A high-pressure cooking test device for chip manufacturing

Abstract

This invention discloses a high-pressure steam cooking test device for chip manufacturing, comprising a chassis, a cooking chamber inside the chassis, a receiving box above the cooking chamber, an air compressor inside the chassis and above the receiving box, wherein the outlet of the air compressor is located on the chassis, and the inlet of the air compressor is connected to a pressure boosting port on the receiving box, and a pressure boosting valve is installed on the pressure boosting port. The air compressor is used to control the pressure inside the receiving box. In addition, a water storage tank is located on one side of the cooking chamber inside the chassis and is connected to the receiving box through a water immersion pipe. Finally, a humidity testing component is located above the water storage tank inside the chassis. Through the humidity testing component, water vapor can be blown onto the chip. Based on the time the water vapor acts on the chip surface, the stability of the chip can be measured sequentially, and the stability and working efficiency of the chip in a high humidity environment can be recorded.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to a high-pressure steaming test apparatus for chip manufacturing. Background Technology

[0002] In the chip manufacturing process, in order to ensure the quality, lifespan, and efficiency of the chip, a large number of tests and adjustments to the manufacturing process are required to bring the chip to its optimal state. This testing process not only requires stress testing but also testing under harsh environments to ensure that its working state is not affected under different conditions. Existing simulation tests all place the chip in water or water vapor, and the duration and variables of the test cannot be precisely controlled, resulting in large deviations in the measured results. Summary of the Invention

[0003] The purpose of this invention is to provide a high-pressure cooking test apparatus for chip manufacturing to solve the problems mentioned above.

[0004] The objective of this invention can be achieved through the following technical solutions:

[0005] A high-pressure cooking test apparatus for chip manufacturing includes a chassis, an internal cooking chamber, a receiving box above the cooking chamber, an air compressor inside the chassis and above the receiving box, an outlet of the air compressor on the chassis, an inlet of the air compressor connected to a pressure boosting port on the receiving box, a pressure boosting valve on the pressure boosting port, a water storage tank inside the chassis located on one side of the cooking chamber, the water storage tank connected to the receiving box via an immersion pipe, and a humidity testing component inside the chassis located above the water storage tank.

[0006] As a further aspect of the present invention: the humidity testing assembly includes an evaporation water tank fixedly installed inside the chassis, an evaporation heating wire installed inside the evaporation water tank, a water inlet installed above the evaporation water tank, a steam pipe installed on one side of the evaporation water tank, an acceleration head installed at the end of the steam pipe, and the acceleration head installed on the receiving box.

[0007] As a further aspect of the present invention: a steam valve is provided on the steam pipe;

[0008] The accelerator head is equipped with a humidifying fan inside, and a jet baffle is provided below the accelerator head, with several jet holes opened on the jet baffle.

[0009] As a further aspect of the present invention: a loading and unloading door is provided at one end of the receiving box, a receiving slider is slidably provided inside the receiving box, a lifting telescopic rod is provided on one side of the receiving slider, a cooking suspension is provided on the extended end of the lifting telescopic rod, a clamping groove is symmetrically opened on one side of the cooking suspension, a clamping cylinder is fixedly provided in the clamping groove, and a clamping frame is provided on the extended end of the clamping cylinder.

[0010] As a further aspect of the present invention: the cross-section of the clamping frame is "C" shaped, and a clamping rubber block is provided on the inner side of the clamping frame.

[0011] As a further aspect of the present invention: receiving grooves are symmetrically arranged on both sides of the receiving box, a receiving screw is rotatably arranged in one receiving groove, and a limiting slide rod is arranged in the other receiving groove. One end of the receiving slider is threadedly connected to the receiving screw, and the other end of the receiving slider is slidably connected to the limiting slide rod. A receiving motor is arranged outside the receiving box, and the output end of the receiving motor is connected to one end of the receiving screw.

[0012] As a further aspect of the present invention: a water pump is provided at one end of the immersion pipe near the water storage tank.

