Lens module and method for manufacturing lens module

Abstract

A lens module includes a circuit board, an image sensor, a magnet and a lens, wherein the circuit board includes a first area, a second area and a third area connected in sequence, an angle is formed between the third area and the first area to form an accommodation space, the third area has a coil on one side facing the accommodation space, and the second area is bent; the image sensor is located in the accommodation space and fixedly connected to the first area; the magnet is fixedly connected to the image sensor and spaced apart from the coil; the lens is fixedly connected to the coil; wherein the fixedly connected image sensor and the magnet, and the fixedly connected coil and the lens are elastically connected through the bent second area. The present application also provides a method for manufacturing a lens module.

Description

Technical Field

[0001] The present application relates to the field of lens modules, and in particular to a lens module and a method for manufacturing the lens module. Background Art

[0002] Whether users are shooting in motion or in a non-motion process, the images or videos taken by the lens module are often shaken and blurred due to shaking (such as hand shaking). In order to solve this technical problem, optical image stabilization (OIS) technology has emerged. This technology is a kind of electronic device (such as mobile phones, tablets, etc.) shake detection through structures such as suspension wires, balls or gyroscopes, and then the OIS and voice coil motor (VCM) move the lens in the opposite direction to compensate for the offset of light on the image sensor (CMOS image sensor, CMOS) caused by the shaking of the lens module, thereby effectively overcoming the problem of shaking and blurring of the images or videos taken due to shaking.

[0003] However, the above structure needs to have a separate voice coil motor and an optical image stabilization structure, which results in a larger size of the lens module and does not meet the requirements for component integration. In addition, the pixels of the lens module are related to the size of the image sensor in the lens module. The larger the image sensor size, the higher the pixel. Under the premise that the installation volume of the lens module is limited, the size of the image sensor is limited, which makes it difficult to increase the pixel of the lens module. Summary of the invention

[0004] In view of this, it is necessary to provide a lens module with an anti-shake function and a small size to solve the above technical problems.

[0005] In addition, it is necessary to provide a method for manufacturing a lens module.

[0006] A lens module comprises a circuit board, an image sensor, a magnet and a lens, wherein the circuit board comprises a first area, a second area and a third area which are connected in sequence, an angle is formed between the third area and the first area to form an accommodating space, the third area has a coil on a side facing the accommodating space, and the second area is bent; the image sensor is located in the accommodating space and fixedly connected to the first area; the magnet is fixedly connected to the image sensor and spaced apart from the coil; the lens is fixedly connected to the coil; wherein the fixedly connected image sensor and the magnet, and the fixedly connected coil and the lens are elastically connected via the bent second area.

[0007] In some embodiments, the second region is a soft board region.

[0008] In some embodiments, the bent shape is at least one of a wave shape, a W shape, and an S shape.

[0009] In some embodiments, the circuit board further includes a shaping layer, and the shaping layer is located at a corner area where the second region is bent.

[0010] In some embodiments, the material of the shaping layer is selected from one of polyethylene naphthalate and polyester resin.

[0011] In some embodiments, the lens module further includes a first bracket, the first bracket is accommodated in the accommodating space and fixed on the circuit board located in the first area, and the magnet is fixed on the first bracket.

[0012] In some embodiments, the lens module further includes a second bracket, which is located in a peripheral area of ​​the first bracket and spaced apart from the first bracket, and the circuit board located in the third area is fixed on the second bracket.

[0013] In some embodiments, a side of the circuit board located in the third region facing away from the coil has a connection pad.

[0014] A method for manufacturing a lens module includes: providing a circuit board, the circuit board including a first area, a second area and a third area connected in sequence, bending the third area toward the first area to form an accommodating space, the third area having a coil on the side facing the accommodating space, and the second area being bent; placing an image sensor in the accommodating space and fixedly connected to the first area; fixing a magnet to the image sensor and spacing it from the coil; fixing a lens to the coil, so that the image sensor and the magnet, and the coil and the lens are elastically connected through the bent second area.

[0015] In some embodiments, the step of forming a circuit board includes: providing a first circuit substrate, including a first area, a second area, and a third area connected in sequence; covering the surface of the first circuit substrate located in the second area with an insulating layer; forming a second circuit substrate on the surface of the first circuit substrate located in the first area and the third area, the insulating layer located in the second area is exposed to the second circuit substrate, and the second circuit substrate located in the third area includes a coil; bending the second area to form a circuit board in which the second area is a bent shape.

