Temperature and pressure sensors

Abstract

A temperature and pressure sensor comprises: a housing; a top cover that, together with the housing, encloses a working chamber; a pressure-sensitive assembly disposed within the working chamber and dividing the working chamber into a sealed chamber and a sensing chamber, comprising a printed circuit board and a pressure core disposed on the front side of the printed circuit board and electrically connected to the printed circuit board; a pressure connector tube with one end sealedly connected to the sensing chamber; a temperature-sensitive assembly comprising a temperature-sensitive element and a plurality of second fisheye pins embedded and fixed within the housing, the first ends of the second fisheye pins being inserted upwardly into metal holes provided in the printed circuit board and electrically connected to the printed circuit board through the metal holes; the temperature-sensitive element being fixed to the lower portion of the inner chamber of the pressure connector tube; a plurality of lead terminals of the temperature-sensitive element extending upwardly and connected to the second ends of the second fisheye pins; a terminal button connected to the housing; and a plurality of third fisheye pins. The sensor has a simple structure and significantly reduces costs.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a temperature and pressure sensor. Background Art

[0002] A pressure sensor is a sensor used to measure the pressure of an environment or medium. Currently, it is mostly implemented through MEMS (micro-electromechanical systems), which measures pressure through the piezoresistive effect of semiconductor silicon. The middle part of the silicon core is configured as a diaphragm. The pressure applied to the silicon diaphragm from both sides causes the resistance of the doped resistors on the silicon diaphragm to change. The current or voltage signal output by the measurement circuit composed of several connected resistors can be further processed by the conditioning circuit and output as the measurement result. When a vacuum cavity is set on one side of the diaphragm in the silicon chip, the measured pressure is the pressure applied on the other side relative to the vacuum pressure, that is, the absolute pressure; when atmospheric pressure is introduced on one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, that is, the gauge pressure; when other pressures are introduced on both sides of the diaphragm, the measured pressure is the difference between the pressures on both sides, that is, the differential pressure.

[0003] A pressure sensor that is combined with a temperature sensing component can be called a temperature pressure sensor. Known temperature pressure sensors usually use thermistors to measure the temperature of the medium to be measured. The characteristics of the temperature pressure sensor are that the medium channel needs to be connected to the pressure chip to measure the pressure of the fluid to be measured, and at the same time, there is no need to set a thermistor circuit inside the medium channel to measure the temperature. In order to prevent the thermistor from obstructing the medium channel and to fix the connection terminals of the thermistor circuit, some use an intermediate seat plate to fix the end of the thermistor, and connect the connection terminal to the flexible circuit board by connecting the probe that passes through the intermediate seat downward, and the pin for outputting the signal to the outside is connected to the flexible circuit board, such as CN115127722A. This structure also requires the connection terminal to be fixed by an auxiliary structure. Therefore, its structure is relatively complex and the cost is relatively high.

[0004] The statements in this section above merely provide background information related to the present application and may not constitute prior art. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present application provides a temperature and pressure sensor to simplify its structure and reduce costs.

[0006] To achieve the above objectives, the present application provides the following technical solution: a temperature and pressure sensor, comprising:

[0007] case;

[0008] a top cover which, together with the shell, encloses a working chamber;

[0009] a pressure-sensitive component disposed in the working chamber and dividing the working chamber into a sealed chamber and a sensing chamber, comprising a printed circuit board and a pressure core disposed on a front side of the printed circuit board and electrically connected to the printed circuit board;

[0010] A pressure joint tube having one end sealedly connected to the sensing cavity;

[0011] The temperature sensitive component includes a temperature sensitive element and a plurality of second fisheye pins embedded and fixed in the housing. The first ends of the second fisheye pins are inserted upward and fixed in metal holes provided in the printed circuit board and are electrically connected to the printed circuit board through the metal holes. The temperature sensitive element is fixed to the lower portion of the inner cavity of the pressure joint tube. The plurality of lead terminals of the temperature sensitive element extend upward and are connected to the second ends of the second fisheye pins.

[0012] A terminal connected to the housing;

[0013] and a plurality of third fisheye pins, one end of which is electrically connected to the printed circuit board, and the other end of which passes through the shell and extends to the inside of the terminal button.

