Wafer cleaning apparatus

Abstract

One or more embodiments of the present application disclose a wafer cleaning device to solve the problem of low safety of the existing wafer cleaning device. The wafer cleaning device comprises a process tank assembly, a self-protection device and a first safety control assembly. The process tank assembly comprises a tank body, a heater arranged in the tank body, a heating control device and a control system. The heating control device is turned on when receiving a heating control signal sent by the control system, and controls the heater to work. The heating control device is turned off when not receiving the heating control signal, and controls the heater to stop working. The self-protection device comprises a first protection circuit and a safety protection assembly. The self-protection device is used for controlling the heating control device to be turned on or turned off. The first safety control assembly is connected between the heating control device and the control system, and is connected with the self-protection device. The first safety control assembly is used for controlling the heating control device to be turned off when the heater meets a preset power-off condition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a wafer cleaning equipment. BACKGROUND

[0002] Cleaning technology is an important part of the semiconductor manufacturing process. Among them, wet cleaning technology is a major cleaning technology, and tank cleaning equipment is a kind of wet cleaning equipment commonly used at present. However, some dangerous situations may occur during the operation of the tank cleaning equipment, such as collision of mechanical parts, falling of the heater from the support, fire of the equipment, etc., which seriously threatens the safety of the operators and products, so it is particularly important to consider safety control strategy when designing the tank cleaning equipment. However, the safety level of the safety control strategy in the existing tank cleaning equipment is low, and it is difficult to deal with the dangerous situations when the cleaning liquid needs to be heated to an ultra-high temperature and the high-risk chemical liquid is involved, which leads to the inability to ensure the safety of the operators, products and tank cleaning equipment. SUMMARY

[0003] The purpose of one or more embodiments of the present application is to provide a wafer cleaning equipment to solve the problem of low safety of the existing wafer cleaning equipment.

[0004] To solve the above technical problems, one or more embodiments of the present application are implemented as follows:

[0005] In one aspect, one or more embodiments of the present application provide a wafer cleaning equipment, comprising a process tank assembly, a self-protection device and a first safety control assembly.

[0006] The process tank assembly comprises a tank body, a heater arranged in the tank body, a heating control device and a control system. The heating control device is turned on when receiving the heating control signal sent by the control system, and controls the heater to work. The heating control device is turned off when not receiving the heating control signal, and controls the heater to stop working.

[0007] The self-protection device comprises a first protection circuit and a safety protection assembly. The self-protection device is used to control the heating control device to be turned on or turned off.

[0008] The first safety control assembly is connected between the heating control device and the control system, and is connected with the self-protection device. The first safety control assembly is used to control the heating control device to be turned off when the heater meets the preset power-off condition.

[0009] The wafer cleaning equipment of the embodiment of the present invention is connected to the process tank assembly by a self-protection device and a first safety control component. The self-protection device includes a first protection circuit and a safety protection component. The self-protection device controls the heating control device connected to the heater to be turned on or off, thereby controlling the heater to work or stop working. In addition, by connecting the first safety control component in series between the heating control device and the control system and connected to the self-protection device, when the heater meets the preset power-off condition and / or does not receive the heating control signal sent by the control system, the heating control device is controlled to be disconnected, thereby controlling the heater to stop working. It can be seen that the wafer cleaning equipment can control the heater to stop working when the heater needs to be powered off (such as when the preset power-off condition is met) by setting the self-protection device and the first safety control component, thereby achieving dual control of whether the heater is working, avoiding the situation where control failure is easy to occur when only the self-protection device is set, and then causing the heater to be unable to be powered off normally, greatly reducing the multiple risks in the heater, thereby ensuring the safety of the wafer cleaning equipment during the cleaning liquid heating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate one or more embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in one or more embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 is a schematic block diagram of a wafer cleaning device according to an embodiment of the present invention;

[0012] Figure 2 is a schematic block diagram of a process tank assembly according to an embodiment of the present invention;

[0013] Figure 3 is a schematic block diagram of a wafer cleaning device according to another embodiment of the present invention;

[0014] Figure 4 is a schematic block diagram of a wafer cleaning device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0015] One or more embodiments of the present invention provide a wafer cleaning device to solve the problem of low safety of existing wafer cleaning devices.

[0016] In order to enable those skilled in the art to better understand the technical solutions in one or more embodiments of the present invention, the technical solutions in one or more embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of one or more embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on one or more embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of one or more embodiments of the present invention.

[0017] The wafer cleaning equipment provided by one or more embodiments of the present invention can be applied to the wafer cleaning process in semiconductor technology, can heat the cleaning liquid, and is suitable for high-requirement (such as ultra-high temperature) and high-precision process cleaning.

[0018] Figure 1 FIG. 1 is a schematic block diagram of a wafer cleaning device according to an embodiment of the present invention. Figure 1 As shown, the wafer cleaning equipment includes a process tank assembly, a self-protection device 120 and a first safety control assembly 130. Among them:

[0019] The process tank assembly includes a tank body 110, a heater 111 disposed within the tank body 110, a heating control device 112, and a control system 113. The heating control device 112 turns on upon receiving a heating control signal from the control system 113 and controls the operation of the heater 111. The heating control device 112 turns off upon not receiving a heating control signal and controls the heater 111 to stop operating.

