Printed Circuit Board Chip Mounting Monitoring Method, Device, Computer Equipment and Storage Medium

Abstract

The present application provides a method, apparatus, computer device, and storage medium for monitoring the soldering of a printed circuit board. The method includes obtaining a test status value of the printed circuit board, where the printed circuit board is a circuit board soldered with a communication connector; performing a paste test process on the test status value and a preset status value to obtain a paste test difference component; and sending a board connection prohibition signal to the patch monitoring system according to the paste test difference component to adjust the opening and closing of the test passage of the printed circuit board. By collecting the current test results of the printed circuit board and comparing them with the preset status value to determine the difference in the current test status of the printed circuit board, and finally adjusting the test pass status of the printed circuit board according to the difference in the paste test difference component, it is convenient to determine whether the problem of the printed circuit board occurs on the communication connector, thereby facilitating the rapid determination of the problem point of the printed circuit board and effectively improving the production efficiency of the printed circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit boards, and in particular to a method, device, computer device, and storage medium for monitoring the soldering of components on a printed circuit board. Background Art

[0002] There are a large number of products with a common USB connector on the market today. These products need to be tested before leaving the factory when manufactured in an SMT factory. Since the USB connector cannot be attached to the PCBA together with other components on the SMT mounter, after the SMT soldering of the PCBA is completed, the USB connector still needs to be additionally processed onto the PCBA board before it becomes a finished product.

[0003] However, after soldering the USB connector, if there is a problem with the USB connector, for example, a short circuit in the soldering of the USB connector, it is impossible to accurately locate whether the problem lies in the PCBA semi-finished product or the USB connector, which easily leads to frequent rework and manual inspection of the printed circuit board, resulting in too low production efficiency of the printed circuit board. Summary of the Invention

[0004] An object of the present invention is to overcome the deficiencies in the prior art and provide a method, device, computer device, and storage medium for monitoring the soldering of components on a printed circuit board that can effectively improve production efficiency.

[0005] The object of the present invention is achieved by the following technical solutions:

[0006] A method for monitoring the soldering of components on a printed circuit board, the method comprising:

[0007] Obtaining a test status value of the printed circuit board, where the printed circuit board is a circuit board soldered with a communication connector;

[0008] Performing a paste test process on the test status value and a preset status value to obtain a paste test difference component;

[0009] Sending a board connection prohibition signal to the paste monitoring system according to the paste test difference component to adjust the opening and closing of the test passage for the printed circuit board.

[0010] In one embodiment, the test status value includes at least one of a burn-in test status value, a short / open circuit test status value, an identity recognition test status value, a transmission mode test status value, and an audio path test status value of the printed circuit board.

[0011] In one embodiment, before obtaining the test status value of the printed circuit board, it further includes: obtaining a semi-finished test status value of the semi-finished paste board; updating and replacing the semi-finished test status value with the preset status value.

[0012] In one embodiment, the process of comparing the test status value with the preset status value includes: calculating the difference between the test status value and the semi-finished test status value.

[0013] In one embodiment, the process of sending a board connection prohibition signal to the patch monitoring system according to the comparison difference component to adjust the opening and closing of the test passage for the printed circuit board includes: detecting whether the comparison difference component matches the preset measurement component; when the comparison difference component matches the preset measurement component, sending a board connection passage signal to the patch monitoring system to open the test passage for the printed circuit board.

[0014] In one embodiment, the process of when the comparison difference component matches the preset measurement component, sending a board connection passage signal to the patch monitoring system to open the test passage for the printed circuit board includes: when the comparison difference component is equal to 0, sending a board connection passage signal to the patch monitoring system to turn on the passage light of the printed circuit board patch monitoring device.

[0015] In one embodiment, after detecting whether the comparison difference component matches the preset measurement component, it further includes: when the comparison difference component does not match the preset measurement component, sending a board connection prohibition signal to the patch monitoring system to close the test passage for the printed circuit board.

[0016] A printed circuit board patch monitoring device, the device includes: a patch test component, patch test needles, and a patch test transmission line; the patch test component includes a patch tester and a passage light, the monitoring end of the patch tester is electrically connected to the passage light, and the patch tester is used for test sampling of the printed circuit board; the patch test needles are connected to the sampling end of the patch tester, and the patch test needles are used for pressing against the test end of the printed circuit board to collect the test status value of the printed circuit board; the output end of the patch tester is connected to the patch test transmission line, and the patch test transmission line is used for connecting to the input end of the patch monitoring system.

