Heat dissipation management method, device and server

Abstract

The present invention discloses a heat dissipation management method, device, and server, and relates to the field of management. The present application adds a cooling component between a heat source and a device to be dissipated. After obtaining the temperature of each device to be dissipated and determining the average temperature, the water flow rate of the cooling unit of the cooling component is controlled according to the temperature and the average temperature. The liquid flowing through the cooling unit cools the heat dissipation gas in the ventilation unit, and the water flow rate of each cooling unit is positively correlated with the temperature of the device to be dissipated corresponding to the cooling unit. Ultimately, the heat dissipation airflow is controlled to have the same temperature when it flows through the ventilation unit and reaches each device to be dissipated. The temperature of these devices to be dissipated after dissipation is the same, thereby achieving unified heat dissipation management of the devices to be dissipated and improving the reliability of the server during operation.

Description

Technical Field

[0001] The present invention relates to the field of management, and in particular to a heat dissipation management method, device and server. Background Art

[0002] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the internal structure of a server in the prior art. Heat sources A and B can be chips in the server. When the server is running, the chips dissipate heat. Heat sources A and B are different, so they may dissipate different amounts of heat, and the difference in heat dissipation may be significant. A heat dissipation device, such as a fan, is installed in front of the heat source to blow air toward the heat source to cool it down. In addition to chips, the server also includes devices to be cooled, such as PCIE cards, IO cards, etc. These devices to be cooled are set in the slots of the server. Here, a, b, c, d, e and f are used to represent these devices to be cooled. These devices to be cooled are also cooled by the heat dissipation device. However, since the cooling airflow generated by the heat dissipation device first passes through the heat source and then passes through the devices to be cooled a, b, c, d, e and f, it is affected by the heat of the heat source, which will make the actual cooling effects of the devices to be cooled a, b, c, d, e and f different and the actual cooling effect worse. For example, when the heat of heat source A is higher than that of heat source B, the temperature of the devices to be cooled a, b and c after cooling will be higher than that of the devices to be cooled d, e and f. In the same server, the specifications of these devices to be cooled are usually the same. The different temperatures after cooling may result in some devices to be cooled not achieving the required cooling effect, and unified cooling management of these devices to be cooled cannot be performed, affecting the reliability of the server during operation. Summary of the Invention

[0003] The purpose of the present invention is to provide a heat dissipation management method, device and server. The present application adds a cooling component between the heat source and the device to be dissipated heat. After obtaining the temperature of each device to be dissipated heat and determining the average temperature, the water flow of the cooling part of the cooling component is controlled according to the temperature and the average temperature. The liquid flowing through the cooling part cools the heat dissipation gas in the ventilation part, and the water flow of each cooling part is positively correlated with the temperature of the device to be dissipated heat corresponding to the cooling part. Finally, the temperature of the heat dissipation airflow when it flows through the ventilation part and reaches each device to be dissipated heat is the same. The temperature of these devices to be dissipated after heat dissipation is finally the same, thereby realizing unified heat dissipation management of the devices to be dissipated heat and improving the reliability of the server during operation.

[0004] To solve the above technical problems, the present invention provides a heat dissipation management method, which is applied to a processor of a server. The server also includes a cooling assembly, the cooling assembly including a vent and a cooling portion that are attached to each other. The vent allows a heat dissipation airflow to flow through the heat dissipation device. The cooling portion has a liquid flowing through it to cool the heat dissipation airflow. The cooling portion is provided corresponding to the heat dissipation device.

[0005] The heat dissipation management method comprises:

[0006] Obtaining the temperature of each of the components to be cooled;

[0007] Determining an average temperature of each of the components to be cooled according to the temperature of each of the components to be cooled;

[0008] The water flow rate of the cooling part corresponding to the device to be cooled is controlled according to the relationship between the temperature and the average temperature, so that the temperature of the cooling airflow when it flows through the ventilation part and reaches each device to be cooled is the same, and the temperature of the device to be cooled is positively correlated with the water flow rate of the cooling part corresponding to the device to be cooled.

