A polishing and cleaning method for a scandium-containing target

Abstract

The present invention discloses a polishing and cleaning method for a scandium-containing target, belonging to the technical field of targets, and comprising the following steps: successively performing rough grinding, fine grinding, rough polishing, and fine polishing in a two-axis polishing machine, and cleaning and drying after the fine polishing is completed. By performing rough grinding, fine grinding, rough polishing, and fine polishing on the scandium-containing target, the present invention can effectively remove oxides and foreign matters on the surface of the target, eliminate color difference on the surface of the target, and at the same time cause little loss to the target. By controlling the grinding cloth for rough grinding, fine grinding, rough polishing, and fine polishing, as well as the rotation speed and pressure of the polishing machine, the present invention ensures that the flatness and roughness of the polished surface at each position are consistent. By using scouring pads with different particle sizes in combination with organic solvents for grinding, oil stains and oxides can be removed. By using a polishing sponge and a mixed polishing liquid, the surface of the target is polished to be close to a mirror surface, removing oxidation, oil stains, and color difference on the surface of the target while reducing the surface roughness of the target and improving the flatness of the target.

Description

Technical Field

[0001] The present invention relates to the technical field of target materials, and specifically to a polishing and cleaning method for scandium-containing target materials. Background Art

[0002] Due to its excellent piezoelectric properties, ScAl is widely used in fields such as MEMS sensors, filter chips, and integrated circuits. With the increase in scandium content, the piezoelectric properties of ScAl thin films are significantly improved. When the Sc content reaches 43 at%, its piezoelectric properties are the strongest. During the target cutting process, the surface of the target is eroded and oxidized by the coolant, forming oxidation spots and oil stain color differences. During the target bonding process, the sputtering surface of the target will also be oxidized due to high temperature. Knife marks will be generated when the target is processed on a CNC machine or a grinding machine on the sputtering surface, affecting the roughness of the target sputtering surface and the shipping appearance. Secondly, it affects the purity of the target and the use by customers. Moreover, with the increase in scandium content, the hardness and brittleness of aluminum scandium alloy targets also increase significantly, which brings certain difficulties to the surface polishing treatment of the targets.

[0003] After the target thickness is processed to the finished size in the later stage of target processing, the sputtering surface of the target may be contaminated due to cutting, bonding, defect detection, sandblasting operations, etc., resulting in oxidation and color differences. Since the thickness margin of the target is small, continuing machining may lead to unqualified target thickness. Polishing and cleaning can effectively remove oxides, foreign matters, and color differences on the target surface, and at the same time cause less loss to the target. When manually polishing, due to human factors, the polishing depth at different positions of the target may be different, resulting in extremely poor flatness of the target. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a polishing and cleaning method for scandium-containing target materials, which can reduce the surface roughness of the target while removing oxidation, oil stains, and color differences on the target surface, and improve the flatness of the target.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows:

[0006] A polishing and cleaning method for scandium-containing target materials, comprising the following steps:

[0007] Rough grinding, fine grinding, rough polishing, and fine polishing are sequentially carried out in a two-axis polishing machine, and after fine polishing, it is cleaned and dried;

[0008] For the rough grinding, a grinding cloth with a particle size of 180 - 320 meshes is used for grinding, the rotation speed of the polishing machine is 1200 - 1800 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa;

[0009] For the fine grinding, a grinding cloth with a particle size of 320 - 400 meshes is used for grinding, the rotation speed of the polishing machine is 1500 - 2500 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa;

[0010] For rough polishing, abrasive cloth with a particle size of 320 - 400 mesh is used for polishing. The rotation speed of the polishing machine is 1500 - 2500 r / min, the polishing agent is diamond polishing fluid, and the polishing pressure is 10 - 30 Kpa;

[0011] For fine polishing, a polishing sponge is used for polishing. The rotation speed of the polishing machine is 2500 - 3000 r / min, the polishing agent is a mixed polishing fluid, and the polishing pressure is 10 - 20 Kpa.

[0012] As a preferred embodiment of the present invention, the scandium content in the scandium - containing target is ≥25 at%.

