Memory cards and storage systems

Abstract

According to one embodiment, a memory card is provided having a memory chip, a controller chip, a sealing portion, a first terminal group, a second terminal group, and a conductive pattern. The sealing portion houses the memory chip and the controller chip. The sealing portion has a first main surface and a second main surface. The second main surface is disposed on the opposite side of the first main surface. The first terminal group is disposed on the first main surface. The first terminal group includes a plurality of electrode terminals. The plurality of electrode terminals are arranged along a first direction within the first main surface. The second terminal group is disposed on the first main surface. The second terminal group includes a plurality of electrode terminals. The plurality of electrode terminals are arranged along a first direction within the first main surface. The conductive pattern is disposed between the first terminal group and the second terminal group on the first main surface. The conductive pattern has a larger size than both the electrode terminals in the first terminal group and the electrode terminals in the second terminal group. The conductive pattern is planar.

Description

[0001] Citation of relevant applications

[0002] This application enjoys the benefit of priority to Japanese Patent Application No. 2021-152356, filed on September 17, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This implementation relates to memory cards and memory systems. Background Technology

[0004] In a memory card that houses both a memory chip and a controller chip within a sealed enclosure, the controller chip generates heat during operation. Efficient heat dissipation from the memory card is desired. Summary of the Invention

[0005] One implementation provides a memory card and memory system suitable for efficient heat dissipation.

[0006] According to one embodiment, a memory card is provided having a memory chip, a controller chip, a sealing portion, a first terminal group, a second terminal group, and a conductive pattern. The sealing portion houses the memory chip and the controller chip. The sealing portion has a first main surface and a second main surface. The second main surface is disposed on the opposite side of the first main surface. The first terminal group is disposed on the first main surface. The first terminal group includes a plurality of electrode terminals. The plurality of electrode terminals are arranged along a first direction within the first main surface. The second terminal group is disposed on the first main surface. The second terminal group includes a plurality of electrode terminals. The plurality of electrode terminals are arranged along a first direction within the first main surface. The conductive pattern is disposed between the first terminal group and the second terminal group on the first main surface. The conductive pattern has a larger size than both the electrode terminals in the first terminal group and the electrode terminals in the second terminal group. The conductive pattern is planar.

[0007] Based on the above configuration, a memory card and memory system suitable for efficient heat dissipation can be provided. Attached Figure Description

[0008] Figure 1 This is a perspective view showing the configuration of the memory system in the implementation method.

[0009] Figure 2A as well as Figure 2B This is a cross-sectional view showing the heat dissipation of the memory card in the embodiment.

[0010] Figure 3 This is a top view showing the configuration of the memory card in the implementation method.

[0011] Figure 4 This is a cross-sectional view showing the configuration of the memory card in the implementation method.

[0012] Figure 5 This is a perspective view showing the configuration of a memory system according to a first variation of the implementation method.

[0013] Figure 6A as well as Figure 6B This is a cross-sectional view showing the heat dissipation of the memory card in the first variation of the implementation.

[0014] Figure 7 This is a perspective view showing the configuration of a memory system in a second variation of the implementation.

[0015] Figure 8A as well as Figure 8B This is a cross-sectional view showing the heat dissipation of the memory card in the second variation of the implementation.

[0016] Figure 9 This is a perspective view showing the configuration of a memory system according to a third variation of the implementation method.

[0017] Figure 10 This is a top view showing the configuration of the memory card in the third variation of the implementation.

[0018] Figure 11A as well as Figure 11B This is a cross-sectional view showing the heat dissipation of the memory card in the third variation of the implementation.

[0019] Figure 12 This is a top view showing the configuration of the memory card in other embodiments. Detailed Implementation

[0020] Hereinafter, the memory system of the embodiment will be described in detail with reference to the accompanying drawings. However, this invention is not limited to this embodiment.

[0021] (Implementation Method)

[0022] The memory system of this embodiment can install a memory card into a socket and has a structure for dissipating heat from the memory card when it is installed in the socket. For example, Figure 1 As shown, the memory system 1 has a memory card 10 and a socket 20. Figure 1 This is a perspective view showing the configuration of the memory system 1. Hereinafter, the direction perpendicular to the surface 10a of the memory card 10 is defined as the Z direction, and the two directions orthogonal to the plane perpendicular to the Z direction are defined as the X direction and the Y direction.

[0023] The memory card 10, viewed from above in the XY direction, has a generally rectangular shape with the Y direction as its length. The socket 20 has a recessed space 20a capable of accommodating the memory card 10. The recessed space 20a, viewed from above in the XY direction, has a generally rectangular shape with the Y direction as its length. The memory card 10... Figure 2A , Figure 2BAs shown, it is inserted into the recess 20a with its surface 10a facing the socket 20, so that it can be installed in the socket 20. Figure 2A as well as Figure 2B This diagram shows the installation and heat dissipation of memory card 10. Figure 2A , Figure 2B Equivalent to cutting with line A-A Figure 1 The subsequent cross-section. Figure 2A This shows the state before the memory card 10 was installed. Figure 2B This shows the status of the memory card 10 being installed.

