Splicing display panels and display terminals

Abstract

The present application provides a spliced ​​display panel and a display terminal. The spliced ​​display panel includes a backplane and at least one first package, at least one second package, and at least one third package bonded to the backplane. The first package, the second package, and the third package display blue light, red light, and green light, respectively. The first package, the second package, and the third package each include a substrate, a driving circuit and a light-emitting diode chip integrated on and electrically connected to the substrate, and a first packaging layer covering the driving circuit and the light-emitting diode chip. The present application arranges the light-emitting diode chip and its corresponding driving circuit into a separate package. The size of the separate package is much larger than that of a single light-emitting diode chip. This can reduce the difficulty of optical binning of the light-emitting diode chip, thereby alleviating the optical binning difficulty of existing Micro LED chips.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a spliced ​​display panel and a display terminal. Background Art

[0002] Micro LEDs (micro light emitting diodes) are a new generation of display technology. Compared to existing organic light emitting diode (OLED) technology, they offer advantages such as smaller size, higher brightness, improved luminous efficiency, and lower power consumption. Micro LED technology utilizes thin-film, miniaturized, and arrayed LED structures, with sizes ranging from approximately 1 to 10 microns. However, the tiny size of Micro LED chips makes optical binning difficult. Summary of the Invention

[0003] The present application provides a spliced ​​display panel and a display terminal to alleviate the technical problem of optical binning difficulty in existing Micro LED chips.

[0004] To solve the above problems, the technical solutions provided by this application are as follows:

[0005] An embodiment of the present application provides a spliced ​​display panel, comprising a backplane and at least one first package, at least one second package, and at least one third package bonded to the backplane, wherein the first package, the second package, and the third package respectively display blue light, red light, and green light; and each of the first package, the second package, and the third package comprises:

[0006] substrate;

[0007] A driving circuit and a light-emitting diode chip; the driving circuit and the light-emitting diode chip are integrated on the substrate and electrically connected; and

[0008] a first packaging layer, covering the driving circuit and the light-emitting diode chip;

[0009] In which, the second package body also includes a red quantum dot film layer arranged on the side of the first package layer away from the light-emitting diode chip of the second package body, and a second package layer arranged on the side of the red quantum dot film layer away from the first package layer, and the red quantum dot film layer is positioned opposite to the light-emitting diode chip of the second package body.

[0010] In the spliced ​​display panel provided in the embodiment of the present application, the light-emitting diode chip of the second package body emits blue light, and the second package body further includes a first blue light absorption layer arranged between the red quantum dot film layer and the second package layer.

[0011] In the spliced ​​display panel provided in the embodiment of the present application, the light emitting diode of the third package body emits green light.

[0012] In the spliced ​​display panel provided in the embodiment of the present application, the light emitting diode chip of the third package body emits blue light;

[0013] The third package further includes:

[0014] A green quantum dot film layer is provided on a side of the first packaging layer away from the light-emitting diode chip of the third packaging body; and

[0015] a third encapsulation layer, disposed on a side of the green quantum dot film layer away from the first encapsulation layer;

[0016] The green quantum dot film layer is located opposite to the light emitting diode chip of the third package.

[0017] In the spliced ​​display panel provided in the embodiment of the present application, the third packaging body further includes:

[0018] The second blue light absorbing layer is arranged between the green quantum dot film layer and the third encapsulation layer.

[0019] In the spliced ​​display panel provided in the embodiment of the present application, the light emitting diode chip emits ultraviolet light;

[0020] The second encapsulation body includes: a red quantum dot film layer provided on the first encapsulation layer; and a second encapsulation layer provided on the red quantum dot film layer;

[0021] The third encapsulation body includes: a green quantum dot film layer provided on the first encapsulation layer; and a third encapsulation layer provided on the green quantum dot film layer;

[0022] The first encapsulation body includes: a blue quantum dot film layer disposed on the first encapsulation layer; and a fourth encapsulation layer disposed on the blue quantum dot film layer.

[0023] In the spliced ​​display panel provided in the embodiment of the present application, the first encapsulation body, the second encapsulation body and the third encapsulation body further include an ultraviolet light absorbing layer respectively;

[0024] Among them, the ultraviolet light absorption layer of the second package body is arranged between the red quantum dot film layer and the second packaging layer; the ultraviolet light absorption layer of the third package body is arranged between the green quantum dot film layer and the third packaging layer; the ultraviolet light absorption layer of the first package body is arranged between the blue quantum dot film layer and the fourth packaging layer.

[0025] In the spliced ​​display panel provided in the embodiment of the present application, the first package body, the second package body, and the third package body each further include a composite film layer, the composite film layer being located on a side of the first package layer of the first package body, the second package body, and the third package body, respectively, away from the substrate, and the composite film layer being the top film layer of the corresponding first package body, the second package body, and the third package body;

[0026] The composite film layer includes a first protective layer and a first flat layer. The refractive index of the first protective layer is lower than that of the first flat layer. The first flat layer is arranged on a side of the first protective layer away from the substrate.

[0027] In the spliced ​​display panel provided in an embodiment of the present application, the first protective layer has a first opening, the first opening faces the light-emitting diode chip, and the first flat layer is at least partially located in the first opening;

[0028] The side wall of the first opening is inclined relative to the bottom wall of the first opening, and the slope angle of the side wall of the first opening ranges from 30° to 45°.

