A cured floor patching process and structure

Abstract

The application discloses a solidified floor repairing process and a repairing structure. The repairing process comprises the following steps: firstly, filling a repairing material in a crack of a crack area of the solidified floor to repair the crack; secondly, coating the repairing material on the surface of the repaired crack area to form a repairing layer; and thirdly, performing surface treatment on the surface of the repairing layer to improve the smoothness of the surface of the repairing layer. According to the solidified floor repairing process, the repairing material in the crack is connected with the repairing layer to form an integral whole by twice coating the repairing material on the surface of the crack area to form the repairing layer, so that the repairing strength of the repairing material in the crack is improved, meanwhile, the repairing layer can be adhered to the surface of the crack area to avoid the surface of the crack area from being cracked again, and the repairing effect of the crack area is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of repairing solidified floor, in particular to a solidified floor repairing process and a repairing structure. BACKGROUND

[0002] Solidified floor is widely used due to its dustproof, anti-skid, wear-resistant and aesthetic characteristics. However, after the construction of the solidified floor is completed, large-area cracks often appear on the surface of the solidified floor due to shrinkage cracks, which seriously affects the aesthetics of the solidified floor. In the prior art, the repairing of the solidified floor is usually completed by filling the cracks with repairing material. However, after the repairing by the existing repairing method, cracks still appear again in the crack area, and the repairing effect of the crack area is low. SUMMARY

[0003] The present application aims to at least solve one of the problems in the prior art. The first aspect of the present application provides a solidified floor repairing process. After the cracks are repaired by the process, no cracks appear again in the crack area, and the repairing effect is high. The second aspect of the present application provides a solidified floor repairing structure formed after the repairing by the above-mentioned solidified floor repairing process.

[0004] The solidified floor repairing process provided by the embodiment of the present application comprises:

[0005] filling the cracks in the crack area of the solidified floor with repairing material to repair the cracks;

[0006] coating the surface of the repaired crack area with repairing material to form a repairing layer;

[0007] spraying a water solution of a curing agent on the surface of the repairing layer to form a curing layer on the surface of the repairing layer;

[0008] performing surface treatment on the surface of the curing layer to improve the smoothness of the surface of the curing layer.

[0009] The solidified floor repairing process provided by the present application has at least the following beneficial effects: first, the cracks in the crack area of the solidified floor are filled with repairing material to repair the cracks; then, the surface of the crack area is coated with repairing material to form a repairing layer; next, a water solution of a curing agent is sprayed on the surface of the repairing layer to form a curing layer on the surface of the repairing layer; finally, surface treatment is performed on the surface of the curing layer to improve the smoothness of the surface of the curing layer. In the present application, the repairing material in the cracks is connected with the repairing layer to form a whole by twice coating the surface of the crack area with repairing material to form a repairing layer, thereby improving the repairing strength of the repairing material in the cracks. At the same time, the repairing layer can be adhered to the surface of the crack area to avoid the generation of cracks on the surface of the crack area again, thereby improving the repairing effect of the crack area.

[0010] The solidified floor repairing process according to the embodiment of the present application fills the crack area of the solidified floor with the repairing material to repair the cracks, comprising:

[0011] The crack area of the solidified floor is surface treated to remove impurities in the crack area.

[0012] The crack area is coated with the repairing material to make the repairing material flow into and fill the cracks in the crack area.

[0013] The solidified floor repairing process according to the embodiment of the present application surface treats the crack area of the solidified floor, comprising:

[0014] Water is sprayed on the crack area to wet the crack area.

[0015] The crack area is cleaned to remove solid impurities and excess water on the surface of the crack area.

[0016] The solidified floor repairing process according to the embodiment of the present application surface treats the crack area of the solidified floor, further comprising:

[0017] The surface of the cleaned crack area is rough ground.

[0018] The surface of the cleaned crack area is rough ground according to the solidified floor repairing process according to the embodiment of the present application, comprising:

[0019] The surface of the crack area is ground with resin abrasive sheets of 50 mesh and 150 mesh in sequence.

