Method for exposing and inspecting internal structure of diode

Abstract

The application discloses a diode internal structure stripping method and a checking method, belongs to the technical field of diode structure analysis, and solves the problem that the bolt-mounted diode or the axial lead metal shell diode cannot be stripped of the internal structure by a metal round cap device opening machine for checking in the prior art. The stripping method comprises the following steps: providing a transverse sample and a longitudinal sample; obtaining external structure information and internal structure information of the transverse sample and the longitudinal sample; determining a transverse opening section and an opening clamping surface of the transverse sample and a longitudinal grinding section of the longitudinal sample, and marking the transverse opening section on the transverse sample and marking the longitudinal grinding section on the longitudinal sample; performing transverse mechanical opening on the transverse sample to strip the transverse structure of the transverse sample; and performing longitudinal grinding on the longitudinal sample to strip the longitudinal structure of the longitudinal sample. The diode internal structure stripping method and the checking method can be used for stripping and checking the diode internal structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diode structure analysis, in particular to a method for stripping and checking the internal structure of a diode. BACKGROUND

[0002] In the prior art, the internal structure of a diode is usually detected by using a metal round cap device opening machine to open the diode.

[0003] However, the bolt-mounted diode or the axial lead metal shell diode usually has one or several of the following characteristics: large pipe diameter, long shape, thick and high-strength pipe shell, and shape that cannot match the metal round cap device opening machine. The above leads to the fact that the bolt-mounted diode or the axial lead metal shell diode cannot be stripped of the internal structure by using the metal round cap device opening machine for inspection. SUMMARY

[0004] In view of the above analysis, the present application aims to provide a method for stripping and checking the internal structure of a diode, which solves the problem that the bolt-mounted diode or the axial lead metal shell diode cannot be stripped of the internal structure by using the metal round cap device opening machine for inspection in the prior art.

[0005] The main purpose of the present application is achieved by the following technical solutions:

[0006] The present application provides a method for stripping the internal structure of a diode, comprising the following steps:

[0007] Step 1: providing at least two diode samples, at least one diode sample as a transverse sample, and the remaining diode samples as longitudinal samples;

[0008] Step 2: obtaining the external structure information and the internal structure information of the transverse samples and the longitudinal samples;

[0009] Step 3: determining the transverse opening section and the opening clamping surface of the transverse sample and the longitudinal grinding section of the longitudinal sample according to the external structure information and the internal structure information of the transverse sample and the longitudinal sample, and marking the transverse opening section on the transverse sample and marking the longitudinal grinding section on the longitudinal sample;

[0010] Step 4: performing transverse mechanical opening on the transverse sample to strip the transverse structure of the transverse sample, and performing longitudinal grinding on the longitudinal sample to strip the longitudinal structure of the longitudinal sample.

[0011] Further, the diode is a bolt-mounted diode or an axial lead metal shell diode.

[0012] Further, the external structure information is the packaging structure and the welding method; and the internal structure information is the position of the necking mechanical connection end, the chip orientation, and the position of the axis passing through the center of the chip.

[0013] Further, the transverse unsealing section is located below the necking mechanical connection end and above the lower surface of the chip.

[0014] Further, the longitudinal grinding section penetrates the axis of the longitudinal sample through the center of the chip and is parallel to one of the groups of edges of the chip.

[0015] Further, the external structural information of the transverse sample and the longitudinal sample is obtained by using an optical microscope or a stereomicroscope.

[0016] Further, the internal structural information of the transverse sample and the longitudinal sample is obtained by using an X-ray detection system.

[0017] Further, between the above-mentioned steps 3 and 4, the following step is further included: treating the outer surface of the transverse sample and the longitudinal sample to remove surface protrusions that hinder subsequent unsealing and grinding.

[0018] Further, the surface protrusions are bolt heads and / or lead wires.

[0019] Further, in the above-mentioned step 4, the transverse mechanical unsealing of the transverse sample includes the following steps:

[0020] Step 41: fixing the transverse sample by using a bench vice;

[0021] Step 42: using a saw blade to reciprocally cut along the transverse unsealing section, immediately loosening after eating and becoming empty, unlocking the bench vice, and rotating 60° clockwise or counterclockwise downward along the marked circumference, and then fixing the transverse sample by using the bench vice again;

[0022] Step 43: repeating step 42 until the transverse unsealing section is completely cut open, separating the two parts along the axis direction of the transverse sample, exposing the transverse structure of the transverse sample, and completing the transverse mechanical unsealing.