[0029] In the spliced ​​display panel provided in the embodiment of the present application, the first package body, the second package body and the third package body all further include a second protective layer, the second protective layer includes a second opening, the second opening is opposite to the first opening, the second protective layer covers the driving circuit, and the light-emitting diode chip is accommodated in the second opening.

[0030] In the spliced ​​display panel provided in the embodiment of the present application, the orthographic projection of the second opening on the substrate falls within the orthographic projection of the first opening on the substrate.

[0031] In the spliced ​​display panel provided in the embodiment of the present application, the side wall of the second opening is inclined relative to the bottom wall of the second opening, and the slope angle of the side wall of the second opening ranges from 30° to 45°.

[0032] In the spliced ​​display panel provided in the embodiment of the present application, the first packaging body, the second packaging body, and the third packaging body all further include:

[0033] a second flat layer located on a side of the first package layer of the first package body, the second package body, and the third package body away from the substrate, and the second flat layer is the top film layer of the corresponding first package body, the second package body, and the third package body; and

[0034] A lens is located on a side of the second flat layer facing the first encapsulation layer, and the lens is opposite to the light-emitting diode chip;

[0035] The lens has an arc surface, and the center of the arc surface is located on the side of the second flat layer facing the substrate;

[0036] The refractive index of the second flat layer is lower than the refractive index of the lens.

[0037] In the spliced ​​display panel provided in the embodiment of the present application, the edge of the red quantum dot film layer is flush with the edges of the first encapsulation layer, the second encapsulation layer and the substrate.

[0038] An embodiment of the present application further provides a display terminal, which includes a main body and a spliced ​​display panel according to one of the aforementioned embodiments, wherein the spliced ​​display panel is fixed on the main body.

[0039] The beneficial effects of the present application are as follows: in the spliced ​​display panel and display terminal provided by the present application, the spliced ​​display panel includes a backplane and at least one first package, at least one second package and at least one third package bonded to the backplane, the first package, the second package and the third package respectively display blue light, red light and green light; the first package, the second package and the third package each include a substrate, a driving circuit and a light-emitting diode chip integrated on and electrically connected to the substrate, and a first packaging layer covering the driving circuit and the light-emitting diode chip. The present application arranges the light-emitting diode chip and its corresponding driving circuit into a separate package, the size of which is much larger than the size of a single light-emitting diode chip, thereby reducing the difficulty of optical binning of the light-emitting diode chip, thereby solving the problem of optical binning difficulty existing in existing Micro LED chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0041] Figure 1A schematic top view of the structure of the spliced ​​display panel provided in an embodiment of the present application.

[0042] Figure 2 A schematic cross-sectional view of a spliced ​​display panel provided in an embodiment of the present application.

[0043] Figure 3 This is another schematic cross-sectional structure diagram of the spliced ​​display panel provided in an embodiment of the present application.

[0044] Figure 4 This is another schematic cross-sectional structure diagram of the spliced ​​display panel provided in an embodiment of the present application.

[0045] Figure 5 A schematic cross-sectional view of a second package provided in an embodiment of the present application.

[0046] Figure 6 This is another schematic cross-sectional structure diagram of the second package body provided in an embodiment of the present application.

[0047] Figure 7 for Figure 6 Detailed structural diagram of the second protective layer.

[0048] Figure 8 This is another schematic cross-sectional structure diagram of the second package body provided in an embodiment of the present application.

[0049] Figure 9 This is another schematic cross-sectional structure diagram of the second package body provided in an embodiment of the present application.

[0050] Figure 10 A schematic flow chart of a method for preparing a spliced ​​display panel according to an embodiment of the present application.

[0051] Figure 11 Schematic diagram of the top view of the light-emitting substrate prepared in the method for preparing a spliced ​​display panel in an embodiment of the present application.

[0052] Figure 12 Schematic diagram of the film layer structure of the second sub-substrate prepared in the method for preparing a spliced ​​display panel in an embodiment of the present application.

[0053] Figure 13 Schematic diagram of laminating the second sub-substrate to the light-emitting substrate in the method for preparing a spliced ​​display panel in an embodiment of the present application.

[0054] Figure 14 for Figure 13 Schematic diagram of forming a second packaging substrate after removing the transfer substrate.

[0055] Figure 15 For Figure 14 Schematic diagram of preparing a first protective layer on a second packaging substrate.

[0056] Figure 16 for Figure 15 Schematic diagram of a second package body formed after the second package substrate is cut. DETAILED DESCRIPTION

[0057] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be implemented in. The directional terms mentioned in this application, such as [up], [down], [front], [back], [left], [right], [inside], [outside], [side], etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present application, rather than to limit the present application. In the figures, units with similar structures are represented by the same reference numerals. In the accompanying drawings, the thickness of some layers and areas is exaggerated for clarity of understanding and ease of description. That is, the size and thickness of each component shown in the drawings are arbitrarily shown, but the present application is not limited to this.

[0058] Please refer to Figures 1 to 2 , Figure 1 A schematic diagram of a top view of the spliced ​​display panel provided in an embodiment of the present application is shown. Figure 2 The present invention provides a schematic cross-sectional view of a spliced ​​display panel provided in an embodiment of the present invention. The spliced ​​display panel 100 includes a backplane 10 and at least one first package 20, at least one second package 30, and at least one third package 40 bonded to the backplane 10. The first package 20, the second package 30, and the third package 40 respectively display blue light, red light, and green light, thereby achieving color display of the spliced ​​display panel 100.

