An HDMI interface structure with high transmission signal efficiency

Abstract

The present invention discloses an HDMI interface structure with high transmission signal efficiency, which relates to the field of electronic device connectors. It includes a first group of PIN foot components and a second group of PIN foot components, a first base provided with a core wire, a second base fixedly connected to the first base, an insulating inner shell and an outer shell. The first group of PIN foot components is arranged on the first base. Three positioning protrusion parts are arranged at the bottom of the first base, and each positioning protrusion part is provided with a PIN foot. The second base is provided with positioning grooves adapted to the positioning protrusion parts to form three fixing parts, and each fixing part is provided with two PIN feet. The PIN feet on all the positioning protrusion parts and the fixing parts form the second group of PIN foot components. The insulating inner shell is arranged between the first base, the second base, the first group of PIN foot components and the second group of PIN foot components. The outer shell is installed on the outer side of the insulating inner shell. Both the first group of PIN foot components and the second group of PIN foot components are welded and fixed to the core wire. The technical solution of the present invention has fast signal transmission and is convenient for assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device connectors, and particularly to an HDMI interface structure with high signal transmission efficiency. Background Art

[0002] Currently, in existing HDMI interfaces, generally a PCB board is provided between the PIN foot assembly and the core wire, and the core wire and the PIN foot assembly are connected to each other through the PCB board. However, this connection method causes the signal transmitted by the HDMI interface to first pass through the PCB board and then through the core wire, resulting in a certain degree of signal loss on the PCB board and also reducing the signal transmission rate of the HDMI interface. Summary of the Invention

[0003] The purpose of the present invention is to overcome the above-mentioned defects in the prior art, and provide an HDMI interface structure with high signal transmission efficiency, which has fast signal transmission, simplifies the processing difficulty, and has stable characteristic impedance.

[0004] To achieve the above purpose, the present invention provides an HDMI interface structure with high signal transmission efficiency, including: 1. An HDMI interface structure with high signal transmission efficiency, including a first group of PIN foot assemblies and a second group of PIN foot assemblies arranged horizontally, and further including a first base provided with a core wire, a second base fixedly connected to the first base, an insulating inner shell and an outer shell. The first group of PIN foot assemblies is arranged on the first base. Three positioning protrusion parts are provided at the bottom of the first base, and each positioning protrusion part is provided with a PIN foot. The second base is provided with positioning grooves adapted to the positioning protrusion parts to form three fixing parts, and each fixing part is provided with two PIN feet. The PIN feet on all the positioning protrusion parts and fixing parts form the second group of PIN foot assemblies. The insulating inner shell is used to protect the first base, the second base, the first group of PIN foot assemblies and the second group of PIN foot assemblies. The outer shell is installed on the outside of the insulating inner shell. The first group of PIN foot assemblies and the second group of PIN foot assemblies are both welded and fixed to the core wire. The signal transmission of this technical solution is fast and the assembly is convenient.

[0005] In the above technical solution, the 14th PIN (eARC) and the 19th PIN (HPD) are provided on the first group of PIN foot assemblies or the second group of PIN foot assemblies. Among them, the welding positions of the 14th PIN (eARC) and the 19th PIN (HPD) are adjacent, which is convenient for the core wire to arrange the wires. In this way, the processing difficulty can be simplified, and the characteristic impedance of this technical solution can be made very stable.

[0006] In the above technical solution, a first bearing portion is provided on the first base, the first set of PIN foot components are arranged on one side of the first bearing portion, the positioning convex portion is arranged at the bottom of the first bearing portion, a first supporting portion and first limiting portions which bulge upward and are located on both sides of the first supporting portion are provided on the second base, the fixing portion is arranged on the first supporting portion, the first bearing portion is fixed on the first supporting portion, and the first limiting portions are located on both sides of the first bearing portion.

[0007] In the above technical solution, a second supporting portion located on one side of the first supporting portion is further provided on the second base, a second bearing portion located on one side of the first bearing portion and second limiting portions which bulge downward and are located on both sides of the second bearing portion are further provided on the first base, the second bearing portion is fixed on the second supporting portion, and the second limiting portions are located on both sides of the second supporting portion.

