A precision etching machine for PERC cell production

Abstract

This invention discloses a precise PERC cell etching machine for PERC cell production technology, comprising: a main body with a transparent door; an etching groove inside the main body; electric guide rails on both sides of the main body, the output ends of which are connected to a movable plate; a cylinder on the top of the movable plate, the piston rod of which passes through the movable plate and connects to a mounting plate; and positioning devices evenly arranged above the etching groove on the bottom of the mounting plate. Silicon wafers are placed one by one on a support plate, and then positioned and pressed from above by a miniature electric telescopic rod. Each silicon wafer is supported only on its bottom two sides by individual support plates. Therefore, during etching, the position covering the bottom of the silicon wafer can be intermittently changed by moving the support plates in opposite directions, allowing the lower surface of the silicon wafer to be fully etched by the solution, reducing the probability of defective products after etching.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PERC cell production, in particular to a PERC cell production etching machine with accurate positioning. BACKGROUND

[0002] In the diffusion process, the single-sided diffusion method is used in a back-to-back manner, and the side and back edge of the silicon wafer will inevitably diffuse phosphorus atoms. When sunlight shines, the photo-generated electrons collected on the front surface of the P-N junction will flow to the back surface of the P-N junction along the area with phosphorus on the edge, causing a short circuit path. The short circuit path is equivalent to reducing the parallel resistance.

[0003] The PERC cell production etching machine etches the lower surface and edge of the diffused silicon wafer by using a mixed liquid of HNO3 and HF in the etching tank to remove the N-type silicon on the edge and break the short circuit path on the surface of the silicon wafer. Therefore, the control of the liquid level height needs to be particularly accurate. However, after the traditional PERC cell production etching machine positions and clamps the silicon wafer, the lower surface and edge of the silicon wafer will always be covered by the clamp, so that the lower surface and edge of the silicon wafer cannot be fully etched by the solution in the etching tank, resulting in a large number of defective products of the PERC cell produced by the etching machine. In addition, the waste gas generated during etching cannot be treated in time, polluting the environment. Therefore, we propose a PERC cell production etching machine with accurate positioning. SUMMARY

[0004] The present application aims to provide a PERC cell production etching machine with accurate positioning to solve the problems raised in the background.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a PERC cell production etching machine with accurate positioning, comprising a body, a transparent door is arranged on the body;

[0006] An etching tank is arranged in the body;

[0007] Electric guide rails are arranged on both sides of the body, and the output ends of the two groups of electric guide rails are connected with a movable plate;

[0008] A gas cylinder is arranged on the top of the movable plate, and a mounting plate is connected to the piston rod of the gas cylinder through the movable plate;

[0009] Positioning devices are arranged on the bottom of the mounting plate above the etching tank;

[0010] A shock-absorbing pad is arranged on the bottom of the body.

[0011] As a preferred scheme of the positioning accurate PERC cell production etching machine, the positioning device comprises two groups of connecting rods with the same structure, the bottom end of each group of the connecting rods is provided with a fixed box, the front side of the fixed box is provided with a box door, and a handle is arranged on the box door.

[0012] As a preferred scheme of the positioning accurate PERC cell production etching machine, the inside of the fixed box is uniformly provided with a rotating shaft, the bottom of the rotating shaft is rotatably connected to the fixed box through a bearing, a gear is sleeved on the rotating shaft, support plates are connected to the front and rear sides of the gear in a meshing mode, the two groups of support plates horizontally penetrate through the fixed box, guide rods installed in the fixed box are slidably connected to the two groups of support plates, a notch is formed in the top of one end of the support plate extending to the outside of the fixed box, and the top of one group of the support plates is attached to the silicon wafer.

[0013] As a preferred scheme of the positioning accurate PERC cell production etching machine, the fixed box is uniformly provided with a convex rod, a micro electric telescopic rod is arranged on the convex rod, and the output end of the micro electric telescopic rod is attached to the top of the silicon wafer.

[0014] As a preferred scheme of the positioning accurate PERC cell production etching machine, a motor is arranged in the fixed box, the output shaft of the motor is connected to one group of the rotating shafts, and a transmission structure is arranged on the adjacent rotating shafts.

[0015] As a preferred scheme of the positioning accurate PERC cell production etching machine, the transmission structure comprises a belt pulley one sleeved on each adjacent rotating shaft, and a belt one is connected between the two groups of belt pulleys one.

