A quartz wafer polishing apparatus

Abstract

This application provides a quartz wafer polishing apparatus, including a lower polishing plate and an upper polishing plate. The polishing plate is provided with polishing teeth, which mesh with both an annular toothed disc and a circular toothed plate, allowing the polishing teeth to rotate in the opposite direction to the rotation of the circular toothed plate. Inside the polishing teeth is a vertical plate and a resetting member. The resetting member is meshed between a set of vertical plates, which includes two plates: one plate extends partially beyond the upper end face of the polishing teeth, and the other plate extends partially beyond the lower end face. By rotating the resetting member, the vertical plate can be in a first state of partially extending out of the polishing teeth and a second state of being fully retracted into the polishing teeth. By lifting the polishing teeth with the vertical plates, and ensuring that both the upper and lower plates are flush with the surface of the quartz wafer, the poor polishing effect at the bottom of the quartz wafer is solved, thereby improving the polishing effect of both sides of the quartz wafer.

Description

Technical Field

[0001] This invention relates to the field of grinding technology, and in particular to a quartz wafer grinding apparatus. Background Technology

[0002] Since the beginning of the 21st century, the IT information revolution has progressed from analog to digital, combining wireless and wired networks. This allows for the sharing of large amounts of information such as data, music, and audio-visual content across networks and various media. Quartz crystal chips, used in crystal products, serve as crucial components in this digital information society.

[0003] Quartz wafers require grinding on both their top and bottom surfaces during production. However, existing grinding equipment results in poor grinding of the bottom of the quartz wafer because the bottom of the wafer is always flush with the bottom surface of the grinding plate during the grinding process, thus affecting the processing effect of the quartz wafer. Summary of the Invention

[0004] In view of this, the main objective of the present invention is to solve the technical problem of poor grinding effect at the bottom of quartz wafers.

[0005] This invention provides a quartz wafer polishing apparatus, including a lower polishing plate and an upper polishing plate; the polishing plate is provided with a polishing toothed plate, which is simultaneously engaged with an annular toothed disc and a circular toothed plate, enabling the polishing toothed plate to rotate in a direction opposite to the rotation direction of the circular toothed plate; the interior of the polishing toothed plate is provided with a vertical plate and a reset member, the reset member being engaged between a set of vertical plates, the set of vertical plates including two vertical plates, one vertical plate partially extending out of the upper end face of the polishing toothed plate, and the other vertical plate partially extending out of the lower end face of the polishing toothed plate, wherein by rotating the reset member, the vertical plate has a first state of partially extending out of the polishing toothed plate and a second state of being completely retracted into the polishing toothed plate.

[0006] In some embodiments of the present invention, both the annular toothed disc and the circular toothed plate are disposed on the lower grinding plate, and the circular toothed plate is located at the center of the annular toothed disc. The annular toothed disc is connected to a drive motor disposed in the base via a transmission shaft. The grinding toothed plate is disposed between the circular toothed plate and the annular toothed disc, and the grinding toothed plate simultaneously meshes with the inner ring teeth of the annular toothed disc and the outer ring teeth of the circular toothed plate.

[0007] In some embodiments of the present invention, the reset member includes: a mounting post disposed within the grinding tooth plate, the two ends of the mounting post being fixed to the inner wall of the grinding tooth plate respectively; a toothed ring movably sleeved on the mounting post; and a torque spring sleeved on the mounting post, the end of the torque spring being fixedly connected to the mounting post, and the middle part of the torque spring being fixedly connected to the toothed ring.

[0008] In some embodiments of the present invention, a limiting pin is provided on the outer wall of the mounting post, and the toothed ring is disposed between a set of the limiting pins, wherein the set of the limiting pins includes two limiting pins.

[0009] In some embodiments of the present invention, the quartz wafer polishing apparatus further includes a frame, and a movable component is disposed above the frame. The movable component is connected to the upper polishing plate, enabling the upper polishing plate to move in a vertical direction.

[0010] In some embodiments of the present invention, the moving component includes: a cylinder mounted on the frame; and a connector connected to the movable end of the cylinder, the end of the connector away from the cylinder being connected to the upper grinding plate.