[0008] In the above technical solution, a plurality of card slots for fixing the core wires are provided on the first base. In this technical solution, the existing wire clips are not used to clamp the core wires, and only the card slots are used for the core wire wiring, which is more convenient for the core wire wiring.

[0009] In the above technical solution, a receiving cavity for fixing the first supporting portion and the first bearing portion is provided on the insulating inner shell, and a plurality of fixing slots which are communicated with the receiving cavity and are used for fixing the PIN feet on the first set of PIN foot components and the second set of PIN foot components.

[0010] In the above technical solution, a guiding block is provided on the inner wall of the outer shell, and a guiding groove adapted to the guiding block is provided on the outer wall of the insulating inner shell, which is convenient for the installation and fixation of the insulating inner shell and the outer shell.

[0011] In the above technical solution, a third limiting portion is provided on the inner wall of the outer shell, and an abutting portion is provided on the insulating inner shell. The abutting portion abuts against the third limiting portion, which is convenient for the positioning during the assembly of the insulating inner shell and the outer shell.

[0012] In the above technical solution, a buckling portion is provided on the first base, and a hook portion is provided on the outer shell.

[0013] This technical solution also provides a method for manufacturing the HDMI interface structure with high transmission signal efficiency in the above technical solution, including the following steps

[0014] S1. Use a machine to respectively stamp out a 7PIN terminal component and a GND+14PIN(eARC) terminal component. At this time, the tape of the GND and 14PIN(eARC) terminal components is fixedly connected. Combine and align the 7PIN terminal component and the GND+14PIN(eARC) terminal component to obtain a combined terminal.

[0015] S2. Place the combined terminal in the injection mold, and injection-mold the first base on the outside of the combined terminal;

[0016] S3. Cut the strip of the combined terminal on the first base, thereby forming the first set of PIN foot components on the first base (1);

[0017] S4. Use machine stamping to obtain a 6PIN terminal component, place the 6PIN terminal component in the injection mold, and injection-mold the second base on the outside of the 6PIN terminal component;

[0018] S5. Cut the strip of the combined terminal on the second base, thereby forming the second set of PIN foot components on the second base;

[0019] S6. Assemble the first base and the second base, and injection-mold an insulating inner shell at the connection between the first base, the second base, the first set of PIN foot components, and the second set of PIN foot components;

[0020] S7. Injection-mold an outer shell on the outside of the insulating inner shell.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] 1. In this technical solution, a card slot is provided on the first base, the core wires are arranged in the card slot and welded and fixed to the PIN foot components, thereby greatly improving the assembly and processing efficiency. Moreover, during use, the signal can be directly transmitted to the wire through the PIN foot components, without the need to transmit it to the wire through a PCB board as in the prior art. This can greatly reduce the loss during signal transmission, improve the signal transmission rate, and reduce production costs.

[0023] 2. Generally, the 14th PIN (eARC) and the 19th PIN (HPD) of the existing HDMI interface core wires are arranged on different PIN foot components, so that the 14th PIN (eARC) and the 19th PIN (HPD) core wires are not on the same horizontal plane. In this way, when arranging the core wires, the 14th PIN (eARC) and the 19th PIN (HPD) need to be arranged in fixed places, which is rather troublesome and likely to cause impedance mismatch between the HDMI interface structure and the wire. In this technical solution, the 14th PIN (eARC) and the 19th PIN (HPD) of the core wire are arranged adjacent to each other. This can simplify the processing difficulty. Moreover, the characteristic impedance is proportional to the PIN pitch. The farther away, the higher the characteristic impedance and the greater the processing error. As an adjacent pair, it can ensure processing consistency and characteristic impedance consistency, so that the characteristic impedance of the HDMI in this technical solution will be very stable. Description of the Drawings

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0026] Figure 2 It is a schematic structural diagram of an HDMI interface structure with high transmission signal efficiency provided by the present invention from another angle;

[0027] Figure 3 It is the first exploded view of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0028] Figure 4 It is the second exploded view of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0029] Figure 5 It is the third exploded view of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0030] Figure 6 It is the fourth exploded view of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0031] Figure 7 It is the fifth exploded view of an HDMI interface structure with high transmission signal efficiency provided by the present invention;

[0032] Figure 8 It is a flowchart of a method for manufacturing the HDMI interface structure with high transmission signal efficiency in the first embodiment provided by the present invention.

