Quick Temperature Change Test Method for Encapsulated Products

Abstract

The present invention provides a rapid temperature change test method for encapsulated products. The test equipment used includes a test chamber, a positioning unit, and a test unit. In the present invention, a sample module that can accurately simulate the actual temperature inside the encapsulated product during the test can truly simulate the test state of the encapsulated product, and based on this, output a signal to the temperature controller to automatically correct and compensate for the temperature inside the test chamber, ensuring that the equipment operates effectively during the test, effectively improving the accuracy of the test results, so as to timely detect design and process faults of the product, facilitate subsequent design and process improvements, and improve the reliability of the product.

Description

Technical Field

[0001] The present invention belongs to the technical field of rapid temperature change test, and particularly relates to a rapid temperature change test method for packaged products. Background Art

[0002] The rapid temperature change test is used to determine the adaptability of products for storage, transportation, and use in a climatic environment with rapid or slow changes in high and low temperatures. The test process takes normal temperature → low temperature → low temperature residence → high temperature → high temperature residence → normal temperature as one cycle, and the severity of the temperature cycle test is determined by the high / low temperature range, residence time, and number of cycles.

[0003] Currently, in the semiconductor industry, the main steps for the rapid temperature change test of packaged products are as follows: placing the tray loaded with products into the temperature change test chamber → closing the chamber door → setting the program on the control panel of the test chamber according to the standard temperature and humidity environment requirements → starting the program to conduct the environmental test → monitoring whether the temperature output by the equipment controller (generally a single point, air temperature) meets the standard requirements.

[0004] However, in the actual test process, the temperature output by the above test method is only the air temperature of the equipment cavity. In order to meet high performance and for the purpose of stable and reliable product installation, sealing, and transportation, currently, packaged products in the semiconductor industry usually adopt a multi-chip stacking design and various frame structure designs, and the structure is very complex. Therefore, when using the existing rapid temperature change test method, due to the different heat absorption performances of various materials on the packaged products and the different placement methods of the products during the test, there are obvious lag and attenuation phenomena in the highest / lowest temperature and high / low temperature residence time inside the actual product compared with the air curve output by the test chamber, resulting in inaccurate test results, affecting the subsequent improvement of the product, and reducing the reliability of the product. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a new rapid temperature change test method for packaged products.

[0006] To solve the above technical problem, the present invention adopts the following technical solutions:

[0007] A rapid temperature change test method for a packaged product, the test equipment used includes a test chamber with a test cavity, a positioning unit, and a test unit. The positioning unit includes a positioning rack placed in the test cavity, and the positioning rack has multiple layers of positioning areas spaced up and down, and multiple packaged products are correspondingly positioned in each layer of positioning area; the test unit includes a sample module with the same structure as the packaged product, a first temperature monitoring component for monitoring the internal temperature of the sample module, a second temperature monitoring component for monitoring the air temperature in the test cavity, and a temperature controller. The test method includes the following steps:

[0008] S1. Fabricate a sample module and a positioning rack according to the encapsulation product to be tested.

[0009] S2. After placing the sample module and multiple other encapsulation products at specified positions on the positioning rack, send them into the test chamber, and insert the monitoring probes of the first temperature monitoring component and the second temperature monitoring component into the interior of the sample module and the test chamber respectively.

[0010] S3. After inputting the set parameters, start the test equipment for cyclic operation. The first temperature monitoring component and the second temperature monitoring component respectively obtain the module temperature curve and the air temperature curve. When the test equipment runs to the second cycle, the first temperature monitoring component and the second temperature monitoring component synchronously send the module temperature curve and the air temperature curve to the temperature controller. The temperature controller performs data comparison, calculation, and processing on the two temperature curves, and takes the module temperature curve as the benchmark. The temperature controller controls and corrects the maximum temperature, high-temperature residence time, minimum temperature, and low-temperature residence time of the air in the test chamber according to the differences between the module temperature curve and the air temperature curve.

