A method and apparatus for temperature measurement in an integrated circuit test process

Abstract

The application provides a temperature measurement method and device in an integrated circuit test process, and relates to the field of integrated circuit testing.The method comprises the following steps: establishing a circuit model matched with the integrated circuit and an image analysis model in a processing module, the circuit model is composed of multiple virtual circuit modules, the processing module is connected with a test device, the test device records a measured circuit module number, the processing module reads the measured circuit module number, and the virtual circuit module is locked according to the measured circuit module number; an infrared image of the integrated circuit is acquired by using an infrared thermal imager and is sent to the processing module, the processing module identifies the infrared image, and a measured circuit module image in the infrared image is locked; multiple temperature measurement points are established on the locked virtual circuit module; the processing module analyzes the measured circuit module image according to the image analysis model, and calculates corresponding temperature values of the multiple temperature measurement points; and the method provided by the application is helpful to improve the measurement efficiency and the measurement accuracy.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit testing technology, in particular to a temperature measurement method and device in an integrated circuit testing process. BACKGROUND

[0002] In the integrated circuit testing process, the probe of the testing equipment is usually connected with each test point on the integrated circuit, the current flows through the circuit module corresponding to the test point, the circuit module generates heat, the circuit module includes a printed circuit and electronic components arranged on the printed circuit, and the heat is usually concentrated on the electronic components. When the current is large, the printed circuit also generates heat due to the internal resistance. In order to obtain the heat distribution of the integrated circuit in use, the temperature values of multiple positions of each circuit module are usually measured by a tester using an electronic thermometer during the testing process of the integrated circuit board, and then recorded one by one. This method is not only low in measurement efficiency, but also has a large workload and a high error rate (a large amount of data needs to be recorded, and manual recording is prone to errors), and the accuracy is low (the number of temperature measurement points is usually small, and the accuracy of the temperature distribution judgment result is low). SUMMARY

[0003] The present application provides a temperature measurement method and device in an integrated circuit testing process, which is used to improve the measurement efficiency and accuracy of temperature measurement in the integrated circuit testing process.

[0004] In the first aspect of the present application, a temperature measurement method in an integrated circuit testing process is provided, which includes the following steps:

[0005] A circuit model matched with the integrated circuit is established in the processing module, and an image analysis model is established. The circuit model is composed of a plurality of virtual circuit modules, each virtual circuit module corresponds to each entity circuit module in the integrated circuit one by one. In the process of testing the integrated circuit by the testing equipment, the processing module is connected with the testing equipment, and the testing equipment records the test data. The test data includes the measured circuit module number of the measured entity circuit module. The virtual circuit module has a virtual circuit module number corresponding to the measured circuit module number. The processing module reads the measured circuit module number, and locks the virtual circuit module corresponding to the measured circuit module number in the circuit model according to the measured circuit module number;

[0006] An infrared image of the integrated circuit is obtained by an infrared thermal imager, and sent to the processing module. The processing module identifies the infrared image, and locks the measured circuit module image corresponding to the measured circuit module in the infrared image;

[0007] The processing module establishes a plurality of temperature measurement points on the locked virtual circuit module, and each temperature measurement point is arranged at equal intervals on the virtual circuit module;

[0008] The processing module analyzes the measured circuit module image according to the image analysis model, and calculates the corresponding temperature value at each temperature measurement point according to the color of the measured circuit module image at each temperature measurement point.

[0009] The processing module labels the temperature value corresponding to each temperature measurement point.

[0010] The processing module transmits the virtual circuit module to the display.

[0011] In some embodiments of the first aspect, the method for establishing the image analysis model comprises:

[0012] A plurality of integrated circuits are used as sample integrated circuits, a plurality of sample temperature measurement points are arranged on each sample entity circuit module in the sample integrated circuits, the sample entity circuit modules are tested, and the sample temperature measurement points are measured for temperature at the same time, sample temperature values are obtained, an infrared thermal imager is used to obtain sample infrared images, the image colors in the sample infrared images corresponding to the positions of the sample temperature measurement points and the sample temperature values are extracted as sample analysis features, and the colors in each sample analysis feature are different.

