Method for bonding auxiliary materials of circuit board and circuit board

Abstract

The present invention discloses a bonding method for auxiliary materials of a circuit board and a circuit board, comprising the following steps: preparing a vacuum box, a plurality of adsorption holes are provided on an adsorption plate, and at least two positioning pins are provided on the adsorption plate; the upper surfaces of all auxiliary materials are pasted on the lower surface of a carrier, and the auxiliary materials and the carrier are respectively penetrated up and down to open a first positioning hole and a second positioning hole; the first positioning hole and the second positioning hole are sequentially inserted into the positioning pins, the auxiliary materials and the carrier are placed on the adsorption plate, the vacuum box is opened, and the adsorption plate is positioned to adsorb the auxiliary materials; the carrier is removed from the auxiliary materials; at least two third positioning holes are penetrated up and down on the main body of the circuit board, and the main body of the circuit board is pasted on the auxiliary materials; the vacuum box is closed, and the main body of the circuit board and the auxiliary materials are taken out from the positioning pins. The bonding method can realize the precise bonding of auxiliary materials on the main body of the circuit board, is adaptable to a variety of auxiliary materials, has low bonding cost, and high processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a method for laminating auxiliary materials of a circuit board and a circuit board. Background Art

[0002] In the process of circuit board processing, especially for rigid-flexible boards and flexible boards, auxiliary materials need to be aligned and bonded to the main body of the circuit board. Auxiliary materials usually include electromagnetic films, covering films, reinforcing plates, pressure-sensitive adhesives, thermosetting adhesives, etc. The traditional method of bonding auxiliary materials is manual bonding, which has poor alignment, cannot be processed in batches, and has high bonding difficulty. At present, the industry also uses a robot plus CCD visual alignment method for bonding processing. Although the positioning accuracy is high, there is also a problem that objects with irregular shapes cannot be processed. It has certain limitations, and the equipment cost is high, and the production cost remains high.

[0003] In addition, the working principle of the utility model patent with the patent number "CN201820461308.X" and the name "A flexible circuit board cover film bonding jig" is: put the circuit board on the surface of the shelf board, put the cover film on the surface of the supporting bottom plate, move the slide bar on the guide rail, let the suction cup suck up the cover film, and then make the cover film accurately pressed on the surface of the circuit board. This bonding jig still has the defect of inaccurate positioning, and relying on the suction cup to suck up the cover film, it can only be used for larger auxiliary materials such as the cover film. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for laminating auxiliary materials of a circuit board, which can accurately laminar the auxiliary materials and is suitable for a variety of auxiliary materials.

[0005] The invention also provides a circuit board.

[0006] According to a first aspect of the present invention, a bonding method for auxiliary materials of a circuit board comprises the following steps: step 1, preparing a vacuum box, on which an adsorption plate is arranged, on which a plurality of adsorption holes are provided, and on which at least two positioning pins are provided; step 2, preparing at least one auxiliary material and a carrier, the upper surfaces of all the auxiliary materials being pasted on the lower surface of the carrier, the auxiliary material and the carrier being respectively penetrated by a first positioning hole and a second positioning hole, and at least two second positioning holes are provided; step 3, the first positioning hole and the second positioning hole are sequentially inserted into the positioning pins, the auxiliary material and the carrier are placed on the adsorption plate, the vacuum box is opened, and the adsorption plate is positioned to adsorb the auxiliary material; step 4, the carrier is removed from the auxiliary material; step 5, preparing a circuit board body, on which at least two third positioning holes are penetrated by the upper and lower parts, the third positioning holes are inserted into the positioning pins, and the circuit board body is pasted on the auxiliary material; step 6, closing the vacuum box, taking out the circuit board body and the auxiliary material from the positioning pins, and obtaining a finished product.

[0007] At least the following beneficial effects are achieved: the bonding method provides an adsorption plate with multiple adsorption holes on a vacuum box, at least two positioning pins are provided on the adsorption plate, and the carrier and the auxiliary material positioned and pasted on the carrier are placed on the adsorption plate through the positioning pins. The positioning pins can position the auxiliary material and fix the auxiliary material by adsorption through the adsorption holes. The carrier can be removed from the auxiliary material without causing positional displacement of the auxiliary material. The circuit board body is then positioned and bonded to the auxiliary material through the positioning pins, and the bonding work can be completed by closing the vacuum box. The auxiliary material can be accurately bonded to the circuit board body, and the multiple adsorption holes on the adsorption plate can adsorb and fix auxiliary materials of smaller sizes, thereby adapting to a variety of auxiliary materials. The bonding cost is low, and the bonding work of multiple auxiliary materials can be completed simultaneously, with high processing efficiency.

[0008] According to some embodiments of the present invention, the adsorption holes are only distributed in the area corresponding to the auxiliary material.

[0009] According to some embodiments of the present invention, the inner diameter of the adsorption hole is 0.05-0.1 mm.

[0010] According to some embodiments of the present invention, the auxiliary material is a pressure-sensitive adhesive.

