Half hole processing method of circuit board and circuit board

Abstract

The present invention discloses a half-hole processing method for a circuit board, and discloses a circuit board made by the half-hole processing method for a circuit board, wherein the half-hole processing method for a circuit board comprises the following steps: S100: obtaining a board and a half-hole area thereof, obtaining a preset spacing A in a first direction and a preset spacing B in a second direction of a first test hole and a second test hole of the board, wherein a plurality of half-holes are arranged on the half-hole area; S200: measuring an actual spacing C in a first direction and an actual spacing D in a second direction of the first test hole and the second test hole, so as to obtain a first expansion / contraction coefficient E in a first direction and a second expansion / contraction coefficient F in a second direction of the board; S300: placing the board in a gong machine, and obtaining gong half-hole processing information of the board, the gong half-hole processing information comprising a gong belt area, and translating the gong belt area according to the first expansion / contraction coefficient and the second expansion / contraction coefficient so that the gong belt area covers half of the half-hole, so as to avoid an open circuit in the circuit board, thereby reducing the scrap rate of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a half-hole processing method of a circuit board and the circuit board. Background Art

[0002] When the circuit board manufacturer is processing half-holes, the circuit boards produced in the previous process are prone to expansion or contraction, resulting in inconsistent expansion and contraction coefficients of different circuit boards. The preset gong belt area on the gong machine is prone to offset relative to the half-hole, causing deviations in the size of the half-hole, resulting in open circuits on the circuit boards and increased scrap rates of the circuit boards. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a half-hole processing method for a circuit board, which can reduce the scrap rate of the circuit board.

[0004] The present invention also provides a circuit board manufactured by the above-mentioned circuit board half-hole processing method.

[0005] According to the first aspect of the present invention, the half-hole processing method of the circuit board includes the following steps: S100: obtaining a board and its half-hole area, wherein the board is provided with a first test hole and a second test hole, obtaining a preset spacing A between the first test hole and the second test hole in a first direction and a preset spacing B in a second direction, wherein the first direction is orthogonal to the second direction, and a plurality of half holes are provided in the half-hole area; S200: measuring an actual spacing C between the first test hole and the second test hole in the first direction to obtain a first expansion / contraction coefficient E of the board in the first direction, measuring an actual spacing D between the first test hole and the second test hole in the second direction to obtain a first expansion / contraction coefficient E of the board in the second direction, and measuring an actual spacing D between the first test hole and the second test hole in the second direction to obtain a first expansion / contraction coefficient E of the board in the second direction. The second expansion / contraction coefficient F in the direction, wherein E=C / A, F=D / B; S300: placing the plate in the gong machine, and obtaining the gong half-hole processing information of the plate to perform gong half-hole processing on the plate, the gong half-hole processing information including a gong band area, and adjusting the position of the gong band area along the first direction according to the first expansion / contraction coefficient, and adjusting the position of the gong band area along the second direction according to the second expansion / contraction coefficient, so that the gong band area covers half of the half hole; S400: gong half-hole processing, performing rough gong at the center of the gong band area, and then performing fine gong at the corresponding position to gong out a half hole; S500: etching, using etching solution to clean the copper skin remaining at the exposed copper part of the half hole.

[0006] The half-hole processing method of a circuit board according to the first aspect of the present invention has at least the following beneficial effects:

[0007] When the circuit board shrinks in the first direction, that is, C is less than A, E is less than 1, and E-1 is less than 0, the gong belt area is adjusted to offset in the direction of reducing the spacing between the first test hole and the second test hole in the first direction. When the circuit board collides in the first direction, that is, C is greater than A, E is greater than 1, and E-1 is greater than 0, the gong belt area is adjusted to offset in the direction of increasing the spacing between the first test hole and the second test hole in the first direction; similarly, when the circuit board shrinks in the second direction, that is, D is less than B, F is less than 1, and E-1 is less than 0, the gong belt area is adjusted to offset in the direction of reducing the spacing between the first test hole and the second test hole in the second direction. When the circuit board collides in the second direction, that is, D is greater than B, F is greater than 1, and F-1 is greater than 0, the gong belt area is adjusted to offset in the direction of increasing the spacing between the first test hole and the second test hole in the second direction. In this way, it can be ensured that the gong belt area covers half of the half hole to avoid open circuit on the circuit board and reduce the scrap rate of the circuit board.

[0008] According to some embodiments of the present invention, the cutting direction of the gong knife of the rough gong is the same as the cutting direction of the gong knife of the fine gong, and the rotation direction of the gong knife of the rough gong is the same as the rotation direction of the gong knife of the fine gong.