[0013] In some embodiments of the first aspect, when the measured circuit module is analyzed, the sample features are matched with the measured circuit module image, and the sample temperature values matched are used as the temperature values at the temperature measurement points.

[0014] In some embodiments of the first aspect, the method for labeling the temperature value corresponding to each temperature measurement point comprises:

[0015] The temperature value is labeled beside the temperature measurement point.

[0016] In some embodiments of the first aspect, the method for labeling the temperature value corresponding to each temperature measurement point comprises:

[0017] All temperature measurement points are numbered, the temperature values are numbered, and all the numbered temperature values are labeled beside the virtual circuit module in the form of a list.

[0018] In some embodiments of the first aspect, the method for labeling the temperature value corresponding to each temperature measurement point comprises:

[0019] All temperature measurement points are numbered, the temperature values are numbered, and all the numbered temperature values are labeled beside the circuit model in the form of a list.

[0020] In some embodiments of the first aspect, the method for labeling the temperature value corresponding to each temperature measurement point comprises:

[0021] All temperature measurement points are numbered, the temperature values are numbered, and all the numbered temperature values are listed.

[0022] The temperature value list of all the measured circuit modules is spliced to form a total table, and the total table is marked beside the circuit model.

[0023] In some embodiments of the first aspect, each temperature measuring point on the virtual circuit module is equally divided on the virtual circuit module based on the total length of the circuit of the virtual circuit module.

[0024] In some embodiments of the first aspect, the method of marking the temperature value corresponding to each temperature measuring point comprises:

[0025] A circle is drawn at each temperature measuring point, the circle is filled with the same color as the analysis feature, and the diameter of the circle is positively correlated with the wavelength of the color light filled therein.

[0026] In the second aspect of the present application, a temperature measurement device in an integrated circuit test process is provided, comprising:

[0027] An infrared thermal imager acquires an infrared image of the integrated circuit;

[0028] A processing module is connected to the test device and the infrared thermal imager, the infrared thermal imager transmits the infrared image to the processing module, the test device tests the integrated circuit and obtains a measured circuit module, the processing module locks a virtual circuit module according to the measured circuit module, the processing module has a processor and a memory, the memory stores a computer program, the computer program is adapted to be executed by the processor to implement the temperature measurement method in the integrated circuit test process as described in the first aspect, and the virtual circuit module is processed according to the temperature measurement method in the integrated circuit test process;

[0029] A display is connected to the processing module, and the processing module transmits the processed virtual circuit module to the display.

[0030] The present application has the following beneficial effects:

[0031] The distribution density of the temperature measuring points is increased, the temperature distribution density of each part of the virtual circuit module transmitted to the display is improved, the temperature distribution result obtained by measurement is more accurate, the integrated circuit designer can use the test result to better make corresponding adjustments for later research and development, so that the temperature distribution tends to approach the expected distribution mode; the infrared thermal imager can obtain images of each part of the measured circuit module, and the temperature value of any one or more positions of the measured circuit module can be obtained through processing and analysis of the processing module, compared with the manual measurement in the prior art, the measurement efficiency and accuracy are improved. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0033] Fig. 1 is a flowchart of a temperature measurement method in an integrated circuit test process in the embodiments of the present application;

[0034] Fig. 2 is a schematic diagram of the correspondence between the physical circuit module, the infrared image and the virtual circuit module in the embodiments of the present application;

[0035] Fig. 3 is a structural schematic diagram of a temperature measurement device in an integrated circuit test process in the embodiments of the present application.

[0036] Reference signs:

[0037] 101, processing module; 102, infrared thermal imager; 103, display. DETAILED DESCRIPTION

[0038] The embodiments of the present application will be further described in detail below in combination with the drawings and embodiments, and the terms used in the embodiments part of the present application are only used to explain the specific embodiments of the present application, but not intended to limit the present application.