[0014] Preferably, an accommodating cavity is provided between the pressure sensitive component and the housing, and the lead terminal and the second end of the second fisheye pin are arranged in the accommodating cavity.

[0015] Preferably, one end of the lead-out terminal away from the temperature sensitive element passes through the terminal through-hole provided in the housing in a one-to-one correspondence upwards and is then welded to the second end of the second fisheye pin.

[0016] Preferably, the second end of the second fisheye pin is arranged horizontally.

[0017] Preferably, the second end of the second fisheye pin is supported on a corresponding supporting plane formed on the inner wall of the housing.

[0018] Preferably, the temperature sensitive component further comprises:

[0019] printed circuit boards;

[0020] A ceramic circuit board bonded to the front side of the printed circuit board, the printed circuit board being electrically connected to a pad provided on the ceramic circuit board via a conductor, and a conditioning element being provided on the back side of the printed circuit board;

[0021] A pressure core fixed to the front surface of the ceramic circuit board, which is electrically connected to the solder pad via a conductor;

[0022] and a core protection cover, which is fixed to the front side of the printed circuit board and the pressure core is located in a glue filling hole opened on it, and the glue filling hole is filled with a first protective glue; the edge of the positive side end face of the glue filling hole protrudes toward the positive side to form a circle of positioning flange, and the inner side of the positioning flange is correspondingly formed with a positioning groove; the upper end of the pressure joint tube protrudes upward near the center to form a protruding positioning part, and the edge of the upper end of the pressure joint tube is correspondingly formed with a groove; the protruding positioning part is inserted upward into the positioning groove, and the positioning flange is inserted downward into the groove, and the groove is filled with sealing adhesive.

[0023] Preferably, the accommodating cavity is communicated with the groove, and the upper end of the lead terminal passes through the groove and the accommodating cavity in sequence after passing through the tube wall of the pressure joint tube upward.

[0024] Preferably, the core protection cover includes a cover plate and a circle of first skirt wall formed by the edge of the cover plate protruding vertically toward the back side; the cover plate is provided with glue injection holes and glue filling holes, and the back side periphery of the glue filling hole protrudes toward the back side to form a circle of second skirt wall; the back side end face of the second skirt wall is located on the positive side of the back side end face of the first skirt wall; the back side end face of the second skirt wall is sealed and fixed on the front side end face of the ceramic circuit board, and the back side end face of the first skirt wall is sealed and fixed on the front side end face of the printed circuit board; a glue filling cavity is surrounded by the second skirt wall, the first skirt wall and the printed circuit board, the conductor is located in the glue filling cavity, and the glue filling cavity is filled with a second protective glue.

[0025] Preferably, the front side end surface of the glue filling hole is located on the positive side of the front side end surface of the glue injection hole.

[0026] Preferably, the positive end surface of the glue-filling hole protrudes toward the positive side to form a circle of positioning flange, and the inner side of the positioning flange forms a positioning groove accordingly.

[0027] The temperature and pressure sensor of the present application connects the temperature sensitive component and the pin to the printed circuit board through the second fisheye pin and the third fisheye pin embedded in the shell, respectively. Its structure is simple and the cost is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A perspective view of a temperature and pressure sensor according to a preferred embodiment of the present application;

[0029] Figure 2 A top view of a temperature and pressure sensor according to a preferred embodiment of the present application;

[0030] Figure 3 A temperature and pressure sensor according to a preferred embodiment of the present invention is provided. Figure 2 A cross-sectional view of AA shown in FIG;

[0031] Figure 4A three-dimensional diagram of a partial structure of a temperature and pressure sensor according to a preferred embodiment of the present application;

[0032] Figure 5 The partial structure of the temperature and pressure sensor of a preferred embodiment of the present application is along Figure 2 A cross-sectional view of BB shown in ;

[0033] Figure 6 A perspective view of a pressure-sensitive component according to a preferred embodiment of the present application;

[0034] Figure 7 A top view of a pressure sensitive component according to a preferred embodiment of the present application;

[0035] Figure 8 The pressure sensitive component of a preferred embodiment of the present application is along Figure 7 A cross-sectional view of CC shown in ;

[0036] Figure 9 A bottom view of a core protection cover according to a preferred embodiment of the present application;

[0037] Figure 10 The core protection cover of a preferred embodiment of the present application is Figure 8 A cross-sectional view of DD shown in ;

