An electronic device

Abstract

The application relates to an electronic device, wherein the electronic device comprises a housing, a buffer assembly connected with the housing, a first electronic element located on a side of the buffer assembly away from the housing, and a second electronic element located on a side of the housing away from the buffer assembly. The buffer assembly has a recessed portion, and at least part of the normal projection of the second electronic element along the thickness direction of the electronic device is located in the normal projection of the recessed portion. By arranging the recessed portion, the area of direct contact or indirect contact between the buffer assembly and the first electronic element and / or the second electronic element can be reduced, the heat transfer efficiency of the corresponding area of the buffer assembly is reduced, the heat transfer efficiency of the electronic device along the thickness direction is reduced, the uniformity of heat along the non-thickness direction is improved, the possibility of local high temperature of the first electronic element is reduced, and the thermal experience of the user is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication devices, and in particular to an electronic device. BACKGROUND

[0002] With the development of technology, electronic devices such as mobile phones and tablet computers have become common electronic devices for people. In use, the heat generated by second electronic elements such as mainboards and chip assemblies is transmitted to the screen through the buffer foam, causing the temperature of the corresponding position of the screen to rise, which affects the user experience. SUMMARY

[0003] The present application provides an electronic device for improving the problem of mutual influence of heat generated between different electronic elements in the prior art.

[0004] The present application provides an electronic device, which comprises:

[0005] a housing;

[0006] a first electronic element;

[0007] a second electronic element;

[0008] a buffer assembly connected with the housing, the first electronic element being located on a side of the buffer assembly away from the housing, and the second electronic element being located on a side of the housing away from the buffer assembly;

[0009] wherein the buffer assembly is provided with a recessed portion, and at least part of the second electronic element in orthographic projection along the thickness direction of the electronic device is located within the orthographic projection along the thickness direction of the electronic device of the recessed portion.

[0010] By providing the recessed portion, the area of direct or indirect contact between the buffer assembly and the first electronic element and / or the second electronic element can be reduced, thereby reducing the heat transfer efficiency of the corresponding region of the second electronic element of the buffer assembly, which is conducive to reducing the possibility of local high temperature of the first electronic element, reducing the influence of heat generation of the first electronic element on the touch feeling, and improving the user experience.

[0011] In a possible implementation, the recessed portion comprises a first recessed portion located on a side of the buffer assembly facing the second electronic element, and the recessed portion is recessed in a direction away from the second electronic element.

[0012] By providing the recessed portion on the side of the buffer assembly facing the second electronic element, the contact area between the buffer assembly and the second electronic element can be reduced, thereby reducing the heat transfer efficiency.

[0013] In a possible implementation, the recess further comprises a second recess, and the second recess is located on the side of the buffer assembly away from the second electronic component.

[0014] By arranging two recesses, the contact area of the buffer assembly with the first electronic component and the second electronic component can be reduced at the same time, so that the heat transfer between the first electronic component and the second electronic component is reduced, and the possibility of interference is reduced.

[0015] In a possible implementation, the recess is a through hole, and the through hole penetrates the buffer assembly along the thickness direction of the electronic device.

[0016] By arranging the through hole, the region of the buffer assembly corresponding to the electronic component is not in direct or indirect contact with the electronic component. Since air has good heat insulation capacity, arranging the through hole can reduce the heat conduction rate of the region, thereby facilitating the reduction of the possibility of heat transfer to the screen assembly.

[0017] In a possible implementation, the buffer assembly is provided with a plurality of through holes.

[0018] By arranging a plurality of through holes, the heat transfer efficiency can be further reduced.

[0019] In a possible implementation, along the thickness direction of the electronic device, the depth of the recess is m, the thickness of the buffer assembly is n, and 0 < m ≤ n.

[0020] The depth of the recess can be set according to the actual heat insulation effect.

[0021] In a possible implementation, the recess is provided with a heat insulation material, and the heat conduction efficiency of the heat insulation material is lower than that of the buffer assembly.

[0022] By arranging the heat insulation material, the heat conduction efficiency can be further reduced.

[0023] In a possible implementation, an adhesive is arranged between the side wall of the recess and the heat insulation material, and the heat insulation material is bonded to the side wall of the recess.

[0024] By arranging the adhesive, the stability of the arrangement of the heat insulation material can be improved.

[0025] In a possible implementation, the heat insulation material fills all the recesses, or the heat insulation material is in a grid structure.

[0026] By arranging the heat insulation material in a grid structure, the heat insulation effect can be achieved while reducing the amount of heat insulation material, which is conducive to reducing the cost and meeting the actual use demand.