[0023] Further, in the above-mentioned step 4, the longitudinal grinding of the longitudinal sample includes the following steps:

[0024] Step 41’: pouring the longitudinal sample into a pouring material;

[0025] Step 42’: longitudinally grinding in a direction parallel to the longitudinal axis to the longitudinal grinding section, exposing the longitudinal structure of the longitudinal sample and polishing, and completing the longitudinal grinding.

[0026] Further, the pouring material is epoxy resin.

[0027] Further, in the above-mentioned step 42’, during the longitudinal grinding, when the shell of the longitudinal sample is ground through, the pouring material is immediately poured into the cavity of the longitudinal sample to support the shell and protect the internal structure.

[0028] The stripping method comprises the following steps:

[0029] Step 1: providing three diode samples, one diode sample as a lateral sample, one diode sample as a longitudinal sample, and the remaining one diode sample as a comparison sample;

[0030] Step 2: obtaining the external structural information (for example, packaging structure) and internal structural information (for example, the position of the necking mechanical connection end 1, the orientation of the chip 2, and the position of the axis passing through the center of the chip 2) of the lateral sample, the longitudinal sample, and the comparison sample;

[0031] Step 3: determining the lateral unsealing section and unsealing clamping surface of the lateral sample, the longitudinal grinding section of the longitudinal sample, and the lateral unsealing section, unsealing clamping surface, and longitudinal grinding section of the comparison sample according to the external structural information and internal structural information of the lateral sample, the longitudinal sample, and the comparison sample, and marking the lateral unsealing section on the lateral sample, marking the longitudinal grinding section on the longitudinal sample, and marking the lateral unsealing section and the longitudinal grinding section on the comparison sample;

[0032] Step 4: performing lateral mechanical unsealing on the lateral sample to strip the lateral structure of the lateral sample, and performing longitudinal grinding on the longitudinal sample to strip the longitudinal structure of the longitudinal sample;

[0033] performing lateral mechanical unsealing on the comparison sample to strip the lateral structure of the lateral sample, obtaining a first lateral part and a second lateral part, and obtaining a lateral structure diagram of the first lateral part and a lateral structure diagram of the second lateral part; performing longitudinal grinding on the first lateral part and the second lateral part respectively to obtain a first longitudinal part and a second longitudinal part, and splicing the first longitudinal part and the second longitudinal part to obtain a spliced longitudinal structure diagram;

[0034] Step 5: comparing the lateral structure of the lateral sample with the lateral structure diagram of the first lateral part or the lateral structure diagram of the second lateral part to determine the consistency of the lateral structure of the lateral sample;

[0035] comparing the longitudinal structure of the longitudinal sample with the spliced longitudinal structure diagram to determine the consistency of the longitudinal structure of the longitudinal sample.

[0036] The application also provides a diode internal structure inspection method, comprising the following steps:

[0037] Step A: using the above-mentioned diode internal structure stripping method to strip the lateral structure of the lateral sample and the longitudinal structure of the longitudinal sample;

[0038] Step B: inspecting the lateral structure and the longitudinal structure.

[0039] Further, the inspection of the lateral structure and the longitudinal structure is carried out by means of a stereomicroscope, a metallographic microscope or a scanning electron microscope.

[0040] Compared with the prior art, the present application can achieve at least one of the following beneficial effects:

[0041] a) The method for stripping the internal structure of a diode provided by the present application is completely different from the existing metal round cap device opening machine. According to the internal structure information and the external structure information of the diode sample, the lateral mechanical opening and the longitudinal grinding are carried out, so that the internal structure stripping of the bolt-mounted diode or the axial lead metal shell diode can be realized without using the metal round cap device opening machine.

[0042] b) The method for stripping the internal structure of a diode provided by the present application can immediately fill the filling material into the cavity of the longitudinal sample to support the shell and protect the internal structure when the shell of the longitudinal sample is ground through during the longitudinal grinding, so that the shell collapse deformation and extrusion of the internal structure of the longitudinal sample during the longitudinal grinding can be avoided.