[0059] Reference Figure 1 The backplane 10 exemplarily shows a plurality of first packages 20, a plurality of second packages 30, and a plurality of third packages 40. The plurality of first packages 20, the plurality of second packages 30, and the plurality of third packages 40 are spliced ​​together to form the spliced ​​display panel 100. Each package (including the first package 20, the second package 30, and the third package 40) is a sub-pixel. For example, the first package 20 is a blue sub-pixel B, the second package 30 is a red sub-pixel R, and the third package 40 is a green sub-pixel G.

[0060] Specifically, refer to Figure 2The first package body 20, the second package body 30 and the third package body 40 all include a substrate, a driving circuit and a light-emitting diode chip integrated on and electrically connected to the substrate, and a first packaging layer covering the driving circuit and the light-emitting diode chip. The light-emitting diode chip includes a Micro LED chip, a Mini LED chip, etc. By packaging the light-emitting diode chip and the corresponding driving circuit together as a separate package body, each package body can work as an independent unit, and multiple packages are spliced ​​together to form the spliced ​​display panel 100, which can realize the display of the spliced ​​display panel 100. Of course, multiple packages spliced ​​together can also be used as a backlight. The size of the package body is much larger than the size of the light-emitting diode chip, which can reduce the difficulty of optical binning of the light-emitting diode chip, thereby solving the problem of optical binning difficulty existing in existing Micro LED chips.

[0061] The specific structure of the package will be described in detail below through specific embodiments:

[0062] Continue to refer to Figure 2 The LED chips of the first package 20 and the second package 30 both emit blue light, and the LED chip of the third package 40 emits green light. In order to realize that the second package 30 displays red light, the second package 30 also needs to be provided with a corresponding quantum dot film.

[0063] Specifically, the first package 20 includes a first substrate 21, and a first driving circuit 22 and a first LED chip 23 disposed on the first substrate 21. The first driving circuit 22 and the first LED chip 23 are electrically connected. To protect the first driving circuit 22 and the first LED chip 23, the first package 20 also includes a first sealing layer 24 covering the first driving circuit 22 and the first LED chip 23, and a first encapsulation layer 25 covering the first sealing layer 24. The first LED chip 23 of the first package 20 emits blue light, enabling the first package 20 to display blue light.

[0064] The second package 30 includes a second substrate 31, a second driving circuit 32, and a second LED chip 33 disposed on the second substrate 31. The second driving circuit 32 and the second LED chip 33 are electrically connected. To protect the second driving circuit 32 and the second LED chip 33, the second package 30 further includes a second sealing layer 34 covering the second driving circuit 32 and the second LED chip 33, and a first encapsulation layer 35 covering the second sealing layer 34.

[0065] The second light-emitting diode chip 33 of the second package body 30 emits blue light. In order to make the second package body 30 display red light, the second package body 30 also includes a red quantum dot film layer 36 arranged on the side of the first packaging layer 35 away from the second light-emitting diode chip 33 and a second packaging layer 38 arranged on the side of the red quantum dot film layer 36 away from the first packaging layer 35. The red quantum dot film layer 36 is positioned opposite to the second light-emitting diode chip 33 of the second package body 30.

[0066] Optionally, the edge of the red quantum dot film layer 36 is flush with the edges of the first encapsulation layer 35, the second encapsulation layer 38 and the second substrate 31, so that full film coating can be used when preparing the red quantum dot film layer 36 of the second encapsulation body 30, thereby eliminating the need for lamination and alignment when the red quantum dot film layer 36 and the second light-emitting diode chip 33 are laminated.

[0067] Furthermore, in order to improve the color purity of the red quantum dot film layer 36 of the second package body 30 and enhance the display effect, the second package body 30 also includes a first blue light absorption layer 37 arranged between the red quantum dot film layer 36 and the second packaging layer 38 to absorb the blue light that is not converted by the red quantum dot film layer 36.

[0068] Accordingly, the third package 40 includes a third substrate 41, and a third drive circuit 42 and a third LED chip 43 disposed on the third substrate 41. The third drive circuit 42 and the third LED chip 43 are electrically connected. To protect the third drive circuit 42 and the third LED chip 43, the third package 40 also includes a third sealing layer 44 that covers the third drive circuit 42 and the third LED chip 43, and a first encapsulation layer 45 overlying the third sealing layer 44. The third LED chip 43 of the third package 40 emits green light, allowing the third package 40 to display green light.

[0069] In this embodiment, the light-emitting diode chip and its corresponding driving circuit are packaged into an independent package to reduce the difficulty of optical binning of the light-emitting diode chip. At the same time, when the light-emitting diode chip and its corresponding driving circuit are bonded to the backplane 10 as a whole, backlight or direct display can be achieved. In this way, the originally complex driving backplane design becomes simple because the driving circuit is completely transferred to the package, and when facing the needs of products of different sizes, only simple modifications to the backplane design are required to achieve it, without changing the mask design, thereby greatly reducing costs and greatly improving the backplane yield. In addition, since the second package 30 uses the second light-emitting diode chip 33 that emits blue light in combination with the red quantum dot film layer 36 to display red light, this can avoid the use of a red light-emitting diode chip and improve the light extraction efficiency of red light.