[0017] A computer device, including a memory and a processor, the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0018] Obtain the test status value of the printed circuit board, where the printed circuit board is a board welded with a communication connector;

[0019] Perform a comparison process on the test status value and the preset status value to obtain a comparison difference component;

[0020] Send a board connection prohibition signal to the patch monitoring system according to the patch measurement difference component to adjust the opening and closing of the test passage for the printed circuit board.

[0021] A computer-readable storage medium stores a computer program thereon, and when the computer program is executed by a processor, the following steps are implemented:

[0022] Obtain the test status value of the printed circuit board, where the printed circuit board is a circuit board welded with a communication connector;

[0023] Perform patch measurement processing on the test status value and a preset status value to obtain a patch measurement difference component;

[0024] Send a board connection prohibition signal to the patch monitoring system according to the patch measurement difference component to adjust the opening and closing of the test passage for the printed circuit board.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] By collecting the current test results of the printed circuit board and comparing them with the preset status value, that is, comparing them with the standard test results, to determine the difference in the current test status of the printed circuit board. Finally, according to the difference situation of the patch measurement difference component, adjust the test pass status of the printed circuit board, which is convenient to determine whether the problem of the printed circuit board occurs on the communication connector, so as to quickly determine the problem point of the printed circuit board, without rework and manual testing again, effectively improving the production efficiency of the printed circuit board. Brief Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained according to these drawings without creative efforts.

[0028] Figure 1 It is a flowchart of a printed circuit board patch monitoring method in an embodiment;

[0029] Figure 2 It is a schematic diagram of a printed circuit board patch monitoring device in an embodiment;

[0030] Figure 3 It is an internal structure diagram of a computer device in an embodiment. Detailed Embodiments

[0031] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be a middle element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only embodiments.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0034] The present invention relates to a method for monitoring the soldering of a printed circuit board. In one embodiment, the method for monitoring the soldering of a printed circuit board includes obtaining a test status value of the printed circuit board, wherein the printed circuit board is a circuit board welded with a communication connector; performing a comparison process on the test status value and a preset status value to obtain a comparison difference component; and sending a board connection prohibition signal to the soldering monitoring system according to the comparison difference component to adjust the opening and closing of the test passage of the printed circuit board. By collecting the current test results of the printed circuit board and comparing them with the preset status value, that is, comparing them with the standard test results, to determine the difference in the current test status of the printed circuit board, and finally adjusting the test pass status of the printed circuit board according to the difference in the comparison difference component, it is convenient to determine whether there is a problem with the communication connector on the printed circuit board, so as to quickly determine the problem point of the printed circuit board, without rework and manual testing again, effectively improving the production efficiency of the printed circuit board.

[0035] Please refer to Figure 1 , which is a schematic structural diagram of the method for monitoring the soldering of a printed circuit board according to an embodiment of the present invention. The method for monitoring the soldering of a printed circuit board includes some or all of the following steps.

[0036] S100: Obtain a test status value of the printed circuit board, wherein the printed circuit board is a circuit board welded with a communication connector.

[0037] In this embodiment, the test status value is the current test results of the printed circuit board, that is, the test status value is the test values of several functional tests of the printed circuit board, that is, the test status value is the test results of a specific state of the printed circuit board. Specifically, the test status value is the functional test result of the circuit board with a communication connector soldered on it, and the functional test therein is a specified functional test, which is convenient to be the same as the functional test of the circuit board without a communication connector soldered on it, so as to facilitate subsequent test comparison, and further facilitate subsequent determination of whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication.

[0038] S200: Perform a sticker test process on the test status value and the preset status value to obtain a sticker test difference component.