[0039] As shown in Figs. 1 to 3 , in the embodiment 1 of the present application, a temperature measurement method in an integrated circuit test process is provided, which comprises the following steps:

[0040] A circuit model matched with the integrated circuit is established in the processing module 101, and an image analysis model is also established. The circuit model is composed of a plurality of virtual circuit modules, each of which corresponds to each physical circuit module in the integrated circuit. In the process of testing the integrated circuit by the test equipment, the processing module 101 is connected with the test equipment, and the test equipment records the test data, which includes the measured circuit module number of the measured physical circuit module. The virtual circuit module has a virtual circuit module number corresponding to the measured circuit module number. The processing module 101 reads the measured circuit module number, and locks the virtual circuit module corresponding to the measured circuit module number in the circuit model according to the measured circuit module number.

[0041] The infrared image of the integrated circuit is acquired by the infrared thermal imager 102, and is sent to the processing module 101. The processing module 101 identifies the infrared image, and locks the measured circuit module image corresponding to the measured circuit module in the infrared image.

[0042] The processing module 101 establishes a plurality of temperature measurement points on the locked virtual circuit module, and each temperature measurement point is arranged at equal intervals on the virtual circuit module.

[0043] The processing module 101 analyzes the measured circuit module image according to the image analysis model, and calculates the corresponding temperature value at each temperature measurement point according to the color of the measured circuit module image at each temperature measurement point.

[0044] The processing module 101 labels the temperature value corresponding to each temperature measurement point.

[0045] The processing module 101 transmits the virtual circuit module to the display 103.

[0046] Through the above implementation of embodiment 1, the distribution density of the temperature measurement points is increased, the temperature distribution density of the virtual circuit module transmitted to the display 103 is improved, the temperature distribution result obtained by measurement is more accurate, the integrated circuit designer can use the test result to better make corresponding adjustment for later research and development, so that the temperature distribution tends to approach the expected distribution mode; the infrared thermal imager 102 can obtain the image of each part of the measured circuit module, and the temperature value of any one or more positions of the measured circuit module can be obtained through the processing and analysis of the processing module 101. Compared with the manual measurement in the prior art, the measurement efficiency and accuracy are improved.

[0047] In some embodiments of embodiment 1, the method for establishing the image analysis model comprises:

[0048] A plurality of integrated circuits are used as sample integrated circuits, a plurality of sample temperature measurement points are arranged on each sample physical circuit module in the sample integrated circuit, the sample physical circuit module is tested, the sample temperature measurement points are measured at the same time, sample temperature values are obtained, the sample infrared image is obtained by the infrared thermal imager 102, the image color of the position corresponding to the sample temperature measurement point in the sample infrared image and the sample temperature value are extracted as sample analysis features, and the colors in each sample analysis feature are different.

[0049] In some embodiments of embodiment 1, when the measured circuit module is analyzed, the sample features are matched with the measured circuit module image, and the sample temperature value matched is used as the temperature value at the temperature measurement point.

[0050] For example, the color value of the measured temperature point in the measured circuit module image is RGB (120, 20, 50), there is a color with color value RGB (120, 20, 50) in the sample feature, and the sample temperature value corresponding to the color is 43℃, so the temperature value of the measured circuit module at the temperature measuring point is 43℃; in order to improve the matching success rate, a matching error is set in the processing module 101, and the maximum error value is set to 10, for example, the color value of the measured temperature point in the measured circuit module image is RGB (120, 20, 50), there is a color with color value RGB (124, 23, 51) in the sample feature, and the sample temperature value corresponding to the color is 43℃, since the difference between the values in RGB is within the maximum error value range, the temperature value of the measured circuit module at the temperature measuring point is 43℃, when there are multiple matching results, the sample temperature value corresponding to the color in the sample feature with the smallest error is used as the temperature value at the temperature measuring point.

[0051] In some embodiments of embodiment 1, the method for marking the temperature value corresponding to each temperature measuring point comprises:

[0052] Marking the temperature value beside the temperature measuring point.

