A multi-sensor temperature calibration method, apparatus, electronic device, and medium
By reading the memory identifier and initializing the ADC for temperature acquisition and calibration, the problem of heating plane consistency detection in multi-sensor temperature calibration is solved, achieving high-precision temperature control and wide applicability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SIKUN LIFE SCIENCE CO LTD
- Filing Date
- 2022-12-22
- Publication Date
- 2026-05-05
AI Technical Summary
Existing multi-sensor temperature calibration methods are inefficient, cannot achieve consistent detection of the heating plane of the device, and multiple measurements can easily lead to temperature inconsistencies.
By reading the memory identifier, the ADC is initialized to acquire temperature data, and the temperature data is calibrated based on the memory system configuration. High-precision fixed resistors and constant current sources are used to eliminate common-mode interference. High-precision ADCs are used for data acquisition and filtering to achieve consistent detection of the heating plane temperature.
It improves the accuracy of temperature data and the system's accuracy in temperature control, supports calibration of 1-20 temperature points, has a wide range of applications, low cost, and is suitable for microprocessors with different architectures.
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Figure CN115790722B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of sensor calibration, and more particularly to a multi-sensor temperature calibration method, apparatus, electronic device, and medium. Background Technology
[0002] With the development of technology, sensors are being used more and more widely. Currently, temperature calibration of sensors generally adopts single-point calibration, which only calibrates the temperature at a specific location. However, this method lacks the ability to detect the entire plane of the module under test. When calibrating a certain plane, multiple calibrations are required, which is inefficient and can easily lead to inconsistent heating surface temperatures. Therefore, how to detect the consistency of the heating plane of the device when calibrating multiple sensors has become an urgent problem to be solved. Summary of the Invention
[0003] In view of this, the present disclosure provides a sensor temperature calibration method, apparatus, electronic device, and medium suitable for multi-sensor temperature calibration. This method reads relevant data from internal storage, detects errors between different batches of the electronic control system, eliminates board errors by measuring a consistent high-precision fixed resistor, eliminates common-mode interference using a constant current source and a reference resistor, acquires data using a high-precision ADC, and filters the data to ensure the device operates in a specific state. This addresses the problem in the prior art where consistency detection of the heating plane of the device is impossible during multi-sensor calibration.
[0004] A first aspect of this disclosure provides a multi-sensor temperature calibration method, comprising: reading a memory identifier and writing the identifier into a memory system configuration; reading the memory system configuration after the identifier has been written; initializing an ADC and driving the ADC to perform temperature acquisition to obtain temperature data; and calibrating the temperature data based on the memory system configuration after the identifier has been written to obtain calibrated temperature data.
[0005] A second aspect of this disclosure provides a multi-sensor temperature calibration device, comprising: a first reading unit configured to read a memory identifier and write the identifier into a memory system configuration; a second reading unit configured to read the memory system configuration after the identifier is written; a data acquisition unit configured to initialize an ADC and drive the ADC to acquire temperature data; and a calibration unit configured to calibrate the temperature data based on the memory system configuration after the identifier is written, to obtain calibrated temperature data.
[0006] A third aspect of this disclosure provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the method described above.
[0007] A fourth aspect of this disclosure provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the above-described method.
[0008] The beneficial effects of this disclosed embodiment compared to the prior art are as follows: First, the memory identifier is read and written into the memory system configuration; then, the memory system configuration after the identifier is written is read; subsequently, the ADC is initialized and driven to perform temperature acquisition to obtain temperature data; finally, the temperature data is calibrated based on the memory system configuration after the identifier is written to obtain calibrated temperature data. This disclosed multi-sensor temperature calibration method employs flexible configuration, enabling the detection of errors between different batches of the electronic control system, calibration of sensors using a water bath to achieve consistent temperature detection of the heating plane, and calibration of the heating module based on the temperature data of the heating plane. Especially in the process of multi-sensor, multi-point temperature calibration, by flexibly configuring the sensor sampling positions, a single module can support the calibration of 1-20 temperature points, improving the accuracy of temperature data and the accuracy of the system in temperature control. Furthermore, this disclosed method can be implemented with a simple structure, has low cost, wide applicability, and can be applied to microprocessors of different architectures. Attached Figure Description
[0009] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0010] Figure 1 This is a schematic diagram of an application scenario of a multi-sensor temperature calibration method according to some embodiments of the present disclosure;
[0011] Figure 2 This is a flowchart of some embodiments of the multi-sensor temperature calibration method according to the present disclosure;
[0012] Figure 3 These are schematic diagrams of some embodiments of the multi-sensor temperature calibration device according to the present disclosure;
[0013] Figure 4This is a schematic diagram of the structure of an electronic device suitable for implementing some embodiments of the present disclosure. Detailed Implementation
[0014] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.