[0039] In this embodiment, the test status value is the current test results of the printed circuit board, that is, the test status value is the test values of several functional tests of the printed circuit board, that is, the test status value is the test results of a specific state of the printed circuit board. Specifically, the test status value is the functional test result of the circuit board with a communication connector soldered on it, and the functional test therein is a specified functional test, which is convenient to be the same as the functional test of the circuit board without a communication connector soldered on it, so as to facilitate subsequent test comparison, and further facilitate subsequent determination of whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication. The preset status value is the standard test results of the printed circuit board, that is, the preset status value is the standard test values of several functional tests of the printed circuit board, that is, the preset status value is the reference test results of a specific state of the printed circuit board. Performing a sticker test process on the test status value and the preset status value is a comparison of the functional test results before and after the surface mounting of the printed circuit board, which is convenient to determine the difference degree of the functional test of the printed circuit board before and after soldering the communication connector, so as to facilitate determination of the problem location when the printed circuit board fails the test, that is, to facilitate determination of whether the unqualified reason of the printed circuit board is on the communication connector or on the semi-finished surface-mounted board.

[0040] S300: Send a board connection prohibition signal to the surface mounting monitoring system according to the sticker test difference component to adjust the opening and closing of the test passage of the printed circuit board.

[0041] In this embodiment, the paste measurement difference component is the difference between the test status value and the preset status value. The test status value is the current test results of the printed circuit board, that is, the test status value is the test values of several function tests of the printed circuit board, that is, the test status value is the test results of a specific status of the printed circuit board. Specifically, the test status value is the function test results of the circuit board soldered with a communication connector, and the function test is a specified function test, which is convenient to keep the same as the function test of the circuit board without soldered communication connector, so as to facilitate subsequent test comparison, and further facilitate subsequent determination of whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication. The preset status value is the standard test results of the printed circuit board, that is, the preset status value is the standard test values of several function tests of the printed circuit board, that is, the preset status value is the reference test results of a specific status of the printed circuit board. The paste measurement process for the test status value and the preset status value is a comparison of the function test results before and after the chip mounting of the printed circuit board, which is convenient to determine the difference degree of the function test before and after soldering the communication connector of the printed circuit board, so as to facilitate the determination of the problem location when the printed circuit board fails the test, that is, to facilitate the determination of whether the reason for the unqualified of the printed circuit board is on the communication connector or on the semi-finished chip mounting board. After determining the paste measurement difference component, it is possible to determine whether there is a problem with the printed circuit board on the communication connector, which is convenient to send a corresponding test pass instruction to the chip mounting monitoring system, that is, the board connection prohibition signal, so as to facilitate the determination of whether the problem location of the printed circuit board is the semi-finished chip mounting board or the communication connector, and further facilitate the pass control of the qualification of the printed circuit board, so that the qualified printed circuit board is released after the test, and the problem location of the unqualified printed circuit board can be quickly determined.

[0042] In the above embodiment, by collecting the current test results of the printed circuit board and comparing them with the preset status value, that is, comparing them with the standard test results, to determine the difference in the current test status of the printed circuit board. Finally, according to the difference situation of the paste measurement difference component, the test pass status of the printed circuit board is adjusted, which is convenient to determine whether there is a problem with the printed circuit board on the communication connector, so as to quickly determine the problem location of the printed circuit board, without rework and manual testing again, effectively improving the production efficiency of the printed circuit board.

[0043] In one of the embodiments, the test status value includes at least one of the programming test status value, short / open circuit test status value, identity recognition test status value, transmission mode test status value, and audio path test status value of the printed circuit board. In this embodiment, the test status value is the current test results of each item of the printed circuit board, that is, the test status value is the test values of several function tests of the printed circuit board, that is, the test status value is the test results of the specific status of the printed circuit board. Specifically, the test status value is the function test result of the circuit board soldered with a communication connector, and the function test therein is a specified function test, which is convenient to be the same as the function test of the circuit board without soldered communication connector, so as to facilitate subsequent test comparison, and further facilitate subsequent determination of whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication. Among them, the test items corresponding to the test status value include programming test, short circuit test, open circuit test, identity recognition test, transmission mode test, and audio path test. The above test items are tests that can be carried out when soldering the communication connector. After testing the above same test items, and then comparing the same test results before and after soldering the communication connector, it is convenient to determine the problem when the test of the printed circuit board is unqualified.

