Liquid ejection device

By setting up receiving and contact areas in the liquid ejection device and supplying the reaction liquid in the absorption component, the problem of liquid diffusion within the absorption component is solved, thereby improving printing quality and maintenance efficiency.

CN115703295BActive Publication Date: 2026-02-03SEIKO EPSON CORP
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Patent Information

Application Number
CN202210931841.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-08-05
Filing Date
2022-08-04
Publication Date
2026-02-03
Estimated Expiration
2042-08-04

AI Technical Summary

Technical Problem

In existing liquid ejection devices, the diffusion of waste liquid within the absorption component leads to wetting expansion, which may cause contact with the printing unit and affect printing quality.

Method used

A sheet-like absorber is used, with a receiving area and a contact area defined. A reaction liquid that solidifies the liquid is supplied to the absorber, and the liquid diffusion is controlled by supplying the reaction liquid through the supply area.

Benefits of technology

It effectively inhibits the wetting and spreading of liquid within the absorption components, improving printing quality and equipment maintenance efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a liquid ejecting apparatus. A liquid ejecting apparatus (11) includes a liquid ejecting portion (20), a belt member (60), and a supply portion (RLS) capable of supplying a reaction liquid having a component that cures ink to the belt member (60), the belt member (60) is provided so as to be capable of setting a receiving region (A1) that receives either one of ink and the reaction liquid discharged as waste liquid from a nozzle (36) of the liquid ejecting portion (20) and a contact region (A2) that contacts the liquid ejecting portion (20) when collecting either one of the ink and the reaction liquid, and the supply portion (RLS) supplies the reaction liquid to a supply region (S1) in the belt member (60), the supply region (S1) being set between a position farthest from the contact region (A2) in the receiving region (A1) and the contact region (A2).
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Description

Technical Field

[0001] This disclosure relates to a liquid ejection device. Background Technology

[0002] Patent Document 1 discloses an inkjet liquid ejection device comprising a printing unit and an absorber capable of absorbing ink. The printing unit is an example of a liquid ejection section that ejects ink as a liquid from a nozzle. This liquid ejection device washes the printing unit towards its receiving area, causing the ink to be discharged from the nozzle as waste liquid. Furthermore, the liquid ejection device brings an area in the absorber that has not yet absorbed ink into contact with the printing unit, allowing it to absorb ink from the printing unit.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2008-238436

[0004] However, the waste liquid collected in the absorption component can diffuse within the absorption component. For example, if the waste liquid received in the receiving area spreads towards the area in contact with the printing unit, it is possible that an area in the absorption component where the waste liquid has spread can come into contact with the printing unit. Summary of the Invention

[0005] A liquid ejection device includes: a liquid ejection section for ejecting liquid from a nozzle onto a medium for printing; a sheet-like absorption member capable of absorbing the liquid; and a supply section capable of supplying a reaction liquid containing components that solidify the liquid to the absorption member. The absorption member is configured to have a receiving area and a contact area. The receiving area receives the liquid discharged from the nozzle as waste liquid, and the contact area contacts the liquid ejection section when collecting the liquid by contacting it. The supply section supplies the reaction liquid to a supply area in the absorption member located between the receiving area and the contact area, at the position furthest from the contact area. Attached Figure Description

[0006] Figure 1 This is a perspective view showing the configuration of a liquid ejection device as an embodiment of the present disclosure.

[0007] Figure 2 This is a bottom view of the liquid ejection section and the carriage.

[0008] Figure 3 This is a top view of the maintenance unit.

[0009] Figure 4 This is a side view of a liquid collection device with its housing located at the receiving position.

[0010] Figure 5 This is a side view schematic diagram of a liquid collection device for wiping the liquid spray section.

[0011] Figure 6 This is a side view of a liquid collection device with the casing located in a non-collection position.

[0012] Figure 7 This is a top view schematic diagram showing the liquid discharged into receiving area A1 in Embodiment 1.

[0013] Figure 8 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S1 in Embodiment 1.

[0014] Figure 9 This is a top view schematic diagram showing the liquid sprayed into the spraying area A3 in Embodiment 1.

[0015] Figure 10 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S2 in Embodiment 1.

[0016] Figure 11 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S3 in Embodiment 1.

[0017] Figure 12 This is a side view schematic diagram of a liquid collection device when supplying reaction liquid to the supply area S3 in Embodiment 1.

[0018] Figure 13 This is a top view schematic diagram showing the liquid sprayed into the spraying area A4 in Embodiment 1.

[0019] Figure 14 This is a top view of the maintenance unit in Implementation Method 2.

[0020] Figure 15 This is a top view schematic diagram showing the liquid discharged to the receiving area A1 in Embodiment 2.

[0021] Figure 16 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S1 in Embodiment 2.

[0022] Figure 17 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S2 in Embodiment 2.

[0023] Figure 18 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S3 in Embodiment 2.

[0024] Figure 19 This is a top view schematic diagram showing the reaction liquid supplied to the supply area S4 in Embodiment 2.

[0025] Figure 20This is a bottom view of the liquid ejection section and carriage involved in other embodiments.

[0026] Explanation of reference numerals in the attached figures

[0027] 11…Liquid ejection device, 12…Support leg, 13…Frame, 14…Media, 15…Extraction section, 16…Guide section, 17…Recovery section, 18…Tension application mechanism, 20…Liquid ejection section, 20A…Reaction liquid ejection section, 20B…Ink ejection section, 21…Carriage, 22…Maintenance unit, 23…Liquid supply device, 24…Operation panel, 25…Liquid collection body, 26…Mounting section, 27…Supply path, 29…Control section, 31…Guide shaft, 32…Carriage motor, 36…Nozzle, 36A…Reaction liquid spray Nozzle, 36B…Ink nozzle, 37…Nozzle forming component, 38…Cover component, 39…Through hole, 40…Nozzle face, 42…Rinsing device, 42A…Reaction liquid receiving part, 42B…Ink receiving part, 43…Liquid collection device, 44, 44A, 44B…Suction device, 45, 45A, 45B…Sealing device, 51…Suction cap, 52…Suction holder, 53…Suction motor, 54…Pressure reduction mechanism, 56…Standby cap, 57…Standby cap holder, 58…Standby cap motor, 60…Band 60a…contact position, 61…housing, 62…track, 63…wiping motor, 64…winding motor, 65…power transmission mechanism, 67…opening, 69…releasing shaft, 70…releasing part, 71…winding shaft, 72…winding part, 74…upstream roller, 75…tension roller, 76…pressing part, 79…downstream roller, 220…reaction liquid spraying part, 236…spray nozzle, A1…receiving area, A2…contact area, A3, A4…ejection area, G1…first nozzle group, G2…second nozzle group, G3… Third nozzle group, G4…Fourth nozzle group, G5…Fifth nozzle group, G6…Sixth nozzle group, L1…First nozzle column, L2…Second nozzle column, L3…Third nozzle column, L4…Fourth nozzle column, L5…Fifth nozzle column, L6…Sixth nozzle column, L7…Seventh nozzle column, L8…Eighth nozzle column, L9…Ninth nozzle column, L10…Tenth nozzle column, L11…Eleventh nozzle column, L12…Twelfth nozzle column, S1, S2, S3, S4…Supply area, W1…First erasing direction, W2…Second erasing direction. Detailed Implementation

[0028] The present disclosure will now be described based on embodiments. In the figures, the same reference numerals are used to refer to the same components, and repeated descriptions are omitted. It should be noted that in this specification, "same" means not only completely identical, but also includes cases where the components are the same considering measurement errors, manufacturing deviations, or are identical without impairing functionality. Therefore, for example, "the dimensions of both are the same" means that, considering measurement errors and manufacturing deviations, the dimensional difference between the two is within ±10% of the dimension of one, more preferably within ±5%, and particularly preferably within ±3%.

[0029] In addition, in each figure, X, Y, and Z represent three mutually orthogonal spatial axes. In this specification, the directions along these axes are designated as the X-axis direction, Y-axis direction, and Z-axis direction. When a direction is specified, the positive direction is designated as "+" and the negative direction as "-". The direction markings are explained using positive and negative signs, with the direction the arrow in each figure pointing being designated as the "+" direction and the opposite direction of the arrow being designated as the "-" direction.