[0011] In some embodiments of the present invention, a control panel is provided on the frame, and the control panel is electrically connected to the cylinder and the drive motor disposed inside the base.

[0012] In some embodiments of the present invention, the outer wall of the upper grinding plate is provided with a through hole in the circumferential direction, and an infusion tube is installed in the through hole.

[0013] The present invention provides a quartz wafer grinding device, which lifts the grinding tooth plate by means of a vertical plate, and both the upper and lower vertical plates are flush with the surface of the quartz wafer. Compared with the traditional structure in which the upper end face of the quartz wafer is in contact with the upper grinding plate alone and the lower end face of the quartz wafer is flush with the outer wall of the grinding tooth plate, this invention solves the problem of poor grinding effect at the bottom of the quartz wafer, thereby improving the effect of double-sided grinding of the quartz wafer. Attached Figure Description

[0014] Figure 1 This is an assembly schematic diagram of a quartz wafer grinding apparatus according to an embodiment of the present invention;

[0015] Figure 2 This is a top view of the lower grinding plate of a quartz wafer grinding apparatus according to an embodiment of the present invention;

[0016] Figure 3 This is a schematic diagram of a working state of a grinding tooth plate according to an embodiment of the present invention;

[0017] Figure 4This is a schematic diagram of another working state of the grinding tooth plate according to one embodiment of the present invention.

[0018] The above figures include the following reference numerals:

[0019] 10. Frame; 11. Base; 12. Control panel; 20. Lower grinding plate; 21. Annular gear plate; 22. Circular gear plate; 23. Drive shaft; 30. Grinding gear plate; 31. Placement hole; 32. Vertical plate; 3201. Tooth groove; 33. Reset component; 40. Moving assembly; 41. Cylinder; 42. Connector; 43. Upper grinding plate; 50. Quartz wafer. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] Please see Figures 1-4 This application illustrates a quartz wafer polishing apparatus, including a lower polishing plate 20 and an upper polishing plate 43. The polishing plate 20 is provided with a polishing toothed plate 30, which meshes with both an annular toothed disc 21 and a circular toothed plate 22, allowing the polishing toothed plate 30 to rotate in the opposite direction to the rotation of the circular toothed plate 22. Inside the polishing toothed plate 30 are a vertical plate 32 and a reset member 33. The reset member 33 is meshed between a set of vertical plates 32. Each set of vertical plates 32 includes two vertical plates 32, one of which extends partially beyond the upper end face of the polishing toothed plate 30, and the other extends partially beyond the lower end face of the polishing toothed plate 30. By rotating the reset member 33, the vertical plate 32 can be in a first state of partially extending out of the polishing toothed plate 30 and a second state of being fully retracted into the polishing toothed plate 30.

[0022] Specifically, the annular toothed disc 21 and the circular toothed plate 22 are both disposed on the lower grinding plate 20, and the circular toothed plate 22 is located at the center of the annular toothed disc 21. The annular toothed disc 21 is connected to a drive motor disposed in the base 11 via a transmission shaft 23. The grinding toothed plate 30 is disposed between the circular toothed plate 22 and the annular toothed disc 21, and the grinding toothed plate 30 simultaneously meshes with the inner ring teeth of the annular toothed disc 21 and the outer ring teeth of the circular toothed plate 22.

[0023] Applying the technical solution of this embodiment, the circular toothed plate 22 is connected to the drive motor disposed in the base 11 via the drive shaft 23, and a snap-fit ​​hole is provided in the middle of the upper grinding plate 43, so that the drive shaft can pass through the snap-fit ​​hole and abut against the inner wall of the upper grinding plate 43. Thus, after the drive motor is started, due to the action of the drive shaft 23, the circular toothed plate 22 and the upper grinding plate 43 will rotate synchronously. When the circular toothed plate 22 rotates, the grinding toothed plate 30 is disposed between the circular toothed plate 22 and the annular toothed disk 21, and the grinding toothed plate 30 simultaneously interacts with the annular toothed disk 21. The inner ring teeth of the toothed disc 21 and the outer ring teeth of the circular toothed plate 22 mesh with each other, allowing the grinding toothed plate 30 to rotate in the opposite direction to the rotation of the circular toothed plate 22. After the operator places the quartz wafer 50 in the placement hole 31 of the grinding toothed plate 30, the upper grinding plate 43 contacts the upper end face of the quartz wafer 50, and the lower grinding plate 20 contacts the lower end face of the quartz wafer 50. Since both the upper grinding plate 43 and the grinding toothed plate 30 rotate in opposite directions, the upper and lower end faces of the quartz wafer 50 can be ground simultaneously.

