Spacers for optical devices

Abstract

A method of manufacturing a spacer (285) for separating and electrically coupling a first component and a second component of an optical device is disclosed. The method includes the steps of adhesively coupling a first substrate (250) to each of a plurality of spacer elements (205). The method includes the steps of adhesively coupling a second substrate (275) to each of the plurality of spacer elements such that the plurality of spacer elements are disposed between opposing surfaces of the first substrate and the second substrate. At least one of the plurality of spacer elements includes a conductive coating and / or is adhesively coupled to the first substrate and the second substrate using a conductive adhesive such that a conductive path (290a-d) is formed for electrically coupling the first component and the second component of the optical device. An optical device (500) is also disclosed that includes the spacer (285) manufactured according to the method.

Description

Technical Field

[0001] The present disclosure belongs to the field of optical devices and wafer-level manufacturing of optical devices. In particular, the present disclosure relates to spacers for optical devices. Background Art

[0002] Optical devices, e.g., devices including passive optical components (such as lenses) and / or active optical components (such as radiation sensors and emitters), are common in many optical systems. For example, camera systems such as those implemented on cell phones and tablet devices may include multiple optical devices.

[0003] Such optical devices can be implemented as micro-optical devices, where the physical size of the device is minimized for functional, practical and / or cost purposes.Cost-effective and extensively parallelized production methods at wafer level can be implemented to manufacture such micro-optical devices.

[0004] Such an optical device may include electronic components or may need to provide an interface to electronic circuitry. For example, an optical sensor may be required to provide a signal to a measurement circuit. Thus, an optical device may include circuitry and / or electronic components.

[0005] Furthermore, such optical devices manufactured at the wafer level may be formed by a layered stack or assembly of multiple components, which may require electrical connections between these components. In some cases, it may be desirable to achieve these connections without obstructing or blocking the optical elements within the device.

[0006] Existing techniques for achieving electrical connections between components in such micro-optical devices can require complex component geometries and complex processes, such as laser direct structuring (LDS), to place the electrical connections away from the optical elements. Furthermore, existing manufacturing techniques can result in large optical device sizes, which can adversely affect manufacturing costs and efficiency.

[0007] Therefore, it is desirable to provide a compact optical device that includes reliable electrical connections between components and / or connections to other electronic components. Furthermore, it is desirable to provide a method of manufacturing such an optical device.

[0008] Therefore, an object of at least one embodiment of at least one aspect of the present disclosure is to obviate or at least mitigate at least one of the above-mentioned disadvantages of the prior art. Summary of the Invention

[0009] The present disclosure generally relates to a method for manufacturing a spacer for separating and electrically coupling a first component and a second component of an optical device. Specifically, the optical device may be suitable for implementation in eye-safe circuitry in illuminators for 3D sensing in smartphones and automotive applications.

[0010] According to a first aspect of the present disclosure, there is provided a method for manufacturing a spacer for separating and electrically coupling a first component and a second component of an optical device, the method comprising the following steps: adhesively coupling a first substrate to each of a plurality of spacer elements; and adhesively coupling a second substrate to each of the plurality of spacer elements, so that the plurality of spacer elements are disposed between relative surfaces of the first substrate and the second substrate, wherein at least one of the plurality of spacer elements includes a conductive coating and / or is adhesively coupled to the first substrate and the second substrate using a conductive adhesive, so that a conductive path is formed for electrically coupling the first component and the second component of the optical device.

[0011] Advantageously, providing a conductive path extending between a first component and a second component of an optical device and effectively integrated into a spacer can enable assembly of a compact optical device. Such a compact optical device can provide reliable electrical connections between the first component and the second component and another component or circuit via the conductive path.

[0012] Furthermore, by providing smaller, more compact optical devices, the overall material cost can be reduced. That is, for wafer-level manufacturing of optical devices, a larger number of optical devices can be manufactured per wafer due to the reduced footprint of each individual optical device.

[0013] Each spacer element can be a rod. Each spacer element can be an elongated element. For example, each spacer element can have a substantially cubic shape. Each spacer element can be formed from a substrate or wafer. For example, the substrate or wafer can be cut or diced into the plurality of spacer elements using a dicing saw or the like. Multiple substantially parallel cuts across the substrate or wafer can form the plurality of spacer elements.

[0014] In some embodiments, the coating may include chromium and / or another metal.

[0015] Furthermore, in some embodiments where at least one of the plurality of spacer elements includes a conductive layer and / or a conductive coating, the adhesive can be a non-conductive adhesive.

[0016] At least one surface of each spacer element may be ground and / or polished.

[0017] Each spacer element and / or the first substrate and / or the second substrate may be formed from an electrically insulating material.

