Method of manufacturing a package and package

Abstract

The application discloses a packaging piece manufacturing method and a packaging piece. The packaging piece manufacturing method comprises the following steps: installing a pre-ball mounting tool with a through hole on one side of a substrate, and making the through hole face the substrate; implanting a first tin ball into the through hole, and reflowing the first tin ball to form a tin column; separating the pre-ball mounting tool from the tin column; plastic packaging the side of the substrate provided with the tin column to form a plastic packaging body, and making the height of the tin column not lower than the height of the plastic packaging body; and implanting a second tin ball into the side of the tin column away from the substrate. According to the technical scheme, the pre-ball mounting tool with the through hole is first installed, the first tin ball is implanted into the through hole and reflowed to form the tin column, the tin column can occupy a smaller area of the substrate relative to a tin ball with the same height, and the density of the tin column on the substrate can be increased. By making the height of the tin column not lower than the height of the plastic packaging body, the tin column can be directly exposed, so that the second tin ball can be accurately implanted on the tin column.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging, and in particular to a method for manufacturing a package and a package manufactured using the method. Background Art

[0002] In order for the package to be able to connect to the finished upper device, it is usually necessary to implant a tin ball. One side of the tin ball is connected to the substrate of the package, and the other side is connected to the finished upper device. The traditional method of manufacturing a package is usually to first implant the tin ball on the substrate for the first time, then perform plastic sealing, then open a hole in the plastic seal to reveal the first implanted tin ball, and finally implant the tin ball a second time in the hole. However, such a manufacturing method requires the size of the tin ball to be larger for the first implant. Otherwise, it will be difficult to leak the tin ball during the hole opening process, resulting in the risk of the hole position shifting, affecting the product's welding performance; and due to the instability of the hole opening process, when the tin ball is implanted for the second time, the surface of the ball planting area is uneven, and there are small residues that are difficult to clean, which causes impurities to be mixed into the tin ball after reflow, affecting the subsequent welding performance. Summary of the Invention

[0003] The main purpose of the present invention is to provide a method for manufacturing a package, aiming to improve the problem of positional deviation of openings of a plastic part on the package.

[0004] To achieve the above-mentioned object, the present invention provides a method for manufacturing a package, comprising:

[0005] Installing a pre-ball implantation tool with a through hole on one side of the substrate, with the through hole facing the substrate;

[0006] implanting a first solder ball into the through hole, and reflowing the first solder ball to form a solder pillar;

[0007] Separating the pre-ball implant from the tin pillar;

[0008] Plastic-sealing the side of the substrate provided with the tin pillar to form a plastic-sealed body, and ensuring that the height of the tin pillar is not less than the height of the plastic-sealed body;

[0009] A second solder ball is implanted into a side of the solder pillar facing away from the substrate.

[0010] In one embodiment, the pre-ball-planting tool is detached from the tin pillar in a manner that is along the height direction of the tin pillar and away from the substrate.

[0011] In one embodiment, the diameter of the through hole gradually decreases from an end close to the substrate to an end far away from the substrate.

[0012] In one embodiment, after the step of detaching the pre-ball implant tool from the tin pillar, the step further includes: rinsing the tin pillar.

[0013] In one embodiment, after the step of flushing the tin pillar, the method further includes: holding the injection mold against the side of the tin pillar facing away from the substrate, so that when the substrate is plastic-sealed, the plastic-sealed body is restricted to flow between the limiting plate and the substrate.

[0014] In one embodiment, before the step of disposing a pre-ball placement tool with a through hole on one side of the substrate and orienting the through hole toward the substrate, the method further includes: wetting the inner wall of the through hole of the pre-ball placement tool.

[0015] In one embodiment, before the step of implanting the first solder ball into the through hole and performing reflow, the method further includes: covering the area outside the pre-ball implantation tooling.

[0016] In one embodiment, after the step of plastic-sealing the side of the substrate provided with the pre-ball-implanting tooling to form a plastic-sealed body and ensuring that the height of the tin column is not lower than the height of the plastic-sealed body, the step further includes: opening a hole in the plastic-sealed body according to the position of the tin column, and ensuring that the inner wall of the hole surrounds the tin column.