[0011] Preferably, the positioning rack includes a rack body and a plurality of positioning trays that are spaced up and down on the rack body. A plurality of positioning slots that penetrate up and down are formed on each positioning tray, and the encapsulation products are correspondingly inserted into the positioning slots. With this setting, the hollow trays are adopted to ensure that the sample module and the encapsulation products are evenly heated up and down.

[0012] Specifically, a border is provided at the edge of the top opening of each positioning slot, and the inner side of the border is gradually narrowed from top to bottom. The encapsulation product and / or the sample module are mounted on the inner side of the border from the outer periphery. With this setting, the contact area between the sample module and the encapsulation product and the border is reduced, and the heat transfer between the tray is reduced.

[0013] According to a specific implementation and preferred aspect of the present invention, the rack body is a rectangular frame vertically placed in the test chamber, and the four sides of the rectangular frame are spaced apart from the corresponding side walls of the test chamber. The distance between each side of the rectangular frame and the corresponding side wall of the test chamber is greater than or equal to 1 / 10 times the length of the corresponding side of the rectangular frame. Ensure that each encapsulation product is evenly heated.

[0014] Further, there are at least two positioning racks, which are placed side by side in the test chamber.

[0015] According to another specific implementation and preferred aspect of the present invention, the sample module is positioned in the positioning area of the middle layer; the sample module is positioned in the middle of the corresponding positioning area.

[0016] Preferably, the material of the sample module is the same as that of the encapsulation product. With this setting, the thermal conductivity of the sample module can be the same as that of the encapsulation product, so as to more accurately simulate the temperature inside the actual encapsulation product.

[0017] Specifically, the sample module includes a substrate, a protective cover, a chip installed between the substrate and the protective cover, and a sensing wire. A through hole is formed at the center of the substrate, and the sensing wire passes through the through hole and extends into the interior of the sample module. During the test, the first temperature monitoring component is connected to the sensing wire.

[0018] Preferably, a sensor is provided in the test chamber above the positioning frame. During the test, the second temperature detection component is connected to the sensor.

[0019] In addition, the test unit further includes an alarm. When the corresponding temperature difference between the module temperature curve and the air temperature curve is less than 3°C and the corresponding residence time difference is less than 2 minutes, the temperature controller does not perform temperature correction; when the corresponding temperature difference between the module temperature curve and the air temperature curve is 3 - 5°C and the corresponding residence time difference is 2 - 5 minutes, the temperature controller automatically corrects and compensates each parameter; when the corresponding temperature difference between the module temperature curve and the air temperature curve is greater than 5°C and the corresponding residence time difference is greater than 5 minutes, the alarm is triggered and an alarm is issued.

[0020] Due to the implementation of the above technical solutions, the present invention has the following advantages compared with the prior art:

[0021] The present invention can accurately simulate the actual temperature inside the packaged product during the test through the sample module, can truly simulate the test state of the packaged product, and outputs a signal to the temperature controller based on this to automatically correct and compensate the temperature inside the test chamber, ensuring that the equipment operates effectively during the test, effectively improving the accuracy of the test results, so as to timely detect the design and process faults of the product for subsequent design and process improvement, and improve the reliability of the product. Description of the Drawings

[0022] Figure 1 It is a front view schematic diagram (partially sectioned) of the rapid temperature change test method for the packaged product of the present invention;

[0023] Figure 2 is Figure 1 an enlarged top view schematic diagram of the positioning tray in

[0024] Figure 3 is an exploded schematic diagram of the sample module;

[0025] Figure 4 is a curve comparison schematic diagram of the internal temperature of the sample module and the air temperature in the test chamber;

[0026] Among them: 1. Test chamber; q1. Test cavity; a. Sensor

[0027] 2. Positioning unit; 20. Positioning frame; 200. Frame body; k. Support block; 201. Positioning tray; q2. Positioning area; c. Positioning groove; c0. Border; e. Frame ear

[0028] 3. Test unit; 30. Sample module; 300. Substrate; 301. Protective cover; 302. Chip; 303. Sensing wire; 31. First temperature monitoring component; 32. Second temperature monitoring component; 33. Temperature controller Detailed implementation manners

[0029] To make the above objects, features, and advantages of the present application more apparent and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below

[0030] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application

[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined

[0032] In the present application, unless otherwise clearly specified and limited, the terms "install", "connect", "connection", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances

[0033] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature has a lower horizontal height than the second feature. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0034] As Figures 1 to 4 shown, the rapid temperature change test method for the packaged product of this embodiment includes a test chamber 1, a positioning unit 2, and a test unit 3.

