Integrated circuits and methods for simulating parameters of a fluid ejection die

Abstract

This disclosure relates to an integrated circuit and a method for simulating parameters of a fluid jet dies. One integrated circuit includes a thermal tracking logic unit, a control logic unit, and an output interface. The thermal tracking logic unit determines the temperature of the fluid jet die. The control logic unit limits the simulated parameters of the fluid jet die as a function of the fluid jet die temperature. The output interface outputs the simulated parameters to a printer system based on the function and the fluid jet die temperature.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 2019800906962, filed on February 6, 2019, entitled "Integrated circuit and method for simulating parameters of fluid jetting core". Technical Field

[0002] This disclosure relates to integrated circuits and methods for simulating parameters of a fluid jetting die. Background Technology

[0003] An inkjet printing system, as an example of a fluid jet system, may include a printhead, an ink supply unit that supplies liquid ink to the printhead, and an electronic controller that controls the printhead. As an example of a fluid jet device, a printhead ejects ink droplets through multiple nozzles or orifices onto a printing medium (such as a sheet of paper) to print on the medium. In some examples, the orifices are arranged in at least one column or array such that, as the printhead and printing medium move relative to each other, the appropriate sequence of ink ejection from the orifices causes characters or other images to be printed on the printing medium. Summary of the Invention

[0004] An integrated circuit for simulating parameters of a fluid jet dies includes: a thermal tracking logic component for determining the temperature of the fluid jet dies; a control logic component for limiting the simulated parameters of the fluid jet dies as a function of the temperature of the fluid jet dies; and an output interface for outputting the simulated parameters to a printer system based on the function and the temperature of the fluid jet dies.

[0005] A method for simulating parameters of a fluid jet wick, the method comprising: measuring the temperature of the fluid jet wick; defining simulation parameters of the fluid jet wick as a function of the measured temperature; and outputting the simulation parameters to a printer system based on the function and the measured temperature.

[0006] A method for simulating parameters of a fluid jet wick, the method comprising: estimating the temperature of the fluid jet wick based on a thermal model; defining simulation parameters of the fluid jet wick as a function of the estimated temperature; and outputting the simulation parameters to a printer system based on the function and the estimated temperature. Attached Figure Description

[0007] Figure 1 This is a block diagram illustrating an example of an integrated circuit used to simulate parameters.

[0008] Figure 2 This is a block diagram illustrating another example of an integrated circuit used to simulate parameters.

[0009] Figure 3 This is a schematic diagram illustrating another example of an integrated circuit used to simulate parameters.

[0010] Figure 4A and Figure 4B This is a flowchart illustrating an example of a method for simulating parameters of a fluid jetting core.

[0011] Figure 5 This is a flowchart illustrating another example of a method for simulating parameters of a fluid jetting core.

[0012] Figure 6 This is a flowchart illustrating another example of a method for simulating parameters of a fluid jetting core.

[0013] Figure 7 This is a flowchart illustrating another example of a method for simulating parameters of a fluid jetting core.

[0014] Figure 8A and Figure 8B An example of a fluid jetting core is illustrated.

[0015] Figure 9 This is a block diagram illustrating an example of a fluid jetting system. Detailed Implementation

[0016] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description, and specific examples in which the present disclosure may be practiced are illustrated by way of illustration. It should be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description should not be construed as limiting, and the scope of the present disclosure is defined by the appended claims. It should be understood that, unless otherwise specifically indicated, features of the various examples described herein may be combined with each other in part or in whole.

[0017] Parameter drift characterization can be used to verify the integrity of devices that implement fluid jetting (e.g., fluid jet dies). Fluid jetting systems (e.g., printers) can employ parameter drift characterization using a defined approach that can be configured for specific devices and / or printhead technologies. This system-specific approach may limit flexibility and compatibility with existing systems.

[0018] Therefore, this paper discloses an integrated circuit between a printer system and a fluid jetting die, said integrated circuit for simulating parameters of the fluid jetting die based on the die's temperature. Each parameter can be initialized by measuring or inferring the die's temperature and defining the parameter as a temperature-based function. After initialization, each parameter can be simulated via closed-loop thermal control of the simulated parameters based on the measured or inferred temperature. The simulated parameters can be voltage, current, or resistance.

[0019] Figure 1 This is a block diagram illustrating an example of an integrated circuit 100 used for simulating parameters. In one example, the integrated circuit 100 may be electrically coupled to the following references. Figure 8A and Figure 8B The fluid injection core described herein will be referenced below. Figure 9 Between the described fluid injection systems. Integrated circuit 100 includes a thermal tracking logic unit 102, a control logic unit 106, and an output interface 108. The thermal tracking logic unit 102 is electrically coupled to the control logic unit 106 via a signal path 104. The control logic unit 106 is electrically coupled to the output interface 108.