[0017] The present invention also proposes a package, which is a package manufactured based on the above-mentioned package manufacturing method, and includes a substrate, a tin column and a plastic packaging body, wherein the tin column is arranged on one side of the substrate; the plastic packaging body encapsulates the side of the substrate provided with the tin column, the plastic packaging body wraps the side wall of the tin column, and the side of the tin column facing away from the substrate is flush with the plastic packaging body or exposed outside the plastic packaging body.

[0018] In one embodiment, the radial dimension of the tin pillar gradually decreases from a side close to the substrate to a side far away from the substrate.

[0019] The present invention's technical solution involves installing a pre-ball placement tool with a through-hole on one side of a substrate, with the through-hole facing the substrate. A first solder ball is then implanted into the through-hole and reflowed to form a tin pillar. This allows the tin pillar to occupy a smaller area of ​​the substrate than a solder ball of the same height, thereby enabling more tin pillars to be implanted on the substrate and ensuring a higher density of tin pillars. After the first solder ball is reflowed and the tin pillars are formed, the pre-ball placement tool is detached from the tin pillars, further reducing the space occupied by the pre-ball placement tool on the substrate and thereby increasing the density of tin pillars on the substrate. Furthermore, by plastic-sealing one side of the substrate on which the tin column is provided and forming a plastic-sealed body, the height of the tin column is not lower than the height of the plastic-sealed body. Therefore, the upper surface of the tin column can be directly exposed after the plastic-sealing process is completed, thereby reducing the process steps of opening or grinding and improving production efficiency; and it also provides a good implantation reference for the subsequent implantation of the second tin ball on the tin column, ensuring that the second tin ball can be accurately implanted on the side of the tin column away from the substrate, avoiding the risk of implantation misalignment, and thus ensuring that the second tin ball has good welding performance; in addition, it can also avoid the risk of fine residue on the surface of the tin column due to the traditional hole-opening process affecting the subsequent welding performance with the second tin ball, and avoid the risk of uneven surface of the tin column due to the traditional hole-opening process, which in turn leads to height mismatch of the welding area in the subsequent process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0021] Figure 1 1 is a flow chart of an embodiment of a method for manufacturing a package according to the present invention;

[0022] Figure 2 FIG1 is a flow chart of another embodiment of a method for manufacturing a package according to the present invention;

[0023] Figure 3 A schematic flow chart of another embodiment of a method for manufacturing a package of the present invention;

[0024] Figure 4 Schematic diagram of a process of another embodiment of a method for manufacturing a package of the present invention;

[0025] Figure 5 A schematic flow chart of another embodiment of a method for manufacturing a package according to the present invention;

[0026] Figure 61 is a schematic structural diagram of step 10 in the method for manufacturing a package of the present invention;

[0027] Figure 7 Schematic diagram of the process of implanting the first solder ball into the through hole in step 30 of the method for manufacturing the package of the present invention;

[0028] Figure 8 Schematic diagram of the state structure after executing step 50 in the method for manufacturing a package of the present invention;

[0029] Figure 9 70 is a schematic structural diagram of the method for manufacturing a package according to the present invention;

[0030] Figure 10 Schematic diagram of the structure of step 90 in the method for manufacturing a package of the present invention;

[0031] Figure 11 Schematic diagram of the structure of step 20 in the method for manufacturing a package of the present invention.

[0032] Description of Figure Numbers:

[0033] Label name Label name 100 substrate 200a First solder ball 200b tin pillars 300 Pre-balling tooling 310 Through hole 400 Plastic package 500 Second solder ball

[0034] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] The present invention provides a method for manufacturing a package.

[0039] In the embodiments of the present invention, please refer to Figures 1 to 10 , the method for manufacturing the package includes:

[0040] Step 10: Install a pre-ball placement tool 300 with a through hole 310 on one side of the substrate 100 , with the through hole 310 facing the substrate 100 .