[0018] Each spacer element may be formed from a glass wafer, a silicon wafer, etc. Each spacer element may include a cured epoxy resin. Each spacer element may include polydimethylsiloxane (PDMS).

[0019] Each spacer element may be formed from a machined substrate, wafer or plate.

[0020] The method may comprise the prior step of arranging a plurality of spacer elements on the container substantially parallel to each other.The plurality of spacer elements may be arranged to be evenly spaced apart.

[0021] For example, the container may be a base plate, a wafer plate, etc. The container may include a plurality of slots or grooves, wherein each slot or groove may be sized to receive a spacer element of the plurality of spacer elements.

[0022] The container may be a suction cup. The container may be configured to hold or clamp a plurality of spacer elements. The container may be a vacuum suction cup.

[0023] The method may include the steps of adhering a removable adhesive element to a plurality of spacer elements, and subsequently removing the plurality of spacer elements from the container.

[0024] The removable adhesive element may comprise a piece of dicing tape.

[0025] The removable adhesive element may include a double-sided tape, such as a tape having adhesive applied to both sides.

[0026] A first side of the removable adhesive element may be adhered to a carrier element, such as a base plate. The method may include adhering a second side of the removable adhesive element to a plurality of spacer elements. In this manner, the carrier element may be used to lift the plurality of spacer elements from the container. Furthermore, the plurality of spacer elements may remain temporarily adhered to the carrier element via the removable adhesive element.

[0027] The method may include one or more steps of curing the conductive adhesive to form the conductive path (eg, at least a portion of the conductive path).

[0028] The step of curing the conductive adhesive may solidify the conductive adhesive. Additionally, the step of curing the conductive adhesive may allow the conductive adhesive to bond (such as rigidly bond) each of the plurality of spacer elements to the first substrate and / or the second substrate.

[0029] The conductive adhesive may be an isotropic adhesive.

[0030] The step of curing the conductive adhesive may include adding one or more curing agents or hardeners.

[0031] The step of curing the conductive adhesive may include thermal curing and / or UV curing of the conductive adhesive.

[0032] The method may include the following steps: when adhesively coupling the first and / or second substrates to the plurality of spacer elements, applying a force to the first and / or second substrates such that a portion of the conductive adhesive is pushed or compressed from between the first and / or second substrates and the plurality of spacer elements. The portion of the conductive adhesive may form a conductive path or may form an extension of the conductive path. Advantageously, the portion of material may increase the total cross-sectional area of ​​the conductive path, thereby reducing the overall resistance of the conductive path.

[0033] The method may include the step of cutting the first substrate, the second substrate and the plurality of spacer elements to form the plurality of spacers. That is, the method may include the step of cutting the assembly including the first substrate, the second substrate and the plurality of spacer elements to form the plurality of spacers.

[0034] The cutting step may include using a dicing saw, a laser cutter, or the like.

[0035] The step of cutting may include cutting each spacer element of the plurality of spacer elements into individual portions, each portion forming a sidewall of an individual spacer of the plurality of spacers.

[0036] After the cutting step, each portion of the sidewalls forming the individual spacers may be polished.

[0037] The method may comprise the step of forming a layer of substantially reflective material on at least one of the plurality of spacer elements and / or on the first substrate and / or the second substrate.

[0038] For example, the reflective material may reflect wavelengths of radiation that may be emitted by an active device, such as a diode, a vertical cavity surface emitting laser (VCSEL), etc., which may be disposed on either or both of the first and second components of the optical device.

[0039] The method may comprise the step of forming an optical element on at least one of the plurality of spacer elements and / or on the first substrate and / or the second substrate.

[0040] For example, the optical element can be a lens, a microlens array, a metalens, a diffraction grating, a diffuser, a Fresnel lens, an interference filter, etc. The optical element can be configured to act as a waveguide. The optical element can be configured to increase the optical gain of the optical device.

[0041] The method may comprise the step of forming a circuit on at least one of the plurality of spacer elements and / or on the first substrate and / or the second substrate.

[0042] The circuit may include passive and / or active components. For example, such a circuit may include components such as one or more capacitors, resistors, and / or inductors. Such a circuit may include an integrated circuit.

[0043] Advantageously, by implementing circuitry on at least one of the plurality of spacer elements and / or on the first substrate and / or the second substrate, additional functionality can be added to the optical device in an efficient and cost-effective manner. By implementing such circuitry on the spacer, the first and / or second components can be made smaller, resulting in a more compact and cost-effective optical device.