[0038] Figure 11 A three-dimensional diagram of a core protection cover according to a preferred embodiment of the present application;

[0039] Figure 12 A three-dimensional diagram of a core protection cover from another perspective of a preferred embodiment of the present application;

[0040] In the figure: 1. pressure sensitive component; 10. core protection cover; 100. cover plate; 101. first skirt wall; 102. second skirt wall; 103. positioning flange; 104. first positioning portion; 105. second positioning portion; 10a. glue injection hole; 01a. glue filling cavity; 10b. glue filling hole; 10c. positioning groove; 10d. top end surface; 10e. first positioning surface; 10f. second positioning surface; 10g. clearance opening; 11. pressure core; 12. printed circuit board; 13. ceramic circuit board; 14. conditioning element; 15. conductor; 16. sealing cover; 17. first protective glue; 18. second protective glue; 2. housing; 21. cover Body sealing groove; 3. Pressure joint tube; 30. Pressure channel; 31. First window; 33. Adhesive sealant; 34. Second window; 35. Lower tube wall; 36. Sealing ring groove; 37. Protruding positioning portion; 4. Terminal button; 41. Guide portion; 5. Sealing ring; 6. Temperature sensitive component; 64. Groove; 60. Terminal through hole; 61. Temperature sensitive element; 62. Lead terminal; 65. Support plane; 71. First fisheye pin; 72. Second fisheye pin; 73. Third fisheye pin; 8. Top cover; 81. Plate body; 82. Sealing flange; 9. Mounting portion; 91. Bushing; 120. Metal hole; 66. Second end; 67. Accommodation cavity. DETAILED DESCRIPTION

[0041] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The following embodiments are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. In the following description, the same reference numerals are used to represent the same or equivalent elements, and repeated descriptions are omitted.

[0042] In the description of this application, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0043] In addition, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] It should be further understood that the term “and / or” used in this specification and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

[0045] like Figures 1 to 5 As shown. The temperature and pressure sensor of the present application includes a housing (unmarked), a pressure sensitive component 1, a pressure connector tube 3, a temperature sensitive component 6 and a terminal button 4. The housing can be composed of a shell 2 and a top cover 8, and the top cover 8 and the shell 2 together form a working chamber. The top cover 8 can include a plate body 81 and a sealing flange 82 formed by the edge of the plate body 81 protruding downward. In order to facilitate the combined seal between the top cover 8 and the shell 2, the upper end of the shell 2 can be provided with a cover body sealing groove 21, and the sealing flange 82 extends into the cover body sealing groove 21, and the cover body sealing groove 21 is filled with a sealing adhesive.

[0046] The pressure sensitive component 1 is disposed in the working chamber and divides the working chamber into a sealed chamber and a sensing chamber. The pressure sensitive component 1 includes at least a printed circuit board 12 and a pressure core 11 disposed on the front side of the printed circuit board 12 and electrically connected to the printed circuit board 12 .

[0047] The upper end of the pressure connector tube 3 is sealedly connected to the sensing cavity, allowing the measured medium to act on a pressure-sensing surface of the pressure core 11 through the lumen (pressure channel 30) of the pressure connector tube 3. A sealing ring groove 36 may be provided on the outer wall of the pressure connector tube 3, and a sealing ring 5 is disposed within the sealing ring groove 36 to provide a seal when docking with the container of the measured medium.

[0048] The temperature-sensing assembly 6 includes a temperature-sensing element 61 and a plurality of second fisheye pins 72 embedded and fixed within the housing 2. The temperature-sensing element 61 is fixed to the lower portion of the inner cavity of the pressure connector tube 3. The plurality of lead terminals 62 of the temperature-sensing element 61 extend upward and connect to the second ends 66 of the second fisheye pins 72. A plurality of third fisheye pins 73 have one end electrically connected to the printed circuit board 12, and their other ends extend through the housing 2 into the interior of the terminal 4. The terminal 4 may be provided with a horizontally extending guide 41 to facilitate guidance during electrical connection with external devices. Among them, the first ends of the second fisheye pin 72 and the third fisheye pin 73 are respectively inserted upward into the metal holes 120 set in the printed circuit board 12 to fix the printed circuit board 12 in the working chamber. The second fisheye pin 72 and the third fisheye pin 73 are electrically connected to the printed circuit board 12 through the metal holes 120, thereby electrically connecting the temperature sensitive element 61 to the printed circuit board 12 respectively, and at the same time enabling the printed circuit board 12 to output the measured pressure electrical signal to the outside through the third fisheye pin 73.

