A multi-dimensional large-sized scintillation crystal array and a manufacturing method thereof
The splicing fixture is produced through 3D printing technology, and high-precision assembly of inconsistent crystal units in the scintillation crystal array is achieved, which solves the problems of low yield and serious waste in the existing technology, and improves the production efficiency and yield.
Patent Information
- Application Number
- CN202211509453.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-29
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2042-11-29
AI Technical Summary
The existing scintillation crystal array processing methods have problems such as difficulty in recycling and utilization of operational errors, serious waste of edge crystals, and inability to deal with inconsistent crystal cell sizes, and the application of multi-wire cutting machines and scribers is limited.
The splicing fixture is made using 3D printing technology, and the crystal units are inserted and bonded vertically according to the design drawings through the splicing fixture, and then the reflective glue is sealed and ground to complete the production of the scintillation crystal array.
High-precision assembly with inconsistent crystal cell sizes is achieved, yield and production efficiency are improved, and waste of crystal cell is reduced.
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Figure CN115718320B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of scintillation crystal arrays, and particularly relates to a multi-dimensional large-size scintillation crystal array and a manufacturing method thereof. Background Art
[0002] Scintillation detectors are one of the commonly used detectors for high-energy ray detection. Scintillation detectors usually use scintillation crystals that can effectively block and absorb electromagnetic wave radiation and generate luminescence with electromagnetic wave radiation as detection materials. When high-energy rays enter the scintillation crystal, according to the different ray energies, effective atomic numbers and densities of the crystals, different proportions of photoelectric effect, Compton scattering effect and pair production effect occur with the crystal, depositing energy in the scintillation crystal, and the excited scintillation crystal emits scintillation light. Scintillation detectors have the characteristics of high detection efficiency and short resolution, and are widely used in the fields of nuclear medicine, security inspection, high-energy physics and cosmic ray detection, etc.
[0003] The key component in a scintillation crystal detector is the scintillation crystal array. The scintillation crystal array is composed of several crystal units and reflective glue. Five sides of the scintillation crystal array are reflective glue layers, and the other side is the light-emitting surface. Currently, scintillation crystal arrays usually adopt conventional array processing methods such as grooving the crystal with a multi-wire cutting machine or a dicing machine, and then encapsulating the reflective glue. However, when using a multi-wire cutting machine and a dicing machine, there are the following problems: First, due to mechanical reasons, once an operation error occurs, the material cannot be recycled, which will inevitably affect the yield; Second, the sizes of the crystal units in the horizontal and / or vertical directions of the scintillation crystal array obtained by using a multi-wire cutting machine are the same, and a large whole crystal is required, resulting in serious waste of the edge crystals, which is very uneconomical. When the sizes or gaps of the crystal units in the horizontal X or / and vertical Y directions in the scintillation crystal array are inconsistent, a multi-wire cutting machine cannot be used for processing; The grooving method of the multi-wire cutting machine is only used in a small number of scientific research projects; Third, the dicing machine can only meet the grooving of crystals with a depth of less than 5 mm. Summary of the Invention
[0004] Aiming at the above deficiencies existing in the prior art, the purpose of the present invention is to provide a multi-dimensional large-size scintillation crystal array and a manufacturing method thereof. This manufacturing method can manufacture a scintillation crystal array with inconsistent sizes of crystal units in the horizontal X or / and vertical Y directions and unlimited height, with high precision and high efficiency, and can also improve the yield.
[0005] The technical solution of the present invention is realized as follows:
[0006] A manufacturing method of a multi-dimensional large-size scintillation crystal array specifically includes the following steps:
[0007] S1: Fabricate a splicing fixture according to the scintillation crystal array to be fabricated. The splicing fixture includes a horizontally arranged support plate. There are several rectangular frames on the support plate that correspond one by one to the crystal units of the scintillation crystal array to be fabricated. Four support legs are provided below the support plate, and the four support legs are respectively arranged at the four corners of the support plate;
[0008] S2: Select several crystal units within the tolerance range of -0.02 mm according to the scintillation crystal array to be fabricated for standby;
[0009] S3: Place the splicing fixture on a horizontal gasket, or place a horizontal gasket below the splicing fixture and make the horizontal gasket located inside the four support legs. Insert all the crystal units vertically into the corresponding rectangular frames of the splicing fixture from top to bottom in sequence, and evenly apply an adhesive on the horizontal gasket so that the crystal units are adhesively fixed to the horizontal gasket;
[0010] S4: After the adhesive is cured, take out the splicing fixture or heat and dissolve the splicing fixture; then pour and seal the reflective glue, and then grind the peripheral reflective glue, thereby completing the grinding of the reflective glue layer;
[0011] S5: Grind the horizontal gasket, and perform grinding and polishing according to the design drawing of the scintillation crystal array, thereby completing the grinding and polishing of the light-emitting surface, and further completing the fabrication of the scintillation crystal array.