[0015] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.
[0016] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.
[0017] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".
[0018] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.
[0019] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.
[0020] Figure 1 This is a schematic diagram of an application scenario of a multi-sensor temperature calibration method according to some embodiments of the present disclosure.
[0021] exist Figure 1 In the application scenario, firstly, the computing device 101 can read the memory identifier 102 and write the identifier into the memory system configuration. Then, the computing device 101 can read the memory system configuration 103 after the identifier has been written. Next, the computing device 101 can initialize the ADC 104 and drive it to perform temperature acquisition, obtaining temperature data 105. Finally, based on the memory system configuration after the identifier has been written, the computing device 101 can calibrate the temperature data, obtaining calibrated temperature data 106.
[0022] It should be noted that the aforementioned computing device 101 can be either hardware or software. When the computing device 101 is hardware, it can be implemented as a distributed cluster consisting of multiple servers or terminal devices, or as a single server or a single terminal device. When the computing device 101 is software, it can be installed in the hardware devices listed above. It can be implemented as, for example, multiple software programs or software modules used to provide distributed services, or as a single software program or software module. No specific limitations are made here.
[0023] It should be understood that Figure 1 The number of computing devices shown is merely illustrative. Any number of computing devices can be used depending on implementation needs.
[0024] Figure 2 This is a flowchart of some embodiments of the multi-sensor temperature calibration method according to the present disclosure. Figure 2 Multi-sensor temperature calibration methods can be derived from Figure 1 The computing device 101 performs the operation. For example... Figure 2 As shown, the multi-sensor temperature calibration method includes:
[0025] Step 201: Read the storage identifier and write the identifier into the storage system configuration.
[0026] In some embodiments, the entity executing the multi-sensor temperature calibration method (e.g. Figure 1 The computing device 101 shown can read the memory identifier and write it into the memory system configuration by following these steps:
[0027] First, the aforementioned executing entity can read the first storage identifier of the first storage;
[0028] The second step is that the aforementioned execution entity can read the first fixed address data generated by the first storage;
[0029] Third, the aforementioned executing entity can determine whether the aforementioned first fixed address data and the aforementioned first memory identifier are the same;
[0030] Fourth, in response to the difference between the first fixed address data and the first memory identifier, the execution entity can read the calibration board data of the first memory; specifically, the calibration board is a known high-precision resistor;
[0031] Fifth step: In response to the abnormal calibration board data in the first storage, the execution entity can return to reread the calibration board data in the first storage.
[0032] Step 6: In response to the normal calibration board data of the first storage, the execution entity can obtain the control board error data of the first storage.
[0033] Step 7: The aforementioned executing entity can write the control board error data of the aforementioned first storage into the aforementioned first storage identifier;
[0034] Step 8: In response to the first fixed address data being the same as the first memory identifier or after the control board error data of the first memory is written into the first memory identifier, the execution entity can read the second memory identifier.
[0035] In the ninth step, the aforementioned execution entity can read the second fixed-address data generated by the second storage;
[0036] Step 10: The aforementioned executing entity can determine whether the aforementioned second fixed address data and the aforementioned second memory identifier are the same;
[0037] In the eleventh step, in response to the difference between the second fixed address data and the second memory identifier, the execution entity can perform sensor calibration;
[0038] In the twelfth step, in response to the second fixed address data and the second memory identifier being the same or the calibration being completed, the execution entity can write the second memory identifier into the memory system configuration.