[0030] Furthermore, the Z-axis direction represents the direction of gravity, the +Z direction represents vertically downward, and the -Z direction represents vertically upward. The plane containing the X and Y axes will be designated as the XY plane, the plane containing the X and Z axes as the XZ plane, and the plane containing the Y and Z axes as the YZ plane. The XY plane is a horizontal plane. Furthermore, the three spatial axes X, Y, and Z, which do not have defined positive and negative directions, will be designated as the X-axis, Y-axis, and Z-axis. In the following explanation, the direction along the X-axis will be referred to as the width direction X, the direction along the Y-axis as the depth direction Y, and the direction along the Z-axis as the gravity direction Z.

[0031] 1. Implementation Method 1

[0032] The configuration of the liquid ejection device 11 according to Embodiment 1 will be described. The liquid ejection device 11 is, for example, an inkjet printer that ejects ink, an example of a liquid, onto a medium such as paper for printing. It should be noted that the liquid ejection device 11 of this embodiment ejects ink onto a medium from which a reaction liquid has been ejected for printing. The reaction liquid contains components that increase the viscosity of the ink by contact with it, thereby causing the ink to solidify. The reaction liquid also contains components that, when mixed with ink, cause the viscosity of the ink-reaction liquid mixture to become higher than the viscosity of the ink, thereby causing the mixture to solidify. The reaction liquid is an example of a liquid. In the following description, ink, reaction liquid, ink and reaction liquid, a mixture of ink and reaction liquid, and waste liquid may be referred to as liquid.

[0033] like Figure 1As shown, the liquid ejection device 11 includes a pair of support legs 12 and a frame 13 assembled on the support legs 12. The liquid ejection device 11 includes: an extraction section 15 for unwinding and extracting a medium 14 wound into a cylindrical shape; a guide section 16 for guiding the medium 14 discharged from the frame 13; and a recovery section 17 for winding and recovering the medium 14. The liquid ejection device 11 includes a tension applying mechanism 18 for applying tension to the medium 14 recovered in the recovery section 17.

[0034] The liquid ejection device 11 includes: a liquid ejection section 20 capable of ejecting liquid; a carriage 21 for moving the liquid ejection section 20; and a maintenance unit 22 for maintaining the liquid ejection section 20. The liquid ejection device 11 includes a liquid supply device 23 for supplying liquid to the liquid ejection section 20 and an operation panel 24 operated by a user. The carriage 21 reciprocates the liquid ejection section 20 along the X-axis. The liquid ejection section 20 ejects the liquid supplied by the liquid supply device 23 while moving, and prints on the medium 14.

[0035] The liquid supply device 23 includes a mounting section 26 and a supply flow path 27. A plurality of liquid collection bodies 25 for collecting liquid are detachably mounted on the mounting section 26. The supply flow path 27 supplies liquid from the liquid collection bodies 25 mounted on the mounting section 26 to the liquid ejection section 20.

[0036] The liquid dispensing device 11 includes a control unit 29 for controlling the operation of the liquid dispensing device 11. The control unit 29 is configured to include, for example, a CPU and a memory. The control unit 29 controls the liquid dispensing unit 20, the liquid supply device 23, and the maintenance unit 22 by executing a program stored in the memory by the CPU.

[0037] like Figure 2 As shown, the liquid ejection device 11 includes a guide shaft 31 that supports the carriage 21 and a carriage motor 32 that moves the carriage 21. The guide shaft 31 extends in the width direction X. The control unit 29 controls the carriage motor 32 to drive the carriage 21, thereby causing the carriage 21 and the liquid ejection part 20 to reciprocate along the guide shaft 31.

[0038] The liquid ejection section 20 includes a nozzle forming member 37 that forms a plurality of nozzles 36 and a cover member 38 that covers a portion of the nozzle forming member 37. The cover member 38 is made of a metal such as stainless steel. A plurality of through holes 39 are formed on the cover member 38, extending through the cover member 38 in the direction of gravity Z. The cover member 38 covers one side of the nozzle forming member 37 in which the nozzles 36 are formed, such that the nozzles 36 are exposed through the through holes 39. The nozzle surface 40 is formed including the nozzle forming member 37 and the cover member 38. Specifically, the nozzle surface 40 is composed of the nozzle forming member 37 and the cover member 38 exposed through the through holes 39, and the nozzles 36 that eject liquid are formed on the nozzle surface 40.

[0039] In the liquid ejection section 20, multiple nozzles 36 with openings arranged at regular intervals along one direction are present. These multiple nozzles 36 constitute a nozzle array. In this embodiment, the openings of the nozzles 36 are arranged along the depth direction Y, forming a first nozzle array L1 to a twelfth nozzle array L12. The nozzles 36 constituting a nozzle array eject the same type of liquid. The inner nozzle 36 in the depth direction Y and the front nozzle 36 in the depth direction Y of a nozzle array are staggered in the width direction X.

[0040] The first nozzle array L1 to the twelfth nozzle array L12 are arranged in pairs, close to each other in the width direction X. In this embodiment, the two nozzle arrays arranged close to each other are referred to as nozzle groups. In the liquid ejection section 20, the first nozzle group G1 to the sixth nozzle group G6 are arranged at certain intervals along the width direction X. In this embodiment, the first nozzle group G1 to the sixth nozzle group G6 have the same dimensions in the depth direction Y. The first nozzle group G1 to the sixth nozzle group G6 are disposed in the region BW of the nozzle surface 40.

[0041] Specifically, the first nozzle group G1 includes a first nozzle column L1 that sprays magenta ink and a second nozzle column L2 that sprays yellow ink. The second nozzle group G2 includes a third nozzle column L3 that sprays cyan ink and a fourth nozzle column L4 that sprays black ink. The third nozzle group G3 includes a fifth nozzle column L5 that sprays light cyan ink and a sixth nozzle column L6 that sprays light magenta ink.

[0042] The fourth nozzle group G4 includes the seventh nozzle column L7 and the eighth nozzle column L8, which spray the reaction liquid. The fifth nozzle group G5 includes the ninth nozzle column L9, which sprays black ink, and the tenth nozzle column L10, which sprays cyan ink. The sixth nozzle group G6 includes the eleventh nozzle column L11, which sprays yellow ink, and the twelfth nozzle column L12, which sprays magenta ink.

[0043] Next, the maintenance unit 22 will be explained. For example... Figure 3 As shown, the maintenance unit 22 includes a liquid collection device 43, a suction device 44, and a capping device 45 arranged along the width direction X. The -Z direction, i.e., the upper part, of the capping device 45 becomes the starting position HP of the liquid ejection section 20. The starting position HP becomes the starting point for the movement of the liquid ejection section 20. The -Z direction, i.e., the upper part, of the liquid collection device 43 becomes the cleaning position CP of the liquid ejection section 20. Figure 3 In the diagram, the liquid ejection section 20 located at the clean position CP is indicated by a double-dotted line.

[0044] The suction device 44 includes a suction cap 51, a suction holder 52, a suction motor 53 that reciprocates the suction holder 52 along the Z-axis, and a pressure-reducing mechanism 54 that reduces pressure within the suction cap 51. The suction motor 53 moves the suction cap 51 between a sealed position and a clearance position. The sealed position is where the suction cap 51 contacts the liquid ejection section 20 and surrounds the nozzle 36. The clearance position is where the suction cap 51 moves away from the liquid ejection section 20. The suction cap 51 can be configured to surround all the nozzles 36, surround at least one nozzle group, or surround a portion of the nozzles 36 constituting a nozzle group. In this embodiment, the suction device 44 uses two suction caps 51 to surround one of the first nozzle group G1 to the sixth nozzle group G6.

[0045] The liquid ejection device 11 performs suction cleaning as follows: the liquid ejection part 20 is positioned above the suction device 44, and the suction cap 51 is in the sealed position, surrounding a nozzle assembly. Pressure is applied inside the suction cap 51 to discharge the liquid from the nozzle 36. That is, the suction device 44 receives the liquid discharged through suction cleaning.

[0046] The capping device 45 includes a standby cap 56, a standby cap holder 57, and a standby cap motor 58 that reciprocates the standby cap holder 57 along the Z-axis. Driven by the standby cap motor 58, the standby cap holder 57 and the standby cap 56 move upwards or downwards. The standby cap 56 moves from a separated position (downwards in the +Z direction) to a capped position (upwards) and contacts the liquid ejection section 20, which stops at the initial position HP.

[0047] The standby cap 56, located in the sealing position, surrounds the openings of the nozzles 36 that constitute the first nozzle group G1 to the sixth nozzle group G6. This maintenance of surrounding the openings of the nozzles 36 with the standby cap 56 is called standby sealing. The standby sealing is a type of sealing. By using the standby sealing, the drying of the nozzles 36 is prevented.