[0024] It should be noted that the grinding plate 30 is internally provided with a vertical plate 32 and a reset member 33. The reset member 33 is engaged between a set of vertical plates 32. The set of vertical plates 32 includes two vertical plates 32. One vertical plate 32 partially covers the upper end face of the grinding plate 30, and the other vertical plate 32 partially extends out of the lower end face of the grinding plate 30. The initial state of the vertical plate 32 is when it partially extends out of the grinding plate 30. The upper grinding plate 43 contacts the upper vertical plate 32 and presses the upper vertical plate 32 downward, so that the vertical plate 32 is partially retracted into the grinding plate 30. At this time, since the vertical plate 32 is engaged with the reset member 33, the reset member 33 will rotate synchronously. The reset member 33 has a tendency to recover its deformation during the rotation, so that the lower vertical plate 32 lifts the grinding plate 30, thereby keeping the grinding plate 30 from contacting the lower grinding plate 20.

[0025] Specifically, after the quartz wafer 50 is placed in the placement hole of the grinding plate 30, the upright plate 32 is in a first state where it partially extends out of the grinding plate 30, thereby lifting the grinding plate 30 as if... Figure 3 As shown, the upper grinding plate 43 contacts the upper vertical plate 32 and presses the upper vertical plate 32 downward, causing the vertical plate 32 to partially retract into the grinding tooth plate 30, until the upper end face of the quartz wafer 50 contacts the upper grinding plate 43. Figure 4As shown, during the grinding process, the grinding tooth plate 30 is lifted by the vertical plate 32, and both the upper and lower vertical plates 32 are flush with the surface of the quartz wafer 50. Compared with the traditional structure where the upper end face of the quartz wafer 50 is in contact with the upper grinding plate 43 alone, and the lower end face of the quartz wafer 50 is flush with the outer wall of the grinding tooth plate 30, this solves the problem of poor grinding effect at the bottom of the quartz wafer, thereby improving the double-sided grinding effect of the quartz wafer 50.

[0026] In order to achieve the effect of driving the vertical plate 32 to reset, in a preferred embodiment, the reset member 33 includes: a mounting post disposed in the grinding tooth plate 30, with both ends of the mounting post fixed to the inner wall of the grinding tooth plate; a toothed ring movably sleeved on the mounting post; and a torque spring sleeved on the mounting post, with the end of the torque spring fixedly connected to the mounting post and the middle part of the torque spring fixedly connected to the toothed ring.

[0027] In this structural design, the end of the torque spring is fixedly connected to the mounting post, and the middle part of the torque spring is fixedly connected to the toothed ring. When the toothed ring rotates, the torque spring is in a deformed state, which gives the torque spring the elastic force to restore the deformation, thereby driving the toothed ring to rotate in the opposite direction. This achieves the effect of the reset component driving the vertical plate 32 to reset.

[0028] In one specific embodiment, a limiting pin is provided on the outer wall of the mounting post, and the toothed ring is disposed between a set of the limiting pins, wherein the set of the limiting pins includes two limiting pins. This prevents the toothed ring from moving along the length of the mounting post, effectively improving the stability of the toothed ring during rotation.

[0029] In one specific embodiment, the quartz wafer polishing apparatus further includes a frame 10, above which a moving component 40 is disposed. The moving component 40 is connected to the upper polishing plate 43, enabling the upper polishing plate 43 to move vertically. Thus, the moving component 40 can drive the upper polishing plate 43 to move vertically.