[0020] The solidified floor repairing process according to the embodiment of the present application, wherein the repairing material is a concrete repairing agent and cement configured in a mass ratio of 1:1.

[0021] The solidified floor repairing process according to the embodiment of the present application, further comprising:

[0022] Before spraying the water solution of the solidifying agent, the surface of the repairing layer is ground with a resin abrasive sheet of 300 mesh.

[0023] The solidified floor repairing process according to the embodiment of the present application surface treats the surface of the solidified layer, comprising:

[0024] The surface of the solidified layer is fine ground.

[0025] The surface of the solidified layer is fine ground according to the solidified floor repairing process according to the embodiment of the present application, comprising:

[0026] The solidified layer is ground with resin abrasive sheets of 500 mesh, 800 mesh and 1000 mesh in sequence.

[0027] According to the second aspect of the embodiment of the present application, a solidified floor repairing structure is provided, wherein a crack area of a solidified floor is filled with a repairing material in a crack, a surface of the crack area is covered with a repairing layer formed by the repairing material, and a surface of the repairing layer is covered with a solidified layer formed by solidification of an aqueous solution of a solidifying agent.

[0028] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0029] The present application will be further described below in conjunction with the accompanying drawings and embodiments.

[0030] Figure 1 A schematic diagram of a structure of a solidified floor before repairing according to an embodiment of the present application;

[0031] Figure 2 A schematic diagram of a structure of a solidified floor after repairing according to an embodiment of the present application;

[0032] Figure 3 A flow chart of a repairing process of a solidified floor according to an embodiment of the present application;

[0033] Figure 4 A flow chart of filling a repairing material in a crack of a crack area of a solidified floor according to an embodiment of the present application;

[0034] Figure 5 A flow chart of surface treatment of a crack area of a solidified floor according to an embodiment of the present application.

[0035] REFERENCE NUMERALS

[0036] Solidified floor 100; crack 110;

[0037] Repairing layer 200;

[0038] Solidified layer 300. DETAILED DESCRIPTION

[0039] This part will describe the specific embodiments of the present application in detail, and the preferred embodiments of the present application are shown in the accompanying drawings, which serve to supplement the description in the text part of the specification and enable people to intuitively and visually understand each technical feature and the overall technical scheme of the present application, but cannot be understood as a limitation on the protection scope of the present application.

[0040] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In the description of the present application, one or more is understood as one or more, more than two is understood as more than two, greater than, less than, more than and the like are understood as not including the number, above, below, within and the like are understood as including the number. If the first, second is described, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the sequence of technical features indicated.

[0042] In the description of the present application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be broadly understood, and those skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0043] The following refers to Figures 1 to 5 A solidified floor repairing process of the present application is described in detail.

[0044] Reference is made to Figure 1 And Figure 2 Before the solidified floor 100 is repaired, a plurality of cracks 110 are distributed on the solidified floor 100, which will affect the strength and aesthetics of the solidified floor 100; after the solidified floor 100 is repaired, the solidified floor 100 will be covered with a repairing layer 200 and a solidified layer 300 in turn, the repairing layer 200 connects the repairing material in the cracks 110, so that the repairing material in the cracks 110 forms an integral whole with the repairing layer 200, at the same time, the repairing layer 200 is adhered to the surface of the solidified floor 100, improving the repairing effect of the solidified floor 100 and avoiding the appearance of cracks 110 on the surface of the solidified floor 100 again, at the same time, the solidified layer 300 can protect the repairing layer 200, thereby prolonging the service life of the repairing layer 200.

[0045] Reference is made to Figure 3 According to the solidified floor repairing process of the first aspect of the present application, the following steps are included but not limited to:

[0046] S100: filling repairing material in the cracks 110 in the crack area of the solidified floor 100 to repair the cracks 110;

[0047] S200: coating repairing material on the surface of the repaired crack area to form a repairing layer 200;

[0048] It can be understood that the repair layer 200 can connect the repair material in each crack of the crack area, thereby improving the strength of the repair material after curing, thereby improving the repair effect of the repair material on the cracks of the crack area; at the same time, the repair layer 200 can protect the cured floor 100 and prolong the service life of the cured floor 100.