[0048] The standby cap 56 may be configured to surround all the nozzles 36, or to surround at least one group of nozzles, or to surround a portion of the nozzles 36 constituting the nozzle group.

[0049] Next, the liquid collection device 43 will be described. For example... Figure 3As shown, the liquid collection device 43 includes a strip-shaped member 60 capable of absorbing liquid. The strip-shaped member 60 is an example of a sheet-like absorption member. The liquid collection device 43 includes a housing 61 for housing the strip-shaped member 60, a pair of tracks 62 extending along the Y-axis, an wiping motor 63, a winding motor 64, and a power transmission mechanism 65 for transmitting power to the winding motor 64. The housing 61 has an opening 67 that exposes the strip-shaped member 60. When the size of the strip-shaped member 60 in the width direction X is greater than or equal to the size of the nozzle surface 40, the liquid ejection section 20 can be maintained efficiently.

[0050] The housing 61 reciprocates along the Y-axis on the track 62 by means of the power of the erasing motor 63. Specifically, the housing 61... Figure 3 , Figure 4 The receiving position shown is Figure 6 The device moves between the non-collecting positions shown. In this embodiment, the standby position of the housing 61 is the receiving position. Figure 3 , Figure 4 As shown, when the housing 61 is in the receiving position and the liquid ejection section 20 is in the cleaning position CP, the strip member 60 is opposite to the nozzle surface 40. Additionally, as... Figure 6 As shown, when the housing 61 is in the non-collection position and the liquid ejection part 20 is in the clean position CP, the housing 61 is opposite to the nozzle surface 40.

[0051] When the erasing motor 63 is driven in the forward direction, the housing 61 located in the receiving position moves towards the non-collecting position in the first erasing direction W1, which is parallel to the Y-axis. When the erasing motor 63 is driven in the reverse direction, the housing 61 located in the non-collecting position moves towards the receiving position in the second erasing direction W2, which is opposite to the first erasing direction W1.

[0052] The liquid dispensing device 11 wipes the liquid dispensing portion 20 during at least one of the processes of the housing 61 moving from the receiving position to the non-collecting position and the housing 61 moving from the non-collecting position to the receiving position. The wiping is a maintenance process performed by wiping the nozzle surface 40 with the strip member 60.

[0053] In addition, the liquid ejection device 11 of this embodiment flushes the liquid ejection section 20 to the liquid collection device 43 located at the receiving position. The liquid collection device 43 receives the liquid ejected from the liquid ejection section 20 by the flushing. The flushing is a maintenance procedure to prevent or eliminate any clogging of the nozzle 36 by ejecting the liquid as waste liquid.

[0054] Alternatively, the liquid ejection device 11 can also perform pressurized cleaning of the liquid discharged from the nozzle 36 from the liquid ejection section 20 to the liquid collection device 43 located at the receiving position. In this case, the liquid collection device 43 receives the liquid discharged through pressurized cleaning. Pressurized cleaning is a maintenance procedure to discharge the liquid as waste liquid for the purpose of maintaining the normal state of the liquid in the liquid ejection section 20 and the supply flow path 27.

[0055] like Figure 4 As shown, the liquid collection device 43 includes a release section 70 with a release shaft 69 and a winding section 72 with a winding shaft 71. The release section 70 holds the strip member 60 in a wound state. The strip member 60, unwound from the release section 70, is conveyed to the winding section 72 along a conveying path. The liquid collection device 43 includes an upstream roller 74, a tension roller 75, a pressing section 76, and a downstream roller 79 arranged sequentially from upstream along the conveying path of the strip member 60. The housing 61 supports the release shaft 69, the upstream roller 74, the tension roller 75, the pressing section 76, the downstream roller 79, and the winding shaft 71 in a manner that allows rotation with the X-axis as the axial direction.

[0056] The winding shaft 71 is rotated by the winding motor 64. The winding section 72 winds the strip member 60 into a cylindrical shape on the winding shaft 71. By winding the strip member 60, the winding section 72 causes the portion of the strip member 60 that is unwound from the unwinding section 70 to move in the D direction. The D direction is the direction along the conveying path of the strip member 60, and is the direction of movement from the upstream unwinding section 70 towards the downstream winding section 72.

[0057] The power transmission mechanism 65 transmits the driving force of the winding motor 64 to the winding shaft 71. The winding motor 64 can also drive at least one of the upstream roller 74, tension roller 75, pressing part 76, and downstream roller 79 to rotate together with the winding shaft 71. The power transmission mechanism 65 can also connect the winding motor 64 to the winding shaft 71 when the housing 61 is in the standby position, and disconnect the winding motor 64 from the winding shaft 71 when the housing 61 leaves the standby position.

[0058] The tension roller 75 is positioned further upstream in the D direction and below in the Z direction of gravity than the pressing part 76. The tension roller 75 applies tension to the belt member 60 by pressing it downwards.

[0059] In this embodiment, the pressing part 76 is a roller for winding the strip member 60. The pressing part 76 pushes the strip member 60, which has been released from the releasing part 70, from below to above, causing the strip member 60 to protrude from the opening 67.

[0060] The delivery path has an upstream region that is further upstream than the pressing part 76, a contact region A2 that allows the strip member 60 to contact the liquid ejection part 20, and a downstream region that is further downstream than the pressing part 76.

[0061] like Figures 4 to 6 As shown, the upstream region extends from the lowest point of the tension roller 75 to the upstream end of the contact region A2 in the D direction. The pressing part 76 is located further downstream and above the tension roller 75 in the D direction. Therefore, the strip member 60 located in the upstream region becomes an upward slope that rises in the opposite direction to the gravity direction Z as it moves further downstream in the D direction.

[0062] The contact area A2 is the area that contacts the liquid ejection part 20 during wiping. The pressing part 76 can push the contact area A2 located at the contact position 60a in the strip member 60, causing the contact area A2 to contact the liquid ejection part 20. That is, the liquid collection device 43 wipes the liquid ejection part 20 by moving the housing 61 while the contact area A2 is in contact with the liquid ejection part 20. In other words, the strip member 60 is configured to have a contact area A2 that contacts the liquid ejection part 20 when liquid is collected from the liquid ejection part 20 by contacting it. Figure 3 In the diagram, contact position 60a is indicated by a grid.

[0063] The downstream region extends from the downstream end of the contact region A2 in the D direction to the uppermost part of the downstream roller 79. The downstream roller 79 is located further downstream and below the pressing part 76 in the D direction. Therefore, the strip member 60 in the downstream region becomes a descending slope that gradually slopes downwards towards the direction of gravity Z as it moves downstream in the D direction. The strip member 60 in the downstream region is exposed through the opening 67.

[0064] like Figure 4 As shown, when the housing 61 is in the receiving position and the liquid ejection section 20 is in the cleaning position CP, the strip member 60 located in the receiving area A1 in the downstream region faces the area BW of the nozzle surface 40. In this state, the liquid ejection device 11 performs either rinsing or pressurized cleaning. In this case, the liquid collection device 43 receives the liquid discharged in the receiving area A1 through either rinsing or pressurized cleaning.

[0065] In other words, the strip member 60 is configured to have a receiving area A1 on the strip member 60 for receiving liquid discharged as waste liquid from the liquid ejection section 20. Furthermore, in this embodiment, the contact area A2 is located upstream in the D direction, further than the receiving area A1.

[0066] Next, the maintenance operations of the liquid ejection device 11 in this embodiment will be explained. First, the maintenance of the liquid ejection unit 20 will be explained by sequentially performing suction cleaning, wiping, and rinsing on the control unit 29 of the liquid ejection device 11.

[0067] The control unit 29 stops the liquid ejection unit 20 above the suction device 44 to perform suction cleaning on the nozzle assembly that needs to be cleaned. When the suction cleaning is finished, the control unit 29 moves the liquid ejection unit 20 to the cleaning position CP.

[0068] like Figure 4 As shown, when the housing 61 is in the receiving position as the standby position, the control unit 29 reverses the drive of the erasing motor 63, causing the housing 61 to move in the second erasing direction W2.

[0069] like Figure 5 As shown, the liquid collection device 43 wipes the liquid by bringing the contact area A2 into contact with the liquid ejection part 20. Specifically, the liquid collection device 43 wipes the liquid by pressing the contact area A2 of the strip member 60 against the nozzle surface 40 with the pressing part 76 and moving the housing 61 while the strip member 60 is sandwiched between the pressing part 76 and the nozzle surface 40.