[0012] Further, the splicing fixture is fabricated by using 3D printing technology.
[0013] Further, in S3, at least two splicing fixtures are placed on the horizontal gasket, and all the splicing fixtures are stacked vertically; there are four downwardly concave limiting grooves on the upper surface of the support plate, and the four limiting grooves are arranged corresponding to the four support legs one by one, which is convenient for the four support legs of the splicing fixture located above to be respectively inserted into the corresponding limiting grooves, so as to be placed on the splicing fixture located below.
[0014] Further, the reflective glue is composed of titanium dioxide and epoxy resin.
[0015] Further, the adhesive is UV glue.
[0016] Further, the splicing fixture is made of a material with a melting temperature lower than the softening temperature of the UV glue.
[0017] Further, if the splicing fixture is removed by heating and dissolving the splicing fixture, first soak it in acetone, then rinse it with an organic solvent to remove the residue of the splicing fixture completely, and finally dry it.
[0018] If the splicing fixture is removed by taking out the splicing fixture, first rinse it with absolute ethanol, and then dry it.
[0019] Further, the organic solvent is one of absolute ethanol, acetone or gasoline.
[0020] Further, the reflective glue is filled and sealed in two times and the peripheral reflective glue is ground. The specific method is as follows: first, the reflective glue on three sides is filled and sealed, and grinding is carried out with the other two sides as the reference planes, so as to complete the grinding of three reflective glue layers; then, the reflective glue on the other two sides is filled and sealed, and grinding is carried out on the other two sides with the ground reflective glue layers as the reference planes, so as to complete the grinding of the other two reflective glue layers.
[0021] The present invention also provides a multi-dimensional large-size scintillation crystal array, which is manufactured by using the manufacturing method described above.
[0022] Compared with the prior art, the present invention has the following beneficial effects:
[0023] 1. The assembling fixture of the present invention is manufactured by using 3D printing technology, with low cost, and can effectively manufacture according to the to-be-manufactured scintillation crystal array, so that it can be used to manufacture a scintillation crystal array with inconsistent lateral X or / and longitudinal Y dimensions and a height greater than 5 mm of crystal units, and has high precision.
[0024] When using the assembling fixture to assemble the to-be-manufactured scintillation crystal array, the perpendicularity of each crystal unit can be effectively guaranteed, and further the manufacturing precision of the scintillation crystal array can be guaranteed.
[0025] 2. Compared with the conventional array processing methods such as using a multi-wire cutting machine and a dicing machine to cut grooves on a crystal, the present invention can effectively improve the yield, because even if the assembled scintillation crystal array is unqualified after inspection, the crystal units of the scintillation crystal array can be all recycled, and there is no loss of crystal units.
[0026] 3. When using the assembling fixture of the present invention to manufacture a scintillation crystal array, the operation is simple, and the manufacturing efficiency can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 - Top view of the to-be-manufactured scintillation crystal array in the embodiment.
[0028] Figure 2 - Schematic diagram of crystal unit assembly.
[0029] Wherein: 1-assembling fixture; 2-horizontal gasket; 3-crystal unit. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.
[0031] See Figure 1 and Figure 2, A method for manufacturing a multi-dimensional large-sized scintillation crystal array, specifically including the following steps:
[0032] S1: According to the scintillation crystal array to be manufactured, fabricate the splicing fixture 1. The splicing fixture 1 includes a horizontally arranged support plate. There are several rectangular frames on the support plate that correspond one-to-one with the crystal units 3 of the scintillation crystal array to be manufactured. Four support legs are provided below the support plate, and the four support legs are respectively located at the four corners of the support plate;
[0033] In this embodiment, the top view of the scintillation crystal array to be manufactured is as Figure 1 shown. This scintillation crystal array includes crystal units 3 of three sizes: 4.50×5.00×30mm 3 , 5.00×5.00×30mm 3 , 4.85×5.00×30mm 3 And there are two kinds of gaps of 015mm and 0.20mm between rows. Of course, the scintillation crystal array to be manufactured in this embodiment is only one example. In actual applications, the corresponding scintillation crystal array to be manufactured can be designed according to specific applications. When manufacturing the corresponding scintillation crystal array, the splicing fixture can be fabricated in advance according to the corresponding scintillation crystal array. Then, the selected crystal units can be of various specifications, and the gap between rows can also be of one size or two or more sizes.
