A pressure distribution detection system and method for polishing equipment

Abstract

The present invention discloses a pressure distribution detection system and method for polishing equipment, the pressure distribution detection system includes: polishing equipment, pressure distribution detection equipment and a host computer; an annular cavity is used to provide pressure for wafer polishing; a microstructured flexible pressure sensor array includes a plurality of sensor units, which are cross-distributed in an array to form a sensing area of ​​a circular array sensor; a polishing head is installed on one side of the circular array sensor; the circular array sensor is connected to the signal acquisition module through the sensor interface; the signal acquisition module is connected to the host computer through the transmission hardware. The present invention connects the polishing head to one side of the circular array sensor, combines the annular cavity to apply pressure, so that the circular array sensor can perform real-time pressure distribution detection on each area of ​​the polishing head; the sensor array is a circular array composed of sensor units cross-distributed in an array, which is not easy to warp and contains more sampling points, which can improve the detection accuracy.

Description

Technical Field

[0001] The present invention relates to the field of sensor applications, and in particular to a pressure distribution detection system and method for polishing equipment. Background Art

[0002] The integrated circuit manufacturing process usually refers to the deposition of conductors, semiconductors, and insulating layers on a specific substrate including a silicon-based wafer in a certain process sequence. As the substrate of the integrated circuit, the quality and efficiency of the finished product of the wafer directly affect the subsequent process and determine the quality of the final finished chip. In the manufacturing process, the polishing process is a necessary process to remove the bumps or undulations on the surface of the wafer, and CMP (Chemical Mechanical Polishing) is often used for mirror processing. During the operation of the existing polishing equipment, the airbag (Membrane) in the polishing head is inflated to generate downward pressure on the polished wafer to ensure that the friction between the wafer and the polishing pad can meet the process requirements. Applying appropriate polishing pressure to each pressure zone of the wafer can improve the flatness of the wafer and facilitate subsequent precision processing; therefore, the system for detecting and controlling the polishing pressure of different sectors of the wafer polishing head is very important. The existing technology usually uses pressure detection on the airbag cavity, and an electric proportional valve is used to adjust the pressure of the airbag cavity in the polishing head, and a pressure sensor arranged at the outlet of the electric proportional valve is used as a feedback element in the closed loop; however, the airbag cavity detection cannot collect the actual polishing pressure, and the use of a grid sensor to collect the pressure applied by the polishing head on the wafer cannot be monitored in real time, and errors will occur, resulting in low collection accuracy. Summary of the invention

[0003] The present invention provides a pressure distribution detection system and method for polishing equipment, so as to solve the problem that the prior art cannot perform high-precision pressure detection on the polishing head in real time.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides a pressure distribution detection system for a polishing device, comprising: a polishing device, a pressure distribution detection device and a host computer;

[0005] Wherein, the polishing device is a polishing head, and the base of the polishing head includes a plurality of annular cavities; wherein, the annular cavities are used to provide pressure for wafer polishing;

[0006] The pressure distribution detection device comprises: a circular array sensor, a signal acquisition module and a transmission hardware; wherein the circular array sensor comprises: a microstructured flexible pressure sensor array and a sensor interface; the microstructured flexible pressure sensor array comprises a plurality of sensor units, and the plurality of sensor units are cross-distributed in an array to form a sensing area of ​​the circular array sensor;

[0007] The polishing head is installed on one side of the circular array sensor; the circular array sensor is connected to the signal acquisition module through the sensor interface; the signal acquisition module is connected to the host computer through the transmission hardware; wherein, the host computer is used to control the pressure distribution detection device to perform pressure distribution detection on the polishing device.

[0008] The present invention connects the polishing head to one side of the circular array sensor and applies pressure through the annular cavity, so that the circular array sensor can perform real-time pressure distribution detection on various areas of the polishing head; and the microstructured flexible pressure sensor array is a circular array composed of sensor units cross-distributed by the array, which is more suitable for pressure detection of polishing equipment and is not prone to warping. More sampling points in the circular array sensor can improve detection accuracy.

[0009] Furthermore, the signal acquisition module includes: an artifact elimination circuit and an MCU;

[0010] The MCU is respectively connected to the artifact elimination circuit and the sensor interface; the MCU is also connected to the host computer through transmission hardware;

[0011] The artifact elimination circuit is used to virtually isolate the measured resistance in the circular array sensor;

[0012] The MCU is used to control the circular array sensor to perform pressure distribution detection according to the instructions of the host computer; and is used to receive the collected information of the artifact elimination circuit; and is used to transmit the collected information to the host computer.