[0070] like Figure 6 As shown, when the housing 61 moves to the non-collection position, the control unit 29 stops the drive of the wiping motor 63 and moves the liquid spraying unit 20 from the cleaning position CP. Then, the control unit 29 drives the wiping motor 63 to rotate forward, causing the housing 61 to move in the first wiping direction W1.

[0071] When wiping is complete, the control unit 29 moves the liquid ejection unit 20 to the cleaning position CP while the housing 61 is in the receiving position. Thus, as... Figure 7 As shown, the control unit 29 performs rinsing by spraying liquid from the nozzle 36 of the liquid ejection unit 20 into the receiving area A1 of the strip member 60 opposite to the liquid ejection unit 20. It should be noted that in Figures 7 to 11 , Figure 13 , Figures 15 to 19 In the diagram, the extent of the liquid adhering to the strip member 60 is indicated by shading. Furthermore, when the liquid is ink, it is indicated by shading that slopes diagonally towards the -Y direction as it moves towards the +X direction; when the liquid is a reaction liquid, it is indicated by shading that slopes diagonally towards the +Y direction as it moves towards the +X direction.

[0072] The liquid discharged into the strip member 60 diffuses within the strip member 60. The liquid sprayed into the receiving area A1 of the strip member 60 by rinsing diffuses over time from... Figure 7The area shown by the mid-shadow line expands towards a larger area. Therefore, the area in the strip member 60 that has absorbed liquid also expands in the +Y direction, i.e., towards the contact area A2. In the strip member 60, when the liquid received in the receiving area A1 wets and expands towards the contact area A2, it is possible that the area in the strip member 60 where the liquid has wetted and expanded may come into contact with the liquid ejection part 20.

[0073] In this embodiment, after rinsing, the control unit 29 moves the liquid ejection unit 20 along the X-axis while... Figure 8 As shown in the mid-shadow line, the reaction liquid is ejected from nozzle 36, which constitutes the fourth nozzle group G4, toward a position that overlaps with the area from which ink has been ejected by rinsing.

[0074] Accordingly, the ink absorbed by the strip member 60 comes into contact with the reaction liquid supplied to the strip member 60, thereby increasing the viscosity of both the ink and the reaction liquid. Furthermore, the ink absorbed by the strip member 60 comes into contact with the reaction liquid supplied to the strip member 60, thereby causing the ink and the reaction liquid to solidify. As a result, the spread of the ink and reaction liquid received in the receiving area A1 towards the contact area A2 within the strip member 60 can be suppressed.

[0075] Furthermore, when the area from which the reaction liquid is ejected from the nozzle 36 constituting the fourth nozzle group G4 is designated as the supply area S1, the supply area S1 is located within the receiving area A1. The nozzle 36 constituting the fourth nozzle group G4 is an example of a supply section RLS capable of supplying the strip member 60 with a reaction liquid containing components that cure ink. In this case, it can also be said that the supply section RLS includes the nozzle 36 constituting the fourth nozzle group G4.

[0076] Alternatively, the reaction liquid can be supplied to the strip member 60 before rinsing. In this case, for example, the control unit 29 moves the liquid ejection unit 20 along the X-axis while directing the reaction liquid from the nozzle 36 constituting the fourth nozzle group G4 to... Figure 8 The supply area S1, shown in the middle shadow line, is ejected. Then, the control unit 29 moves the liquid ejection unit 20 to the cleaning position CP. Thus, as... Figure 7 As shown, the control unit 29 performs rinsing by spraying liquid from the nozzle 36 of the liquid ejection unit 20 into the receiving area A1 of the strip member 60 opposite to the liquid ejection unit 20.

[0077] It should be noted that when the reaction liquid is ejected from the nozzle 36 constituting the fourth nozzle group G4 into the supply area S1 that overlaps with the area where ink is ejected through rinsing, it is also possible that the reaction liquid is not ejected from the nozzle 36 constituting the fourth nozzle group G4 into the supply area S1 during rinsing. Figure 7 The reaction liquid is sprayed out within the area indicated by the double-dotted line.

[0078] Additionally, during rinsing, as a rinsing process, [the water is directed towards...] Figure 7 The area indicated by the double-dotted line may be sprayed with the reaction liquid without contacting other inks, such as... Figure 9 As shown, it is also possible to direct the nozzles from any of the nozzles 36 constituting the first nozzle group G1 to the third nozzle group G3, the fifth nozzle group G5, and the sixth nozzle group G6 towards the nozzles. Figure 7 The overlapping area A3, indicated by the double-dotted line, is where ink is ejected.

[0079] Alternatively, it can replace supply area S1 in Figure 10 The supply region S2, shown in the mid-shadow line, supplies the reaction liquid to the strip member 60. The supply region S2 is located within the receiving region A1. The supply region S2 overlaps with the +Y direction end of the receiving region A1. This +Y direction end of the receiving region A1 is the upstream end in the D direction of the receiving region A1, and is the position in the receiving region A1 closest to the contact region A2. That is, the supply region S2 overlaps with the position in the receiving region A1 closest to the contact region A2. The supply region S2 extends in a strip-like shape in the X-axis direction, which is the width direction of the strip member 60. The dimension of the supply region S2 in the X-axis direction can also be the same as the width dimension of the strip member 60. Alternatively, the dimension of the supply region S2 in the Y-axis direction can be less than half the dimension in the Y-axis direction of the first nozzle rows L1 to the twelfth nozzle rows L12.

[0080] When supplying reaction liquid to the supply area S2, for example, the control unit 29 moves the liquid ejection unit 20 along the X-axis while ejecting reaction liquid from the nozzles 36 constituting the fourth nozzle group G4 into the supply area S2. At this time, the reaction liquid is ejected into the supply area S2 from several nozzles 36 of the fourth nozzle group G4 that are opposite to the supply area S2. These nozzles 36 opposite to the supply area S2 are the nozzles 36 on the +Y direction side of the fourth nozzle group G4. Alternatively, when supplying reaction liquid to the supply area S2, the reaction liquid may also be ejected into the supply area S2 from one nozzle at the +Y direction end of the nozzles 36 constituting the fourth nozzle group G4.

[0081] Alternatively, it can replace supply area S1 in Figure 11 The supply region S3, shown in the mid-shadow line, supplies the reaction liquid to the strip member 60. The supply region S3 is located between the receiving region A1 and the contact region A2 in the Y-axis direction. The supply region S3 extends in a strip shape in the X-axis direction, which is the width direction of the strip member 60. The dimension of the supply region S3 in the X-axis direction can also be the same as the width dimension of the strip member 60. Alternatively, the dimension of the supply region S3 in the Y-axis direction can be less than half the dimension in the Y-axis direction of the first nozzle rows L1 to the twelfth nozzle rows L12.

[0082] When the reaction liquid is supplied to the supply area S3, for example, the control unit 29 drives the wiping motor 63, such as... Figure 12 As shown, the housing 61 is moved to a position further in the -Y direction than the receiving position. This establishes a supply region S3 downstream of the strip member 60. Then, the control unit 29 moves the liquid ejection unit 20 along the X-axis while ejecting the reaction liquid from the nozzles 36 constituting the fourth nozzle group G4 into the supply region S3. At this time, the reaction liquid is ejected into the supply region S3 from several nozzles 36 of the fourth nozzle group G4 that are opposite to the supply region S3. These nozzles 36 opposite to the supply region S3 are the nozzles 36 on the +Y direction side of the fourth nozzle group G4. Alternatively, when supplying the reaction liquid to the supply region S3, the reaction liquid can also be ejected from one nozzle at the +Y direction end of the nozzles 36 constituting the fourth nozzle group G4.

[0083] When the reaction liquid is supplied to the supply area S2, during rinsing, as a rinsing process, it is supplied to... Figure 10 The area indicated by the double-dotted line may be sprayed with the reaction liquid without contacting other inks, such as... Figure 13 As shown, ink can also be ejected from any of the nozzles 36 that constitute the first nozzle group G1 to the third nozzle group G3, the fifth nozzle group G5 and the sixth nozzle group G6 into the ejection area A4 that overlaps with the supply area S2.

