A level shift structure for a super large array ultra-low temperature infrared image sensor
By employing a combination of high and low threshold devices and level conversion clamping matching technology in an ultra-large array ultra-low temperature infrared image sensor, the problem of signal conversion failure was solved, achieving highly reliable level conversion and improving the reliability and stability of the sensor.
Patent Information
- Application Number
- CN202211339506.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-25
- Publication Date
- 2026-05-29
- Estimated Expiration
- 2042-10-25
AI Technical Summary
In ultra-large array ultra-low temperature infrared image sensors, the traditional low-voltage to high-voltage circuit structure causes the signal to fail to complete level conversion smoothly under ultra-low temperature conditions, resulting in some signals failing to start and causing functional failure.
By employing a hybrid high- and low-threshold device technology and a level-shifting clamping matching technology, a low-voltage input transistor is added to the high-voltage-domain level-shifting structure. The clamping matching circuit stabilizes the source-drain voltage of the signal input transistor, ensuring that it is within the normal operating voltage range and avoiding the risk of breakdown.
It achieves highly reliable level switching under ultra-low temperature conditions, ensuring that the signal can be turned on smoothly in the high voltage domain, thereby improving the reliability and stability of the image sensor.