[0049] S400: Spraying a curing agent aqueous solution on the surface of the repair layer 200 to form a curing layer 300 on the surface of the repair layer 200.

[0050] It can be understood that spraying a curing agent aqueous solution on the surface of the repair layer 200 to form a curing layer 300 can increase the strength and hardness of the repair layer 200, and at the same time, the curing layer 300 can protect the repair layer 200, prevent the repair layer 200 from loosening due to external friction and its own aging, and thereby prolong the service life of the repair layer 200.

[0051] S500: Surface treatment is performed on the surface of the curing layer 300 to improve the smoothness of the surface of the curing layer 300.

[0052] It can be understood that surface treatment is performed on the surface of the repair layer 200 to improve the smoothness of the surface of the repair layer 200, which can improve the appearance of the repaired cured floor 100.

[0053] In some embodiments of the present application, with reference to Figure 4 , in step S100, the following steps are included but not limited to:

[0054] S110: Surface treatment is performed on the crack area of the cured floor 100 to remove impurities in the crack area.

[0055] It can be understood that the surface of the cured floor 100 will be covered with impurities, which will block the cracks 110, and at the same time, the repair material will be coated on the crack area covered with impurities, and the repair material will be partially attached to the impurities, thereby affecting the repair effect of the repair material; the cracks 110 on the cured floor 100 are mainly alligator cracks, and the alligator cracks have small openings. By performing surface treatment on the crack area of the cured floor 100 to remove impurities in the crack area, the cracks 110 in the crack area can be exposed, thereby improving the subsequent repair effect of the cracks 110.

[0056] S120: Coating repair material on the surface of the crack area to make the repair material flow into and fill the cracks 110 of the crack area.

[0057] It can be understood that by coating repair material on the surface of the crack area, the repair material can gradually flow into the cracks 110, avoiding too much repair material flowing into the cracks 110 at one time and blocking the openings of the cracks 110, thereby improving the repair effect of the crack area.

[0058] Specifically, the patching material is prepared by mixing the concrete patching agent and the cement at a mass ratio of 1:1.

[0059] In some embodiments of the present application, with reference to Figure 5 In step S110, the following steps are included but not limited to:

[0060] S111: Spraying water on the surface of the crack area to wet the crack area.

[0061] It can be understood that spraying water on the surface of the crack area can remove impurities on the surface of the crack area, thereby improving the repair effect of the patching material.

[0062] S112: Cleaning the crack area to remove solid impurities and excess water on the surface of the crack area.

[0063] There are some impurities with large mass in the crack area, which are difficult to be washed away by water flow. These impurities also reduce the repair effect of the patching material. The water in the crack 110 is blocked between the patching material and the floor, which affects the repair effect of the patching material. Removing the solid impurities and excess water on the surface of the crack area can improve the repair effect of the patching material.

[0064] Further, with reference to Figure 5 In step S100, the following steps are included but not limited to:

[0065] S113: Rough grinding the surface of the cleaned crack area.

[0066] It can be understood that part of the cracks 110 in the crack area are subcutaneous cracks. By rough grinding the surface of the crack area, the subcutaneous cracks can be exposed, and then the patching material can flow into the subcutaneous cracks to repair the subcutaneous cracks, thereby improving the repair effect of the crack area.

[0067] Specifically, in step S113, the following steps are included but not limited to:

[0068] S113a: Polishing the surface of the crack area with 50-mesh and 150-mesh resin abrasive sheets in sequence.

[0069] Further, with reference to Figure 1 Before step S400, the following steps are included but not limited to:

[0070] S300: Polishing the surface of the patching layer 200 with a 300-mesh resin abrasive sheet.

[0071] It can be understood that the surface of the repair layer 200 is rough after curing, and the water-soluble curing agent solution is difficult to uniformly penetrate into the repair layer 200. By polishing the surface of the repair layer 200, the smoothness and flatness of the surface of the repair layer 200 can be improved, thereby improving the penetration effect of the water-soluble curing agent solution in the repair layer 200, and further improving the curing effect of the water-soluble curing agent solution on the repair layer 200.