[0009] Preferably, the cooling assembly further comprises a water inlet pipe provided at one end of the cooling portion, a water outlet pipe provided at the other end of the cooling portion, and a water valve provided on the water inlet pipe, wherein the water valve is connected to the processor;

[0010] Controlling the water flow of the cooling part corresponding to the heat dissipation device according to the relationship between the temperature and the average temperature includes:

[0011] According to the relationship between the temperature and the average temperature, the opening angle of the water valve on the water inlet pipe of the cooling part corresponding to the heat dissipation device is controlled to control the water inlet amount of the water inlet pipe, and the water inlet amount is positively correlated with the water flow of the cooling part.

[0012] Preferably, controlling the opening angle of the water valve on the water inlet pipe of the cooling part corresponding to the heat dissipation device includes:

[0013] The opening angle of the water inlet valve of the cooling part corresponding to the heat dissipating device is controlled to be a target angle corresponding to the temperature of the heat dissipating device so that the temperature of each heat dissipating device is the same.

[0014] Preferably, controlling the opening angle of the water valve on the water inlet pipe of the cooling part corresponding to the heat dissipation device includes:

[0015] The opening angle of the water supply valve of the water inlet pipe of the cooling part corresponding to the heat dissipating device is controlled to change the preset angle in each control cycle until the temperatures of the heat dissipating devices are the same.

[0016] Preferably, the ventilation portion is a honeycomb structure ventilation portion or a grid structure ventilation portion.

[0017] Preferably, the vent is a vent made of a thermally conductive material.

[0018] Preferably, the cooling part is a plastic cooling part or a plastic cooling part.

[0019] Preferably, the server further comprises a plurality of slots for plugging in the heat dissipation devices, and the slots are provided with temperature sensors;

[0020] Get the temperature of each device to be cooled, including:

[0021] The temperature of each slot is acquired through a temperature sensor to acquire the temperature of each component to be cooled.

[0022] To solve the above technical problems, the present invention further provides a heat dissipation management device, comprising:

[0023] memory for storing computer programs;

[0024] A processor is used to execute the computer program to implement the steps of the above-mentioned heat dissipation management method.

[0025] In order to solve the above technical problems, the present invention also provides a server, including the above-mentioned heat management device, and also including a cooling component, the cooling component includes a ventilation part and a cooling part that are in contact with each other, a heat dissipation airflow flows through the heat dissipation device in the ventilation part, and a liquid flows in the cooling part to cool the heat dissipation airflow, the cooling part is arranged corresponding to the heat dissipation device, and the heat management device is connected to the cooling component.

[0026] The present application provides a heat dissipation management method, device and server, including: obtaining the temperature of each device to be dissipated; determining the average temperature of each device to be dissipated based on the temperature of each device to be dissipated; controlling the water flow of the cooling unit corresponding to the device to be dissipated based on the relationship between the temperature and the average temperature, so that the temperature of the heat dissipation airflow when it flows through the ventilation unit to reach each device to be dissipated is the same, and the temperature of the device to be dissipated is positively correlated with the water flow of the cooling unit corresponding to the device to be dissipated. The present application adds a cooling component between the heat source and the device to be dissipated, obtains the temperature of each device to be dissipated and determines the average temperature, controls the water flow of the cooling unit of the cooling component based on the temperature and the average temperature, cools the heat dissipation gas of the ventilation unit by the liquid flowing through the cooling unit, and the water flow of each cooling unit is positively correlated with the temperature of the device to be dissipated corresponding to the cooling unit, and finally controls the temperature of the heat dissipation airflow when it flows through the ventilation unit to reach each device to be dissipated, and the temperature of these devices to be dissipated after heat dissipation is the same, thereby realizing unified heat dissipation management of the devices to be dissipated and improving the reliability of the server during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the prior art and the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 A schematic diagram of the internal structure of a server in the prior art;