[0027] In a possible implementation, at least part of the thermal insulation material is one or more of a thermal insulation piece, a thermal insulation aerogel, glass fiber cotton, asbestos, rock wool, silicate, ceramic fiber paper, and vacuum board.

[0028] The above material can further reduce the heat conduction efficiency of the corresponding area.

[0029] In a possible implementation, a projection of the recess along a thickness direction of the electronic device contains a projection of the second electronic element along the thickness direction of the electronic device.

[0030] The projection area of the recess is greater than the projection area of the electronic element, which is beneficial to improve the heat insulation capacity of the recess and reduce the possibility of heat generated by the electronic element being transmitted to the screen assembly through contact heat transfer.

[0031] In a possible implementation, the electronic device further includes a first heat conduction component, and a heat conduction efficiency of the first heat conduction component along a thickness direction of the electronic device is lower than a heat conduction efficiency of the first heat conduction component along a length direction and / or a width direction of the electronic device.

[0032] The first heat conduction component is mounted to a side of the shell facing the second electronic element.

[0033] The first heat conduction component is mounted to a side of the shell facing the second electronic element.

[0034] In a possible implementation, the electronic device further includes a second heat conduction component, the second heat conduction component is located at a side of the buffer assembly away from the first electronic element, and a heat conduction efficiency of the second heat conduction component along a length direction and / or a thickness direction of the electronic device is higher than a heat conduction efficiency of the second heat conduction component along a thickness direction of the electronic device.

[0035] The second heat conduction component is beneficial to heat transfer along the length direction and / or the width direction of the electronic device, and is beneficial to reduce the possibility of heat transfer along the thickness direction, thereby reducing the possibility of heat generated by the second electronic element being transmitted to the first electronic element.

[0036] In a possible implementation, the electronic device further includes a shielding component, the shielding component is located at a side of the shell facing the second electronic element, and the shielding component has a mounting cavity, and the second electronic element is located in the mounting cavity.

[0037] The shielding component can reduce the influence of other factors on the second electronic element.

[0038] In a possible implementation, an inner wall of the mounting cavity is provided with a third heat-conducting component, the third heat-conducting component protrudes towards the inside of the mounting cavity, and at least part of the heat-conducting interface material is in contact with the second electronic element.

[0039] The shielding component is made of a heat-conducting material, which can facilitate the timely dissipation of heat generated by the electronic element and reduce the possibility of heat accumulation near the electronic element.

[0040] In a possible implementation, the third heat-conducting component is integrally formed with the shielding component.

[0041] Generally, the shielding component can be made of a metal material such as stainless steel. Since the metal material has good heat-conducting capability, the metal material can be used as the third heat-conducting component to conduct the heat generated by the second electronic element and reduce the possibility of heat accumulation near the second electronic element.

[0042] The electronic device provided in the present application includes a housing, a buffer assembly connected to the housing, a first electronic element located on a side of the buffer assembly away from the housing, and a second electronic element located on a side of the housing away from the buffer assembly. The buffer assembly has a recessed portion, and at least part of the second electronic element in orthographic projection along the thickness direction of the electronic device is located in the orthographic projection of the recessed portion. By providing the recessed portion, the area of direct or indirect contact between the buffer assembly and the first electronic element and / or the second electronic element can be reduced, thereby reducing the heat transfer efficiency of the corresponding region of the buffer assembly, reducing the heat transfer efficiency of the electronic device along the thickness direction, improving the uniformity of heat along the non-thickness direction, and reducing the possibility of local high temperature of the first electronic element, thereby improving the user's thermal experience.

[0043] It should be understood that the general description above and the detailed description below are only exemplary and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 An exploded view of the electronic device provided in the present application;

[0045] Figure 2 A structural schematic diagram of the first embodiment of the electronic device provided in the present application;

[0046] Figure 3 A structural schematic diagram of the second embodiment of the electronic device provided in the present application;

[0047] Figure 4 A structural schematic diagram of the third embodiment of the electronic device provided in the present application;

[0048] Figure 5Structure diagram of a fourth embodiment of the electronic device provided in the present application;

[0049] Figure 6 Structure diagram of a fifth embodiment of the electronic device provided in the present application;

[0050] Figure 7 Structure diagram of a sixth embodiment of the electronic device provided in the present application;

[0051] Figure 8 Structure diagram of a seventh embodiment of the electronic device provided in the present application;

[0052] Figure 9 Structure diagram of an eighth embodiment of the electronic device provided in the present application;

[0053] Figure 10 Structure diagram of a ninth embodiment of the electronic device provided in the present application;

[0054] Figure 11 Structure diagram of a tenth embodiment of the electronic device provided in the present application;

[0055] Figure 12 Structure diagram of an eleventh embodiment of the electronic device provided in the present application.