[0084] The dimension of the ejection region A4 in the X-axis direction can also be smaller than the dimension of the supply region S2 in the X-axis direction. Alternatively, the dimension of the ejection region A4 in the X-axis direction can also be larger than... Figure 10 The area indicated by the double-dotted line is the dimension along the X-axis. It should be noted that when the reaction solution is supplied to the supply area S3, during rinsing, as a rinsing agent... Figure 11 Even if the reaction liquid sprayed from the area indicated by the double-dotted line does not come into contact with other inks, ink can still be sprayed from any of the nozzles 36 constituting the first nozzle group G1 to the third nozzle group G3, the fifth nozzle group G5 and the sixth nozzle group G6, just as when the reaction liquid is supplied to the supply area S2, into the spraying area A4 or into the area overlapping with the supply area S3.

[0085] It should be noted that if a large amount of liquid is collected in the contact area A2 of the strip member 60 during wiping, the liquid collected in the contact area A2 may wet and spread towards the upstream side of the strip member 60 in the D direction, causing the area of ​​the strip member 60 with liquid wetting and spreading to come into contact with the liquid ejection part 20 during subsequent wiping. In this case, a reaction solution may also be supplied to the contact area A2 where liquid has been collected by wiping.

[0086] Specifically, after wiping, the control unit 29 moves the contact area A2, where liquid has been collected by wiping, in the direction D by winding the winding unit 72 around the strip member 60. Thus, the control unit 29 positions the contact area A2, where liquid has been collected by wiping, within the receiving area A1.

[0087] Then, for example, the control unit 29 moves the liquid ejection unit 20 along the X-axis while ejecting the reaction liquid from the nozzle 36 constituting the fourth nozzle group G4 into the supply area S2. Alternatively, the control unit 29 may also eject the reaction liquid from the nozzle 36 constituting the fourth nozzle group G4 into the supply area S3.

[0088] In this case, for example, the contact area A2, which has been moved into the receiving area A1 and collected by wiping, is designated as the collection area CR, and the area in the strip member 60 designated as the contact area A2 to be used in the subsequent wiping is designated as the wiping area WR. At this time, the nozzle 36 constituting the fourth nozzle group G4 supplies the reaction liquid to the supply area S2 or the supply area S3 in the strip member 60, the supply area S2 being located between the position in the collection area CR furthest from the wiping area WR and the wiping area WR.

[0089] Next, the maintenance procedures for the liquid spraying device 11, including pressurized cleaning, wiping, and rinsing, will be explained. (For example...) Figure 3 , Figure 4 As shown, during pressurized cleaning, the control unit 29 positions the housing 61 in the receiving position. Then, the control unit 29 moves the liquid ejection unit 20 to the cleaning position CP and stops it.

[0090] The control unit 29 controls the liquid supply device 23 to supply pressurized liquid to the nozzle 36 and discharge the liquid from the nozzle 36. The liquid discharged from the nozzle 36 drips from the nozzle surface 40. At this time, the strip member 60 is located in the +Z direction, i.e., vertically below the nozzle 36. Therefore, the liquid discharged from the nozzle 36 as waste liquid by pressurized cleaning is received by the receiving area A1 set in the strip member 60 in the same way as rinsing.

[0091] like Figure 5 As shown, after pressurized cleaning, the control unit 29 reverses the wiping motor 63 while the liquid ejection section 20 is stopped, causing the housing 61 to move in the second wiping direction W2. That is, the control unit 29 wipes the nozzle surface 40 by bringing the contact area A2 of the strip member 60 into contact with it, collecting the liquid discharged during pressurized cleaning and remaining on the nozzle surface 40 into the contact area A2. After wiping, the control unit 29 moves the liquid ejection section 20 to rinse.

[0092] In this embodiment, when performing pressurized cleaning, wiping and rinsing as maintenance of the liquid ejection device 11, the reaction liquid is ejected from the nozzle 36 constituting the fourth nozzle group G4 to any one of the supply areas S1, S2 and S3 set in the strip member 60, just as when performing suction cleaning, wiping and rinsing in sequence as maintenance of the liquid ejection section 20.

[0093] Furthermore, in this embodiment, the control unit 29 moves the liquid ejection section 20 to the cleaning position CP at predetermined intervals during printing. Then, the control unit 29 performs rinsing, causing liquid to be ejected from the nozzle 36 of the liquid ejection section 20 into the receiving area A1 of the strip member 60 opposite to the liquid ejection section 20. Thus, in the case of rinsing during printing as maintenance of the liquid ejection section 20, the reaction liquid can also be ejected from the nozzle 36 constituting the fourth nozzle group G4 into any of the supply areas S1, S2, and S3 provided on the strip member 60.

[0094] Supply regions S1, S2, and S3 are located in the strip member 60 between the end of the receiving region A1 on the -Y direction side and the contact region A2. In other words, the nozzle 36 constituting the fourth nozzle group G4 supplies the reaction liquid to the supply regions S1, S2, and S3 in the strip member 60 located between the receiving region A1 and the contact region A2 at the position furthest from the contact region A2.

[0095] The +Y direction end of the supply regions S1, S2, and S3 is positioned in the strip member 60 between the -Y direction end of the receiving region A1 and the -Y direction end of the contact region A2. The +Y direction end of the supply regions S1, S2, and S3 is positioned in the strip member 60 downstream of the contact region A2 in the D direction and spaced apart from the contact region A2.

[0096] In this embodiment, the -Y direction ends of the supply regions S1, S2, and S3 are positioned in the strip member 60 between the -Y direction ends of the receiving region A1 and the -Y direction ends of the contact region A2. However, if the reaction liquid supplied from the supply unit RLS to the strip member 60 comes into contact with the ink discharged into the designated receiving region A1, the -Y direction ends of the supply regions S1, S2, and S3 may not be positioned in the strip member 60 between the -Y direction ends of the receiving region A1 and the -Y direction ends of the contact region A2.

[0097] For example, if the +Y direction end of the supply regions S1, S2, and S3 is positioned between the -Y direction end in the receiving region A1 and the -Y direction end in the contact region A2, then the -Y direction end of the supply regions S1, S2, and S3 can also be positioned downstream in the D direction relative to the -Y direction end in the receiving region A1. In other words, the supply unit RLS supplies the reaction liquid to the area of ​​the strip member 60 that is in contact with the ink collected in the receiving region A1.

[0098] As described above, the liquid ejection device 11 according to Embodiment 1 can achieve the following effects.

[0099] The liquid ejection device 11 includes: a liquid ejection section 20 for ejecting ink from a nozzle 36 onto a medium 14 for printing; a sheet-like strip member 60 capable of absorbing ink and a reaction liquid; and a supply section RLS capable of supplying a reaction liquid containing components for curing ink to the strip member 60. Furthermore, the strip member 60 is configured to have a receiving area A1 and a contact area A2. The receiving area A1 receives either the ink or the reaction liquid discharged as waste liquid from the nozzle 36, and the contact area A2 contacts the liquid ejection section 20 when collecting either the ink or the reaction liquid through contact with it. Additionally, the supply section RLS supplies the reaction liquid to supply areas S1, S2, and S3 within the strip member 60 located between the receiving area A1 and the contact area A2, at the position furthest from the contact area A2. Accordingly, since the waste liquid received in the receiving area A1 can be prevented from spreading towards the contact area A2 within the strip member 60, areas that have not absorbed waste liquid can easily come into contact with the liquid ejection section 20.

[0100] The liquid ejection device 11 also includes a release section 70 and a winding section 72. The release section 70 holds the strip member 60 in a cylindrical state, and the winding section 72 allows the strip member 60 to move in the D direction by winding it around the release section 70. The contact area A2 is set at a position upstream in the D direction than the receiving area A1. Accordingly, since the area of ​​the strip member 60 that has not absorbed waste liquid can be set as the contact area A2, it is easy to make the area that has not absorbed waste liquid come into contact with the liquid ejection section 20.

[0101] Supply areas S1 and S2 are located within receiving area A1. This reduces the amount of waste liquid received in receiving area A1 that extends from receiving area A1 to contact area A2.

[0102] The supply area S3 is located between the receiving area A1 and the contact area A2. Accordingly, it is possible to prevent the waste liquid received in the receiving area A1 from spreading towards the contact area A2.

[0103] The supply unit RLS supplies a reaction liquid to the strip member 60 before the liquid ejection unit 20 discharges ink into the receiving area A1. Accordingly, the reaction liquid absorbed by the strip member 60 comes into contact with the ink discharged to the strip member 60, thereby increasing the viscosity of both the ink and the reaction liquid. Furthermore, the reaction liquid absorbed by the strip member 60 comes into contact with the ink discharged to the strip member 60, thereby solidifying both the ink and the reaction liquid. As a result, it is possible to prevent the waste liquid received in the receiving area A1 from spreading towards the contact area A2.