[0041] When installing the pre-balling tool 300 having a through hole 310 on one side of the substrate 100, it can be installed and fixed by plugging or magnetic attraction. The pre-balling tool 300 has a through hole 310, which makes it easy to place the solder ball into the through hole 310 and limit the solder ball. Since the solder ball needs to be soldered to the substrate 100, the through hole 310 of the pre-balling tool 300 needs to be set towards the substrate 100, so that after the solder ball is placed in the through hole 310, it can be connected to the substrate 100 during the high-temperature reflow process.

[0042] Step 30: implanting the first solder ball 200 a into the through hole 310 and reflowing the first solder ball 200 a to form a solder pillar 200 b.

[0043] The shape of the through hole 310 can be cylindrical. It should be noted that the cylindrical shape mentioned in the present invention refers to a shape in which the dimension in the height direction is greater than the dimension in the length direction and the width direction. For example, it can be a cylindrical or prism shape with the same area of ​​the top and bottom surfaces, or a truncated cone or prism shape with different areas of the top and bottom surfaces. After the first solder ball 200a is implanted into the through hole 310 and the first solder ball 200a is reflowed, the first solder ball 200a is in a molten state and fills the through hole 310. Therefore, under the limiting effect of the hole wall of the through hole 310 of the pre-ball implantation tool 300, the shape of the molten solder ball after cooling is consistent with the shape of the through hole 310. When the through hole 310 is a cylindrical hole, the molten solder ball will also form a solder column 200b after cooling. The diameter of the first solder ball 200a needs to be smaller than or equal to the diameter of the opening of the through-hole 310 facing away from the substrate 100. This configuration facilitates the placement of the first solder ball 200a into the through-hole 310. Specifically, depending on the required volume of the through-hole 310 and the diameter of the first solder ball 200a, the number of first solder balls 200a placed in the through-hole 310 can be one, two, or more, as long as the number of implanted first solder balls 200a is sufficient to nearly fill the through-hole 310 after reflow.

[0044] Step 50: Separate the pre-ball implant tool 300 from the tin pillar 200b.

[0045] After the first solder ball 200a is reflowed, the first solder ball 200a implanted in the pre-ball implantation tooling 300 becomes a solder pillar 200b. At this time, the pre-ball implantation tooling 300 no longer has a significant effect on the solder pillar 200b. Therefore, by separating the pre-ball implantation tooling 300 from the solder pillar 200b, that is, the demolding process, it is possible to avoid the pre-ball implantation tooling 300 occupying a certain volume on the final package, thereby allowing the distance between two adjacent solder pads in the area where the ball implantation is required on the substrate 100 to be set smaller, which will also make the density of the solder balls finally formed on the package higher.

[0046] Specifically, during the demolding process, the pre-ball placement tool 300 can be demolded in a direction perpendicular to the substrate 100. Alternatively, the pre-ball placement tool 300 can include two separate molds that open and close parallel to the substrate 100. In this case, the pre-ball placement tool 300 can be demolded in a direction parallel to the substrate 100. As long as the pre-ball placement tool 300 can be removed from the solder pillars 200b to avoid the subsequent plastic encapsulation process, it will be sufficient.

[0047] Step 70 : performing plastic packaging on the side of the substrate 100 where the tin pillar 200 b is provided to form a plastic packaging body 400 , and ensuring that the height of the tin pillar 200 b is not less than the height of the plastic packaging body 400 .

[0048] When plastic encapsulation is performed on one side of the substrate 100, an injection molding machine can be used to inject plastic from one edge of the substrate 100, so that the injected plastic flows on the substrate 100 and forms a plastic encapsulation body 400 after cooling. This allows the plastic encapsulation body 400 to protect the components on the side of the substrate 100 where the tin pillars 200b are provided, thereby preventing the components on this side of the substrate 100 from being eroded by external forces or dust or rainwater. During the plastic encapsulation process, the volume of plastic ejected by the injection molding machine can be controlled to control the height of the plastic encapsulation body 400, or a shield can be provided to limit the height of the plastic encapsulation body 400. As long as the height of the plastic encapsulation body 400 is ensured to be no higher than the height of the tin pillars 200b, the surface of the tin pillars 200b can be exposed through a single injection molding process, thereby reducing the process steps of having to drill holes in the plastic encapsulation body 400 to expose the tin balls. Specifically, the height direction of the tin column 200b refers to the direction from the surface where the tin column 200b contacts the substrate 100 to the surface where the tin column 200b is away from the substrate 100. The height of the tin column 200b can be higher than the height of the plastic package 400 or can be flush with the height of the plastic package 400.