[0013] As a preferred embodiment of the present invention, the scandium - containing target includes an aluminum - scandium target or a scandium - gallium target.

[0014] As a preferred embodiment of the present invention, the organic solvent includes at least one of absolute ethanol and isopropyl alcohol.

[0015] As a preferred embodiment of the present invention, 8689 scouring pads are used for rough grinding.

[0016] As a preferred embodiment of the present invention, 7447 scouring pads are used for fine grinding.

[0017] As a preferred embodiment of the present invention, 7447 scouring pads are used for rough grinding.

[0018] As a preferred embodiment of the present invention, the mixed polishing fluid includes diamond polishing fluid and an organic solvent.

[0019] As a preferred embodiment of the present invention, the cleaning specifically is: ultrasonic cleaning the target with an organic solvent or wiping the target with an organic solvent.

[0020] As a preferred embodiment of the present invention, during rough grinding, fine grinding, rough polishing, and fine polishing, the moving speed of the Y - axis is 10 - 50 mm / s. When the grinding in the Y - axis direction is completed, the X - axis steps 50 - 100 mm each time until the grinding surface covers the entire target.

[0021] The beneficial effects of the present invention are as follows: (1) By rough grinding, fine grinding, rough polishing, and fine polishing the scandium-containing target, the present invention can effectively remove oxides and foreign matters on the surface of the target, eliminate color differences on the surface of the target, and at the same time cause little loss to the target. By controlling the grinding cloth and the rotation speed and pressure of the polishing machine for rough grinding, fine grinding, rough polishing, and fine polishing, the flatness and roughness of the polished surface at each position are ensured to be consistent. By using abrasive cloths with different particle sizes in combination with organic solvents for grinding, oil stains and oxides can be removed. Using a polishing sponge and a mixed polishing solution, the surface of the target is polished to be close to a mirror surface, removing oxidation, oil stains, and color differences on the surface of the target while reducing the surface roughness of the target and improving the flatness of the target; (2) During the processes of rough grinding, fine grinding, and rough polishing, organic solvents need to be used as grinding agents. On the one hand, the aluminum scandium target with a high scandium content is relatively brittle, and the uneven temperature of the target caused by grinding may cause the target to crack. During the grinding process, using organic solvents as grinding agents can play a good role in cooling and prevent the target from cracking. On the other hand, if the grinding debris is not taken away in time, it will deepen the grinding marks on the surface of the target and is not conducive to observing the surface grinding situation. Organic solvents can play a role in flushing the grinding debris; Through the fine polishing described in the present invention, a target with a mirror effect can be obtained. If only a polishing sponge is used without adding a mixed polishing agent, the roughness of the sponge is limited and a mirror effect cannot be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Figure for the aluminum scandium target before treatment in Example 1;

[0023] Figure 2 Figure for the aluminum scandium target after treatment in Example 1. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] In the present invention, among the technically characterized described in an open-ended manner, there are included closed technical solutions composed of the listed features, as well as open technical solutions including the listed features.

[0026] In the present invention, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are considered continuous and include the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when the range refers to integers, it includes each integer between the minimum and maximum values of the range. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein.

[0027] In the present invention, there is no particular limitation on the specific dispersion and stirring treatment methods.

[0028] In the present invention, unless otherwise stated, the parts mentioned are all parts by mass.

[0029] The reagents or instruments used in the present invention that are not specified by the manufacturer are all conventional products that can be obtained through commercial purchase.