[0020] Thermal tracking logic unit 102 determines the temperature of the fluid jet wick. In one example, thermal tracking logic unit 102 measures the temperature of the fluid jet wick. In another example, thermal tracking logic unit 102 estimates the temperature of the fluid jet wick based on a thermal model. The thermal model can estimate the temperature of the fluid jet wick based on the effects of the fluid jet wick's heat capacity, heating power, ambient temperature, etc. The thermal model can be used to calculate the temperature rise when fluid jet wick heating is enabled and the temperature drop when fluid jet wick heating is disabled.

[0021] Control logic unit 106 defines the analog parameters of the fluid jet dies as a function of the fluid jet dies' temperature. The analog parameters may be, for example, resistance, voltage, or current. Output interface 108 outputs the analog parameters to the printer system based on the function and the fluid jet dies' temperature.

[0022] The control logic unit 106 may include a microprocessor, an application-specific integrated circuit (ASIC), or other suitable logic circuitry for controlling the operation of the integrated circuit 100. The output interface 108 may be a contact pad, pin, bump, wire, or other suitable electrical interface for outputting analog parameters from the control logic unit 106.

[0023] Figure 2 This is a block diagram illustrating another example of an integrated circuit 120 used for simulating parameters. In one example, integrated circuit 120 may be electrically coupled to the following references. Figure 8A and Figure 8B The fluid injection core described herein will be referenced below. Figure 9 Between the described fluid injection systems. Integrated circuit 120 is similar to the previous reference. Figure 1 The described and illustrated integrated circuit 100 includes a thermal tracking logic unit 102, a control logic unit 106, and an output interface 108. Additionally, the integrated circuit 120 includes multiplexers 124 and 130, a temperature (TEMP) input interface 140, a control (CNTL) input interface 142, and multiple input interfaces including a first (IN-1) input interface 144 and a second (IN-2) input interface 146.

[0024] Temperature input interface 140 is electrically coupled to thermal tracking logic unit 102. Control input interface 142 is electrically coupled to control logic unit 106. Control logic unit 106 is electrically coupled to the control input of multiplexer 124 via signal path 122. First input interface 144 and second input interface 146 are electrically coupled to the input of multiplexer 124. The output of multiplexer 124 is electrically coupled to the input of control logic unit 106. Control logic unit 106 is electrically coupled to the control input of multiplexer 130 via signal path 128, and is electrically coupled to the first and second inputs of multiplexer 130 via signal paths 132 and 134, respectively. The output of multiplexer 130 is electrically coupled to output interface 108.

[0025] Temperature interface 140 can be used to measure the temperature of the fluid jet dies. Temperature interface 140 can be electrically coupled to an internal thermal sensing element of the fluid jet dies (e.g., a temperature-sensing resistor, a temperature-sensing diode stack, or another suitable integrated temperature-sensing element) or electrically coupled to an external temperature sensor (e.g., a thermocouple) outside the fluid jet dies to measure the fluid jet dies' temperature. Control interface 142 can be electrically coupled to a fluid jet system (e.g., a printer) to receive a control signal indicating which parameter to simulate. Input interfaces 144 and / or 146 can be used to measure the parameters of the fluid jet dies to be simulated.

[0026] Control logic unit 106 receives control signals and can provide signals on signal path 122 to multiplexer 124 to select input interface 144 or 146 corresponding to the received control signals on control interface 142. Control logic unit 106 then measures parameters on the selected input interface via signal path 126. Control logic unit 106 can modify the measured parameters based on the temperature of the fluid ejector wick and the desired temperature correlation (e.g., linear or nonlinear) to limit the analog parameters to a function of the fluid ejector wick temperature.

[0027] Control logic unit 106 can transmit analog parameters to multiplexer 130 via signal paths 132 and 134. Control logic unit 106 can provide signals on signal path 128 to multiplexer 130 to select analog parameters on signal paths 132 or 134 corresponding to control signals received on control interface 142. The selected analog parameters are then transmitted to output interface 108. Therefore, multiplexer 124 can select one of multiple input interfaces (i.e., 144 or 146) based on control signals on control interface 142. Multiplexer 130 can output one of multiple analog parameters on output interface 108 based on control signals on control interface 142.