[0034] S2: Select several crystal units within the tolerance range of -0.02mm according to the scintillation crystal array to be manufactured and set them aside for use;
[0035] Select the crystal units with dimensions within the tolerance range of -0.02mm, then wipe them with alcohol and set them aside for use.
[0036] S3: Place the splicing fixture 1 on the horizontal gasket 2, or place the horizontal gasket 2 under the splicing fixture 1 and make the horizontal gasket 2 located inside the four support legs. Insert all the crystal units 3 vertically into the corresponding rectangular frames of the splicing fixture 1 from top to bottom in sequence, and evenly apply adhesive on the horizontal gasket 2 so that the crystal units 3 are bonded and fixed to the horizontal gasket 2;
[0037] Whether to place the splicing fixture on the horizontal gasket is not important. The main thing is to use the splicing fixture to position the crystal units and ensure the perpendicularity of the manufactured scintillation crystal array. As Figure 2 shown, the horizontal gasket is placed under the splicing fixture and located inside the four support legs. Here, the support plate of the splicing fixture has a certain thickness, which can accurately position the crystal units and ensure the perpendicularity of the crystal units.
[0038] The horizontal spacer here can be a glass spacer or a spacer made of other materials. In this embodiment, a glass spacer is used mainly because glass spacers are easily available, inexpensive, and convenient for subsequent grinding.
[0039] S4: After the bonding adhesive cures, remove the splicing fixture or heat it to dissolve the splicing fixture; then fill and seal the reflective adhesive, and grind the peripheral reflective adhesive according to the scintillation crystal array to be fabricated, thereby completing the grinding of the reflective adhesive layer.
[0040] Generally, the splicing fixture is made of smooth materials such as red wax and acrylic, which facilitates inserting the crystal unit into the rectangular frame of the splicing fixture. At the same time, after the bonding adhesive cures, it is also convenient to remove the splicing fixture from between the bonded crystal units, and it can reduce or avoid damage to the crystal units caused by the splicing fixture. The removed splicing fixture can be reused.
[0041] At the same time, if the splicing fixture is made of materials such as ABS, its dissolution temperature is lower than the softening temperature of the adhesive. When the splicing fixture is heated, it can be effectively dissolved and removed without affecting the bonding effect of the adhesive on the crystal units.
[0042] S5: Grind the horizontal spacer, and grind and polish it according to the scintillation crystal array to be fabricated, thereby completing the grinding and polishing of the light-emitting surface, and further completing the fabrication of the scintillation crystal array.
[0043] Specifically, when implemented, the splicing fixture 1 is fabricated by 3D printing technology.
[0044] The 3D printing technology has low cost and can accurately print according to the specific scintillation crystal array to be fabricated, ensuring the fabrication accuracy of the scintillation crystal array.
[0045] Specifically, when implemented, at least two splicing fixtures 1 are placed on the horizontal spacer, and all the splicing fixtures 1 are stacked vertically; the upper surface of the support plate has four downwardly concave limiting grooves, and the four limiting grooves are arranged in one-to-one correspondence with the four support legs, facilitating the four support legs of the splicing fixture 1 located above to be respectively inserted into the corresponding limiting grooves, so as to be placed on the splicing fixture 1 located below.
[0046] Setting two or more splicing fixtures can further improve the splicing accuracy of the scintillation crystal array and ensure the perpendicularity of each crystal unit.
[0047] Specifically, when implemented, the reflective adhesive is composed of titanium dioxide and epoxy resin.
[0048] The reflective adhesive prepared by mixing titanium dioxide and epoxy resin has good fluidity, can effectively ensure the uniformity of the distribution of the reflective adhesive layer in the fabricated scintillation crystal array, and improve the fabrication quality.
[0049] Specifically, when implemented, the bonding adhesive is UV glue.
[0050] Adopt UV glue. During the curing process, ultraviolet light irradiation can be used to accelerate the curing rate, improve the assembly efficiency, and further improve the production efficiency.
[0051] During specific implementation, the splicing fixture 1 is made of a material with a melting temperature lower than the softening temperature of the UV glue.
[0052] During specific implementation, if the splicing fixture is removed by heating and dissolving the splicing fixture, first soak it in acetone, then rinse it with an organic solvent to completely remove the residue of the splicing fixture, and finally dry it.