[0009] According to some embodiments of the present invention, when machining a half-hole, the diameter of the gong cutter of the fine gong is greater than half the width of the gong belt and smaller than the width of the gong belt.

[0010] According to some embodiments of the present invention, when machining a half hole, the tool diameter compensation value of the fine gong is 0.02 mm larger than the diameter of the half hole.

[0011] According to some embodiments of the present invention, before the plate is fixed on the gong machine, the positioning accuracy of the plate is detected.

[0012] According to some embodiments of the present invention, the plate has a plurality of modules arranged in an array. When processing a half-hole, the modules located at the corners of the plate are processed first, and then the plate is placed on a three-dimensional measuring machine to detect whether the gong belt area covers half of the half hole. If so, the remaining modules are processed continuously, otherwise, the position of the gong belt area is readjusted.

[0013] The circuit board according to the embodiment of the second aspect of the present invention is manufactured by the half-hole processing method of the circuit board described in the above embodiment.

[0014] The circuit board according to the second aspect of the present invention has at least the following beneficial effects:

[0015] When the circuit board shrinks in the first direction, that is, C is less than A, E is less than 1, and E-1 is less than 0, the gong belt area is adjusted to offset in the direction of reducing the spacing between the first test hole and the second test hole in the first direction. When the circuit board collides in the first direction, that is, C is greater than A, E is greater than 1, and E-1 is greater than 0, the gong belt area is adjusted to offset in the direction of increasing the spacing between the first test hole and the second test hole in the first direction; similarly, when the circuit board shrinks in the second direction, that is, D is less than B, F is less than 1, and E-1 is less than 0, the gong belt area is adjusted to offset in the direction of reducing the spacing between the first test hole and the second test hole in the second direction. When the circuit board collides in the second direction, that is, D is greater than B, F is greater than 1, and F-1 is greater than 0, the gong belt area is adjusted to offset in the direction of increasing the spacing between the first test hole and the second test hole in the second direction. In this way, it can be ensured that the gong belt area covers half of the half hole to avoid open circuit on the circuit board and reduce the scrap rate of the circuit board.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 A flow chart of a half-hole processing method for a circuit board according to an embodiment of the present invention;

[0019] Figure 2 It is a schematic diagram of a plate according to an embodiment of the present invention before machining of a gong half hole;

[0020] Figure 3 for Figure 2 A partial enlarged view of part A;

[0021] Figure 4 It is a schematic diagram of a plate after a gong half hole is processed according to an embodiment of the present invention;

[0022] Figure 5 for Figure 4 A partial enlarged view of part B;

[0023] Figure 6 This is a schematic diagram of the knife trajectory of the gong knife when fine gong is being made.

[0024] Reference numerals:

[0025] Plate 900, first test hole 901, second test hole 902, module 910, half hole 911, cutting area 912, positioning point 920, and tool trajectory 930. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] Reference Figure 1 , Figure 3 and Figure 5According to the first aspect of the present invention, the half-hole processing method of the circuit board of the embodiment of the present invention comprises the following steps: S100: obtaining a board 900 and its half-hole area, the board 900 is provided with a first test hole 901 and a second test hole 902, obtaining a preset spacing A of the first test hole 901 and the second test hole 902 in the first direction and a preset spacing B in the second direction, the first direction is orthogonal to the second direction, wherein a plurality of half holes 911 are provided on the half-hole area; S200: measuring an actual spacing C of the first test hole 901 and the second test hole 902 in the first direction to obtain a first expansion and contraction coefficient E of the board 900 in the first direction, measuring an actual spacing D of the first test hole 901 and the second test hole 902 in the second direction to obtain a second expansion and contraction coefficient F of the board 900 in the second direction, wherein E=C / A, F=D / B ; S300: placing the plate 900 in the gong machine, and obtaining the gong half-hole processing information of the plate 900, so as to perform gong half-hole processing on the plate 900, the gong half-hole processing information includes the gong belt area 912, according to the first expansion and contraction coefficient, along the first direction, adjust the position of the gong belt area 912, according to the second expansion and contraction coefficient, along the second direction, adjust the position of the gong belt area 912, so that the gong belt area 912 covers half of the half hole 911; S400: gong half-hole processing, rough gong is performed at the center position of the gong belt area 912, and then fine gong is performed at the corresponding position to gong out the half hole 911; S500: etching, using etching solution to clean the copper skin remaining at the exposed copper part of the half hole 911, so that it can ensure that the gong belt area 912 covers half of the half hole 911, so as to avoid the open circuit of the circuit board, and reduce the scrap rate of the circuit board.