[0028] Figure 3 This is a schematic diagram illustrating another example of an integrated circuit 200 used for simulating parameters. In one example, the integrated circuit 200 may be electrically coupled to the following reference. Figure 8A and Figure 8B The fluid injection core described herein will be referenced below. Figure 9 Between the described fluid jetting systems. Integrated circuit 200 may include analog multiplexers 202, 214, and 254, a programmable gain amplifier 206, an analog-to-digital converter (ADC) 210, voltage-mode digital-to-analog converters (DACs) 218, 244, and 258, a current-mode digital-to-analog converter (iDAC) 228, a transimpedance amplifier (TIA) 222, a sensor / parameter input measurement control logic unit 232, a thermal tracking logic unit 236, a sensor / parameter output multiplexer control logic unit 240, a digital potentiometer 248, and a transconductance amplifier (TCA) 250. Integrated circuit 200 may also include a dedicated sensing input interface 270 for receiving voltage parameters, a shared sensing input interface 272 for receiving any one of a plurality of parameters, a control bus input interface 274 for receiving a signal indicating a parameter to be simulated, a thermal sensing input interface 276 for receiving a temperature signal or a signal for estimating temperature, a dedicated sensing output interface 278 for outputting analog parameters, and a shared sensing output interface 280 for outputting any one of a plurality of analog parameters.

[0029] Dedicated sensing input interface 270 and shared sensing input interface 272 are electrically coupled to the input of analog multiplexer 202. The output of analog multiplexer 202 is electrically coupled to the input of programmable gain amplifier 206 via signal path 204. The output of programmable gain amplifier 206 is electrically coupled to the input of analog-to-digital converter 210 via signal path 208. The output of analog-to-digital converter 210 is electrically coupled to the input of sensor / parameter input measurement control logic unit 232 via signal path 212.

[0030] The output of sensor / parameter input measurement control logic unit 232 is electrically coupled to the input of current-mode digital-to-analog converter 228 via signal path 230. The output of current-mode digital-to-analog converter 228 is electrically coupled to the input of analog multiplexer 214 via signal path 216. Another output of sensor / parameter input measurement control logic unit 232 is electrically coupled to the input of transimpedance amplifier 222 and the input of voltage-mode digital-to-analog converter 218 via signal path 220. The output of voltage-mode digital-to-analog converter 218 is electrically coupled to another input of analog multiplexer 214 via signal path 216. The output of analog multiplexer 214 is electrically coupled to shared sense input interface 272. The output of transimpedance amplifier 222 is electrically coupled to the input of analog multiplexer 202 via signal path 224.

[0031] Sensor / parameter input measurement control logic unit 232 is electrically coupled to sensor / parameter output multiplexer control logic unit 240 via signal path 234. Control bus input interface 274 is electrically coupled to the input of thermal tracking logic unit 236 and the input of sensor / parameter output multiplexer control logic unit 240. Thermal sensing input interface 276 is electrically coupled to the input of thermal tracking logic unit 236 and the input of analog multiplexer 254. The output of thermal tracking logic unit 236 is electrically coupled to the input of sensor / parameter output multiplexer control logic unit 240 via signal path 238. Sensor / parameter output multiplexer control logic unit 240 is electrically coupled to the input of voltage-mode digital-to-analog converter 244 via signal path 242, to the control input of analog multiplexer 254 via signal path 252, and to the input of voltage-mode digital-to-analog converter 258 via signal path 256. The output of voltage-mode digital-to-analog converter 258 is electrically coupled to dedicated sensing output interface 278.

[0032] The output of the voltage-mode digital-to-analog converter 244 is electrically coupled to the input of the analog multiplexer 254, the control input of the digital potentiometer 248, and the input of the transconductance amplifier 250 via signal path 246. One side of the digital potentiometer 248 is electrically coupled to a common point or ground 247, and the other side of the digital potentiometer 248 is electrically coupled to the input of the analog multiplexer 254 via signal path 249. The output of the transconductance amplifier 250 is electrically coupled to the input of the analog multiplexer 254 via signal path 251. The output of the analog multiplexer 254 is electrically coupled to a shared sense output interface 280.

[0033] Analog multiplexer 202 passes a voltage input from one of the dedicated sense input interface 270, the shared sense input interface 272, or the transimpedance amplifier 222 to programmable gain amplifier 206. Programmable gain amplifier 206 can scale the output of analog multiplexer 202 to the input range of analog-to-digital converter 210. Analog-to-digital converter 210 generates an output code representing the input voltage. This code is passed to sensor / parameter input measurement control logic unit 232. In one example, analog-to-digital converter 210 is a 10-bit analog-to-digital converter. Sensor / parameter input measurement control logic unit 232 can pass the code from analog-to-digital converter 210 to sensor / parameter output multiplexer control logic unit 240.