[0043] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the present application. The objects and other advantages of the present application can be achieved and obtained by means of the structure particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0044] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. In the drawings:

[0045] Figure 1 Structure diagram of the bolt-mounted metal shell diode in the method for stripping the internal structure of a diode provided by the present application;

[0046] Figure 2 Structure diagram of the axial lead metal shell diode in the method for stripping the internal structure of a diode provided by the present application;

[0047] Figure 3 Lateral structure actual diagram of the diode obtained by using the method for stripping the internal structure of a diode provided by the present application;

[0048] Figure 4 Longitudinal structure actual diagram of the diode obtained by using the method for stripping the internal structure of a diode provided by the present application;

[0049] Figure 5 Partial longitudinal structure actual diagram of the diode obtained by using the method for stripping the internal structure of a diode provided by the present application;

[0050] Figure 6 Another partial physical diagram of the longitudinal structure of the diode obtained by the peeling method of the internal structure of the diode according to the embodiment one of the present application;

[0051] Figure 7 A physical diagram of the transverse structure of the diode obtained by the peeling method of the internal structure of the diode according to the embodiment two of the present application;

[0052] Figure 8 A physical diagram of the longitudinal structure of the diode obtained by the peeling method of the internal structure of the diode according to the embodiment two of the present application;

[0053] Figure 9 A partial physical diagram of the longitudinal structure of the diode obtained by the peeling method of the internal structure of the diode according to the embodiment two of the present application.

[0054] Reference signs:

[0055] 1 - necked mechanical connection end; 2 - chip; 3 - lead. DETAILED DESCRIPTION

[0056] The preferred embodiments of the present application will be described in detail below with reference to the drawings, which form a part of this application, and together with the embodiments of the present application, illustrate the principles of the present application.

[0057] The present application provides a peeling method of the internal structure of a diode, which is a bolt-mounted diode (see Figure 1 ) or an axial lead metal shell diode (see Figure 2 ), and the peeling method comprises the following steps:

[0058] Step 1: providing at least two diode samples, at least one diode sample as a transverse sample and the remaining diode samples as longitudinal samples;

[0059] Step 2: obtaining the external structure information (for example, the packaging structure) and the internal structure information (for example, the position of the necked mechanical connection end 1, the orientation of the chip 2 and the position of the axis passing through the center of the chip 2) of the transverse sample and the longitudinal sample;

[0060] Step 3: determining the transverse opening section and the opening clamping surface of the transverse sample and the longitudinal grinding section of the longitudinal sample according to the external structure information and the internal structure information of the transverse sample and the longitudinal sample, and marking the transverse opening section on the transverse sample and marking the longitudinal grinding section on the longitudinal sample;

[0061] Step 4: performing transverse mechanical opening on the transverse sample to peel the transverse structure of the transverse sample, and performing longitudinal grinding on the longitudinal sample to peel the longitudinal structure of the longitudinal sample.

[0062] It should be noted that the obtained external structure information (for example, the packaging structure) is mainly used in the following two aspects: on the one hand, the external structure information can determine the opening clamping surface of the instrument during the transverse opening of the transverse sample, and the opening clamping surface can be selected to have a large thickness and / or be relatively flat; on the other hand, the external structure information can determine the protrusion in the longitudinal sample that needs to be removed in advance, which can exceed the size of the sample preparation container used in the sample preparation process of the longitudinal sample.

[0063] Compared with the prior art, the method for stripping the internal structure of the diode provided by the present application is completely different from the existing metal round cap device opening machine. According to the internal structure information and the external structure information of the diode sample, transverse mechanical opening and longitudinal grinding are performed, so that the internal structure stripping of the bolt-mounted diode or the axial lead metal shell diode can be realized without using the metal round cap device opening machine.

[0064] In order to ensure that the transverse opening section can basically reflect the transverse structure of the transverse sample, the transverse opening section is located below the necked mechanical connection end 1 and above the lower surface of the chip 2.

[0065] Similarly, in order to ensure that the longitudinal grinding section can basically reflect the longitudinal structure of the longitudinal sample, the longitudinal grinding section penetrates the axis through the center of the chip 2 of the longitudinal sample and is parallel to one group of edges of the chip 2.

[0066] In order to accurately obtain the external structure information of the transverse sample and the longitudinal sample, an optical microscope or a stereomicroscope can be used, and correspondingly, in order to accurately obtain the internal structure information of the longitudinal sample and the transverse sample, an X-ray detection system can be used for X-ray inspection.

[0067] In order to avoid the influence of the surface protrusions of the transverse sample and the longitudinal sample on the subsequent transverse opening and longitudinal grinding, the above step 3 and step 4 further include the following step: treating the outer surface of the transverse sample and the longitudinal sample to remove the surface protrusions (for example, bolt heads, lead wires 3, etc.) that hinder the subsequent opening and grinding.