[0016] In some embodiments, the step of forming the circuit board further includes: forming a third circuit substrate on a surface of the first circuit substrate located in the first area and the third area facing away from the second circuit substrate, and the third circuit substrate located in the third area includes a connection pad.

[0017] In some embodiments, the bent shape is at least one of a wave shape, a W shape, and an S shape.

[0018] In some embodiments, the manufacturing method further comprises the step of forming a shaping layer at a corner region located at a bend of the second zone.

[0019] In some embodiments, the material of the shaping layer is selected from one of polyethylene naphthalate and polyester resin.

[0020] The lens module provided by the present application includes a circuit board, an image sensor, a magnet and a lens. Among them, there is a coil on the circuit board, the coil is fixedly connected to the lens, the image sensor is fixedly connected to the magnet, the fixedly connected image sensor and magnet, and the fixedly connected coil and lens are elastically connected through a bent soft board area. When the lens module is shaken by an external force, the lens and the coil shake synchronously and drive the image sensor and the magnet to move synchronously through the bent soft board area, compensating for the offset of light on the image sensor caused by the shaking of the lens module, thereby effectively overcoming the problem of shaking and blurring of the captured image or video caused by shaking. The coil is formed on the circuit board, and the magnet is set in the accommodation space formed by the circuit board. On the premise of meeting the function of the lens module, it replaces the additionally set voice coil motor, effectively reducing the volume of the lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic cross-sectional view of a first circuit substrate provided in an embodiment of the present application.

[0022] Figure 2 For Figure 1 The schematic cross-sectional view of the surface of the first circuit substrate being covered with an insulating layer is shown.

[0023] Figure 3 For Figure 2 The surface of the first circuit substrate shown is a schematic cross-sectional view of covering a first copper clad laminate and a second copper clad laminate.

[0024] Figure 4 For Figure 3 The cross-sectional diagram of the first copper clad laminate and the second copper clad laminate after circuits are made and covered with solder mask

[0025] Figure 5 The schematic cross-sectional view of a circuit board obtained by removing the first copper clad laminate and the second copper clad laminate located in the second area and after circuit fabrication.

[0026] Figure 6 for Figure 5 A top view of the circuit board is shown.

[0027] Figure 7 For an embodiment Figure 5 The circuit board in the second zone is shown as a schematic diagram of a bent structure formed after being bent.

[0028] Figure 8 For another embodiment Figure 5 The circuit board in the second zone is shown as a schematic diagram of a bent structure formed after being bent.

[0029] Fig. 9 To combine the image sensor with Figure 5 The cross-sectional diagram of the bent circuit board after fixed installation is shown.

[0030] Fig.10 To combine the lens with Fig. 9 The cross-sectional schematic diagram of the lens module obtained after the structure shown is assembled.

[0031] Fig.11 In one embodiment, Fig.10 A top view of a lens module connected to a connector.

[0032] Fig.12 For another embodiment Fig.10 A top view of a lens module connected to a connector.

[0033] Main component symbols

[0034]

[0035]

[0036] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0037] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0039] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0040] See also Figures 1 to 12 The embodiment of the present application provides a lens module 200 with an anti-shake function and a small size. The preparation method of the lens module 200 includes the following steps:

[0041] Step S1: Please refer to Figure 1 , providing a first circuit substrate 10, including a first area I, a second area II and a third area III connected in sequence.

[0042] The first circuit substrate 10 includes a first dielectric layer 11 and a first circuit layer 13 stacked along a first direction L1, and at least a portion of the first circuit layer 13 is exposed to the first dielectric layer 11. The number of the first circuit layer 13 may be one or more layers. When the number of the first circuit layer 13 is multiple layers, the multiple first circuit layers 13 are spaced apart by the first dielectric layer 11 and are electrically connected to each other through the conductive holes 15. In this embodiment, the first circuit substrate 10 is a double-layer circuit substrate, that is, the number of the first dielectric layer 11 is one layer, the number of the first circuit layer 13 is two layers, and the two first circuit layers 13 are respectively located on two opposite surfaces of the first dielectric layer 11.

[0043] The material of the first dielectric layer 11 can generally be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), so that the first circuit substrate 10 has flexibility to facilitate bending processing in subsequent processes and has elastic buffering force.