[0104] After the liquid ejection section 20 discharges ink into the receiving area A1, the supply unit RLS supplies a reaction liquid to the strip member 60. Accordingly, the ink absorbed by the strip member 60 comes into contact with the reaction liquid supplied to the strip member 60, thereby increasing the viscosity of both the ink and the reaction liquid. Furthermore, the ink absorbed by the strip member 60 comes into contact with the reaction liquid supplied to the strip member 60, thereby solidifying both the ink and the reaction liquid. As a result, it is possible to prevent the waste liquid received in the receiving area A1 from spreading towards the contact area A2.

[0105] The supply unit RLS includes a nozzle 36 that constitutes a fourth nozzle group G4 capable of ejecting reaction liquid, and the nozzle 36 constituting the fourth nozzle group G4 capable of ejecting reaction liquid is provided in the liquid ejection unit 20. Accordingly, the reaction liquid can be supplied to the strip member 60 through the nozzle 36 constituting the fourth nozzle group G4 of the liquid ejection unit 20.

[0106] In the liquid ejection device 11, the liquid ejection unit 20 ejects ink onto the medium 14, which has been supplied with reaction liquid by the supply unit RLS, for printing. Accordingly, since the ink can be fixed on the medium 14 before it spreads on the medium 14, the image quality during printing can be improved.

[0107] 2. Implementation Method 2

[0108] Next, the liquid ejection device 11 of Embodiment 2, which is an embodiment of this disclosure, will be described. It should be noted that the same reference numerals are used for parts that are common to the liquid ejection device 11 of Embodiment 1, and their descriptions are omitted.

[0109] When the nozzle 36 capable of ejecting the reaction liquid is designated as the reaction liquid nozzle 36A, and the nozzle 36 capable of ejecting ink is designated as the ink nozzle 36B, the liquid ejection unit 20 in this embodiment includes the reaction liquid ejection unit 20A and the ink ejection unit 20B. The reaction liquid ejection unit 20A has a reaction liquid nozzle 36A capable of ejecting the reaction liquid, and the ink ejection unit 20B has an ink nozzle 36B capable of ejecting ink. In other words, the liquid ejection device 11 of this embodiment includes the reaction liquid ejection unit 20A, and the reaction liquid ejection unit 20A has a reaction liquid nozzle 36A capable of ejecting the reaction liquid.

[0110] like Figure 14As shown, the reaction liquid ejection section 20A and the ink ejection section 20B are disposed on the carriage 21 at a distance from each other in the Y-axis direction. The reaction liquid ejection section 20A is disposed in the -Y direction relative to the ink ejection section 20B. The reaction liquid nozzle 36A and the ink nozzle 36B are examples of nozzles. In addition, the ink ejection section 20B is an example of a liquid ejection section.

[0111] The composition of the reaction liquid ejection section 20A and the ink ejection section 20B is the same as that of the liquid ejection section 20 in Embodiment 1. In addition, the reaction liquid is ejected from the reaction liquid nozzles 36A of the first nozzle group G1, the second nozzle group G2, the third nozzle group G3, the fourth nozzle group G4, the fifth nozzle group G5 and the sixth nozzle group G6 included in the reaction liquid ejection section 20A.

[0112] Furthermore, the same ink as that in the liquid ejection section 20 of Embodiment 1 is ejected from the ink nozzles 36B of the first nozzle group G1, the second nozzle group G2, the third nozzle group G3, the fifth nozzle group G5, and the sixth nozzle group G6 constituting the ink ejection section 20B. For example, white ink is ejected from the ink nozzles 36B constituting the fourth nozzle group G4.

[0113] The maintenance unit 22 in this embodiment has a liquid collection device 43, a suction device 44, and a capping device 45 arranged along the width direction X. The liquid collection device 43 is the same as the liquid collection device 43 in embodiment 1, except that the length of the track 62 and the distance of the housing 61 reciprocating along the Y axis are changed in relation to the reaction liquid ejection section 20A and the ink ejection section 20B.

[0114] In this embodiment, the standby position of the housing 61 is the position where the strip member 60 is opposite the reaction liquid ejection section 20A when the liquid ejection section 20 is in the clean position CP. That is, the standby position of the housing 61 is the receiving position corresponding to the reaction liquid ejection section 20A. It should be noted that when the housing 61 is in the receiving position corresponding to the reaction liquid ejection section 20A, the reaction liquid ejection section 20A is located in... Figures 15 to 19 The position of the liquid ejection section 20, indicated by the double-dotted line, is such that when the housing 61 is in the receiving position corresponding to the ink ejection section 20B, the ink ejection section 20B is located... Figures 15 to 19 The position of the liquid ejection section 20 is indicated by the double-dotted line.

[0115] Furthermore, the suction device 44 includes a suction device 44A corresponding to the reaction liquid ejection section 20A and a suction device 44B corresponding to the ink ejection section 20B. The configurations of the suction devices 44A and 44B are the same as those of the suction device 44 in Embodiment 1. Additionally, the capping device 45 includes a capping device 45A corresponding to the reaction liquid ejection section 20A and a capping device 45B corresponding to the ink ejection section 20B. The configurations of the capping devices 45A and 45B are the same as those of the capping device 45 in Embodiment 1.

[0116] Alternatively, the maintenance unit 22 may also have a rinsing device 42 that receives rinsing performed at predetermined intervals during printing. In this case, the rinsing device 42 includes a reaction liquid receiving section 42A and an ink receiving section 42B. The reaction liquid receiving section 42A receives the reaction liquid ejected from the reaction liquid ejector section 20A for rinsing, and the ink receiving section 42B receives the ink ejected from the ink ejector section 20B for rinsing.

[0117] Next, the maintenance procedure of pressurizing and cleaning the ink ejection unit 20B by the control unit 29 as part of the maintenance of the liquid ejection device 11 will be described. Figure 15 As shown, during pressurized cleaning, the control unit 29 causes the housing 61 to... Figure 14 The standby position shown is moved to the receiving position in the +Y direction corresponding to the ink ejection section 20B. Then, the control unit 29 moves the liquid ejection section 20 to the cleaning position CP and stops it. As a result, the receiving area A1 of the strip member 60 is opposite to the area BW of the ink ejection section 20B.

[0118] The control unit 29 controls the liquid supply device 23 to supply pressurized liquid to the ink nozzle 36B, from which ink is discharged. Figure 15 As shown in the mid-shadow line, the ink discharged as waste liquid from the ink nozzle 36B through pressurized cleaning is received by the receiving area A1 set in the strip member 60.

[0119] After pressurizing and cleaning the ink ejection section 20B, the control unit 29 reverses the wiping motor 63 while the liquid ejection section 20 is stopped, thereby moving the housing 61 in the second wiping direction W2. That is, the control unit 29 wipes the ink ejection section 20B by bringing the contact area A2 of the strip member 60 into contact with the nozzle surface 40 of the ink ejection section 20B, collecting the ink discharged during pressurized cleaning and remaining on the nozzle surface 40 into the contact area A2.

[0120] After wiping the ink ejection section 20B, the control unit 29 also moves the housing 61 in the second wiping direction W2 and stops it at the receiving position corresponding to the reaction liquid ejection section 20A. Thus, as... Figure 16As shown in the mid-shadow, the control unit 29 sprays the reaction liquid from the reaction liquid nozzles 36A of the first nozzle group G1 to the sixth nozzle group G6 constituting the reaction liquid ejection unit 20A to the area overlapping with the area where ink has been discharged through the pressurized cleaning of the ink ejection unit 20B. In other words, after the reaction liquid ejection unit 20A discharges ink from the ink nozzles 36B of the ink ejection unit 20B to the receiving area A1, it supplies the reaction liquid from the reaction liquid nozzles 36A to the strip member 60.

[0121] When the area of ​​the strip member 60 from which the reaction liquid is ejected from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A is defined as the supply area S1, the supply area S1 is located within the receiving area A1. The reaction liquid nozzle 36A of the reaction liquid ejection section 20A is an example of a supply section RLS capable of supplying the strip member 60 with a reaction liquid containing components that cure ink. In this case, it can also be said that the supply section RLS includes the reaction liquid ejection section 20A. Alternatively, it can also be said that the supply section RLS includes the reaction liquid nozzle 36A of the reaction liquid ejection section 20A.