[0031] Specifically, when the circuit board shrinks in the first direction, that is, C is less than A, E is less than 1, and E-1 is less than 0, the gong belt area 912 is adjusted to offset in the direction of reducing the spacing between the first test hole 901 and the second test hole 902 in the first direction; when the circuit board collides in the first direction, that is, C is greater than A, E is greater than 1, and E-1 is greater than 0, the gong belt area 912 is adjusted to offset in the direction of increasing the spacing between the first test hole 901 and the second test hole 902 in the first direction; similarly, when the circuit board shrinks in the second direction, that is, D is less than B, F is less than 1, and E-1 is less than 0, the gong belt area 912 is adjusted to offset in the direction of reducing the spacing between the first test hole 901 and the second test hole 902 in the second direction; when the circuit board collides in the second direction, that is, D is greater than B, F is greater than 1, and F-1 is greater than 0, the gong belt area 912 is adjusted to offset in the direction of increasing the spacing between the first test hole 901 and the second test hole 902 in the second direction. In this way, it can be ensured that the gong belt area 912 covers half of the half hole 911 to avoid open circuits in the circuit board and reduce the scrap rate of the circuit board.

[0032] It should be noted that after the gong belt area 912 is determined to be completed, the gong machine first drives the rough gong knife to perform rough gong on the gong belt area 912, and then drives the fine gong knife to perform fine gong on the corresponding position of the rough gong to gong out the gong belt. After that, the copper skin remaining in the exposed copper part of the half hole 911 is cleaned with etching solution to ensure that the notch of the half hole 911 is neat and flat without gaps.

[0033] It should be noted that both A and B are greater than 0.

[0034] In some embodiments of the present invention, the moving direction of the gong knife for roughing is the same as that of the gong knife for fine gong, and the rotation direction of the gong knife for roughing is the same as that of the gong knife for fine gong, which can reduce the generation of batching edges and reduce the scrap rate of circuit boards.

[0035] Reference Figure 6 In some embodiments of the present invention, when processing a half hole, the diameter of the fine gong cutter is larger than half the width of the gong belt and smaller than the width of the gong belt, so that the fine gong cutter needs to move back and forth around the circumference of the gong belt to gong out the gong belt. The tool trajectory 930 of the fine gong cutter is a waist-shaped structure, and the gong belt cannot be gonged out by a single knife forming method, which can effectively ensure the stability of the size of the gong belt.

[0036] In some embodiments of the present invention, when processing a half hole, the tool diameter compensation value of the fine gong is 0.02 mm larger than the diameter of the half hole 911. Since the gong cutter of the fine gong is easily worn during the fine processing of the gong belt, resulting in the width of the gong belt being too small, the wear of the tool diameter of the gong cutter of the fine gong can be compensated by pre-compensating the tool diameter of the gong cutter of the fine gong.

[0037] It should be noted that when roughing the belt, no tool diameter compensation is done for the roughing knife.

[0038] Reference Figure 2 , Figure 4 In some embodiments of the present invention, a positioning point 920 is provided on the plate 900. Before fixing the plate 900 on the gong machine, the gong machine can open the optical lens, position the plate 900 with the positioning point 920 as a reference, detect the positioning accuracy of the plate 900, and ensure the position accuracy of the gong belt relative to the positioning point 920, thereby preventing the gong plate from offsetting due to the knocking of the pin.

[0039] Reference Figure 2 , Figure 4In some embodiments of the present invention, a plurality of modules 910 arranged in an array are provided on a plate 900. When processing a half hole, the modules 910 located at the corners of the plate 900 are processed first, and then the plate 900 is placed on a three-dimensional measuring machine to detect whether the belt area 912 covers half of the half hole 911. If so, the remaining modules 910 continue to be processed, otherwise, the position of the belt area 912 is readjusted. In this way, it is possible to accurately confirm whether the belt area 912 covers half of the half hole 911, so as to reduce the generation of waste during the processing process.

[0040] Reference Figure 2 , Figure 4 In some embodiments of the present invention, when processing a half hole, when the diameter of the half hole is 0.3 mm, the spindle speed of the gong machine is set to 35 to 38 krpm, the lowering speed is 0.2 to 0.4 m / min, and the retracting speed is 3 to 4 m / min; the feed speed during rough gong is 1 to 2 mm / seE, and the gong cutter life of rough gong is 5 m; the plate feed speed during fine gong is 4 to 5 mm / seE, and the gong cutter life of fine gong is 8 m.