[0016] As a preferred scheme of the positioning accurate PERC cell production etching machine, a top plate is arranged in the fixed box, a connecting shaft is rotatably connected to the bottom of the top plate through a bearing, a belt pulley two is sleeved on the connecting shaft and the output shaft of the motor, a belt two is connected between the two groups of belt pulleys two, a fan blade is arranged on the connecting shaft, an air inlet pipe and an exhaust port are arranged on the fixed box, and a waste gas purifier is arranged between the top plate and the exhaust port in the fixed box.

[0017] As a preferred scheme of the positioning accurate PERC cell production etching machine, hydraulic cylinders are arranged at the two ends of the front and rear sides of the body, and moving wheels are arranged on the piston rods of the hydraulic cylinders.

[0018] Compared with the prior art, the present application has the beneficial effects that: the silicon wafer is placed on the support plate one by one, and then the micro electric telescopic rod is used to position and press the silicon wafer from above, and each silicon wafer is only supported by the bottom two sides by the separate support plate, so that when etching, the position covering the bottom of the silicon wafer can be intermittently changed by moving the support plate in the opposite direction, so that the lower surface of the silicon wafer can be fully corroded by the solution, thereby reducing the probability of occurrence of defective products after etching of the silicon wafer; during etching, the motor can drive the connecting shaft to rotate through the belt pulley II, so that the fan blades rotate, and then the exhaust gas during etching can be timely sucked through the air inlet pipe, and after purification by the exhaust gas purifier, the exhaust gas is discharged through the exhaust port, thereby reducing the pollution to the environment. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure schematic diagram of the etching machine for the PERC battery piece production with accurate positioning of the present application;

[0020] Figure 2 It is a structure schematic diagram of the positioning device of the etching machine for the PERC battery piece production with accurate positioning of the present application;

[0021] Figure 3 It is an internal structure schematic diagram of the fixed box of the etching machine for the PERC battery piece production with accurate positioning of the present application;

[0022] Figure 4 It is a structure schematic diagram of A of the etching machine for the PERC battery piece production with accurate positioning of the present application.

[0023] In the figure: 1, body; 2, transparent door; 3, etching groove; 4, electric guide rail; 5, movable plate; 6, air cylinder; 7, mounting plate; 8, connecting rod; 9, fixed box; 10, box door; 11, handle; 12, rotating shaft; 13, gear; 14, support plate; 15, guide rod; 16, notch; 17, silicon wafer; 18, protruding rod; 19, micro electric telescopic rod; 20, motor; 21, belt pulley I; 22, belt pulley II; 23, connecting shaft; 24, top plate; 25, fan blade; 26, air inlet pipe; 27, exhaust gas purifier; 28, exhaust port; 29, shock pad; 30, hydraulic cylinder; 31, moving wheel. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0025] Embodiment 1

[0026] Reference Figures 1 to 4 A positioning accurate PERC cell production etching machine, comprising, the body 1, other structures in the PERC cell production etching machine not mentioned in this paper are the same as the prior art, the body 1 is provided with a transparent door 2;

[0027] The body 1 is provided with an etching groove 3, and a solution for etching the lower surface and the edge of the silicon wafer is arranged in the etching groove 3;

[0028] Both sides of the body 1 are provided with an electric guide rail 4, and the output ends of the two groups of electric guide rails 4 are connected with a movable plate 5. The electric guide rail 4 can move the silicon wafer 17 in the front and back directions, so as to enter different processes in the etching process.

[0029] The top of the movable plate 5 is provided with an air cylinder 6, and the piston rod of the air cylinder 6 penetrates through the movable plate 5 and is connected with a mounting plate 7.

[0030] The bottom of the mounting plate 7 is uniformly provided with a positioning device located above the etching groove 3.

[0031] The bottom of the body 1 is provided with a shock pad 29, which can reduce the vibration of the body 1 in the etching process.

[0032] The positioning device comprises two groups of connecting rods 8 which are the same in structure. The bottom ends of the two groups of connecting rods 8 are provided with fixed boxes 9. The front sides of the fixed boxes 9 are provided with box doors 10. The box doors 10 are provided with handles 11, which are convenient for maintaining the structure in the fixed box 9.