[0013] The present invention virtually isolates the measured resistor in the circular array sensor through an artifact elimination circuit, thereby eliminating interference of adjacent resistors in the array on the measured resistor, achieving artifact elimination and improving the detection accuracy of the system.

[0014] Furthermore, the artifact elimination circuit is used to virtually isolate the measured resistance in the circular array sensor, specifically:

[0015] Wherein, the artifact elimination circuit comprises: a power supply, a standard resistor, a plurality of operational amplifiers and a multi-way switch;

[0016] After being connected to the power supply, the artifact elimination circuit calculates the resistance value of the resistor to be measured according to the standard resistor and the plurality of operational amplifiers, so that the current ratio and voltage ratio between the current passing through the standard resistor and the current passing through the resistor to be measured remain known.

[0017] Furthermore, the on-resistance of the multi-way switch is less than or equal to 4Ω.

[0018] The on-resistance of the multi-way switch in the present invention is relatively small, so that the scanning detection of the circular array sensor can be closer to an ideal state.

[0019] Furthermore, the sampling frequency of the pressure distribution detection is 50 Hz.

[0020] The present invention further realizes real-time acquisition of pressure distribution in each area of ​​the probe through a higher sampling frequency.

[0021] Furthermore, the host computer is also used to perform fitting processing on the received collected data according to a nonlinear fitting algorithm to obtain pressure value data.

[0022] The present invention reduces the nonlinear error of the sensor through a nonlinear fitting algorithm, thereby improving the detection accuracy.

[0023] Furthermore, the host computer is also used to display a pressure distribution diagram in real time according to the collected data or pressure value data; wherein the pressure distribution diagram includes: a 3D image and a thermal map.

[0024] The present invention displays the collected data or the pressure value data obtained after processing the collected data in real time through the pressure distribution diagram, and the visualized pressure distribution diagram is convenient for technicians to view the pressure distribution situation.

[0025] Furthermore, the pressure distribution detection system for polishing equipment further includes: a polishing leak detection device;

[0026] The polishing leak detection device comprises: a flat base; wherein the other side of the circular array sensor is mounted to the flat base; and the polishing leak detection device is used to detect whether there is air leakage in the annular cavity.

[0027] The present invention connects the polishing leak detection device to the other side of the circular array sensor to realize simultaneous pressure distribution detection and routine maintenance of the polishing equipment, and displays the actual pressure distribution of each area of ​​the polishing head in real time to establish a corresponding relationship between the gas pressure and the actual pressure, thereby preventing the polishing head from being discovered during the polishing process and ensuring that appropriate polishing pressure is applied to the wafer subsequently.

[0028] The embodiment of the present invention further provides a pressure distribution detection method for a polishing device, and the pressure distribution detection method for a polishing device is applied to the pressure distribution detection system for a polishing device as described in the embodiment of the present invention, comprising:

[0029] Controlling the annular cavity to apply pressure to the retainer area of ​​the polishing head, and receiving the first collected data uploaded by the pressure distribution detection device;

[0030] Performing fitting processing on the first collected data to obtain first pressure value data, and presenting a real-time image of the first pressure value data;

[0031] After the back pressure of the retainer area is emptied, the annular cavity is controlled to apply pressure to other designated sectors of the polishing head, and second acquisition data uploaded by the pressure distribution detection device is received;

[0032] The second collected data is fitted to obtain second pressure value data, and a real-time image of the second pressure value data is presented.

[0033] Furthermore, before the control annular cavity applies pressure to the retainer area of ​​the polishing head and receives the first collected data uploaded by the pressure distribution detection device, it also includes:

[0034] Wherein, the pressure distribution detection system for polishing equipment further comprises: a calibration device;

[0035] Controlling the calibration device to apply a preset pressure to each area of ​​the polishing head, and receiving the force-electricity curve uploaded by the pressure distribution detection device;

[0036] The circular array sensor is calibrated according to the calibration device and the force-electricity curve, so that the electrical signal output by each sensor unit of the circular array sensor corresponds to the preset pressure.