[0034] The parameters to be simulated can be received for measurement on either the dedicated sensing input interface 270 or the shared sensing input interface 272. In this example, the dedicated sensing input interface 270 has voltage measurement capabilities for voltage parameters, while the shared sensing input interface 272 includes voltage, current, and resistance measurement capabilities for voltage, current, and resistance parameters. For voltage measurement, the voltage parameters received on the dedicated sensing input interface 207 or the shared sensing input interface 272 are passed to the analog multiplexer 202 and converted into codes representing voltage parameters by the analog-to-digital converter 210.

[0035] For current measurements, a voltage is applied to the shared sense input interface 272 via a voltage-mode digital-to-analog converter 218 and an analog multiplexer 214. The current flowing from the voltage-mode digital-to-analog converter 218 is converted into a voltage via a transimpedance amplifier 222. This voltage is then passed to an analog multiplexer 202 and converted into a code representing the current parameter by an analog-to-digital converter 210. For resistance measurements, a current is applied to the shared sense input interface 272 via a current-mode digital-to-analog converter 228 and an analog multiplexer 214. The resulting voltage on the shared sense input interface 272 is passed to an analog multiplexer 202 and converted into a code representing the resistance parameter by an analog-to-digital converter 210.

[0036] Thermal tracking logic unit 236 measures or estimates the temperature of the fluid ejector wick based on signals on control bus input interface 274 and thermal sensing input interface 276. Thermal tracking logic unit 236 transmits the measured or estimated temperature to sensor / parameter output multiplexer control logic unit 240. Sensor / parameter output multiplexer control logic unit 240, based on the measured or estimated temperature, signals on control bus input interface 274 indicating parameters to be simulated, and measurement parameters from sensor / parameter input measurement control logic unit 232 (i.e., for parameters to be referenced below),... Figure 6The adaptive system described herein, along with the desired thermal correlation, generates code corresponding to analog parameters. In one example, the code corresponding to the analog parameters is passed to a voltage-mode digital-to-analog converter 258, which converts the code into analog voltage parameters and outputs the analog voltage parameters on a dedicated sensing output interface 278. In another example, the voltage-mode digital-to-analog converter 258 can be replaced with a current-mode digital-to-analog converter to convert the code corresponding to the analog parameters into analog current parameters for output on the dedicated sensing output interface 278.

[0037] The code corresponding to the analog parameter can also be passed to a voltage-mode digital-to-analog converter 244, which converts the code into a voltage corresponding to the analog parameter. In this case, the analog parameter can be a voltage parameter, a current parameter, or a resistance parameter. Sensor / parameter output multiplexer control logic unit 240 controls analog multiplexer 254. In one example, analog multiplexer 254 passes the voltage corresponding to the analog parameter on signal path 246 to shared sense output interface 280 to provide an analog voltage parameter. In another example, analog multiplexer 254 passes the resistance from digital potentiometer 248 to shared sense output interface 280 to provide an analog resistance parameter, which is controlled by the voltage corresponding to the analog parameter on signal path 246. In yet another example, analog multiplexer 254 passes the current from transconductance amplifier 250 to shared sense output interface 280 to provide an analog current parameter, which is set by the voltage corresponding to the analog parameter on signal path 246. In another example, analog multiplexer 254 passes the temperature signal on thermal sensing input interface 276 to shared sensing output interface 280 to provide pass-through functionality for the temperature signal.

[0038] Although the sensor / parameter input measurement control logic unit 232, the thermal tracking logic unit 236, and the sensor / parameter output multiplexer control logic unit 240 are in Figure 3 The control logic components are shown as separate blocks, but in other examples, control logic components 232, 236, and 240 may be combined. Each control logic component block 232, 236, and 240, or a combination thereof, may be provided by a microprocessor, an ASIC, or other suitable logic circuitry for controlling the operation of integrated circuit 200.

[0039] Figure 4A and Figure 4B This is a flowchart illustrating an example of a method 300 for simulating parameters of a fluid jetting core. In one example, method 300 can be... Figure 1 Integrated circuit 100, Figure 2 Integrated circuit 120 or Figure 3 The integrated circuit 200 is implemented. For example... Figure 4A As illustrated, at 302, method 300 includes measuring the temperature of a fluid jet wick. In one example, measuring the temperature of the fluid jet wick includes measuring the temperature of the fluid jet wick via a temperature sensor external to the fluid jet wick. At 304, method 300 includes defining analog parameters of the fluid jet wick as a function of the measured temperature. In one example, the analog parameters include resistance, voltage, or current. At 306, method 300 includes outputting the analog parameters to a printer system based on the function and the measured temperature. In one example, outputting the analog parameters includes outputting the analog parameters via a voltage-mode digital-to-analog converter, a current-mode digital-to-analog converter, a transconductance amplifier, or a digital potentiometer.