[0013] As a further aspect of the present invention: the interior of the cooking chamber is provided with a cooking heating wire, and a liquid inlet is provided on one side of the cooking chamber.

[0014] The beneficial effects of this invention are:

[0015] (1) In this invention, since moisture can easily cause water vapor to seep into the equipment, causing polymer materials to depolymerize and resulting in corrosion, voids, wire solder joint detachment, leakage between leads, and chip-to-chip bonding layer detachment, during testing, the accelerator head is directly sprayed with steam onto the chip. By controlling the duration of steam spraying, the chip is tested at regular intervals and in quantitative quantities. This can effectively test the chip's performance and efficiency under these conditions, and more accurately and directly measure the impact of water vapor on the chip.

[0016] (2) In this invention, not only water can be added to the cooking chamber, but also some acidic or alkaline substances can be added to test the acid and alkali resistance of the chip. In the chip test, the immersion tube can directly apply water to the chip, and the application time can be controlled to test the water resistance of the chip. The steam tube can apply water vapor to the chip and then test the humidity resistance of the chip. In addition, the chip can be immersed in the liquid in the cooking chamber for cooking test to achieve other different test environments. Under the three environments, different conditions can be controlled to test the chip. There are many test variables and the test results are more accurate. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic cross-sectional view of the overall structure of the present invention;

[0019] Figure 2 This is a cross-sectional schematic diagram of the connection structure between the receiving slider and the receiving box in this invention;

[0020] Figure 3 This is a schematic diagram of the connection structure between the clamping cylinder and the clamping frame in this invention;

[0021] Figure 4 This is a cross-sectional schematic diagram of the connection structure between the accelerator head and the receiving box in this invention;

[0022] Figure 5 This is a partial cross-sectional structural diagram of the evaporation tank in this invention;

[0023] Figure 6 This is a partial cross-sectional structural diagram of the cooking tank in this invention.

[0024] In the diagram: 1. Chassis; 2. Cooking chamber; 20. Liquid inlet; 21. Cooking heating wire; 3. Receiving box; 30. Loading / unloading door; 301. Pressure inlet; 302. Pressure valve; 31. Receiving motor; 32. Receiving chute; 33. Receiving screw; 34. Limiting slide bar; 35. Receiving slider; 36. Lifting telescopic rod; 37. Cooking suspension; 370. Clamping groove; 38. Clamping cylinder; 39. Clamping frame; 391. Clamping rubber block; 4. Air compressor; 5. Humidity testing assembly; 51. Evaporation water tank; 510. Evaporation heating wire; 511. Water inlet; 52. Steam pipe; 521. Steam valve; 53. Accelerator head; 54. Humidifying fan; 55. Jet baffle; 550. Jet nozzle; 6. Water storage tank; 61. Water pump; 62. Immersion pipe. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figure 1 - Figure 6As shown, this invention is a high-pressure steam cooking test device for chip manufacturing, including a chassis 1. A cooking chamber 2 is set inside the chassis 1, and a receiving box 3 is set above the cooking chamber 2. An air compressor 4 is set inside the chassis 1 and above the receiving box 3. The outlet end of the air compressor 4 is set on the chassis 1, and the inlet end of the air compressor 4 is connected to the pressure boosting port 301 on the receiving box 3. At the same time, a pressure boosting valve 302 is set on the pressure boosting port 301. The air compressor 4 is used to control the pressure inside the receiving box 3. In addition, a water storage tank 6 is set on one side of the cooking chamber 2 inside the chassis 1, and the water storage tank 6 is connected to the receiving box 3 through a water immersion pipe 62. Finally, a humidity test component 5 is set above the water storage tank 6 inside the chassis 1. Water vapor can be blown onto the chip through the humidity test component 5. According to the time the water vapor acts on the chip surface, the stability of the chip can be detected sequentially. The stability and working efficiency of the chip in a high humidity environment can be recorded.