[0044] The method may include forming a layer of radiation absorbing material on at least one of the plurality of spacer elements and / or on the first substrate and / or the second substrate. For example, the radiation absorbing material may absorb wavelengths of radiation emitted by an active device (e.g., a diode, a vertical cavity surface emitting laser (VCSEL), etc.), which may be disposed on either or both of the first and second components of the optical device.

[0045] According to a second aspect of the present disclosure, there is provided a spacer manufactured by the method according to the first aspect.

[0046] According to a third aspect of the present disclosure, a spacer for spacing and electrically coupling a first component and a second component of an optical device is provided, the spacer comprising: a first substrate coupled to each of a plurality of spacer elements; and a second substrate coupled to each of the plurality of spacer elements, such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates. At least one of the plurality of spacer elements includes a conductive coating and / or is coupled to the first and second substrates using a conductive material, such that a conductive path is formed for electrically coupling the first and second components of the optical device.

[0047] Each spacer element may be a rod.Each spacer element and / or at least one of the first substrate and / or the second substrate may be formed from an electrically insulating material.

[0048] The conductive material may be formed from a cured conductive adhesive. The conductive material may include a metal such as chromium.

[0049] At least one of the plurality of spacer elements may include a layer of substantially reflective material.

[0050] At least one of the plurality of spacer elements may include a hole.

[0051] At least one of the plurality of spacer elements may include an optical element.

[0052] At least one of the plurality of spacer elements may include circuitry.

[0053] At least one of the plurality of spacer elements may comprise a layer of radiation absorbing material.

[0054] According to a fourth aspect of the present disclosure, a method for assembling an optical device is provided, the method comprising the following steps: adhering a first component of the optical device to a spacer formed according to the method of the first aspect; and adhering a second component of the optical device to the spacer so that a conductive path of the spacer electrically couples a first conductive element formed on the first component to a second conductive element formed on the second component.

[0055] The first component and / or the second component can be a substrate, a printed circuit board (PCB), etc. A conductive adhesive can be used to adhere the first component and / or the second component. This conductive adhesive can continue (e.g., extend) the conductive path of the spacer to one or more conductive elements on the first component and / or the second component.

[0056] According to a fifth aspect of the present disclosure, there is provided an optical device assembled according to the method of the fourth aspect.

[0057] The first component may include at least one passive optical element.

[0058] The second component may include at least one active optical element.

[0059] The at least one passive optical element may include one of the following: a lens; a microlens array; a metalens; a diffraction grating; a diffuser; a Fresnel lens; a filter; a waveguide.

[0060] At least one active optical element may include a sensor and / or an emitter. For example, the emitter may be a laser diode, LED, VCSEL, etc. The sensor may include a photodiode, a single photon avalanche detector, etc.

[0061] The first component may include electrical traces for the eye safety circuitry.

[0062] The optical device can be one of the following: an illuminator; a proximity sensor; a spectral sensor; an ambient light sensor; a dot projector; a light-to-frequency sensor.

[0063] According to a sixth aspect of the present disclosure, there is provided an apparatus comprising: at least one optical device according to the fifth aspect; a camera; and a processing circuit communicatively coupled to the at least one optical device and the camera.

[0064] The device may be one of: a cellular telephone; a tablet device; or a personal computer.

[0065] The above summary of the invention is intended to be merely illustrative and not restrictive. The present disclosure includes one or more corresponding aspects, embodiments, or features, alone or in various combinations, whether or not specifically stated (including claimed) in that combination or alone. It should be understood that the features defined above in accordance with any aspect of the present disclosure or below in connection with any specific embodiment of the present disclosure may be used alone or in combination with any other defined features in any other aspect or embodiment, or to form further aspects or embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] These and other aspects of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0067] Figure 1 Depicts prior art optical devices;

[0068] Figure 2a depicts the steps of arranging a plurality of spacer elements on a container;

[0069] Figure 2b depicts the step of adhering a removable adhesive element to a plurality of spacer elements;

[0070] Figure 2c depicts a plurality of spacer elements adhered to a removable adhesive element;

[0071] Figure 2d depicting the step of dispensing adhesive on each of the plurality of spacer elements;

[0072] Figure 2e depicts the step of adhesively coupling a first substrate to each of the plurality of spacer elements;

[0073] Figure 2f depicting the steps of removing the removable adhesive element;

[0074] Figure 2g depicts a further step of dispensing adhesive on each of the plurality of spacer elements;

[0075] Figure 2h depicting the step of adhesively coupling a second substrate to each of the plurality of spacer elements;

[0076] Figure 2i depicts the step of cutting the assembled first substrate, second substrate, and plurality of spacer elements to form a plurality of spacers;

[0077] Figure 3 depicts a spacer according to an embodiment of the present disclosure;

[0078] Figure 4 is a photograph of a spacer according to an embodiment of the present disclosure;