[0011] According to some embodiments of the present invention, the auxiliary material is a thermosetting adhesive, and in step five, the adsorption plate is heated.

[0012] According to some embodiments of the present invention, the auxiliary material is a film material or a plate material, and in step 2, the upper surfaces of all the auxiliary materials are adhered to the lower surface of the carrier through an adhesive layer.

[0013] According to some embodiments of the present invention, in step five, the circuit board main body is adhered to the auxiliary material through the adhesive layer.

[0014] According to some embodiments of the present invention, the carrier is release paper or release film.

[0015] According to some embodiments of the present invention, the number of the second positioning holes and the number of the third positioning holes are not less than the number of the positioning pins.

[0016] The circuit board according to the second embodiment of the present invention is manufactured by using the bonding method of the auxiliary materials of the circuit board according to the first embodiment of the present invention.

[0017] At least the following beneficial effects are achieved: the circuit board has all the beneficial effects brought about by the above-mentioned bonding method, which will not be described repeatedly here.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0020] Figure 1 It is a schematic diagram of the structure of some embodiments of the present invention when completing step three;

[0021] Figure 2 It is a schematic diagram of the structure of some embodiments of the present invention when completing step five;

[0022] Figure 3 This is a schematic diagram of the structure of another embodiment of the present invention when completing step three;

[0023] Figure 4 This is a schematic diagram of the structure of another embodiment of the present invention when completing step five.

[0024] Reference numerals: vacuum box 1, adsorption plate 2, adsorption hole 21, positioning pin 22, auxiliary material 3, carrier 4, circuit board body 5, adhesive layer 6. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In the description of the present invention, if there is a description of first, second, and third, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0028] In the description of the present invention, unless otherwise clearly defined, words such as fitting, adsorption, setting, installation, and connection should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0029] Reference Figure 1 and Figure 2 The present invention discloses a method for bonding auxiliary materials of a circuit board, comprising the following steps:

[0030] Step 1: prepare a vacuum box 1, set an adsorption plate 2 on the vacuum box 1, the adsorption plate 2 has a plurality of adsorption holes 21, and at least two positioning pins 22 are set on the adsorption plate 2;

[0031] Step 2: prepare at least one auxiliary material 3 and a carrier 4, the upper surfaces of all auxiliary materials 3 are pasted on the lower surface of the carrier 4, the auxiliary material 3 and the carrier 4 are respectively penetrated from top to bottom to form a first positioning hole and a second positioning hole, and at least two second positioning holes are provided;

[0032] Step 3: insert the first positioning hole and the second positioning hole into the positioning pin 22 in sequence, place the auxiliary material 3 and the carrier 4 on the adsorption plate 2, open the vacuum box 1, and position the adsorption plate 2 to adsorb the auxiliary material 3;

[0033] Step 4: Remove the carrier 4 from the auxiliary material 3;

[0034] Step 5, prepare the circuit board body 5, set at least two third positioning holes through the upper and lower parts of the circuit board body 5, make the third positioning holes fit into the positioning pins 22, and stick the circuit board body 5 on the auxiliary material 3;

[0035] Step 6: Close the vacuum box 1, take out the circuit board body 5 and the auxiliary material 3 from the positioning pins 22, and obtain the finished product.

[0036] It can be understood that the adsorption holes 21 are connected to the interior of the vacuum box 1. When the vacuum box 1 is opened, the gas inside the vacuum box 1 can be evacuated to form a vacuum state, thereby providing a vacuum suction effect for the multiple adsorption holes 21, so that the adsorption holes 21 have the ability of negative pressure adsorption to adsorb the auxiliary material 3; when the vacuum box 1 is closed, the adsorption holes 21 no longer have the ability of negative pressure adsorption and cannot adsorb the auxiliary material 3.

[0037] Reference Figure 1 and Figure 2 In this bonding method, an adsorption plate 2 with multiple adsorption holes 21 is arranged on a vacuum box 1, and at least two positioning pins 22 are arranged on the adsorption plate 2. The carrier 4 and the auxiliary material 3 positioned and pasted on the carrier 4 are placed on the adsorption plate 2 through the positioning pins 22. The positioning pins 22 can position the auxiliary material 3 and fix the auxiliary material 3 by adsorption through the adsorption holes 21. The carrier 4 can be removed from the auxiliary material 3 without causing the position of the auxiliary material 3 to shift. Then, the circuit board body 5 is positioned and bonded to the auxiliary material 3 through the positioning pins 22. The vacuum box 1 can be closed to complete the bonding work, and the auxiliary material 3 can be accurately bonded to the circuit board body 5.

[0038] Since the multiple adsorption holes 21 on the adsorption plate 2 can adsorb and fix auxiliary materials 3 of smaller sizes, the present bonding method can adapt to a variety of auxiliary materials 3, the bonding cost is low, and the bonding work of multiple pieces of auxiliary materials 3 can be completed at the same time, with high processing efficiency.