[0030] The embodiments of the present invention provide a polishing and cleaning method for a scandium-containing target, comprising the following steps:

[0031] Rough grinding, fine grinding, rough polishing, and fine polishing are sequentially carried out in a two-axis polishing machine, and after fine polishing, cleaning and drying are performed;

[0032] For the rough grinding, a grinding cloth with a particle size of 180 - 320 mesh is used for grinding, the rotational speed of the polishing machine is 1200 - 1800 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa;

[0033] For the fine grinding, a grinding cloth with a particle size of 320 - 400 mesh is used for grinding, the rotational speed of the polishing machine is 1500 - 2500 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa;

[0034] For the rough polishing, a grinding cloth with a particle size of 320 - 400 mesh is used for polishing, the rotational speed of the polishing machine is 1500 - 2500 r / min, the polishing agent is diamond polishing liquid, and the polishing pressure is 10 - 30 Kpa;

[0035] For the fine polishing, a polishing sponge is used for polishing, the rotational speed of the polishing machine is 2500 - 3000 r / min, the polishing agent is a mixed polishing liquid, and the polishing pressure is 10 - 20 Kpa.

[0036] By rough grinding, fine grinding, rough polishing, and fine polishing the scandium-containing target, the oxides and foreign matters on the surface of the target can be effectively removed, the color difference on the surface of the target can be eliminated, and at the same time, the loss of the target is small. By controlling the grinding cloth for rough grinding, fine grinding, rough polishing, and fine polishing, as well as the rotation speed and pressure of the polishing machine, the flatness and roughness of the polished surface at each position are ensured to be consistent. By using abrasive cloths with different particle sizes in combination with organic solvents for grinding, oil stains and oxides can be removed. Using a polishing sponge and a mixed polishing liquid, the surface of the target is polished to be close to a mirror surface. While removing oxidation, oil stains, and color difference on the surface of the target, the surface roughness of the target is reduced, and the flatness of the target is improved.

[0037] It should be noted that the two-axis polishing machine described in the present invention is a conventional two-axis polishing machine in the art. The present invention does not involve structural improvements to the polishing machine. For example, the structures of the two-axis polishing machines have been disclosed by many companies and numerous patents. In the polishing and cleaning method described in the present invention, only the two-axis polishing machine needs to have an X-axis, a Y-axis, and a pressure sensor, and those skilled in the art can obtain it through regular purchase.

[0038] Exemplarily, the polishing machine suitable for the present invention has an X-axis and a Y-axis. The movement of the X and Y axes is realized by a synchronous belt slide table module servo motor stepping cross slide table electric guide rail module xy-axis moving platform. The pneumatic grinding machine is installed on the guide rail of the Y-axis and is also equipped with a pressure sensor. For example, the polishing machine is a JP035.2A large two-axis high-speed fine grinding and polishing machine or a JP035.2B large two-axis high-speed fine grinding and polishing machine.

[0039] In one of the embodiments, the scandium content in the scandium-containing target is ≥25 at%.

[0040] In the scandium-containing target, especially the aluminum scandium target, as the scandium content increases, the brittle phase in the aluminum scandium target increases, and the hardness of the target also increases. The specific processing method of the aluminum scandium target with a high scandium content makes the surface of the target easily contaminated by oil stains, thereby oxidizing and generating color difference.

[0041] The present invention is directed to a scandium-containing target with a scandium content of ≥25 at% in the scandium-containing target. When the scandium content reaches more than 25 at%, the brittleness and hardness of the target increase. During the grinding and polishing process, it is necessary to strictly control each parameter of grinding and polishing. If there is a slight carelessness, it is easy to cause cracks or scratches on the target, or even break the target.

[0042] Specifically, when polishing and cleaning a scandium-containing target with a scandium content of ≥25 at%.

[0043] During the rough grinding and fine grinding processes, if an abrasive cloth with a smaller particle size is used for rough grinding (it is known that the larger the particle size, the finer it is), the sputtering surface of the target may be damaged. If an abrasive cloth with a larger particle size is used for rough grinding, the grinding effect is not good, and the grinding time is greatly extended.

[0044] During rough grinding, fine grinding, and rough polishing, an organic solvent is required as the abrasive. On the one hand, the aluminum scandium target with a high scandium content is brittle in nature. The uneven temperature of the target caused by grinding may lead to target cracking. During the grinding process, using an organic solvent as the abrasive can play a good role in cooling and prevent the target from cracking. On the other hand, if the grinding debris is not removed in time, it will deepen the grinding marks on the target surface and is not conducive to observing the surface grinding condition. The organic solvent can play a role in flushing the grinding debris.

