Substrate structure and method of manufacturing the same

Abstract

The present invention relates to a substrate structure and a method of manufacturing the same. The method includes forming a recess at the intersection of a side surface and a top surface of a substrate body including a circuit portion, and forming an antenna body in the recess such that the antenna body is coplanar with the side surface of the substrate body and exposed on the top surface of the substrate body, thereby improving the performance of the side surface antenna.

Description

TECHNICAL FIELD

[0001] The present invention relates to a semiconductor device, and in particular, to a substrate structure and a method of fabricating the same. BACKGROUND

[0002] Currently, wireless communication technology has been widely applied to various consumer electronic products to facilitate receiving or transmitting various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the requirements of lightness, thinness, shortness and smallness. Among them, side antennas are widely used in wireless communication modules of electronic products such as cell phones due to their small size, light weight and easy manufacturing.

[0003] As shown in Figure 1 The existing radio frequency module 1 arranges a plurality of radio frequency chips 11 on a packaging substrate 10, then stacks an antenna substrate 12 on the packaging substrate 10 through a conductive column 13, and covers each of the radio frequency chips 11 with a packaging glue 15. The antenna substrate 12 has an antenna layer 120 formed on its top surface 12a, and a side antenna 14 formed on its side surface 12c.

[0004] However, in the existing radio frequency module 1, the side antenna 14 needs to use laser drilling technology to form a hole on the side surface 12c of the antenna substrate 12, and then use photoresist and electroplated metal to fill the hole on the side surface 12c of the antenna substrate 12, so the manufacturing cost is extremely high, and the process time is long.

[0005] Furthermore, after electroplating metal, when the excess metal material on the side surface 12c of the antenna substrate 12 is cut off using a cutter, the cutter is easily worn out, resulting in increased manufacturing cost.

[0006] In addition, the side antenna 14 is not exposed on the top surface 12a of the antenna substrate 12, so the directivity or strength of signal transmission is hindered, resulting in difficulty in improving the antenna performance.

[0007] Therefore, how to overcome the various problems of the above-mentioned prior art has become a pressing issue to be solved at present. SUMMARY

[0008] In view of the various defects of the above-mentioned prior art, the present invention provides a substrate structure and a method of fabricating the same, which can improve the antenna performance.

[0009] The substrate structure of the present application comprises: a substrate body having opposite first and second surfaces and a side surface adjacent to the first and second surfaces, and a recess formed at the intersection of the first surface and the side surface, wherein the substrate body comprises a circuit portion; and an antenna body formed in the recess, wherein the antenna body is coplanar with the side surface of the substrate body and communicates with the first surface of the substrate body.

[0010] The present application also provides a method for manufacturing the substrate structure, comprising: providing a whole surface substrate comprising a plurality of substrate bodies, and the substrate body has opposite first and second surfaces, wherein the substrate body comprises a circuit portion; forming a recess at the intersection between any two adjacent substrate bodies, and the recess does not penetrate the substrate body; forming an antenna body in the recess; and performing a singulation process on the whole surface substrate corresponding to the recess to obtain a plurality of substrate structures, wherein the substrate body defines a side surface adjacent to the first and second surfaces, and the antenna body is coplanar with the side surface of the substrate body and communicates with the first surface of the substrate body.

[0011] In the aforementioned substrate structure and the manufacturing method thereof, the antenna body is electrically connected to the circuit portion.

[0012] In the aforementioned substrate structure and the manufacturing method thereof, the substrate body further comprises a ground portion electrically connected to the circuit portion. For example, the ground portion is formed by stacking a plurality of conductive bodies.

[0013] In the aforementioned substrate structure and the manufacturing method thereof, the substrate body further comprises an antenna structure corresponding to the antenna body, so that the antenna body and the antenna structure transmit signals in a coupled manner. For example, the antenna structure is formed by stacking a plurality of conductive bodies.

[0014] In the aforementioned substrate structure and the manufacturing method thereof, the substrate body further comprises at least one signal terminal communicating with the second surface and electrically connected to the circuit portion.

[0015] In the aforementioned substrate structure and the manufacturing method thereof, the substrate body further comprises at least one antenna portion communicating with the first surface and electrically connected to the circuit portion.

[0016] As can be seen from the above, in the substrate structure and the manufacturing method thereof of the present application, the antenna body is formed on the cutting path, so that after the singulation process, the antenna body is directly located on the side surface of the substrate body, and the antenna body communicates with the first surface of the substrate body and is coplanar with the side surface of the substrate body. Therefore, compared with the prior art, the present application not only has low manufacturing cost, but also can improve the antenna performance. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a cross-sectional view of a prior art radio frequency module.

