elastic sheet, 22 Clamping block, 23 Metal layer, 24 Plastic layer, 25 Flame retardant layer. Specific embodiments

[0035] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0036] As Figures 1-7 shown, a triode of an integrated circuit and its testing method provided by an embodiment of the present invention include a triode assembly 1. The triode assembly 1 includes a base assembly 3. A core assembly 2 is clamped on the outer wall of the top of the base assembly 3. The base assembly 3 includes a base 15. A protruding ring 16 is integrally formed on the outer wall of the top of the base 15. Placement grooves 19 are provided on the outer walls of both sides of the protruding ring 16. Elastic sheets 21 are integrally formed on the inner wall of the bottom of the placement grooves 19. A clamping block 22 is integrally formed on the outer wall of one side of the elastic sheet 21 near the top. Two springs 20 are installed between the outer wall of one side of the elastic sheet 21 and the inner wall of one side of the placement groove 19 by bolts.

[0037] Specifically, in this embodiment, it includes a triode assembly 1. The triode assembly 1 includes a base assembly 3. A core assembly 2 is clamped on the outer wall of the top of the base assembly 3. The base assembly 3 includes a base 15. A protruding ring 16 is integrally formed on the outer wall of the top of the base 15. The protruding ring 16 facilitates positioning the connection between the core assembly 2 and the base assembly 3. Placement grooves 19 are provided on the outer walls of both sides of the protruding ring 16. Elastic sheets 21 are integrally formed on the inner wall of the bottom of the placement grooves 19. The elastic sheets 21 are made of elastic materials such as metal sheets. A clamping block 22 is integrally formed on the outer wall of one side of the elastic sheet 21 near the top. The clamping block 22 will be inserted into the core assembly 2 under the action of the elastic sheet 21. Two springs 20 are installed between the outer wall of one side of the elastic sheet 21 and the inner wall of one side of the placement groove 19 by bolts. The springs 20 facilitate the elastic sheet 21 to pop out from the inside of the placement groove 19 when the protruding ring 16 is inserted into the inside of the core assembly 2, so that the clamping block 22 is clamped on the box shell 4, and the core assembly 2 and the base assembly 2 are fixed together.

[0038] An integrated circuit triode provided by the present invention. When the triode is damaged and needs to be disassembled and assembled, the structure composed of the elastic member 21, the clamping block 22 and the spring 20 can reduce the difficulty of disassembling and assembling between the core component 2 and the base component 3, realize the quick disassembly and assembly of the triode packaging structure, so as to facilitate the subsequent preservation of the undamaged structure and realize the utilization of resources.

[0039] In another embodiment provided by the present invention, as Figure 3 shown, three plug-in members 18 distributed at equal distances are plugged on the inner wall of the bottom of the base 15. The plug-in members 18 facilitate the connection of the pins 17 to the core 9, and the pins 17 are integrally formed on the outer wall of the bottom of the plug-in members 18. The pins 17 facilitate the welding of the triode on the integrated circuit board.

[0040] In another embodiment provided by the present invention, as Figure 2 shown, the core component 2 includes a box shell 4. A plug-in groove 5 is opened at a position close to the bottom on the inner wall of the side of the box shell 4, and a sealing gasket 6 is bonded inside the plug-in groove 5. The sealing gasket 6 can improve the sealing performance between the base 15 and the box shell 4, and the raised ring 16 is plugged inside the sealing gasket 6.

[0041] In another embodiment provided by the present invention, as Figures 1-2 shown, limiting holes 8 are opened at positions close to the bottom on the outer walls of both sides of the box shell 4. The limiting holes 8 facilitate the clamping block 22 to be clamped on the box shell 4, so that the base 15 and the box shell 4 are connected together, and the clamping block 22 is clamped inside the limiting holes 8.

[0042] In another embodiment provided by the present invention, as Figure 3 、 Figure 5 shown, a heat dissipation component 7 is plugged on the inner wall of the top of the box shell 4. The heat dissipation component 7 can accelerate the heat dissipation of the triode. A core 9 in contact with the heat dissipation component 7 is plugged inside the box shell 4. The core 9 is the pn structure inside the triode, and the bottom end of the core 9 is plugged inside the base 15 and the raised ring 16.