[0049] Step 90 : implanting a second solder ball 500 into the side of the solder pillar 200 b facing away from the substrate 100 .

[0050] Since the height of the tin pillar 200b is not less than the height of the plastic package body 400, the surface of the tin pillar 200b away from the substrate 100 can be exposed, thereby facilitating the user or a robot to find a reference surface for implanting the second tin ball 500, so as to facilitate the accurate implantation of the second tin ball 500 into the side of the tin pillar 200b away from the substrate 100, thereby avoiding the implantation position of the second tin ball 500 from being offset and affecting the subsequent welding performance with other finished devices.

[0051] The present invention employs a pre-ball placement tool 300 having a through-hole 310 mounted on one side of a substrate 100, with the through-hole 310 facing the substrate 100. A first solder ball 200a is then implanted into the through-hole 310 and reflowed to form a solder pillar 200b. This allows the solder pillar 200b to occupy a smaller area of ​​the substrate 100 than solder balls of the same height, thereby enabling more solder pillars 200b to be implanted on the substrate 100 and ensuring a higher density of the resulting solder pillars 200b on the substrate 100. After the first solder ball 200a is reflowed to form the solder pillars 200b, the pre-ball placement tool 300 is removed from the solder pillars 200b, further reducing the space occupied by the pre-ball placement tool 300 on the substrate 100 and thereby increasing the density of the solder pillars 200b on the substrate 100. Furthermore, by performing plastic sealing on one side of the substrate 100 on which the tin pillar 200b is provided and forming a plastic sealing body 400, the height of the tin pillar 200b is not lower than the height of the plastic sealing body 400. Then, after the plastic sealing process is completed, the upper surface of the tin pillar 200b can be directly exposed, thereby reducing the process steps of opening or grinding and improving production efficiency; and it also provides a good implantation reference for the subsequent implantation of the second tin ball 500 on the tin pillar 200b, ensuring that the second tin ball 500 can be accurately implanted on the side of the tin pillar 200b away from the substrate 100, avoiding the risk of implantation misalignment, thereby ensuring that the second tin ball 500 has good welding performance; in addition, it can also avoid the risk of fine residue on the surface of the tin pillar 200b due to the traditional hole opening process affecting the subsequent welding performance with the second tin ball 500, and avoid the risk of uneven surface of the tin pillar 200b due to the traditional hole opening process, thereby leading to height mismatch of the welding area in the subsequent process.

[0052] Furthermore, the pre-ball implant tool 300 is detached from the tin pillar 200 b in the direction of the height of the tin pillar 200 b and away from the substrate 100 .

[0053] By separating the pre-ball placement tool 300 from the tin pillar 200b along the height direction of the tin pillar 200b and in a direction away from the substrate 100, the risk of the pre-ball placement tool 300 being blocked by other components on the substrate 100 and damaging other components when separating from the tin pillar 200b can be avoided.

[0054] like Figure 6 As shown, in order to facilitate the separation of the pre-ball-implanting tool 300 from the tin pillar 200 b , the aperture of the through hole 310 is gradually reduced in a direction from an end close to the substrate 100 to an end away from the substrate 100 .

[0055] By gradually reducing the aperture of the through hole 310 from the end close to the substrate 100 to the end away from the substrate 100, the pre-ball placement tool 300 is easily separated from the tin pillar 200b, avoiding the risk of the pre-ball placement tool 300 being stuck by the tin pillar 200b.

[0056] Of course, in other embodiments, the aperture of the through hole 310 may also remain consistent in the direction from the end close to the substrate 100 to the end away from the substrate 100, so that the tin pillar 200b is cylindrical, and the hole wall of the through hole 310 is perpendicular to the substrate 100, so that the pre-balling tooling 300 can be detached in the direction along the tin pillar 200b and in the direction away from the substrate 100.

