Laminating device and laminating method

Abstract

The present application relates to a bonding device and a bonding method, wherein the bonding device includes a carrying jig and a pressing jig. The carrying jig includes a carrying body and a carrying portion provided on the first surface of the carrying body, the carrying portion being used to carry a first target part, and the carrying portion having a first contact area capable of forming a bonding contact with the first target part. The pressing jig is located on one side of the carrying jig. Wherein, when the pressing jig is pressed onto the first target part, at least one of the two opposite ends of the first target part can float with a first fulcrum to adjust the posture of the first target part to a first specified posture. The first fulcrum is formed in the first contact area. The present application presses the first target part by means of a pressing jig, so that the first target part can float with the aid of the first fulcrum in the first contact area, thereby adjusting the posture of the first target part to the first specified posture, so as to facilitate subsequent bonding actions and improve the bonding flatness of the bonding device.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a bonding device and a bonding method. Background Art

[0002] In the semiconductor packaging process, the chips cut from the wafer need to be bonded to the substrate. However, due to the tolerances of the bonding equipment and the substrate, as well as other factors, it is difficult to ensure that the chips are bonded flatly to the substrate. Summary of the Invention

[0003] Based on this, a laminating device and a laminating method are provided that can improve the laminating flatness, so as to alleviate the problem of difficulty in ensuring flatness during laminating.

[0004] In one aspect of the present application, a laminating device is provided, comprising:

[0005] A carrying jig, comprising a carrying body and a carrying portion provided on a first surface of the carrying body, the carrying portion being used to carry a first target part, the carrying portion having a first contact area capable of forming a fitting contact with the first target part; and

[0006] The pressing jig is located on the side of the bearing jig;

[0007] Wherein, when the pressing jig is pressed onto the first target part, at least one of the two opposite ends of the first target part can float about the first fulcrum to adjust the posture of the first target part to the first specified posture;

[0008] The first support point is located in the first contact area.

[0009] In one embodiment, the first contact area is a continuous area.

[0010] In one embodiment, the bearing portion has a bearing surface;

[0011] The bearing surface includes a first arc surface, and the first arc surface is located in the first contact area.

[0012] In one embodiment, the curvature of the first arc surface is defined as a first curvature;

[0013] defining a curvature of a surface of a side of the first target component facing the supporting portion as a second curvature;

[0014] The first curvature is smaller than the second curvature.

[0015] In one embodiment, the supporting portion is constructed as a centrally symmetrical structure.

[0016] In one embodiment, the first target part is in the first designated posture, and surfaces of the carrying portion and the first target part facing each other can be aligned relative to each other.

[0017] In one embodiment, the bearing portion has a bearing surface;

[0018] The bearing surface is a curved surface with a gradual curvature, so that the bearing portion forms a continuous curved surface body;

[0019] A normal line of a tangent line at a central position of the support surface and a normal line of a tangent line at any position of the support surface form an included angle.

[0020] In one embodiment, the laminating device further includes a fixing jig;

[0021] The fixing fixture is used to fix the load-bearing fixture.

[0022] In one embodiment, the carrying fixture further includes a matching portion provided on a second surface of the carrying body; the second surface is disposed opposite to the first surface;

[0023] The fixing fixture has a supporting portion for supporting the carrying fixture; the supporting portion has a second contact area capable of forming a fitting contact with the matching portion;

[0024] When the pressing jig is pressed onto the first target part, at least one of the two opposite ends of the supporting jig can float at the second fulcrum to adjust the posture of the supporting jig to the second specified posture;

[0025] The second support point is located in the second contact area.

[0026] In one embodiment, the second contact area is a continuous area.

[0027] In one embodiment, the supporting portion has a supporting surface;

[0028] The supporting surface includes a second arc surface, and the second arc surface is located in the second contact area.

[0029] In one embodiment, the curvature of the second arc surface is defined as a third curvature;

[0030] The mating portion has a mating surface, and the curvature of the mating surface is defined as a fourth curvature;

[0031] The third curvature is smaller than the fourth curvature.

[0032] In one embodiment, the supporting portion is constructed as a centrally symmetrical structure.

[0033] In one embodiment, the matching portion is configured as a centrally symmetrical structure.

[0034] In one embodiment, the carrying fixture is in the second designated position, and the surfaces of the supporting portion and the matching portion facing each other can be aligned relative to each other.

[0035] In one embodiment, the supporting portion has a supporting surface;

[0036] The supporting surface is a curved surface with a gradual curvature, so that the supporting portion forms a continuous curved surface body;

[0037] The normal line of the tangent line at the center position of the supporting surface and the normal line of the tangent line at any position of the supporting surface have an included angle.

[0038] In one embodiment, the mating portion has a mating surface;

[0039] The mating surface is a curved surface with a gradual curvature, so that the mating portion forms a continuous curved surface body;

[0040] The normal line of the tangent line at the center position of the mating surface and the normal line of the tangent line at any position of the mating surface have an included angle.

[0041] Another aspect of the present application further provides a bonding method, the method comprising:

[0042] Controlling the pressing jig to approach the carrying jig until it is in close contact with the first target part carried by the carrying jig;

[0043] The first target part is pressed so that at least one of the two opposite ends of the first target part can float about a first fulcrum, so as to adjust the posture of the first target part to a first specified posture.

[0044] In one embodiment, controlling the pressing jig to approach the carrying jig until it comes into contact with the first target part carried by the carrying jig, further comprising the steps of:

[0045] Placing the first target part on the carrier jig until the carrier jig and the first target part are in contact with each other on their surfaces facing each other;

[0046] Pre-fix the first target part.

[0047] In one embodiment, pre-fixing the first target component specifically includes:

[0048] The first target part is pre-fixed by electromagnetic means.

[0049] In one embodiment, pre-fixing the first target component specifically includes:

[0050] The first target part is pre-fixed by vacuum adsorption.