[0018] Figures 2A-2E A cross-sectional view of another embodiment of the substrate structure.

[0019] Figure 3 A cross-sectional view of another embodiment of the substrate structure. Figure 2E A cross-sectional view of another embodiment of the substrate structure.

[0020] Reference numeral explanation

[0021] 1: Radio frequency module

[0022] 10: Package substrate

[0023] 11: Radio frequency chip

[0024] 12: Antenna substrate

[0025] 12a: Top surface

[0026] 12c, 20c: Side surface

[0027] 120: Antenna layer

[0028] 13: Conductive pillar

[0029] 14: Side surface antenna

[0030] 15: Package adhesive

[0031] 2, 3: Substrate structure

[0032] 2a: Substrate body

[0033] 20: Insulating portion

[0034] 20a: First surface

[0035] 20b: Second surface

[0036] 21: Circuit portion

[0037] 210: Circuit layer

[0038] 211: Conductive blind via

[0039] 22: Antenna portion

[0040] 220a, 220b: Signal terminal

[0041] 221: First antenna layer

[0042] 222: Second antenna layer

[0043] 23: Ground portion

[0044] 230, 250: Conductive body

[0045] 24, 34: Antenna body

[0046] 240: Concave portion

[0047] 25: antenna structure

[0048] 29: cutting portion

[0049] 7: machine drill

[0050] 8: whole surface substrate

[0051] 9: cutter

[0052] S: cutting path DETAILED DESCRIPTION

[0053] The present application will now be described by way of specific embodiments, from which its further scope and advantages will be readily apparent to those skilled in the art.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the drawings accompanying the present specification are merely intended to facilitate the understanding of the present specification disclosed, for the understanding and reading of those skilled in the art, and are not intended to limit the conditions for implementing the present application, and therefore do not have technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "left", "right", "first", "second", and "one" used in the present specification are only for the purpose of clear understanding, and are not intended to limit the scope of the present application, and the change or adjustment of the relative relationship without substantially changing the technical content is also considered as the scope of the present application.

[0055] Figures 2A-2E A cross-sectional schematic view of a method for manufacturing the substrate structure 2 of the present application.

[0056] As shown in Figure 2A , a whole surface substrate 8 including a plurality of substrate bodies 2a is provided, wherein the substrate body 2a is in the form of an antenna plate, including an insulating portion 20, a circuit portion 21, and an antenna portion 22.

[0057] In the present embodiment, the plurality of substrate bodies 2a are arranged in an array to define a cutting portion 29 at the interface of each substrate body 2a.

[0058] The insulating portion 20 has opposite first and second surfaces 20a and 20b, and includes at least one insulating layer.

[0059] In this embodiment, the insulating layer is made of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder mask such as green paint or ink.

[0060] The circuit portion 21 includes at least one circuit layer 210 formed on the insulating layer and a plurality of conductive blind vias 211 electrically connecting the circuit layer 210.

[0061] In this embodiment, the circuit layer 210 is a fan-out redistribution layer (RDL), and the circuit layer 210 is made of copper.

[0062] Furthermore, a ground portion 23 can be formed in the insulating portion 20 to connect the first surface 20a and the second surface 20b. For example, the ground portion 23 is formed by using the RDL process to stack a plurality of columnar or wall-shaped conductive bodies 230 in the insulating portion 20 in correspondence with the circuit layer 210.

[0063] In addition, an antenna structure 25 can be formed in the insulating portion 20 to connect the first surface 20a and the second surface 20b, so that the ground portion 23 is located between the antenna structure 25 and the antenna portion 22. For example, the antenna structure 25 is formed by using the RDL process to stack a plurality of columnar or wall-shaped conductive bodies 250 in the insulating portion 20 in correspondence with the circuit layer 210.

[0064] The antenna portion 22 includes a first antenna layer 221 and a second antenna layer 222 which are separated from each other and arranged in correspondence with the insulating layer.

[0065] In this embodiment, the first antenna layer 221 and the second antenna layer 222 transmit signals in a coupled manner, so the arrangement position of the first antenna layer 221 corresponds to the arrangement position of the second antenna layer 222. For example, the first antenna layer 221 is arranged on the upper side of the insulating layer (or the first surface 20a of the insulating portion 20), and the second antenna layer 222 is arranged on the lower side of the insulating layer (or the inner layer of the insulating portion 20) and is electrically connected to the circuit layer 210 via the conductive blind via 211, so the first antenna layer 221 and the second antenna layer 222 can generate radiated energy from alternating voltage, alternating current or radiation changes, and the radiated energy is an electromagnetic field, so that the first antenna layer 221 and the second antenna layer 222 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the first antenna layer 221 and the second antenna layer 222.