[0044] In one embodiment, before obtaining the test status value of the printed circuit board, the method further includes: obtaining the semi-finished test status value of the semi-finished patch board; updating and replacing the semi-finished test status value with the preset status value. In this embodiment, the semi-finished patch board is the circuit board of the printed circuit board without the communication joint welded, that is, the semi-finished patch board is a semi-finished board without a communication joint. The semi-finished test status value corresponds to the test status value of the printed circuit board, that is, the test performed on the semi-finished patch board corresponds to the test of the printed circuit board. Specifically, the test items of the semi-finished patch board are the same as those of the printed circuit board. The semi-finished test status value is the current test results of each item of the semi-finished patch board, that is, the semi-finished test status value is the test value of some function tests of the semi-finished patch board, that is, the semi-finished test status value is the test result of the specific state of the semi-finished patch board. Specifically, the semi-finished test status value is the function test result of the circuit board without the communication joint welded, and the function test therein is a specified function test, which is convenient to be the same as the function test of the printed circuit board with the communication joint welded later, so as to facilitate the subsequent test comparison, and further facilitate the subsequent determination of whether the problem of the printed circuit board occurs on the communication joint or on the semi-finished patch board. In this way, updating and replacing the semi-finished test status value with the preset status value makes the test result of the printed circuit board compared with the test result of the semi-finished patch board, so that the test of the printed circuit board and the semi-finished patch board is the test before and after welding the communication joint, which is convenient to distinguish and determine the situation where the semi-finished patch board and the communication joint have problems, and thus convenient for the targeted maintenance of the printed circuit board. That is, when the communication joint has problems, a new communication joint is replaced, and when the semi-finished patch board has problems, a new semi-finished patch board is replaced, so as to improve the production efficiency of the printed circuit board.

[0045] Further, the process of comparing the test status value with the preset status value includes: obtaining the difference between the test status value and the semi-finished test status value. In this embodiment, the test status value is the current test results of each item of the printed circuit board, that is, the test status value is the test value of several function tests of the printed circuit board, that is, the test status value is the test result of the specific status of the printed circuit board. Specifically, the test status value is the function test result of the circuit board welded with the communication connector, and the function test is a specified function test. The semi-finished test status value corresponds to the test status value of the printed circuit board, that is, the test performed on the semi-finished patch board corresponds to the test of the printed circuit board. Specifically, the test items of the semi-finished patch board are the same as those of the printed circuit board. The semi-finished test status value is the current test results of each item of the semi-finished patch board, that is, the semi-finished test status value is the test value of several function tests of the semi-finished patch board, that is, the semi-finished test status value is the test result of the specific status of the semi-finished patch board. Specifically, the semi-finished test status value is the function test result of the circuit board without the welded communication connector. In this way, comparing the test status value with the semi-finished test status value is to compare the test status of the semi-finished patch board with that of the printed circuit board, and also to compare the printed circuit board before and after welding the communication connector, which is convenient for determining the degree of difference in the function test results of the printed circuit board before and after welding the communication connector, so as to facilitate determining whether the problem of the printed circuit board occurs in the semi-finished patch board or the communication connector.

[0046] In one of the embodiments, sending a board connection prohibition signal to the patch monitoring system according to the patch measurement difference component to adjust the opening and closing of the test passage for the printed circuit board includes: detecting whether the patch measurement difference component matches a preset measurement component; when the patch measurement difference component matches the preset measurement component, sending a board connection passing signal to the patch monitoring system to open the test passage for the printed circuit board. In this embodiment, the patch measurement difference component is the difference between the test state value and the preset state value. The test state value is the current test results of each item of the printed circuit board, that is, the test state value is the test values of some function tests of the printed circuit board, that is, the test state value is the test results of a specific state of the printed circuit board. Specifically, the test state value is the function test results of the circuit board welded with a communication connector, and the function test therein is a specified function test, which is convenient to be the same as the function test of the circuit board without welding a communication connector, so as to facilitate subsequent test comparison, and further facilitate determining whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before welding the communication. The preset state value is the standard test results of each item of the printed circuit board, that is, the preset state value is the standard test values of some function tests of the printed circuit board, that is, the preset state value is the reference test results of a specific state of the printed circuit board. Performing patch measurement processing on the test state value and the preset state value is to compare the function test results before and after patching of the printed circuit board, which is convenient to determine the difference degree of the function test of the printed circuit board before and after welding the communication connector, so as to facilitate determining the problem location when the printed circuit board fails the test, that is, to facilitate determining whether the unqualified reason of the printed circuit board is on the communication connector or on the semi-finished patching board. The preset measurement component is a standard patch measurement difference component, and the preset measurement component is used to determine the size of the patch measurement difference component. The matching of the patch measurement difference component and the preset measurement component indicates that the test results of the printed circuit board before and after welding the communication connector are the same and both are qualified, that is, it indicates that the semi-finished patching board and the communication connector of the printed circuit board are both qualified, that is, it indicates that the printed circuit board is a qualified product. At this time, a board connection passing signal is sent to the patch monitoring system to send the qualified situation of the printed circuit board to the patch monitoring system in real time, so as to facilitate timely opening the test passage of the printed circuit board, thereby facilitating the qualified ex-factory of the printed circuit board.