[0049] To allow the temperature-sensitive element 61 to be laterally exposed to the medium to be measured, thereby more accurately measuring the medium's temperature, several first windows 31 and at least one second window 34 are provided on the lower sidewall of the pressure connector tube 3. The upper edges of the second windows 34 extend in a direction opposite to the first windows 31, forming a lower tube wall 35. Adhesive sealant 33 is potted in the terminal vias 60. A portion of the adhesive sealant 33 secures the portion of the lead-out terminal 62 near the temperature-sensitive element 61 to the lower tube wall 35 of the pressure connector tube 3, thereby further securing the temperature-sensitive element 61 and preventing flow shock from the medium to be measured.

[0050] Please refer to Figures 6 to 12 .

[0051] The pressure-sensitive component 1 includes a printed circuit board 12, a pressure core 11, a ceramic circuit board 13, and a core protective cover 10. The ceramic circuit board 13 is bonded to the front side of the printed circuit board 12. The printed circuit board 12 is electrically connected to the pads provided on the ceramic circuit board 13 via conductors 15. A conditioning element 14 is provided on the back side of the printed circuit board 12. The pressure core 11 is fixed to the front side of the ceramic circuit board 13 and electrically connected to the pads via conductors 15 (e.g., gold wire).

[0052] The core protection cover 10 includes a cover plate 100 and a first skirt wall 101 formed by the edge of the cover plate 100 extending vertically toward the back. The cover plate 100 is provided with a glue injection hole 10a and a glue filling hole 10b. The back edge of the glue filling hole 10b extends toward the back to form a second skirt wall 102. The back end surface 10f of the second skirt wall 102 is located directly opposite the back end surface 10e of the first skirt wall 101. The back end surface 10f of the second skirt wall 102 is sealed and fixed to the front end surface of the ceramic circuit board 13. The back end surface 10e of the first skirt wall 101 is sealed and fixed to the front end surface of the printed circuit board 12. The pressure core 11 is located within the glue filling hole 10b. The glue filling hole 10b is filled with a first protective glue 17. The second skirt wall 102, the first skirt wall 101, and the printed circuit board 12 define a glue filling cavity 01a. The conductor 15 is located in the glue filling cavity 01a. The glue filling cavity 01a is filled with a second protective glue 18.

[0053] By filling the first protective glue 17 in the glue filling hole 10b, the pressure core can be protected from damage under the conditions of corrosive media (such as the circulating gas in the engine intake manifold); by filling the second protective glue 18 in the glue filling cavity 01a, the risks of the solder joints of the conductor 15 falling off or the gold wire breaking during assembly or use can be avoided. In addition, a double seal is formed between the core protection cover 10 and the ceramic circuit board 13 and the printed circuit board 12, which greatly reduces the risk of other electronic components (such as the conditioning element 14) being corroded by the pressure medium to be measured. Moreover, the use of a ceramic circuit board as the mounting base of the pressure core in this application can reduce the adverse effects of high-temperature exhaust gas on the printed circuit board.

[0054] The housing 2 may be fixedly connected to a plate-shaped mounting portion 9, which may have a mounting hole formed therein. A bushing 91 may be disposed within the mounting hole, thereby securing the temperature and pressure sensor to an external device via fasteners. In various embodiments of the present application, the terminal 4 and pressure connector tube 3 are preferably integrally connected to the housing 2. However, they may also be fixedly connected separately.

[0055] In this embodiment, the pressure core 11 measures absolute pressure, meaning a vacuum chamber is provided on the other side of the pressure core's measuring diaphragm to serve as a pressure reference. In other embodiments, the pressure-sensing surface on the other side of the pressure core can be connected to the atmosphere, for example, through holes provided in the printed circuit board 12 and ceramic circuit board 13, or through a waterproof, breathable membrane / hole provided in the top cover 8.