[0056] Reference Signs:

[0057] 1 - housing

[0058] 11 - back cover

[0059] 2 - first electronic component

[0060] 21 - glass cover plate

[0061] 22 - display assembly

[0062] 3 - second electronic component

[0063] 4 - buffer assembly

[0064] 41 - recess

[0065] 411 - first recess

[0066] 412 - second recess

[0067] 42 - thermal insulation material

[0068] 5 - first heat conducting member

[0069] 6 - shielding member

[0070] 7 - second heat conducting member

[0071] 8 - third heat conducting component;

[0072] 9 - circuit board.

[0073] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the application and serve to explain the principles of the application. DETAILED DESCRIPTION

[0074] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the drawings.

[0075] With the development of technology, electronic devices such as mobile phones and tablets have become common communication devices in people's daily life. When in use, the load of electronic components such as mainboards and chips increases, and the generated heat increases. The heat is transmitted to the screen of the mobile phone through the middle frame and the buffer foam, causing the local temperature of the screen to be relatively high, affecting the user's touch feeling. Moreover, when the temperature control software and program inside the electronic device detect that the temperature of the screen is relatively high, the central processing unit and other electronic components will be subjected to frequency reduction processing, causing the electronic device to lag, affecting the performance of the product.

[0076] In view of this, the embodiments of the present application provide an electronic device for improving the problem that the heat generated between different electronic components of the electronic device in the prior art affects each other.

[0077] As Figure 1As shown in the figure, the Z-axis represents the thickness direction of the electronic device, the X-axis represents the width direction of the electronic device, and the Y-axis represents the length direction of the electronic device. An electronic device provided by an embodiment of the present application can be a mobile phone, a tablet computer (PAD), a personal digital assistant (PDA), a notebook computer, a handheld device with a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, or the like. The electronic device includes a housing 1, a first electronic element 2, a second electronic element 3, and a buffer assembly 4. The housing 1 can be a middle frame of the electronic device, and the housing 1 further includes a back cover 11.

[0078] In the present application, the first electronic element 2 can be a display screen of the electronic device, used for displaying images or videos, etc. The display screen includes a display panel, which can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light emitting diode (AMOLED), a flexible light-emitting diode (FLED), a Miniled, a MicroLed, a Micro-oLed, a quantum dot light emitting diode (QLED), etc. In some embodiments, the electronic device can include one or more display screens. It can be understood that the first electronic element 2 can also be other electronic devices extending along the XY plane, which are not limited in the present application.

[0079] The second electronic element 3 can be a processor. The processor can include one or more processing units. The processor can include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural-network processing unit (NPU), etc. Among them, different processing units can be independent devices, or can be integrated in one or more processors. It can be understood that the second electronic element 3 can also be other electronic devices extending along the XY plane, such as other chips provided on the mainboard of the electronic device, which is not limited in the present application.

[0080] The buffer assembly 4 can be made of buffer foam or the like. The buffer foam can be foamed from a high molecular polymer. According to the material type of the base material, it is mainly divided into polypropylene (PP), polyethylene (PE), polyurethane (PU), etc. It has air holes inside, and is mainly divided into open-cell, semi-open-cell and closed-cell structures according to the structure. When the buffer assembly 4 is applied to the electronic device, it mainly plays the roles of sealing, pressing, buffering, supporting, etc. For example, it can be used to protect the first electronic element 2. When the electronic device falls or the first electronic element 2 is impacted, the buffer foam can be used to absorb the impact, play the role of buffering, and reduce the possibility of damage to the first electronic element 2.