[0045] Through the fine polishing described in the present invention, a target with a mirror effect can be obtained. If only a polishing sponge is used without adding a mixed polishing agent, the roughness of the sponge is limited and the mirror effect cannot be achieved.

[0046] The polishing and cleaning method described in the present invention is particularly applicable to aluminum scandium targets with a scandium content of greater than or equal to 30 at%. When the scandium content is ≥30 at%, the brittleness and hardness of the target increase. By using the polishing and cleaning method of the present invention, the surface roughness of the target can be most effectively reduced and the flatness of the target can be maintained. However, when the content is less than 30 at%, the effect of reducing the surface roughness of the target and improving the flatness is not good.

[0047] In one embodiment, the scandium-containing target includes an aluminum scandium target or a scandium gallium target. It is particularly applicable to aluminum scandium targets.

[0048] In one embodiment, the organic solvent includes at least one of anhydrous ethanol and isopropanol.

[0049] In one embodiment, 8689 scouring pads are used for rough grinding.

[0050] In one embodiment, 7447 scouring pads are used for fine grinding.

[0051] In one embodiment, 7447 scouring pads are used for rough grinding.

[0052] In one embodiment, the mixed polishing liquid includes diamond polishing liquid and an organic solvent.

[0053] In one embodiment, the cleaning specifically includes: ultrasonically cleaning the target with an organic solvent or wiping the target with an organic solvent.

[0054] In one embodiment, during rough grinding, fine grinding, rough polishing, and fine polishing, the moving speed of the Y-axis is 10 - 50 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 50 - 100 mm until the entire target surface is covered.

[0055] The grinding method is to continuously move along one axial direction. After the entire axis is completely ground, a certain displacement is stepped along the other axis, and then continue to grind continuously along the previous direction until the entire target is covered. The speed in the continuous movement direction will affect the grinding effect. If the speed is too fast, the grinding effect cannot be achieved; if the speed is too slow, it will increase the consumption of the target and consume more time at the same time.

[0056] The following examples are provided to facilitate the understanding of the present invention. These examples are not provided to limit the scope of the claims.

[0057] Example 1

[0058] A polishing and cleaning method for a scandium-containing target, comprising the following steps:

[0059] (1) Polishing and cleaning an aluminum scandium target with a scandium content of 30 at%. The flatness of the aluminum scandium target before polishing is 0.05 μm, and the roughness is 0.875 μm. The aluminum scandium target before polishing is as Figure 1 shown;

[0060] (2) Fix the aluminum scandium target on the base of a two-axis polishing machine with a vacuum chuck;

[0061] (3) Coarse grinding the aluminum scandium target: The coarse grinding is carried out using 8689 scouring pads, the rotation speed of the polishing machine is 1200 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0062] (4) Fine grinding the aluminum scandium target: The fine grinding is carried out using 7447 scouring pads, the rotation speed of the polishing machine is 1500 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0063] (5) Coarse polishing the aluminum scandium target: The coarse polishing is carried out using 7447 scouring pads, the rotation speed of the polishing machine is 1500 r / min, the polishing agent is diamond polishing liquid, the polishing pressure is 25 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0064] (6) Fine polishing the aluminum scandium target: The fine polishing is carried out using a polishing sponge, the rotation speed of the polishing machine is 2500 r / min, the polishing agent is diamond polishing liquid (the diamond polishing liquid and isopropyl alcohol are composed according to a mass ratio of 1:1), the polishing pressure is 15 Kpa, the moving speed of the Y-axis is 10 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0065] (7) Cleaning: ultrasonically clean the target with anhydrous ethanol;

[0066] (8) Drying: dry the target with compressed air to obtain a polished and clean scandium-doped aluminum target. As Figure 2 shown, there is no oxidation or color difference on the surface of the target. It has a mirror effect. The flatness of the target is 0.015 μm, and the roughness is 0.264 μm.