[0039] In some optional implementations of certain embodiments, in response to the difference between the second fixed address data and the second memory identifier, the execution entity can perform sensor calibration through the following sub-steps: First sub-step: In response to the difference between the second fixed address data and the second memory identifier, the execution entity can read the first temperature acquisition point calibration data from the second memory; Second sub-step: Determine whether the first temperature acquisition point calibration data from the second memory is normal; Third sub-step: In response to the abnormal first temperature acquisition point calibration data from the second memory, the execution entity can reread the first temperature acquisition point calibration data from the second memory; Fourth sub-step: In response to the difference between the first fixed address data and the second memory identifier, the execution entity can reread the first temperature acquisition point calibration data from the second memory; If the temperature acquisition point calibration data is normal, the aforementioned execution entity can write the first temperature acquisition point calibration data from the second storage to the second storage identifier; in the fifth sub-step, the aforementioned execution entity can read the second temperature acquisition point calibration data from the second storage; in the sixth sub-step, the aforementioned execution entity can determine whether the second temperature acquisition point calibration data from the second storage is normal; in the seventh sub-step, in response to the second temperature acquisition point calibration data from the second storage being abnormal, the aforementioned execution entity can return to reread the second temperature acquisition point calibration data from the second storage; in the eighth sub-step, in response to the second temperature acquisition point calibration data from the second storage being normal, the aforementioned execution entity can write the first temperature acquisition point calibration data from the second storage to the second storage identifier. The calibration data of the second temperature acquisition point is written to the second storage identifier; in the ninth sub-step, the execution entity can read the calibration data of the third temperature acquisition point in the second storage; in the tenth sub-step, the execution entity can determine whether the calibration data of the third temperature acquisition point is normal; in the eleventh sub-step, in response to the third temperature acquisition point calibration data of the second storage being abnormal, the execution entity can return to reread the calibration data of the third temperature acquisition point in the second storage; in the twelfth sub-step, in response to the third temperature acquisition point calibration data of the second storage being normal, the execution entity can write the calibration data of the third temperature acquisition point in the second storage identifier; in the thirteenth sub-step, the above... The executing entity can read the calibration data of the fourth temperature acquisition point in the second storage; in the fourteenth sub-step, the executing entity can determine whether the calibration data of the fourth temperature acquisition point in the second storage is normal; in the fifteenth sub-step, in response to the fourth temperature acquisition point calibration data of the second storage being abnormal, the executing entity can return to reread the fourth temperature acquisition point calibration data of the second storage; in the sixteenth sub-step, in response to the fourth temperature acquisition point calibration data of the second storage being normal, the executing entity can write the fourth temperature acquisition point calibration data of the second storage into the second storage identifier; in the seventeenth sub-step, the executing entity can read the calibration data of the fifth temperature acquisition point in the second storage;In the eighteenth sub-step, the aforementioned executing entity can determine whether the calibration data of the fifth temperature acquisition point in the second storage is normal; in the nineteenth sub-step, in response to the abnormal calibration data of the fifth temperature acquisition point in the second storage, the aforementioned executing entity can return to reread the calibration data of the fifth temperature acquisition point in the second storage; in the twentieth sub-step, in response to the normal calibration data of the fifth temperature acquisition point in the second storage, the aforementioned executing entity can write the calibration data of the fifth temperature acquisition point in the second storage to the identifier of the second storage.
[0040] Step 202: Read the storage system configuration after writing the above identifier.
[0041] In some embodiments, the aforementioned execution entity may begin executing a temperature data acquisition program and read the storage system configuration written to the aforementioned identifier.
[0042] In some embodiments, the above-described storage system configuration includes: the number of temperature acquisition points and calibration data for each of the temperature acquisition points.
[0043] Step 203: Initialize the ADC. The aforementioned execution entity can drive the ADC to acquire temperature data.
[0044] In some embodiments, the above-mentioned ADC includes a first ADC and a second ADC.
[0045] In some embodiments, the ADC is initialized, and the aforementioned execution entity can drive the ADC to acquire temperature data through the following steps:
[0046] First, the execution entity can initialize the first ADC and the second ADC to generate data acquisition signals. Specifically, the execution entity can initialize the first ADC for chip configuration, data filtering, etc., and initialize the second ADC for chip configuration, data filtering, etc.
[0047] The second step involves, based on the aforementioned data acquisition signals, driving the first ADC and the second ADC to synchronously acquire temperature data for each temperature point. Specifically, the execution entity can generate a data acquisition synchronization signal to drive the first ADC and the second ADC to perform synchronous acquisition, and drive the first ADC and the second ADC to sequentially acquire temperature data according to the number of temperature points configured in the storage system. For example, the maximum number of temperature points can be set to 20.
[0048] In some optional implementations of certain embodiments, the above method may further include: the execution entity may perform data filtering processing on the collected temperature data.
[0049] Step 204: Based on the storage system configuration after writing the above identifier, calibrate the above temperature data to obtain calibrated temperature data.