[0079] Figure 5a depicts a plan view of a plurality of spacer elements arranged on a container;

[0080] Figure 5b depicts another plan view of a plurality of spacer elements arranged on a container;

[0081] Figure 6 depicts an optical device according to an embodiment of the present disclosure;

[0082] Figure 7 An apparatus for implementing an optical device according to an embodiment of the present disclosure is depicted;

[0083] Figure 8 is a method of manufacturing a spacer for spacing apart and electrically coupling a first component and a second component of an optical device according to an embodiment of the present disclosure; and

[0084] Figure 9 A method of assembling an optical device according to an embodiment of the present disclosure is provided. DETAILED DESCRIPTION

[0085] Figure 1 A simplified cross-sectional view of a prior art optical device 100 is depicted.

[0086] The optical device 100 includes a substrate 105, such as a glass or silicon substrate. An optical element 110 is formed or mounted on the substrate 105. For example, the optical element 110 may be a microlens array, a metalens, or the like.

[0087] Circuitry or other conductive elements (not shown) may be formed on substrate 105 .

[0088] The optical device 100 comprises a further substrate 120 , for example a glass or silicon substrate.

[0089] For purposes of illustration, the active device 125 is depicted as being mounted on the further substrate 120. The active device 125 may be a laser diode, an LED, a sensor, or the like.

[0090] The prior art optical device 100 further includes a spacer 115. The spacer 115 may be formed by a hole, void, or aperture formed in the substrate. The spacer 115 may be adapted to be mounted on the further substrate 120 such that the active device 125 is located within the hole, void, or aperture.

[0091] In some cases, it may be necessary to provide an electrical connection between the substrate 105 and the further substrate 120. In such prior art optical devices, the electrical connection may be achieved by implementing complex geometry of the components and / or complex processes such as laser direct structuring (LDS) and / or implementation of additional components.

[0092] Figures 2a to 2i Depicted are a series of steps for fabricating a spacer for spacing and electrically coupling first and second components of an optical device, according to an embodiment of the present disclosure.

[0093] Figure 2a The step 200 of arranging a plurality of spacer elements 205 on a container 210 is depicted. Figure 2a is a cross-sectional view. In some embodiments, each spacer element 205 is an elongated element, such as a rod. Thus, step 200 can include arranging a plurality of spacer elements 205 substantially parallel to one another on the container 205.

[0094] The container 210 may be a base plate, a wafer plate, etc. Figure 2a The illustrated example container 210 includes a plurality of slots, each slot being sized to receive a spacer element 205. As such, each slot can inhibit or limit movement of the plurality of spacer elements 205 during assembly of the spacer 285.

[0095] The container 210 may be a suction cup. The container 210 may include additional components (not shown) configured to hold or clamp the plurality of spacer elements 205. In an exemplary embodiment, the container 210 is a vacuum suction cup.

[0096] Figure 2b Step 215 of adhering a removable adhesive element 220 to the plurality of spacer elements 205 is depicted. The removable adhesive element 220 may comprise a piece of dicing tape. In an exemplary embodiment, the removable adhesive element 220 comprises double-sided tape, such as tape having adhesive applied to both sides. A first side of the removable adhesive element 220 is depicted as being adhered to a carrier element 225. The carrier element 225 may be a substrate, etc. Figure 2b Step 215 includes adhering the second side of the removable adhesive element 220 to the plurality of spacer elements 205. In this way, the carrier element 225 can be used to lift the plurality of spacer elements 205 from the container 210, such as Figure 2c shown.

[0097] In addition, Figure 2c In the optional step depicted in , the carrier element 225 has been rotated such that the plurality of spacer elements 205 extend from the removable adhesive element 220 and the carrier element 225 in an upward direction.

[0098] Figure 2d Depicted is a step 230 of dispensing a conductive adhesive 240a on each of the plurality of spacer elements 205 .

[0099] The conductive adhesive 240a may be dispensed, for example, as a liquid, gel, paste, or the like.

[0100] The conductive adhesive 240a may be provided as a suspension of conductive filaments or elements. The conductive adhesive 240a may be an isotropic conductive adhesive.

[0101] The step 230 of dispensing the conductive adhesive 240a on each of the plurality of spacer elements 205 may include screen printing. The step of dispensing the conductive adhesive 240a may include spraying.

[0102] The conductive adhesive 240a may be dispensed as a drop or bead on each spacer element 205 .

[0103] Figure 2e Depicted is a step 245 of adhesively coupling the first substrate 250 to each of the plurality of spacer elements 205. The first substrate 250 is lowered onto the conductive adhesive 240a in the direction indicated by arrow 255, thereby adhering the first substrate 250 to each of the plurality of spacer elements 205.