[0037] The present invention calibrates the electrical signal output by the circular array sensor through a calibration device, so that the output of each sensor unit corresponds to a preset pressure, thereby improving the detection accuracy; in addition, by controlling the annular cavity to apply pressure to each area of ​​the polishing head, pressure detection with a larger range and a larger detection range is achieved in conjunction with the pressure distribution monitoring equipment, thereby achieving more accurate pressure detection while meeting the polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic structural diagram of an embodiment of a pressure distribution detection system based on a polishing device provided by the present invention;

[0039] Figure 2 A schematic structural diagram of an embodiment of a pressure distribution detection device provided by the present invention;

[0040] Figure 3 A schematic structural diagram of an embodiment of a polishing leak detection device provided by the present invention;

[0041] Figure 4 A schematic flow chart of an embodiment of a pressure distribution detection method based on a polishing device provided by the present invention;

[0042] Figure 5 A schematic diagram of an embodiment of the overall software interface of the host computer provided by the present invention;

[0043] Figure 6A graph of the force-electricity curve during the calibration process provided by the present invention;

[0044] Figure 7 A graph of the force-electricity curve during the calibration process provided by the present invention;

[0045] Figure 8 A test result diagram of the pressure change test on the retainer area provided by the present invention;

[0046] Fig. 9 Another test result diagram of the pressure change test on the retainer area provided by the present invention;

[0047] Fig.10 The test result diagram of the first area to the seventh area provided by the present invention;

[0048] Fig.11 A schematic diagram of minimum resolution test results of the first area of ​​other designated sectors provided by the present invention;

[0049] Fig.12 A schematic diagram of the 4 psi continuous test results of the sixth area provided by the present invention;

[0050] Fig.13 A box plot of pressure values ​​for the sixth region provided by the present invention;

[0051] Fig.14 Another schematic diagram of the 4 psi continuous test results of the sixth region provided by the present invention;

[0052] Fig.15 Another schematic diagram of the 4 psi continuous test results of the sixth area provided by the present invention.

[0053] Among them, the figure numbers of the drawings in the specification are as follows: 1. circular array sensor, 2. signal acquisition module, 3. transmission hardware, 4. circular array sensor, 5. sensor interface. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] Embodiment 1

[0056] Please refer to Figure 1, which is a structural schematic diagram of an embodiment of a pressure distribution detection system based on a polishing device provided by the present invention, comprising: a polishing device, a pressure distribution detection device and a host computer.

[0057] Wherein, the polishing device is a polishing head, and the base of the polishing head includes a plurality of annular cavities; wherein, the annular cavities are used to provide pressure for wafer polishing.

[0058] Please refer to Figure 2 , which is a structural schematic diagram of an embodiment of the pressure distribution detection device provided by the present invention, wherein the pressure distribution detection device includes: a circular array sensor, a signal acquisition module and a transmission hardware; wherein the circular array sensor includes: a microstructured flexible pressure sensor array and a sensor interface; the microstructured flexible pressure sensor array includes a plurality of sensor units, and the plurality of sensor units are cross-distributed in an array to form a sensing area of ​​the circular array sensor.

[0059] In this embodiment, the circular array is a 64×64 array, which can identify the magnitude and distribution of normal pressure in different sectors. Compared with traditional flexible pressure sensors, the application of microstructures can significantly improve the sensitivity of the sensor, respond more significantly to pressure changes, and have smaller hysteresis errors.

[0060] In this embodiment, the circular array sensor has a measuring range of 0-15psi, or 0-103kPa; the resolution is less than 0.05psi, or 345Pa; the accuracy error is less than 3%; it has a larger detection range, higher detection accuracy and smaller accuracy error, and can meet the requirements of precision processing of integrated circuits.

[0061] The present invention avoids the problem of insufficient measurement accuracy caused by using flexible film grid sensors by using a microstructured flexible pressure sensor array.

[0062] In this embodiment, the signal acquisition module includes: an artifact elimination circuit and an MCU; the MCU is respectively connected to the artifact elimination circuit and the sensor interface; the MCU is also connected to the host computer through transmission hardware, wherein the transmission hardware includes: a USB interface; the artifact elimination circuit is used to virtually isolate the measured resistance in the circular array sensor; the MCU is used to control the circular array sensor to perform pressure distribution detection according to the instructions of the host computer; and is used to receive the acquisition information of the artifact elimination circuit; and is used to transmit the acquisition information to the host computer.

