An embedded cooling chip with manifold microchannels

Abstract

The present invention belongs to the field of semiconductor technology, and discloses an embedded cooling chip with manifold microchannels, including a base substrate and a manifold substrate, the base substrate and the manifold substrate are bonded to each other, the base substrate has a plurality of annular fins arranged in an array, the annular fins are hollow cylinders protruding upward from the bottom surface of the base substrate, and the inner ring forms a first through hole; the manifold substrate has a plurality of second through holes that penetrate up and down, the second through holes of the manifold substrate are aligned one by one with the first through holes of the base substrate, and the manifold substrate has a plurality of parallel coolant inlet and outlet channels. The present invention adopts a parallel manifold structure to make the coolant distribution on the chip more uniform; the through holes are used to form an annular fin structure, and there is no need to design an additional heat exchange channel or increase the chip height; the through holes penetrate the chip, and the conductive metal can be filled inside to achieve circuit connection of the stacked chips.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular relates to an embedded cooling chip with a manifold microchannel. Background Art

[0002] As computing power requirements increase, the market demand for multi-chip stacking packaging technology to achieve high computing power density for devices of the same size is also growing. At the same time, the increase in computing power density inevitably leads to an increase in heat flux density, resulting in serious chip heating problems. Traditional surface cooling cannot solve the heat of the middle layer chip, so chip embedded microchannel cooling technology came into being.

[0003] Embedded microchannel cooling technology is to etch microchannels on the back of the semiconductor substrate. The coolant flows through the microchannels to remove the heat from the chip. It has the characteristics of high heat exchange efficiency, low manufacturing cost and long service life. However, for stacked chips with through-silicon vias, the semiconductor substrate cannot be etched with microchannels on the entire surface, and the heat exchange efficiency of the coolant is greatly limited. Summary of the invention

[0004] The object of the present invention is to provide an embedded cooling chip with manifold microchannels to solve the above-mentioned technical problems.

[0005] In order to solve the above technical problems, the specific technical solution of an embedded cooling chip with manifold microchannels of the present invention is as follows:

[0006] An embedded cooling chip with a manifold microchannel comprises a base substrate and a manifold substrate, wherein the base substrate and the manifold substrate are bonded to each other, wherein the base substrate has a plurality of annular fins arranged in an array, wherein the annular fins are hollow cylinders protruding upward from the bottom surface of the base substrate, wherein the inner ring forms a first through hole; wherein the manifold substrate has a plurality of second through holes penetrating vertically, wherein the second through holes of the manifold substrate are aligned one by one with the first through holes of the base substrate, and wherein the manifold substrate has a plurality of parallel cooling liquid inlet and outlet channels.

[0007] Furthermore, the base substrate and the manifold substrate adopt a flat plate structure, and the material is a circuit board or ceramics, silicon.

[0008] Furthermore, the lower surface of the base substrate is an active device.

[0009] Furthermore, microchannels are formed between adjacent annular fins.

[0010] Furthermore, the annular fin is etched on the back side of the chip based on semiconductor material, and is processed by laser etching and plasma dry etching processes.

[0011] Furthermore, the manifold substrate is a serpentine baffle structure, and coolant inlet and outlet channels are formed between the baffles and are alternately arranged on the left and right sides, namely a left channel and a right channel. The left channel is open on the left side, and the right channel is open on the right side. The left channel and the right channel are used to provide coolant inlet and outlet.

[0012] Furthermore, the first through hole and the second through hole are filled with conductive metal to achieve circuit connectivity.

[0013] Furthermore, the second through hole and the coolant inlet and outlet channel on the manifold substrate are both etched on the manifold substrate by laser etching and plasma dry etching processes.

[0014] Furthermore, the coolant enters the microchannel from the manifold substrate.

[0015] Furthermore, the coolant enters the manifold substrate from the coolant inlet and outlet channel on one side of the manifold substrate; then, the coolant enters the microchannel of the base substrate, exchanges heat with the outer surface of the annular fin and the upper surface of the base substrate, and finally, the coolant flows out of the chip from the coolant inlet and outlet channel on the other side of the manifold substrate.

[0016] An embedded cooling chip with a manifold microchannel of the present invention has the following advantages: the present invention adopts a parallel manifold structure to make the coolant distribution on the chip more uniform; a ring-shaped fin structure is formed by through holes, and there is no need to additionally design heat exchange channels or increase the chip height; the through holes run through the chip and can be filled with conductive metal to achieve circuit connection of stacked chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of an embedded cooling chip with manifold microchannels of the present invention;

[0018] Figure 2 It is a schematic diagram of the base substrate structure of the present invention;

[0019] Figure 3 It is a schematic diagram of the structure of the manifold substrate of the present invention;

[0020] Figure 4 is a cross-sectional view of an embedded cooling chip with manifold microchannels of the present invention;

[0021] Figure 5 It is a cross-sectional view of the local structure of the chip of the present invention.

[0022] Markings in the figure: 1-base substrate; 2-manifold substrate; 11-annular fin; 111-first through hole; 22-second through hole; 21-cooling liquid inlet and outlet channel; 211-left channel; 212, right channel; 12-microchannel. DETAILED DESCRIPTION

[0023] In order to better understand the purpose, structure and function of the present invention, the embedded cooling chip with manifold microchannels of the present invention is further described in detail below in conjunction with the accompanying drawings.

