A method of securing an inclinometer on a carrier susceptible to deformation

Abstract

The present application relates to a kind of method for fixing inclination sensor on easily deformed carrier, the field of application inclination sensor.According to the size of inclination sensor and the size of field space, rigid adapter plate or adapter block is developed, inclination sensor is not reserved on it Perforation position and rigid adapter plate or adapter block Perforation position, and in the case where field space allows, perforation position should be located outside the sensor installation area;In factory room temperature environment, inclination sensor is installed on rigid adapter plate or adapter block, then rigid adapter plate or adapter block is fixed to carrier, and wait 1-2 days stress release is completed;Calibrate inclination sensor.The present application solves the inclination sensor fixed on easily deformed carrier.

Description

Technical Field

[0001] This invention belongs to the field of tilt sensor applications and relates to a method for fixing a tilt sensor on a deformable carrier. Background Technology

[0002] Tilt sensors are fixed to the carrier being tested to measure the tilt angle of the carrier relative to the horizontal plane. They are widely used in industrial control, aviation, aerospace, bridges, buildings and other fields. Theoretically, the carrier should be rigid, but in practice, carriers are often soft and deform when supported or subjected to other forces. If the carrier is directly fixed to such a carrier, the sensor will also deform over time, leading to inaccurate measurements and affecting control accuracy. Therefore, this is a problem that must be solved. Summary of the Invention

[0003] Technical problems to be solved

[0004] To avoid the shortcomings of the prior art, the present invention provides a method for fixing an tilt sensor on a deformable carrier.

[0005] Technical solution

[0006] A method for fixing a tilt sensor on a deformable carrier, characterized by the following steps:

[0007] (1) Develop a rigid adapter plate or adapter block according to the size of the tilt sensor and the size of the site space. The adapter plate or adapter block shall have reserved holes for the tilt sensor that are not penetrated and through holes for the rigid adapter plate or adapter block. If the site space allows, the through holes shall be located outside the sensor installation area.

[0008] (2) Install the tilt sensor onto the rigid adapter plate or adapter block in the factory room at room temperature, then fix the rigid adapter plate or adapter block onto the carrier and wait for the stress to be released in 1 to 2 days.

[0009] (3) Calibrate the tilt sensor;

[0010] (4) Normal use.

[0011] Beneficial effects

[0012] The present invention provides a method for fixing an tilt sensor on a deformable carrier, which offers the following advantages:

[0013] 1. Simple and easy to implement;

[0014] 2. To prevent potential deformation issues of the tilt sensor;

[0015] 3. It effectively solves the leveling problem caused by carrier deformation;

[0016] 4. The method is reasonable and highly reliable;

[0017] 5. Low cost and high cost-effectiveness. Attached Figure Description

[0018] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0019] Figure 1 Application diagram of this invention;

[0020] Figure 2 A specific embodiment of fixing an tilt sensor on a deformable carrier is shown in the figure. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0022] The tilt sensor itself is designed so that its rigidity cannot be modified to increase it, because it is ultimately mounted on a carrier, and the rigidity of the carrier cannot be strengthened. Therefore, the method to enhance rigidity is to add a rigid adapter plate (block) between it and the carrier. The tilt sensor uses the rigidity of this plate to compensate for its insufficient rigidity. In this way, the rigid adapter plate (block) at the bottom of the sensor resists the deformation of the carrier and maintains the original shape of the sensor, solving the problem of tilt sensor deformation caused by easily deformable carriers at the lowest cost.

[0023] See below for specific methods. Figure 1 As shown, the feature is:

[0024] (1) Develop a rigid adapter plate (block) according to the size of the tilt sensor and the size of the site space. The plate has reserved non-penetrating holes for the tilt sensor and through holes for the rigid adapter plate (block). If the site space allows, the through holes should be located outside the sensor installation area.

[0025] (2) Install the tilt sensor onto the rigid adapter plate (block) in the factory room temperature environment, then fix the rigid adapter plate (block) onto the carrier and wait for the stress to be released in 1 to 2 days;

[0026] (3) Calibrate the tilt sensor;

[0027] (4) Normal use.

[0028] To enable those skilled in the art to better understand the present invention, the present invention will be described in detail below with reference to specific embodiments.

[0029] Now, in conjunction with the embodiments and Figure 2 The present invention will be further described as follows:

[0030] Example:

[0031] Schematic diagram of the embodiment of the present invention is shown below. Figure 2 .

[0032] The vehicle body mounting surface of the tilt sensor (SP-XX) used for leveling in a certain project was too soft. Previous tests had already warped the bottom surface of the tilt sensor, making leveling impossible. To prevent this from happening again, it was decided to add a 3 cm thick rigid adapter plate (block) (made of galvanized steel) under the tilt sensor. This rigid adapter plate (block) will act as a buffer between the sensor and the carrier to prevent sensor deformation. The specific process is detailed below:

[0033] (1) Based on the dimensions of the tilt sensor (SP-0X) (100×100×116) and considering the limited installation space on site, a 3 cm thick rigid adapter plate (block) (122×122×30) was developed. It has 4×φ5.0 deep 10.0 through holes for the tilt sensor and 3×φ4.7 deep 4.0 through holes for the rigid adapter plate (block). It has a through hole φ8.0 deep 26.0. The sensor installation area covers the through holes.

[0034] (2) In the room temperature environment of the factory, fix the rigid adapter plate (block) to the original mounting surface of the vehicle body, and then install the tilt sensor on the rigid adapter plate (block) and wait for the stress to be released in 2 days;

[0035] (3) Calibrate the tilt sensor:

[0036] (4) Normal use.

[0037] After this measure, the tilt sensor did not twist or deform again, thus ensuring the reliable operation of the leveling system.

[0038] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the scope of the technology disclosed in the present invention, and such modifications or substitutions should all be covered within the scope of protection of the present invention.

Claims

1. A method of securing an inclinometer sensor on a carrier susceptible to deformation, characterized by The steps are as follows: (1) A rigid adapter plate or adapter block is developed according to the size of the tilt sensor and the size of the site space. The rigid adapter plate or adapter block serves as a buffer between the sensor and the carrier to isolate the sensor from deformation. The non-penetrating hole of the tilt sensor and the through hole of the rigid adapter plate or adapter block are reserved on it. If the site space allows, the through hole should be located outside the sensor installation area. The specific process is detailed below: Based on the tilt sensor's dimensions of 100×100×116, and considering the limited installation space on site, a 3 cm thick rigid adapter plate or block with dimensions of 122×122×30 was developed. It has 4 pre-drilled holes (φ5.0, 10.0 deep) for the tilt sensor and 3 through holes (φ4.7, 4.0 deep) for the rigid adapter plate or block. It also has through holes (φ8.0, 26.0 deep). The sensor installation area covers the through holes. (2) Install the tilt sensor onto the rigid adapter plate or adapter block in the factory room at room temperature, then fix the rigid adapter plate or adapter block onto the carrier and wait for the stress to be released in 1 to 2 days. (3) Calibrate the tilt sensor; (4) Normal use.

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