[0020] The self-protection device 120 includes a first protection circuit 121 and a safety protection component 122 . The self-protection device 120 is used to control the heating control device 112 to be turned on or off.

[0021] The first safety control component 130 is connected in series between the heating control device 112 and the control system 113 and is connected to the self-protection device 120. The first safety control component 130 is used to control the heating control device 112 to disconnect when the heater 111 meets a preset power-off condition.

[0022] The wafer cleaning equipment of the embodiment of the present invention is connected to the process tank assembly by a self-protection device and a first safety control component. The self-protection device includes a first protection circuit and a safety protection component. The self-protection device controls the heating control device connected to the heater to be turned on or off, thereby controlling the heater to work or stop working. In addition, by connecting the first safety control component in series between the heating control device and the control system and connected to the self-protection device, when the heater meets the preset power-off condition and / or does not receive the heating control signal sent by the control system, the heating control device is controlled to be disconnected, thereby controlling the heater to stop working. It can be seen that the wafer cleaning equipment can control the heater to stop working when the heater needs to be powered off (such as when the preset power-off condition is met) by setting the self-protection device and the first safety control component, thereby achieving dual control of whether the heater is working, avoiding the situation where control failure is easy to occur when only the self-protection device is set, and then causing the heater to be unable to be powered off normally, greatly reducing the multiple risks in the heater, thereby ensuring the safety of the wafer cleaning equipment during the cleaning liquid heating process.

[0023] In one embodiment, the first protection circuit 121 can detect liquid leakage during the wafer cleaning process and can also detect other parameters such as heater temperature, cleaning liquid temperature, etc. The detection of various parameters can be achieved by setting corresponding components in the process tank assembly, which is described in detail below.

[0024] Figure 2 is a schematic block diagram of a process tank assembly according to an embodiment of the present invention, such as Figure 2 As shown, the process tank assembly includes a tank body 110, and a process circulation pump 211 and a heater 111 (not marked on the left) disposed in the tank body 110. Figure 2 ), pipeline flow measuring device 212, first filtering device 213, process inner tank 214, second filtering device 215 and leak prevention device 216. During the wafer cleaning process, the cleaning liquid passes through the process circulation pump 211, heater 111, pipeline flow measuring device 212 and second filtering device 215 in sequence, and flows into the process inner tank 214 to clean the wafers placed in the process inner tank 214. The cleaning liquid in the process inner tank 214 circulates through the first filtering device 213 and flows into the process circulation pump 211. The direction of the arrow in the figure is the flow direction of the cleaning liquid during the wafer cleaning process. Among them:

[0025] A first pressure detection device PSW1 is connected to the process circulation pump 211 to detect the first pressure of the process circulation pump 211. The process circulation pump 211 is gas-driven, and the first pressure detection device PSW1 is used to detect the gas pressure within the process circulation pump 211. If the detected first pressure is less than a first preset pressure threshold, the first pressure detection device PSW1 is disconnected; if the first pressure is greater than or equal to the first preset pressure threshold, the first pressure detection device PSW1 is closed. The first pressure detection device PSW1 can be a pressure gauge.

[0026] The heater 111 includes a heater housing 1111, which is provided with a pipeline inlet and a pipeline outlet. A process circulation pump 211 is connected to the pipeline inlet, and a pipeline flow measurement device 212 is connected to the pipeline outlet. A second pressure detection device PSW2 is connected to the heater 111 for detecting a second pressure within the heater 111. During operation, the heater 111 requires a fixed amount of dry air to prevent acid mist from corroding the heater 111. The second pressure detection device PSW2 is used to detect the pressure of the dry air within the heater 111. If the detected second pressure is less than a second preset pressure threshold, the second pressure detection device PSW2 is disconnected; if the second pressure is greater than or equal to the second preset pressure threshold, the second pressure detection device PSW2 is closed.

[0027] Flow rate detection device FM1 is connected to pipeline flow measurement device 212 and is used to detect whether the flow rate of the cleaning fluid in the pipeline is less than a first set value. If the detected flow rate of the cleaning fluid in the pipeline is less than the first set value, flow rate detection device FM1 is disconnected. If the flow rate of the cleaning fluid in the pipeline is greater than or equal to the first set value, flow rate detection device FM1 is closed.

[0028] The first filter device 213 is disposed between the process circulation pump 211 and the process inner tank 214 and is used to filter the cleaning fluid. The first filter device 213 can be a filter FLT1. The second filter device 215 is disposed between the pipeline flow measurement device 212 and the process inner tank 214 and is used to filter the cleaning fluid. The second filter device 215 can be a filter FLT2. The second filter device 215 has a higher filtration accuracy than the first filter device 213.

[0029] A first thermal resistor RTD1 is installed in the process tank 214 and is connected to a first temperature control device 2141 located outside the process tank 214. This resistor is used to detect whether the temperature of the cleaning liquid in the process tank 214 is greater than a second set value. If the detected temperature of the cleaning liquid in the process tank 214 is greater than the second set value, the first temperature control device 2141 is disconnected; if the temperature of the cleaning liquid in the process tank 214 is less than or equal to the second set value, the first temperature control device 2141 is closed. A liquid level detection device LLS1 is also installed in the process tank 214 to detect the level of the cleaning liquid in the process tank 214. If the detected level of the cleaning liquid in the process tank 214 is below a preset level threshold, the liquid level detection device LLS1 is disconnected; if the level of the cleaning liquid in the process tank 214 is greater than or equal to the preset level threshold, the liquid level detection device LLS1 is closed.