[0029] Figure 2 A flow chart of a heat dissipation management method provided by the present invention;

[0030] Figure 3 A schematic diagram of the internal structure of a server corresponding to a heat dissipation management method provided by the present invention;

[0031] Figure 4 A schematic diagram of water flow control corresponding to a heat dissipation management method provided by the present invention;

[0032] Figure 5 A schematic structural diagram of a cooling assembly provided by the present invention;

[0033] Figure 6 This is a structural schematic diagram of a heat dissipation management device provided by the present invention. DETAILED DESCRIPTION

[0034] The core of the present invention is to provide a heat dissipation management method, device and server. The present application adds a cooling component between the heat source and the device to be dissipated heat. After obtaining the temperature of each device to be dissipated heat and determining the average temperature, the water flow of the cooling part of the cooling component is controlled according to the temperature and the average temperature. The liquid flowing through the cooling part cools the heat dissipation gas in the ventilation part, and the water flow of each cooling part is positively correlated with the temperature of the device to be dissipated heat corresponding to the cooling part. Finally, the temperature of the heat dissipation airflow when it flows through the ventilation part and reaches each device to be dissipated heat is the same. The temperature of these devices to be dissipated after heat dissipation is finally the same, thereby realizing unified heat dissipation management of the devices to be dissipated heat and improving the reliability of the server during operation.

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0036] Please refer to Figure 2 , Figure 2This is a flow chart of a heat dissipation management method provided by the present invention. The method is applied to a server processor. The server also includes a cooling assembly 1, which includes a vent 2 and a cooling unit 3 that are attached to each other. The vent 2 allows a heat dissipation airflow to flow through the heat dissipation device. The cooling unit 3 has a liquid flowing through it to cool the heat dissipation airflow. The cooling unit 3 is provided in correspondence with the heat dissipation device.

[0037] The method includes:

[0038] S11: Obtain the temperature of each device to be cooled;

[0039] The devices to be cooled can be IO cards, PCIE cards, and other devices. In this solution, these devices to be cooled are arranged after the cooling assembly 1. In the prior art, the devices to be cooled emit a cooling airflow. After the cooling airflow passes through the heat source, it causes a large temperature difference in the devices to be cooled, and the cooling and cooling effect on the devices to be cooled is reduced. Therefore, in this solution, the cooling assembly 1 is arranged before the devices to be cooled. The cooling assembly 1 cools the cooling airflow passing through the heat source, thereby achieving an improved cooling effect on the subsequent devices to be cooled.

[0040] First, it is necessary to obtain the temperature of each device to be cooled, and determine the cooling effect that the cooling component 1 needs to achieve for the device to be cooled based on these temperatures, so as to accurately control the final temperature of each device to be cooled to be the same, so that the temperatures of each device to be cooled that originally have the same specifications can be managed in a unified manner, thereby improving the reliability of the solution.

[0041] S12: determining an average temperature of each component to be cooled according to the temperature of each component to be cooled;

[0042] Then, the average temperature of each device to be cooled is obtained, and the cooling part 3 of the cooling part 3 can be controlled according to the average temperature and the temperature of the current device to be cooled, so as to achieve different cooling treatments for different devices to be cooled, thereby improving the feasibility and reliability of the solution.

[0043] S13: Control the water flow rate of the cooling part 3 corresponding to the device to be cooled according to the relationship between the temperature and the average temperature, so that the temperature of the cooling airflow when it flows through the ventilation part 2 and reaches each device to be cooled is the same, and the temperature of the device to be cooled is positively correlated with the water flow rate of the cooling part 3 corresponding to the device to be cooled.