[0081] As shown in Figure 1 The buffer assembly 4 is connected with the shell 1, the first electronic element 2 is located on the side of the buffer assembly 4 away from the shell 1, and the second electronic element 3 is located on the side of the shell 1 away from the buffer assembly 4, that is, the buffer assembly 4 is located between the first electronic element 2 and the shell 1, and the shell 1 is located between the buffer assembly 4 and the second electronic element 3. During installation, the buffer assembly 4 can be fixedly connected with the shell 1 by bonding or the like, or can be clamped and fixed by the first electronic element 2 and the shell 1. The buffer assembly 4 can be a whole layer structure, that is, covering the surface of the side of the first electronic element 2 facing the shell 1, or can be an annular structure, that is, arranged on the side of the first electronic element 2 facing the shell 1 along the edge of the first electronic element 2. The buffer assembly 4 is provided with a recess 41, which can be arranged on the side of the mainboard, the chip or the like second electronic element 3 away from the first electronic element 2 of the shell 1. As shown in Figure 2 The surface of the side of the first electronic element 2 facing the buffer assembly 4 is the projection surface, that is, the projection surface is parallel toFigure 1 When the screen assembly is a curved screen structure, the projection plane can be a plane in which the lower end surface (the lower end surface in the thickness direction Z) of the curved screen is located, and the orthographic projection of the second electronic element 3 in the thickness direction Z of the electronic device is at least partially located in the projection range of the recess 41 in the thickness direction Z, or the orthographic projection of the second electronic element 3 in the thickness direction Z of the electronic device is completely located in the projection range of the recess 41 in the thickness direction Z. That is, the area of the recess 41 can be greater than the area of the second electronic element 3, so that the second electronic element 3 is entirely located in the projection range of the recess 41, or the area of the recess 41 can be equal to or less than the area of the second electronic element 3, so that part of the second electronic element 3 is located in the projection range of the recess 41.

[0082] The shape of the projection of the recess 41 to the projection plane can be a rectangle, a circle, a regular polygon, a polygon, or other irregular shapes. In some possible embodiments, the recess 41 can be a groove structure, that is, the bottom is not through. In other examples, the recess 41 can be a through-hole structure. The depth of the recess 41 is m, and the thickness of the buffer assembly 4 is n, specifically, 0 < m ≤ n. When the buffer assembly 4 has the recess 41, the contact area can be reduced, thereby reducing the heat conduction efficiency.

[0083] Specifically, the ratio between the depth m of the recess 41 and the thickness n of the buffer assembly 4 can be 0.2, 0.4, 0.6, 0.8, etc. Generally, the heat conduction efficiency of air is lower than that of the buffer foam, so the greater the depth of the recess 41, the stronger the heat insulation capacity of the area where the recess 41 is located, and the more conducive to reducing the influence of the heat emitted by the second electronic element 3 on the first electronic element 2.

[0084] It should be noted that the relationship between the depth m of the recess 41 and the thickness n of the buffer assembly 4 can satisfy 0 < m ≤ n, that is, the heat insulation capacity can be improved, and the possibility of mutual heat transfer between the first electronic element 2 and the second electronic element 3 can be reduced. The above-mentioned ratio between m and n is only a more preferred scheme, and in actual use, the ratio between m and n can be designed according to the actual situation. The actual ratio of m and n includes but is not limited to the above-mentioned ratio.

[0085] In some possible implementation manners, the recessed portion 41 can be filled with air, that is, no additional heat insulation material is arranged in the recessed portion 41. Since air has good heat insulation performance, the heat insulation efficiency of air is generally higher than that of the buffer assembly 4. The air filling can reduce the heat transfer efficiency of the area corresponding to the recessed portion 41, that is, reduce the heat transfer efficiency of the area whose orthographic projection along the thickness direction of the electronic device is located in the orthographic projection range of the recessed portion 41, thereby facilitating reduction of the heat conducted by the second electronic element 3 to the first electronic element 2. In some other embodiments, the recessed portion 41 can be provided with a heat insulation material 42, and the heat insulation efficiency of the heat insulation material 42 is higher than that of the buffer assembly 4, thereby reducing the heat conducted by the second electronic element 3 to the first electronic element 2.

[0086] By arranging the recessed portion 41 in the buffer assembly 4 and filling the recessed portion 41 with the heat insulation material 42 (or heat insulation medium) having a heat insulation efficiency higher than that of the buffer assembly 4, the recessed portion 41 can be used to form a heat insulation channel. The recessed portion 41 is filled with the heat insulation material 42 to further improve the heat insulation capacity of the heat insulation channel, thereby reducing the possibility of heat generated by the second electronic element 3 being transmitted to the first electronic element 2 through the area where the heat insulation channel is located, and reducing the possibility of the first electronic element 2 having a relatively high local temperature. When the first electronic element 2 is a screen assembly, the influence of screen heating on touch feeling can be reduced, thereby improving the user experience and better meeting the actual use requirements.

[0087] Since the recessed portion 41 is arranged in the buffer assembly 4, the possibility of heat generated by the second electronic element 3 being transmitted to the first electronic element 2 is reduced, thereby reducing the possibility of the temperature control software of the electronic device reducing the frequency of the second electronic element 3 due to detection of a relatively high temperature of the first electronic element 2, and reducing the possibility of the electronic device being stuck, thereby improving the user experience.