[0047] Further, when the paste measurement difference component matches the preset measurement component, sending a board connection pass signal to the patch monitoring system to open the test pass channel of the printed circuit board, includes: when the paste measurement difference component is equal to 0, sending a board connection pass signal to the patch monitoring system to turn on the pass light of the printed circuit board patch monitoring device. In this embodiment, the paste measurement difference component is the difference between the test state value and the preset state value. The test state value is the current various test results of the printed circuit board, that is, the test state value is the test values of some function tests of the printed circuit board, that is, the test state value is the test result of a specific state of the printed circuit board. Specifically, the test state value is the function test result of the circuit board with a communication connector soldered on it. The function test is a specified function test, which is convenient to keep the same as the function test of the circuit board without a communication connector soldered on it, so as to facilitate subsequent test comparison, and further facilitate determining whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication connector. The preset state value is the standard test results of various tests of the printed circuit board, that is, the preset state value is the standard test values of some function tests of the printed circuit board, that is, the preset state value is the reference test result of a specific state of the printed circuit board. Performing a paste measurement process on the test state value and the preset state value is to compare the function test results before and after patching the printed circuit board, which is convenient to determine the difference degree of the function test before and after soldering the communication connector on the printed circuit board, so as to facilitate determining the problem location when the printed circuit board fails the test, that is, to facilitate determining whether the unqualified reason of the printed circuit board is on the communication connector or on the semi-finished patching board. The preset measurement component is 0, and the paste measurement difference component is equal to 0, indicating that the test results of the printed circuit board before and after soldering the communication connector are consistent, that is, indicating that the semi-finished patching board and the communication connector of the printed circuit board are qualified and well-matched. At this time, a pass instruction is sent to the patch monitoring system. Specifically, the pass light of the printed circuit board patch monitoring device is turned on. For example, at this time, the pass light shows green.

[0048] Furthermore, after detecting whether the measured difference component of the patch is matched with the preset measured component, the method further includes: when the measured difference component of the patch is not matched with the preset measured component, sending a board connection prohibition signal to the patch monitoring system to close the test passage of the printed circuit board. In this embodiment, the measured difference component of the patch is the difference between the test status value and the preset status value. The test status value is the current test results of the printed circuit board, that is, the test status value is the test values of some function tests of the printed circuit board, that is, the test status value is the test results of a specific state of the printed circuit board. Specifically, the test status value is the test results of the function test of the circuit board with a communication connector soldered thereon. The function test is a specified function test, which is convenient to be the same as the function test of the circuit board without a communication connector soldered thereon, so as to facilitate subsequent test comparison, and further facilitate subsequent determination of whether the problem of the printed circuit board occurs on the communication connector or on the circuit board before soldering the communication connector. The preset status value is the standard test results of the printed circuit board, that is, the preset status value is the standard test values of some function tests of the printed circuit board, that is, the preset status value is the reference test results of a specific state of the printed circuit board. Performing the patch measurement process on the test status value and the preset status value is to compare the function test results of the printed circuit board before and after patching, which is convenient to determine the difference degree of the function test of the printed circuit board before and after soldering the communication connector, so as to facilitate determining the problem location when the printed circuit board fails the test, that is, to facilitate determining whether the reason for the unqualified printed circuit board is on the communication connector or on the semi-finished patching board. The preset measured component is a standard measured difference component of the patch. The preset measured component is used to determine the size of the measured difference component of the patch. The non-matching of the measured difference component of the patch with the preset measured component indicates that the test results of the printed circuit board before and after soldering the communication connector are different, that is, it indicates that the communication connector of the printed circuit board is unqualified, that is, it indicates that the printed circuit board is a product with an unqualified communication connector. At this time, a board connection prohibition signal is sent to the patch monitoring system to send the unqualified situation of the printed circuit board to the patch monitoring system in real time, so as to facilitate timely closing the test passage of the printed circuit board and preventing unqualified printed circuit boards from leaving the factory. In another embodiment, the test of the semi-finished patching board needs to be qualified before the test status value of the printed circuit board can be obtained, that is, the test status value of the printed circuit board is obtained after the semi-finished patching board test is qualified, ensuring the qualification of the semi-finished patching board, so as to facilitate quickly determining whether there is a problem with the communication connector.