[0070] In one embodiment, see Figures 1 to 3 , Figure 3 This is another schematic cross-sectional view of the spliced ​​display panel provided in an embodiment of the present application. Unlike the above embodiment, in the spliced ​​display panel 101 of this embodiment, the LED chip of the third package 40 emits blue light. To achieve green light, the third package 40 further includes a green quantum dot film layer 46 disposed on the first package layer 45 and a third package layer 48 disposed on the green quantum dot film layer 46. The green quantum dot film layer 46 is positioned opposite the third LED chip 43 of the third package 40.

[0071] Furthermore, in order to improve the color purity of the green quantum dot film layer 46 of the third package body 40 and enhance the display effect, the third package body 40 also includes a second blue light absorption layer 47 arranged between the green quantum dot film layer 46 and the third package layer 48 to absorb the blue light that is not converted by the green quantum dot film layer 46.

[0072] In this embodiment, the LED chips in the first package 20, the second package 30, and the third package 40 all emit blue light. That is, the first package 20, the second package 30, and the third package 40 use LED chips of the same color. This simplifies the design of the driver circuit. Using LED chips of different colors in a package requires different driver circuit designs, which complicates the design of the driver circuit for each package. For further details, please refer to the above embodiment and will not be repeated here.

[0073] In one embodiment, see Figures 1 to 4 , Figure 4This is another cross-sectional structural diagram of a spliced ​​display panel provided in an embodiment of the present application. Unlike the above embodiment, in the spliced ​​display panel 102 of this embodiment, the LED chips in the first package 20, the second package 30, and the third package 40 all emit ultraviolet light, that is, the first LED chip 23, the second LED chip 33, and the third LED chip 43 all emit ultraviolet light. Therefore, in order for the first package 20, the second package 30, and the third package 40 to display blue, red, and green light, respectively, they all require quantum dot film layers of corresponding colors.

[0074] Specifically, the second encapsulation body 30 includes a red quantum dot film layer 36 disposed on the first encapsulation layer 35 and a second encapsulation layer 38 disposed on the red quantum dot film layer 36. The third encapsulation body 40 includes a green quantum dot film layer 46 disposed on the first encapsulation layer 45 and a third encapsulation layer 48 disposed on the green quantum dot film layer 46. The first encapsulation body 20 includes a blue quantum dot film layer 26 disposed on the first encapsulation layer 25 and a fourth encapsulation layer 28 disposed on the blue quantum dot film layer 26.

[0075] Similarly, to enhance the color purity of the quantum dot film layers within each package and improve the display quality, each package also includes a UV absorption layer. Specifically, the UV absorption layer 39 of the second package 30 is disposed between the red quantum dot film layer 36 and the second encapsulation layer 38; the UV absorption layer 49 of the third package 40 is disposed between the green quantum dot film layer 46 and the third encapsulation layer 48; and the UV absorption layer 27 of the first package 20 is disposed between the blue quantum dot film layer 26 and the fourth encapsulation layer 28. For other explanations, please refer to the above embodiment and will not be repeated here.

[0076] In one embodiment, see Figures 1 to 5 , Figure 5 This is a schematic cross-sectional view of the second package provided in an embodiment of the present application. Unlike the above embodiment, the first package 20, the second package 30, and the third package 40 all further include a composite film layer. The composite film layer is located on the side of the first package layer of the first package 20, the second package 30, and the third package 40, respectively, away from the substrate. The composite film layer is the top film layer of the corresponding first package 20, the second package 30, and the third package 40. This embodiment of the present application uses the second package 30 in the spliced ​​display panel 101 as an example to illustrate the structure and function of the composite film layer:

[0077] Reference Figure 5The composite film layer includes a first protective layer 51 and a first planar layer 52. The first planar layer 52 is disposed on a side of the first protective layer 51 away from the second substrate 31. The refractive index of the first protective layer 51 is lower than that of the first planar layer 52. The material of the first protective layer 51 includes gray photoresist, etc. The first protective layer 51 has a first opening 511, which faces the second LED chip 33. The first planar layer 52 is at least partially located within the first opening 511.

[0078] By providing the first protective layer 51 with the first opening 511, the first protective layer 51 can block the wide-angle light output of the second LED chip 33, preventing color bleeding between adjacent packages. Furthermore, the first opening 511 in the first protective layer 51 faces the second LED chip 33, preventing the first protective layer 51 from blocking the light output from the second LED chip 33. Furthermore, the first opening 511 is 1 to 10 microns larger than the second LED chip 33 to ensure that the first protective layer 51 prevents color bleeding between adjacent packages.

[0079] In addition, since the refractive index of the first protective layer 51 is smaller than the refractive index of the first flat layer 52, the wide-angle light emitted from the red quantum dot film layer 36 can move toward the middle after passing through the first protective layer 51 and the first flat layer 52, so as to converge the light output angle, improve the brightness at the positive viewing angle, and thereby increase the light output effect of the second package body 30.