[0040] like Figure 4B As illustrated, at 308, method 300 may further include measuring the parameters to be simulated in the fluid jet spool. In this case, defining the simulation parameters may include modifying the measured parameters based on the measured temperature to define the simulation parameters as a function of the measured temperature.

[0041] Figure 5 This is a flowchart illustrating another example of a method 350 for simulating parameters of a fluid jetting core. In one example, method 350 can be... Figure 1 Integrated circuit 100, Figure 2 Integrated circuit 120 or Figure 3 The integrated circuit 200 is implemented. At 352, method 350 includes estimating the temperature of the fluid jet dies based on a thermal model. In one example, estimating the temperature includes monitoring a thermal control loop that controls heating of the fluid jet dies. The thermal model can estimate the temperature based on whether heating of the fluid jet dies is enabled or disabled. At 354, method 350 includes defining analog parameters of the fluid jet dies as a function of the estimated temperature. In one example, the analog parameters include resistance, voltage, or current. At 356, method 350 includes outputting the analog parameters to a printer system based on the function and the estimated temperature. In one example, outputting the analog parameters includes outputting the analog parameters via a voltage-mode digital-to-analog converter, a current-mode digital-to-analog converter, a transconductance amplifier, or a digital potentiometer.

[0042] Figure 6 This is a flowchart illustrating another example of a method 400 for simulating parameters of a fluid jetting core. In one example, method 400 can be... Figure 1 Integrated circuit 100, Figure 2 Integrated circuit 120 or Figure 3Integrated circuit 200 is implemented. Method 400 is initialized at 402. In response to initialization, at 404, method 400 determines whether a thermal sensor for the fluid jet dies is enabled. In response that the thermal sensor is not enabled, method 400 waits and continues to check whether the thermal sensor is enabled. Once the thermal sensor is enabled, at 406, method 400 measures the temperature of the fluid jet dies.

[0043] At 408, method 400 determines whether the system is adaptive or non-adaptive. For example, a non-adaptive system is one in which the sensing input interface 270 or 272 ( Figure 3 The parameter to be simulated is not measured and is simulated based on an expected value relative to temperature (e.g., a lookup table output based on temperature) (e.g., via sensing output interface 278 or 280). For example, an adaptive system is such a system in which sensing input interface 270 or 272 receives the parameter to be simulated and the parameter is measured (e.g., via sensing input interface 270 or 272) and then modified based on temperature (e.g., via linear or nonlinear equations), and the parameter is simulated on sensing output interface 278 or 280.

[0044] In response to determining that the system is an adaptive system, at 410, method 400 measures the parameters to be simulated. In response to determining that the system is not an adaptive system or after measuring the parameters at 410, at 412, method 400 limits the simulation parameters such that the DAC function is equal to a function of temperature (T), i.e., DAC = F(T). This completes the initialization of the parameter simulation.

[0045] The remainder of method 400 describes thermal loop control. At 414, the DAC is set to the target code based on the measured temperature, i.e., DAC = F(T). At 416, method 400 determines whether the thermal sensor for the fluid ejector wick is enabled. In response to the thermal sensor not being enabled, method 400 waits and continues to check whether the thermal sensor is enabled. Once the thermal sensor is enabled, at 418, method 400 measures the temperature of the fluid ejector wick. At 414, method 400 sets the DAC to the target code based on the measured temperature. The thermal loop control of method 400 is then repeated at 416.

[0046] Figure 7 This is a flowchart illustrating another example of a method 500 for simulating parameters of a fluid jetting core. In one example, method 500 can be... Figure 1 Integrated circuit 100, Figure 2 Integrated circuit 120 or Figure 3 The integrated circuit 200 is implemented. Method 500 is initialized at 502. In response to the initialization, at 504, method 500 determines whether the system is an adaptive or non-adaptive system, as previously referenced above. Figure 6 As described. In response to determining that the system is an adaptive system, at 506, method 500 measures the parameters to be simulated. In response to determining that the system is not an adaptive system or after measuring the parameters at 506, at 508, method 500 limits the parameters such that the DAC function is equal to a function of temperature (T), i.e., DAC = F(T). This completes the initialization of the parameter simulation.

[0047] The remainder of method 500 describes thermal loop control. At 510, the DAC is set to the target code based on the estimated temperature, i.e., DAC = F(T). At 512, method 500 waits for the thermal time increment. At 514, method 500 determines whether heating of the fluid jet wick is enabled or disabled. In response to heating not being enabled, at 516, method 500 decreases the estimated temperature according to the thermal model. Then at 510, method 500 sets the DAC to the target code based on the decreased estimated temperature. In response to heating being enabled, at 518, method 500 increases the estimated temperature according to the thermal model. Then at 510, method 500 sets the DAC to the target code based on the increased estimated temperature. The thermal loop control of method 500 is then repeated at 512.