[0049] It can be understood that after the printed circuit board has passed the test after welding the communication joint, at this time, the semi-finished patch board of the printed circuit board and the communication joint are both judged to be qualified, that is, the semi-finished patch board of the printed circuit board and the communication joint are both normal products. However, in the actual testing process, limited by the influence of manual testing, especially the influence of the testing method for the semi-finished patch board. For example, the patch tester presses the patch test needle on the test end of the semi-finished patch board by a crimping method, and it is often easy to have misplacement, resulting in some test results still being compared with the previous data for subsequent testing, thus easily misjudging the semi-finished patch board, that is, misidentifying a problematic semi-finished patch board as a qualified board. After welding the communication joint subsequently, it may continue to be misjudged in the previous way, and seriously misjudge a problematic printed circuit board as a qualified circuit board.

[0050] In order to reduce the probability of misjudgment of the printed circuit board, a board connection prohibition signal is sent to the patch monitoring system according to the patch measurement difference component to adjust the opening and closing of the test passage of the printed circuit board. After that, the following steps are also included, that is, when the patch measurement difference component matches the preset measurement component, a board connection passage signal is sent to the patch monitoring system to open the test passage of the printed circuit board. After that, the following steps are included:

[0051] Collect the eye diagram test parameters of the printed circuit board;

[0052] Obtain an eye diagram test image according to the eye diagram test parameters;

[0053] Detect whether the eye diagram test image matches the preset eye diagram image;

[0054] When the eye diagram test image does not match the preset eye diagram image, a first patch board replacement alarm signal is sent to the patch monitoring system to replace the semi-finished patch board of the printed circuit board.

[0055] In this embodiment, the eye diagram test parameters are the test parameters collected by the printed circuit board during the eye diagram test, that is, the eye diagram test parameters are the communication test parameters of the printed circuit board during the eye diagram test. According to the waveform shown by the eye diagram test parameters, the waveforms of the transmitted scan and received symbols within the period are displayed on the oscilloscope, thereby obtaining the corresponding eye diagram test image. The eye diagram test image is the image corresponding to the digital signal transmission and reception during the eye diagram test of the printed circuit board, and is used to determine the inter-symbol interference situation between the patch semi-finished board and the communication connector, so as to facilitate determining the source signal crosstalk situation of the transmission image of the patch semi-finished board through the communication connector. The preset eye diagram image is a standard eye diagram test image, that is, the preset eye diagram image is the standard test image of a qualified patch semi-finished board during the eye diagram test. The mismatch between the eye diagram test image and the preset eye diagram image indicates that the eye diagram test of the printed circuit board is different from the standard eye diagram test, that is, it indicates that there is a difference between the eye diagram image of the printed circuit board and the standard eye diagram image, which also means that there is a misdetection situation for the patch semi-finished board of the printed circuit board, that is, the patch semi-finished board of the printed circuit board is an unqualified semi-finished board. In this way, at this time, a first patch board replacement alarm signal is sent to the patch monitoring system to determine that the patch semi-finished board of the printed circuit board is a board with signal transmission problems, which is convenient for determining that there is a problem with the patch semi-finished board, so that the operator can replace the patch semi-finished board of the printed circuit board in time without replacing the communication connector, so as to improve the production efficiency of the printed circuit board.

[0056] Further, after sending a board connection prohibition signal to the patch monitoring system according to the patch measurement difference component to adjust the opening and closing of the test passage of the printed circuit board, especially when the patch measurement difference component does not match the preset measurement component, a board connection prohibition signal is sent to the patch monitoring system to close the test passage of the printed circuit board. After that, the following steps are also included:

[0057] Replace the communication connector and re-execute steps S100 to S300;

[0058] Obtain the number of times the communication connector of the printed circuit board is replaced;

[0059] Detect whether the number of times the communication connector is replaced is greater than or equal to the preset replacement times;

[0060] When the number of times the communication connector is replaced is greater than or equal to the preset replacement times, send a second patch board replacement alarm signal to the patch monitoring system to replace the patch semi-finished board of the printed circuit board.