[0050] In some embodiments, based on the storage system configuration after the identifier is written, the execution entity can calibrate the temperature data to obtain calibrated temperature data. Specifically, based on the storage system configuration after the identifier is written, the execution entity can acquire calibration data for each temperature acquisition point, calibrate the temperature data to improve temperature accuracy, and obtain calibrated temperature data.
[0051] In some optional implementations of certain embodiments, the method further includes: based on the calibrated temperature data, the execution entity can calibrate the heating module. Specifically, based on the calibrated temperature data, the execution entity can determine the temperature uniformity of the heating plane and calibrate the heating module according to the calibrated temperature data.
[0052] In some embodiments, the multi-sensor temperature calibration method of this disclosure is mainly executed by a control device and a control terminal. The control device includes a temperature acquisition board and a temperature main control board, which are connected by a flexible printed circuit board (FPCB). The temperature acquisition board includes 14 temperature sensors for data acquisition; for example, thermocouples can be used as temperature sensors. The temperature main control board processes the data acquired by the temperature sensors, converts the acquired data into temperature data, and then enables the communication interface to upload the temperature data to the control terminal. The control terminal receives and processes the temperature data, including issuing control commands. For example, the control commands include, but are not limited to, commands to enable temperature data upload and commands to send temperature calibration data to the temperature main control board. The control terminal mainly includes a microcontroller (MCU), an analog-to-digital converter (ADC), a communication module, and a power supply module. The MCU and the ADC are connected via SPI.
[0053] The beneficial effects of this disclosed embodiment compared with the prior art are as follows: First, the memory identifier is read and written into the memory system configuration; then, the memory system configuration after the identifier is written is read; after that, the ADC is initialized and driven to perform temperature acquisition to obtain temperature data; finally, the temperature data is calibrated based on the memory system configuration after the identifier is written to obtain calibrated temperature data. The multi-sensor temperature calibration method of this disclosure adopts flexible configuration, can detect errors between different batches of the electronic control system, calibrates the sensors through a water bath to achieve consistent temperature detection of the heating plane, and calibrates the heating module based on the temperature data of the heating plane. Especially in the process of multi-sensor multi-point temperature calibration, by flexibly configuring the sensor sampling positions, a single module can support the calibration of 1-20 temperature points, improving the accuracy of temperature data and the accuracy of the system in temperature control. Furthermore, the method of this disclosure can be implemented with a simple structure, has low cost, wide applicability, and can be applied to microprocessors of different architectures.
[0054] All of the above-mentioned optional technical solutions can be combined in any way to form the optional embodiments of this application, and will not be described in detail here.
[0055] The following are embodiments of the apparatus disclosed herein, which can be used to execute embodiments of the method disclosed herein. For details not disclosed in the apparatus embodiments of this disclosure, please refer to the embodiments of the method disclosed herein.
[0056] Figure 3 These are schematic diagrams illustrating the structure of some embodiments of the multi-sensor temperature calibration device according to this disclosure. For example... Figure 3 As shown, the multi-sensor temperature calibration device includes: a first reading unit 301, a second reading unit 302, a data acquisition unit 303, and a calibration unit 304. The first reading unit 301 is configured to read a memory identifier and write it into the memory system configuration; the second reading unit 302 is configured to read the memory system configuration after the identifier has been written; the data acquisition unit 303 is configured to initialize an ADC and drive the ADC to acquire temperature data; and the calibration unit 304 is configured to calibrate the temperature data based on the memory system configuration after the identifier has been written, to obtain calibrated temperature data.
[0057] In some optional implementations of certain embodiments, the first reading unit 301 of the multi-sensor temperature calibration device is further configured to: read a first memory identifier of a first memory; read first fixed address data generated by the first memory; determine whether the first fixed address data and the first memory identifier are the same; in response to the first fixed address data and the first memory identifier being different, read calibration board data of the first memory; in response to the calibration board data of the first memory being abnormal, return to reread the calibration board data of the first memory; in response to the calibration board data of the first memory being normal, obtain the control board error of the first memory. Data; write the control board error data of the first storage to the first storage identifier; in response to the first fixed address data being the same as the first storage identifier or after the control board error data of the first storage is written to the first storage identifier, read the second storage identifier; read the second fixed address data generated by the second storage; determine whether the second fixed address data and the second storage identifier are the same; in response to the second fixed address data and the second storage identifier being different, perform sensor calibration; in response to the second fixed address data being the same as the second storage identifier or calibration being completed, write the second storage identifier to the storage system configuration.