[0068] In order to avoid damaging the whisker connection point at the top of the chip 2 of the transverse sample during the transverse mechanical opening, the transverse mechanical opening of the transverse sample in the above step 4 includes the following steps:

[0069] Step 41: fixing the transverse sample by using a bench vice;

[0070] Step 42: using a saw blade to reciprocally cut along the transverse opening section, immediately releasing after eating and becoming empty, unlocking the bench vice to prevent damage to the whisker connection point at the top of the chip 2 during cap removal, rotating 60° clockwise or counterclockwise downward along the marked circle, and then fixing the transverse sample by using the bench vice again;

[0071] Step 43: Repeat step 42 until the transverse opening profile is completely cut open, and separate the two parts along the axis direction of the transverse sample, expose the transverse structure of the transverse sample, and complete the transverse mechanical opening.

[0072] Similarly, the longitudinal grinding of the longitudinal sample in step 4 above includes the following steps:

[0073] Step 41': encapsulate the longitudinal sample in a filling material (e.g., epoxy resin);

[0074] Step 42': grind longitudinally (a double-disc grinder or a size-inscribed circle disc double-axial relative motion grinder can be used to improve grinding uniformity) in a direction parallel to the longitudinal axis until a longitudinal grinding profile is obtained, expose the longitudinal structure (e.g., chip 2 mounting position and bonding situation, etc.) of the longitudinal sample and polish, and complete the longitudinal grinding.

[0075] In order to avoid the shell of the longitudinal sample collapsing and deforming to extrude the internal structure during longitudinal grinding, in step 42' above, when the shell of the longitudinal sample is ground through during longitudinal grinding, the filling material is immediately filled into the cavity of the longitudinal sample to support the shell and protect the internal structure, thereby avoiding the shell of the longitudinal sample collapsing and deforming to extrude the internal structure during longitudinal grinding.

[0076] In consideration of the fact that in the case of only one transverse sample and one longitudinal sample, the same production line may also have a sample that is inconsistent with other samples, if this sample is taken as the transverse sample or the longitudinal sample, the situation of the diode on the entire production line may not be reflected, that is, the accuracy of the exposure method will be affected, therefore, the exposure method includes the following steps:

[0077] Step 1: provide three diode samples, one diode sample as a transverse sample, one diode sample as a longitudinal sample, and the remaining one diode sample as a comparison sample;

[0078] Step 2: obtain the external structure information (e.g., packaging structure) and internal structure information (e.g., position of necking mechanical connection end 1, orientation of chip 2, and position of axis passing through chip 2 center) of the transverse sample, the longitudinal sample, and the comparison sample;

[0079] Step 3: determining the transverse unsealing profile and unsealing clamping surface of the transverse sample, the longitudinal grinding profile of the longitudinal sample, and the transverse unsealing profile and longitudinal grinding profile of the comparison sample according to the external structure information and internal structure information of the transverse sample, the longitudinal sample and the comparison sample, and marking the transverse unsealing profile on the transverse sample, marking the longitudinal grinding profile on the longitudinal sample, and marking the transverse unsealing profile and longitudinal grinding profile on the comparison sample;

[0080] Step 4: performing transverse mechanical unsealing on the transverse sample to expose the transverse structure of the transverse sample, and performing longitudinal grinding on the longitudinal sample to expose the longitudinal structure of the longitudinal sample;

[0081] performing transverse mechanical unsealing on the comparison sample to expose the transverse structure of the transverse sample, obtaining the first transverse part and the second transverse part, and obtaining the transverse structure diagram of the first transverse part and the transverse structure diagram of the second transverse part; performing longitudinal grinding on the first transverse part and the second transverse part respectively to obtain the first longitudinal part and the second longitudinal part, and splicing the first longitudinal part and the second longitudinal part to obtain the spliced longitudinal structure diagram;

[0082] Step 5: comparing the transverse structure of the transverse sample with the transverse structure diagram of the first transverse part or the transverse structure diagram of the second transverse part to determine the consistency of the transverse structure of the transverse sample;

[0083] comparing the longitudinal structure of the longitudinal sample with the spliced longitudinal structure diagram to determine the consistency of the longitudinal structure of the longitudinal sample.

[0084] The application also provides a diode internal structure inspection method, comprising the following steps:

[0085] Step A: using the diode internal structure stripping method described above to strip the transverse structure of the transverse sample and the longitudinal structure of the longitudinal sample;

[0086] Step B: inspecting the transverse structure and the longitudinal structure.

[0087] Compared with the prior art, the diode internal structure inspection method provided by the application has basically the same beneficial effects as the diode internal structure stripping method provided above, and will not be described here.