[0033] The inside of the fixed box 9 is uniformly provided with a rotating shaft 12. The bottom of the rotating shaft 12 is rotatably connected to the fixed box 9 through a bearing. A gear 13 is sleeved on the rotating shaft 12. The front and back sides of the gear 13 are engaged with support plates 14. The two groups of support plates 14 horizontally penetrate through the fixed box 9. The two groups of support plates 14 are slidably connected with guide rods 15 mounted in the fixed box 9. The guide rods 15 can support the support plates 14. The top of one end of the support plate 14 extending to the outside of the fixed box 9 is provided with a notch 16. The top of one of the two groups of support plates 14 is attached to the silicon wafer 17. The notch 16 makes the support plate 14 easily enter the bottom of the silicon wafer 17 horizontally. The bottom of each silicon wafer 17 is supported by a separate support plate 14.

[0034] The fixed box 9 is uniformly provided with a convex rod 18. The convex rod 18 is provided with a micro electric telescopic rod 19. The output end of the micro electric telescopic rod 19 is attached to the top of the silicon wafer 17. The micro electric telescopic rod 19 presses the silicon wafer 17 downward.

[0035] The fixed box 9 is provided with a motor 20. The output shaft of the motor 20 is connected with one of the rotating shafts 12. Adjacent rotating shafts 12 are provided with transmission structures.

[0036] The transmission structure includes pulleys 21 respectively sleeved on adjacent rotating shafts 12, and a belt connecting the two sets of pulleys 21. The motor 20 drives one set of rotating shafts 12 to rotate, which in turn drives the adjacent rotating shafts 12 to rotate through the pulleys 21. This allows the adjacent rotating shafts 12 to rotate in tandem, so that all rotating shafts 12 can rotate synchronously. This allows each gear 13 to drive the support plates 14 on the front and rear sides to move in opposite directions, thereby causing the support plates 14 supporting the bottom of the silicon wafer 17 to retract. When retracting, the support plates 14 have not completely detached from the bottom of the silicon wafer 17. The previously retracted support plates 14 have already supported the bottom of the silicon wafer 17 through the notch 16. Until the retracted support plates 14 are completely retracted, the position covering the bottom of the silicon wafer 17 can be changed, so that the lower surface of the silicon wafer 17 can be fully etched by the solution, reducing the probability of defective products appearing after the silicon wafer 17 is etched.

[0037] A top plate 24 is installed inside the fixed box 9. The bottom of the top plate 24 is rotatably connected to a connecting shaft 23 via a bearing. Pulleys 22 are sleeved on both the connecting shaft 23 and the output shaft of the motor 20. A belt 22 is connected between the two sets of pulleys 22. A fan blade 25 is installed on the connecting shaft 23. An air inlet pipe 26 and an exhaust port 28 are installed on the fixed box 9. An exhaust gas purifier 27 is installed inside the fixed box 9 between the top plate 24 and the exhaust port 28. When the motor 20 is working, the pulleys 22 drive the connecting shaft 23 to rotate, causing the fan blade 25 to rotate. This allows the exhaust gas during etching to be drawn in through the air inlet pipe 26 in a timely manner. After being purified by the exhaust gas purifier 27, it is discharged into the main body 1 through the exhaust port 28, and then discharged into the atmosphere through the main body 1, reducing environmental pollution.

[0038] Example 2

[0039] Reference Figure 1 Hydraulic cylinders 30 are provided at both the front and rear ends of the main body 1. Each piston rod of the hydraulic cylinder 30 is equipped with a movable wheel 31. The movable wheel 31 is driven by the hydraulic cylinder 30 to contact the ground, which facilitates the movement of the main body 1 and makes it easy to suspend the shock-absorbing pad 29 in the air, so as to facilitate the replacement of the shock-absorbing pad 29.

[0040] The rest of the structure is the same as in Example 1.