[0058] In some optional implementations of certain embodiments, the sensor calibration performed in response to the difference between the second fixed address data and the second memory identifier includes: reading the first temperature acquisition point calibration data of the second memory in response to the difference between the second fixed address data and the second memory identifier; determining whether the first temperature acquisition point calibration data of the second memory is normal; rereading the first temperature acquisition point calibration data of the second memory in response to the abnormality of the first temperature acquisition point calibration data of the second memory; writing the first temperature acquisition point calibration data of the second memory to the second memory identifier in response to the normality of the first temperature acquisition point calibration data of the second memory; reading the second temperature acquisition point calibration data of the second memory; determining whether the second temperature acquisition point calibration data of the second memory is normal; returning to rereading the second temperature acquisition point calibration data of the second memory in response to the abnormality of the second temperature acquisition point calibration data of the second memory; writing the second temperature acquisition point calibration data of the second memory to the second memory identifier in response to the normality of the second temperature acquisition point calibration data of the second memory; reading the third temperature acquisition point calibration data of the second memory; and determining the third temperature acquisition point calibration data. If the calibration data of the third temperature acquisition point in the second storage is abnormal, return to read the calibration data of the third temperature acquisition point in the second storage again; if the calibration data of the third temperature acquisition point in the second storage is normal, write the calibration data of the third temperature acquisition point in the second storage to the second storage identifier; read the calibration data of the fourth temperature acquisition point in the second storage; determine if the calibration data of the fourth temperature acquisition point in the second storage is normal; if the calibration data of the fourth temperature acquisition point in the second storage is abnormal, return to read the calibration data of the fourth temperature acquisition point in the second storage again; if the calibration data of the fourth temperature acquisition point in the second storage is normal, write the calibration data of the fourth temperature acquisition point in the second storage to the second storage identifier; read the calibration data of the fifth temperature acquisition point in the second storage; determine if the calibration data of the fifth temperature acquisition point in the second storage is normal; if the calibration data of the fifth temperature acquisition point in the second storage is abnormal, return to read the calibration data of the fifth temperature acquisition point in the second storage again; if the calibration data of the fifth temperature acquisition point in the second storage is normal, write the calibration data of the fifth temperature acquisition point in the second storage to the second storage identifier.
[0059] In some alternative implementations of some embodiments, the above-described storage system configuration includes: the number of temperature acquisition points and calibration data for each of the temperature acquisition points.
[0060] In some alternative implementations of certain embodiments, the above-described ADC includes a first ADC and a second ADC.
[0061] In some optional implementations of some embodiments, the acquisition unit 303 of the multi-sensor temperature calibration device is further configured to: initialize the first ADC and the second ADC to generate a data acquisition signal; and drive the first ADC and the second ADC to synchronously acquire temperature data at each temperature point based on the data acquisition signal.
[0062] In some alternative implementations of some embodiments, the multi-sensor temperature calibration device may be further configured to calibrate the heating module based on the calibrated temperature data described above.
[0063] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this disclosure.
[0064] The following is for reference. Figure 4 It illustrates electronic devices suitable for implementing some embodiments of this disclosure (e.g., Figure 1 A schematic diagram of the structure of the computing device 101)400. Figure 4 The server shown is merely an example and should not be construed as limiting the functionality and scope of the embodiments of this disclosure.
[0065] like Figure 4 As shown, electronic device 400 may include a processing device (e.g., a central processing unit, a graphics processor, etc.) 401, which can perform various appropriate actions and processes according to a program stored in read-only memory (ROM) 402 or a program loaded from storage device 408 into random access memory (RAM) 403. RAM 403 also stores various programs and data required for the operation of electronic device 400. Processing device 401, ROM 402, and RAM 403 are interconnected via bus 404. Input / output (I / O) interface 405 is also connected to bus 404.
[0066] Typically, the following devices can be connected to I / O interface 405: input devices 406 including, for example, touchscreens, touchpads, keyboards, mice, cameras, microphones, accelerometers, gyroscopes, etc.; output devices 407 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 408 including, for example, magnetic tapes, hard disks, etc.; and communication devices 409. Communication device 409 allows electronic device 400 to communicate wirelessly or wiredly with other devices to exchange data. Although Figure 4 An electronic device 400 with various devices is shown; however, it should be understood that it is not required to implement or possess all of the devices shown. More or fewer devices may be implemented or possessed alternatively. Figure 4 Each box shown can represent a device or multiple devices as needed.