[0035] Specifically, the test chamber 1 has a test cavity q1 that provides a temperature change environment.

[0036] In this example, the positioning unit 2 includes two positioning frames 20 that are placed side by side and spaced apart in the test cavity q1, and each positioning frame 20 has multiple layers of positioning areas q2 that are spaced apart vertically, and multiple packaged products are correspondingly positioned in each layer of the positioning area q2.

[0037] Specifically, each positioning frame 20 includes a frame body 200 and multiple positioning trays 201 that are vertically spaced and installed on the frame body 200.

[0038] The frame body 200 is a rectangular frame that is vertically placed in the test cavity q1, and the four sides of the rectangular frame are spaced apart from the corresponding side walls of the test cavity q1, and the distance between each side of the rectangular frame and the corresponding side wall of the test cavity q1 is equal to 1 / 10 of the length of the corresponding side of the rectangular frame.

[0039] At the same time, multiple support blocks k are respectively provided at intervals from top to bottom on the opposite sides of the rectangular frame, and frame ears e are provided on the opposite sides of each positioning tray 201, and each positioning tray 201 is installed on the corresponding support block k from the frame ear e.

[0040] Specifically, a plurality of positioning grooves c penetrating up and down are formed on each positioning tray 201. The plurality of positioning grooves c are arranged in an array, and a plurality of encapsulated products are inserted into the positioning grooves c in one-to-one correspondence. The material of the positioning tray 201 meets the requirements of high temperature resistance and anti-static. The size of the positioning groove c is customized according to the actual product size. With such a setting, a hollow tray is adopted to ensure that the sample module and the encapsulated product are evenly heated up and down.

[0041] To further facilitate implementation, a frame c0 is provided at the edge of the top opening of each positioning groove c, wherein the inner side of the frame c0 is gradually narrowed from top to bottom, and the encapsulated product is mounted on the inner side of the frame c0 from the outer periphery. With such a setting, the contact surface between the sample module and the encapsulated product and the frame is reduced, and the heat transfer between the tray is reduced.

[0042] In this example, the test unit 3 includes a sample module 30 having the same structure as the encapsulated product, a first temperature monitoring component 31 for monitoring the internal temperature of the sample module 30 to obtain the module temperature curve L1, a second temperature monitoring component 32 for monitoring the air temperature in the test chamber q1 to obtain the air temperature curve L2, and a temperature controller 33. The sample module 30 is positioned in one layer of the multi-layer positioning area q2. During the test, the temperature controller 33 controls and corrects the maximum temperature, high temperature residence time, minimum temperature, and low temperature residence time of the air in the test chamber q1 according to the difference between the module temperature curve and the air temperature curve.

[0043] Specifically, the sample module 30 is positioned in the positioning area q2 of the middle layer, and the sample module 30 is also positioned in the middle of the positioning area q2, wherein the positioning method of the sample module 30 is the same as that of other encapsulated products.

[0044] To improve the accuracy of simulating the internal temperature of the encapsulated product by the sample module 30, the material of the sample module 30 is the same as that of the encapsulated product. With such a setting, the thermal conductivity of the sample module can be the same as that of the encapsulated product, so as to more accurately simulate the temperature inside the actual encapsulated product.

[0045] Specifically, the sample module 30 includes a substrate 300, a protective cover 301, a chip 302 installed between the substrate 300 and the protective cover 301, and a sensing wire 303. A through hole is formed in the center of the substrate 300, and the sensing wire 303 passes through the through hole and extends into the interior of the sample module 30. During the test, the first temperature monitoring component 31 is connected to the sensing wire 303.