[0061] In this embodiment, the measured difference component does not match the preset measured component, that is, at this time, there is a problem with the communication connector on the printed circuit board. By replacing the communication connector and re - executing the above - mentioned test and detection steps S100 to S300, the printed circuit board with the newly soldered communication connector is tested again. By collecting the number of times of replacing the above - mentioned communication connector, that is, for the same printed circuit board, the communication connector can be replaced multiple times. That is, there may still be problems after replacing the communication connector. The preset replacement times is the maximum replaceable times of the communication connector of the printed circuit board. When the number of times of replacing the communication connector is greater than or equal to the preset replacement times, it indicates that the number of times of replacing the communication connector of the printed circuit board exceeds the maximum replaceable times, that is, it indicates that the communication connector of the printed circuit board is replaced relatively frequently. Specifically, the preset replacement times is 2. In this way, if the communication connector of the printed circuit board still has problems after being replaced many times, it indicates that the problem location of the printed circuit board is not the communication connector but the semi - finished patch board. At this time, a second patch board replacement alarm signal is sent to the patch monitoring system to replace the semi - finished patch board of the printed circuit board, avoiding repeatedly replacing the communication connector, replacing the semi - finished patch board misjudged as qualified in the printed circuit board, thus avoiding infinitely cycling to replace the communication connector, facilitating quickly finding the cause of the problem of the printed circuit board, and thus facilitating timely loss prevention.

[0062] The above - mentioned various preset variables are all set in the database for easy extraction in time, and different preset variables are placed in different storage units, that is, in different storage stacks. Moreover, the eye diagram test parameters and the number of times of replacing the communication connector can be collected by corresponding detectors. For example, they can be collected by a patch tester.

[0063] In one of the embodiments, the present application further provides a printed circuit board patch monitoring device, which is implemented by using the printed circuit board patch monitoring method in any of the above - mentioned embodiments. In one of the embodiments, the printed circuit board patch monitoring device has functional modules corresponding to each step for implementing the printed circuit board patch monitoring method. Please refer to Figure 2, the printed circuit board chip mounting monitoring device 10 includes a chip mounting test component 100, chip mounting test pins 200, and a chip mounting test transmission line 300; the chip mounting test component 100 includes a chip mounting tester 110 and a passing light 120, the monitoring end of the chip mounting tester 110 is electrically connected to the passing light 120, and the chip mounting tester 110 is used for test sampling of the printed circuit board; the chip mounting test pins 200 are connected to the sampling end of the chip mounting tester 110, and the chip mounting test pins 200 are used for crimping with the test end of the printed circuit board to collect the test status value of the printed circuit board; the output end of the chip mounting tester 110 is connected to the chip mounting test transmission line 300, and the chip mounting test transmission line 300 is used for connection with the input end of the chip mounting monitoring system.

[0064] In this embodiment, the chip mounting tester 110 collects the current test results of the printed circuit board and compares them with the preset status values, that is, compares them with the standard test results, to determine the difference in the current test status of the printed circuit board. Finally, according to the difference in the chip mounting test difference component, the passing status of the printed circuit board test is adjusted, which is convenient for determining whether there is a problem with the printed circuit board at the communication connector, so as to quickly determine the problem point of the printed circuit board, without rework and manual testing again, effectively improving the production efficiency of the printed circuit board.

[0065] In another embodiment, chips for each test item are integrated in the chip mounting tester 110, so as to output the test results to the chip mounting monitoring system.

[0066] In another embodiment, the passing light 120 corresponds to whether the printed circuit board is communicating. Specifically, when the printed circuit board passes the inspection, the passing light 120 shows green, otherwise it shows red, which is convenient for the monitoring personnel to visually determine the passing situation of the printed circuit board.

[0067] Each module in the above-mentioned printed circuit board chip mounting monitoring device can be implemented in whole or in part by software, hardware, and their combination. The above-mentioned modules can be embedded in the processor of the computer device in hardware form or be independent of it, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above-mentioned modules.