[0104] Step 245 may include applying a force to the first substrate 250 when adhesively coupling the first substrate 250 to the plurality of spacer elements 205 so as to push or compress a portion of the conductive adhesive 240a from between the first substrate 250 and the plurality of spacer elements 205, as will be described with reference to FIG. Figure 3 and Figure 4 Described in more detail.

[0105] The conductive adhesive 240 a may be cured, such as thermally cured and / or UV cured, to harden the conductive adhesive 240 a .

[0106] exist Figure 2f At step 260 depicted in FIG, the removable adhesive element 220 is separated from the plurality of spacer elements 205. The step of curing the conductive adhesive 240a may also reduce the adhesiveness of the removable adhesive element 220 to at least some extent and thus facilitate removal of the removable adhesive element 220 without applying excessive force to the first substrate 250 and / or the plurality of spacer elements 205.

[0107] Figure 2g Depicted is a step 265 of dispensing a conductive adhesive 240b on each of the plurality of spacer elements 205. Figure 2d The characteristics and application method of conductive adhesive 240b are described in detail with reference to conductive adhesive 240a.

[0108] Figure 2h Depicted is a step 270 of adhesively coupling a second substrate 275 to each of the plurality of spacer elements 205. The second substrate 275 can be a glass substrate, a silicon substrate, or the like.

[0109] The second substrate 275 is placed onto the conductive adhesive 240 b , thereby adhering the second substrate 275 to each of the plurality of spacer elements 205 .

[0110] Step 270 may include applying a force to the second substrate 275 when adhesively coupling the second substrate 275 to the plurality of spacer elements 205 so as to push or compress a portion of the conductive adhesive 240b from between the second substrate 275 and the plurality of spacer elements 205, as will be described with reference to FIG. Figure 3 and Figure 4 Described in more detail.

[0111] The conductive adhesive 240 b may then be cured, such as thermally and / or UV-cured, to harden the conductive adhesive 240 b .

[0112] Figure 2i Depicted is a step 280 of cutting the assembled first substrate 250, second substrate 275, and plurality of spacer elements 210 to form a plurality of spacers 285. Step 280 may include using a dicing saw, a laser cutter, or the like. Each spacer element in the plurality of spacer elements 210 is cut into individual portions, each portion forming a sidewall of an individual spacer 285 in the plurality of spacers. In some exemplary embodiments, after cutting step 280, each portion forming a sidewall of an individual spacer 285 may be polished.

[0113] Figure 3 An example of a spacer 285 is depicted. The spacer 285 is formed by a cut portion of the first substrate 250, a cut portion of the second substrate 275, and two cut portions of the spacer element 205. Figure 2d and 2g The conductive adhesive 240a, 240b is hardened to form conductive paths 290a, 290b, 290c, 290d. The conductive paths 290a, 290b, 290c, 290d are suitable for electrically coupling the first component 540 and the second component 545 of the optical device 500, as described below with reference to Figure 6 Described in more detail.

[0114] Figure 3 Also depicted is a portion 295a of the conductive path 290a, which is formed by pushing or compressing a portion of the conductive adhesive 240a from between the first and second substrates 250, 275 and the plurality of spacer elements 205, as described above. Beneficially, this portion 295a of the conductive path 290a increases the overall cross-sectional area of ​​the conductive path 290a, thereby reducing the overall resistance of the conductive path 290a.

[0115] Figure 43 is a photograph of a spacer 385 according to an embodiment of the present disclosure. The spacer 385 is formed by a cut portion of the first substrate 350, a cut portion of the second substrate 375, and two cut portions of the spacer element 305. Figure 2d and 2g The conductive adhesives 240a, 240b are hardened to form conductive paths 390a, 390b, 390c, 390d. The conductive paths 390a, 390b, 390c, 390d are suitable for electrically coupling the first component 540 and the second component 545 of the optical device 500, as described below with reference to Figure 6 Described in more detail.

[0116] Figure 4 Also depicted is a portion 395a of the conductive path 390a formed by pushing or compressing a portion of the conductive adhesive 240a from between the first and second substrates 350, 375 and the plurality of spacer elements 305, as described above.

[0117] FIG5 depicts a plan view of a plurality of spacer elements 405 arranged on a container 410. FIG5 is a plan view of a plurality of spacer elements 405 arranged on a container 410. Figure 2a 2. An example of a plan view of a container 210 and a spacer element 205 corresponding to the container 210 and the spacer element 205 depicted in FIG.

[0118] As can be seen, each spacer element 405 is an elongated element and is generally shaped as a rod. In the exemplary embodiment, each spacer element 405 is formed from a diced substrate or wafer. After dicing, each spacer element 405 is disposed in a slot or groove in the container 410, as described above in step 200.