[0044] Determine the relationship between the temperature of each device to be dissipated and the average temperature. If the temperature is higher than the average temperature, it means that the device to be dissipated needs to be cooled more. At this time, increase the water flow rate of the cooling part 3 of the cooling part 3 corresponding to the device to be dissipated. Since the cooling part 3 and the ventilation part 2 of the cooling part 3 are in contact with each other, after the liquid flows through the cooling part 3, the heat dissipation airflow passing through the ventilation part 2 can be cooled. When it is detected that the temperature of the device to be dissipated is high, it is necessary to increase the water flow rate of the cooling part 3 corresponding to the device to be dissipated. The larger the water flow rate, the better the cooling effect on the heat dissipation airflow. Similarly, when it is determined that the temperature of the device to be dissipated is lower than the average temperature, control the water flow rate of the cooling part 3 corresponding to the device to be dissipated to be relatively small, and then the heat dissipation effect for the device to be dissipated whose temperature is lower than the average temperature can be weakened. In this way, by controlling the water flow rate of the cooling part 3 corresponding to each device to be dissipated, the final temperature of each device to be dissipated can be made the same, thereby realizing unified management of the devices to be dissipated and improving the reliability and feasibility of the solution.

[0045] The system's temperature control strategy is as follows: After passing through different heat sources, the temperatures Ta, Tb, Tc, ..., Tn reached by each heat dissipation component vary. The average of these values ​​is calculated as the target temperature control value, T = (Ta + Tb + Tc + ...Tn) / n, where T is the average temperature and n is the number of heat dissipation components. Ta, Tb, Tc, ..., Tn are then compared with the average value. If the values ​​are higher than the average, the flow rate is increased; if the values ​​are lower, the flow rate is reduced. This iterative process is repeated until each value of Ta, Tb, ..., Tn approaches the target temperature value T, achieving automatic temperature control.

[0046] In general, the present application provides a heat dissipation management method, including: obtaining the temperature of each device to be dissipated; determining the average temperature of each device to be dissipated based on the temperature of each device to be dissipated; and controlling the water flow rate of the cooling part 3 corresponding to the device to be dissipated based on the relationship between the temperature and the average temperature, so that the temperature of the heat dissipation airflow when it flows through the ventilation part 2 to reach each device to be dissipated is the same, and the temperature of the device to be dissipated is positively correlated with the water flow rate of the cooling part 3 corresponding to the device to be dissipated. The present application adds a cooling component 1 between the heat source and the device to be dissipated, obtains the temperature of each device to be dissipated and determines the average temperature, and then controls the water flow rate of the cooling part 3 of the cooling component 1 based on the temperature and the average temperature. The heat dissipation gas of the ventilation part 2 is cooled by the liquid flowing through the cooling part 3, and the water flow rate of each cooling part 3 is positively correlated with the temperature of the device to be dissipated corresponding to the cooling part 3. Finally, the heat dissipation airflow is controlled to have the same temperature when it flows through the ventilation part 2 to reach each device to be dissipated, and the temperature of these devices to be dissipated after heat dissipation is finally the same, thereby achieving unified heat dissipation management of the devices to be dissipated and improving the reliability of the server during operation.

[0047] Based on the above embodiment:

[0048] Please refer to Figure 3 、 Figure 4 and Figure 5 , Figure 3 A schematic diagram of the internal structure of a server corresponding to a heat dissipation management method provided by the present invention. Figure 4 A schematic diagram of water flow control corresponding to a heat dissipation management method provided by the present invention, Figure 5 This is a schematic structural diagram of a cooling assembly provided by the present invention.

[0049] As a preferred embodiment, the cooling assembly 1 further includes a water inlet pipe provided at one end of the cooling portion 3, a water outlet pipe provided at the other end of the cooling portion 3, and a water valve 4 provided on the water inlet pipe, the water valve 4 being connected to the processor;

[0050] Controlling the water flow of the cooling part 3 corresponding to the heat dissipation device according to the relationship between the temperature and the average temperature includes:

[0051] According to the relationship between the temperature and the average temperature, the opening angle of the water inlet valve 4 of the cooling part 3 corresponding to the heat dissipation device is controlled to control the water inlet amount of the water inlet pipe. The water inlet amount is positively correlated with the water flow of the cooling part 3.