[0057] Furthermore, if Figure 2 As shown, after the step 50 of separating the pre-ball-planting tool 300 from the tin pillar 200 b , the following steps are further included:

[0058] Step 61: Rinse the tin pillar 200b.

[0059] After the pre-balling tool 300 is separated from the tin pillar 200b, and before the substrate 100 provided with the tin pillar 200b is plastic-sealed, the tin pillar 200b can be rinsed to remove the soldering flux on the surface of the tin pillar 200b, thereby preventing excessive soldering flux from remaining on the surface of the tin pillar 200b. Specifically, the tin pillar 200b can be washed with water or other liquids that have no effect on the tin pillar 200b. Furthermore, by rinsing the tin pillar 200b, the surface of the tin pillar 200b can be kept relatively clean, thereby improving the connection strength between the tin pillar 200b and the plastic-sealed body 400 and the soldering strength between the tin pillar 200b and the second solder ball.

[0060] Furthermore, if Figure 2 As shown, after the step 61 of rinsing the tin pillar 200 b , the method further includes:

[0061] Step 62 : The injection mold is pressed against the side of the tin pillar 200 b facing away from the substrate 100 to perform plastic packaging on the substrate 100 . The plastic packaging body 400 is restricted to flow between the limiting plate and the substrate 100 .

[0062] By positioning the injection mold against the tin pillar 200b on the side of the tin pillar 200b facing away from the substrate 100, a certain space is formed between the injection mold and the substrate 100, thereby restricting the plastic flowing toward the substrate 100 to flow within this space. This prevents the plastic from flowing over the surface of the tin pillar 200b facing away from the substrate 100 and covering the surface of the tin pillar 200b, particularly under the high pressure of the injection molding machine, thereby ensuring that the height of the resulting plastic package 400 is equal to the height of the tin pillar 200b. This arrangement avoids the need for grinding or cutting to ensure that the upper surface of the tin pillar 200b is flush with the upper surface of the plastic package 400, reduces the need to rinse away small debris on the surface of the tin pillar 200b, and avoids the risk of poor soldering due to incomplete rinsing of debris.

[0063] Alternatively, in other embodiments, the injection mold may be provided with a plug hole, and the end of the tin pillar 200b away from the substrate 100 can be inserted into the plug hole of the injection mold, so that the side of the injection mold facing the substrate 100 is lower than the height of the tin pillar 200b, thereby ensuring that the plastic flowing between the injection mold and the substrate 100 eventually forms a plastic package 400 whose height is lower than the height of the tin pillar 200b.

[0064] Of course, it is understandable that, after the step of holding the injection mold against the side of the tin pillar 200b away from the substrate 100, and before the step 90 of implanting the second tin ball 500 into the side of the tin pillar 200b away from the substrate 100, it also includes the step of separating the injection mold from the tin pillar 200b to provide an escape space for implanting the second tin ball 500 into the tin pillar 200b.

[0065] In order to facilitate demoulding, Figure 3 As shown, as an example, before the step 10 of disposing a pre-ball placement tool 300 with a through hole 310 on one side of the substrate 100 and orienting the through hole 310 toward the substrate 100, the step further includes:

[0066] Step 01: Moisten the inner wall of the through hole 310 of the pre-ball placement tool 300.

[0067] By wetting the inner wall of the through hole 310 of the pre-ball implantation tool 300, the tin pillar 200b formed after the reflow of the first tin ball 200a in the through hole 310 has good wettability with the inner wall of the through hole 310, thereby avoiding adhesion between the tin pillar 200b and the hole wall of the through hole 310, thereby ensuring smoother demoulding and preventing pulling damage to the tin pillar 200b during demoulding.

[0068] In order to ensure the accuracy of implantation of the first solder ball 200a, please refer to Figure 4 and Figure 11 , the step 30: implanting the first solder ball 200a into the through hole 310 and performing reflow, further comprising:

[0069] Step 20: Cover the area outside the pre-ball-planting tool 300 .