[0051] In one embodiment, after pressing the first target part so that at least one of the two opposite ends of the first target part can float about the first fulcrum to adjust the posture of the first target part to the first specified posture, the method further includes the following steps:

[0052] Controlling the pressing jig to move away from the first target part and fixing the second target part on the pressing jig;

[0053] The pressing jig is controlled to approach the carrying jig until the second target part is fitted with the first target part.

[0054] In one embodiment, the second target part is configured as a chip.

[0055] In one embodiment, controlling the pressing jig to approach the carrying jig until it comes into contact with the first target part carried by the carrying jig, further comprising the steps of:

[0056] Place the carrier jig on the fixing jig until the surfaces of the carrier jig and the fixing jig facing each other form a fitting contact.

[0057] In one embodiment, pressing the first target part so that at least one of the two opposite ends of the first target part can float about a first fulcrum to adjust the posture of the first target part to a first specified posture specifically includes the steps of:

[0058] The first target part is pressed so that at least one of the two opposite ends of the first target part can float about the first fulcrum, and at least one of the two opposite ends of the supporting fixture can float about the second fulcrum, so as to adjust the posture of the supporting fixture to the second specified posture and the posture of the first target part to the first specified posture.

[0059] In one embodiment, after placing the supporting jig on the fixing jig until the surfaces of the supporting jig and the fixing jig facing each other form a fitting contact, the method further includes the following steps:

[0060] Pre-fixed load-bearing fixture.

[0061] In one embodiment, the pre-fixed bearing fixture specifically includes:

[0062] The load-bearing fixture is pre-fixed by electromagnetic means.

[0063] In one embodiment, the pre-fixed bearing fixture specifically includes:

[0064] The load-bearing fixture is pre-fixed by vacuum adsorption.

[0065] In one embodiment, the first target part is configured as a substrate.

[0066] In one embodiment, a surface of the first target component facing the supporting portion is a curved surface.

[0067] In the aforementioned laminating device and laminating method, the carrying portion of the carrying jig carries the first target part and is in laminating contact with the first target part. The laminating jig presses the first target part, allowing the first target part to float using a first fulcrum in the first contact area, thereby adjusting the position of the first target part to a first designated position, facilitating subsequent laminating operations and improving the laminating smoothness of the laminating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 A schematic diagram of a laminating device according to an embodiment of the related art;

[0069] Figure 2 A schematic diagram of a first target component according to an embodiment of the related art;

[0070] Figure 3 A schematic diagram of a carrying fixture carrying a first target part according to an embodiment of the related art;

[0071] Figure 4 A schematic diagram of a laminating device according to an embodiment of the present application;

[0072] Figure 5 This is a schematic diagram of a laminating device according to another embodiment of the present application;

[0073] Figure 6 Schematic diagram of the process of the lamination method according to one embodiment of the present application;

[0074] Figure 7 This is a schematic flow chart of a laminating method according to another embodiment of the present application;

[0075] Figure 8 Schematic diagram of the structure obtained in step S230 of the bonding method according to another embodiment of the present application;

[0076] Figure 9 This is a schematic diagram of a laminating device according to another embodiment of the present application;

[0077] Figure 10 Schematic diagram of the structure obtained in step S250 of the bonding method according to another embodiment of the present application;

[0078] Figure 11 Schematic diagram of the structure obtained in step S260 of the bonding method according to another embodiment of the present application;

[0079] Figure 12 This is a schematic flow chart of a bonding method according to another embodiment of the present application.

[0080] Brief description of component symbols:

[0081] 10, 100: Laminating device 11, 110: Carrying fixture

[0082] 11a, 112: bearing part 12, 120: pressing fixture

[0083] 20, 200: first target part 30, 300: second target part

[0084] 40, 400: colloid layer 111: carrier body

[0085] 111a: first surface 111b: second surface

[0086] 112a: bearing surface 113: mating portion

[0087] 113a, mating surface 114: air flow channel

[0088] 120: Pressing fixture 130: Fixed fixture

[0089] 131: Supporting part 131a: Supporting surface

[0090] 132: Air channel Z1: first contact area

[0091] Z2: Second contact area G: Gap DETAILED DESCRIPTION

[0092] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0093] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0094] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0095] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0096] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0097] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0098] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0099] In order to facilitate understanding of the technical solution of the present application, before detailed description, the bonding device in the related art is first explained.

[0100] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The specific bonding process of the packaged chip is to cut the wafer into small chips (Die) through a dicing process, and then attach the cut chips to the corresponding substrate with a liquid or solid colloid. When bonding the chip to the substrate, it is usually necessary to use a bonding device so that the two can be bonded reliably. It should be understood that the bonding device of this application takes the bonding of the chip and the substrate as an example, which is for explanation and not limitation.

[0101] Figure 1 A schematic diagram of a laminating device 10 according to an embodiment of the related art is shown.

[0102] like Figure 1 As shown, in an embodiment of the related art, the bonding device 10 includes a carrying jig 11 and a pressing jig 12. The carrying jig 11 is used to carry the first target part 20, that is, the substrate. A colloid layer is also provided on the substrate to facilitate subsequent bonding. The pressing jig 12 is located on one side of the carrying jig 11, and the pressing jig 12 is used to carry the second target part 30, that is, the chip. The pressing jig 12 is controlled to be close to the pressing jig 12 so that the chip is close to the substrate and the bonding of the chip and the substrate is completed.

[0103] Figure 2 A schematic diagram of a first target member 20 according to an embodiment of the related art is shown; Figure 3 A schematic diagram showing a carrying fixture 11 carrying a first target part 20 according to an embodiment of the related art is shown.