[0052] The cooling assembly 1 also includes a water inlet pipe arranged at one end of the cooling part 3, a water outlet pipe arranged at the other end of the cooling part 3 and a water valve 4 arranged on the water inlet pipe. The water valve 4 is controlled by a processor. When the water flow of the cooling part 3 corresponding to the heat dissipation device is controlled according to the relationship between the temperature and the average temperature, the opening angle of the water valve 4 on the water inlet pipe of the corresponding cooling part 3 can be controlled to control the water inlet amount of the water inlet pipe. The larger the opening angle, the smaller the resistance of the water valve 4, and the more water can enter the cooling part 3. The water inlet amount is positively correlated with the water flow rate. The higher the water inlet amount, the greater the water flow rate. Therefore, the water flow rate of the cooling part 3 can be controlled according to the opening angle. Similarly, if the opening angle is controlled to be smaller, the water flow rate of the cooling part 3 can also be controlled to be reduced, thereby controlling the temperature of the heat dissipation device. The entire process is automated, which improves the degree of automation of the solution.

[0053] As a preferred embodiment, controlling the opening angle of the water supply valve 4 of the water inlet pipe of the cooling part 3 corresponding to the heat dissipation device includes:

[0054] The opening angle of the water supply valve 4 of the water inlet pipe of the cooling part 3 corresponding to the heat dissipating device is controlled to be a target angle corresponding to the temperature of the heat dissipating device so that the temperature of each heat dissipating device is the same.

[0055] When actually controlling the opening angle of the water valve 4, the opening angle can be opened to a target angle corresponding to the temperature of the device to be cooled. When the temperature of the device to be cooled is obtained, the corresponding relationship between the temperature and the target angle pre-stored in the processor can be used to determine to what extent the current opening angle needs to be opened. Then, by directly opening the opening angle of the water valve 4 to the target angle, the temperature of the device to be cooled can be made to reach the required temperature, so that the temperatures of each device to be cooled are the same, thereby improving the reliability and feasibility of the solution.

[0056] As a preferred embodiment, controlling the opening angle of the water supply valve 4 of the water inlet pipe of the cooling part 3 corresponding to the heat dissipation device includes:

[0057] The opening angle of the water supply valve 4 of the water inlet pipe of the cooling part 3 corresponding to the heat dissipating device is controlled to change the preset angle in each control cycle until the temperatures of the heat dissipating devices are the same.

[0058] In order to make the solution more flexible, another method is provided for controlling the opening angle. The opening angle of the water valve 4 can be controlled to change the preset angle in each control cycle, that is, to perform regulation in stages. Each time the opening angle of the water valve 4 is adjusted, the preset angle is changed, and then it is judged whether the temperature of the current device to be cooled is the same. If different, it is adjusted again. This adjustment method can be carried out more accurately according to the actual situation until the temperatures of the various devices to be cooled are the same. The entire process is automated, which improves the degree of automation of the solution.

[0059] As a preferred embodiment, the ventilation portion 2 is a honeycomb structure ventilation portion 2 or a grid structure ventilation portion 2 .

[0060] The ventilation portion 2 can be a honeycomb structure ventilation portion 2 or a grid structure ventilation portion 2. When the ventilation portion 2 is set to a grid or honeycomb shape, it is more conducive to the circulation of the heat dissipation airflow, and the contact area with the cooling portion 3 can be increased to achieve a better cooling effect on the heat dissipation airflow. The ventilation portion 2 here is not limited to the above two structures, and can also be other structures that can achieve better cooling effect after the combination of the cooling portion 3 and the ventilation portion 2, thereby improving the flexibility of the solution.