[0070] By covering the area outside the first pre-balling tool 300, it is possible to prevent the solder balls from falling into the area outside the pre-balling tool 300 and causing the risk of short circuits in components in other areas. Specifically, before installing the pre-balling tool 300, the installation of other components can be completed, and then the demolding and plastic encapsulation processes can be performed only after the first solder ball 200a reflows and forms the solder pillar 200b, thereby preventing the solder pillar 200b from affecting the installation of other components. The object used to cover the first pre-balling tool 300 can be a cover, and the upper surface of the cover can be at the same height as the upper surface of the pre-balling tool 300. The cover can be a separate structure from the pre-balling tool 300.

[0071] Of course, in other embodiments, the cover can also be integrated with the pre-ball placement tool 300. That is, when the pre-ball placement tool 300 is installed on one side of the substrate 100, the cover also covers the area outside the pre-ball placement tool 300. This arrangement improves production efficiency.

[0072] Furthermore, if Figure 5 As shown, after the step 70 of plastic-sealing the side of the substrate 100 provided with the pre-ball-planting tool 300 to form a plastic-sealed body 400 and ensuring that the height of the tin pillar 200 b is not less than the height of the plastic-sealed body 400 , the process further includes:

[0073] Step 80: Drill a hole in the plastic package body 400 according to the position of the tin pillar 200 b , and make the inner wall of the hole surround the tin pillar 200 b .

[0074] By drilling holes in the plastic package 400 based on the position of the tin pillar 200b, the accuracy of the holes can be guaranteed, avoiding the problem of not being able to locate the actual position of the tin pillar 200b embedded in the plastic. In addition, by setting up the hole drilling process, some users can meet the needs of implanting a larger second solder ball 500 on the tin pillar 200b.

[0075] The present invention also provides a package, which is a package made by the method for making a package in the above embodiment. Since the package adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments. Specifically, Figure 10As shown, the package includes a substrate 100, a tin pillar 200b, and a plastic encapsulation body 400. The tin pillar 200b is disposed on one side of the substrate 100. The plastic encapsulation body 400 encapsulates the side of the substrate 100 where the tin pillar 200b is disposed. The plastic encapsulation body 400 wraps around the sidewall of the tin pillar 200b. The side of the tin pillar 200b facing away from the substrate 100 is flush with the plastic encapsulation body 400 or exposed outside the plastic encapsulation body 400. The substrate 100 serves as a foundation for mounting components and other parts such as solder balls. The tin pillar 200b is used to solder the package together with other finished devices. The plastic encapsulation body 400 wraps around the sidewall of the tin pillar 200b and other components, thereby protecting the various components on the substrate 100. By arranging the side of the tin pillar 200b away from the substrate 100 flush with the plastic package 400 or exposing it outside the plastic package 400, it is convenient to implant the tin ball on the side of the tin pillar 200b away from the substrate 100, avoiding the situation where the tin ball is misaligned during implantation.

[0076] Furthermore, during the manufacture of the plastic package body 400 of the present invention, a pre-balling tool 300 having a through-hole 310 is first installed on one side of the substrate 100, with the through-hole 310 facing the substrate 100. A first solder ball 200a is then implanted into the through-hole 310 and the first solder ball 200a is reflowed to form a solder pillar 200b. Consequently, the solder pillar 200b occupies a smaller area of ​​the substrate 100 than solder balls of the same height. This allows for more solder pillars 200b to be implanted on the substrate 100, thereby ensuring a higher density of the solder pillars 200b ultimately formed on the substrate 100. After the first solder ball 200a is reflowed to form the solder pillars 200b, the pre-balling tool 300 is detached from the solder pillars 200b, further reducing the space occupied by the pre-balling tool 300 on the substrate 100 and thereby increasing the density of the solder pillars 200b on the substrate 100. Furthermore, by performing plastic sealing on one side of the substrate 100 on which the tin pillar 200b is provided and forming a plastic sealing body 400, the height of the tin pillar 200b is not lower than the height of the plastic sealing body 400. Then, after the plastic sealing process is completed, the upper surface of the tin pillar 200b can be directly exposed, thereby reducing the process steps of opening or grinding and improving production efficiency; and it also provides a good implantation reference for the subsequent implantation of the second tin ball 500 on the tin pillar 200b, ensuring that the second tin ball 500 can be accurately implanted on the side of the tin pillar 200b away from the substrate 100, avoiding the risk of implantation misalignment, thereby ensuring that the second tin ball 500 has good welding performance; in addition, it can also avoid the risk of fine residue on the surface of the tin pillar 200b due to the traditional hole opening process affecting the subsequent welding performance with the second tin ball 500, and avoid the risk of uneven surface of the tin pillar 200b due to the traditional hole opening process, thereby leading to height mismatch of the welding area in the subsequent process.