[0088] In a possible implementation manner, the surface of the first electronic element 2 facing the buffer assembly 4 is a projection surface, and the orthographic projection of the recessed portion 41 along the thickness direction Z of the electronic device contains the orthographic projection of the second electronic element 3 along the thickness direction Z of the electronic device. The projection area of the recessed portion 41 is greater than the projection area of the second electronic element 3, and covers the entire projection of the second electronic element 3. For example, when the area of the second electronic element 3 is 10 square centimeters, the area of the recessed portion 41 can be 30 square centimeters to 40 square centimeters.

[0089] By making the projection area of the recessed portion 41 greater than the projection area of the second electronic element 3, the second electronic element 3 can be located in the area range of the recessed portion 41, thereby facilitating heat insulation through the recessed portion 41 to reduce the possibility of heat being transmitted to the first electronic element 2.

[0090] As Figure 3As shown, in one possible implementation, the electronic device may include a first thermally conductive component 5, the thermal conductivity of which along the thickness direction Z of the electronic device is lower than its thermal conductivity along the length direction Y and / or width direction X of the electronic device. The first thermally conductive component 5 is mounted on the side of the housing 1 facing the second electronic component 3.

[0091] The first heat-conducting component 5 can be made of a material with high thermal conductivity to absorb the heat generated by the second electronic component 3 and transfer the heat to the side of the heat-conducting material away from the chip assembly. This design helps to remove the heat generated by the second electronic component 3 from its vicinity in a timely manner, thereby reducing the possibility of the second electronic component 3 experiencing frequency reduction and electronic device lag due to excessive temperature. In some possible embodiments, the first heat-conducting component 5 can be made of graphite material, such as graphene or artificial graphite. Since graphite material has different properties in different directions and is anisotropic, its thermal conductivity will also vary in different directions. In practical use, the first heat-conducting component 5 can be set to have lower thermal conductivity along the thickness direction Z of the electronic device and higher thermal conductivity along the non-thickness direction, which is conducive to heat transfer along the non-thickness direction Z, making the temperature of the first electronic component 2 more uniform and reducing the possibility of local overheating of the first electronic component 2. In other examples, the first heat-conducting component 5 may also be a VC heat exchanger plate, in which the heat-conducting medium channels are arranged in a direction parallel to the XY plane, so that the heat conduction efficiency of the first heat-conducting component 5 along the thickness direction Z is lower than the heat conduction efficiency along the XY plane.

[0092] like Figure 3 As shown, in one possible implementation, the electronic device may further include a shielding component 6. The shielding component 6 may be a shielding cover or similar structure, and may be made of a metal or other material, such as stainless steel. The shielding component 6 is located on the side of the buffer assembly 4 away from the first electronic component 2, specifically on the side of the housing 1 facing the second electronic component 3. The shielding component 6 has a mounting cavity, in which at least a portion of the motherboard of the electronic device is located. The second electronic component 3, such as a chip, is mounted on the circuit board 9 and located in the mounting cavity. The shielding component 6 can be used to shield the second electronic component 3 from interference from external signals, magnetic fields, radiation, and other factors, thereby improving the stability of the second electronic component 3's operation. Simultaneously, metal materials generally have good thermal conductivity and can be used to conduct heat. That is, the shielding component 6 can serve as both a shielding and heat-conducting component. Specifically, the shielding component 6 may protrude towards the direction close to the second electronic component 3, and the protruding portion can serve as a third heat-conducting component 8. The third heat-conducting component 8 can be integrally formed into the inner wall of the mounting cavity during the processing of the shielding component 6. The third heat-conducting component 8 is used to contact the second electronic component 3 to absorb the heat generated by the second electronic component 3.

[0093] In one possible implementation, the shielding component 6 may include an end cap and a mounting bracket. The bracket may be made of materials such as nickel-plated copper, nickel silver, stainless steel, or tin-plated steel strip. The end cap may be made of stainless steel. The end cap is mounted on the circuit board 9 via the mounting bracket to protect electronic components and shield interference signals.

[0094] In one possible implementation, at least a portion of the shielding component 6 is a thermally conductive material. Since metal has good thermal conductivity, it can be used as a thermally conductive material.

[0095] By using a thermally conductive material, the shielding component 6 can not only provide shielding but also dissipate the heat generated by the second electronic component 3 in a timely manner.