[0122] After the control unit 29 ejects the reaction liquid from the reaction liquid nozzle 36A of the reaction liquid ejection unit 20A into the receiving area A1 of the strip member 60, it moves the housing 61 to the receiving position corresponding to the ink ejection unit 20B. Then, the control unit 29 performs rinsing of the ink ejected from the ink nozzle 36B of the ink ejection unit 20B into the receiving area A1 of the strip member 60.

[0123] Furthermore, when the maintenance unit 22 has a rinsing device 42, rinsing of the ink ejection section 20B after wiping it can also be performed towards the ink receiving section 42B of the rinsing device 42. In this case, after wiping the ink ejection section 20B, the control unit 29 moves the liquid ejection section 20 to a position opposite the reaction liquid receiving section 42A and the ink ejection section 20B of the rinsing device 42 while moving the housing 61 toward the receiving position corresponding to the reaction liquid ejection section 20A. Then, the control unit 29 performs rinsing to eject ink from the ink nozzle 36B of the ink ejection section 20B into the ink receiving section 42B of the rinsing device 42.

[0124] Alternatively, the supply of reaction liquid from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A to the supply area S1 of the strip member 60 can be performed before pressurizing and cleaning the ink ejection section 20B. In this case, with the housing 61 in the standby position, the control unit 29 moves the liquid ejection section 20 to the cleaning position CP, causing the reaction liquid to flow from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A to the supply area S1 of the strip member 60. Figure 16 The ink supply area S1, indicated by the mid-shadow line, is ejected. Then, the control unit 29 performs pressure cleaning on the ink ejection unit 20B.

[0125] It should be noted that, during the wiping of the ink ejection section 20B, if a large amount of ink is collected in the contact area A2 of the strip member 60, the ink collected in the contact area A2 may wet and spread towards the upstream side in direction D of the strip member 60, causing the area of ​​the strip member 60 with ink wetting and spreading to come into contact with either the reaction liquid ejection section 20A or the ink ejection section 20B. In this case, the reaction liquid may also be supplied to the contact area A2 where ink has been collected by wiping with the ink ejection section 20B.

[0126] Specifically, after wiping the ink ejection section 20B, the control section 29 moves the contact area A2, where ink was collected by wiping, in the direction D by winding the winding section 72 around the strip member 60. Thus, the control section 29 positions the contact area A2, where ink was collected by wiping, within the receiving area A1.

[0127] Then, for example, the control unit 29 moves the housing 61 to the standby position and sprays the reaction liquid from the reaction liquid nozzle 36A of the reaction liquid spraying unit 20A into the supply area S2. Alternatively, the control unit 29 may also spray the reaction liquid from the reaction liquid nozzle 36A of the reaction liquid spraying unit 20A into the supply area S3.

[0128] In this case, for example, the contact area A2, which has collected ink by wiping with the ink ejector 20B and moved into the receiving area A1, is designated as the collecting area CRB, and the area in the strip member 60 designated as the contact area A2 for use in the next wiping is designated as the wiping area WR. At this time, the reaction liquid nozzle 36A of the reaction liquid ejector 20A supplies reaction liquid to the supply area S2 or the supply area S3 in the strip member 60 located between the position furthest from the wiping area WR in the collecting area CRB and the wiping area WR.

[0129] Next, the maintenance of the liquid ejection section 20 by rinsing the control unit 29 will be described. For example, when rinsing the reaction liquid ejection section 20A, with the housing 61 in the standby position, the control unit 29 moves the liquid ejection section 20 to the cleaning position CP and causes the reaction liquid to flow from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A into the liquid ejection section 20A. Figure 16 The supply area S1, indicated by the mid-shadow line, is ejected.

[0130] Then, while rinsing the ink ejection section 20B, the control unit 29 moves the housing 61 to the receiving position corresponding to the ink ejection section 20B, and then moves the liquid ejection section 20 to the cleaning position CP. The control unit 29 then directs ink from the ink nozzle 36B of the ink ejection section 20B to... Figure 15 The receiving area A1, indicated by the mid-shadow line, is ejected.

[0131] At this time, between the rinsing of the reaction liquid ejected from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A and the rinsing of the ink ejected from the ink nozzle 36B of the ink ejection section 20B, the control unit 29 does not cause the winding section 72 to perform the winding operation of the strip member 60. In this case, the action of the reaction liquid ejection section 20A discharging the reaction liquid to the strip member 60 by rinsing is equivalent to the action of the reaction liquid ejection section 20A supplying the reaction liquid from the reaction liquid nozzle 36A to the supply area S1 that overlaps with the receiving area A1 of the strip member 60 before the ink ejection section 20B discharges the ink to the receiving area A1 by rinsing.

[0132] Alternatively, in this embodiment, the supply area S1 can be replaced by... Figure 17 The supply region S2, shown in the middle shadow line, supplies the reaction liquid to the strip-shaped component 60. The supply region S2 in this embodiment is the same as the supply region S2 in Embodiment 1. When supplying the reaction liquid to the supply region S2, for example, when the housing 61 is in the standby position, the control unit 29 moves the liquid ejection unit 20 along the X-axis direction while spraying the reaction liquid from any of the nozzles 36A constituting the first nozzle group G1 to the sixth nozzle group G6 into the supply region S2.

[0133] At this time, reaction liquid is sprayed into the supply region S2 from several reaction liquid nozzles 36A that are opposite to the supply region S2 among the reaction liquid nozzles 36A constituting the first nozzle group G1 to the sixth nozzle group G6. The reaction liquid nozzles 36A opposite to the supply region S2 are the nozzles 36 on the +Y direction side of the first nozzle group G1 to the sixth nozzle group G6. Alternatively, when supplying reaction liquid to the supply region S2, reaction liquid may also be sprayed into the supply region S2 from one nozzle at the +Y direction end of the nozzles 36 on the +Y direction side of the first nozzle group G1 to the sixth nozzle group G6.

[0134] Alternatively, it can replace supply area S1 in Figure 18 The supply region S3, shown in the middle shadow line, supplies the reaction liquid to the strip member 60. The supply region S3 in this embodiment is the same as the supply region S3 in Embodiment 1. When supplying the reaction liquid to the supply region S3, for example, the control unit 29 drives the wiping motor 63 to move the housing 61 to a position further in the +Y direction than the standby position. As a result, the supply region S3 is set in the downstream region of the strip member 60. Then, similarly to when supplying the reaction liquid to the supply region S2 while moving the liquid ejection unit 20 in the X-axis direction, the control unit 29 causes the reaction liquid to be ejected from any of the nozzles of the reaction liquid nozzles 36A constituting the first nozzle group G1 to the sixth nozzle group G6 into the supply region S3.

[0135] Alternatively, in this embodiment, the supply area S1 can be replaced by... Figure 19The supply area S4, shown in the middle shadow line, supplies the reaction liquid to the strip member 60. For example, the reaction liquid is supplied to the ink nozzle 36B from the ink ejection section 20B. Figure 19 The process of supplying reaction liquid to supply area S4 before ink is discharged from receiving area A1 (shown by the middle shadow line) will be explained.

[0136] In this case, with the housing 61 in the standby position, the control unit 29 moves the liquid ejection section 20 to the cleaning position CP. Then, the control unit 29 moves the housing 61 from the standby position in the first wiping direction W1, causing the contact area A2 of the strip member 60 to contact the reaction liquid nozzle area, which includes the opening of the reaction liquid nozzle 36A, in the nozzle surface 40 of the reaction liquid ejection section 20A. Alternatively, the control unit 29 uses the strip member 60 to wipe the reaction liquid ejection section 20A. As a result, the reaction liquid adhering to the reaction liquid nozzle area of ​​the reaction liquid ejection section 20A is collected in the contact area A2.

[0137] Alternatively, the control unit 29 controls the liquid supply device 23 to supply reaction liquid to the reaction liquid nozzle 36A of the reaction liquid ejection section 20A, forming a state in which the reaction liquid gushes out from the reaction liquid nozzle 36A. In this state, the control unit 29 may also bring the contact area A2 of the strip member 60 into contact with the reaction liquid nozzle area of ​​the reaction liquid ejection section 20A. Thus, the reaction liquid gushes out from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A is collected in the contact area A2.

[0138] Therefore, the control unit 29 causes the winding unit 72 to wind the strip member 60, moving the contact area A2, which has collected the reaction liquid, to the position of the supply area S4 downstream in the D direction. In this case, the contact area A2, which has moved to the position within the receiving area A1 after collecting the reaction liquid by contacting the reaction liquid nozzle area, can be considered as the supply area S4 that supplies the reaction liquid to the receiving area A1 where the ink is discharged.