[0063] In this embodiment, the artifact elimination circuit is used to virtually isolate the measured resistor in the circular array sensor, specifically: wherein the artifact elimination circuit includes: a power supply, a standard resistor, a plurality of operational amplifiers and a multi-way switch; after the artifact elimination circuit is connected to the power supply, the resistance value of the measured resistor is calculated according to the standard resistor and the plurality of operational amplifiers, so that the current ratio and voltage ratio between the current passing through the standard resistor and the current passing through the measured resistor remain known.

[0064] The present invention virtually isolates the measured resistor in the circular array sensor through an artifact elimination circuit, thereby eliminating interference of adjacent resistors in the array on the measured resistor, achieving artifact elimination and improving the detection accuracy of the system.

[0065] In this embodiment, the on-resistance of the multi-way switch is less than or equal to 4Ω.

[0066] The on-resistance of the multi-way switch in the present invention is relatively small, so that the scanning detection of the circular array sensor can be closer to an ideal state.

[0067] In this embodiment, the sampling frequency of the pressure distribution detection is 50 Hz.

[0068] The present invention further realizes real-time acquisition of pressure distribution in each area of ​​the probe through a higher sampling frequency.

[0069] The polishing head is installed on one side of the circular array sensor; the circular array sensor is connected to the signal acquisition module through the sensor interface; the signal acquisition module is connected to the host computer through the transmission hardware; wherein, the host computer is used to control the pressure distribution detection device to perform pressure distribution detection on the polishing device.

[0070] In this embodiment, the signal acquisition module is Figure 1 The hardware module in the transmission hardware includes a USB interface. The signal acquisition module is connected to the host computer through the USB interface and performs data transmission. In addition, the host computer receives and processes the collected data uploaded by the signal acquisition module through the host computer software.

[0071] In this embodiment, the host computer is also used to perform fitting processing on the received collected data according to a nonlinear fitting algorithm to obtain pressure value data.

[0072] The present invention reduces the nonlinear error of the sensor through a nonlinear fitting algorithm, thereby improving the detection accuracy.

[0073] In this embodiment, the host computer is also used to display a pressure distribution map in real time according to the collected data or pressure value data; wherein the pressure distribution map includes: a 3D image and a thermal map. In addition, the host computer can also perform communication settings for the sensor interface, refresh and pause the pressure distribution map in real time, calculate the time pressure mean curve, load single frame data, and load multiple frames of data.

[0074] The present invention uses a pressure distribution graph to display the collected data or the pressure value data obtained after processing the collected data in real time. The visualized pressure distribution graph is convenient for technicians to view the pressure distribution situation, thereby solving the problem of the lack of visualized presentation of the pressure distribution detection of polishing equipment in the prior art.

[0075] Please refer to Figure 3 , which is a structural schematic diagram of an embodiment of the polishing leak detection device provided by the present invention, wherein the pressure distribution detection system for the polishing equipment also includes: a polishing leak detection device; the polishing leak detection device includes: a flat substrate; wherein the other side of the circular array sensor is installed to the flat substrate; the polishing leak detection device is used to detect whether there is a leak in the annular cavity.

[0076] In this embodiment, the polishing leak detection device further includes: a fixing device; the fixing device is used to fix the connection relationship between the polishing head, the circular array sensor and the flat substrate, so that the system is not affected by the outside world during the pressure distribution detection process.

[0077] The present invention connects the polishing leak detection device to the other side of the circular array sensor to realize simultaneous pressure distribution detection and routine maintenance of the polishing equipment, and displays the actual pressure distribution of each area of ​​the polishing head in real time to establish a corresponding relationship between the gas pressure and the actual pressure, thereby preventing the polishing head from being discovered during the polishing process and ensuring that appropriate polishing pressure is applied to the wafer subsequently.

[0078] Please refer to Figure 4 , is a flow chart of an embodiment of a pressure distribution detection method based on a polishing device provided by the present invention, which mainly includes steps 101 to 104, which are as follows:

[0079] In this embodiment, the pressure distribution detection method for a polishing device is applied to a pressure distribution detection system for a polishing device as described in an embodiment of the present invention.

[0080] Please refer to Figure 5 , which is a schematic diagram of an embodiment of the overall software interface of the host computer provided by the present invention. The present invention implements the acceptance, processing and imaging of the collected data through software.

[0081] Step 101: Control the annular cavity to apply pressure to the retainer area of ​​the polishing head, and receive first collected data uploaded by the pressure distribution detection device.

[0082] In this embodiment, the pressure distribution detection system for polishing equipment further includes: a calibration device.