[0041] Operation process: Open the transparent door 2, place the silicon wafers 17 one by one above the support plate 14, and then use the miniature electric telescopic rod 19 to position and press the silicon wafers 17 from above. Next, the cylinder 6 drives the mounting plate 7 to move downward, allowing the silicon wafers 17 to enter the etching tank 3. The solution in the etching tank 3 etches the lower surface and edges of the silicon wafers 17. Each silicon wafer 17 is only supported by individual support plates 14 on its bottom two sides. Therefore, during etching, the motor 20 is turned on. The motor 20 drives one set of rotating shafts 12 to rotate through the output shaft. Then, through the transmission structure on the adjacent rotating shafts 12, each rotating shaft 12 rotates synchronously. This allows each gear 13 to drive the support plates 14 on the front and rear sides to move in opposite directions, thereby supporting the bottom of the silicon wafers 17. The support plate 14 is retracted, and the previously retracted support plate 14 supports the bottom of the silicon wafer 17. By setting a notch 16, it is easy for the support plate 14 to enter the bottom of the silicon wafer 17 for support. By moving the support plate 14 in the opposite direction, the position covering the bottom of the silicon wafer 17 can be changed intermittently, so that the lower surface of the silicon wafer 17 can be fully etched by the solution, reducing the probability of defective products after etching. During etching, the motor 20 can drive the connecting shaft 23 to rotate through the pulley 22, so that the fan blade 25 can rotate, so that the waste gas during etching can be drawn in through the air inlet pipe 26 in time. After being purified by the waste gas purifier 27, it is discharged through the exhaust port 28. After the silicon wafer 17 is removed from the etching tank 3, it continues to move backward through the electric guide rail 4 to carry out the subsequent etching process.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A precision-positioning etching machine for PERC solar cell production, characterized in that: include, The main body (1) is provided with a transparent door (2). The body (1) is provided with etching grooves (3); Electric guide rails (4) are provided on both sides of the main body (1), and the output ends of the two sets of electric guide rails (4) are connected to the movable plate (5). A cylinder (6) is provided on the top of the movable plate (5), and the piston rod of the cylinder (6) passes through the movable plate (5) and is connected to the mounting plate (7). The bottom of the mounting plate (7) is uniformly provided with positioning devices located above the etching groove (3); The bottom of the main body (1) is provided with a shock-absorbing pad (29). The positioning device includes two sets of connecting rods (8) with the same structure. The bottom end of each set of connecting rods (8) is provided with a fixed box (9). The front side of each fixed box (9) is provided with a box door (10). The box door (10) is provided with a handle (11). The fixed box (9) is uniformly provided with rotating shafts (12). The bottom of each rotating shaft (12) is rotatably connected to the fixed box (9) through bearings. A gear (13) is sleeved on the rotating shaft (12). Support plates (14) are meshed on both the front and rear sides of the gear (13). Both sets of support plates (14) pass through the fixed box (9) laterally. Guide rods (15) installed in the fixed box (9) are slidably connected on both sets of support plates (14). A notch (16) is opened at the top of one end of the support plate (14) extending to the outside of the fixed box (9). The top of one set of support plates (14) is in contact with the silicon wafer (17). The fixed box (9) is provided with a top plate (24), and the fixed box (9) is provided with an air inlet pipe (26) and an exhaust port (28). The fixed box (9) is provided with an exhaust gas purifier (27) located between the top plate (24) and the exhaust port (28).

2. The precision-positioning etching machine for PERC cell production according to claim 1, characterized in that: The fixed box (9) is uniformly provided with protruding rods (18), and a miniature electric telescopic rod (19) is provided on the protruding rod (18). The output end of the miniature electric telescopic rod (19) is attached to the top of the silicon wafer (17).

3. The precision-positioning etching machine for PERC cell production according to claim 1, characterized in that: The fixed box (9) is equipped with a motor (20), the output shaft of the motor (20) is connected to one of the sets of rotating shafts (12), and a transmission structure is provided on each of the adjacent rotating shafts (12).

4. The precision-positioning etching machine for PERC solar cell production according to claim 3, characterized in that: The transmission structure includes pulleys (21) respectively sleeved on adjacent rotating shafts (12), and a belt is connected between the two sets of pulleys (21).

5. The precision-positioning etching machine for PERC cell production according to claim 3, characterized in that: The bottom of the top plate (24) is rotatably connected to a connecting shaft (23) via a bearing. Both the connecting shaft (23) and the output shaft of the motor (20) are fitted with pulleys (22). A belt is connected between the two sets of pulleys (22). A fan blade (25) is provided on the connecting shaft (23).

6. The precision-positioning etching machine for PERC solar cell production according to claim 1, characterized in that: Hydraulic cylinders (30) are provided at both ends of the front and rear sides of the main body (1), and movable wheels (31) are provided on the piston rods of the hydraulic cylinders (30).

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