[0104] like Figure 2 As shown in FIG, the shape of the substrate is not limited to a flat substrate. To meet the requirements of subsequent processes, some substrates also have curved surfaces. In order to adapt to the curved surface of the substrate, such as Figure 3 As shown, the carrier jig 11 is provided with a carrier portion 11a having a curved surface. When attaching a chip to a substrate having a curved surface, the substrate needs to be placed on the carrier portion 11a of the carrier jig 11 first. Figure 2 and Figure 3 As shown, the inventors of this application noticed that there are tolerances when the carrier portion 11a contacts the substrate, such as the forming tolerances of the carrier jig 11 and the bonding device 100, the forming tolerances of the substrate, and the placement tolerances when the substrate is placed on the carrier portion 11a. The existence of tolerances may cause the substrate to tilt, and the sum of all possible tolerances further exacerbates the tilt problem. Before the chip is bonded to the substrate, the substrate tilts, which means that there is an angle or deviation between the bonding surfaces of the substrate and the chip facing each other. On this basis, when the chip is bonded to the substrate, it will be difficult to bond the two together smoothly due to the inconsistency of the two bonding surfaces, resulting in poor bonding.

[0105] Based on this, the inventors of the present application conducted in-depth research and improved the structure of the bonding device 10 and the bonding method. Before bonding, the position of the substrate is adjusted to improve the flatness of the bonding between the chip and the substrate.

[0106] For ease of description, the drawings only show structures related to the embodiments of the present application.

[0107] Figure 4 FIG. 1 is a schematic diagram of a laminating device 100 according to an embodiment of the present application.

[0108] See Figure 4 , an embodiment of the present application provides a bonding device 100, which includes a carrying jig 110 and a pressing jig 120. The carrying jig 110 includes a carrying body 111 and a carrying portion 112 provided on a first surface 111a of the carrying body 111, the carrying portion 112 is used to carry the first target part 200, and the carrying portion 112 has a first contact area Z1 that can form a fitting contact with the first target part 200. The pressing jig 120 is located on one side of the carrying jig 110. In which, when the pressing jig 120 is pressed onto the first target part 200, at least one of the two opposite ends of the first target part 200 can float with a first fulcrum to adjust the posture of the first target part 200 to a first specified posture. The first fulcrum is located within the first contact area Z1.

[0109] In the laminating device 100 of the present application, the carrying portion 112 of the carrying jig 110 carries the first target part 200 and is in laminating contact with the first target part 200. The first target part 200 is pressed by the pressing jig 120, so that the first target part 200 can float with the help of the first fulcrum in the first contact area Z1, thereby adjusting the position of the first target part 200 to the first specified position, facilitating subsequent laminating operations and improving the laminating smoothness of the laminating device 100.

[0110] like Figure 4As shown, it should be noted that the supporting portion 112 provided on the first surface 111a protrudes toward a side away from the first surface 111a to support the first target part 200. The first fulcrum refers to at least a portion of the first contact area Z1 where the supporting portion 112 and the first target part 200 can be in contact with each other, which allows the first target part 200 to float on the supporting portion 112 with the help of this area. The first fulcrum can be a point contact, a line contact, or a surface contact, as long as it can provide support for the floating of the first target part 200. Floating refers to the action of the first target part 200 adjusting its posture on the supporting portion 112 with the help of the first fulcrum. Under normal circumstances, both opposite ends of the first target part 200 will float, and the first fulcrum is located in the middle of the opposite ends of the first target part 200, so that the first target part 200 swings on the supporting portion 112 similar to a lever to adjust to the first specified posture. It should be explained that floating does not mean performing large-scale movements such as moving the first target part 200, but rather adjusting it to a first designated posture through small-scale floating adjustments. The first designated posture in this application refers to a posture that is easy to perform subsequent bonding operations. Taking the bonding of a chip to a substrate as an example, the surfaces of the chip and the substrate facing each other are both flat. The first designated posture is to adjust the posture of the substrate so that its two surfaces facing the chip are parallel, thereby improving the bonding flatness during subsequent bonding.

[0111] Please continue reading Figure 4 In some embodiments, a gap G is formed between the bearing portion 112 and the first target part 200. It can be understood that the gap G between the bearing portion 112 and the first target part 200 enables the first target part 200 to float on the bearing portion 112. Specifically, in some embodiments, the first contact area Z1 is a continuous area. In this way, the continuous first contact area Z1 can increase the posture adjustment range of the first target part 200. In some other embodiments, the first contact area Z1 can also be a discontinuous area, as long as the first target part 200 can adjust its posture with the help of the first contact area Z1, and there is no limitation here.

[0112] exist Figure 4In the illustrated embodiment, the support portion 112 has a support surface 112a. The support surface 112a comprises a first arcuate surface, which is located within the first contact zone Z1. This allows the first target member 200 to adjust its position on the support portion 112, providing a smoother support surface 112a and a smoother first contact zone Z1. This allows for virtually no obstruction during adjustment. Furthermore, when the first target member 200 floats on the first arcuate surface to adjust its position, the floating angle is continuous and uninterrupted, thereby enabling stepless adjustment of the first target member 200. Specifically, in some embodiments, the curvature of the first arcuate surface is defined as a first curvature, and the curvature of the surface of the first target member 200 facing the support portion 112 is defined as a second curvature. The first curvature is smaller than the second curvature. The curvature of a curve is the ratio of the tangent angle at a point on the curve to the arc length. The curvature indicates the degree to which the curve deviates from a straight line. The greater the curvature, the greater the curvature of the curve. It can be understood that the greater the curvature of a curved surface, the greater the degree of curvature of the curved surface relative to the flat surface. The first curvature is smaller than the second curvature, that is, the side surface of the first target component 200 facing the support portion 112 is more curved relative to the support surface 112a, thereby allowing the center position of the first target component 200 to be aligned with the support portion 112 and adjust its posture. Of course, in other embodiments, the first curvature and the second curvature can also be equal, and this is not limited here.