[0080] Optionally, the sidewall 5111 of the first opening 511 is inclined relative to the bottom wall 5112 of the first opening 511, and the slope angle a of the sidewall 5111 of the first opening 511 is in the range of 30° to 45°, so as to better converge the light emission angle of the wide-angle light, thereby further increasing the light emission effect of the second package 30. The sidewall 5111 of the first opening 511 refers to the surface of the first protective layer 51 forming the first opening 511, and the bottom wall 5112 of the first opening 511 refers to the surface of the film layer exposed by the first opening 511, such as Figure 5 As shown, the bottom wall 5112 of the first opening 511 refers to the surface of the second packaging layer 38 exposed by the first opening 511 .

[0081] It should be noted that the composite film structure on the first package body 20 and the composite film structure on the third package body 40 can refer to the description of the composite film structure on the second package body 30, and will not be repeated here. For other descriptions of the spliced ​​display panel 101, please refer to the above embodiment and will not be repeated here.

[0082] In one embodiment, see Figures 1 to 7 , Figure 6 This is another schematic cross-sectional structure diagram of the second package body provided in an embodiment of the present application. Figure 7 for Figure 6 Detailed structural diagram of the second protective layer in FIG. Unlike the above embodiment, the first encapsulation body 20, the second encapsulation body 30, and the third encapsulation body 40 all further include a second protective layer. This embodiment also uses the second encapsulation body 30 in the spliced ​​display panel 101 as an example to illustrate the structure and function of the second protective layer.

[0083] Reference Figure 6 The second protective layer 53 covers the second driving circuit 32 to protect the second driving circuit 32 and reduce the surface reflectivity of the second driving circuit 32. Optionally, the material of the second protective layer 53 includes gray photoresist or the like.

[0084] The second protective layer 53 includes a second opening 531, which is positioned opposite the first opening 511. The second LED chip 33 is accommodated within the second opening 531. The orthographic projection of the second opening 531 on the second substrate 31 falls within the orthographic projection of the first opening 511 on the second substrate 31. This ensures that the dimension W2 of the first opening 511 is larger than the dimension W1 of the second opening 531, thereby preventing the first opening 511 from affecting the light output of the second LED chip 33.

[0085] Furthermore, the second sealing layer 34 covers the second protective layer 53 and the second LED chip 33 and fills the second opening 531. The refractive index of the second protective layer 53 is less than the refractive index of the second sealing layer 34. For example, the refractive index of the second sealing layer 34 is greater than 1.6. In this way, the wide-angle light emitted from the second LED chip 33 can move toward the middle after passing through the second protective layer 53 and the second sealing layer 34, so as to converge the light output angle, improve the brightness at the positive viewing angle, and thereby increase the light output effect of the second package body 30.

[0086] Optionally, the sidewall 5311 of the second opening 531 is inclined relative to the bottom wall 5312 of the second opening 531, and the slope angle b of the sidewall 5311 of the second opening 531 is in the range of 30° to 45°, so as to better converge the light emission angle of the wide-angle light, thereby further increasing the light emission effect of the second package 30. The sidewall 5311 of the second opening 531 refers to the surface of the second protective layer 53 forming the second opening 531, and the bottom wall 5312 of the second opening 531 refers to the surface of the film layer exposed by the second opening 531. Figure 7 As shown, the bottom wall 5312 of the second opening 531 refers to the surface of the second substrate 31 exposed by the second opening 531 .

[0087] Similarly, the second protective layer structure on the first package body 20 and the second protective layer structure on the third package body 40 can refer to the description of the second protective layer 53 structure on the second package body 30, and will not be repeated here. For other descriptions of the spliced ​​display panel 101, please refer to the above embodiment and will not be repeated here.

[0088] In one embodiment, see Figures 1 to 8 , Figure 8 This is another schematic diagram of the cross-sectional structure of the second package body provided in an embodiment of the present application. Different from the above embodiment, the first package body 20, the second package body 30 and the third package body 40 also include a lens and a second flat layer. The second flat layer is located on the side of the first package layer of the first package body 20, the second package body 30 and the third package body 40 away from the substrate, and the second flat layer is the top film layer of the corresponding first package body, the second package body and the third package body. The lens is located on the side of the second flat layer facing the first package layer, the second flat layer covers the lens, and the lens is opposite to the position of the light-emitting diode chip. This embodiment also takes the second package body 30 in the spliced ​​display panel 101 as an example to illustrate the structure and function of the lens and the second flat layer:

[0089] Reference Figure 8 The lens 61 is arranged on the second packaging layer 38 of the second packaging body 30. The lens 61 is opposite to the second light-emitting diode chip 33, and the size of the lens 61 is 1 micron to 10 microns larger than the size of the second light-emitting diode chip 33, so that the output light of the light-emitting diode chip can reach the lens 61.

[0090] The lens 61 has an arc surface, the center of which is located on the side of the second flat layer 62 facing the second substrate 31. In this way, along the emitting direction of the light, the lens 61 is a convex lens 61, so that the wide-angle light emitted from the red quantum dot film layer 36 can move toward the middle after passing through the lens 61, so as to converge the light output angle, improve the brightness at the positive viewing angle, and thereby increase the light output effect of the second package body 30.

[0091] Furthermore, the second flat layer 62 covers the lens 61 and the second encapsulation layer 38 of the second encapsulation body 30. The refractive index of the second flat layer 62 is lower than that of the lens 61. For example, the refractive index of the second flat layer 62 is less than 1.5. Optionally, the material of the second flat layer 62 includes gray photoresist, etc.