[0061] Cold water enters the cooling component 1 from the main water inlet pipe through the water distribution pipe, and then flows out through the main water outlet pipe. The water distribution pipe entering the cooling component 1 is equipped with a resistance regulating valve to control the opening size of the valve, thereby controlling the amount of water flowing into each cooling component 1. The components to be dissipated with high inlet air temperature are allocated a larger water flow (representing the cooling capacity), and the components to be dissipated with low inlet air temperature are allocated a smaller water flow, ultimately achieving the goal of uniform outlet air temperature. The cooling part 3 is a water-cooling channel, and the ventilation part 2 is composed of heat dissipation fins. The working principle is as follows: heat dissipation airflows of different temperatures flow through the gaps between the heat dissipation fins, and the heat is transferred to the cooling part 3 through the fins and is carried away by the coolant in the cooling part 3. The system achieves the goal of having the same temperature when different air temperatures enter and exit by controlling the flow rate of the coolant in the cooling part 3.

[0062] As a preferred embodiment, the vent portion 2 is a vent portion 2 made of a thermally conductive material.

[0063] The ventilation part 2 can be made of a thermally conductive material, which can be but not limited to aluminum. When using thermally conductive materials such as aluminum, the temperature of the heat dissipation airflow can be better cooled by the cooling part 3. Then, the better cooling effect can make the subsequent radiator flow to each device to be cooled better, the actual effect is better, the heat dissipation effect is more obvious, and the reliability of the solution is improved.

[0064] As a preferred embodiment, the cooling portion 3 is a plastic cooling portion 3 or a plastic cooling portion 3 .

[0065] The cooling part 3 can be made of plastic material or plastic material, which is easy to process and manufacture, and is also convenient for connecting with the water inlet pipe and the water outlet pipe when liquid flows through it. The plastic cooling part 3 and the plastic cooling part 3 are more durable, which improves the reliability of the solution.

[0066] As a preferred embodiment, the server further comprises a plurality of slots for inserting heat dissipation devices, and the slots are provided with temperature sensors;

[0067] Get the temperature of each device to be cooled, including:

[0068] The temperature of each slot is obtained by a temperature sensor to obtain the temperature of each component to be cooled.

[0069] The server also includes multiple slots, which are used to plug in heat sinks. Temperature sensors are set on the slots, and the temperature at the slots is then obtained to represent the temperature of each device to be cooled. When the temperature sensors are set in the slots, the actual measured temperature will not be affected by the replacement of the device to be cooled, making the solution more reliable and improving the feasibility of the solution.

[0070] The device for temperature collection is not limited to a temperature sensor, but may also be other devices for collecting temperature, thereby increasing the flexibility of the solution.

[0071] Please refer to Figure 6 , Figure 6 This is a structural schematic diagram of a heat dissipation management device provided by the present invention.

[0072] The present invention also provides a heat dissipation management device, comprising:

[0073] Memory 30, for storing computer programs;

[0074] The processor 31 is configured to execute a computer program to implement the steps of the above-mentioned heat dissipation management method.

[0075] For an introduction to the heat dissipation management device provided by this solution, please refer to the embodiment of the heat dissipation management method described above, which will not be repeated here.

[0076] By obtaining the temperature of each device to be cooled; determining the average temperature of each device to be cooled according to the temperature of each device to be cooled; and controlling the water flow of the cooling part corresponding to the device to be cooled according to the relationship between the temperature and the average temperature, so that the temperature of the heat dissipation airflow when it flows through the ventilation part to reach each device to be cooled is the same, and the temperature of the device to be cooled is positively correlated with the water flow of the cooling part corresponding to the device to be cooled. The present application adds a cooling component between the heat source and the device to be cooled, obtains the temperature of each device to be cooled and determines the average temperature, and then controls the water flow of the cooling part of the cooling component according to the temperature and the average temperature. The heat dissipation gas of the ventilation part is cooled by the liquid flowing through the cooling part, and the water flow of each cooling part is positively correlated with the temperature of the device to be cooled corresponding to the cooling part. Finally, the heat dissipation airflow is controlled to have the same temperature when it flows through the ventilation part to reach each device to be cooled, and the temperature of these devices to be cooled is the same after cooling, thereby realizing unified heat dissipation management of the devices to be cooled and improving the reliability of the server during operation.