[0053] Through the above embodiments of embodiment 1, the temperature value is marked beside the temperature measuring point, which helps to quickly observe and obtain the temperature value at the temperature measuring point.

[0054] In some embodiments of embodiment 1, the method for marking the temperature value corresponding to each temperature measuring point comprises:

[0055] Numbering all temperature measuring points, making temperature values with numbers, and marking all temperature values with numbers in the form of a list beside the virtual circuit module.

[0056] Through the merchant implementation of embodiment 1, the temperature value is marked in the form of a list beside the virtual circuit module, which helps to quickly observe and obtain the temperature distribution mode in the virtual circuit module.

[0057] In some embodiments of embodiment 1, the method for marking the temperature value corresponding to each temperature measuring point comprises:

[0058] Numbering all temperature measuring points, making temperature values with numbers, and marking all temperature values with numbers in the form of a list beside the circuit model.

[0059] Through the above embodiments of embodiment 1, according to the number, the temperature value corresponding to the temperature measuring point position in the list can be quickly found.

[0060] In some embodiments of embodiment 1, the method for marking the temperature value corresponding to each temperature measuring point comprises:

[0061] Number all the temperature measuring points, so that the temperature values are numbered, and list all the temperature values after numbering;

[0062] Splice the temperature value list of all measured circuit modules to form a total table, and mark the total table next to the circuit model.

[0063] Through the above implementation of embodiment 1, after all the entity circuit modules on the integrated circuit are measured, the processing module 101 transmits the entire circuit model to the display 103, so as to observe and obtain the temperature distribution mode on the entire integrated circuit; through the setting of the total table, it is helpful to quickly observe and obtain the temperature distribution mode in the virtual circuit module, and quickly observe and find the temperature value corresponding to the temperature measuring point position.

[0064] In some embodiments of embodiment 1, each temperature measuring point on the virtual circuit module is equally divided based on the total length of the virtual circuit module.

[0065] In some embodiments of embodiment 1, the method for marking the temperature value corresponding to each temperature measuring point comprises:

[0066] Draw a circle at each temperature measuring point, fill the circle with the same color as the analysis feature, and the diameter of the circle is positively correlated with the wavelength of the color light filled therein.

[0067] Through the above implementation of embodiment 1, the observation and reading convenience of the display result is improved.

[0068] It should be noted that in Fig. 2 , the feature referred to by a is the test contact of the circuit module, the feature referred to by b is the circuit, and the feature referred to by c is the temperature measuring point (the temperature measuring point after being marked by circle filling).

[0069] As Fig. 3 shown, in embodiment 2 of the present application, a temperature measuring device in an integrated circuit test process is provided, which comprises:

[0070] An infrared thermal imager 102 acquires an infrared image of the integrated circuit;

[0071] A processing module 101 is connected with a test device and the infrared thermal imager 102, the infrared thermal imager 102 transmits the infrared image to the processing module 101, the test device tests the integrated circuit and obtains a measured circuit module, the processing module 101 locks a virtual circuit module according to the measured circuit module, the processing module 101 has a processor and a memory, the memory stores a computer program, the computer program is adapted to be executed by the processor to realize the temperature measuring method in the integrated circuit test process as described in embodiment 1, and the virtual circuit module is processed according to the temperature measuring method in the integrated circuit test process;

[0072] The display 103 is connected with the processing module 101, and the processing module 101 transmits the processed virtual circuit module to the display 103.