[0068] In one embodiment, a computer device is provided. The computer device can be a server, and its internal structure diagram can be as Figure 3As shown. The computer device includes a processor, a memory, and a network interface connected by a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to auscultate data such as operating state parameters, auscultatory-tactile difference, and auscultation switching signals. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it implements a method for monitoring the hot pressing of a multi-layer circuit board.

[0069] Those skilled in the art can understand that Figure 3 the structure shown in is only a block diagram of some structures related to the solution of this application, and does not constitute a limitation on the computer device to which the solution of this application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0070] In one embodiment, the present application also provides a computer device, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the steps in the above method embodiments are implemented.

[0071] In one embodiment, the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by the processor, the steps in the above method embodiments are implemented.

[0072] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above-mentioned embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned various methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in this application can include at least one of non-volatile and volatile memories. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0073] The above-mentioned embodiments only represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A method for monitoring printed circuit board chip mounting, characterized in that, Including: Obtain the test status value of a printed circuit board, where the printed circuit board is a board with a communication connector soldered thereon; Perform a comparison test process on the test status value and a preset status value to obtain a comparison difference component; Send a board connection prohibition signal to the chip mounter monitoring system according to the comparison difference component to adjust the opening and closing of the test passage for the printed circuit board; Collect the eye diagram test parameters of the printed circuit board; Obtain an eye diagram test image according to the eye diagram test parameters; Detect whether the eye diagram test image matches a preset eye diagram image, where the preset eye diagram image is a standard test image during the eye diagram test of a qualified semi-finished chip mounting board; When the eye diagram test image does not match the preset eye diagram image, send a first chip mounting board replacement alarm signal to the chip mounter monitoring system to replace the semi-finished chip mounting board of the printed circuit board; Before the step of obtaining the test status value of the printed circuit board, it further includes: Obtain the semi-finished test status value of a semi-finished chip mounting board, where the semi-finished chip mounting board is a board of the printed circuit board without a communication connector soldered thereon; Update and replace the semi-finished test status value with the preset status value.

2. The printed circuit board chip mounting monitoring method according to claim 1, characterized in that The test status value includes at least one of the burn-in test status value, short / open circuit test status value, identity recognition test status value, emission mode test status value, and audio path test status value of the printed circuit board.

3. The printed circuit board chip mounting monitoring method according to claim 1, wherein The step of performing a comparison test process on the test status value and a preset status value includes: Calculate the difference between the test status value and the semi-finished test status value.

4. The printed circuit board chip mounting monitoring method according to claim 1, wherein The step of sending a board connection prohibition signal to the chip mounter monitoring system according to the comparison difference component to adjust the opening and closing of the test passage for the printed circuit board includes: Detect whether the comparison difference component matches a preset comparison component; When the comparison difference component matches the preset comparison component, send a board connection permission signal to the chip mounter monitoring system to open the test passage for the printed circuit board.

5. The printed circuit board chip mounting monitoring method according to claim 4, wherein The step of when the comparison difference component matches the preset comparison component, sending a board connection permission signal to the chip mounter monitoring system to open the test passage for the printed circuit board includes: When the comparison difference component is equal to 0, send a board connection permission signal to the chip mounter monitoring system to turn on the passage light of the printed circuit board chip mounting monitoring device.

6. The printed circuit board chip mounting monitoring method according to claim 4, wherein After the step of detecting whether the comparison difference component matches a preset comparison component, it further includes: When the comparison difference component does not match the preset comparison component, send a board connection prohibition signal to the chip mounter monitoring system to close the test passage for the printed circuit board.

7. A printed circuit board chip mounting monitoring device, the printed circuit board chip mounting monitoring device adopting the printed circuit board chip mounting monitoring method as described in any one of claims 1 to 6, characterized in that, Including: A chip mounter test component, the chip mounter test component includes a chip mounter tester and a passage light, the monitoring end of the chip mounter tester is electrically connected to the passage light, and the chip mounter tester is used for test sampling of the printed circuit board; Chip mounter test pins, the chip mounter test pins are connected to the sampling end of the chip mounter tester, and the chip mounter test pins are used for pressing against the test end of the printed circuit board to collect the test status value of the printed circuit board; Chip mounter test transmission lines, the output end of the chip mounter tester is connected to the chip mounter test transmission lines, and the chip mounter test transmission lines are used for connecting to the input end of the chip mounter monitoring system.

8. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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