[0067] In particular, according to some embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, some embodiments of this disclosure include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication device 409, or installed from storage device 408, or installed from ROM 402. When the computer program is executed by processing device 401, it performs the functions defined above in the methods of some embodiments of this disclosure.
[0068] It should be noted that, in some embodiments of this disclosure, the computer-readable medium described above may be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable storage medium may be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In some embodiments of this disclosure, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In some embodiments of this disclosure, a computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (radio frequency), etc., or any suitable combination thereof.
[0069] In some implementations, clients and servers can communicate using any currently known or future-developed network protocol such as HTTP (Hypertext Transfer Protocol) and can interconnect with digital data communication (e.g., communication networks) of any form or medium. Examples of communication networks include local area networks (“LANs”), wide area networks (“WANs”), the Internet (e.g., the Internet of Things), and peer-to-peer networks (e.g., ad hoc peer-to-peer networks), as well as any currently known or future-developed networks.
[0070] The aforementioned computer-readable medium may be included in the aforementioned device; or it may exist independently and not assembled into the electronic device. The aforementioned computer-readable medium carries one or more programs that, when executed by the electronic device, cause the electronic device to: read a memory identifier and write the identifier into a memory system configuration; read the memory system configuration after the identifier has been written; initialize the ADC and drive the ADC to perform temperature acquisition to obtain temperature data; and calibrate the temperature data based on the memory system configuration after the identifier has been written to obtain calibrated temperature data.
[0071] Computer program code for performing operations of some embodiments of this disclosure can be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, and C++, and conventional procedural programming languages such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).
[0072] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.
[0073] The units described in some embodiments of this disclosure can be implemented in software or in hardware. The described units can also be housed in a processor; for example, a processor may be described as including a first reading unit, a second reading unit, an acquisition unit, and a calibration unit. The names of these units do not necessarily limit the specific unit; for example, the first reading unit may also be described as "a unit that reads a memory identifier and writes the identifier into the memory system configuration."
[0074] The functions described above in this document can be performed, at least in part, by one or more hardware logic components. For example, exemplary types of hardware logic components that can be used, without limitation, include: Field Programmable Gate Arrays (FPGAs), Application-Specific Integrated Circuits (ASICs), Application Standard Products (ASSPs), System-on-Chip (SoCs), Complex Programmable Logic Devices (CPLDs), and so on.
[0075] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.
Claims
1. A multi-sensor temperature calibration method, characterized in that, include: Read the storage identifier and write the identifier into the storage system configuration; The storage includes a first storage and a second storage, and the step of reading the storage identifier and writing the identifier into the storage system configuration includes: Read the first memory identifier of the first memory; Read the first fixed-address data generated by the first memory; Determine whether the first fixed address data and the first memory identifier are the same; In response to the difference between the first fixed address data and the first memory identifier, the calibration board data of the first memory is read; In response to the abnormal calibration board data in the first storage, return to reread the calibration board data in the first storage; In response to the calibration board data of the first memory being normal, the control board error data of the first memory is acquired; Write the control board error data of the first memory into the first memory identifier; In response to the first fixed address data being the same as the first memory identifier, or after the control board error data in the first memory is written to the first memory identifier, the second memory identifier is read; Read the data generated at the second fixed address in the second memory; Determine whether the second fixed address data and the second memory identifier are the same; Sensor calibration is performed in response to the difference between the second fixed address data and the second memory identifier; In response to the second fixed address data and the second memory identifier being the same or calibration being completed, the second memory identifier is written into the memory system configuration; Read the storage system configuration after the identifier has been written; Initialize the ADC and drive it to acquire temperature data at each acquisition point. The temperature data is calibrated based on the storage system configuration after the identifier is written, and the calibrated temperature data is obtained. The storage system configuration includes the number of temperature acquisition points and the calibration data for each temperature acquisition point.