[0088] Exemplarily, the inspection of the transverse structure and the longitudinal structure is performed by using a stereomicroscope, a metallographic microscope or a scanning electron microscope.

[0089] Embodiment one

[0090] In this embodiment, the device to be inspected is a SD51 type bolt-mounted diode produced by NJS Company, and the diode internal structure inspection method of this embodiment comprises the following steps:

[0091] Step S01: providing two diode samples, 1# sample as a transverse sample, 2# sample as a longitudinal sample;

[0092] Step S02: obtaining external structure information of the 1# sample and the 2# sample by using a stereomicroscope, determining the packaging structure and the welding mode of the 1# sample and the 2# sample;

[0093] obtaining internal structure information of the 1# sample and the 2# sample by using an X-ray detection system, determining the plane where the necking mechanical connection end is located, the chip orientation and the axis position passing through the center of the chip;

[0094] Step S03: marking a transverse opening section along the circumference of the outer surface of the 1# sample, and marking a longitudinal grinding section along the circumference of the outer surface of the 2# sample;

[0095] Step S04: performing necessary treatment on the outer surface of the 1# sample and the 2# sample, removing surface protrusions that hinder subsequent opening and grinding;

[0096] Step S05: performing transverse mechanical opening on the cavity of the internal structure of the 1# sample; fixing the 1# sample by using a bench clamp, and reciprocally cutting along the transverse opening section by using a saw blade, immediately releasing after the cutting is completed to prevent damaging the whisker connection point on the top of the chip, re-fixing the side surface and the opposite surface, and continuing to cut along the circumference;

[0097] Step S06: repeating Step S05 until the transverse opening section is completely cut, and then pulling out the metal cap top along the axis direction after the completion, exposing the transverse structure of the 1# sample, and completing the transverse mechanical opening;

[0098] Step S07: filling the 2# sample in epoxy resin, cutting the necking part perpendicular to the longitudinal axis after determining the necking part in Step S02, preparing a section along the longitudinal axis, immediately filling the epoxy resin into the inner cavity after the shell is ground through to avoid damage caused by subsequent grinding process, and grinding to the longitudinal grinding section, and exposing the longitudinal internal structure after the 2# sample is ground and polished;

[0099] Step S08: presenting the internal morphology of the 1# sample after the transverse opening under a microscope for inspection, presenting the overall morphology and the enlarged local morphology of the longitudinal section of the 2# sample for inspection, and photographing the chip mounting position and the bonding condition.

[0100] The inspection result of the embodiment is used, the internal transverse structure is shown in Figure 3 , and the internal longitudinal structure is shown in Figure 4 to Figure 6 .

[0101] Example Two

[0102] In this embodiment, the device to be inspected is a TVP1000 axial lead metal shell diode (non-bolt type package) produced by Chaoyang Radio Components Co., Ltd. The diode internal structure inspection method of this embodiment includes the following steps:

[0103] Step S01: Provide two diode samples, 1# sample as a transverse sample, and 2# sample as a longitudinal sample;

[0104] Step S02: Use an optical microscope to inspect the 1# sample and the 2# sample, observe the appearance of the axial lead metal shell diode, and determine the package structure and welding method;

[0105] Use X-ray inspection to determine the internal structure information of the 1# sample and the 2# sample, determine the plane where the neck mechanical connection end is located, the chip orientation, and the axis position passing through the center of the chip;

[0106] Step S03: Mark the transverse opening section along the circumference of the outer surface of the 1# sample, and mark the longitudinal grinding section along the circumference of the outer surface of the 2# sample;

[0107] Step S04: Perform necessary treatment on the outer surface of the 1# sample and the 2# sample to remove surface protrusions that interfere with subsequent opening and grinding (e.g., the part above the transverse opening is irrelevant);

[0108] Step S05: Mechanically open the cavity of the internal structure of the 1# sample and the 2# sample transversely; use a vise to fix the 1# sample and the 2# sample, use a saw blade to make a circumferential cut along the transverse opening section, and immediately release after the cut is completed to prevent damage to the whisker connection point on the top of the chip when the cap is removed. Change the side and fix the opposite side again, and continue to make a circumferential cut;

[0109] Step S06: Repeat step S05 until the transverse opening section is completely cut open, and then hold the top of the metal cap and pull it off along the axis direction to expose the transverse structure of the 1# sample, completing the transverse mechanical opening;

[0110] Step S07: Pour the 2# sample that has been transversely opened into epoxy resin, prepare a section along the longitudinal axis, and grind to the longitudinal grinding section. After grinding and polishing, the internal structure of the 2# sample is exposed;

[0111] Step S08: Present the internal morphology of the 1# sample after transverse opening under a microscope for inspection, present the overall morphology and local enlarged morphology of the longitudinal section of the 2# sample for inspection, and take photographs of the chip mounting position and adhesion.