[0066] Alternatively, the antenna section 22 can be fabricated using methods such as sputtering, vaporization, electroplating, electroless electroplating, chemical plating, or foaming. For example, the antenna section 22 can be fabricated together with the circuit layer 210 using the RDL process.

[0067] In addition, the antenna section 22 also includes a signal terminal 220a, 220b that connects to the second surface 20b of the insulating section 20, i.e., a feed point, which is electrically connected to the line layer 210 via a conductive blind hole 211, so that a portion of the signal terminal 220a and the second antenna layer 222 can transmit signals through the line section 21.

[0068] like Figures 2B-2C As shown, at least one recess 240 is formed at the junction (or the cut portion 29) between the two substrate bodies 2a, and the recess 240 does not penetrate the substrate body 2a. Next, an antenna body 24, like a metal layer, is formed along the surface of the recess 240, such that the placement position of the antenna body 24 corresponds to the placement position of the antenna structure 25, so that the antenna body 24 and the antenna structure 25 transmit signals in a coupled manner.

[0069] In this embodiment, drilling is used (e.g., Figure 2B The drill 7 shown forms the recess 240 at the junction between the first surfaces 20a of the two substrate bodies 2a, and the recess 240 does not connect to the second surface 20b of the substrate body 2a.

[0070] Furthermore, the antenna body 24 does not need to completely fill the recess 240. Alternatively, the antenna body 24 can fill the recess 240 as needed.

[0071] like Figure 2D As shown, a single-piece cutting process is performed on the entire substrate 8 along the cutting path S (i.e., at the location corresponding to the recess 240 or the cutting portion 29) to obtain multiple substrate structures 2, such as... Figure 2E As shown, the substrate body 2a (or insulating portion 20) defines a side surface 20c adjacent to the first surface 20a and the second surface 20b.

[0072] In this embodiment, the antenna body 24 is formed on the side 20c of the substrate body 2a and is connected to or exposed on the first surface 20a of the substrate body 2a to serve as a side antenna, and the antenna body 24 and the side 20c of the substrate body 2a are coplanar.

[0073] Furthermore, the signal terminals 220b are electrically connected to the antenna structure 25 via the circuit portion 21 to transmit signals to the antenna body 24. For example, signals are transmitted from the signal terminals 220b at the leftmost and / or rightmost sides of the second surface 20b of the substrate body 2a to the antenna structure 25 via the circuit portion 21 and the ground portion 23, so that the antenna structure 25 inductively transmits the signals to the antenna body 24 on the side surface 20c of the substrate body 2a.

[0074] In addition, in other embodiments, as shown in the substrate structure 3 of Figure 3 the antenna structure 25 can be omitted, so that the signal terminals 220b are electrically connected to the antenna body 34 via the circuit portion 21. For example, signals are transmitted from the signal terminals 220b at the leftmost and / or rightmost sides of the second surface 20b of the substrate body 2a to the antenna body 34 on the side surface 20c of the substrate body 2a.

[0075] Therefore, the manufacturing method of the substrate structure of the present application forms the recess 240 on the cutting path S, so that the antenna body 24, 34 is formed on the side surface 20c of the substrate body 2a after the singulation process. Compared with the prior art, the manufacturing method of the present application does not need to perform the complicated laser drilling, resist layer coating, metal plating and other related processes after the singulation process, so that the manufacturing cost is greatly reduced and the process time is greatly shortened.

[0076] Furthermore, the manufacturing method of the substrate structure of the present application can remove the excess metal material in the recess 240 by using the cutting tool 9 during the singulation process, as shown in Figure 2D so that the antenna body 24, 34 is coplanar with the side surface 20c of the substrate body 2a. Therefore, the cutting tool 9 does not need to be used in the subsequent processes, so that the wear of the cutting tool 9 is reduced, thereby reducing the manufacturing cost.

[0077] In addition, the antenna body 24, 34 is coplanar with the side surface 20c of the substrate body 2a and is connected to or exposed on the first surface 20a of the substrate body 2a, so that the directivity or strength of signal transmission is increased, thereby improving the antenna performance.

[0078] The present application also provides a substrate structure 2, 3, which comprises a substrate body 2a and at least one antenna body 24, 34 arranged on the side surface 20c of the substrate body 2a.

[0079] The substrate body 2a has opposite first and second surfaces 20a, 20b and a side surface 20c adjacent to the first and second surfaces 20a, 20b, and at least one recess 240 in the form of a step is formed at the junction of the first surface 20a and the side surface 20c. The substrate body 2a comprises a circuit portion 21.