[0048] Figure 8A An example of a fluid injection core 600 is illustrated, and Figure 8B The illustration shows an enlarged view of the end of a fluid jet die 600. The die 600 includes a first row of contact pads 602, a second row of contact pads 604, and a row of 606 fluid actuators 608. The second row of contact pads 604 is aligned with and spaced a distance (i.e., along the Y-axis) from the first row of contact pads 602. This row of 606 fluid actuators 608 is arranged longitudinally relative to the first row of contact pads 602 and the second row of contact pads 604. This row of 606 fluid actuators 608 is also arranged between the first row of contact pads 602 and the second row of contact pads 604. In one example, the fluid actuator 608 is a nozzle or fluid pump for jetting droplets.

[0049] In one example, the first column of contact pads 602 includes six contact pads. The first column of contact pads 602 may sequentially include the following contact pads: data contact pad 610, clock contact pad 612, logic power ground loop contact pad 614, multipurpose input / output contact pad 616, first high-voltage power supply contact pad 618, and first high-voltage power ground loop contact pad 620. Therefore, the first column of contact pads 602 includes a data contact pad 610 at the top of the first column 602, a first high-voltage power ground loop contact pad 620 at the bottom of the first column 602, and a first high-voltage power supply contact pad 618 directly above the first high-voltage power ground loop contact pad 620. Although contact pads 610, 612, 614, 616, 618, and 620 are illustrated in a specific order, in other examples, the contact pads may be arranged in a different order.

[0050] In one example, the second column of contact pads 604 includes six contact pads. The second column of contact pads 604 may sequentially include the following contact pads: a second high-voltage power grounding loop contact pad 622, a second high-voltage power supply contact pad 624, a logic reset contact pad 626, a logic power supply contact pad 628, a mode contact pad 630, and an activation contact pad 632. Therefore, the second column of contact pads 604 includes the second high-voltage power grounding loop contact pad 622 at the top of the second column 604, the second high-voltage power supply contact pad 624 directly below the second high-voltage power grounding loop contact pad 622, and the activation contact pad 632 at the bottom of the second column 604. Although contact pads 622, 624, 626, 628, 630, and 632 are illustrated in a specific order, in other examples, the contact pads may be arranged in a different order.

[0051] Data contact pad 610 can be used to input serial data to die 600 for selecting fluid actuators, memory bits, thermal sensors, configuration modes (e.g., via a configuration register), etc. Data contact pad 610 can also be used to output serial data from die 600 for reading memory bits, configuration modes, status information (e.g., via a status register), etc. Clock contact pad 612 can be used to input a clock signal to die 600 to transfer serial data on data contact pad 610 to the die or to transfer serial data from the die to data contact pad 610. Logic power ground loop contact pad 614 provides a ground loop path for the logic power (e.g., approximately 0V) supplied to die 600. In one example, logic power ground loop contact pad 614 is electrically coupled to the semiconductor (e.g., silicon) substrate 640 of die 600. Multipurpose input / output contact pad 616 can be used for analog sensing and / or digital test modes of die 600. In one example, the multipurpose input / output contact pad 616 can be electrically coupled to... Figure 2 Input interface 144 or 146 or Figure 3 The sensing input interface is 270 or 272.

[0052] The first high-voltage power supply contact pad 618 and the second high-voltage power supply contact pad 624 can be used to supply high voltage (e.g., about 32V) to the die 600. The first high-voltage power grounding contact pad 620 and the second high-voltage power grounding contact pad 622 can be used to provide a power grounding circuit (e.g., about 0V) for the high-voltage power supply. The high-voltage power grounding contact pads 620 and 622 are not directly electrically connected to the semiconductor substrate 640 of the die 600. The specific contact pad sequence of the high-voltage power supply contact pads 618 and 624 and the high-voltage power grounding contact pads 620 and 622 as the innermost contact pads can improve the power delivery to the die 600. Having high-voltage power grounding contact pads 620 and 622 at the bottom of the first column 602 and the top of the second column 604, respectively, can improve manufacturing reliability and improve ink short-circuit protection.

[0053] The logic reset contact pad 626 can be used as a logic reset input to control the operating state of die 600. The logic power supply contact pad 628 can be used to supply logic power (e.g., between approximately 1.8V and 15V, such as 5.6V) to die 600. The mode contact pad 630 can be used as a logic input to control access, thereby enabling / disabling the configuration mode (i.e., functional mode) of die 600. The excitation contact pad 632 can be used as a logic input to latch loaded data from the data contact pad 610 and enable the fluid actuator or memory element of die 600.