[0030] A first leakage detection device LS1 is installed at the bottom of the inner wall of the tank body 110 to detect any leakage within the process tank assembly. A leak prevention device 216 is connected to the first leakage detection device LS1 to receive leaks from the process tank assembly and provide feedback to the first leakage detection device LS1, including leakage status, location, and volume. If leakage is detected within the process tank assembly, the first leakage detection device LS1 is disconnected; if no leakage is detected, the first leakage detection device LS1 is closed.

[0031] In this embodiment, the heater 111 may be a HT online heater. Figure 2 The heater 111 shown also includes a heating wire 1112 disposed within the heater housing 1111. A protective shell 1113 is disposed outside the heating wire 1112. A second liquid leakage detection device LS2 is disposed on the inner wall of the protective shell 1113 for detecting whether there is liquid leakage within the heater 111. If a liquid leak is detected within the heater 111, the second liquid leakage detection device LS2 is disconnected; if no liquid leak is detected within the heater 111, the second liquid leakage detection device LS2 is closed.

[0032] A temperature detection device OT1 is provided on the inner wall of the heater housing 1111 for detecting the temperature of the heater 111. If the temperature of the heater 111 is detected to be greater than a preset temperature threshold, the temperature detection device OT1 is disconnected; if the temperature of the heater 111 is less than or equal to the preset temperature threshold, the temperature detection device OT1 is closed.

[0033] A second thermal resistor RTD2 is provided on the heating wire 1112 and is connected to a second temperature control device 1114 disposed outside the heater 111. The second thermal resistor RTD2 is configured to detect whether the temperature of the heating wire 1112 is greater than a third set value. If the detected temperature of the heating wire 1112 is greater than the third set value, the second temperature control device 1114 is disconnected; if the temperature of the heating wire 1112 is less than or equal to the third set value, the second temperature control device 1114 is closed.

[0034] A third thermal resistor RTD3 is provided at the pipeline outlet and is connected to a third temperature control device 1115. This resistor is used to detect whether the temperature of the cleaning fluid at the pipeline outlet is greater than a fourth set value. If the detected temperature of the cleaning fluid at the pipeline outlet is greater than the fourth set value, the third temperature control device 1115 is disconnected. If the temperature of the cleaning fluid at the pipeline outlet is less than or equal to the fourth set value, the third temperature control device 1115 is closed.

[0035] In this embodiment, by setting multiple components (such as a first pressure detection device PSW1, a second pressure detection device PSW2, a first temperature control device 2141, etc.) in the process tank assembly to detect various parameters in the wafer cleaning process, it is possible to more comprehensively detect abnormal conditions in the wafer cleaning equipment. When an abnormal condition occurs in the wafer cleaning equipment, the heater can be dually controlled by the self-protection device and the first safety control component to stop working, thereby ensuring the safety of the wafer cleaning equipment during the heating of the cleaning liquid.

[0036] In one embodiment, Figure 1 The wafer cleaning equipment shown may include Figure 2 The process tank assembly shown in the figure may include a first pressure detection device PSW1, a second pressure detection device PSW2, a flow detection device FM1, a first temperature control device 2141, a liquid level detection device LLS1, a first leakage detection device LS1, a second leakage detection device LS2, a temperature detection device OT1, a second temperature control device 1114 and a third temperature control device 1115.

[0037] In order to more accurately control the heating control device 112 to disconnect when an abnormal situation occurs in the wafer cleaning equipment, the above-mentioned devices can be further divided, and the first liquid leakage detection device LS1, the second liquid leakage detection device LS2, the second temperature control device 1114, the third temperature control device 1115 and the temperature detection device OT1 are divided into a heater protection circuit 1211, and the first pressure detection device PSW1, the second pressure detection device PSW2, the flow detection device FM1, the first temperature control device 2141, the liquid level detection device LLS1 and the first liquid leakage detection device LS1 are divided into a process tank protection circuit 1212.

[0038] Among them, a relay K1 can be connected to each of the above-mentioned devices in the first protection circuit 121. Taking the first leakage detection device LS1 and the second leakage detection device LS2 in the heater protection circuit 1211 as an example, the first leakage detection device LS1 and the second leakage detection device LS2 can be connected to one end of the control unit (i.e., the coil of the relay) of each relay K1, and the other end of the control unit of each relay K1 can be grounded. Then, the switch units (i.e., the contacts of the relays) of the two relays K1 are connected. The connection between each device in the heater protection circuit 1211 and the relay K1, as well as the connection between each device in the process tank protection circuit 1212 and the relay K1 can be referred to the above examples, and can also be referred to. Figure 3 ( Figure 3 The relay K1 includes a control unit, a normally closed switch unit and a normally open switch unit) and Figure 4 ( Figure 4 The relay K1 includes a control part and a normally closed switch part), which will not be described here.