[0027] Specifically, the humidity test assembly 5 includes an evaporation tank 51 fixedly installed inside the chassis 1. An evaporation heating wire 510 is installed inside the evaporation tank 51. A water inlet 511 is installed above the evaporation tank 51 to add water. A steam pipe 52 is installed on one side of the evaporation tank 51 to transport steam. An acceleration head 53 is installed at the end of the steam pipe 52 and is mounted on the receiving box 3. Since moisture easily causes water vapor to seep into the equipment, leading to polymer depolymerization, corrosion, voids, wire bonding failure, lead leakage, and chip-to-chip bonding layer separation, during testing, the acceleration head 53 directly sprays steam onto the chip. By controlling the steam spray duration, the chip is tested periodically and quantitatively, effectively testing the chip's performance and efficiency under these conditions, and more accurately and directly measuring the chip's susceptibility to moisture.

[0028] In addition, a steam valve 521 is installed on the steam pipe 52 to control the flow of steam; a humidifying fan 54 is installed inside the accelerator head 53, and a jet baffle 55 is installed below the accelerator head 53, with several jet holes 550 opened on the jet baffle 55. When the chip moves into the receiving box 3 and is located below the accelerator head 53, the water in the evaporating water tank 51 can be heated by the action of the evaporating heating wire 510, and then the chip can be tested for moisture under the action of the humidifying fan 54.

[0029] Secondly, a pick-and-place door 30 is provided at one end of the receiving box 3 for picking up and placing chips. Then, a receiving slider 35 is slidably arranged inside the receiving box 3. At the same time, a lifting telescopic rod 36 is provided on one side of the receiving slider 35, and a cooking suspension 37 is provided on the extended end of the lifting telescopic rod 36. Then, clamping grooves 370 are symmetrically opened on one side of the cooking suspension 37. Then, a clamping cylinder 38 is fixedly installed in the clamping groove 370, and a clamping frame 39 is provided on the extended end of the clamping cylinder 38, and the cross-section of the clamping frame 39 is "C". The chip is placed between the two clamping frames 39. The two clamping frames 39 are then clamped and fixed by the two clamping cylinders 38. Then, a moisture test can be performed. At the same time, if the lifting telescopic rod 36 extends and moves the chip downward into the steaming chamber 2, a steaming test can be performed to test the performance of the chip after it has been affected by high temperature water in a high temperature environment.

[0030] Reference Figure 2 As shown, two receiving grooves 32 are symmetrically arranged on both sides of the receiving box 3. A receiving screw 33 is rotatably installed in one receiving groove 32, and a limiting slide rod 34 is installed in the other receiving groove 32. One end of the receiving slider 35 is threadedly connected to the receiving screw 33, and the other end of the receiving slider 35 is slidably connected to the limiting slide rod 34. Then, a receiving motor 31 is set outside the receiving box 3, and the output end of the receiving motor 31 is connected to one end of the receiving screw 33. Through the action of the receiving motor 31, the receiving screw 33 is driven to rotate. At this time, the receiving slider 35, which is threadedly connected to the receiving screw 33, can move back and forth under the action of the thread of the receiving screw 33 and the limiting action of the limiting slide rod 34, thereby controlling the clamping frame 39 to move back and forth to receive and deliver the chip.

[0031] In addition, a water pump 61 is installed at one end of the immersion pipe 62 near the water storage tank 6 to transport the water in the water storage tank 6 along the immersion pipe 62 to the receiving box 3 and apply it to the chip. This allows for direct testing of the chip's efficiency and lifespan after it comes into contact with water.

[0032] Finally, a heating wire 21 is installed inside the cooking chamber 2, and a liquid inlet 20 is installed on one side of the cooking chamber 2. It should be noted that not only water can be added to the cooking chamber 2, but also some acidic or alkaline substances can be added to test the acid and alkali resistance of the chip.