[0072] In some embodiments of the present application, step S500 includes but is not limited to the following steps:

[0073] S510: Polishing the surface of the cured layer 300.

[0074] It can be understood that the surface of the cured layer 300 is uneven and has low aesthetic appearance. By polishing the surface of the cured layer 300, the aesthetic appearance of the cured layer 300 can be improved, and further the aesthetic appearance of the repaired cured floor 100 can be improved.

[0075] Specifically, in step S510, the following steps are included but are not limited thereto:

[0076] S511: Polishing the cured layer 300 with resin abrasive discs of 500 mesh, 800 mesh and 1000 mesh in sequence.

[0077] It can be understood that by polishing the cured layer 300 with resin abrasive discs of gradually increasing mesh, the smoothness of the surface of the cured layer 300 can be gradually improved, and further the smoothness of the repaired cured floor 100 can be improved.

[0078] Reference Figure 1 and Figure 2 According to the cured floor repair structure of the second embodiment of the present application, the crack 110 in the crack area of the cured floor 100 is filled with the repair material, the surface of the crack area is covered with the repair layer 200 formed by the repair material, and the surface of the repair layer 200 is covered with the cured layer 300 formed by the water-soluble curing agent. By covering the crack area with a layer of repair layer 200, the repair layer 200 can be connected with the repair material in the crack 110 to form a whole, so that the inner wall of the crack 110 is tightly adhered to the repair material; at the same time, the repair layer 200 is adhered to the surface of the crack area, thereby avoiding secondary cracking of the surface of the crack area.

[0079] Although embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A cured floor patching process characterized by, The method comprises the following steps: carrying out surface treatment on a crack area of a cured floor (100) to remove impurities of the crack area; applying a repairing material on the surface of the crack area to make the repairing material flow into and fill cracks (110) of the crack area to repair the cracks (110); reapplying the repairing material on the surface of the repaired crack area to form a repairing layer (200), so that the repairing material in the cracks (110) and the repairing layer (200) are connected to form an integral whole; spraying a curing agent aqueous solution on the surface of the repairing layer (200) to form a curing layer (300) on the surface of the repairing layer (200); and carrying out surface treatment on the surface of the curing layer (300) to improve the smoothness of the surface of the curing layer (300).

2. A cured-in-place-pavement repair process as defined in claim 1, wherein, The surface treatment on the crack area of the cured floor (100) comprises the following steps: spraying water on the surface of the crack area to wet the crack area; cleaning the crack area to remove solid impurities and excess water on the surface of the crack area.

3. A cured-in-place-pavement process according to claim 2, wherein, The surface treatment on the crack area of the cured floor (100) further comprises the following steps: rough grinding the surface of the cleaned crack area.

4. A cured-in-place pavement repair process as defined in claim 3, wherein, The rough grinding of the surface of the cleaned crack area comprises the following steps: successively using 50-mesh and 150-mesh resin abrasive sheets to polish the surface of the crack area.

5. A cured-in-place pavement repair process as defined in claim 1, wherein, The repairing material is a concrete repairing agent and cement configured in a mass ratio of 1:

1.

6. A cured-in-place pavement repair process according to claim 1, wherein, The method further comprises the following steps: before spraying the curing agent aqueous solution, polishing the surface of the repairing layer (200) using a 300-mesh resin abrasive sheet.

7. A cured-in-place pavement repair process according to claim 1, wherein, The surface treatment on the surface of the curing layer (300) comprises the following steps: finely grinding the surface of the curing layer (300).

8. A cured-in-place pavement repair process as defined in claim 7, wherein, The finely grinding of the surface of the curing layer (300) comprises the following steps: successively using 500-mesh, 800-mesh and 1000-mesh resin abrasive sheets to polish the curing layer (300).

9. A cured floor patching structure, characterized by, The crack (110) of the crack area of the cured floor (100) is filled with the repairing material, the surface of the crack area is covered with the repairing layer (200) formed by the repairing material, and the surface of the repairing layer (200) is covered with the curing layer (300) formed by curing the curing agent aqueous solution.

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