[0044] The first circuit substrate 10 includes a first area I, a second area II and a third area III, and the second area II is connected to the first area I and the third area III. The number of the second area II and the third area III is equal, and each is a plurality. Figure 6In this embodiment, the number of the second area II and the third area III are both four spaced areas, the four second areas II and the third areas III extend along a plane perpendicular to the first direction L1, and the four second areas II and the third areas III extend along different directions in the plane, that is, the four second areas II and the third areas III extend along the second direction L2, the second direction L2 is perpendicular to the first direction L1, and the second direction L2 is multiple, so that the subsequent multiple third areas III can be bent along one side of the first area I to enclose a receiving space 60 (see Fig. 9 ).

[0045] Step S2: Please refer to Figure 2 , the surface of the first circuit substrate 10 located in the second area II is covered with an insulating layer 20 .

[0046] The insulating layer 20 covers the surface of the first circuit layer 13 of the first circuit substrate 10 located in the second area II. In this embodiment, the two opposite surfaces of the first circuit substrate 10 located in the four second areas II are covered with the insulating layer 20. The insulating layer 20 is used to facilitate the subsequent opening process in the area where the insulating layer 20 is located, for example, to facilitate the removal of the copper clad plate covering the surface of the insulating layer 20; and to protect the first circuit layer 13 after opening the cover to prevent the first circuit layer 13 from being oxidized.

[0047] Step S3: Please refer to Figure 3 The first copper clad laminate 35 and the second copper clad laminate 45 are covered on two opposite surfaces of the first circuit substrate 10 in the first area I, the second area II and the third area III.

[0048] The first copper clad board 35 includes a second dielectric layer 31 and a first copper layer 352. The first copper layer 352 is located on the surface of the second dielectric layer 31 away from the first circuit substrate 10. The first copper clad board 35 covers the insulating layer 20 located on the same side of the first circuit substrate 10 as the first copper clad board 35.

[0049] The second copper clad board 45 includes a third dielectric layer 41 and a second copper layer 452. The second copper layer 452 is located on the surface of the third dielectric layer 41 away from the first circuit substrate 10. The second copper clad board 45 covers the insulating layer 20 located on the same side of the first circuit substrate 10 as the second copper clad board 45.

[0050] The material of the second dielectric layer 31 and the third dielectric layer 41 can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), or can be selected from one of hard materials such as polypropylene (PP) and polytetrafluoroethylene (PTFE).

[0051] In some embodiments, an adhesive layer (not shown) may be further provided between the first copper clad laminate 35 and the first circuit substrate 10 and between the second copper clad laminate 45 and the first circuit substrate 10 to bond the first copper clad laminate 35 and the first circuit substrate 10 and the second copper clad laminate 45 and the first circuit substrate 10 respectively.

[0052] Step S4: Please refer to Figure 4 , the first copper clad plate 35 and the second copper clad plate 45 are respectively processed into circuits, wherein the first copper clad plate 35 located in the third area III is processed into a coil 332 (refer to Figure 6 ), a second copper clad board 45 located in the third area III is manufactured to form a connecting pad 432.

[0053] Specifically, see Figure 3 as well as Figure 4 The first copper layer 352 is wired to form a second wiring layer 33 electrically connected to the first wiring layer 13, and the second wiring layer 33 includes a coil 332. The second copper layer 452 is wired to form a third wiring layer 43 electrically connected to the first wiring layer 13, and the third wiring layer 43 includes a connection pad 432.

[0054] Step S5: Please refer to Figure 5 as well as Figure 6 , remove the first copper clad laminate 35 and the second copper clad laminate 45 located in the second area II after the circuit is fabricated.

[0055] The second dielectric layer 31 and the second circuit layer 33 located in the second area II are removed to expose the insulating layer 20, and the second circuit substrate 30 located in the first area I and the third area III including the second dielectric layer 31 and the second circuit layer 33 is obtained. The third dielectric layer 41 and the third circuit layer 43 located in the second area II are removed to expose the insulating layer 20, and the third circuit substrate 40 located in the first area I and the third area III including the third dielectric layer 41 and the third circuit layer 43 is obtained. Among them, the second area II includes the first circuit substrate 10 and the insulating layer 20 covering the surface of the first circuit substrate 10, and the second area II is a flexible area.

[0056] It is understandable that the number of circuit layers in the second circuit substrate 30 and the third circuit substrate 40 is not limited to one layer, but may be multiple layers. The above steps of forming the second circuit substrate 30 and the third circuit substrate 40 are only examples and are not intended to be limiting.

[0057] Before step S5, see Figure 4 , and may further include the step of forming a solder mask layer 50 , wherein the solder mask layer 50 covers the second dielectric layer 31 and the second circuit layer 33 , and also covers the third dielectric layer 41 and the third circuit layer 43 .