[0033] In chip testing, the immersion tube 62 can directly apply water to the chip, and the application time can be controlled to test the chip's water resistance. The steam tube 52 can apply water vapor to the chip to test its humidity resistance. In addition, the chip can be immersed in the liquid in the cooking chamber 2 for cooking tests to achieve testing in other different environments. Under these three environments, different conditions can be controlled to test the chip, resulting in more test variables and more accurate test results.

[0034] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A high-pressure steam cooking test apparatus for chip manufacturing, comprising a chassis (1), characterized in that, The machine casing (1) is equipped with a cooking chamber (2) inside. A receiving box (3) is provided above the cooking chamber (2). An air compressor (4) is provided inside the machine casing (1) and above the receiving box (3). The outlet end of the air compressor (4) is provided on the machine casing (1). The inlet end of the air compressor (4) is connected to the pressure boosting port (301) on the receiving box (3). A pressure boosting valve (302) is provided on the pressure boosting port (301). A water storage tank (6) is provided inside the machine casing (1) on one side of the cooking chamber (2). The water storage tank (6) is connected to the receiving box (3) through a water immersion pipe (62). A humidity test assembly (5) is provided inside the machine casing (1) above the water storage tank (6). The humidity test assembly (5) includes an evaporation tank (51) fixedly installed in the housing (1), an evaporation heating wire (510) is installed in the evaporation tank (51), a water inlet (511) is installed above the evaporation tank (51), a steam pipe (52) is installed on one side of the evaporation tank (51), an acceleration head (53) is installed at the end of the steam pipe (52), and the acceleration head (53) is installed on the receiving box (3); The receiving box (3) is provided with a pick-up and put-out door (30) at one end. A receiving slider (35) is slidably provided inside the receiving box (3). A lifting telescopic rod (36) is provided on one side of the receiving slider (35). A cooking suspension (37) is provided on the extended end of the lifting telescopic rod (36). A clamping groove (370) is symmetrically opened on one side of the cooking suspension (37). A clamping cylinder (38) is fixedly provided in the clamping groove (370). A clamping frame (39) is provided on the extended end of the clamping cylinder (38). The chip is placed between two clamping frames (39), and the two clamping cylinders (38) control the two clamping frames (39) to clamp and fix the chip for a moisture test. After the chip is moved downwards and into the cooking chamber (2) by extending the lifting telescopic rod (36), a cooking test is carried out.

2. The high-pressure cooking test apparatus for chip manufacturing according to claim 1, characterized in that, A steam valve (521) is provided on the steam pipe (52); The accelerator head (53) is equipped with a humidifying fan (54) inside, and a jet baffle (55) is provided below the accelerator head (53). The jet baffle (55) has several jet holes (550).

3. The high-pressure boiling test apparatus for chip manufacturing according to claim 1, characterized in that, The clamping frame (39) has a "C" shaped cross section, and a clamping rubber block (391) is provided on the inner side of the clamping frame (39).

4. The high-pressure boiling test apparatus for chip manufacturing according to claim 1, characterized in that, The receiving box (3) is symmetrically provided with receiving grooves (32) on both sides. A receiving screw (33) is rotatably provided in one receiving groove (32), and a limiting slide rod (34) is provided in the other receiving groove (32). One end of the receiving slider (35) is threadedly connected to the receiving screw (33), and the other end of the receiving slider (35) is slidably connected to the limiting slide rod (34). A receiving motor (31) is provided outside the receiving box (3), and the output end of the receiving motor (31) is connected to one end of the receiving screw (33).

5. The high-pressure boiling test apparatus for chip manufacturing according to claim 1, characterized in that, A water pump (61) is installed at one end of the immersion pipe (62) near the water storage tank (6).

6. The high-pressure cooking test apparatus for chip manufacturing according to claim 1, characterized in that, The cooking chamber (2) is equipped with a cooking heating wire (21) inside, and a liquid inlet (20) is provided on one side of the cooking chamber (2).

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