[0056] In other embodiments, a receiving cavity 67 is preferably provided between the pressure-sensitive component 1 and the housing 2. The lead-out terminal 62 and the second end 66 of the second fisheye pin 72 are disposed within the receiving cavity 67. The end of the lead-out terminal 62, distal from the temperature-sensitive element 61, is passed upward through a terminal through-hole 60 provided in the housing 2 and then welded to the second end 66 of the second fisheye pin 72. The second end 66 of the second fisheye pin 72 can be positioned horizontally and supported on a corresponding support surface 65 formed on the inner wall of the housing 2.

[0057] In some other embodiments, preferably, the edge of the positive side end face of the glue filling hole 10b protrudes toward the positive side to form a circle of positioning flange 103. A positioning groove 10c is correspondingly formed on the inner side of the positioning flange 103. The upper end of the pressure joint tube 3, close to the center part, protrudes upward to form a protruding positioning portion 37. A groove 64 is correspondingly formed at the edge of the upper end of the pressure joint tube 3. The protruding positioning portion 37 is inserted upward into the positioning groove 10c. The positioning flange 103 is inserted downward into the groove 64. A sealing adhesive is poured into the groove 64. In this way, when the pressure sensitive component 1 is fixed to the protruding positioning portion 37 by the sealing adhesive, it can have a larger bonding area to improve the bonding strength, and at the same time, the sealing path is relatively lengthened to improve the sealing effect.

[0058] In some other embodiments, preferably, the positive side end surface of the glue filling hole 10b is located on the positive side of the positive side end surface of the glue injection hole 10a, such as Figure 10 In this way, after the sealing cover 16 is installed at the glue injection hole 10a, the sealing cover 16 can still not protrude from the positive end of the positioning flange 103.

[0059] Preferably, the accommodating cavity 67 is connected to the groove 64. The upper end of the lead terminal 62 passes upward through the wall of the pressure connector tube 3 and then sequentially through the groove 64 and the accommodating cavity 67. This allows the sealing adhesive to be poured into the groove 64 and then into the accommodating cavity 67, thereby sealing the lead terminal 62 and the terminal via 60, thereby preventing the medium to be measured from intruding into the sealed cavity of the sensor through the terminal via 60.

[0060] In some other embodiments, preferably, a clearance opening 10 g for making room for the lead terminal 62 is opened on one side of the positive end of the positioning flange 103 close to the glue injection hole 10 a.

[0061] In other embodiments, the injection hole 10a is preferably sealed with a sealing cap 16. This improves the sealing of the glue filling cavity 01a and prevents the glue in the accommodating cavity 67 from pressing against the second protective glue 18 from the injection hole 10a during assembly after curing, thereby causing the gold wire solder joint to fall off.

[0062] In some other embodiments, preferably, a first positioning portion 104 extending toward the positive side is provided on the front end face of the glue injection hole 10a, and a second positioning portion 105 extending toward the back side is provided on the back end face of the first skirt wall 101, thereby realizing horizontal positioning between the core protection cover 10 and the printed circuit board 12, and between the core protection cover 10 and the sealing cover 16.

[0063] In some other embodiments, preferably, a side wall of the second skirt wall 102 away from the glue injection hole 10 a is integrally connected to a corresponding side wall of the first skirt wall 101 .

[0064] In the above embodiments of the present application, the temperature sensitive component 6 and related structures may not be provided. In this case, it is a pressure sensor.

[0065] The scope of the disclosure is defined not by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are construed as being included in the disclosure.