[0039] In this embodiment, Figure 3 and Figure 4 The rectangular shape within relay K1 represents the control unit. The Z-shaped shape near the control unit represents the normally closed switch unit, and the parallel short lines away from the control unit represent the normally open switch unit. It should be noted that the control unit and switch unit described in subsequent embodiments can be represented similarly to the control unit and switch unit of relay K1, and both ends of each control unit are connected to a 24V DC voltage.

[0040] The following is a detailed introduction to the wafer cleaning equipment including the first protection circuit 121 and process tank assembly described in the above embodiment. It should be noted that in order to make the connection relationship between the components clearer, Figure 3 and Figure 4 In the method of marking the connection line at the dangling point, the connection that is far away is represented, that is, the two endpoints with the same label are connected. In addition, if Figure 3 or Figure 4 As shown, the wafer cleaning equipment provided by the embodiment of the present invention works under AC voltage, that is, the circuit breaker QF1, current transformer CT, safety protection component (not marked in Figure 3 and Figure 4 ), heating control device 112 and heater 111, and power supply (not in Figure 3 and Figure 4 When the heating control device 112 is working, the control system 113 also needs to provide a DC voltage of 0-24 volts.

[0041] Figure 3FIG. 1 is a schematic block diagram of a wafer cleaning device according to another embodiment of the present invention. In one embodiment, the safety protection component 122 (not in FIG. Figure 3 The first protection device includes a control unit, a first switch unit, and a second switch unit. One end of the control unit of the first protection device is connected to the first protection circuit 121 ( Figure 3 The other end of the control unit of the first protection device is connected to the control system 113, and the first switch unit of the first protection device is connected to the heating control device 112. The first protection circuit 121 is used to control the first protection device to be turned on or off. Figure 3 The switch section of the first control device is connected in series between the heating control device 112 and the control system 113, and the control section of the first control device is connected to the second switch section of the first protection device.

[0042] The heating control device 112 may be a solid-state relay SSR. Figure 3 As shown, the first protection device may be a contactor KM1, and the first control device may be a safety relay KAS1. Accordingly, the first switch portion of the first protection device is KM1-1, the second switch portion is KM1-2, and the switch portion of the first control device is KAS1-1. It should be understood that when the first protection circuit 121 is divided into a heater protection circuit 1211 and a process tank protection circuit 1212, the first protection devices connected to the first protection circuit 121 include contactors KM1 and contactors KM2, respectively, and the corresponding contactor KM2 includes a control portion, a switch portion KM2-1, and a switch portion KM2-2. The connection method of the contactor KM2 with the first protection circuit 121, the connection method with the control system 113, and the settings of the various switch portions of the contactor KM2 are consistent with those of the contactor KM1, and can be referred to. Figure 3 , I will not go into details here.

[0043] like Figure 3 As shown, the power supply is connected to one end of the first switch part KM1-1 of the contactor KM1 through the live wire and the neutral wire respectively, the other end of the first switch part KM1-1 of the contactor KM1 is connected to one end of the first switch part KM2-1 of the contactor KM2 through the live wire and the neutral wire respectively, the other end of the first switch part KM2-1 of the contactor KM2 is connected to one end of the heating control device 112 through the live wire and the neutral wire respectively, and the other end of the heating control device 112 is connected to the heater 111 through the live wire and the neutral wire respectively.

[0044] Optionally, the second switch portion of the first protection device is a normally closed contact. When the heater 111 meets a preset power-off condition, the first switch portion of the first protection device, the switch portion of the first control device and the heating control device 112 are disconnected, and the second switch portion of the first protection device is closed.

[0045] Among them, when the heater 111 meets the preset power-off condition, it means that an abnormal situation occurs in the wafer cleaning equipment (any one or more devices in the first protection circuit 121 are disconnected). At this time, by closing the second switch part of the first protection device, and disconnecting the first switch part of the first protection device, the switch part of the first control device and the heating control device 112, the heater 111 can be controlled to stop working, thereby ensuring the safety of the wafer cleaning equipment during the heating process of the cleaning liquid.

[0046] Among them, a relay K2 is connected in series between the control part of the first protection device and the control system 113, the control part of relay K2 is connected to the control system 113, and the switch part of relay K2 is connected to the control part of the first protection device. The switch part of relay K2 is closed when it receives the heating control signal sent by the control system 113, and is opened when it receives the stop heating control signal sent by the control system 113. It should be understood that when the first protection circuit 121 is divided into the heater protection circuit 1211 and the process tank protection circuit 1212, relay K2 and relay K3 are connected in series between the control part of the first protection device and the control system 113 respectively, and the connection method between relay K3 and the control part of the first protection device and the control system 113, as well as the settings of the switch part and control part of relay K3 are consistent with those of relay K2, which can be referred to. Figure 3 , I will not go into details here.

[0047] Figure 4 FIG. 1 is a schematic block diagram of a wafer cleaning device according to another embodiment of the present invention. In one embodiment, the safety protection component 122 (not in FIG. Figure 4 ) also includes a first protection circuit 121 ( Figure 4 The second protection device is shown between the heater protection circuit 1211 and the process tank protection circuit 1212 and the first protection device. The second protection device includes a control unit, a third switch unit and a fourth switch unit. The control unit of the second protection device is connected to the first protection circuit 121, and the third switch unit of the second protection device is connected to the control unit of the first protection device. The first protection circuit 121 is used to control the conduction or disconnection of the second protection device, and the second protection device is used to control the conduction or disconnection of the heating control device 112. The first safety control component 130 (not shown) Figure 4 The fourth switch portion of the second protection device is connected in series between the heating control device 112 and the control system 113.