[0053] If the splicing fixture is removed by taking out the splicing fixture, first rinse it with absolute ethanol and then dry it.
[0054] During specific implementation, the organic solvent is one of absolute ethanol, acetone or gasoline.
[0055] During specific implementation, the reflective glue is sealed and filled in two times, and the outer periphery of the reflective glue is ground. The specific method is as follows: first seal and fill the reflective glue on three sides, and grind with the other two sides as the reference surfaces to complete the grinding of the three reflective glue layers; then seal and fill the reflective glue on the other two sides, and grind the other two sides with the ground reflective glue layers as the reference surfaces to complete the grinding of the other two reflective glue layers.
[0056] Finally, it should be noted that the above embodiments of the present invention are only examples for explaining the present invention, and are not limitations on the implementation modes of the present invention. For those of ordinary skill in the art, other different forms of changes and modifications can be made on the basis of the above description. It is impossible to list all the implementation modes here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.
Claims
1. A method for fabricating a multi-dimensional large-size scintillation crystal array, characterized in that, Specifically, it includes the following steps: S1: According to the scintillation crystal array to be fabricated, a splicing fixture is fabricated by using 3D printing technology. The splicing fixture includes a horizontally arranged support plate, on which there are a number of rectangular frames corresponding one by one to the crystal units of the scintillation crystal array to be fabricated. Four support legs are provided below the support plate, and the four support legs are respectively arranged at the four corners of the support plate; S2: Select a number of crystal units within the tolerance range of -0.02 mm according to the scintillation crystal array to be fabricated for standby; S3: Place the splicing fixture on a horizontal gasket, or place a horizontal gasket under the splicing fixture and make the horizontal gasket located inside the four support legs. Insert all the crystal units vertically into the corresponding rectangular frames of the splicing fixture from top to bottom in sequence, and evenly apply an adhesive on the horizontal gasket so that the crystal units are adhesively fixed to the horizontal gasket; S4: After the adhesive is cured, take out the splicing fixture or heat and dissolve the splicing fixture; then encapsulate the reflective glue, and then grind the peripheral reflective glue, thereby completing the grinding of the reflective glue layer; S5: Grind the horizontal gasket, and perform grinding and polishing according to the design drawing of the scintillation crystal array, thereby completing the grinding and polishing of the light-emitting surface, and further completing the fabrication of the scintillation crystal array; In S3, at least two splicing fixtures are placed on the horizontal gasket, and all the splicing fixtures are stacked vertically. The upper surface of the support plate has four downwardly concave limiting grooves, and the four limiting grooves are arranged corresponding to the four support legs respectively, which is convenient for the four support legs of the splicing fixture located above to be respectively inserted into the corresponding limiting grooves, so as to be placed on the splicing fixture located below; The reflective glue is encapsulated and the peripheral reflective glue is ground in two times. The specific method is: first encapsulate the reflective glue on three sides, and grind with the other two sides as the reference surfaces, thereby completing the grinding of the three reflective glue layers; then encapsulate the reflective glue on the other two sides, and grind the other two sides with the ground reflective glue layer as the reference surface, thereby completing the grinding of the other two reflective glue layers.
2. The method for fabricating a multi-dimensional large-size scintillation crystal array according to claim 1, characterized in that, The reflective glue is composed of titanium dioxide and epoxy resin.
3. The method for fabricating a multi-dimensional large-size scintillation crystal array according to claim 1, characterized in that, The adhesive is UV glue.
4. The method for fabricating a multi-dimensional large-size scintillation crystal array according to claim 3, characterized in that, The splicing fixture is made of a material with a melting temperature lower than the softening temperature of the UV glue.
5. The method for fabricating a multi-dimensional large-size scintillation crystal array according to claim 1 or 4, characterized in that, If the splicing fixture is removed by heating and dissolving the splicing fixture, first soak it with acetone, then rinse it with an organic solvent to remove the residue of the splicing fixture completely, and finally dry it; If the splicing fixture is removed by taking out the splicing fixture, first rinse it with absolute ethanol, and then dry it.
6. The method for fabricating a multi-dimensional large-size scintillation crystal array according to claim 5, characterized in that, The organic solvent is one of absolute ethanol, acetone or gasoline.
7. A multi-dimensional large-size scintillation crystal array, characterized in that, It is fabricated by using the fabrication method described in any one of claims 1 to 6.
Citation Information
Patent Citations
Scintillation crystal array and scintillation crystal array packaging method
CN107290771A
Method for manufacturing vacuum centrifugal scintillation crystal array
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