[0046] At the same time, a sensor a is provided in the test chamber q1 above the positioning frame 20. During the test, the second temperature detection component 32 is connected to the sensor a.

[0047] For convenient implementation, a central control area is provided on the test chamber 1 on one side of the test cavity q1. The first temperature monitoring component 31, the second temperature monitoring component 32, the temperature controller 33, and the control panel are respectively integrated in the central control area, facilitating the staff to observe data and operate.

[0048] In addition, the test unit 3 further includes an alarm. When the corresponding temperature difference between the temperature curves respectively monitored and obtained by the first temperature monitoring component 31 and the second temperature detection component 32 is greater than 5°C, and the corresponding residence time difference is greater than 5 minutes, the alarm is triggered to issue an alarm, prompting the staff to stop the machine for inspection.

[0049] In summary, the implementation process of this embodiment is as follows:

[0050] S1. Fabricate the sample module 30 and customize the positioning frame 20 according to the product requirements;

[0051] S2. Place the sample module 30 and multiple other encapsulated products correspondingly at the specified positions on each positioning tray 201, and evenly place the multiple positioning trays 201 in the test cavity q1 through the frame body 200. At the same time, connect the first temperature monitoring component 31 and the second temperature detection component 32 to the sample module 30 and the sensor a respectively;

[0052] S3. Edit the program at the control panel and input the set test parameters, then start the test equipment. The first temperature monitoring component 31 and the second temperature detection component 32 respectively obtain the module temperature curve L1 and the air temperature curve L2. And when the equipment runs to the second cycle, the first temperature monitoring component 31 and the second temperature detection component 32 synchronize the module temperature curve L1 and the air temperature curve L2 to the temperature controller 33 respectively. The temperature controller 33 conducts data comparison, calculation, and processing on the two temperature curves, and calculates the difference and sets the parameter difference interval based on the actual temperature curve inside the sample module 30. Among them,

[0053] If the corresponding temperature difference between the module temperature curve and the air temperature curve is less than 3°C, and the corresponding residence time difference is less than 2 minutes, the temperature controller 33 does not perform temperature correction;

[0054] If the corresponding temperature difference between the module temperature curve and the air temperature curve is 3 - 5°C, and the corresponding residence time difference is 2 - 5 minutes, the temperature controller 33 automatically continuously corrects and compensates each parameter to ensure that the module temperature curve is consistent with the standard requirements;

[0055] If the corresponding temperature difference between the module temperature curve and the air temperature curve is greater than 5°C, and the corresponding residence time difference is greater than 5 minutes, the alarm is triggered to issue an alarm, prompting the staff to stop the machine for inspection.

[0056] The comparison and correction of the curve parameters are illustrated in the following table:

[0057]

[0058] In summary, the present embodiment has the following advantages:

[0059] 1. By means of a sample module that can accurately simulate the actual temperature inside the packaged product during the test, the test state of the packaged product can be truly simulated, and based on this, a signal is output to the temperature controller to automatically correct and compensate for the temperature inside the test chamber, ensuring that the equipment operates effectively during the test, effectively improving the accuracy of the test results, so as to timely detect the design and process faults of the product, for subsequent design and process improvement, and improve the reliability of the product;

[0060] 2. Using the same material, the thermal conductivity of the sample module can be the same as that of the packaged product, so as to more accurately simulate the temperature inside the actual packaged product;

[0061] 3. Adopting the layout of the present application and a hollowed-out tray ensures that the sample module and the packaged product are evenly heated up and down, improving the stability of temperature monitoring.