[0054] Die 600 includes an elongated substrate 640 having a length 642 (along the Y-axis), a thickness 644 (along the Z-axis), and a width 646 (along the X-axis). In one example, the length 642 is at least twenty times the width 646. The width 646 may be 1 mm or less and the thickness 644 may be less than 500 micrometers. A fluid actuation device 608 (e.g., fluid actuation logic) and contact pads 610 to 632 are provided on the elongated substrate 640 and arranged along the length 642 of the elongated substrate. The fluid actuation device 608 has a strip length 652 that is less than the length 642 of the elongated substrate 640. In one example, the strip length 652 is at least 1.2 cm. The contact pads 610 to 632 may be electrically coupled to the fluid actuation logic. A first row of contact pads 602 may be arranged near a first longitudinal end 648 of the elongated substrate 640. The second row of contact pads 604 can be arranged near the second longitudinal end 650 of the elongated substrate 640, which is opposite to the first longitudinal end 648.

[0055] Figure 9This is a block diagram illustrating an example of a fluid jetting system 700. The fluid jetting system 700 includes fluid jetting components, such as a printhead assembly 702, and fluid supply components, such as an ink supply assembly 710. In the illustrated example, the fluid jetting system 700 also includes a service station assembly 704, a carriage assembly 716, a print media transport assembly 718, and an electronic controller 720. Although the following description provides examples of systems and components for fluid handling with respect to ink, the disclosed systems and components are also suitable for handling fluids other than ink.

[0056] Printhead assembly 702 includes the previously referenced Figure 8A and Figure 8B The description and illustration include at least one printhead or fluid jetting die 600 that ejects ink droplets or liquid droplets through a plurality of orifices or nozzles 608. In one example, the droplets are directed toward a medium, such as printing medium 724, for printing onto the printing medium 724. In one example, the printing medium 724 comprises any type of suitable sheet material, such as paper, cardstock, transparent film, polyester film, fabric, etc. In another example, the printing medium 724 comprises a medium for three-dimensional (3D) printing, such as a powder bed, or a medium for bioprinting and / or drug discovery testing, such as a reservoir or container. In one example, the nozzles 608 are arranged in at least one column or array such that properly ordered ejection of ink from the nozzles 608 results in characters, symbols, and / or other graphics or images being printed as printhead assembly 702 onto the printing medium 724 and the printing medium 724 moving relative to each other.

[0057] The ink supply assembly 710 supplies ink to the printhead assembly 702 and includes a reservoir 712 for storing the ink. Thus, in one example, ink flows from the reservoir 712 to the printhead assembly 702. In one example, the printhead assembly 702 and the ink supply assembly 710 are housed together in an inkjet or fluid jet printing cartridge or pen. In another example, the ink supply assembly 710 is separate from the printhead assembly 702 and supplies ink to the printhead assembly 702 via an interface connection 713 (such as a supply tube and / or valve).

[0058] The carriage assembly 716 positions the printhead assembly 702 relative to the print media transport assembly 718, and the print media transport assembly 718 positions the print media 724 relative to the printhead assembly 702. Therefore, the printing area 726 is defined as adjacent to the nozzle 608 in the region between the printhead assembly 702 and the print media 724. In one example, the printhead assembly 702 is a scanning type printhead assembly, such that the carriage assembly 716 moves the printhead assembly 702 relative to the print media transport assembly 718. In another example, the printhead assembly 702 is a non-scanning type printhead assembly, such that the carriage assembly 716 holds the printhead assembly 702 in a predetermined position relative to the print media transport assembly 718.

[0059] Service station assembly 704 provides ejection, wiping, capping, and / or filling of printhead assembly 702 to maintain the functionality of printhead assembly 702, and more specifically, nozzle 608. For example, service station assembly 704 may include a rubber blade or wiper that periodically passes over printhead assembly 702 to wipe and clean excess ink from nozzle 608. Additionally, service station assembly 704 may include a cap covering printhead assembly 702 to protect nozzle 608 from drying out during periods of non-use. Furthermore, service station assembly 704 may include an ink reservoir into which printhead assembly 702 ejects ink during ejection to ensure reservoir 712 maintains appropriate levels of pressure and flow, and to ensure nozzle 608 does not clog or leak. Functionality of service station assembly 704 may include relative movement between service station assembly 704 and printhead assembly 702.