[0077] The present invention also provides a server, including the above-mentioned heat dissipation management device and a cooling assembly, the cooling assembly including a ventilation part and a cooling part that are in contact with each other, a heat dissipation airflow flowing through the heat dissipation device in the ventilation part, and a liquid flowing in the cooling part to cool the heat dissipation airflow, the cooling part is arranged corresponding to the device to be dissipated, and the heat dissipation management device is connected to the cooling assembly.

[0078] For an introduction to the server provided by this solution, please refer to the embodiment of the above-mentioned heat dissipation management method, which will not be repeated here.

[0079] By obtaining the temperature of each device to be cooled; determining the average temperature of each device to be cooled according to the temperature of each device to be cooled; and controlling the water flow of the cooling part corresponding to the device to be cooled according to the relationship between the temperature and the average temperature, so that the temperature of the heat dissipation airflow when it flows through the ventilation part to reach each device to be cooled is the same, and the temperature of the device to be cooled is positively correlated with the water flow of the cooling part corresponding to the device to be cooled. The present application adds a cooling component between the heat source and the device to be cooled, obtains the temperature of each device to be cooled and determines the average temperature, and then controls the water flow of the cooling part of the cooling component according to the temperature and the average temperature. The heat dissipation gas of the ventilation part is cooled by the liquid flowing through the cooling part, and the water flow of each cooling part is positively correlated with the temperature of the device to be cooled corresponding to the cooling part. Finally, the heat dissipation airflow is controlled to have the same temperature when it flows through the ventilation part to reach each device to be cooled, and the temperature of these devices to be cooled is the same after cooling, thereby realizing unified heat dissipation management of the devices to be cooled and improving the reliability of the server during operation.

[0080] The present invention also provides a heat dissipation management system, which is applied to a processor of a server. The heat dissipation management system includes:

[0081] A temperature acquisition unit, used to acquire the temperature of each device to be cooled;

[0082] an average temperature determining unit, configured to determine an average temperature of each of the components to be cooled according to the temperature of each of the components to be cooled;

[0083] A water flow control unit is used to control the water flow of the cooling part corresponding to the device to be cooled according to the relationship between the temperature and the average temperature, so that the temperature of the cooling airflow when it flows through the ventilation part and reaches each device to be cooled is the same, and the temperature of the device to be cooled is positively correlated with the water flow of the cooling part corresponding to the device to be cooled.

[0084] The cooling assembly further comprises a water inlet pipe provided at one end of the cooling unit, a water outlet pipe provided at the other end of the cooling unit, and a water valve provided on the water inlet pipe, wherein the water valve is connected to the processor;

[0085] Water flow control unit, comprising:

[0086] According to the relationship between the temperature and the average temperature, the opening angle of the water valve on the water inlet pipe of the cooling part corresponding to the heat dissipation device is controlled to control the water inlet amount of the water inlet pipe, and the water inlet amount is positively correlated with the water flow of the cooling part.

[0087] Wherein, the water flow control unit includes:

[0088] The opening angle of the water inlet valve of the cooling part corresponding to the heat dissipating device is controlled to be a target angle corresponding to the temperature of the heat dissipating device so that the temperature of each heat dissipating device is the same.

[0089] Wherein, the water flow control unit includes:

[0090] The opening angle of the water supply valve of the water inlet pipe of the cooling part corresponding to the heat dissipating device is controlled to change the preset angle in each control cycle until the temperatures of the heat dissipating devices are the same.

[0091] Wherein, the ventilation portion is a honeycomb structure ventilation portion or a grid structure ventilation portion.

[0092] Wherein, the vent portion is a vent portion made of a thermally conductive material.

[0093] Wherein, the cooling part is a plastic cooling part or a plastic cooling part.