[0096] like Figure 4 As shown, in one possible implementation, the third thermally conductive component 8 can also be provided separately. For example, to improve heat transfer efficiency, a third thermally conductive component 8 can be provided between the shielding component 6 and the second electronic component 3, and at least a portion of the third thermally conductive component 8 is in contact with the second electronic component 3. The third thermally conductive component 8 can be a thermal interface material (TIM). For example, silicone grease can be applied between the shielding component 6 and the second electronic component 3. Since silicone grease has good thermal conductivity, it can absorb the heat emitted by the second electronic component 3 in a timely manner and transfer the heat to the shielding component 6, and then transfer the heat out through the shielding component 6, thereby reducing the possibility of heat accumulation between the second electronic component 3.

[0097] By setting the third heat-conducting component 8, it is beneficial to remove the heat generated by the second electronic component 3 away from the vicinity of the second electronic component 3 in a timely manner through contact heat transfer, thereby improving the heat dissipation efficiency of the electronic device.

[0098] like Figure 3As shown, in one possible implementation, the first electronic component 2 can be a screen assembly, which may include a glass cover 21 and a display component 22. The display component 22 can be an OLED display component. The glass cover 21 is located on the side of the display component 22 away from the housing 1, and is used to protect the display component 22. A second heat-conducting component 7 can be provided between the buffer component 4 and the housing 1. Specifically, graphene, graphite sheets, composite graphite, copper foil, VC, heat pipes, etc. can be selected. Its specific characteristics or structure can be the same as the first heat-conducting component 5 mentioned above, that is, the heat conduction efficiency of the second heat-conducting component 7 along the length direction Y and / or width direction X of the electronic device is higher than its heat conduction efficiency along the thickness direction Z. When the heat generated by the second electronic component 3 is transferred to the second heat-conducting component 7 through the housing 1, the second heat-conducting component 7 can conduct the heat along the width direction X and / or length direction Y of the electronic device, that is, reduce the heat transfer along the thickness direction Z of the electronic device, promote the heat transfer along the XY plane, which is conducive to the uniform distribution of heat, thereby helping to reduce the occurrence of local overheating of the electronic device and improving the user experience.

[0099] like Figure 3 As shown, in one possible implementation, the recess 41 may be located on the side of the buffer assembly 4 facing the second electronic element 3, and recessed in a direction away from the second electronic element 3.

[0100] With this design, the opening of the recess 41 can be oriented toward the second electronic component 3, thereby reducing the possibility of heat transfer through contact between the buffer assembly 4 and the second electronic component 3, which is beneficial to reducing heat transfer efficiency.

[0101] like Figure 4 As shown, in one possible embodiment, the recess 41 includes a first recess 411 and a second recess 412. The first recess 411 is located on the side of the buffer assembly 4 facing the second electronic component 3, and the second recess 412 is located on the side of the buffer assembly 4 away from the first electronic component 2. Specifically, the depth of the first recess 411 can be greater than or equal to the depth of the second recess 412. Typically, the first electronic component 2 is a screen assembly, and the second electronic component 3 is a chip. The chip generates a large amount of heat. Therefore, a larger depth of the first recess 411 can reduce the transfer of heat generated by the chip to the side where the buffer assembly 4 is located, thereby helping to reduce the transfer of heat to the side where the first electronic component 2 is located.

[0102] Compared to the scheme where the depth of the first recess 411 can be greater than or equal to the depth of the second recess 412, the second recess 412 is deeper than the first recess 411 and can also play a role in hindering heat conduction. However, since the first recess 411 is shallower, its heat insulation ability will be relatively poor. It is possible that a small portion of the heat generated by the second electronic component 3 can be easily transferred to the buffer assembly 4 and then to the first electronic component 2 through other areas of the buffer assembly 4, i.e., areas without recesses 41.

[0103] By providing the first recess 411 and the second recess 412, the direct or indirect contact area between the buffer assembly 4 and the second electronic component 3, and between the first electronic component 2 and the buffer assembly 4, can be reduced, thereby reducing heat conduction efficiency. The second recess 412 is used to further reduce the possibility of heat transfer to the first electronic component 2, so that heat can spread along the non-thickness direction Z, thereby reducing the possibility of local overheating of the first electronic component 2.

[0104] like Figure 5 As shown, in one possible implementation, the recess 41 is a through hole, that is, along the thickness direction Z of the electronic device, the recess 41 completely penetrates the buffer assembly 4.

[0105] By setting the recessed portion 41 as a through hole, the direct or indirect contact area between the second electronic component 3 and the first electronic component 2 and the buffer assembly 4 can be reduced, thereby reducing the heat conduction efficiency and the possibility of heat from the second electronic component 3 being transferred to the first electronic component 2.