[0112] The inspection results of this embodiment are as follows: Figure 7 , and the internal longitudinal structure is as follows: Figure 8 to Figure 9 .

[0113] The above description is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A method of exposing the internal structure of a diode, characterized by, The diode is a bolted diode or an axial lead metal shell diode, and the stripping method comprises the following steps: Step 1: providing three diode samples, one diode sample as a transverse sample, one diode sample as a longitudinal sample, and the remaining one diode sample as a comparison sample; Step 2: obtaining external structure information and internal structure information of the transverse sample, the longitudinal sample and the comparison sample; Step 3: determining a transverse opening section and an opening clamping surface of the transverse sample, a longitudinal grinding section of the longitudinal sample, and the transverse opening section and the longitudinal grinding section of the comparison sample according to the external structure information and the internal structure information of the transverse sample, the longitudinal sample and the comparison sample, and marking the transverse opening section on the transverse sample, marking the longitudinal grinding section on the longitudinal sample, and marking the transverse opening section and the longitudinal grinding section on the comparison sample; Step 4: performing transverse mechanical opening on the transverse sample to strip the transverse structure of the transverse sample; performing longitudinal grinding on the longitudinal sample to strip the longitudinal structure of the longitudinal sample; performing transverse mechanical opening on the comparison sample to strip the transverse structure of the transverse sample, obtaining a first transverse part and a second transverse part, and obtaining a transverse structure diagram of the first transverse part and a transverse structure diagram of the second transverse part; performing longitudinal grinding on the first transverse part and the second transverse part respectively to obtain a first longitudinal part and a second longitudinal part, and splicing the first longitudinal part and the second longitudinal part to obtain a spliced longitudinal structure diagram; Step 5: comparing the transverse structure of the transverse sample with the transverse structure diagram of the first transverse part or the transverse structure diagram of the second transverse part to judge the consistency of the transverse structure of the transverse sample; comparing the longitudinal structure of the longitudinal sample with the spliced longitudinal structure diagram to judge the consistency of the longitudinal structure of the longitudinal sample; The transverse opening section is located below the necked mechanical connection end and is higher than the lower surface of the chip; The longitudinal grinding section penetrates the axis through the chip center of the longitudinal sample and is parallel to one group of edges of the chip; In step 4, the transverse mechanical opening of the transverse sample comprises the following steps: Step 41: fixing the transverse sample; Step 42: reciprocating cutting along the transverse opening section, immediately loosening after eating and becoming empty, loosening the transverse sample, rotating 60 degrees clockwise or counterclockwise downward along the circumference, and fixing the transverse sample again; Step 43: repeating step 42 until the transverse opening section is completely cut open, separating the two parts along the axial direction of the transverse sample, stripping the transverse structure of the transverse sample, and completing the transverse mechanical opening; In step 4, the longitudinal grinding of the longitudinal sample comprises the following steps: Step 41': pouring the longitudinal sample into the pouring material; Step 42': longitudinally grinding in the direction parallel to the longitudinal axis to the longitudinal grinding section, stripping and polishing the longitudinal structure of the longitudinal sample, completing the longitudinal grinding, and in the process of longitudinal grinding, immediately pouring the pouring material into the cavity of the longitudinal sample when the shell of the longitudinal sample is ground through, supporting the shell and protecting the internal structure to avoid the shell collapse deformation and extrusion of the internal structure during the longitudinal grinding.

2. The method of claim 1, wherein the diode internal structure is exposed by a laser beam. The external structure information is the packaging structure and the welding mode.

3. The method of claim 1 or 2, wherein The internal structure information is the position of the necked mechanical connection end, the chip orientation, and the position of the axis passing through the center of the chip.

4. The method of claim 1 or 2, wherein Between the step 3 and the step 4, further comprising the step of treating the outer surface of the transverse sample and the longitudinal sample to remove surface protrusions that would hinder subsequent opening and grinding.

5. A method of inspecting an internal structure of a diode, characterized by, Comprising the steps of: Step A: exposing the transverse structure of the transverse sample and the longitudinal structure of the longitudinal sample using the method of exposing the internal structure of a diode according to any one of claims 1 to 4; Step B: inspecting the transverse structure and the longitudinal structure.

Images