[0092] Similarly, the structure and function of the lens and the second flat layer on the first package body 20, as well as the structure and function of the lens and the second flat layer on the third package body 40, can be referred to the description of the structure and function of the lens 61 and the second flat layer 62 on the second package body 30, and will not be repeated here. For other descriptions of the spliced ​​display panel 101, please refer to the above embodiment, and will not be repeated here.

[0093] In another embodiment, the lens 61 of the second package body 30 can also cooperate with the second protective layer 53 of the second package body 30 to further enhance the light extraction effect of the second package body 30. Figures 1 to 9 , Figure 9 This is another cross-sectional structural diagram of the second package provided in an embodiment of the present application. The lens 61 is positioned opposite the second opening 531 of the second protective layer 53, and the size W3 of the lens 61 is larger than the size W1 of the second opening 531, so that most of the light emitted by the second LED chip 33 can pass through the lens 61.

[0094] In one embodiment, the present application also provides a method for preparing a spliced ​​display panel, see FIG. Figures 1 to 16 , Figure 10 A schematic diagram of a process for preparing a spliced ​​display panel according to an embodiment of the present application is provided. Figure 11 Schematic diagram of the top view of the light-emitting substrate prepared in the method for preparing a spliced ​​display panel in an embodiment of the present application. Figure 12 Schematic diagram of the film structure of the second sub-substrate prepared in the method for preparing a spliced ​​display panel in an embodiment of the present application, Figure 13 Schematic diagram of laminating the second sub-substrate to the light-emitting substrate in the method for preparing a spliced ​​display panel in an embodiment of the present application. Figure 14 for Figure 13 Schematic diagram of forming a second packaging substrate after removing the transfer substrate, Figure 15 For Figure 14 A schematic diagram of preparing a first protective layer on a second packaging substrate, Figure 16 for Figure 15 Schematic diagram of a second package body formed after the second package substrate is cut. The method for preparing a spliced ​​display panel includes the following steps:

[0095] S301: preparing a driving circuit 2 on a substrate 1, and preparing a light-emitting diode chip 3 on the substrate 1, and electrically connecting the light-emitting diode chip 3 to the corresponding driving circuit 2 to form a light-emitting substrate 200;

[0096] Specifically, refer to Figure 11 , driver circuits 2 are prepared on a substrate 1. The driver circuits 2 are arranged in an array on the substrate 1, with spaces between adjacent driver circuits 2, so that each driver circuit 2 is an independent driver unit. The light-emitting diode chips 3 are also disposed on the substrate 1 and are electrically connected to corresponding driver circuits 2. Each light-emitting diode chip 3 corresponds to a driver unit, that is, each light-emitting diode chip 3 corresponds to a separate driver circuit 2, so that the driver circuit 2 can drive the corresponding light-emitting diode chip 3 to emit light independently.

[0097] S302: preparing a first sub-substrate, a second sub-substrate, and a third sub-substrate respectively, wherein the first sub-substrate, the second sub-substrate, and the third sub-substrate each include a sacrificial layer formed on a transfer substrate and a first encapsulation layer formed on a side of the sacrificial layer away from the transfer substrate, wherein the second sub-substrate further includes a second encapsulation layer and a red quantum dot film layer formed between the sacrificial layer and the first encapsulation layer, and the red quantum dot film layer is located on a side of the second encapsulation layer away from the sacrificial layer;

[0098] Specifically, this embodiment takes the preparation of the second sub-substrate as an example. Figure 12 The method for preparing the second sub-substrate comprises the following steps:

[0099] Coating a thermal debonding material or a UV debonding material on the transfer substrate 70 and curing the material to form a sacrificial layer 71;

[0100] A transparent protective material is coated on the entire surface of the sacrificial layer 71 to form a second encapsulation layer 38;

[0101] The red quantum dot material is coated on the entire surface of the second encapsulation layer 38 to form a whole layer of red quantum dot film layer 36;

[0102] A transparent protective material is coated on the entire surface of the red quantum dot film layer 36 to form a first encapsulation layer 35 .

[0103] It should be noted that the preparation methods for the first and third sub-substrates can refer to the preparation method for the second sub-substrate 300. The difference is that when the first and third sub-substrates do not require a quantum dot film layer, the first encapsulation layer can be directly prepared on the sacrificial layer. Furthermore, the order in which the first, second, and third sub-substrates are prepared is not limited.

[0104] In addition, in order to improve the light purity of the red quantum dot film layer 36 on the second sub-substrate 300 , a first blue light absorption layer 37 may also be prepared on the second sub-substrate 300 , and the first blue light absorption layer 37 is located between the second encapsulation layer 38 and the red quantum dot film layer 36 .

[0105] S303: laminating the first sub-substrate, the second sub-substrate, and the third sub-substrate on the corresponding light-emitting substrate respectively, and removing the transfer substrate to form a first packaging substrate, a second packaging substrate, and a third packaging substrate;

[0106] Specifically, refer to Figure 13 and Figure 14 Similarly, this embodiment takes the second sub-substrate and the light-emitting substrate as an example to form a second package substrate. A sealing layer 4 is applied on the light-emitting substrate 200, and the sealing layer 4 covers the driving circuit 2 and the light-emitting diode chip 3. The first packaging layer 35 on the second package substrate 400 faces the sealing layer 4, and the second package substrate 400 is bonded to the light-emitting substrate 200. Figure 13 Since all film layers on the second packaging substrate 400 are fully coated, the second packaging substrate 400 is formed with a full-surface film layer. Therefore, when the second packaging substrate 400 is attached to the light-emitting substrate 200, no alignment is required.