[0058] Step S6: Please refer to Figure 7 and Figure 8 , the second region II is bent to form a circuit board 100 in which the second region II is bent.

[0059] The bent shape includes but is not limited to a wave shape, a W shape, and an S shape, that is, the cross-section of the second region II along the first direction L1 or the second direction L2 may include but is not limited to a wave shape, a W shape, and an S shape.

[0060] In some embodiments, the manufacturing method further includes forming a patterning layer 70 in the second region II (see Figure 7 and Figure 8 ), the shaping layer 70 is located in the corner area of ​​the second zone II, so that the second zone II is shaped after bending. The material of the shaping layer 70 needs to have a certain hardness, and the hardness of the material of the shaping layer 70 is greater than the hardness of the first dielectric layer 11, so as to avoid the second zone II from recovering its deformation under its own force after being shaped. It can be understood that the material of the shaping layer 70 itself also needs to have a certain toughness. Under the shaping effect, when the second zone II is deformed by external force, the second zone II can be restored to its original bending state, thereby making the second zone II elastic. The material of the shaping layer 70 can be selected from resin materials such as polyethylene naphthalate diformic acid glycol ester (PEN), polyester resin (PET), etc.

[0061] Step S7: Please refer to Fig. 9 , provide an image sensor 210, fix the image sensor 210 to the first region I, and bend the surface of the third region III having the coil 332 toward the side of the first region I.

[0062] In this embodiment, the image sensor 210 is fixed to the surface of the second circuit substrate 30 located in the first area I on the side with the coil 332, and then the four third areas III are bent toward the side where the image sensor 210 is located to form an accommodation space 60 for accommodating the image sensor 210, that is, the coil 332 faces the accommodation space 60, and the connection pad 432 faces away from the accommodation space 60. The connection pad 432 is used to electrically connect the circuit board 100 with the external circuit. Among them, the image sensor 210 is electrically connected to the circuit board 100.

[0063] It is understandable that in some implementations, the accommodating space 60 may be formed first, and then the image sensor 210 may be placed in the accommodating space 60 and electrically connected to the circuit board 100 .

[0064] Step S8: Please refer to Fig. 9 , a magnet 220 is fixedly connected to the image sensor 210 and spaced apart from the coil 332 .

[0065] In this embodiment, a first bracket 240 is accommodated in the accommodation space 60 and fixed on the solder mask 50 located in the first area I, that is, the first bracket 240 is located on the side of the first area I having the image sensor 210; and the magnet 220 is fixed on the first bracket 240, so that the image sensor 210 is fixedly connected to the magnet 220. There is a certain distance between the magnet 220 and the coil 332.

[0066] In some embodiments, the manufacturing method further includes the step of fixing a filter 260 on the first bracket 240 , where the filter 260 is located on a side of the image sensor 210 facing away from the circuit board 100 and is spaced apart from the image sensor 210 .

[0067] Step S9: Please refer to Fig.10 , a lens 230 is fixedly connected to the coil 332 , so that the image sensor 210 and the magnet 220 as well as the coil 332 and the lens 230 are elastically connected through the bent second region II to obtain the lens module 200 .

[0068] In this embodiment, a second bracket 250 is provided, which is located in the peripheral area of ​​the first bracket 240 and is spaced apart from the first bracket 240. The third zone III is fixed to the second bracket 250, and the lens 230 is fixed to the second bracket 250, so that the lens 230 is fixedly connected to the coil 332.

[0069] Among them, the third area III is connected to the first area I through the bent second area II, and the third area III is elastically connected to the first area I, so that the fixedly connected image sensor 210 and the magnet 220 and the fixedly connected coil 332 and the lens 230 are elastically connected through the bent second area II.

[0070] In some embodiments, see Fig.11 and Fig.12 The manufacturing method also includes the step of forming a connector 80 on the circuit board 100. The formation of the connector 80 can be similar to the step of forming the circuit board 100 located in the second zone II and the third zone III. The position of the connector 80 is not limited, and it only needs to be electrically connected to the circuit board 100.

[0071] See also Fig.10 The embodiment of the present application also provides a lens module 200 with an anti-shake function and a small size. The lens module 200 can be manufactured by the above manufacturing method.

[0072] The lens module 200 includes a circuit board 100, an image sensor 210, a magnet 220 and a lens 230. The circuit board 100 has a coil 332, the coil 332 is fixedly connected to the lens 230, the image sensor 210 is fixedly connected to the magnet 220, and the fixedly connected image sensor 210 and magnet 220 and the fixedly connected coil 332 and lens 230 are elastically connected.