[0030] Specifically, the moving component 40 includes: a cylinder 41 mounted on the frame 10; and a connector 42 connected to the movable end of the cylinder 41, with one end of the connector 42 away from the cylinder 41 connected to the upper grinding plate 43.

[0031] In one specific embodiment, a control panel 12 is provided on the frame 10, and the control panel 12 is electrically connected to the cylinder 41 and the drive motor disposed inside the base 11. The operating status of the cylinder 41 and the drive motor can be controlled through the control panel 12.

[0032] In one specific embodiment, the outer wall of the upper grinding plate 43 is provided with a through hole in the circumferential direction, and an infusion tube is installed in the through hole. In this way, during grinding, the grinding fluid can flow downward through the infusion tube, so that it flows onto the grinding tooth plate 30 and can wash away the grinding debris on the grinding tooth plate 30.

[0033] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A quartz wafer grinding apparatus, characterized in that, Including the lower grinding plate (20) and the upper grinding plate (43); The grinding plate (20) is provided with a grinding tooth plate (30), which is simultaneously engaged with the annular toothed disc (21) and the circular toothed plate (22), so that the grinding tooth plate (30) can rotate in the opposite direction to the rotation direction of the circular toothed plate (22); The grinding tooth plate (30) is provided with a vertical plate (32) and a reset member (33) inside. The reset member (33) is engaged between a set of vertical plates (32). The set of vertical plates (32) includes two vertical plates (32). One vertical plate (32) extends out of the upper end face of the grinding tooth plate (30), and the other vertical plate (32) extends out of the lower end face of the grinding tooth plate (30). By rotating the reset member (33), the vertical plate (32) has a first state of partially extending out of the grinding tooth plate (30) and a second state of being completely retracted into the grinding tooth plate (30). The reset component (33) includes a toothed ring and a torque spring, with the middle part of the torque spring fixedly connected to the toothed ring.

2. The quartz wafer grinding apparatus according to claim 1, characterized in that, The annular toothed disc (21) and the circular toothed plate (22) are both disposed on the lower grinding plate (20), and the circular toothed plate (22) is located at the center of the annular toothed disc (21). The annular toothed disc (21) is connected to the drive motor disposed in the base (11) via the transmission shaft (23). The grinding tooth plate (30) is disposed between the circular tooth plate (22) and the annular tooth disk (21), and the grinding tooth plate (30) simultaneously meshes with the inner ring teeth of the annular tooth disk (21) and the outer ring teeth of the circular tooth plate (22).

3. The quartz wafer grinding apparatus according to claim 1, characterized in that, The reset component (33) includes: The mounting post is disposed in the grinding tooth plate (30), and the two ends of the mounting post are respectively fixed on the inner wall of the grinding tooth plate; The toothed ring that is movably fitted onto the mounting post; and A torque spring is sleeved on the mounting post, and the end of the torque spring is fixedly connected to the mounting post.

4. The quartz wafer grinding apparatus according to claim 3, characterized in that, The outer wall of the mounting column is provided with a limiting pin, and the toothed ring is disposed between a set of the limiting pins, wherein the set of the limiting pins includes two limiting pins.

5. A quartz wafer grinding apparatus according to claim 1, characterized in that, The quartz wafer polishing apparatus also includes a frame (10), on which a moving component (40) is provided. The moving component (40) is connected to the upper polishing plate (43) so that the upper polishing plate (43) can move in the vertical direction.

6. A quartz wafer grinding apparatus according to claim 5, characterized in that, The moving component (40) includes: Cylinder (41) mounted on the frame (10); and A connector (42) is connected to the movable end of the cylinder (41), and one end of the connector (42) away from the cylinder (41) is connected to the upper grinding plate (43).

7. A quartz wafer grinding apparatus according to claim 6, characterized in that, A control panel (12) is provided on the frame (10), and the control panel (12) is electrically connected to the cylinder (41) and the drive motor located inside the base (11).

8. A quartz wafer grinding apparatus according to claim 1, characterized in that, The outer wall of the upper grinding plate (43) is provided with a through hole in the circumferential direction, and an infusion tube is installed in the through hole.

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