[0067] Example 2

[0068] A method for polishing and cleaning a scandium-containing target, comprising the following steps:

[0069] (1) Polish and clean a scandium-doped aluminum target with a scandium content of 40 at%. The flatness of the scandium-doped aluminum target before polishing is 0.043 μm, and the roughness is 0.967 μm;

[0070] (2) Fix the scandium-doped aluminum target on the base of a two-axis polishing machine with a vacuum chuck;

[0071] (3) Rough grind the scandium-doped aluminum target: use 8689 scouring pads for grinding. The rotation speed of the polishing machine is 1200 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0072] (4) Fine grind the scandium-doped aluminum target: use 7447 scouring pads for grinding. The rotation speed of the polishing machine is 1500 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0073] (5) Rough polish the scandium-doped aluminum target: use 7447 scouring pads for polishing. The rotation speed of the polishing machine is 1500 r / min, the polishing agent is diamond polishing liquid, the polishing pressure is 25 Kpa, the moving speed of the Y-axis is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0074] (6) Fine polish the scandium-doped aluminum target: use a polishing sponge for polishing. The rotation speed of the polishing machine is 2500 r / min, the polishing agent is diamond polishing liquid (composed of diamond polishing liquid and isopropyl alcohol in a mass ratio of 1:1), the polishing pressure is 15 Kpa, the moving speed of the Y-axis is 10 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0075] (7) Cleaning: ultrasonically clean the target with anhydrous ethanol;

[0076] (8) Air drying: Use compressed air to dry the target, and obtain a polished and cleaned scandium-containing aluminum target. There is no oxidation or color difference on the surface of the target, which has a mirror effect. The flatness of the target is 0.016 μm, and the roughness is 0.366 μm.

[0077] Example 3

[0078] A polishing and cleaning method for a scandium-containing target, comprising the following steps:

[0079] (1) Polish and clean a scandium-containing aluminum target with a scandium content of 40 at%. The flatness of the scandium-containing aluminum target before polishing is 0.037 μm, and the roughness is 0.856 μm;

[0080] (2) Fix the scandium-containing aluminum target on the base of a two-axis polishing machine with a vacuum chuck;

[0081] (3) Rough grinding of the scandium-containing aluminum target: The rough grinding is carried out using 8689 scouring pads. The rotation speed of the polishing machine is 1500 r / min, the grinding agent is anhydrous ethanol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 50 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0082] (4) Fine grinding of the scandium-containing aluminum target: The fine grinding is carried out using 7447 scouring pads. The rotation speed of the polishing machine is 1500 r / min, the grinding agent is isopropanol, the grinding pressure is 45 Kpa, the moving speed of the Y-axis is 50 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0083] (5) Rough polishing of the scandium-containing aluminum target: The rough polishing is carried out using 7447 scouring pads. The rotation speed of the polishing machine is 1500 r / min, the polishing agent is diamond polishing liquid, the polishing pressure is 25 Kpa, the moving speed of the Y-axis is 50 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0084] (6) Fine polishing of the scandium-containing aluminum target: The fine polishing is carried out using a polishing sponge. The rotation speed of the polishing machine is 2500 r / min, the polishing agent is diamond polishing liquid (composed of diamond polishing liquid and isopropanol in a mass ratio of 1:1), the polishing pressure is 15 Kpa, the moving speed of the Y-axis is 10 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0085] (7) Cleaning: Ultrasonically clean the target with anhydrous ethanol;

[0086] (8) Air drying: Use compressed air to dry the target, obtaining a polished and cleaned aluminum scandium target. There is no oxidation or color difference on the surface of the target, and it has a mirror effect. The flatness of the target is 0.015 μm, and the roughness is 0.366 μm.