[0107] Furthermore, after the second packaging substrate 400 is attached to the light emitting substrate 200, UV light or heat treatment is used to reduce the viscosity of the sacrificial layer 71 according to the characteristics of the material used for the sacrificial layer 71, so as to peel off the transfer substrate 70, thereby forming a second packaging substrate 400 with a thinner thickness. Figure 14 shown.

[0108] Furthermore, with reference to Figure 5 and Figure 15 In order to limit the light emission range of the LED chip 3, a first protective layer 51 can be prepared on the second packaging substrate 400. The first protective layer 51 is coated on the side of the second packaging layer 38 away from the red quantum dot film layer 36. The first protective layer 51 is provided with first openings 511 at positions corresponding to the LED chips 3, and each first opening 511 corresponds to one LED chip 3. It should be noted that Figure 15 The arrangement of the first openings 511 on the first protective layer 51 and the corresponding relationship between the first openings 511 and the light-emitting diode chips 3 are merely shown. Each light-emitting diode chip 3 is a sub-pixel. Figure 15Only the red sub-pixel R is used to illustrate the corresponding relationship between the LED chip 3 and the first opening 511 .

[0109] Furthermore, in order to improve the brightness of the light emitted from each light-emitting diode chip 3 on the second packaging substrate 400 at a front viewing angle, a first flat layer 52 may be coated on the first protective layer 51. The first flat layer 52 covers the first protective layer 51 and fills the first opening 511. Figure 5 The refractive index of the first flat layer 52 is greater than that of the first protective layer 51, so that the wide-angle light of the LED chip 3 converges to the middle, narrowing the angle of the wide-angle light and thereby improving the brightness of the light at a normal viewing angle.

[0110] S304: cutting the first packaging substrate, the second packaging substrate 400 and the third packaging substrate respectively to form a first packaging body 20, a second packaging body 30 and a third packaging body 40;

[0111] Specifically, this embodiment also takes cutting the second packaging substrate 400 to form the second packaging body 30 as an example for explanation, and with reference to FIG. Figure 15 and Figure 16 , the second packaging substrate 400 is cut to form Figure 16 The single second package body 30 shown in FIG. 3 shows red light. In order to clearly illustrate the structure of the first protective layer 51 on each second package body 30, Figure 16 The first planar layer 52 on the first protection layer 51 is not shown.

[0112] It should be noted that Figure 15 The cross-sectional structure of a single second package body 30 is shown as Figure 5 As shown, in Figure 5 In order to distinguish the film structure of the second package body 30 from the first package body 20 and the third package body 40, the names of the film layers are distinguished, such as Figure 5 The second base 31 of the second package body 30 corresponds to Figure 14 The base 1 in the second packaging substrate 400, Figure 5 The second driving circuit 32 of the second package 30 corresponds to Figure 14 The driving circuit 2 in the second packaging substrate 400, Figure 5 The second light emitting diode chip 33 of the second package body 30 corresponds to Figure 14 The light emitting diode chip 3 in the second packaging substrate 400, Figure 5 The second sealing layer 34 of the second package body 30 corresponds to Figure 14 The sealing layer 4 in the second packaging substrate 400.

[0113] In addition, the formation methods of the first package body 20 and the third package body 40 can refer to the formation method of the second package body 30, which will not be repeated here. The first package body 20 displays blue light, and the third package body 40 displays green light.

[0114] S305 : Bonding at least one of the first packaging bodies 20 , at least one of the second packaging bodies 30 , and at least one of the third packaging bodies 40 to the backplane 10 to form a spliced ​​display panel 100 .

[0115] Specifically, at least one first package body 20, at least one second package body 30, and at least one third package body 40 are bonded to the backplane 10 using a bonding technology, so that the first package body 20, the second package body 30, and the third package body 40 are arranged in an array and spliced ​​together to form a Figure 1 The spliced ​​display panel 100 is shown.

[0116] Based on the same inventive concept, an embodiment of the present application further provides a display terminal, comprising a main body and a spliced ​​display panel according to one of the aforementioned embodiments, wherein the spliced ​​display panel is fixed to the main body. The display terminal includes electronic devices such as mobile phones, tablets, and televisions.

[0117] According to the above embodiments, it can be seen that:

[0118] The present application provides a spliced ​​display panel and a display terminal, wherein the spliced ​​display panel includes a backplane and at least one first package, at least one second package, and at least one third package bonded to the backplane, wherein the first package, the second package, and the third package respectively display blue light, red light, and green light; the first package, the second package, and the third package each include a substrate, a driving circuit and a light-emitting diode chip integrated on and electrically connected to the substrate, and a first packaging layer covering the driving circuit and the light-emitting diode chip. The present application arranges the light-emitting diode chip and its corresponding driving circuit into a separate package, the size of which is much larger than that of a single light-emitting diode chip. This reduces the difficulty of optical binning of the light-emitting diode chip, thereby solving the optical binning difficulty problem of existing Micro LED chips.