[0073] The circuit board 100 includes a first area I, a second area II, and a third area III connected in sequence. The number of the second area II and the third area III is equal, and they are multiple. In this embodiment, there are four second areas II and three areas III, which are respectively arranged on the periphery of the first area I and symmetrically arranged. The four third areas III are bent toward one side of the first area I to form an accommodation space 60, that is, the third area III has a certain angle with the first area I and is connected through the second area II, so that the first area I, the second area II, and the third area III form the accommodation space.

[0074] The circuit board 100 may be a flexible board or a rigid-flexible board, wherein the second area II is a flexible board area. The circuit board 100 is a multi-layer circuit board 100, and the circuit board 100 includes a stacked dielectric layer and a circuit layer, and the number of circuit layers is multiple, and the multiple circuit layers are electrically connected.

[0075] In this embodiment, the circuit board 100 includes a first circuit substrate 10 and a second circuit substrate 30 and a third circuit substrate 40 respectively located on two opposite surfaces of the first circuit substrate 10. The second circuit substrate 30 and the third circuit substrate 40 are only located in the first area I and the third area III, that is, the second area II only includes the first circuit substrate 10, and the surface of the first circuit substrate 10 located in the second area II is covered by the insulating layer 20.

[0076] The first circuit substrate 10 includes a first dielectric layer 11 and a first circuit layer 13 which are stacked; the second circuit substrate 30 includes a second dielectric layer 31 and a second circuit layer 33 which are stacked; and the third circuit substrate 40 includes a third dielectric layer 41 and a third circuit layer 43 which are stacked. The material of the first dielectric layer 11 can be selected from one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide; the material of the second dielectric layer 31 and the third dielectric layer 41 can be selected from one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide, or can be selected from one of hard materials such as polypropylene and polytetrafluoroethylene. The first circuit layer 13, the second circuit layer 33, and the third circuit layer 43 can be electrically connected to each other.

[0077] The second circuit substrate 30 is located at one side of the accommodating space 60 . The second circuit substrate 30 located in the third area III has a coil 332 .

[0078] The circuit board 100 further includes connection pads 432 , which are located on the third circuit substrate 40 in the third area and on opposite sides of the circuit board 100 from the coil 332 . The connection pads 432 are used to realize electrical connection between the circuit board 100 and an external circuit.

[0079] The image sensor 210 is accommodated in the accommodation space 60 and fixed to the surface of the circuit board 100 located in the first area I. The image sensor 210 is electrically connected to the circuit board 100 .

[0080] The magnet 220 can be fixedly connected to the image sensor 210 through the first bracket 240, and the magnet 220 is spaced apart from the coil 332. Specifically, the first bracket 240 is accommodated in the accommodation space 60 and fixed to the surface of the circuit board 100 located in the first area I, and the magnet 220 is fixed on the first bracket 240 and faces the coil 332, so that the magnet 220 is fixedly connected to the image sensor 210 and spaced apart from the coil 332.

[0081] The lens 230 can be fixedly connected to the coil 332 through a second bracket 250. Specifically, the second bracket 250 is arranged in the peripheral area of ​​the first bracket 240 and is spaced from the first bracket 240, the circuit board 100 is passed through the second bracket 250, the first area I is inside the second bracket 250, the third area III with the coil 332 is fixed to the second bracket 250 from the outside of the second bracket 250, the lens 230 is fixed to the second bracket 250, and the lens 230 is located on the side of the image sensor 210 away from the circuit board 100, so as to achieve a fixed connection between the lens 230 and the coil 332. It can be understood that in other embodiments, the method of fixing the first bracket 240 and the second bracket 250 can be adjusted as needed, and is not limited thereto.

[0082] The second region II is bent, and the shape of the bent includes but is not limited to wave shape, W shape, and S shape.

[0083] In some embodiments, the circuit board 100 further includes a shaping layer 70, which is located at the corner area of ​​the second region II and on the surface of the insulating layer 20, so as to facilitate shaping of the second region II after bending. The material of the shaping layer 70 needs to have a certain hardness, and the hardness of the material of the shaping layer 70 is greater than the hardness of the first dielectric layer 11, so as to avoid the second region II from recovering its deformation under its own force after shaping. It can be understood that the material of the shaping layer 70 itself also needs to have a certain toughness, and under the shaping effect, when the second region II is deformed by external force, the second region II can be restored to its original bending state, thereby making the second region have an elastic effect. The material of the shaping layer 70 can be selected from resin materials such as polyethylene naphthalate, polyester resin, etc.