[0062] The above has described the present invention in detail. The purpose is to enable those skilled in this field of technology to understand the content of the present invention and implement it. However, it should not be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A rapid temperature change test method for encapsulated products, characterized in that, the test equipment used includes a test chamber, a positioning unit, and a test unit. The positioning unit includes a positioning rack placed in the test chamber, and the positioning rack has multiple layers of positioning areas spaced up and down. Multiple encapsulated products are correspondingly positioned in each layer of the positioning area; the positioning rack includes a rack body and multiple positioning trays erected on the rack body at intervals up and down. Each positioning tray is formed with multiple positioning slots penetrating up and down. The encapsulated products are correspondingly inserted into the positioning slots. The edge of the top opening of each positioning slot is provided with a frame, and the inner side of the frame is gradually narrowed from top to bottom. The encapsulated products and / or sample modules are erected on the inner side of the frame from the outer periphery; the test unit includes a sample module with the same structure and thermal conductivity as the encapsulated product, a first temperature monitoring component for monitoring the internal temperature of the sample module, a second temperature monitoring component for monitoring the air temperature in the test chamber, and a temperature controller. The test method includes the following steps: S1. Fabricate a sample module and a positioning rack according to the encapsulated products to be tested; S2. Place the sample module and other multiple encapsulated products at the designated positions on the positioning rack and then send them into the test chamber, and correspondingly insert the monitoring probes of the first temperature monitoring component and the second temperature monitoring component into the interior of the sample module and the test chamber; S3. After inputting the set parameters, start the test equipment to operate in a cycle. The first temperature monitoring component and the second temperature monitoring component respectively obtain the module temperature curve and the air temperature curve. When the test equipment runs to the second cycle, the first temperature monitoring component and the second temperature monitoring component synchronously send the module temperature curve and the air temperature curve to the temperature controller. The temperature controller performs data comparison, calculation, and processing on the two temperature curves, and takes the module temperature curve as the benchmark. The temperature controller controls and corrects the maximum temperature, high-temperature residence time, minimum temperature, and low-temperature residence time of the air in the test chamber according to the difference between the module temperature curve and the air temperature curve.

2. The rapid temperature change test method for encapsulated products according to claim 1, characterized in that, the rack body is a rectangular frame vertically placed in the test chamber, and the four sides of the rectangular frame are spaced apart from the corresponding side walls of the test chamber. The distance between each side of the rectangular frame and the corresponding side wall of the test chamber is greater than or equal to 1 / 10 times the length of the corresponding side of the rectangular frame.

3. The rapid temperature change test method for encapsulated products according to claim 1 or 2, characterized in that, there are at least two positioning racks, and they are placed side by side in the test chamber.

4. The rapid temperature change test method for encapsulated products according to claim 1, characterized in that, the sample module is positioned in the positioning area of the middle layer.

5. The rapid temperature change test method for encapsulated products according to claim 1, characterized in that, the sample module is positioned in the middle of the corresponding positioning area.

6. The rapid temperature change test method for encapsulated products according to claim 1, characterized in that, the material of the sample module is the same as that of the encapsulated product.

7. The rapid temperature change test method for the encapsulated product according to claim 6, characterized in that, the sample module includes a substrate, a protective cover, a chip and a sensing wire installed between the substrate and the protective cover, wherein a through hole is formed in the center of the substrate, the sensing wire passes through the through hole and extends into the interior of the sample module, and during the test, the first temperature monitoring component is connected to the sensing wire.

8. The rapid temperature change test method for the encapsulated product according to claim 1, characterized in that, a sensor is provided in the test chamber above the positioning frame, and during the test, the second temperature monitoring component is connected to the sensor.

9. The rapid temperature change test method for the encapsulated product according to claim 1, characterized in that, the test unit further includes an alarm. When the corresponding temperature difference between the module temperature curve and the air temperature curve is less than 3°C and the corresponding residence time difference is less than 2 minutes, the temperature controller does not perform temperature correction; when the corresponding temperature difference between the module temperature curve and the air temperature curve is 3-5°C and the corresponding residence time difference is 2-5 minutes, the temperature controller automatically corrects and compensates each parameter; when the corresponding temperature difference between the module temperature curve and the air temperature curve is greater than 5°C and the corresponding residence time difference is greater than 5 minutes, the alarm is triggered and an alarm is issued.

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