[0106] like Figure 6 As shown, in one possible implementation, the buffer component 4 can be provided with multiple recesses 41. For example, multiple grooves or through holes can be provided on the same side of the buffer component 4, and the grooves or through holes are arranged according to a preset rule. For example, multiple rows of grooves / through holes can be provided, with multiple grooves / through holes in each row. That is, the grooves or through holes are arranged in an array. For example, the array arrangement can be, for example, 2*2, 2*3, 2*4, 3*3, or 3*4. It is understood that the above preset rule can be set according to specific circumstances, and this application does not limit the number and position of the arrangement.

[0107] like Figure 7 As shown, in one possible implementation, the recess 41 can be filled with a thermal insulation material 42 or an air gap. The thermal conductivity of the thermal insulation material 42 is lower than that of the buffer assembly 4. The thermal insulation material 42 can be selected from thermal insulation aerogel, asbestos, rock wool vacuum board, ceramic fiber paper, glass fiber cotton, etc., or materials containing sulfates such as aluminum sulfate. It can also be thermal insulation film, thermal insulation paper, thermal insulation pad, etc. The thermal insulation material 42 can be selected from one or more of the above embodiments and combined.

[0108] Since air itself has good heat insulation capacity, and compared with filling other heat insulation materials 42, the cost of using air is lower, therefore, the recess 41 can be arranged only in the buffer assembly 4 and no other heat insulation materials 42 are additionally filled.

[0109] Specifically, the heat insulation material can adopt heat insulation aerogel, which has good heat insulation capacity and is beneficial to reduce the possibility of local high temperature of the first electronic element 2 and the second electronic element 3, and the mass of the heat insulation aerogel is small, compared with the heat insulation pad, the heat insulation effect of the heat insulation aerogel is better at the same thickness, that is, less (thinner) heat insulation aerogel can obtain good heat insulation effect, therefore, when the heat insulation aerogel is applied to electronic devices such as mobile phones, tablets, notebook computers and the like, it is beneficial to improve the heat insulation capacity while reducing the weight of the electronic device, making it more convenient for users to carry and more in line with actual use requirements.

[0110] Specifically, in a possible implementation, an adhesive can be arranged on the inner wall of the recess 41, and the heat insulation material 42 can be bonded to the inner wall of the recess 41 through the adhesive. Specifically, the adhesive can adopt heat insulation glue to further reduce the heat conduction efficiency.

[0111] As shown in Figure 8 , Figure 9 and Figure 10 , in a possible implementation, the recess 41 can be a rectangular recess, a circular recess, a regular polygon recess, a polygon recess or other irregular shape recess, and the specific structure can be designed according to actual requirements.

[0112] By arranging the heat insulation material 42 in the recess 41, the heat conduction efficiency of the buffer foam to the area of the second electronic element 3 such as the mainboard and the chip can be further reduced, which is beneficial to hinder the conduction of heat to the position of the first electronic element 2, thereby reducing the possibility of local high temperature of the first electronic element 2.

[0113] When designing the structure of the recess 41, the position, depth, and area of ​​the recess 41 can be adjusted according to actual conditions, such as the position and shape of other surrounding components. The second electronic component 3 can be entirely located within the projection range of the recess 41, or it can be partially located within the projection range of the recess 41. When the second electronic component 3 is a component that generates a large amount of heat, the area and depth of the recess 41 can be increased. When the second electronic component 3 is a component that generates a small amount of heat, the area or depth of the recess 41 can be reduced to decrease the number or volume of the recesses 41 in the buffer assembly 4. This reduces the impact of the recesses 41 on the buffering effect of the buffer assembly 4, thereby reducing the possibility of damage to the first electronic component 2 and / or the second electronic component 3, and better meeting actual usage requirements.

[0114] In one possible implementation, the thermal insulation material 42 can fill the entire space of the recess 41.

[0115] By filling the entire space of the recess 41 with the heat insulation material 42, the heat conduction efficiency of the area can be reduced, thereby reducing the possibility of heat generated by the second electronic component 3 being transferred to the first electronic component 2.

[0116] like Figure 11 and Figure 12 As shown, in one possible implementation, the thermal insulation material 42 can be a mesh structure. Specifically, the mesh structure can be a cross-shaped mesh, a strip structure, etc. Since air also has good thermal insulation properties, the area of ​​the thermal insulation material 42 can be appropriately reduced, achieving the thermal insulation effect while also reducing costs, which is more in line with actual production needs.