[0113] like Figure 4 As shown, in some embodiments, the support portion 112 is constructed as a centrally symmetrical structure. In conjunction with some of the aforementioned embodiments, the support portion 112 of the centrally symmetrical structure is characterized by a first arc surface located at the center of the support portion 112. When the first target member 200 floats on the first arc surface, it is adjusted at the center of the support portion 112. This allows for floating space at both opposing ends of the first target member 200, with the adjustment space at both ends being substantially the same, enabling more efficient adjustment to the first designated position with a smaller adjustment angle. Of course, the support portion 112 of the centrally symmetrical structure may not have the first arc surface, and this is not a limitation. Specifically, in some embodiments, when the first target member 200 is in the first designated position, the surfaces of the support portion 112 and the first target member 200 facing each other can be aligned relative to each other. This alignment of the support portion 112 and the first target member 200 facilitates force application during adjustment and makes it easier to determine whether the first designated position has been achieved.

[0114] Combine Figure 4As shown, in some embodiments, the support portion 112 has a support surface 112a, which is a curved surface with a gradual curvature, so that the support portion 112 forms a continuous curved surface. The normal line of the tangent at the center of the support surface 112a and the normal line of the tangent at any position on the support surface 112a form an included angle. In this way, the support portion 112 of the continuous curved surface increases the adjustment range of the first target part 200. The gradual curvature also increases the adaptability of the support portion 112, enabling it to adapt to different first target parts 200 and adjust their position.

[0115] Figure 5 A schematic diagram of a laminating device 100 according to another embodiment of the present application is shown.

[0116] like Figure 5 As shown, combined with Figure 4 In some embodiments, the laminating device 100 further includes a fixing jig 130 for fixing the supporting jig 110. Thus, after the supporting jig 110 adjusts the first target part 200 to the first designated posture, the supporting jig 110 can be fixed with the help of the fixing jig 130, thereby maintaining the first target part 200 carried by the supporting jig 110 in the first designated posture, thereby preventing the first target part 200 from moving on the supporting portion 112, which would cause the posture adjustment to fail.

[0117] Specifically, the fixture 130 is provided with an air channel 132. A vacuum pump is then used to draw air from the air channel 132 to create a vacuum environment, thereby securing the support fixture 110 by suction. Alternatively, a solenoid valve can be used to secure the support fixture 110. Furthermore, other methods besides electromagnetic and vacuum methods can also be used to secure the support fixture 110, which are not limited here.

[0118] Please continue reading Figure 5 , and combined with Figure 4In some embodiments, the carrying jig 110 further includes a mating portion 113 provided on the second surface 111b of the carrying body 111, and the second surface 111b is disposed opposite to the first surface 111a. The fixing jig 130 has a supporting portion 131 for supporting the carrying jig 110, and the supporting portion 131 has a second contact area Z2 capable of forming a fitting contact with the mating portion 113. In the case where the pressing jig 120 is pressed onto the first target part 200, at least one of the two opposite ends of the carrying jig 110 can float at the second fulcrum to adjust the posture of the carrying jig 110 to the second specified posture, and the second fulcrum is located within the second contact area Z2. In this way, the pressing force of the pressing jig 120 for pressing the first target part 200 is transmitted to the carrying jig 110, so that the carrying jig 110 can float with the help of the second fulcrum in the second contact area Z2, thereby adjusting the posture of the carrying jig 110 to the second specified posture to facilitate subsequent bonding actions, and with the help of the floating of the carrying jig 110, the adaptability of the bonding device 100 is further improved.

[0119] It should be noted that the mating portion 113 provided on the second surface 111b is convex toward the side away from the second surface 111b, and the supporting portion 131 is recessed toward the side away from the supporting fixture 110, so as to mate with the supporting portion 131 of the fixing fixture 130 and enable the mating portion 113 to float relative to the supporting portion 131. The second fulcrum refers to a second contact area Z2 where the supporting portion 131 and the mating portion 113 of the supporting fixture 110 can fit together and contact, and at least a portion of the area exists in the area, which enables the supporting fixture 110 to float on the supporting portion 131. The second fulcrum can be point contact, line contact, or surface contact, as long as it can provide support for the floating of the supporting fixture 110. Floating refers to the action of the carrying jig 110 adjusting its posture on the supporting portion 131 with the help of the second fulcrum. Under normal circumstances, both opposite ends of the carrying jig 110 will float, and the second fulcrum is located in the middle of the supporting portion 131, so that the carrying jig 110 swings on the supporting portion 131 similar to a lever to adjust to the second specified posture. It should be explained that floating does not mean performing large-scale activities such as moving the carrying jig 110, but rather adjusting it to the second specified posture through small-scale floating adjustments. The second specified posture in this application refers to a posture that is easy for the first target part 200 carried by the carrying jig 110 to perform subsequent bonding actions.

[0120] Please continue reading Figure 5In some embodiments, the second contact area Z2 is a continuous area. Thus, the continuous second contact area Z2 can increase the position adjustment range of the support fixture 110. In other embodiments, the second contact area Z2 can also be a discontinuous area, as long as the support fixture 110 can achieve position adjustment with the help of the second contact area Z2. This is not a limitation here.

[0121] like Figure 5 As shown, in some embodiments, the supporting portion 131 has a supporting surface 131a. The supporting surface 131a includes a second arc surface, and the second arc surface is located within the second contact area Z2. In this way, when the supporting fixture 110 adjusts its position on the supporting portion 131, the supporting portion 131 on the second arc surface is smoother, and the second contact area Z2 is also smoother, and there is almost no obstruction during the adjustment process. Moreover, when the supporting fixture 110 floats on the second arc surface to adjust its position, its floating angle is continuous and uninterrupted, thereby achieving stepless adjustment of the supporting fixture 110.