[0083] In this embodiment, before the annular cavity is controlled to apply pressure to the retainer area of ​​the polishing head and the first collected data uploaded by the pressure distribution detection device is received, it also includes: controlling the calibration device to apply a preset pressure to each area of ​​the polishing head and receiving the force-electric curve uploaded by the pressure distribution detection device; calibrating the circular array sensor according to the calibration device and the force-electric curve so that the electrical signal output by each sensor unit of the circular array sensor corresponds to the preset pressure.

[0084] In this embodiment, the calibration device includes: an air source, an external pressure regulating gauge, a sealed cavity, a cavity pressure detection gauge and a plurality of connecting pipelines; wherein, the calibration device is used to apply uniform pressure to different positions of the sensor.

[0085] Please refer to Figure 6 and Figure 7 , respectively, are force-electricity curve diagrams in the calibration process provided by the present invention, wherein each sensor unit has a specific force-electricity curve, and by applying a preset and uniform pressure, the force-electricity curve of each unit is obtained for subsequent measurement.

[0086] In this embodiment, during the process of controlling the annular cavity to apply pressure to the retainer area of ​​the polishing head, the common pressure applied to the retainer area is 6.5 psi.

[0087] Step 102: performing fitting processing on the first collected data to obtain first pressure value data, and presenting a real-time image of the first pressure value data.

[0088] Please refer to Figure 8 and Fig. 9 , which is a test result diagram of the pressure change test on the retainer area provided by the present invention. When the pressure applied to the retainer area varies in the range of 0-14psi, the output changes significantly under different pressures; among them, the output value is quite different from the applied force. The possible reason is that the area of ​​the retainer area where the pressure is applied is inconsistent with the area of ​​the actual contact sensor, resulting in a difference between the applied pressure and the interface pressure.

[0089] Step 103: After the back pressure of the retainer area is cleared, the annular cavity is controlled to apply pressure to other designated sectors of the polishing head, and second collected data uploaded by the pressure distribution detection device is received.

[0090] Please refer to Fig.10 , the present invention provides a test result diagram of the first area to the seventh area, wherein the other designated sectors include the first area to the seventh area, wherein the common pressure applied to the first area to the seventh area is 4psi.

[0091] Step 104: performing fitting processing on the second collected data to obtain second pressure value data, and presenting a real-time image of the second pressure value data.

[0092] Please refer to Fig.11 , which is a schematic diagram of a minimum resolution test result of the first area of ​​other specified sectors provided by the present invention, Fig. 9 The sector for minimum resolution test is the sixth region. The pressure applied to the sixth region is first increased from 0 to 0.06 psi, and then increased at a rate of 0.03 psi / time. The circular array sensor in the embodiment of the present invention can identify the pressure change.

[0093] Please refer to Fig.12 , which is a schematic diagram of the minimum resolution test results of the first area for other specified sectors provided by the present invention, and the sixth area is continuously subjected to a pressure of 4.03 psi for 19 times to perform error calculation; wherein, the sensor accuracy Among them, U1 is the systematic error, U2 is the random error, and Y Fs is the full-scale output value for static calibration.

[0094] Please refer to Fig.13 , which is a box plot of the pressure values ​​of the sixth region provided by the present invention, wherein the average value of 19 4.03psi pressure tests is 3.85psi, the maximum value is 4.01psi, and the minimum value is 3.70psi.

[0095] Please refer to Fig.14 and Fig.15 , respectively, are another schematic diagram and yet another schematic diagram of the 4psi continuous test results of the sixth area provided by the present invention, wherein, according to the test average value and the maximum and minimum values, the measurement error of the pressure distribution detection system of this embodiment is -1.02%-1.1%; the error is calculated based on the input value as the average value, and the error is -2.18%-0.14%, and the test accuracy can reach less than 3%.

[0096] The present invention calibrates the electrical signal output by the circular array sensor through a calibration device, so that the output of each sensor unit corresponds to a preset pressure, thereby improving the detection accuracy; in addition, by controlling the annular cavity to apply pressure to each area of ​​the polishing head, pressure detection with a larger range and a larger detection range is achieved in conjunction with the pressure distribution monitoring equipment, thereby achieving more accurate pressure detection while meeting the polishing process.

[0097] The present invention connects the polishing head to one side of the circular array sensor and applies pressure through the annular cavity, so that the circular array sensor can perform real-time pressure distribution detection on various areas of the polishing head; and the microstructured flexible pressure sensor array is a circular array composed of sensor units cross-distributed by the array, which is more suitable for pressure detection of polishing equipment and is not prone to warping. More sampling points in the circular array sensor can improve detection accuracy.