[0033] The reference numerals of the drawings are: 1. First base; 11. Positioning convex portion; 12. First bearing portion; 13. Second bearing portion; 14. Second limiting portion; 15. Buckle portion; 16. Card slot; 2. First group of PIN foot components; 3. Second base; 31. Positioning groove; 32. Fixing portion; 33. First supporting portion; 34. First limiting portion; 35. Second supporting portion; 4. Second group of PIN foot components; 5. Insulating inner shell; 51. Fixing groove; 52. Abutting portion; 53. Guide groove; 6. Outer shell; 61. Hook portion; 62. Guide block; 63. Third limiting portion. Detailed implementation manners

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0036] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution that satisfies both A and B at the same time. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0038] As Figures 1-7 shown, this embodiment provides an HDMI interface structure with high transmission signal efficiency, which includes a first base 1, a first group of PIN foot components 2, a second base 3, a second group of PIN foot components 4, an insulating inner shell 5, and a housing 6. Among them, a core wire is arranged on the first base 1.

[0039] Please refer to Figure 5, both the first set of PIN - foot components 2 and the second set of PIN - foot components 4 are arranged horizontally and parallel to each other. The second base 3 is fixedly connected to the first base 1. The first set of PIN - foot components 2 is arranged on the first base 1. Among them, three positioning protrusion parts 11 are arranged at the bottom of the first base 1, and each positioning protrusion part 11 is provided with a PIN - foot. The second base 3 is provided with positioning grooves 31 adapted to the positioning protrusion parts 11 and forms three fixing parts 32. Each fixing part 32 is provided with two PIN - feet. When the second base 3 is fixedly connected to the first base 1, the positioning protrusion parts 11 are inserted into the positioning grooves 31. At this time, all the PIN - feet on all the positioning protrusion parts 11 and all the PIN - feet on all the fixing parts 32 are exactly on the same horizontal plane and form the second set of PIN - foot components 4. The insulating inner shell 5 is arranged between the first base 1, the second base 3, the first set of PIN - foot components 2 and the second set of PIN - foot components 4, mainly for protecting and fixing the first base 1, the second base 3, the first set of PIN - foot components 2 and the second set of PIN - foot components 4. The outer shell 6 is installed on the outside of the insulating inner shell 5, mainly for protecting the insulating inner shell 5, the first base 1 and the second base 3. Preferably, guide blocks 62 are arranged on the inner wall of the outer shell 6, and guide grooves 53 adapted to the guide blocks 62 are arranged on the outer wall of the insulating inner shell 5, mainly for facilitating the positioning and fixing of the insulating inner shell 5 and the outer shell 6. A third limiting part 63 is arranged on the inner wall of the outer shell 6, and an abutting part 52 is arranged on the insulating inner shell 5. When the insulating inner shell 5 is inserted into the outer shell 6 in place, the abutting part 52 will abut against the third limiting part 63, thus facilitating the fixed connection between the insulating inner shell 5 and the outer shell 6. In addition, both the first set of PIN - foot components 2 and the second set of PIN - foot components 4 are welded and fixed to the core wires. The existing HDMI interfaces generally connect the core wires and PIN - feet through a PCB board. First, the core wires are welded at one end of the PCB board and then the PIN - feet are welded at the other end of the PCB board. Although such a welding method is relatively simple and easy to operate, during the signal transmission process, the signal first passes through the PCB board from the PIN - feet and then is transmitted to the core wires. In this way, there will be a certain loss of the signal during the transmission process. However, in this technical solution, the core wires and the PIN - foot components are directly welded together, and the signal can be directly transmitted to the wire through the PIN - foot components, greatly reducing the loss during the signal transmission process, thereby improving the signal transmission rate.