[0122] like Figure 5 As shown, specifically in some embodiments, the curvature of the second arc surface is defined as the third curvature, the mating portion 113 has a mating surface 113a, and the curvature of the mating surface 113a is defined as the fourth curvature. The third curvature is smaller than the fourth curvature. The third curvature is smaller than the fourth curvature, that is, the side surface of the mating portion 113 facing the supporting portion 131 is more curved relative to the supporting surface 131a on the supporting portion 131, so that the mating portion 113 can be more easily fitted with the supporting surface 131a and the posture can be adjusted. Of course, in some other embodiments, the third curvature and the fourth curvature may also be equal, which is not limited here.

[0123] Please continue reading Figure 5In some embodiments, the supporting portion 131 is constructed as a centrally symmetrical structure. In this way, the second arc surface is at the central position of the supporting portion 131, that is, the matching portion 113 of the supporting fixture 110 can be floated and adjusted at the central position of the supporting portion 131. In this way, there is floating space at both opposite ends of the supporting fixture 110, and the adjustment space at the opposite ends is roughly the same, and it can be adjusted to the second designated posture more efficiently with a smaller adjustment angle. In some other embodiments, the matching portion 113 is constructed as a centrally symmetrical structure. In this way, the matching portion 113 of the centrally symmetrical structure can be more easily adjusted to the second designated posture on the supporting portion 131. Specifically, when the supporting fixture 110 is in the second designated posture, the surfaces of the supporting portion 131 and the matching portion 113 facing each other can be aligned relative to each other. In this way, it is easy to apply force during the adjustment process, and it is also easier to determine whether the second designated posture has been reached. Of course, when the carrying fixture 110 is in the second designated posture, the surfaces of the supporting portion 131 and the matching portion 113 facing each other may not be aligned relative to each other, as long as the subsequent fitting action can be facilitated.

[0124] Continue reading Figure 5 In some embodiments, the supporting portion 131 has a supporting surface 131a, which is a curved surface with a gradual curvature, so that the supporting portion 131 forms a continuous curved surface. The normal line of the tangent line at the center of the supporting surface 131a and the normal line of the tangent line at any position of the supporting surface 131a have an angle. In this way, the supporting portion 131 as a continuous curved surface increases the adjustment range of the supporting fixture 110, and the gradual curvature also increases the adaptability of the supporting portion 131, so that it can adapt to different supporting fixtures 110 and adjust their posture. In some other embodiments, the mating portion 113 has a mating surface 113a, which is a curved surface with a gradual curvature, so that the mating portion 113 forms a continuous curved surface. The normal line of the tangent line at the center of the mating surface 113a and the normal line of the tangent line at any position of the mating surface 113a have an angle. In this way, the matching portion 113 of the continuous curved surface also increases the adjustment range of the supporting fixture 110, and the gradual curvature also increases the adaptability of the matching portion 113 relative to the supporting portion 131, so that it can adapt to different fixing fixtures 130 and realize the adjustment of the posture of the supporting fixture 110.

[0125] Figure 6 A schematic flow chart of a bonding method according to an embodiment of the present application is shown.

[0126] Based on the same inventive concept, another aspect of the present application further provides a bonding method, see Figure 6 , and combined with Figure 4 As shown, the method includes:

[0127] S110 , controlling the pressing jig 120 to approach the carrying jig 110 until it comes into contact with the first target part 200 carried by the carrying jig 110 ;

[0128] S120 , pressing the first target part 200 so that at least one of the two opposite ends of the first target part 200 can float about the first fulcrum, so as to adjust the posture of the first target part 200 to a first designated posture.

[0129] In step S110 , the contacting means that the supporting portion 112 and the first target component 200 are at least partially in contact with each other.

[0130] In step S120 , pressing means applying a pressing force to the first target part 200 after the pressing jig 120 contacts the first target part 200 , so that the first target part 200 floats with the help of the first fulcrum by means of the pressing force.

[0131] It should be noted that, in step S110 and step S120, details may refer to the contents of some of the aforementioned embodiments, which are not limited here.

[0132] The above-mentioned bonding method presses the first target part 200 through the pressing jig 120, so that the first target part 200 floats with the help of the first fulcrum and adjusts to the first specified position, thereby alleviating the situation where it is difficult to ensure the flatness of the bonding during subsequent bonding due to deviation when placing the first target part 200.

[0133] Figure 7 A schematic flow chart showing a bonding method according to another embodiment of the present application is shown; Figure 8 A schematic diagram showing the structure obtained in step S230 in the bonding method according to another embodiment of the present application; Figure 9 FIG. 1 is a schematic diagram of a laminating device 100 according to another embodiment of the present application.

[0134] In another embodiment of the present application, a bonding method is also provided. Figure 7 , and combined with Figure 8 and Figure 9 , methods include:

[0135] S210, placing the first target part 200 on the carrier jig 110 until the carrier jig 110 and the first target part 200 are in contact with each other with their surfaces facing each other;

[0136] S220, pre-fixing the first target component 200;

[0137] S230 , controlling the pressing jig 120 to approach the carrying jig 110 until it comes into contact with the first target part 200 carried by the carrying jig 110 ;

[0138] S240 , pressing the first target part 200 so that at least one of the two opposite ends of the first target part 200 can float about the first fulcrum, so as to adjust the posture of the first target part 200 to the first designated posture.

[0139] It should be noted that, in step S230 and step S240, the details may refer to the contents of some of the aforementioned embodiments, which are not limited here.

[0140] In this way, by pre-fixing the first target part 200, the first target part 200 can be prevented from slipping after being placed on the supporting fixture 110. Moreover, after the first target part 200 is adjusted to the first specified posture, it can be maintained in the first specified posture, thereby preventing the first target part 200 from moving on the supporting part 112, resulting in failure of the posture adjustment.