[0073] The above embodiments are only explanations of the present application, and are not limitations of the present application. Those skilled in the art can make modifications to the embodiments of the present application without creative contribution after reading the specification, and the modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A method of temperature measurement in an integrated circuit test process, characterized by, It comprises the following steps: A circuit model matched with the integrated circuit is established in the processing module, and an image analysis model is established, the circuit model is composed of multiple virtual circuit modules, each virtual circuit module corresponds to each entity circuit module in the integrated circuit one by one, during the test of the integrated circuit by the test equipment, the processing module is connected with the test equipment, the test equipment records the test data, the test data includes the measured circuit module number of the measured entity circuit module, the virtual circuit module has a virtual circuit module number corresponding to the measured circuit module number, the processing module reads the measured circuit module number, and locks the virtual circuit module corresponding to the measured circuit module number in the circuit model according to the measured circuit module number; The infrared image of the integrated circuit is obtained by the infrared thermal imager and sent to the processing module, the processing module identifies the infrared image, and locks the measured circuit module image corresponding to the measured circuit module in the infrared image; The processing module establishes multiple temperature measuring points on the locked virtual circuit module, and each temperature measuring point is arranged at equal intervals on the virtual circuit module; The processing module analyzes the measured circuit module image according to the image analysis model, calculates the corresponding temperature value at each temperature measuring point according to the color of the measured circuit module image at each temperature measuring point; The processing module marks the temperature value corresponding to each temperature measuring point; The processing module transmits the virtual circuit module to the display.

2. The method of claim 1, wherein, The establishment method of the image analysis model comprises: A plurality of integrated circuits are used as sample integrated circuits, a plurality of sample temperature measuring points are arranged on each sample entity circuit module in the sample integrated circuit, the sample temperature measuring points are measured for temperature while the sample entity circuit module is tested, the sample temperature value is obtained, and the sample infrared image is obtained by the infrared thermal imager, the image color at the position corresponding to the sample temperature measuring point in the sample infrared image and the sample temperature value are extracted as sample analysis features, and the colors in each sample analysis feature are different.

3. The method of claim 2, wherein the temperature measurement is taken after the integrated circuit is powered on and before the integrated circuit is powered off. When analyzing the measured circuit module, the sample features are matched with the measured circuit module image, and the matched sample temperature value is used as the temperature value at the temperature measuring point. ​ 4. The method of claim 1, wherein The method for marking the temperature value corresponding to each temperature measuring point comprises: The temperature value is marked beside the temperature measuring point.

5. The method of claim 1, wherein, The method for marking the temperature value corresponding to each temperature measuring point comprises: All temperature measuring points are numbered, the temperature value is numbered, and all temperature values with numbers are marked beside the virtual circuit module in the form of a list.

6. The method of claim 1, wherein The method for marking the temperature value corresponding to each temperature measuring point comprises: All temperature measuring points are numbered, the temperature value is numbered, and all temperature values with numbers are marked beside the circuit model in the form of a list.

7. The temperature measurement method during integrated circuit testing according to claim 1, characterized in that, The method for marking the temperature value corresponding to each temperature measuring point comprises: All temperature measuring points are numbered, the temperature value is numbered, and all temperature values are listed; The temperature value lists of all measured circuit modules are spliced to form a total table, and the total table is marked beside the circuit model.

8. The method of claim 1, wherein: Each temperature measuring point on the virtual circuit module is equally divided based on the total length of the virtual circuit module.

9. The method of claim 3, wherein, The method for marking the temperature value corresponding to each temperature measuring point comprises: A circle is drawn at each temperature measuring point, the circle is filled with the same color as the analysis feature, and the diameter of the circle is positively correlated with the wavelength of the color light filled therein.

10. A temperature measurement device in an integrated circuit test process, characterized by The method comprises the following steps: an infrared thermal imager is arranged to obtain an infrared image of the integrated circuit; a processing module is connected to the testing device and the infrared thermal imager, the infrared thermal imager transmits the infrared image to the processing module, the testing device tests the integrated circuit and obtains a measured circuit module, the processing module locks the virtual circuit module according to the measured circuit module, the processing module has a processor and a memory, the memory stores a computer program, the computer program is adapted to be executed by the processor to implement the temperature measurement method in the integrated circuit testing process according to any one of claims 1 to 9, and the virtual circuit module is processed according to the temperature measurement method in the integrated circuit testing process; a display is connected to the processing module, and the processing module transmits the processed virtual circuit module to the display.

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