[0040] Specifically, please refer to Figure 6 and Figure 7, a first base 1 is provided with a first bearing portion 12, a second bearing portion 13 and a second limiting portion 14. The second bearing portion 13 is located on one side of the first bearing portion 12, and the second limiting portion 14 is located on both sides of the second bearing portion 13 and protrudes downward. A first group of PIN foot components 2 is arranged on one side of the first bearing portion 12, and a positioning convex portion 11 is arranged at the bottom of the first bearing portion 12. A second base 3 is provided with a first supporting portion 33, a first limiting portion 34 and a second supporting portion 35. The first limiting portion 34 is located on both sides of the first supporting portion 33 and protrudes upward, and the second supporting portion 35 is located on one side of the first supporting portion 33. A fixing portion 32 is arranged on the first supporting portion 33. Specifically, when the first base 1 and the second base 3 are fixedly connected, the first bearing portion 12 is fixed on the first supporting portion 33, the first limiting portion 34 is located on both sides of the first bearing portion 12, the second bearing portion 13 is fixed on the second supporting portion 35, the second limiting portion 14 is located on both sides of the second supporting portion 35, and the positioning convex portion 11 is fixed in the positioning groove 31.

[0041] On the first base 1 of this embodiment, several card slots 16 for fixing the core wires are provided. Among them, the card slots 16 are preferably arranged at the top of the second bearing part 13. In this way, the core wires will not be displaced during processing, which is convenient for processing. Moreover, all the solder joints are on the same horizontal plane, and welding is easier. Automatic wire arrangement can replace manual wire arrangement, greatly simplifying the process flow. As an option, the 14th PIN (eARC) and the 19th PIN (HPD) are arranged on the first group of PIN foot components 2 or the second group of PIN foot components 4. Among them, the welding positions of the 14th PIN (eARC) and the 19th PIN (HPD) are adjacent. Specifically, the full name of eARC is Enhanced Audio Return Channel. It combines the original ARC pin (PIN14 UTILITY) and the HPD pin (PIN19) into a pair of differential signals, realizing 100MHz bandwidth transmission. Since the 14th PIN (eARC) and the 19th PIN (HPD) of the existing HDMI interface core wires are generally arranged on different PIN foot components, the core wires of the 14th PIN (eARC) and the 19th PIN (HPD) are not on the PIN foot components on the same horizontal plane. In this way, the core wires of the 14th PIN (eARC) and the 19th PIN (HPD) are far apart, which easily leads to impedance mismatch. In this technical solution, the welding positions of the 14th PIN (eARC) and the 19th of the core wires are adjacent, which can simplify the processing difficulty and make the characteristic impedance of HDMI very stable. Since the characteristic impedance is proportional to the distance, the closer the distance, the easier it is to control the processing. Therefore, the adjacent arrangement of the 14th PIN (eARC) and the 19th PIN (HPD) can improve the stability of the characteristic impedance. In addition, the traditional interface structure has 19 solder joints. In this technical solution, because the GND is integrated, 5 independent GND solder joints are reduced compared with the traditional interface structure, and the single GND PIN becomes a whole GND sheet, increasing the shielding area and reducing the gaps.

[0042] On the insulating inner shell 5 of this technical solution, a receiving cavity for fixing the first support part 33 and the first bearing part 12 is provided, and several fixing grooves 51 connected to the receiving cavity and used for fixing the PIN feet on the first group of PIN foot components 2 and the second group of PIN foot components 4. The receiving cavity is mainly used to fix the first support part 33 and the first bearing part 12, so as to ensure the stable fixed connection between the first base 1 and the second base 3. In addition, one PIN foot on the first group of PIN foot components 2 and the second group of PIN foot components 4 matches one fixing groove 51, which is mainly used to insulate and separate the PIN feet, facilitating the insertion of the PIN feet into the external adapter, so as to facilitate signal transmission.