[0141] In some embodiments, combined Figure 7 and Figure 9 As shown, step S220 specifically includes pre-fixing the first target part 200 by electromagnetic means. In combination with some of the aforementioned embodiments, the electromagnetic means refers to the fixing jig 130 carrying the jig 110 generating suction after the electromagnetic coil is energized, thereby fixing the first target part 200. In some other embodiments, step S220 specifically includes pre-fixing the first target part 200 by vacuum adsorption. Vacuum adsorption refers to establishing a vacuum environment by sucking air, thereby adsorbing and fixing the first target part 200. Figure 10 In the illustrated embodiment, an air channel 114 is provided on the supporting jig 110 of the bonding device 100, and the air in the air channel 114 is sucked out by a vacuum pump to establish a vacuum environment, thereby achieving adsorption and fixation of the first target part 200. It should also be noted that the pre-fixation of the first target part 200 means that it does not move when it is not subjected to external force. It can be understood that when subjected to the pressing force from the pressing jig 120, the first target part 200 can move to adjust to the first specified posture, and when the pressing force disappears, the first target part 200 can be maintained in the first specified posture by means of vacuum adsorption or electromagnetic means. Of course, in addition to electromagnetic and vacuum adsorption methods, the fixing jig 130 can also use other methods to fix the first target part 200, which is not limited here.

[0142] Figure 10 A schematic diagram showing the structure obtained in step S250 in the bonding method according to another embodiment of the present application; Figure 11 A schematic diagram showing the structure obtained in step S260 in the bonding method according to another embodiment of the present application is shown.

[0143] Please refer again Figure 7 , and combined with Figure 9 and Figure 10As shown, in some embodiments, after step S240, the following steps are further included:

[0144] S250 , controlling the pressing jig 120 to move away from the first target part 200 , and fixing the second target part 300 on the pressing jig 120 ;

[0145] S260 , controlling the pressing jig 120 to approach the carrying jig 110 until the second target component 300 is in contact with the first target component 200 .

[0146] In step S250, the second target part 300 can be attached to the pressing jig 120, or adsorbed on the pressing jig 120, or clamped to be fixed on the pressing jig 120. There is no limitation here. As long as the second target part 300 can be fixed on the pressing jig 120, it is convenient to drive the second target part 300 to be attached to the first target part 200.

[0147] In step S260 , the pressing jig 120 is controlled to move toward the carrying jig 110 so that the second target part 300 on the pressing jig 120 moves toward the first target part 200 carried by the carrying jig 110 , thereby achieving the bonding between the second target part 300 and the first target part 200 .

[0148] Figure 12 A schematic flow chart of a bonding method according to another embodiment of the present application is shown.

[0149] In another embodiment of the present application, a bonding method is also provided. Figure 12 , and combined with Figure 4 and Figure 5 , methods include:

[0150] S310, placing the carrying jig 110 on the fixing jig 130 until the surfaces of the carrying jig 110 and the fixing jig 130 facing each other form a fitting contact;

[0151] S320, pre-fixing the bearing fixture 110;

[0152] S330, placing the first target part 200 on the carrier jig 110 until the carrier jig 110 and the first target part 200 are in contact with each other with their surfaces facing each other;

[0153] S340, pre-fixing the first target component 200;

[0154] S350 , controlling the pressing jig 120 to approach the carrying jig 110 until it comes into contact with the first target part 200 carried by the carrying jig 110 ;

[0155] S360: Pressing the first target part 200 so that at least one of the two opposite ends of the first target part 200 can float about the first fulcrum, and at least one of the two opposite ends of the supporting fixture 110 can float about the second fulcrum, so as to adjust the posture of the supporting fixture 110 to the second designated posture and the posture of the first target part 200 to the first designated posture;

[0156] S370 , controlling the pressing jig 120 to move away from the first target part 200 , and fixing the second target part 300 on the pressing jig 120 ;

[0157] S380 , controlling the pressing jig 120 to approach the carrying jig 110 until the second target component 300 is in contact with the first target component 200 .

[0158] It should be noted that, for steps S330, S340, S350, S370 and S380, details may refer to the contents of some of the aforementioned embodiments, which are not limited here.

[0159] In this way, by pre-fixing the carrying jig 110, it is possible to prevent the carrying jig 110 from slipping after being placed on the fixing jig 130. Moreover, after the first target part 200 is adjusted to the first specified posture, by keeping the carrying jig 110 in the second specified posture, the first target part 200 can also be kept in the first specified posture, thereby preventing the first target part 200 from moving on the carrying portion 112 due to the movement of the carrying jig 110 relative to the fixing jig 130, and thus avoiding failure of the posture adjustment of the first target part 200.

[0160] Combine Figure 12 and Figure 5 As shown, in step S360, a single press can cause both the first target part 200 and the supporting jig 110 to float. That is, a single press can cause the supporting jig 110 to float to the second designated position, and the first target part 200 to float to the first designated position, thereby facilitating subsequent lamination. Of course, in other embodiments, the press method and floating sequence can also be adaptively adjusted, and this is not a limitation here.

[0161] Please continue reading Figure 5In some embodiments, step S320 specifically includes pre-fixing the support jig 110 via electromagnetic means. In conjunction with some of the aforementioned embodiments, the electromagnetic means refers to the generation of suction by energizing the electromagnetic coil in the fixing jig 130, thereby securing the support jig 110. In yet other embodiments, step S320 specifically includes pre-fixing the support jig 110 via vacuum adsorption. Vacuum adsorption refers to creating a vacuum environment by suctioning air, thereby adsorbing and securing the support jig 110. An air channel 132 is provided in the fixing jig 130, and air in the air channel 132 is sucked out by a vacuum pump to create a vacuum environment, thereby achieving adsorption and securing of the support jig 110. It should also be noted that pre-fixing the support jig 110 means that it does not move when not subjected to external forces. It is understood that when subjected to the pressing force from the pressing jig 120, the support jig 110 can move to adjust to the second designated position. When the pressing force disappears, the support jig 110 can remain in the second designated position using vacuum adsorption or electromagnetic means. Of course, in addition to the electromagnetic method and the vacuum adsorption method, other methods can also be used to fix the supporting fixture 110, which are not limited here.