[0024] like Figure 1-Figure 5 As shown, an embedded cooling chip with manifold microchannels of the present invention comprises a base substrate 1 and a manifold substrate 2. The base substrate 1 and the manifold substrate 2 are of flat plate structure and made of materials such as circuit boards, ceramics, silicon, etc. Semiconductor materials such as silicon, silicon carbide, gallium nitride, and gallium oxide can be selected, and the two are bonded to each other. The base substrate 1 is at the bottom, the manifold substrate 2 is at the top, and the lower surface of the base substrate 1 is an active device.

[0025] like Figure 2 As shown, the base substrate 1 has a plurality of annular fins 11 arranged in an array, and the annular fins 11 are hollow cylinders protruding upward from the bottom surface of the base substrate 1, and the inner ring forms a first through hole 111. Microchannels 12 are formed between adjacent annular fins 11. The annular fins 11 are etched on the back of a chip based on semiconductor materials such as silicon, silicon carbide, gallium nitride, and gallium oxide, and are processed by laser etching and plasma dry etching.

[0026] like Figure 3 As shown, the manifold substrate 2 is a serpentine baffle structure, and the baffles form cooling liquid inlet and outlet channels 21 that are alternately arranged on the left and right, respectively, a left channel 211 and a right channel 212. The left channel 211 is open on the left, and the right channel 212 is open on the right. The left channel 211 and the right channel 212 are used to provide the inlet and outlet of the cooling liquid. The serpentine baffle of the manifold substrate 2 has a plurality of second through holes 22 that penetrate up and down. When the manifold substrate 2 is bonded to the base substrate 1, the second through holes 22 of the manifold substrate 2 are aligned one by one with the first through holes 111 of the base substrate 1, and the cooling liquid inlet and outlet channels 21 of the manifold substrate 2 are connected with the microchannels 12 of the base substrate 1. The first through holes 111 and the second through holes 22 are filled with conductive metal aluminum to achieve circuit connectivity.

[0027] The second through hole 22 and the coolant inlet and outlet channel 21 on the manifold substrate 2 are both etched on the manifold substrate 2 by using an etching process such as laser etching and plasma dry etching.

[0028] The working principle of the present invention is as follows: when working, the external coolant enters the manifold substrate 2 from the coolant inlet and outlet channel 21 on one side of the manifold substrate 2 (for example, from the left channel 211); then, the coolant enters the microchannel 12 of the base substrate 1, and exchanges heat with the outer surface of the annular fin 11 and the upper surface of the base substrate 1 to reduce the temperature of the active device on the lower surface of the base substrate 1; finally, the coolant that has completed the heat exchange flows out of the chip from the coolant inlet and outlet channel 21 on the other side of the manifold substrate 2 (for example, from the right channel 212).

[0029] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. An embedded cooling chip with manifold microchannels, characterized in that: The invention comprises a base substrate (1) and a manifold substrate (2), wherein the base substrate (1) and the manifold substrate (2) are bonded to each other, the base substrate (1) has a plurality of annular fins (11) arranged in an array, the annular fins (11) are hollow cylinders protruding upward from the bottom surface of the base substrate (1), and the inner ring of the annular fins (11) forms a first through hole (111); the manifold substrate (2) has a plurality of second through holes (22) penetrating from top to bottom, the second through holes (22) of the manifold substrate (2) are aligned one by one with the first through holes (111) of the base substrate (1), and the manifold substrate (2) has a plurality of parallel cooling liquid inlet and outlet channels (21); the base substrate (1) and the manifold substrate (2) adopt a flat plate structure, microchannels (12) are formed between adjacent annular fins (11), the manifold substrate (2) is a serpentine baffle structure, and the first through holes (111) and the second through holes (22) are filled with conductive metal to achieve circuit connectivity.

2. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The base substrate (1) and the manifold substrate (2) are made of circuit boards, ceramics or silicon.

3. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The lower surface of the base substrate (1) is an active device.

4. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The annular fin (11) is etched on the back of a chip based on a semiconductor material and is manufactured using laser etching and plasma dry etching processes.

5. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: Cooling liquid inlet and outlet channels (21) are formed between the baffles and are arranged alternately on the left and right sides, namely a left channel (211) and a right channel (212). The left channel (211) is open on the left side, and the right channel (212) is open on the right side. The left channel (211) and the right channel (212) are used to provide an inlet and outlet for the cooling liquid.

6. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The second through hole (22) and the coolant inlet and outlet channel (21) on the manifold substrate (2) are both engraved on the manifold substrate (2) using laser etching and plasma dry etching processes.

7. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The cooling liquid enters the microchannel (12) from the manifold substrate (2).

8. The embedded cooling chip with manifold microchannels according to claim 1, characterized in that: The coolant enters the manifold substrate (2) from the coolant inlet and outlet channel (21) on one side of the manifold substrate (2); then, the coolant enters the microchannel (12) of the base substrate (1), exchanges heat with the outer surface of the annular fin (11) and the upper surface of the base substrate (1); finally, the coolant flows out of the chip from the coolant inlet and outlet channel (21) on the other side of the manifold substrate (2).

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