[0043] In another embodiment provided by the present invention, as Figure 4 shown, three plug-in holes 10 distributed at equal distances are opened on the outer wall of one side of the core 9. The plug-in holes 10 facilitate the plug-in members 18 to be plugged on the core 9, so that the pins 17 are connected to the core 9, and the plug-in members 18 are plugged inside the plug-in holes 10.

[0044] In another embodiment provided by the present invention, as Figure 5 shown, the heat dissipation component 7 includes a heat sink plate 11. The heat sink plate 11 facilitates the carrying of liquid ammonia 14. Liquid ammonia 14 is filled inside the heat sink plate 11. The liquid ammonia 14 has a low boiling point and melting point, will evaporate when heated, and then will condense when cooled. This process can dissipate a large amount of heat and can improve the heat dissipation efficiency of the triode.

[0045] In another embodiment provided by the present invention, as Figure 5 shown, a housing 12 is welded to the outer wall of the top of the heat sink plate 11. The housing 12 facilitates the condensation of the evaporated liquid ammonia 14, and the housing 12 communicates with the heat sink plate 11. A plurality of through holes 13 are formed in one side outer wall of the housing 12 at equidistant intervals. The through holes 13 can increase the contact area between the air and the housing 12.

[0046] In another embodiment provided by the present invention, as Figure 6 shown, the box housing 4 includes a metal layer 23. The cooperation of the metal layer 23 and the plastic layer 24 can improve the strength of the box housing 4 and avoid the probability that the box housing 4 explodes when the core 9 is short-circuited. The metal layer 23 is wrapped with a plastic layer 24, and a flame retardant layer 25 is sprayed on one side outer wall of one of the plastic layers 24. The flame retardant layer 25 can improve the flame retardant ability of the inner wall of the box housing 4.

[0047] As Figure 8 shown, an integrated circuit triode testing method includes the following steps:

[0048] S1. Preliminary preparation: According to the measurement requirements, prepare a multimeter as the measurement tool and the corresponding triode.

[0049] S2. Start measurement:

[0050] S2.1. Measure the inter-electrode resistance: Set the multimeter to the R×100 or R×1K range and test according to six different connections of the red and black test leads. Among them, the forward resistance values of the emitter junction and the collector junction are relatively low, and the resistance values measured by the other four connections are very high, about several hundred kiloohms to infinity. However, whether it is low resistance or high resistance, the inter-electrode resistance of a silicon material triode is much larger than that of a germanium material triode;

[0051] S2.2. Measure the value of ICEO: The resistance range of the multimeter is generally selected as R×100 or R×1K range. For a PNP transistor, the black test lead is connected to the e electrode and the red test lead is connected to the c electrode. For an NPN type triode, the black test lead is connected to the c electrode and the red test lead is connected to the e electrode. It is required that the measured resistance is as large as possible. The larger the resistance value between e and c, the smaller the ICEO of the transistor; conversely, the smaller the measured resistance value, the larger the ICEO of the measured transistor. Generally speaking, for medium and small power silicon transistors and germanium material low-frequency transistors, their resistance values should be above several hundred kiloohms, several tens of kiloohms and more than ten kiloohms respectively. If the resistance value is very small or the multimeter pointer swings back and forth during the test, it indicates that the ICEO is very large and the performance of the transistor is unstable;

[0052] S2.3. Measuring amplification ability: First, turn the function switch of the multimeter to the R×100 or R×1K range, turn the range switch to the ADJ position, short-circuit the red and black test leads, and adjust the zero-adjustment knob to make the multimeter pointer indicate zero. Then turn the range switch to the hFE position and separate the short-circuited test leads. Insert the measured triode into the test socket, and the amplification factor of the transistor can be read from the hFE scale line.