[0117] This application provides an electronic device, which includes a housing 1, a buffer assembly 4 connected to the housing 1, a first electronic component 2 located on the side of the buffer assembly 4 away from the housing 1, and a second electronic component 3 located on the side of the housing 1 away from the buffer assembly 4. The buffer assembly 4 has a recess 41, and at least a portion of the orthographic projection of the second electronic component 3 along the thickness direction of the electronic device is located within the orthographic projection of the recess. By providing the recess 41, the area of ​​direct or indirect contact between the buffer assembly 4 and the first electronic component 2 and / or the second electronic component 3 can be reduced, thereby reducing the heat transfer efficiency of the corresponding area of ​​the buffer assembly 4, thereby reducing the heat transfer efficiency of the electronic device along the thickness direction, improving the uniformity of heat along the non-thickness direction, which is beneficial to reducing the possibility of local high temperatures in the first electronic component 2 and improving the user's thermal experience.

[0118] The embodiments of the present application are described above with reference to the drawings, but the present application is not limited to the above-described specific embodiments, and the above-described specific embodiments are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

[0119] It should be noted that a portion of this patent application document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.

Claims

1. An electronic device, characterized in that, The electronic device includes: case; First electronic component; Second electronic component; A cushioning assembly, the cushioning assembly being made of cushioning foam material, the cushioning assembly being connected to the housing, the first electronic component being located on the side of the cushioning assembly away from the housing, and the second electronic component being located on the side of the housing away from the cushioning assembly; The buffer assembly is provided with a recessed portion, and at least a portion of the orthographic projection of the second electronic component along the thickness direction of the electronic device is located within the orthographic projection of the recessed portion along the thickness direction of the electronic device. The electronic device further includes a second thermally conductive component located on the side of the buffer assembly away from the first electronic component, and the thermal conductivity of the second thermally conductive component along the length and / or width direction of the electronic device is higher than that along the thickness direction of the electronic device.

2. The electronic device according to claim 1, characterized in that, The recessed portion includes a first recessed portion, which is located on the side of the buffer assembly facing the second electronic component, and the recessed portion is recessed in a direction away from the second electronic component.

3. The electronic device according to claim 2, characterized in that, The recessed portion further includes a second recessed portion, which is located on the side of the buffer assembly away from the second electronic component.

4. The electronic device according to claim 1, characterized in that, The recessed portion is a through hole, which penetrates the buffer assembly along the thickness direction of the electronic device.

5. The electronic device according to claim 4, characterized in that, The buffer assembly is provided with multiple through holes.

6. The electronic device according to any one of claims 1 to 5, characterized in that, Along the thickness direction of the electronic device, the depth of the recess is m, the thickness of the buffer component is n, and 0 < m ≤ n.

7. The electronic device according to any one of claims 1 to 5, characterized in that, The recessed portion is provided with heat-insulating material, and the thermal conductivity of the heat-insulating material is lower than that of the buffer assembly.

8. The electronic device according to claim 7, characterized in that, An adhesive is provided between the sidewall of the recess and the heat insulation material, and the heat insulation material is bonded to the sidewall of the recess.

9. The electronic device according to claim 7, characterized in that, The thermal insulation material fills all the recesses or the thermal insulation material has a mesh structure.

10. The electronic device according to claim 7, characterized in that, At least a portion of the thermal insulation material is one or more of the following materials: thermal insulation component, thermal insulation aerogel, glass fiber wool, asbestos, rock wool, silicate, ceramic fiber paper, and vacuum plate.

11. The electronic device according to any one of claims 1 to 5, characterized in that, The orthographic projection of the recess along the thickness direction of the electronic device includes the orthographic projection of the second electronic element along the thickness direction of the electronic device.

12. The electronic device according to any one of claims 1 to 5, characterized in that, The electronic device further includes a first heat-conducting component, wherein the heat conduction efficiency of the first heat-conducting component along the thickness direction of the electronic device is lower than the heat conduction efficiency of the first heat-conducting component along the length direction and / or width direction of the electronic device. The first thermally conductive component is mounted on the side of the housing facing the second electronic component.

13. The electronic device according to any one of claims 1 to 5, characterized in that, The electronic device further includes a shielding component located on the side of the housing facing the second electronic component, the shielding component having a mounting cavity in which the second electronic component is located.

14. The electronic device according to claim 13, characterized in that, The inner wall of the mounting cavity is provided with a third heat-conducting component, which protrudes toward the interior of the mounting cavity, and at least a portion of the third heat-conducting component is in contact with the second electronic component.

15. The electronic device according to claim 14, characterized in that, The third heat-conducting component is integrally formed with the shielding component.

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