Claims

1. A temperature and pressure sensor, characterized in that: include: Housing (2); a top cover (8) which, together with the housing (2), encloses a working chamber; A pressure sensitive component (1) is arranged in the working chamber and divides the working chamber into a sealed chamber and a sensing chamber, comprising: a printed circuit board (12); a ceramic circuit board (13) bonded to the positive side of the printed circuit board (12), the printed circuit board (12) being electrically connected to the ceramic circuit board (13) via a conductor (15); a pressure core (11) arranged on the front side of the printed circuit board (12) and electrically connected to the printed circuit board (12), fixed to the front side of the ceramic circuit board (13) and electrically connected to the ceramic circuit board (13); and a core protection cover (10), fixed to the front side of the printed circuit board (12) and with the pressure core (11) located in a glue-filled hole (10b) opened thereon; wherein the core protection cover comprises a cover plate (100) and a pressure core (11) formed by the cover plate (100). The edge of the first skirt wall (101) is vertically extended toward the back side to form a circle of first skirt wall (101); the cover plate (100) is provided with a glue injection hole (10a) and the glue filling hole (10b), and the back side periphery of the glue filling hole (10b) is extended toward the back side to form a circle of second skirt wall (102); the back side end face of the second skirt wall (102) is located on the positive side of the back side end face of the first skirt wall (101); the back side end face of the second skirt wall (102) is sealed and fixed to the positive side end face of the ceramic circuit board (13), and the back side end face of the first skirt wall (101) is sealed and fixed to the positive side end face of the printed circuit board (12); the second skirt wall (102), the first skirt wall (101) and the printed circuit board (12) enclose a glue filling cavity (01a), and the conductor (15) is located in the glue filling cavity (01a); A pressure joint tube (3) with one end sealedly connected to the sensing cavity; A temperature sensitive component (6) comprises a temperature sensitive element (61) and a plurality of second fisheye pins (72) embedded and fixed in a housing (2), wherein the first ends of the second fisheye pins (72) are inserted upward and fixed in a metal hole (120) provided in a printed circuit board (12) and are electrically connected to the printed circuit board (12) through the metal hole (120); the temperature sensitive element (61) is fixed to the lower part of the inner cavity of the pressure joint tube (3); and the plurality of lead terminals (62) of the temperature sensitive element (61) extend upward and are connected to the second ends of the second fisheye pins (72); A terminal button (4) connected to the housing (2); and a plurality of third fisheye pins (73) having one end electrically connected to the printed circuit board (12), and the other end of which passes through the housing (2) and extends to the interior of the terminal button (4).

2. The temperature and pressure sensor according to claim 1, characterized in that: An accommodating cavity is provided between the pressure sensitive component (1) and the housing (2), and the lead terminal (62) and the second end of the second fisheye pin (72) are arranged in the accommodating cavity.

3. The temperature and pressure sensor according to claim 2, characterized in that: One end of the lead-out terminal (62) away from the temperature sensitive element (61) passes upward through the terminal through-hole (60) provided in the housing (2) in a one-to-one correspondence and is then welded to the second end of the second fisheye pin (72).

4. The temperature and pressure sensor according to claim 3, characterized in that: The second end of the second fisheye pin (72) is arranged horizontally.

5. The temperature and pressure sensor according to claim 3, characterized in that: The second end of the second fisheye pin (72) is supported on a corresponding supporting plane (65) formed on the inner wall of the housing (2).

6. The temperature and pressure sensor according to claim 3, characterized in that: The printed circuit board (12) is electrically connected to the soldering pad provided on the ceramic circuit board (13) through the conductor (15), and a conditioning element (14) is provided on the back of the printed circuit board (12); a first protective glue (17) is filled in the glue filling hole (10b); the edge of the positive side end face of the glue filling hole (10b) protrudes toward the positive side to form a circle of positioning flange (103), and the inner side of the positioning flange (103) correspondingly forms a positioning groove (10c); the upper end of the pressure joint tube (3) near the center portion protrudes upward to form a protruding positioning portion (37), and the edge of the upper end of the pressure joint tube (3) correspondingly forms a groove (64); the protruding positioning portion (37) is inserted upward into the positioning groove (10c), and the positioning flange (103) is inserted downward into the groove (64), and the groove (64) is filled with sealing adhesive.

7. The temperature and pressure sensor according to claim 6, characterized in that: The accommodating cavity is communicated with the groove (64), and the upper end of the lead terminal (62) passes through the groove (64) and the accommodating cavity in sequence after passing through the tube wall of the pressure joint tube (3) upward.

8. The temperature and pressure sensor according to claim 1, characterized in that: A second protective glue (18) is filled in the glue filling cavity (01a).

9. The temperature and pressure sensor according to claim 1, characterized in that: The front side end surface of the glue filling hole (10b) is located on the positive side of the front side end surface of the glue injection hole (10a).

10. The temperature and pressure sensor according to claim 1, characterized in that: The positive end surface of the glue filling hole (10b) protrudes toward the positive side to form a circle of positioning flange (103), and the inner side of the positioning flange (103) forms a positioning groove (10c) accordingly.

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