[0162] Combine Figures 4 to 12 As shown, in some embodiments, the second target part 300 is configured as a chip. It should be noted that this application takes the second target part 300 as a chip as an example, which is for the convenience of explanation and not limitation. In some other embodiments, the first target part 200 is configured as a substrate. Furthermore, a colloid layer 400 is provided on the side of the substrate facing the pressing jig 120. In this way, the second target part 300 can be easily bonded. Exemplarily, the material of the colloid layer 400 can be a thermosetting glue, which is not limited here. It should be noted that this application takes the first target part 200 as a substrate as an example, which is for the convenience of explanation and not limitation. In combination with some of the aforementioned embodiments, the bonding device 100 provided in the present application, in the process of bonding the chip to the substrate, uses the pressing jig 120 to apply a pressing force to the substrate, and uses the fixing jig 130 to adjust the supporting jig 110 to the second specified posture, and adjusts the posture of the substrate through the supporting portion 112 of the supporting jig 110 to adjust it to the first specified posture that is convenient for subsequent chip bonding, and then bonds the chip fixed on the pressing jig 120 to the substrate to complete the bonding action, thereby improving the flatness of the bonding between the chip and the substrate. Of course, the bonding device 100 can also be used in, for example, chip bonding or bonding between film layers. As long as the target part has bonding flatness requirements, the bonding device 100 and bonding method provided in the present application can be used to improve the flatness.

[0163] Please continue reading Figure 4In some embodiments, the surface of the first target part 200 facing the support portion 112 is a curved surface. The shape and structure of the first target part 200 vary in different products. During the bonding process, the first target part 200 with a curved surface, by virtue of the bonding contact between the curved surface and the support surface 112a of the support portion 112, enables the first target part 200 to float and adjust to the second specified position when subjected to the pressing force of the pressing jig 120, and the first target part 200 floats and adjusts to the first specified position.

[0164] Combine Figures 4 to 12 As shown, in the bonding device 100 provided by the embodiment of the present application, the bearing portion 112 of the bearing jig 110 carries the first target part 200 and is in bonding contact with the first target part 200. The first target part 200 is pressed by the pressing jig 120, so that the first target part 200 can float with the help of the first fulcrum in the first contact area Z1, thereby adjusting the posture of the first target part 200 to the first specified posture, so as to facilitate subsequent bonding actions and improve the bonding flatness of the bonding device 100. The bearing surface 112a of the bearing portion 112 is set to a first arc surface, which can improve the ease with which the first target part 200 floats on the bearing surface 112a through its smooth surface. Moreover, when the pressing jig 120 presses the first target part 200, the first target part 200 is aligned with the bearing portion 112, which makes it easier for the pressing jig 120 to apply force and also makes it easier to adjust the posture of the first target part 200. In addition, the floating of the supporting jig 110 relative to the fixing jig 130 can further improve the reliability of the adjustment, and the supporting jig 110 can also be reliably fixed by the fixing jig 130, so that the first target part 200 that can float relative to the supporting jig 110 can also be maintained in the first specified position, ensuring the reliability during subsequent bonding. The bonding method provided in the embodiment of the present application uses the pressing jig 120 to press the first target part 200, so that at least one end of the first target part 200 can float with the help of the first fulcrum of the first contact area Z1, thereby adjusting to the first specified position, improving the bonding flatness of the second target part 300 and the first target part 200 during subsequent bonding.

[0165] It should be noted that some of the technical solutions described above can be implemented as independent embodiments in the actual implementation process, or they can be combined with each other and implemented as combined embodiments. Some of the technical solutions described above are exemplary solutions. How to combine them for implementation can be selected according to actual needs, and the embodiments of the present application are not specifically limited. In addition, when the contents of the above-mentioned embodiments of the present application are described, different embodiments are described in the corresponding order based on the idea of ​​convenient description, such as the order preset according to the requirements in the actual implementation process, rather than limiting the execution order between different embodiments. Accordingly, in the actual implementation process, if it is necessary to implement multiple embodiments provided by the embodiments of the present application, it is not necessarily necessary to follow the execution order provided when the embodiments are described in the present invention, but the execution order between different embodiments can be arranged according to demand.

[0166] It should be understood that although Figure 6 、 Figure 7 and Figure 12 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 6 、 Figure 7 and Figure 12 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The order of execution of these steps or stages is not necessarily one by one, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0167] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0168] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A laminating device, characterized in that: include: A carrying jig, comprising a carrying body and a carrying portion provided on a first surface of the carrying body, the carrying portion being used to carry a first target part, the carrying portion having a first contact area capable of forming a fitting contact with the first target part; and A pressing jig, located on one side of the supporting jig; Wherein, when the pressing jig is pressed onto the first target part, at least one of the two opposite ends of the first target part can float about a first fulcrum to adjust the posture of the first target part to a first specified posture; The first supporting point is located in the first contact area; The bearing portion has a bearing surface, which includes a first arc surface. The first arc surface is located in the first contact area. The curvature of the first arc surface is defined as a first curvature. The curvature of the side surface of the first target part facing the bearing portion is defined as a second curvature. The first curvature is smaller than the second curvature.

2. The laminating device according to claim 1, characterized in that: The first contact area is a continuous area.

3. The laminating device according to claim 1 or 2, characterized in that: The bearing portion is constructed as a centrally symmetrical structure.

4. The laminating device according to claim 3, characterized in that: The first target part is in the first designated posture, and the surfaces of the carrying portion and the first target part facing each other can be aligned relative to each other.