[0087] Comparative Example 1

[0088] A polishing and cleaning method for a scandium-containing target, comprising the following steps:

[0089] (1) Polish and clean an aluminum scandium target with a scandium content of 20 at% (the same batch as in Example 1). The flatness of the aluminum scandium target before polishing is 0.05 μm, and the roughness is 0.875 μm. The aluminum scandium target before polishing is as Figure 1 shown;

[0090] (2) Fix the aluminum scandium target on the base of a two-axis polishing machine with a vacuum chuck;

[0091] (3) Rough grind the aluminum scandium target: The rough grinding is carried out using 8689 scouring pads. The rotation speed of the polishing machine is 1200 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the Y-axis moving speed is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0092] (4) Fine grind the aluminum scandium target: The fine grinding is carried out using 7447 scouring pads. The rotation speed of the polishing machine is 1500 r / min, the grinding agent is isopropyl alcohol, the grinding pressure is 45 Kpa, the Y-axis moving speed is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0093] (5) Rough polish the aluminum scandium target: The rough polishing is carried out using 7447 scouring pads. The rotation speed of the polishing machine is 1500 r / min, the polishing agent is diamond polishing liquid, the polishing pressure is 25 Kpa, the Y-axis moving speed is 30 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0094] (6) Fine polish the aluminum scandium target: The fine polishing is carried out using a polishing sponge. The rotation speed of the polishing machine is 2500 r / min, the polishing agent is diamond polishing liquid (the diamond polishing liquid and isopropyl alcohol are composed according to a mass ratio of 1:1), the polishing pressure is 15 Kpa, the Y-axis moving speed is 10 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 100 mm until the grinding surface covers the entire target;

[0095] (7) Cleaning: Ultrasonically clean the target with anhydrous ethanol;

[0096] (8) Blow dry: Use compressed air to blow dry the target to obtain a polished and cleaned aluminum scandium target. The mirror effect cannot be achieved. The flatness of the target is 0.037 μm, and the roughness is 0.566 μm.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A polishing and cleaning method for a scandium-containing target, characterized in that, It includes the following steps: Rough grinding, fine grinding, rough polishing, and fine polishing are successively carried out in a two-axis polishing machine. After fine polishing, it is cleaned and dried; For the rough grinding, abrasive cloth with a particle size of 180 - 320 mesh is used for grinding, the rotation speed of the polishing machine is 1200 - 1800 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa; For the fine grinding, abrasive cloth with a particle size of 320 - 400 mesh is used for grinding, the rotation speed of the polishing machine is 1500 - 2500 r / min, the grinding agent is an organic solvent, and the grinding pressure is 10 - 60 Kpa; For the rough polishing, abrasive cloth with a particle size of 320 - 400 mesh is used for polishing, the rotation speed of the polishing machine is 1500 - 2500 r / min, the polishing agent is diamond polishing liquid, and the polishing pressure is 10 - 30 Kpa; For the fine polishing, a polishing sponge is used for polishing, the rotation speed of the polishing machine is 2500 - 3000 r / min, the polishing agent is a mixed polishing liquid, and the polishing pressure is 10 - 20 Kpa; The scandium content in the scandium-containing target is ≥25 at%; The mixed polishing liquid includes diamond polishing liquid and an organic solvent, and the mass ratio of the diamond polishing liquid to the organic solvent is 1:1; The organic solvent includes at least one of anhydrous ethanol and isopropanol.

2. The polishing and cleaning method of the scandium-containing target according to claim 1, wherein, The scandium-containing target includes an aluminum scandium target or a scandium gallium target.

3. The polishing and cleaning method of the scandium-containing target according to claim 1, wherein 8689 scouring pads are used for the rough grinding.

4. The polishing and cleaning method of the scandium-containing target according to claim 1, wherein, 7447 scouring pads are used for the fine grinding.

5. The polishing and cleaning method of the scandium-containing target according to claim 1, characterized in that, 7447 scouring pads are used for the rough grinding.

6. The polishing and cleaning method of the scandium-containing target according to claim 1, wherein The cleaning specifically is: ultrasonic cleaning the target with an organic solvent or wiping the target with an organic solvent.

7. The polishing and cleaning method of the scandium-containing target according to claim 1, wherein During the rough grinding, fine grinding, rough polishing, and fine polishing, the moving speed of the Y-axis is 10 - 50 mm / s. When the grinding in the Y-axis direction is completed, the X-axis steps 50 - 100 mm each time until the grinding surface covers the entire target.

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