[0048] like Figure 4 As shown, the second protection device may be a safety relay KAS2. Accordingly, the third switch portion of the second protection device is KAS2-1 and the fourth switch portion is KAS2-2. It should be understood that, when the first protection circuit 121 is divided into a heater protection circuit 1211 and a process tank protection circuit 1212, the second protection device connected to the first protection circuit 121 includes a safety relay KAS2 and a safety relay KAS3, respectively, and the corresponding safety relay KAS3 includes a control portion, a switch portion KAS3-1 and a switch portion KAS3-2. The connection method of the safety relay KAS3 with the first protection circuit 121, the connection method with the first protection device, and the settings of the various switch portions of the safety relay KAS3 are consistent with those of the safety relay KAS2, and can be referred to. Figure 4 , I will not go into details here.

[0049] Optionally, the fourth switch portion of the second protection device is a normally open contact. When heater 111 meets a preset power-off condition, the third switch portion of the second protection device, the fourth switch portion of the second protection device, the first switch portion of the first protection device, and heating control device 112 are disconnected. This deactivates heater 111, effectively ensuring the safety of the wafer cleaning apparatus during the cleaning fluid heating process.

[0050] It should be noted that Figure 4 is Figure 3 On the basis of the second protection device, the second protection device is modified into a safety relay including a control part, a third switch part and a fourth switch part, and the first safety control component is set accordingly. Figure 3 In the wafer cleaning equipment shown, the second protection device (i.e., safety relay KAS2 and safety relay KAS3) only includes a control part and a switch part respectively. The control part of the second protection device is connected to the first protection circuit, and the switch part of the second protection device is connected to the control part of the first protection device.

[0051] like Figure 3 or Figure 4 As shown (only schematically shown in Figure 3 middle, Figure 4 It is not shown in the figure, but it should be understood that the components in this embodiment are also applicable to Figure 4 The wafer cleaning equipment shown in the figure) further includes a second safety control component, the second safety control component includes a second control device, and the first protection device further includes a fifth switch unit.

[0052] Among them, the fifth switch portion of the first protection device and the first protection circuit 121 ( Figure 3 or Figure 4The first protection circuit 121 is connected with the heater protection circuit 1211 and the process tank protection circuit 1212 shown in FIG. 12, and the control part of the second control device is connected with the first protection circuit 121. The first switch part of the first protection device is connected with the control part of the second control device and the switch part of the second control device respectively. The second control device is used to control the heating control device 112 to be turned on or turned off when the heater 111 meets the preset power-off condition and the first protection device is abnormal. It should be noted that the connection relationship listed in the embodiment is not shown in Figure 3 and Figure 4 .

[0053] According to the above embodiment, the normally open switch part of each relay K1 in the first protection circuit 121 is connected with the control part of the second control device, and the fifth switch part of the first protection device is KM1-3 and KM2-3. The second control device can be a split excitation release 141.

[0054] Alternatively, the fifth switch part KM1-3 of the first protection device is a normally open contact. When the heater 111 meets the preset power-off condition and the first protection device is abnormal, the first protection circuit 121 is turned on, the fifth switch part of the first protection device is closed, and the switch part of the second control device and the heating control device 112 are disconnected. Therefore, the heater 111 stops working, which realizes the effect of effectively controlling the heater 111 to stop working in the case of abnormality of the first protection device, and effectively ensures the safety of the wafer cleaning equipment during the cleaning liquid heating process.

[0055] In one embodiment, as shown in Figure 3 or Figure 4 (not shown in Figure 3 , not shown in Figure 4 , it should be understood that the components in the embodiment are also applicable to the wafer cleaning equipment shown in Figure 4 ), the second safety control assembly further includes a third control device. The control part of the third control device is connected with the first protection circuit 121, and the switch part of the third control device is connected with the first switch part of the first protection device and the control part of the second control device respectively.

[0056] When the heater meets the preset power-off condition and the first protection device is abnormal, the switch part of the third control device is closed, and the third control device starts timing. When the timing duration of the third control device reaches the preset duration, if the switch part of the third control device is still closed, the third control device controls the second control device to be disconnected.

[0057] For example, the preset time length is 10 seconds. When the switch part of the third control device is closed, the third control device starts timing. If the switch part of the third control device is still closed when the timing length reaches 10 seconds, the third control device controls the second control device to disconnect; if the switch part of the third control device is already disconnected when the timing length reaches 10 seconds, the third control device does not control other devices.