[0119] To facilitate handling of the plurality of spacer elements 405, particularly when placing the spacer elements 405 and / or removing the spacer elements 405 from the container 410, one or more supports 415 may be coupled to the plurality of spacer elements 405, such as Figure 5b shown.

[0120] The above method may further include the step of forming a layer of material on at least one of the plurality of spacer elements 205 and / or on the first substrate 250 and / or the second substrate 275. Such a layer may be formed at any suitable stage of the method. For example, in some embodiments, such a coating or layer may be formed on the first substrate 250 and / or the second substrate 275 prior to step 200.

[0121] In some embodiments, such a coating or layer can be formed on the substrate before the substrate is cut or diced to form the plurality of spacer elements 205. In some embodiments, such a coating or layer can be formed on at least one of the plurality of spacer elements 205 after such cutting or dicing.

[0122] The material layer may be reflective to wavelengths of radiation that may be emitted by the active device 525, such as Figure 6 shown.

[0123] The material layer can be a radiation absorbing material layer.For example, the radiation absorbing material can absorb wavelengths of radiation emitted by an active device (such as active device 525).

[0124] The above method may further include the step of forming a conductive layer or coating on at least one of the plurality of spacer elements 205 and / or on the first substrate 250 and / or the second substrate 275 .

[0125] Furthermore, in some embodiments where a conductive layer or coating is formed on at least one of the plurality of spacer elements 205 and / or on the first substrate 250 and / or the second substrate 275, the adhesive used to couple the spacer elements 205 to the first substrate 250 and the second substrate 275 may be a non-conductive adhesive.

[0126] The conductive layer or coating can be formed by a thin film deposition process and / or by a printing process. The conductive layer or coating can include a metal such as chromium. The conductive layer or coating can be formed from a transparent conductive film, such as a transparent conductive oxide. In an embodiment, the conductive layer or coating includes indium tin oxide.

[0127] Figure 6 An optical device 500 is depicted in accordance with an embodiment of the present disclosure. Figure 6 It is depicted how a spacer 535 manufactured according to the method described above can be used to assemble an optical device 500 .

[0128] The optical device 500 is formed by a first component 540 and a second component 545 separated and conductively coupled by a spacer 535. The spacer 535 may be a Figures 2a to 2i That is, the spacer 535 includes a spacer element 505 coupled to the first substrate and the second substrate.

[0129] exist Figure 6 In the example of FIG, the first component 540 includes an optical element 510. The optical element 510 is a lens. It should be understood that in embodiments, the optical element 510 can be a microlens array, a metalens, a diffraction grating, a diffuser, a Fresnel lens, an interference filter, etc.

[0130] Also depicted is an eye safety circuit 585 formed on the first component 540. The eye safety circuit 585 includes conductive traces extending around the optical element 510.

[0131] exist Figure 6In the example of FIG, the second component 545 is a printed circuit board. It should be understood that in an embodiment, the second component 545 can be a substrate, such as a glass or silicon substrate.

[0132] Also depicted is an active device 525 mounted on a second component 545. In this example embodiment, the active device 525 comprises a radiation emitter, such as an infrared radiation source. The active device 525 is electrically coupled to the second component 545 via bond wires 595.

[0133] The second component 545 includes a plurality of conductive contacts 590. The plurality of conductive contacts 590 includes contacts for coupling to the active device 525, for example, using bond wires 595. The plurality of conductive contacts 590 includes contacts for coupling the optical device 500 to another circuit or device.

[0134] exist Figure 6 In the example of FIG. 5 , the spacer element 505 includes conductive layers 530 a , 530 b , 530 c , and 530 d . The conductive layers 530 a , 530 b , 530 c , and 530 d provide a conductive path extending from the first component 540 to the second component 545 .

[0135] Thus, in some embodiments, the conductive path extending from the first component 540 to the second component 545 can be formed by a conductive layer formed on the spacer element, such as Figure 6 Additionally or alternatively, when assembling the spacer 585, a conductive path extending from the first component 540 to the second component 545 may be formed by using a conductive adhesive, as described above. Figure 3 and Figure 4 As shown in and as referenced above Figures 2a to 2i The method is described.

[0136] continue Figure 6 In an example embodiment, a complete circuit may be formed by the eye safety circuit 585 electrically coupled to the plurality of conductive contacts 590 and / or the active device 525 via the conductive layers 530a, 530b, 530c, 530d in the spacer 535.