[0084] In some embodiments, the lens module 200 further includes a filter 260 , which can be fixed to the first bracket 240 . The filter 260 is located between the image sensor 210 and the lens 230 , and is spaced apart from the image sensor 210 and the lens 230 , respectively.

[0085] In some embodiments, see Fig.11 and Fig.12 The lens module 200 further includes a connector 80 , which is electrically connected to the circuit board 100 . The position of the connector 80 is not limited, and it only needs to be electrically connected to the circuit board 100 .

[0086] The lens module 200 provided in the present application includes a circuit board 100, an image sensor 210, a magnet 220 and a lens 230. Among them, the circuit board 100 has a coil 332, the coil 332 is fixedly connected to the lens 230, the image sensor 210 is fixedly connected to the magnet 220, the fixedly connected image sensor 210 and the magnet 220, and the fixedly connected coil 332 and the lens 230 are elastically connected through a bent soft board area. When the lens module 200 is shaken by an external force, the lens 230 and the coil 332 shake synchronously and drive the image sensor 210 and the magnet 220 to move synchronously through the bent soft board area, compensating for the offset of light on the image sensor 210 caused by the shaking of the lens module 200, thereby effectively overcoming the problem of shaking and blurring of the image or video shot due to shaking. The coil 332 is formed on the circuit board 100 , and the magnet 220 is disposed in the accommodation space 60 formed by the circuit board 100 . On the premise of satisfying the functions of the lens module 200 , the additionally arranged voice coil motor is replaced, thereby effectively reducing the volume of the lens module 200 .

[0087] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A lens module, characterized in that: include: A circuit board, comprising a first area, a second area and a third area connected in sequence, wherein an angle is formed between the third area and the first area to form an accommodation space, the third area has a coil on one side facing the accommodation space, and the second area is bent; An image sensor is located in the accommodating space and fixedly connected to the first area; A magnet, fixedly connected to the image sensor and spaced apart from the coil; as well as A lens, fixedly connected to the coil; The fixedly connected image sensor and the magnet as well as the fixedly connected coil and the lens are elastically connected via the bent second area.

2. The lens module according to claim 1, characterized in that: The second area is a soft board area.

3. The lens module according to claim 2, characterized in that: The circuit board further comprises a shaping layer, and the shaping layer is located at a corner area where the second zone is bent.

4. The lens module according to claim 1, characterized in that: The lens module also includes a first bracket, which is accommodated in the accommodating space and fixed on the circuit board located in the first area, and the magnet is fixed on the first bracket.

5. The lens module according to claim 4, characterized in that: The lens module also includes a second bracket, which is located in the peripheral area of ​​the first bracket and is spaced apart from the first bracket. The circuit board located in the third area is fixed on the second bracket.

6. The lens module according to claim 5, characterized in that: A side of the circuit board located in the third area facing away from the coil has a connection pad.

7. A method for manufacturing a lens module, characterized in that: include: A circuit board is provided, the circuit board comprising a first area, a second area and a third area connected in sequence, the third area is bent toward a side of the first area to form an accommodation space, the third area has a coil on a side facing the accommodation space, and the second area is bent; Placing an image sensor in the accommodating space and fixedly connecting the image sensor to the first area; A magnet is fixedly connected to the image sensor and spaced apart from the coil; and A lens is fixedly connected to the coil, so that the image sensor and the magnet as well as the coil and the lens are elastically connected through the bent second area.

8. The method for manufacturing a lens module according to claim 7, characterized in that: The steps of forming the circuit board include: Providing a first circuit substrate, comprising a first area, a second area and a third area connected in sequence; Covering the surface of the first circuit substrate located in the second area with an insulating layer; forming a second circuit substrate on the surface of the first circuit substrate located in the first area and the third area, the insulating layer located in the second area is exposed to the second circuit substrate, and the second circuit substrate located in the third area includes a coil; and The second area is subjected to a bending process to form the circuit board in which the second area is in a bent shape.

9. The method for manufacturing a lens module according to claim 8, characterized in that: The step of forming the circuit board also includes: A third circuit substrate is formed on a surface of the first circuit substrate located in the first area and the third area away from the second circuit substrate, and the third circuit substrate located in the third area includes a connection pad.

10. The method for manufacturing a lens module according to claim 7, characterized in that: The manufacturing method further comprises the step of forming a shaping layer in a corner region located at a bend of the second zone.

Images