[0060] The electronic controller 720 communicates with the printhead assembly 702 via communication path 703, with the service station assembly 704 via communication path 705, with the carriage assembly 716 via communication path 717, and with the print media transport assembly 718 via communication path 719. In one example, when the printhead assembly 702 is mounted in the carriage assembly 716, the electronic controller 720 and the printhead assembly 702 can communicate via the carriage assembly 716 via communication path 701. The electronic controller 720 can also communicate with the ink supply assembly 710, enabling the detection of new (or used) ink supplies in one embodiment.

[0061] The electronic controller 720 receives data 728 from a host system such as a computer and may include a memory for temporarily storing the data 728. The data 728 may be transmitted to the fluid jet system 700 along electronic, infrared, optical, or other information transmission paths. The data 728 represents, for example, a document and / or file to be printed. Therefore, the data 728 forms a print job for the fluid jet system 700 and includes at least one print job command and / or command parameters.

[0062] In one example, the electronic controller 720 provides control over the printhead assembly 702, including timing control for ejecting ink droplets from the nozzle 608. Therefore, the electronic controller 720 defines the pattern of the ejected ink droplets, which form characters, symbols, and / or other graphics or images on the print medium 724. The timing control, and thus the pattern of the ejected ink droplets, is determined by print job commands and / or command parameters. In one example, the logic and drive circuitry forming part of the electronic controller 720 is located on the printhead assembly 702. In another example, the logic and drive circuitry forming part of the electronic controller 720 is located outside the printhead assembly 702.

[0063] While specific examples have been illustrated and described herein, various alternatives and / or equivalent embodiments may be implemented in place of the specific examples shown and described without departing from the scope of this disclosure. This application is intended to cover any modifications or variations of the specific examples discussed herein. Therefore, this disclosure is intended to be limited only by the claims and their equivalents.

Claims

1. An integrated circuit, comprising: A thermal tracking logic component, the thermal tracking logic component being used to determine the temperature of the fluid injection core; An input interface is provided for measuring the parameters to be simulated in the fluid jetting core. A control logic unit, the control logic unit being configured to modify measured parameters based on the temperature of the fluid jet wick to limit the analog parameters of the fluid jet wick to a function of the temperature of the fluid jet wick, and An output interface is provided for outputting the analog parameters to the printer system based on the function and the temperature of the fluid jet core.

2. The integrated circuit as claimed in claim 1, wherein, The thermal tracking logic component is used to measure the temperature of the fluid jet spool.

3. The integrated circuit as claimed in claim 1, wherein, The thermal tracking logic component is used to estimate the temperature of the fluid jet spool based on a thermal model.

4. The integrated circuit as claimed in claim 1, wherein, The simulated parameters include resistance, voltage, or current.

5. The integrated circuit of claim 1, further comprising: A voltage-mode digital-to-analog converter, a current-mode digital-to-analog converter, a transconductance amplifier, or a digital potentiometer is used to output the analog parameters at the output interface.

6. The integrated circuit of claim 1, further comprising: Control interface; as well as A multiplexer for outputting one of a plurality of analog parameters on the output interface based on control signals on the control interface.

7. A method for simulating parameters of a fluid jet core, the method comprising: Measure the temperature of the fluid injection core; Measure the parameters to be simulated in the fluid jet core; The measured parameters are modified based on the measured temperature to limit the simulated parameters of the fluid jet core to a function of the measured temperature; as well as The simulated parameters are output to the printer system based on the function and the measured temperature.

8. The method of claim 7, wherein, Measuring the temperature of the fluid jet spool includes measuring the temperature of the fluid jet spool via a temperature sensor external to the fluid jet spool.

9. The method of claim 7, wherein, The simulated parameters include resistance, voltage, or current.

10. The method of claim 7, wherein, The analog parameters are output via a voltage-mode digital-to-analog converter, a current-mode digital-to-analog converter, a transconductance amplifier, or a digital potentiometer.

11. A method for simulating parameters of a fluid jetting core, the method comprising: The temperature of the fluid jet core is estimated based on a thermal model; Measure the parameters to be simulated in the fluid jet core; The measured parameters are modified based on the estimated temperature to limit the simulation parameters of the fluid jet core to a function of the estimated temperature; as well as The simulated parameters are output to the printer system based on the function and the estimated temperature.

12. The method of claim 11, wherein, The temperature estimation includes a thermal control loop that monitors and controls the heating of the fluid jet spool.

13. The method of claim 11, wherein, The thermal model estimates the temperature based on whether heating of the fluid jet spool is enabled or disabled.

14. The method of claim 11, wherein, The simulated parameters include resistance, voltage, or current.

15. The method of claim 11, wherein, The analog parameters are output via a voltage-mode digital-to-analog converter, a current-mode digital-to-analog converter, a transconductance amplifier, or a digital potentiometer.

Images