[0119] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0120] The above is a detailed introduction to the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A spliced ​​display panel, characterized in that: The invention comprises a backplane and at least one first package, at least one second package and at least one third package bonded to the backplane, wherein the first package, the second package and the third package respectively display blue light, red light and green light; The first package body, the second package body and the third package body each include: substrate; A driving circuit and a light-emitting diode chip; the driving circuit and the light-emitting diode chip are integrated on the substrate and electrically connected; and a first packaging layer, covering the driving circuit and the light-emitting diode chip; In which, the second package body also includes a red quantum dot film layer arranged on the side of the first package layer away from the light-emitting diode chip of the second package body, and a second package layer arranged on the side of the red quantum dot film layer away from the first package layer, and the red quantum dot film layer is positioned opposite to the light-emitting diode chip of the second package body.

2. The spliced ​​display panel according to claim 1, wherein: The light-emitting diode chip of the second package body emits blue light, and the second package body further includes a first blue light absorption layer arranged between the red quantum dot film layer and the second package layer.

3. The spliced ​​display panel according to claim 2, wherein: The light emitting diode of the third package body emits green light.

4. The spliced ​​display panel according to claim 2, wherein: The light emitting diode chip of the third package body emits blue light; The third package further includes: A green quantum dot film layer is provided on a side of the first packaging layer away from the light-emitting diode chip of the third packaging body; and a third encapsulation layer, disposed on a side of the green quantum dot film layer away from the first encapsulation layer; The green quantum dot film layer is located opposite to the light emitting diode chip of the third package.

5. The spliced ​​display panel according to claim 4, wherein: The third package further includes: The second blue light absorbing layer is arranged between the green quantum dot film layer and the third encapsulation layer.

6. The spliced ​​display panel according to claim 1, wherein: The light emitting diode chip emits ultraviolet light; The second encapsulation body includes: a red quantum dot film layer provided on the first encapsulation layer; and a second encapsulation layer provided on the red quantum dot film layer; The third encapsulation body includes: a green quantum dot film layer provided on the first encapsulation layer; and a third encapsulation layer provided on the green quantum dot film layer; The first encapsulation body includes: a blue quantum dot film layer disposed on the first encapsulation layer; and a fourth encapsulation layer disposed on the blue quantum dot film layer.

7. The spliced ​​display panel according to claim 6, wherein: The first package body, the second package body and the third package body further include an ultraviolet light absorbing layer respectively; Among them, the ultraviolet light absorption layer of the second package body is arranged between the red quantum dot film layer and the second packaging layer; the ultraviolet light absorption layer of the third package body is arranged between the green quantum dot film layer and the third packaging layer; the ultraviolet light absorption layer of the first package body is arranged between the blue quantum dot film layer and the fourth packaging layer.

8. The spliced ​​display panel according to any one of claims 1 to 7, wherein: The first package body, the second package body, and the third package body each further include a composite film layer, the composite film layer being located on a side of the first package layer of the first package body, the second package body, and the third package body away from the substrate, and the composite film layer being the top film layer of the corresponding first package body, the second package body, and the third package body; The composite film layer includes a first protective layer and a first flat layer. The refractive index of the first protective layer is lower than that of the first flat layer. The first flat layer is arranged on a side of the first protective layer away from the substrate.

9. The spliced ​​display panel according to claim 8, wherein: The first protection layer has a first opening, the first opening faces the light-emitting diode chip, and the first flat layer is at least partially located in the first opening; The side wall of the first opening is inclined relative to the bottom wall of the first opening, and the slope angle of the side wall of the first opening ranges from 30° to 45°.

10. The spliced ​​display panel according to claim 9, wherein: The first package body, the second package body and the third package body also include a second protective layer. The second protective layer includes a second opening. The second opening is opposite to the first opening. The second protective layer covers the driving circuit. The light-emitting diode chip is accommodated in the second opening.

11. The spliced ​​display panel according to claim 10, wherein: An orthographic projection of the second opening on the substrate falls within an orthographic projection of the first opening on the substrate.

12. The spliced ​​display panel according to claim 10, wherein: The side wall of the second opening is inclined relative to the bottom wall of the second opening, and the slope angle of the side wall of the second opening ranges from 30° to 45°.

13. The spliced ​​display panel according to any one of claims 1 to 7, characterized in that: The first package body, the second package body and the third package body also include: a second flat layer located on a side of the first package layer of the first package body, the second package body, and the third package body away from the substrate, and the second flat layer is the top film layer of the corresponding first package body, the second package body, and the third package body; and A lens is located on a side of the second flat layer facing the first encapsulation layer, and the lens is opposite to the light-emitting diode chip; The lens has an arc surface, and the center of the arc surface is located on the side of the second flat layer facing the substrate; The refractive index of the second flat layer is lower than the refractive index of the lens.

14. The spliced ​​display panel according to claim 1, wherein: The edge of the red quantum dot film layer is flush with the edges of the first encapsulation layer, the second encapsulation layer and the substrate.

15. A display terminal, characterized in that: The device comprises a body and a spliced ​​display panel according to any one of claims 1 to 14, wherein the spliced ​​display panel is fixed on the body.

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