[0139] Then, the control unit 29 moves the housing 61 to a receiving position corresponding to the ink ejection section 20B. For example, it applies pressure to clean the ink ejection section 20B, causing ink to be discharged from the ink nozzle 36B of the ink ejection section 20B to the receiving area A1 of the strip member 60. In other words, the strip member 60 is configured to allow the supply area S4 to contact the reaction liquid nozzle area, which includes the opening of the reaction liquid nozzle 36A. After the supply area S4 contacts the reaction liquid nozzle area, ink is discharged from the ink ejection section 20B to the receiving area A1.

[0140] As described above, the liquid ejection device 11 according to Embodiment 2 can achieve the following effects.

[0141] The liquid ejection device 11 also includes a reaction liquid ejection section 20A with a nozzle 36 capable of ejecting the reaction liquid, and the supply section RLS includes the reaction liquid ejection section 20A. Accordingly, the reaction liquid can be supplied to the strip member 60 using the reaction liquid ejection section 20A.

[0142] When the nozzle 36 for ejecting the reaction liquid is designated as the reaction liquid nozzle 36A, the strip member 60 is configured to allow the supply area S4 to contact the reaction liquid nozzle area, which includes the opening of the reaction liquid nozzle 36A. After the supply area S4 contacts the reaction liquid nozzle area, ink is discharged from the ink ejection section 20B to the receiving area A1. Accordingly, by bringing the strip member 60 into contact with the reaction liquid nozzle area, reaction liquid can be supplied from the supply section RLS to the supply area S4 of the strip member 60.

[0143] The supply area S4 of the strip member 60 contacts the reaction liquid nozzle area when the reaction liquid is bulging out from the reaction liquid nozzle 36A. Accordingly, the amount of reaction liquid supplied to the strip member 60 can be increased.

[0144] The liquid ejection device 11 according to the above embodiments of the present invention is based on the configuration described above. However, it is of course possible to make changes or omissions to some configurations without departing from the spirit of the present invention. In addition, the above embodiments and other embodiments described below can be combined with each other to the extent that they are not technically contradictory. Hereinafter, other embodiments will be described.

[0145] In the above embodiments, such as Figure 20 As shown, the liquid ejection device 11 may also include a reaction liquid ejection section 220 capable of ejecting the reaction liquid. The reaction liquid ejection section 220 has an ejection nozzle 236 for ejecting the reaction liquid. The reaction liquid ejection section 220 is provided on the carriage 21 in such a way that it can supply the reaction liquid to either the strip member 60 or the medium 14. The reaction liquid ejection section 220 is an example of a supply section RLS capable of supplying the strip member 60 with a reaction liquid containing components that cure ink. In this case, the liquid supply device 23 supplies the reaction liquid to the reaction liquid ejection section 220. In addition, in this case, the liquid ejection section 20 of Embodiment 1 may not eject the reaction liquid from the nozzle 36 constituting the fourth nozzle group G4 to the strip member 60. In addition, in this case, the liquid ejection section 20 of Embodiment 2 may not eject the reaction liquid from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A to the strip member 60.

[0146] In the above embodiment, the first nozzle group G1 to the sixth nozzle group G6 of the liquid ejection unit 20 may not extend in the Y direction. Furthermore, the plurality of first nozzle groups G1 to the sixth nozzle group G6 may not be spaced apart from each other in the X direction. For example, the first nozzle groups G1 to the sixth nozzle group G6 of the liquid ejection unit 20 may extend along the X direction throughout the entire width of the medium 14. Additionally, the plurality of first nozzle groups G1 to the sixth nozzle group G6 may be spaced apart from each other in the Y direction. In this case, the liquid ejection unit 20 may also be a so-called line printhead, and the liquid ejection device 11 may also be a line printhead printer.

[0147] In the above embodiment, the liquid collection device 43 may also omit the release portion 70 and the winding portion 72. In this case, for example, the housing 61 of the liquid collection device 43 may allow the strip member 60 to move along the Y-axis while supporting the strip member 60 in a flat plate shape along the XY plane. Additionally, the housing 61 may support the strip member 60 in a manner that allows it to contact the nozzle surface 40 of the liquid ejection portion 20.

[0148] In the above embodiments, the liquid ejection device 11 may also perform printing without ejecting ink from the liquid ejection section 20 onto the medium 14, which has been supplied with reaction liquid by the supply section RLS. In this case, for example, the liquid ejection device 11 may also supply reaction liquid to the medium 14, which has been printed by ejecting ink from the liquid ejection section 20. Alternatively, the liquid ejection device 11 may also not supply reaction liquid to the medium 14 when printing is performed by ejecting ink from the liquid ejection section 20 onto the medium 14.

[0149] In Embodiment 2 described above, the reaction liquid ejection section 20A may not be positioned in the -Y direction relative to the ink ejection section 20B. In this case, for example, the reaction liquid ejection section 20A may be positioned in the +Y direction relative to the ink ejection section 20B. Alternatively, for example, the reaction liquid ejection section 20A may be arranged side by side with a gap in the X direction relative to the ink ejection section 20B.

[0150] In Embodiment 2 described above, the liquid collection device 43 may also collect ink discharged from the ink nozzle 36B of the ink ejection section 20B without moving the housing 61 from the standby position to the receiving position corresponding to the ink ejection section 20B. In this case, for example, the liquid collection device 43 may also set the receiving position corresponding to the ink ejection section 20B to the standby position. In addition, for example, the liquid collection device 43 may also have a downstream region extending in the Y direction on the conveying path of the strip member 60, so that when the housing 61 is in the standby position, it can collect the reaction liquid discharged from the reaction liquid nozzle 36A of the reaction liquid ejection section 20A and the ink discharged from the ink nozzle 36B of the ink ejection section 20B.

Claims

1. A liquid ejection device, characterized in that, have: The liquid ejection section ejects liquid from the nozzles onto the medium for printing. A sheet-like absorbent component capable of absorbing the liquid; and The supply unit is capable of supplying the absorption component with a reaction liquid containing components that solidify the liquid. The absorption component is configured to have a receiving area and a contact area. The receiving area receives the liquid discharged as waste liquid from the nozzle, and the contact area contacts the liquid ejection portion when collecting the liquid by contacting the liquid ejection portion. The supply unit supplies the reaction liquid to the supply area in the absorption component located in the receiving area between the position furthest from the contact area and the contact area.

2. The liquid ejection device according to claim 1, characterized in that, The liquid ejection device also includes: The loosening part retains the absorbent component while it is rolled into a cylindrical shape; and The winding portion allows the absorbent member to be moved in the moving direction by winding it around the unwinding portion. The contact area is positioned upstream of the receiving area in the direction of movement.

3. The liquid ejection device according to claim 2, characterized in that, The supply area is located within the receiving area.

4. The liquid ejection device according to claim 2, characterized in that, The supply area is located between the receiving area and the contact area.

5. The liquid ejection device according to claim 1, characterized in that, The supply unit supplies the reaction liquid to the absorption unit before the liquid is discharged from the liquid ejection unit to the receiving area.

6. The liquid ejection device according to claim 1, characterized in that, The supply unit supplies the reaction solution to the absorption unit after the liquid is discharged into the receiving area by the liquid ejection unit.

7. The liquid ejection device according to claim 1, characterized in that, The supply unit includes a nozzle capable of spraying the reaction liquid, and the nozzle capable of spraying the reaction liquid is disposed in the liquid spraying unit.

8. The liquid ejection device according to claim 1, characterized in that, The liquid ejection device further includes a reaction liquid ejection section, which has a nozzle capable of ejecting the reaction liquid. The supply unit includes the reaction liquid ejection unit.

9. The liquid ejection device according to claim 7, characterized in that, When the nozzle that ejects the reaction liquid is designated as the reaction liquid nozzle, The absorption component is configured to allow the supply area to contact the reaction liquid nozzle area, which includes the opening of the reaction liquid nozzle. After the supply area comes into contact with the reaction liquid nozzle area, the liquid is discharged from the liquid ejection section to the receiving area.

10. The liquid ejection device according to claim 9, characterized in that, The supply area of ​​the absorption component comes into contact with the reaction liquid nozzle area when the reaction liquid is bulging out from the reaction liquid nozzle.

11. The liquid ejection device according to claim 2, characterized in that, The liquid ejection section ejects the liquid into the medium to which the reaction liquid has been supplied by the supply section for printing.

Citation Information

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