[0077] Furthermore, if Figure 10 As shown, the radial dimension of the tin pillar 200 b gradually decreases from the side close to the substrate 100 to the side away from the substrate 100 .

[0078] The radial dimension of the tin pillar 200b can be the diameter of the tin pillar 200b or the radius of the tin pillar 200b. By gradually reducing the radial dimension of the tin pillar 200b from the side close to the substrate 100 to the side away from the substrate 100, the pre-ball placement tool 300 can be easily separated from the tin pillar 200b, thereby improving the efficiency of package manufacturing.

[0079] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a package, characterized in that: include: Installing a pre-ball implantation tool with a through hole on one side of the substrate, with the through hole facing the substrate; implanting a first solder ball into the through hole, and reflowing the first solder ball to form a solder pillar; Separating the pre-ball implant from the tin pillar; Plastic-sealing the side of the substrate provided with the tin pillar to form a plastic-sealed body, and ensuring that the height of the tin pillar is not less than the height of the plastic-sealed body; A second solder ball is implanted into a side of the solder pillar facing away from the substrate.

2. The method for manufacturing a package according to claim 1, wherein: The pre-ball-planting tool is separated from the tin column in the following steps: separating the pre-ball-planting tool from the tin column along the height direction of the tin column and in a direction away from the substrate.

3. The method for manufacturing a package according to claim 2, wherein: The aperture of the through hole gradually decreases in a direction from an end close to the substrate to an end far away from the substrate.

4. The method for manufacturing a package according to claim 1, wherein: After the step of separating the pre-ball implant tool from the tin pillar, the method further includes: rinsing the tin pillar.

5. The method for manufacturing a package according to claim 4, wherein: After the step of flushing the tin pillar, the method further includes: holding the injection mold against the side of the tin pillar facing away from the substrate, so that when the substrate is plastic-sealed, the plastic-sealed body is restricted to flow between the limiting plate and the substrate.

6. The method for manufacturing a package according to claim 1, wherein: Before the step of arranging a pre-ball-planting tooling with a through hole on one side of the substrate and making the through hole face the substrate, the method further includes: wetting the inner wall of the through hole of the pre-ball-planting tooling.

7. The method for manufacturing a package according to claim 1, wherein: Before the step of implanting the first solder ball into the through hole and performing reflow, the method further includes: covering the area outside the pre-ball implantation tooling.

8. The method for manufacturing a package according to any one of claims 1 to 7, wherein: After the step of plastic-sealing the side of the substrate provided with the pre-ball-planting tooling to form a plastic-sealed body and ensuring that the height of the tin column is not lower than the height of the plastic-sealed body, the method further includes: opening a hole in the plastic-sealed body according to the position of the tin column, and ensuring that the inner wall of the hole surrounds the tin column.

9. A package manufactured based on the method for manufacturing a package according to any one of claims 1 to 8, characterized in that: The package comprises: substrate; a tin pillar, the tin pillar being disposed on one side of the substrate; and A plastic package body is provided to encapsulate the side of the substrate provided with the tin column, the plastic package body wraps the side wall of the tin column, and the side of the tin column facing away from the substrate is flush with the plastic package body or exposed outside the plastic package body.

10. The package according to claim 9, wherein The radial dimension of the tin column gradually decreases in a direction from a side close to the substrate to a side far away from the substrate.

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