[0058] According to the above embodiment, the normally open switch of each relay K1 in the first protection circuit 121 can be connected to the control unit of the third control device. The third control device can be a time relay TR0, and accordingly, the switch unit of the third control device is TR0-1. Specifically, referring to the connection between the above-mentioned second control device and the first protection circuit 121 and the first protection device, the fifth switch part KM1-3 of the first protection device can be connected in parallel with KM2-3, and then connected to one end of the normally open switch part of each relay K1 (the normally open switch parts of each relay K1 are connected in parallel), the other end of the normally open switch part of each relay K1 is connected to the control part of the time relay TR0, one end of the switch part TR0-1 of the time relay TR0 is connected to the control part of the shunt release 141, the other end of the switch part TR0-1 of the time relay TR0 is connected to the live wire on the first switch part KM1-1 of the contactor KM1, the control part of the shunt release 141 is connected to the neutral wire on the first switch part KM1-1 of the contactor KM1, one end of the switch part of the shunt release 141 is connected to the power supply through the live wire and the neutral wire respectively, and the other end of the switch part of the shunt release 141 is connected to the first switch part KM1-1 of the contactor KM1 through the live wire and the neutral wire respectively.

[0059] like Figure 3 or Figure 4 As shown (only schematically shown in Figure 3 middle, Figure 4 It is not shown in the figure, but it should be understood that the components in this embodiment are also applicable to Figure 4 In the wafer cleaning apparatus shown in FIG. 1 , the first protection device further includes a sixth switch. The sixth switch is a normally open contact. The sixth switch of the first protection device is connected to a control system 113, which is configured to detect the open / closed state of the sixth switch of the first protection device. According to the above embodiment, the sixth switch of the first protection device is KM1-4 and KM2-4.

[0060] The first protection device turns on when it receives a heating control signal from the control system 113 and the heater 111 does not meet the preset power-off condition. It turns off when it receives a heating stop control signal from the control system 113 and / or the heater 111 meets the preset power-off condition. When the first protection device turns on, the control system 113 detects that the sixth switch of the first protection device is closed. After the control system 113 sends a heating stop control signal and detects that the sixth switch of the first protection device is closed, the control system 113 issues a prompt indicating an abnormality in the first protection device. This allows operators to promptly detect any abnormalities in the wafer cleaning equipment.

[0061] Among them, the abnormality of the first protection device may be that the first switch part of the first protection device is stuck, resulting in the first switch part of the first protection device being unable to disconnect, which further affects the opening and closing states of the second switch part, the fifth switch part and the sixth switch part of the first protection device.

[0062] like Figure 3 or Figure 4 As shown, the self-protection device also includes a current transformer CT, which is connected in series between the heating control device 112 and the safety protection component 122 (i.e., contactor KM2), and is connected to the control system 113. The current transformer is used to detect whether there is current flowing and feedback to the control system 113. When the control system 113 sends a stop heating control signal but the current transformer detects that there is current flowing, or when the control system 113 sends a heating control signal but the current transformer does not detect that there is current flowing, the control system 113 issues a prompt message indicating that the wafer cleaning equipment is abnormal.

[0063] One end of the current transformer CT is connected to the heating control device 112 through a live wire, and the other end of the current transformer CT is connected to one end of the switch part KM2 - 1 of the contactor KM2 through a live wire.

[0064] like Figure 3 or Figure 4As shown, the self-protection device also includes a circuit breaker QF1. One end of the circuit breaker QF1 is connected to one end of the first switch portion KM1-1 of the contactor KM1 via a live wire and a neutral wire, respectively. The other end of the circuit breaker QF1 is connected to one end of the switch portion of the shunt release 141 via a live wire and a neutral wire, respectively. The circuit breaker QF1 is turned on when the self-protection device is operating normally and is turned off when a circuit abnormality occurs in the self-protection device. The circuit breaker QF1 provides an operating voltage, such as an AC voltage, and also serves as a safety protection for the self-protection device in the event of an abnormality, such as an overvoltage caused by leakage, electric shock, overload, or short circuit. When the voltage in the self-protection device reaches a preset voltage threshold, the circuit breaker QF1 is in the open state; when the voltage in the self-protection device does not reach the preset voltage threshold, the circuit breaker QF1 is in the closed state. Thus, by connecting the circuit breaker QF1 to the self-protection device, a protective function for the wafer cleaning equipment can be achieved.

[0065] The following instructions Figure 3 The working principle of the wafer cleaning equipment shown.

[0066] exist Figure 3 Taking heater protection circuit 1211 as an example, after control system 113 sends a heating control signal, the control unit of relay K2 is energized, the switch unit of relay K2 is closed, the control unit of contactor KM1 is energized, the first switch unit KM1-1 of contactor KM1 is closed, the second switch unit KM1-2 of contactor KM1 is disconnected, the control unit of safety relay KAS1 loses power, the switch unit KAS1-1 of safety relay KAS1 is closed, and control system 113 controls heating control device 112 to turn on, and heater 111 begins operation. At this time, heater 111 does not meet the preset power-off conditions, that is, no abnormality occurs in the wafer cleaning equipment (any one or more normally closed switch units of relays K1 in heater protection circuit 1211 are closed), the control unit of safety relay KAS2 is energized, and the switch unit of safety relay KAS2 is closed.

[0067] When contactor KM1 is conducting, control system 113 detects that the sixth switch KM1-4 of contactor KM1 is closed. After control system 113 sends a stop heating control signal and detects that the sixth switch KM1-4 of contactor KM1 is closed, control system 113 issues a prompt message to contactor KM1. This allows operators to promptly detect any abnormalities in the wafer cleaning equipment.