[0080] The antenna body 24, 34 is formed in the recess 240 and communicates with the first surface 20a of the substrate body 2a, wherein the antenna body 24 is coplanar with the side surface 20c of the substrate body 2a and communicates with the first surface 20a of the substrate body 2a.

[0081] In an embodiment, the antenna body 24, 34 is electrically connected to the circuit portion 21.

[0082] In an embodiment, the substrate body 2a further comprises a ground portion 23 electrically connected to the circuit portion 21. For example, the ground portion 23 is formed by stacking a plurality of conductive bodies 230.

[0083] In an embodiment, the substrate body 2a further comprises an antenna structure 25 corresponding to the antenna body 24, such that the antenna body 24 and the antenna structure 25 transmit signals in a coupled manner. For example, the antenna structure 25 is formed by stacking a plurality of conductive bodies 250.

[0084] In an embodiment, the substrate body 2a further comprises at least one signal terminal 220a, 220b communicating with the second surface 20b and electrically connected to the circuit portion 21.

[0085] In an embodiment, the substrate body 2a further comprises at least one antenna portion 22 communicating with the first surface 20a and electrically connected to the circuit portion 21.

[0086] In summary, the substrate structure and the manufacturing method thereof of the present application form a recess on a cutting path and fill a metal layer, so as to directly form an antenna body on a side surface of a substrate body after a singulation process, and make the antenna body communicate with a first surface of the substrate body and be coplanar with a side surface of the substrate body. Therefore, the substrate structure of the present application not only has low manufacturing cost, but also improves antenna performance.

[0087] The above embodiments are only used to illustrate the principles and effects of the present application, but not used to limit the present application. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application should be subject to the claims.

Claims

1. A substrate structure, characterized by, The substrate body has opposite first and second surfaces and a side surface adjacent to the first and second surfaces, wherein the substrate body includes a circuit portion, and a recess is formed at an intersection of the first surface and the side surface and does not penetrate the substrate body; and An antenna body is formed in the recess that does not penetrate the substrate body, wherein the antenna body in the recess that does not penetrate the substrate body is coplanar with the side surface of the substrate body including the circuit portion and communicates the first surface of the substrate body. The antenna body is electrically connected to the circuit portion.

2. The substrate structure of claim 1, wherein, The substrate body further includes a ground portion electrically connected to the circuit portion.

3. The substrate structure of claim 1, wherein, The ground portion is formed by stacking a plurality of conductive bodies.

4. The substrate structure of claim 3, wherein, The substrate body further includes an antenna structure corresponding to the antenna body, such that the antenna body and the antenna structure transmit signals in a coupled manner.

5. The substrate structure of claim 1, wherein, The antenna structure is formed by stacking a plurality of conductive bodies.

6. The substrate structure of claim 5, wherein, The substrate body further includes at least one signal terminal communicating the second surface and electrically connected to the circuit portion.

7. The substrate structure of claim 1, wherein, The substrate body further includes at least one antenna portion communicating the first surface and electrically connected to the circuit portion.

8. The substrate structure of claim 1, wherein, The substrate body has opposite first and second surfaces and a side surface adjacent to the first and second surfaces, wherein the substrate body includes a circuit portion, and a recess is formed at an intersection of the first surface and the side surface and does not penetrate the substrate body; and 9. A method of fabricating a substrate structure, the method comprising: An antenna body is formed in the recess that does not penetrate the substrate body, wherein the antenna body in the recess that does not penetrate the substrate body is coplanar with the side surface of the substrate body including the circuit portion and communicates the first surface of the substrate body. The antenna body is electrically connected to the circuit portion. The substrate body further includes a ground portion electrically connected to the circuit portion. The ground portion is formed by stacking a plurality of conductive bodies. The substrate body further includes an antenna structure corresponding to the antenna body, such that the antenna body and the antenna structure transmit signals in a coupled manner.

10. The method of claim 9, wherein the substrate structure is a semiconductor substrate structure. The antenna structure is formed by stacking a plurality of conductive bodies.

11. The method of claim 9, wherein the substrate structure is a semiconductor substrate structure. The substrate body further includes at least one signal terminal communicating the second surface and electrically connected to the circuit portion.

12. The method of claim 11, wherein the substrate structure is a semiconductor substrate structure. The substrate body further includes at least one antenna portion communicating the first surface and electrically connected to the circuit portion.

13. The method of claim 9, wherein the substrate structure is a semiconductor substrate structure. ​ 14. The method for manufacturing the substrate structure as described in claim 13, characterized in that, ​ 15. The method of claim 9, wherein the substrate structure is a semiconductor substrate structure. ​ 16. The method of claim 9, wherein the substrate structure is a semiconductor substrate structure. ​

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