[0137] As an example, the size and height of such optical device 500 (e.g., the distance from first component 540 to second component 545) can be in the range of 2 mm to 5 mm. Similarly, the lateral dimensions of first component 540 and second component 545 can be approximately 2 mm to 5 mm by 2 mm to 4 mm.

[0138] The example optical device 500 is an illuminator for eye safety applications, such as an infrared illuminator. In other embodiments, the optical device including the disclosed spacer can be, for example, a proximity sensor; a spectral sensor; an ambient light sensor; a dot projector; a light-to-frequency sensor, etc.

[0139] Figure 7 An example apparatus 600 according to an embodiment of the present disclosure is depicted. The example apparatus 600 may be a smartphone, a tablet device, or the like. The apparatus 600 includes an optical device 610 according to an embodiment of the present disclosure. That is, the optical device 610 may be or may include an optical device according to the above reference. Figures 2a to 2i The method for manufacturing the optical device 500 is described.

[0140] The device 600 also includes an imaging device, which in some embodiments may be a camera 605 .

[0141] Device 600 includes processing circuitry 615 communicatively coupled to optical device 610 and camera 605 .

[0142] In one embodiment, optical device 610 may be a component of an infrared illuminator used in conjunction with camera 605 , for example, to determine the focus of the camera and / or for object recognition and / or proximity detection.

[0143] Figure 8 A method of fabricating a spacer for spacing and electrically coupling a first component and a second component of an optical device according to an embodiment of the present disclosure is depicted.In a first step 710, a first substrate is adhesively coupled to each of a plurality of spacer elements.

[0144] In a second step 720, the second substrate is adhesively coupled to each of the plurality of spacer elements such that the plurality of spacer elements are disposed between opposing surfaces of the first substrate and the second substrate, wherein at least one of the plurality of spacer elements includes a conductive coating and / or is adhesively coupled to the first substrate and the second substrate using a conductive adhesive such that a conductive path is formed for electrically coupling the first component and the second component of the optical device.

[0145] Figure 9 A method of assembling an optical device according to an embodiment of the present disclosure is described.

[0146] In a first step 810, a first component of the optical device is adhered to a Figure 8 The spacer is formed by the method.

[0147] In a second step 820, a second component of the optical device is adhered to the spacer such that the conductive path of the spacer electrically couples a first conductive element formed on the first component to a second conductive element formed on the second component.

[0148] Applicants disclose individually each individual feature described herein, as well as any combination of two or more such features, to the extent that such feature or combination can be implemented based on the specification as a whole according to the common general knowledge of a person skilled in the art, without regard to whether such feature or combination of features solves any problem disclosed herein, and without limiting the scope of the claims. Applicants indicate that aspects of the present disclosure may consist of any such individual feature or combination of features. In view of the foregoing description, it will be apparent to a person skilled in the art that various modifications may be made within the scope of the present disclosure.

[0149] Although the present disclosure has been described in terms of the preferred embodiments described above, it should be understood that these embodiments are illustrative only and that the claims are not limited to these embodiments. Those skilled in the art will be able to make modifications and substitutions in light of this disclosure, and these modifications and substitutions are considered to fall within the scope of the appended claims. Each feature disclosed or shown in this specification may be incorporated into any embodiment, either alone or in any appropriate combination with any other features disclosed or shown herein.