[0039] Among them, only one first positioning hole can be set, and at least two positioning pins 22, second positioning holes and third positioning holes are set, so that the positioning pin 22 can realize the positioning of the carrier 4 and the circuit board body 5 in the horizontal direction. In some embodiments, the number of the second positioning holes and the third positioning holes is not less than the number of the positioning pins 22, so that the carrier 4 and the circuit board body 5 can be respectively inserted into the positioning pins 22, which is also convenient for completing the bonding work of multiple pieces of auxiliary materials 3 at the same time.

[0040] Reference Figure 1 and Figure 2 In some embodiments of the present invention, the adsorption holes 21 are only distributed in the area corresponding to the auxiliary material 3, so that the adsorption effect of the adsorption holes 21 can be fully applied to the auxiliary material 3, thereby firmly adsorbing the auxiliary material 3 and reducing waste.

[0041] In some embodiments, the inner diameter of the adsorption holes 21 is 0.05-0.1 mm and is densely distributed, so as to be able to accommodate auxiliary materials 3 of very small size.

[0042] In some embodiments of the present invention, reference Figure 1 and Figure 2 The auxiliary material 3 is a pressure-sensitive adhesive. It can be understood that one side of the pressure-sensitive adhesive is sticky and can be adhered to the adhesive carrier 4 and the circuit board body 5. The other side of the pressure-sensitive adhesive has its own adhesive tape, label paper or sheet to prevent adhesion to the adsorption plate 2.

[0043] In some embodiments of the present invention, reference Figure 1 and Figure 2 The auxiliary material 3 is a thermosetting adhesive, which is pasted to the carrier 4 in advance. After the carrier 4 is removed, in step five, the adsorption plate 2 is heated so that the thermosetting adhesive can be pasted to the circuit board body 5. It can be understood that the lower surface of the thermosetting adhesive has an isolation layer to prevent adhesion to the adsorption plate 2.

[0044] Reference Figure 3 and Figure 4 In another embodiment of the present invention, the auxiliary material 3 is a film material or a plate material. In step 2, the upper surfaces of all the auxiliary materials 3 are adhered to the lower surface of the carrier 4 through the adhesive layer 6. In step 5, the circuit board body 5 is adhered to the auxiliary material 3 through the adhesive layer 6.

[0045] In order to facilitate the removal of the carrier 4 from the auxiliary material 3 , the carrier 4 may be a release paper or a release film, which can be easily torn off from the auxiliary material 3 .

[0046] The present invention also provides a circuit board, which is made by the bonding method of the circuit board auxiliary materials of the above embodiment. The circuit board has all the beneficial effects brought by the above bonding method, which will not be repeated here.

[0047] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A method for bonding auxiliary materials of a circuit board, characterized in that: The following steps are involved: Step 1: prepare a vacuum box, on which an adsorption plate is arranged, a plurality of adsorption holes are provided on the adsorption plate, and at least two positioning pins are provided on the adsorption plate; Step 2: prepare a carrier and a plurality of auxiliary materials, wherein the upper surfaces of all the auxiliary materials are pasted to the lower surface of the carrier, and the auxiliary materials and the carrier are respectively penetrated from top to bottom to form a first positioning hole and a second positioning hole, and at least two second positioning holes are provided; Step 3: insert the first positioning hole and the second positioning hole into the positioning pin in sequence, place the auxiliary material and the carrier on the adsorption plate, open the vacuum box, and position the adsorption plate to adsorb the auxiliary material; Step 4: removing the carrier from the auxiliary material; Step 5, prepare a circuit board body, the circuit board body is penetrated by at least two third positioning holes from top to bottom, the third positioning holes are inserted into the positioning pins, and the circuit board body is pasted on the auxiliary material; Step 6: close the vacuum box, take out the circuit board body and the auxiliary materials from the positioning pins, and obtain a finished product.

2. A method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The adsorption holes are only distributed in the area corresponding to the auxiliary material.

3. A method for bonding auxiliary materials for a circuit board according to claim 1 or 2, characterized in that: The inner diameter of the adsorption hole is 0.05-0.1 mm.

4. A method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The auxiliary material is pressure-sensitive adhesive.

5. The method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The auxiliary material is thermosetting adhesive. In step five, the adsorption plate is heated.

6. A method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The auxiliary materials are film materials or plate materials. In step 2, the upper surfaces of all the auxiliary materials are adhered to the lower surface of the carrier through an adhesive layer.

7. A method for bonding auxiliary materials for a circuit board according to claim 6, characterized in that: In step five, the circuit board body is adhered to the auxiliary material through the adhesive layer.

8. The method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The carrier is release paper or release film.

9. The method for bonding auxiliary materials for a circuit board according to claim 1, characterized in that: The number of the second positioning holes and the number of the third positioning holes are not less than the number of the positioning pins.

10. A circuit board, characterized in that The circuit board is manufactured by the bonding method of the auxiliary material for the circuit board according to any one of claims 1 to 9.

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