[0068] If, during the wafer cleaning process, the heater 111 meets the preset power-off condition (i.e., an abnormality occurs in the wafer cleaning equipment, and the normally closed switch portion of any one or more relays K1 in the heater protection circuit 1211 is disconnected or the normally open switch portion is closed) and / or the contactor KM1 receives a stop heating control signal sent by the control system 113, the control portion of the safety relay KAS2 loses power, the switch portion of the safety relay KAS2 is disconnected, the control portion of the contactor KM1 loses power, the first switch portion KM1-1 of the contactor KM1 is disconnected, the heating control device 112 is disconnected, and the heater 111 stops working. At the same time, the second switch portion KM1-2 of the contactor KM1 is closed, the control portion of the safety relay KAS1 is energized, the switch portion KAS1-1 of the safety relay KAS1 is disconnected, the control system 113 is disconnected from the heating control device 112, and the heater 111 stops working. By setting up a self-protection device (i.e., heater protection circuit 1211, safety relay KAS2 and contactor KM1) and a first safety control component (i.e., the second switch part KM1-2 of contactor KM1), the heater can be controlled to stop working when the power needs to be cut off, thereby achieving dual control of whether the heater is working.

[0069] If during the wafer cleaning process, when the heater 111 meets the preset power-off condition, the first switch part KM1-1 of the contactor KM1 is still closed, the normally open switch part of the relay K1 is closed, the fifth switch part KM1-3 of the contactor KM1 is closed, the control part of the time relay TR0 is energized, and the time relay TR0 starts timing. After the timing reaches the preset time, if the control part of the time relay TR0 loses power, the opening and closing conditions of each component when the heater 111 stops working are consistent with the opening and closing conditions of each component when the above-mentioned heater 111 meets the preset power-off condition and / or the contactor KM1 receives the stop heating control signal sent by the control system 113, which will not be repeated here.

[0070] If the control unit of time relay TR0 is still energized, switch unit TR0-1 of time relay TR0 closes, energizing the control unit of shunt release 141. This opens the switch unit of shunt release 141, disconnects heating control device 112, and stops heater 111. This effectively stops heater 111 in the event of a malfunction in contactor KM1. After shunt release 141 is disconnected, it requires manual closure after inspection by an operator. This effectively controls the heater's on / off state, ensuring the safety of the wafer cleaning equipment during the cleaning fluid heating process.

[0071] It should be understood that the control relationship between the components connected to the process tank protection circuit 1212 can refer to the above description of the heater protection circuit 1211, and the two are consistent, so they are not repeated here.

[0072] The following instructions Figure 4 The working principle of the wafer cleaning equipment shown.

[0073] exist Figure 4 Taking heater protection circuit 1211 as an example, after control system 113 sends a heating control signal, the control unit of relay K2 is energized, the switch unit of relay K2 is closed, the control unit of contactor KM1 is energized, and the first switch unit KM1-1 of contactor KM1 is closed. At this time, heater 111 does not meet the preset power-off conditions, that is, the wafer cleaning equipment does not experience any abnormality (any one or more normally closed switch units of relays K1 in heater protection circuit 1211 are closed). The control unit of safety relay KAS2 is energized, the third switch unit KAS2-1 of safety relay KAS2 is closed, and the fourth switch unit KAS2-2 of safety relay KAS2 is closed. Control system 113 controls heating control device 112 to turn on, and heater 111 begins operation.

[0074] If, during the wafer cleaning process, heater 111 meets a preset power-off condition (i.e., an abnormality occurs in the wafer cleaning equipment, and the normally closed switch portion of any one or more relays K1 in heater protection circuit 1211 is disconnected) and / or contactor KM1 receives a stop heating control signal from control system 113, the control portion of safety relay KAS2 loses power, the third switch portion KAS2-1 of safety relay KAS2 is disconnected, the control portion of contactor KM1 loses power, the first switch portion KM1-1 of contactor KM1 is disconnected, the heating control device 112 is disconnected, and heater 111 stops working. Simultaneously, the fourth switch portion KAS2-2 of safety relay KAS2 is disconnected, the connection between control system 113 and heating control device 112 is disconnected, and heater 111 stops working. By providing a self-protection device (i.e., heater protection circuit 1211, safety relay KAS2, and contactor KM1) and a first safety control component (i.e., the fourth switch portion KAS2-2 of safety relay KAS2), the heater can be controlled to stop working when power needs to be cut off, thereby achieving dual control over whether the heater is working.

[0075] If during the wafer cleaning process, when the heater 111 meets the preset power-off condition, the first switch part KM1-1 of the contactor KM1 is still closed, then the fourth switch part KAS2-2 of the safety relay KAS2 is disconnected, and the connection between the control system 113 and the heating control device 112 is disconnected, so that the heater 111 can be stopped, thereby achieving the effect of effectively controlling the heater 111 to stop working when the contactor KM1 is abnormal.

[0076] It should be understood that the control relationship between the components connected to the process tank protection circuit 1212 can refer to the above description of the heater protection circuit 1211, and the two are consistent, so they are not repeated here.

[0077] In light of the above, a specific embodiment of the present subject matter has been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. Additionally, the process depicted in the figures does not necessarily require the particular order shown, or sequential order, to achieve desirable results. In certain implementations, multitasking and parallel processing can be advantageous.