5. The laminating device according to claim 1 or 2, characterized in that: The bearing portion has a bearing surface; The bearing surface is a curved surface with a gradual curvature, so that the bearing portion forms a continuous curved surface body; A normal line of a tangent line at a central position of the carrying surface and a normal line of a tangent line at any position of the carrying surface form an angle.

6. The laminating device according to claim 1 or 2, characterized in that: The laminating device further includes a fixing jig; The fixing jig is used to fix the carrying jig.

7. The laminating device according to claim 6, characterized in that: The carrying fixture further includes a matching portion provided on a second surface of the carrying body; the second surface is provided opposite to the first surface; The fixing fixture has a supporting portion for supporting the carrying fixture; the supporting portion has a second contact area capable of forming a fitting contact with the matching portion; Wherein, when the pressing jig is pressed onto the first target part, at least one of the two opposite ends of the supporting jig can float about a second fulcrum to adjust the posture of the supporting jig to a second specified posture; The second supporting point is located in the second contact area.

8. The laminating device according to claim 7, characterized in that: The second contact area is a continuous area.

9. The laminating device according to claim 7, characterized in that: The supporting portion has a supporting surface; The supporting surface includes a second arc surface, and the second arc surface is located in the second contact area.

10. The laminating device according to claim 9, characterized in that: defining the curvature of the second arc surface as a third curvature; The mating portion has a mating surface, and the curvature of the mating surface is defined as a fourth curvature; The third curvature is smaller than the fourth curvature.

11. The laminating device according to claim 7, characterized in that: The supporting portion is constructed as a centrally symmetrical structure.

12. The laminating device according to claim 7, characterized in that: The matching portion is constructed as a centrally symmetrical structure.

13. The laminating device according to claim 7, characterized in that: The carrying fixture is in the second designated posture, and the surfaces of the supporting portion and the matching portion facing each other can be aligned relative to each other.

14. The laminating device according to claim 7, characterized in that: The supporting portion has a supporting surface; The supporting surface is a curved surface with a gradual curvature, so that the supporting portion forms a continuous curved surface body; A normal line of a tangent line at a central position of the supporting surface and a normal line of a tangent line at any position of the supporting surface have an included angle.

15. The laminating device according to claim 7, characterized in that: The mating portion has a mating surface; The mating surface is a curved surface with a gradual curvature, so that the mating portion forms a continuous curved surface body; A normal line of a tangent line at a central position of the mating surface and a normal line of a tangent line at any position of the mating surface have an included angle.

16. A laminating method, characterized in that: The method comprises: Controlling the pressing jig to approach the carrying jig until it comes into contact with the first target part carried by the carrying jig; Pressing the first target component so that at least one of the two opposite ends of the first target component can float about a first fulcrum, so as to adjust the posture of the first target component to a first specified posture; The carrying jig includes a carrying body and a carrying portion provided on a first surface of the carrying body, the carrying portion is used to carry the first target part, and the carrying portion has a first contact area capable of forming a fitting contact with the first target part; The first supporting point is located in the first contact area; The bearing portion has a bearing surface, which includes a first arc surface. The first arc surface is located in the first contact area. The curvature of the first arc surface is defined as a first curvature. The curvature of the side surface of the first target part facing the bearing portion is defined as a second curvature. The first curvature is smaller than the second curvature.

17. The laminating method according to claim 16, characterized in that: The controlling the pressing jig to approach the carrying jig until it comes into contact with the first target part carried by the carrying jig, further comprising the steps of: placing the first target part on the carrier jig until the carrier jig and the first target part are in contact with each other on their surfaces facing each other; The first target part is pre-fixed.

18. The laminating method according to claim 17, wherein: The pre-fixing of the first target part specifically includes: The first target part is pre-fixed by electromagnetic means.

19. The laminating method according to claim 17, wherein: The pre-fixing of the first target part specifically includes: The first target part is pre-fixed by vacuum adsorption.

20. The laminating method according to claim 16, wherein: After pressing the first target part so that at least one of the two opposite ends of the first target part can float about the first fulcrum to adjust the posture of the first target part to the first specified posture, the method further includes the following steps: controlling the pressing jig to move away from the first target part and fixing the second target part on the pressing jig; The pressing jig is controlled to approach the carrying jig until the second target part is fitted with the first target part.

21. The laminating method according to claim 20, characterized in that: The second target part is configured as a chip.

22. The laminating method according to claim 16, characterized in that: The controlling the pressing jig to approach the carrying jig until it comes into contact with the first target part carried by the carrying jig, further comprising the steps of: The carrying jig is placed on the fixing jig until the surfaces of the carrying jig and the fixing jig facing each other form a fitting contact.

23. The laminating method according to claim 22, characterized in that: The pressing of the first target part so that at least one of the two opposite ends of the first target part can float about a first fulcrum to adjust the posture of the first target part to a first specified posture specifically includes the steps of: The first target part is pressed so that at least one of the two opposite ends of the first target part can float about the first fulcrum, and at least one of the two opposite ends of the supporting fixture can float about the second fulcrum, so as to adjust the posture of the supporting fixture to the second specified posture and the posture of the first target part to the first specified posture.

24. The laminating method according to claim 22, wherein: After placing the carrying jig on the fixing jig until the carrying jig and the fixing jig's surfaces facing each other form a fitting contact, the step further includes: Pre-fix the carrying jig.

25. The laminating method according to claim 24, characterized in that: The pre-fixing of the bearing fixture specifically includes: The supporting fixture is pre-fixed by electromagnetic means.

26. The laminating method according to claim 24, characterized in that: The pre-fixing of the bearing fixture specifically includes: The supporting fixture is pre-fixed by vacuum adsorption.

27. The laminating method according to any one of claims 16 to 26, characterized in that: The first target part is configured as a substrate.

28. The laminating method according to claim 27, characterized in that: A surface of the first target component facing the carrying portion is a curved surface.

Images