[0094] The server further comprises a plurality of slots for plugging in the heat dissipation devices, and the slots are provided with temperature sensors;

[0095] Temperature acquisition unit, including:

[0096] The temperature of each slot is acquired through a temperature sensor to acquire the temperature of each component to be cooled.

[0097] For an introduction to the heat dissipation management system provided by this solution, please refer to the embodiment of the heat dissipation management method described above, which will not be repeated here.

[0098] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0099] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0100] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation management method, characterized in that: A processor applied to a server, the server further comprising a cooling assembly, the cooling assembly comprising a vent and a cooling portion attached to each other, a heat dissipation airflow flowing through the heat dissipation device in the vent, a liquid flowing through the cooling portion to cool the heat dissipation airflow, the cooling portion being provided in correspondence with the device to be dissipated; each device to be dissipated has a corresponding cooling portion; The heat dissipation management method comprises: Obtaining the temperature of each of the components to be cooled; Determining an average temperature of each of the components to be cooled according to the temperature of each of the components to be cooled; The water flow rate of the cooling part corresponding to the component to be cooled is controlled according to the relationship between the temperature of each component to be cooled and the average temperature, so that the temperature of the cooling airflow when it flows through the ventilation part and reaches each component to be cooled is the same, and the temperature of the component to be cooled is positively correlated with the water flow rate of the cooling part corresponding to the component to be cooled.

2. The heat dissipation management method according to claim 1, wherein: The cooling assembly further includes a water inlet pipe provided at one end of the cooling portion, a water outlet pipe provided at the other end of the cooling portion, and a water valve provided on the water inlet pipe, wherein the water valve is connected to the processor; Controlling the water flow of the cooling part corresponding to the heat dissipation device according to the relationship between the temperature and the average temperature includes: According to the relationship between the temperature and the average temperature, the opening angle of the water valve on the water inlet pipe of the cooling part corresponding to the heat dissipation device is controlled to control the water inlet amount of the water inlet pipe, and the water inlet amount is positively correlated with the water flow of the cooling part.

3. The heat dissipation management method according to claim 2, wherein: Controlling the opening angle of the water valve on the water inlet pipe of the cooling unit corresponding to the heat dissipation device includes: The opening angle of the water inlet valve of the cooling part corresponding to the heat dissipating device is controlled to be a target angle corresponding to the temperature of the heat dissipating device so that the temperature of each heat dissipating device is the same.

4. The heat dissipation management method according to claim 2, wherein: Controlling the opening angle of the water valve on the water inlet pipe of the cooling unit corresponding to the heat dissipation device includes: The opening angle of the water supply valve of the water inlet pipe of the cooling part corresponding to the heat dissipating device is controlled to change the preset angle in each control cycle until the temperatures of the heat dissipating devices are the same.

5. The heat dissipation management method according to claim 1, wherein: The ventilation portion is a honeycomb structure ventilation portion or a grid structure ventilation portion.

6. The heat dissipation management method according to claim 1, wherein: The vent is a vent made of a thermally conductive material.

7. The heat dissipation management method according to claim 1, wherein: The cooling part is a plastic cooling part or a plastic cooling part.

8. The heat dissipation management method according to any one of claims 1 to 7, wherein: The server further comprises a plurality of slots for plugging in the heat dissipation devices, and the slots are provided with temperature sensors; Get the temperature of each device to be cooled, including: The temperature of each slot is acquired through a temperature sensor to acquire the temperature of each component to be cooled.

9. A heat dissipation management device, characterized in that: include: memory for storing computer programs; A processor, configured to execute the computer program to implement the steps of the heat dissipation management method according to any one of claims 1 to 8.

10. A server, characterized in that: It includes the heat management device according to claim 9, and also includes a cooling component, the cooling component includes a ventilation part and a cooling part that are in contact with each other, a heat dissipation airflow flows through the heat dissipation device in the ventilation part, and a liquid flows in the cooling part to cool the heat dissipation airflow, the cooling part is arranged corresponding to the device to be dissipated, and the heat management device is connected to the cooling component.

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