[0078] It is also noted that the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0079] The foregoing is merely exemplary and is not intended to limit the present disclosure. One or more embodiments of the present disclosure can be embodied in various ways including, for example, in the form of a system, a method, an apparatus, a computer program product, and / or the like. Any modification, equivalent replacement, improvement, and the like of one or more embodiments of the present disclosure, which fall within the spirit and principles of the present disclosure, are intended to be included in the scope of the claims of one or more embodiments of the present disclosure.

Claims

1. A wafer cleaning device, characterized in that: It includes a process tank component, a self-protection device and a first safety control component; The process tank assembly includes a tank body, a heater disposed in the tank body, a heating control device, and a control system; the heating control device is turned on when receiving a heating control signal sent by the control system, and controls the heater to operate; the heating control device is turned off when not receiving the heating control signal, and controls the heater to stop operating; The self-protection device includes a first protection circuit and a safety protection component; the self-protection device is used to control the heating control device to be turned on or off; The first safety control component is connected in series between the heating control device and the control system, and is connected to the self-protection device; the first safety control component is used to control the heating control device to disconnect when the heater meets the preset power-off condition; The safety protection assembly includes a first protection device, which includes a control unit, a first switch unit and a second switch unit; One end of the control unit of the first protection device is connected to the first protection circuit, the other end of the control unit of the first protection device is connected to the control system, and the first switch unit of the first protection device is connected to the heating control device; the first protection circuit is used to control the first protection device to be turned on or off; The first safety control component includes a first control device; a switch portion of the first control device is connected in series between the heating control device and the control system, and the control portion of the first control device is connected to the second switch portion of the first protection device.

2. The wafer cleaning equipment according to claim 1, characterized in that: The second switch portion of the first protection device is a normally closed contact; When the heater meets the preset power-off condition, the first switch part of the first protection device, the switch part of the first control device and the heating control device are opened, and the second switch part of the first protection device is closed.

3. The wafer cleaning equipment according to claim 1, characterized in that: The safety protection component further includes a second protection device connected in series between the first protection circuit and the first protection device; the second protection device includes a control unit, a third switch unit and a fourth switch unit; The control unit of the second protection device is connected to the first protection circuit, and the third switch unit of the second protection device is connected to the control unit of the first protection device; the first protection circuit is used to control the second protection device to be turned on or off, and the second protection device is used to control the heating control device to be turned on or off; The first safety control component includes the second protection device; the fourth switch part of the second protection device is connected in series between the heating control device and the control system.

4. The wafer cleaning equipment according to claim 3, characterized in that: The fourth switch portion of the second protection device is a normally open contact; When the heater meets the preset power-off condition, the third switching part of the second protection device, the fourth switching part of the second protection device, the first switching part of the first protection device, and the heating control device are turned off.

5. The wafer cleaning equipment according to claim 3, characterized in that: It also includes a second safety control component; the second safety control component includes a second control device; the first protection device also includes a fifth switch unit; The fifth switch unit of the first protection device is connected to the first protection circuit, the first protection circuit is connected to the control unit of the second control device, and the first switch unit of the first protection device is connected to the control unit of the second control device and the switch unit of the second control device respectively; The second control device is used to control the heating control device to be turned on or off when the heater meets the preset power-off condition and the first protection device is abnormal.

6. The wafer cleaning equipment according to claim 5, characterized in that: The fifth switch portion of the first protection device is a normally open contact; When the heater meets the preset power-off condition and the first protection device is abnormal, the first protection circuit is turned on, the fifth switch of the first protection device is closed, and the switch of the second control device and the heating control device are disconnected.

7. The wafer cleaning equipment according to claim 6, characterized in that: The second safety control component further includes a third control device; the control portion of the third control device is connected to the first protection circuit, and the switch portion of the third control device is connected to the first switch portion of the first protection device and the control portion of the second control device respectively; When the heater meets the preset power-off condition and the first protection device is abnormal, the switch part of the third control device is closed and the third control device starts timing; When the timing duration of the third control device reaches a preset duration, if the switch portion of the third control device is still closed, the third control device controls the second control device to be opened.

8. The wafer cleaning equipment according to claim 5, characterized in that: The first protection device further includes a sixth switch portion; the sixth switch portion is a normally open contact, and the sixth switch portion of the first protection device is connected to the control system; the control system is used to detect the open and closed state of the sixth switch portion of the first protection device; The first protection device is turned on when receiving the heating control signal sent by the control system and the heater does not meet the preset power-off condition, and is turned off when receiving the heating stop control signal sent by the control system and / or the heater meets the preset power-off condition; When the first protection device is turned on, the control system detects that the sixth switch portion of the first protection device is closed; After the control system sends the heating stop control signal and when the control system detects that the sixth switch portion of the first protection device is closed, the control system issues prompt information indicating that the first protection device is abnormal.

9. The wafer cleaning equipment according to claim 8, characterized in that: The self-protection device further comprises a current transformer; the current transformer is connected in series between the heating control device and the safety protection component, and is connected to the control system; The current transformer is used to detect whether current is passing through and to feed back to the control system; when the current transformer detects that current is passing through after the control system sends the stop heating control signal, or when the current transformer does not detect that current is passing through after the control system sends the heating control signal, the control system issues a prompt message indicating that the wafer cleaning equipment is abnormal.

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