[0043] Preferably, a buckle portion 15 is provided on the first base 1 of the technical solution, and a hook portion 61 is provided on the outer shell 6. After the outer shell 6 and the insulating inner shell 5 are fixed in place, the buckle portion 15 on the first base 1 just engages with the hook portion 61, which can prevent the outer shell 6 from separating from the insulating inner shell 5, further improving the stability and service life of the HDMI. In addition, the buckle portion 15 and the hook portion 61 are simple to process and convenient to assemble.

[0044] Embodiment 2

[0045] As Figure 8 shown, this embodiment also provides a method for manufacturing the HDMI interface structure with high transmission signal efficiency in Embodiment 1, including the following steps:

[0046] S1. Use a machine to separately stamp out a 7PIN terminal assembly and a GND (ground wire) + 14PIN (eARC) terminal assembly. At this time, the tape of the GND (ground wire) and the 14PIN (eARC) terminal assembly is fixedly connected. Align the 7PIN terminal assembly and the GND (ground wire) + 14PIN (eARC) terminal assembly to obtain a combined terminal.

[0047] S2. Place the combined terminal in an injection mold, and injection-mold the first base 1 on the outside of the combined terminal.

[0048] S3. Cut the tape of the combined terminal on the first base 1, thereby forming a first set of PIN foot assemblies 2 on the first base 1. Conventionally, generally, after the PIN foot assembly is assembled on the interface structure, then the GND (ground wire) is processed on the interface structure. However, in this technical solution, during the process of stamping the PIN foot assembly, the GND (ground wire) is stamped together. During the stamping process, the tape of the GND (ground wire) and the PIN foot assembly is connected together. One is for stamping and manufacturing the stamping mold, and the other is to prevent the terminals from shifting during molding (injection). In this way, all the terminals and the GND are connected together through the tape, which can ensure the strength of the terminals, and then they are cut after molding (injection). In addition, the traditional interface structure has 19 solder joints, and because this technical solution integrates the GND, it reduces 5 independent GND solder joints compared with the traditional interface structure, and changes from a single GND PIN to a whole GND sheet, increasing the shielding area and reducing the gap.

[0049] S4. Use a machine to separately stamp out a 6PIN terminal assembly, place the 6PIN terminal assembly in an injection mold, and injection-mold the second base 3 on the outside of the 6PIN terminal assembly.

[0050] S5. Cut the tape of the combined terminal on the second base 3, thereby forming a second set of PIN foot assemblies 4 on the second base 3.

[0051] S6. Assemble the first base 1 and the second base 2, and injection mold an insulating inner shell 5 at the joints between the first base 1, the second base 3, the first set of PIN foot components 2 and the second set of PIN foot components 4;

[0052] S7. Injection mold an outer shell 6 on the outer side of the insulating inner shell 5.

[0053] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention shall be equivalent replacement methods and are all included in the protection scope of the present invention.

Claims

1. An HDMI interface structure with high transmission signal efficiency, including a first group of PIN foot components (2) and a second group of PIN foot components (4) arranged horizontally, characterized in that, It further includes a first base (1) provided with a core wire, a second base (3) fixedly connected to the first base (1), an insulating inner shell (5) and an outer shell (6). The first set of PIN foot components (2) are arranged on the first base (1). Three positioning protrusion parts (11) are arranged at the bottom of the first base (1), and each positioning protrusion part (11) is provided with a PIN foot. The second base (3) is provided with positioning grooves (31) adapted to the positioning protrusion parts (11) to form three fixing parts (32), and each fixing part (32) is provided with two PIN feet. The PIN feet on all the positioning protrusion parts (11) and the fixing parts (32) form a second set of PIN foot components (4). The insulating inner shell (5) is used to protect the first base (1), the second base (3), the first set of PIN foot components (2) and the second set of PIN foot components (4). The outer shell (6) is installed on the outside of the insulating inner shell (5). The first set of PIN foot components (2) and the second set of PIN foot components (4) are both welded and fixed to the core wire. The 14th PIN and the 19th PIN are arranged on the first set of PIN foot components (2) or the second set of PIN foot components (4). The 14th PIN is an eARC interface, and the 19th PIN is an HPD interface. Among them, the welding positions of the 14th PIN and the 19th PIN are adjacent to each other.