[0098] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A pressure distribution detection system for polishing equipment, characterized in that: include: Polishing equipment, pressure distribution detection equipment and host computer; Wherein, the polishing device is a polishing head, and the base of the polishing head includes a plurality of annular cavities; wherein, the annular cavities are used to provide pressure for wafer polishing; The pressure distribution detection device comprises: a circular array sensor, a signal acquisition module and a transmission hardware; wherein the circular array sensor comprises: a microstructured flexible pressure sensor array and a sensor interface; the microstructured flexible pressure sensor array comprises a plurality of sensor units, and the plurality of sensor units are cross-distributed in an array to form a sensing area of ​​the circular array sensor; The polishing head is mounted on one side of the circular array sensor; the circular array sensor is connected to the signal acquisition module via the sensor interface; the signal acquisition module is connected to the host computer via the transmission hardware; wherein the host computer is used to control the pressure distribution detection device to perform pressure distribution detection on the polishing device; The signal acquisition module includes: an artifact elimination circuit and an MCU; The MCU is respectively connected to the artifact elimination circuit and the sensor interface; the MCU is also connected to the host computer through transmission hardware; The artifact elimination circuit is used to virtually isolate the measured resistance in the circular array sensor; The MCU is used to control the circular array sensor to perform pressure distribution detection according to the instructions of the host computer; and is used to receive the acquisition information of the artifact elimination circuit; and is used to transmit the acquisition information to the host computer; The host computer is also used to perform fitting processing on the received collected data according to a nonlinear fitting algorithm to obtain pressure value data; The host computer is also used to display a pressure distribution diagram in real time according to the collected data or pressure value data; wherein the pressure distribution diagram includes: a 3D image and a thermal map.

2. The pressure distribution detection system for polishing equipment according to claim 1, characterized in that: The artifact elimination circuit is used to virtually isolate the measured resistance in the circular array sensor, specifically: Wherein, the artifact elimination circuit comprises: a power supply, a standard resistor, a plurality of operational amplifiers and a multi-way switch; After being connected to the power supply, the artifact elimination circuit calculates the resistance value of the resistor to be measured according to the standard resistor and the plurality of operational amplifiers, so that the current ratio and voltage ratio between the current passing through the standard resistor and the current passing through the resistor to be measured remain known.

3. The pressure distribution detection system for polishing equipment according to claim 2, characterized in that: The on-resistance of the multi-way switch is less than or equal to 4Ω.

4. The pressure distribution detection system for polishing equipment according to claim 1, characterized in that: The sampling frequency of the pressure distribution detection is 50HZ.

5. The pressure distribution detection system for polishing equipment according to any one of claims 1 to 4, characterized in that: Also includes: Polishing leak detection device; The polishing leak detection device comprises: a flat base; wherein the other side of the circular array sensor is mounted to the flat base; and the polishing leak detection device is used to detect whether there is air leakage in the annular cavity.

6. A method for detecting pressure distribution of a polishing device, characterized in that: The pressure distribution detection method for polishing equipment is applied to the pressure distribution detection system for polishing equipment as claimed in any one of claims 1 to 5, comprising: Controlling the annular cavity to apply pressure to the retainer area of ​​the polishing head, and receiving the first collected data uploaded by the pressure distribution detection device; Performing fitting processing on the first collected data to obtain first pressure value data, and presenting a real-time image of the first pressure value data; After the back pressure of the retainer area is emptied, the annular cavity is controlled to apply pressure to other designated sectors of the polishing head, and second acquisition data uploaded by the pressure distribution detection device is received; The second collected data is fitted to obtain second pressure value data, and a real-time image of the second pressure value data is presented.

7. The pressure distribution detection method for polishing equipment according to claim 6, characterized in that: Before the control annular cavity applies pressure to the retainer area of ​​the polishing head and receives the first collected data uploaded by the pressure distribution detection device, include: Wherein, the pressure distribution detection system for polishing equipment further comprises: a calibration device; Controlling the calibration device to apply a preset pressure to each area of ​​the polishing head, and receiving the force-electricity curve uploaded by the pressure distribution detection device; The circular array sensor is calibrated according to the calibration device and the force-electricity curve, so that the electrical signal output by each sensor unit of the circular array sensor corresponds to the preset pressure.

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