[0041] Reference Figure 1 , Figure 2 The circuit board according to the second embodiment of the present invention is manufactured by the half-hole processing method of the circuit hole of the first embodiment of the present invention, which can ensure that the gong belt area 912 covers half of the half hole 911 to avoid open circuits on the circuit board, thereby reducing the scrap rate of the circuit board.

[0042] Specifically, when the circuit board shrinks in the first direction, that is, C is less than A, E is less than 1, and E-1 is less than 0, the gong belt area 912 is adjusted to offset in the direction of reducing the spacing between the first test hole 901 and the second test hole 902 in the first direction; when the circuit board collides in the first direction, that is, C is greater than A, E is greater than 1, and E-1 is greater than 0, the gong belt area 912 is adjusted to offset in the direction of increasing the spacing between the first test hole 901 and the second test hole 902 in the first direction; similarly, when the circuit board shrinks in the second direction, that is, D is less than B, F is less than 1, and E-1 is less than 0, the gong belt area 912 is adjusted to offset in the direction of reducing the spacing between the first test hole 901 and the second test hole 902 in the second direction; when the circuit board collides in the second direction, that is, D is greater than B, F is greater than 1, and F-1 is greater than 0, the gong belt area 912 is adjusted to offset in the direction of increasing the spacing between the first test hole 901 and the second test hole 902 in the second direction. In this way, it can be ensured that the gong belt area 912 covers half of the half hole 911 to avoid open circuits in the circuit board and reduce the scrap rate of the circuit board.

[0043] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The present embodiment is described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiment, and various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the present purpose.

Claims

1. A method for processing a half hole of a circuit board, characterized in that: include: S100: Acquire a plate (900) and a half-hole region thereof, wherein the plate (900) is provided with a first test hole (901) and a second test hole (902), and acquire a preset spacing A between the first test hole (901) and the second test hole (902) in a first direction and a preset spacing B between the first test hole (901) and the second test hole (902) in a second direction, wherein the first direction is orthogonal to the second direction, wherein a plurality of half-holes (911) are provided in the half-hole region; S200: measuring the actual spacing C between the first test hole (901) and the second test hole (902) in the first direction to obtain a first expansion / contraction coefficient E of the plate (900) in the first direction, and measuring the actual spacing D between the first test hole (901) and the second test hole (902) in the second direction to obtain a second expansion / contraction coefficient F of the plate (900) in the second direction, wherein E=C / A, F=D / B; S300: placing the plate (900) in a gong machine, and obtaining gong half-hole processing information of the plate (900) to perform gong half-hole processing on the plate (900), wherein the gong half-hole processing information includes a gong belt area (912), adjusting the position of the gong belt area (912) along the first direction according to the first expansion and contraction coefficient, and adjusting the position of the gong belt area (912) along the second direction according to the second expansion and contraction coefficient, so that the gong belt area (912) covers half of the half hole (911); S400: gong half hole processing, rough gong is performed at the center position of the gong belt area (912), and then fine gong is performed at the corresponding position to gong out a half hole (911); S500: Etching, using etching solution to clean the copper skin remaining in the exposed copper part of the half hole (911).

2. The method for processing a half hole of a circuit board according to claim 1, characterized in that: The moving direction of the gong knife of the rough gong is the same as the moving direction of the gong knife of the fine gong, and the rotating direction of the gong knife of the rough gong is the same as the rotating direction of the gong knife of the fine gong.

3. The method for processing a half hole of a circuit board according to claim 1, characterized in that: When processing the half hole of the gong, the diameter of the gong cutter of the fine gong is greater than half the width of the gong belt and smaller than the width of the gong belt.

4. The method for processing a half hole of a circuit board according to claim 1, characterized in that: When machining a half hole, the tool diameter compensation value of the gong cutter of the fine gong is 0.02 mm larger than the diameter of the half hole (911).

5. The method for processing a half hole of a circuit board according to claim 1, characterized in that: Before fixing the plate (900) on the gong machine, the positioning accuracy of the plate (900) is detected.

6. The method for processing a half hole of a circuit board according to claim 1, characterized in that: The plate (900) has a plurality of modules (910) arranged in an array. When processing a half hole, the modules (910) located at the corners of the plate (900) are processed first, and then the plate (900) is placed on a three-dimensional measuring machine to detect whether the gong belt area (912) covers half of the half hole (911). If so, the remaining modules (910) are processed continuously. Otherwise, the position of the gong belt area (912) is readjusted.

7. A circuit board manufactured by the circuit board half-hole processing method as described in any one of claims 1 to 6.

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