2. The HDMI interface structure with high transmission signal efficiency according to claim 1, characterized in that, A first bearing part (12) is arranged on the first base (1). The first set of PIN foot components (2) are arranged on one side of the first bearing part (12). The positioning protrusion parts (11) are arranged at the bottom of the first bearing part (12). The second base (3) is provided with a first supporting part (33) and first limiting parts (34) that protrude upward on both sides of the first supporting part (33). The fixing parts (32) are arranged on the first supporting part (33). The first bearing part (12) is fixed on the first supporting part (33), and the first limiting parts (34) are located on both sides of the first bearing part (12).

3. The HDMI interface structure with high transmission signal efficiency according to claim 2, characterized in that, The second base (3) is further provided with a second supporting part (35) on one side of the first supporting part (33). The first base (1) is further provided with a second bearing part (13) on one side of the first bearing part (12) and second limiting parts (14) that protrude downward on both sides of the second bearing part (13). The second bearing part (13) is fixed on the second supporting part (35), and the second limiting parts (14) are located on both sides of the second supporting part (35).

4. A HDMI interface structure with high transmission signal efficiency according to claim 3, characterized in that, A plurality of card slots (16) for fixing the core wire are arranged on the first base (1).

5. The HDMI interface structure with high transmission signal efficiency according to claim 1, characterized in that, The insulating inner shell (5) is provided with a receiving cavity for fixing the first supporting part (33) and the first bearing part (12), and a plurality of fixing slots (51) that communicate with the receiving cavity and are used to fix the PIN feet on the first set of PIN foot components (2) and the second set of PIN foot components (4).

6. The HDMI interface structure with high transmission signal efficiency according to claim 1, characterized in that, Guide blocks (62) are arranged on the inner wall of the outer shell (6), and guide grooves (53) adapted to the guide blocks (62) are arranged on the outer wall of the insulating inner shell (5).

7. A HDMI interface structure with high transmission signal efficiency according to claim 1, characterized in that, A third limiting portion (63) is provided on the inner wall of the outer shell (6), and an abutting portion (52) is provided on the insulating inner shell (5), and the abutting portion (52) abuts against the third limiting portion (63).

8. The HDMI interface structure with high transmission signal efficiency according to claim 1, characterized in that, A buckling portion (15) is provided on the first base (1), and a hook portion (61) is provided on the outer shell (6).

9. A method for manufacturing an HDMI interface structure with high transmission signal efficiency according to any one of claims 1-8, characterized in that, including the following steps S1. Use a machine to stamp out a 7PIN terminal assembly and a GND + 14PIN terminal assembly respectively. At this time, the strip of the GND and 14PIN terminal assembly is fixedly connected. Align the 7PIN terminal assembly and the GND + 14PIN terminal assembly to obtain a combined terminal. S2. Place the combined terminal in an injection mold, and injection-mold the first base (1) on the outside of the combined terminal. S3. Cut off the strip of the combined terminal on the first base (1), so as to form a first group of PIN foot assemblies (2) on the first base (1). S4. Use a machine to stamp out a 6PIN terminal assembly, place the 6PIN terminal assembly in an injection mold, and injection-mold the second base (3) on the outside of the 6PIN terminal assembly. S5. Cut off the strip of the combined terminal on the second base (3), so as to form a second group of PIN foot assemblies (4) on the second base (3). S6. Assemble the first base (1) and the second base (2), and injection-mold the insulating inner shell (5) at the connection between the first base (1), the second base (3), the first group of PIN foot assemblies (2) and the second group of PIN foot assemblies (4). S7. Injection-mold the outer shell (6) on the outside of the insulating inner shell (5).

Images