[0053] S2.4. Determining the base, collector c, and emitter e: Use the R×100 or R×1k range of the multimeter to measure the forward and reverse resistance values between every two of the three electrodes of the triode. When the first test lead is connected to a certain electrode and the second test lead successively touches the other two electrodes and both measure low resistance values, the electrode connected by the first test lead is the base b. Then, place the multimeter in the R×100 or R×1K range, with the red test lead on the base b. When using the black test lead to touch the other two pins respectively, the two measured resistance values will be one larger and one smaller. In the measurement with the smaller resistance value, the pin connected by the black test lead is the collector; in the measurement with the larger resistance value, the pin connected by the black test lead is the emitter.

[0054] Working principle: When using this device, the pn structure can be first installed inside the box shell 4, and then the base assembly 3 can be installed on the core assembly 2 through the cooperation of the convex ring 16 and the socket groove 5. At this time, when the convex ring 16 is completely inserted into the socket groove 5, under the action of the spring 20, the elastic member 21 will be squeezed, so that the latch 22 is inserted into the limit hole 8, completing the limit fixation between the core assembly 2 and the base assembly 3. Moreover, when connecting the core assembly 2 and the base assembly 3 together, the connector 18 will be connected to the core 9 through the socket hole 10, thus completing the connection between the pin 17 and the core 9. After that, when the triode operates, the liquid ammonia 14 inside the heat sink plate 11 will evaporate when heated, and then flow to the top of the shell 12 and condense when cooled to dissipate heat, thereby accelerating the heat dissipation of this triode.

[0055] Only some exemplary embodiments of the present invention have been described by way of illustration above. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An integrated circuit triode, comprising a triode component (1), characterized in that: The triode component (1) includes a base component (3). A core component (2) is clamped on the outer wall of the top of the base component (3). The base component (3) includes a base (15). A raised ring (16) is integrally formed on the outer wall of the top of the base (15). Placement grooves (19) are formed on the outer walls on both sides of the raised ring (16). Elastic pieces (21) are integrally formed on the inner walls of the bottoms of the placement grooves (19). A clamping block (22) is integrally formed on the outer wall of one side of the elastic piece (21) near the top. Two springs (20) are installed between the outer wall of one side of the elastic piece (21) and the inner wall of one side of the placement groove (19) by bolts; The core component (2) includes a box shell (4). A plug-in groove (5) is formed on the inner wall of the side of the box shell (4) near the bottom. A sealing gasket (6) is bonded inside the plug-in groove (5). The raised ring (16) is plugged into the sealing gasket (6); A heat dissipation component (7) is plugged on the inner wall of the top of the box shell (4). A core (9) in contact with the heat dissipation component (7) is plugged inside the box shell (4). The bottom end of the core (9) is plugged into the base (15) and the raised ring (16); The heat dissipation component (7) includes a heat spreader (11). Liquid ammonia (14) is filled inside the heat spreader (11); A shell (12) is welded on the outer wall of the top of the heat spreader (11). The shell (12) communicates with the heat spreader (11). Through holes (13) are formed on the outer wall of one side of the shell (12) in an equidistant structure distribution; 2. An integrated circuit triode according to claim 1, characterized in that, Three plug-in parts (18) are plugged on the inner wall of the bottom of the base (15) in an equidistant structure distribution. A pin (17) is integrally formed on the outer wall of the bottom of the plug-in part (18); 3. An integrated circuit triode according to claim 1, characterized in that, Limit holes (8) are formed on the outer walls of both sides of the box shell (4) near the bottom. The clamping block (22) is clamped inside the limit hole (8); 4. An integrated circuit triode according to claim 1, characterized in that, Three plug-in holes (10) are formed on the outer wall of one side of the core (9) in an equidistant structure distribution. The plug-in part (18) is plugged inside the plug-in hole (10); 5. An integrated circuit triode according to claim 1, characterized in that, The box shell (4) includes a metal layer (23). A plastic layer (24) is wrapped outside the metal layer (23). A flame retardant layer (25) is sprayed on the outer wall of one of the plastic layers (24);

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