[0150] Reference Signs List

[0151] 100 optical devices

[0152] 105 substrate

[0153] 110 optical elements

[0154] 115 spacers

[0155] 120 additional substrates

[0156] 125 active devices

[0157] 200 steps

[0158] 205 spacer element

[0159] 210 containers

[0160] 215 steps

[0161] 220 bonding elements

[0162] 225 carrier element

[0163] 230 steps

[0164] 240a conductive adhesive

[0165] 240b conductive adhesive

[0166] 245 steps

[0167] 250 first substrate

[0168] 255 arrows

[0169] 260 steps

[0170] 265 steps

[0171] 270 steps

[0172] 275 second substrate

[0173] 275 steps

[0174] 280 steps

[0175] 285 spacers

[0176] 290a conductive path

[0177] 290b conductive path

[0178] 290c conductive path

[0179] 290d conductive path

[0180] Section 295a

[0181] 305 spacer elements

[0182] 350 first substrate

[0183] 375 second substrate

[0184] 385 spacers

[0185] 390a conductive path

[0186] 390b conductive path

[0187] 390c conductive path

[0188] 390d conductive path

[0189] Section 395a

[0190] 405 spacer element

[0191] 410 container

[0192] 415 support

[0193] 500 optical equipment

[0194] 505 spacer element

[0195] 510 optical elements

[0196] 525 active device

[0197] 530a conductive layer

[0198] 530b conductive layer

[0199] 530c conductive layer

[0200] 530d conductive layer

[0201] 535 spacer

[0202] 540 first component

[0203] 545 Second Component

[0204] 585 Eye Safety Circuit

[0205] 590 conductive contacts

[0206] 595 bonding wire

[0207] 600 devices

[0208] 605 camera

[0209] 610 Optical Equipment

[0210] 615 processing circuit

[0211] 710 First Step

[0212] 720 Second Step

[0213] 810 First Step

[0214] 820 Second Step

Claims

1. A method for manufacturing a spacer (285) for separating and electrically coupling a first component and a second component of an optical device, the method comprising the following steps: - adhesively coupling a first substrate (250) to each of the plurality of spacer elements (205); as well as - adhesively coupling a second substrate (275) to each of the plurality of spacer elements (205) such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates, wherein at least one of the plurality of spacer elements is adhesively coupled to the first substrate and the second substrate using a conductive adhesive such that a conductive path (290a-d) is formed for electrically coupling the first component and the second component of the optical device, and Wherein, each spacer element (205) is formed of an electrically insulating material.

2. The method according to claim 1, wherein Each spacer element (205) is a rod.

3. The method according to claim 1, wherein The first substrate (250) and / or the second substrate (275) are formed of an electrically insulating material.

4. The method according to claim 1, comprising the preceding step of arranging the plurality of spacer elements (205) on the container (210) substantially parallel to each other.

5. The method according to claim 4, comprising the steps of: A removable adhesive element (220) is adhered to the plurality of spacer elements (205), and the plurality of spacer elements are subsequently removed from the container (210).

6. The method of claim 1, comprising one or more steps of curing the conductive adhesive to form the conductive paths (290a-d).

7. The method of claim 1, comprising the step of cutting the first substrate (250), the second substrate (275), and the plurality of spacer elements (205) to form a plurality of spacers (285).

8. The method according to claim 7, wherein: The step of cutting includes cutting each spacer element (205) of the plurality of spacer elements into separate portions, each portion forming a sidewall of an individual spacer of the plurality of spacers.

9. The method according to claim 1, comprising the step of forming at least one of the following on at least one of the plurality of spacer elements (205) and / or on the first substrate (250) and / or the second substrate (275): - a layer of substantially reflective material; - Optical components; - circuits; - holes; and - A layer of radiation absorbing material.

10. A spacer manufactured according to the method of any one of claims 1 to 9.

11. A spacer (285) for separating and electrically coupling a first component and a second component of an optical device, the spacer comprising: - a first substrate (250) coupled to each of the plurality of spacer elements (205); as well as - a second substrate (275) coupled to each of the plurality of spacer elements such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates, wherein at least one of the plurality of spacer elements is coupled to the first substrate and the second substrate using a conductive material such that a conductive path (290a-d) is formed for electrically coupling the first component and the second component of the optical device, and Wherein, each spacer element (205) is formed of an electrically insulating material.

12. The spacer (285) according to claim 11, wherein Each spacer element (205) is a rod, and wherein at least one of the first substrate (250) and / or the second substrate (275) is formed from an electrically insulating material.

13. The spacer according to claim 11, wherein At least one spacer element of the plurality of spacer elements (205) comprises: a layer of substantially reflective material and / or an optical element and / or an electrical circuit and / or a layer of radiation absorbing material.

14. A method of assembling an optical device (500), the method comprising the steps of: adhering a first component (540) of an optical device to a spacer (535) formed according to the method of claim 1; as well as A second component (545) of the optical device is adhered to the spacer such that the conductive path of the spacer electrically couples a first conductive element formed on the first component to a second conductive element formed on the second component.

15. An optical device (500) assembled according to the method of claim 14.

16. The optical device (500) of claim 15, wherein: The first component (540) includes at least one passive optical element; and / or The second component (545) includes at least one active optical element.

17. The optical device (500) according to claim 16, wherein At least one of the following: - the at least one passive optical element comprises one of the following: a lens; a microlens array; a metalens; a diffraction grating; a diffuser; a Fresnel lens; a filter; a waveguide; - the at least one active optical element comprises a sensor and / or an emitter; and - The first component comprises electrical traces for an eye-safe circuit.

18. The optical device (500) according to claim 15, wherein The optical device is one of the following: an illuminator; a proximity sensor; a spectral sensor; an ambient light sensor; a dot projector; and a light-to-frequency sensor.

19. An apparatus (600), comprising: at least one optical device (500) according to any one of claims 15 to 18; Camera (605); as well as Processing circuitry (615) is communicatively coupled to the at least one optical device and the camera.

20. The device according to claim 19, wherein The device (600) is one of the following: Cellular telephone; Tablet devices; and Personal computer.

Images