2. The multi-sensor temperature calibration method according to claim 1, characterized in that, The sensor calibration in response to the difference between the second fixed address data and the second memory identifier includes: In response to the difference between the second fixed address data and the second memory identifier, the calibration data of the first temperature acquisition point in the second memory is read; Determine whether the calibration data of the first temperature acquisition point of the second storage is normal; In response to the abnormal calibration data of the first temperature acquisition point in the second storage, the calibration data of the first temperature acquisition point in the second storage is reread; In response to the normal calibration data of the first temperature acquisition point of the second storage, the calibration data of the first temperature acquisition point of the second storage is written into the second storage identifier; Read the calibration data of the second temperature acquisition point from the second storage device; Determine whether the calibration data of the second temperature acquisition point of the second storage is normal; In response to the abnormal calibration data of the second temperature acquisition point in the second storage, return to reread the calibration data of the second temperature acquisition point in the second storage; In response to the second temperature acquisition point calibration data of the second storage being normal, the second temperature acquisition point calibration data of the second storage is written to the second storage identifier; Read the calibration data from the third temperature acquisition point in the second storage device; Determine whether the calibration data of the third temperature acquisition point is normal; In response to the abnormal calibration data of the third temperature acquisition point in the second storage, return to reread the calibration data of the third temperature acquisition point in the second storage; In response to the normal calibration data of the third temperature acquisition point of the second storage, the calibration data of the third temperature acquisition point of the second storage is written into the second storage identifier; Read the calibration data from the fourth temperature acquisition point in the second storage; Determine if the calibration data of the fourth temperature acquisition point of the second storage is normal; In response to the abnormal calibration data of the fourth temperature acquisition point in the second storage, return to reread the calibration data of the fourth temperature acquisition point in the second storage; In response to the normal calibration data of the fourth temperature acquisition point in the second storage, the calibration data of the fourth temperature acquisition point in the second storage is written to the second storage identifier; Read the calibration data from the fifth temperature acquisition point in the second storage device; Determine if the calibration data of the fifth temperature acquisition point of the second storage device is normal; In response to the abnormal calibration data of the fifth temperature acquisition point in the second storage, return to reread the calibration data of the fifth temperature acquisition point in the second storage; In response to the normal calibration data of the fifth temperature acquisition point in the second storage, the calibration data of the fifth temperature acquisition point in the second storage is written to the identifier of the second storage.
3. The multi-sensor temperature calibration method according to claim 1, characterized in that, The ADC includes a first ADC and a second ADC.
4. The multi-sensor temperature calibration method according to claim 3, characterized in that, The initialization of the ADC and the driving of the ADC to perform temperature acquisition to obtain temperature acquisition data include: Initialize the first ADC and the second ADC to generate a data acquisition signal; Based on the data acquisition signal, the first ADC and the second ADC are driven to synchronously acquire temperature data at each temperature point.
5. The multi-sensor temperature calibration method according to claim 1, characterized in that, The method further includes: Based on the calibrated temperature data, the heating module is calibrated and set.
6. A multi-sensor temperature calibration device, characterized in that, include: A first reading unit is configured to read a memory identifier and write the identifier into a memory system configuration; wherein the memory includes a first memory and a second memory, and reading the memory identifier and writing the identifier into the memory system configuration includes: Read the first memory identifier of the first memory; Read the first fixed-address data generated by the first memory; Determine whether the first fixed address data and the first memory identifier are the same; In response to the difference between the first fixed address data and the first memory identifier, the calibration board data of the first memory is read; In response to the abnormal calibration board data in the first storage, return to reread the calibration board data in the first storage; In response to the calibration board data of the first memory being normal, the control board error data of the first memory is acquired; Write the control board error data of the first memory into the first memory identifier; In response to the first fixed address data being the same as the first memory identifier, or after the control board error data in the first memory is written to the first memory identifier, the second memory identifier is read; Read the data generated at the second fixed address in the second memory; Determine whether the second fixed address data and the second memory identifier are the same; Sensor calibration is performed in response to the difference between the second fixed address data and the second memory identifier; In response to the second fixed address data and the second memory identifier being the same or calibration being completed, the second memory identifier is written into the memory system configuration; The second read unit is configured to read the memory system configuration after the identifier is written; The acquisition unit is configured to initialize the ADC and drive the ADC to acquire temperature data at each acquisition point. The calibration unit is configured to calibrate the temperature data based on the storage system configuration written with the identifier, and obtain calibrated temperature data. The storage system configuration includes the number of temperature acquisition points and the calibration data for each temperature acquisition point.
7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method as described in any one of claims 1 to 5.
8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1 to 5.
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