[0024] When the memory card 10 is installed in the socket 20, it can be electrically connected to the host (not shown) via the socket 20. In this state, the controller chip 11 inside the memory card 10 can communicate with the host to perform operations such as reading and writing data to the memory chip. During this operation, the controller chip 11 in the memory card 10 will generate heat.

[0025] In contrast, on the surface 10a of the memory card 10, a planar conductive pattern 15 is provided at the position overlapping with the controller chip 11 when viewed from the Z direction. Furthermore, the socket 20 has a thermally conductive plate-like member 25 at a position where it can contact the conductive pattern 15. When the memory card 10 is installed in the socket 20, the conductive pattern 15 contacts the plate-like member 25. Thus, as... Figure 2B As shown by the dashed line, the heat generated by the controller chip 11 in the memory card 10 can be efficiently dissipated through the conductive pattern 15 and the plate-shaped component 25.

[0026] in addition, Figure 2B The discharge path shown is an example and is not limited to the illustration. The heat transferred to the plate-shaped component 25 can also be dissipated to the surrounding gas via the substrate 24, or to a component (not shown) connected to the host side of the substrate 24 via the substrate 24.

[0027] Specifically, such as Figure 3 as well as Figure 4 As shown, the memory card 10 includes memory chips 12-1 to 12-4, a controller chip 11, a buffer chip 18, a conductive pattern 15, a sealing part 16, a substrate 17, a terminal group TG1, a terminal group TG2, electronic components 9, and a cover 19. Figure 3 This is a top view showing the configuration of the memory card 10, and a view of the memory card 10 from the -Z side (surface 10a side). Figure 4 This is a cross-sectional view showing the configuration of memory card 10, illustrating its use. Figure 3 The cross-section when cut by the B-B line.

[0028] The substrate 17 has multiple memory chips 12-1 to 12-4 stacked on the +Z side and a controller chip 11 disposed thereon. A buffer chip 18 may also be stacked on the +Z side of the memory chip 12-4 closest to the +Z side. Terminal groups TG1 and TG2 are disposed on the -Z side of the substrate 17.

[0029] The sealing portion 16 covers the +Z side of the substrate 17 and houses the memory chips 12-1 to 12-4, the controller chip 11, the buffer chip 18, and the substrate 17. The sealing portion 16 may be formed of a thermoplastic insulating material such as molding resin. The sealing portion 16 covers the -Z side of the substrate 17 and exposes the terminal groups TG1 and TG2. The -Z side of the sealing portion 16 forms the surface 10a of the memory card 10, and the +Z side forms the back surface 10b of the memory card 10.

[0030] Terminal group TG1 and terminal group TG2 are respectively disposed on surface 10a of memory card 10. Terminal group TG1 and terminal group TG2 are separated in the Y direction within surface 10a.

[0031] Terminal group TG1 comprises a plurality of electrode terminals 13-1 to 13-n. N is an integer greater than or equal to 2. The plurality of electrode terminals 13-1 to 13-n are arranged along the X direction within surface 10a. Each electrode terminal 13-1 to 13-n is, for example, approximately rectangular in shape with the Y direction as its length direction. The width of each electrode terminal 13-1 to 13-n is equal in the X direction and approximately equal in the Y direction. Each electrode terminal 13-1 to 13-n is formed of a material whose main component is a conductive material (e.g., containing at least one of copper, gold, silver, aluminum, nickel, etc.).

[0032] Terminal group TG2 comprises multiple electrode terminals 14-1 to 14-m. m is an integer greater than or equal to 2. M may be equal to or different from n. The multiple electrode terminals 14-1 to 14-m are arranged along the X direction within surface 10a. Each electrode terminal 14-1 to 14-m is, for example, approximately rectangular in shape with the Y direction as its length direction. The width of each electrode terminal 14-1 to 14-m is equal in the X direction and approximately equal in the Y direction. Each electrode terminal 14-1 to 14-m is formed of a material whose main component is a conductive material (e.g., containing at least one of copper, gold, silver, aluminum, nickel, etc.).

[0033] Conductive pattern 15 is disposed on surface 10a of memory card 10. Conductive pattern 15 is disposed within surface 10a between terminal group TG1 and terminal group TG2 in the Y direction.

[0034] The conductive pattern 15 is a planar pattern, also referred to as an integral pattern. The conductive pattern 15 is disposed between terminal groups TG1 and TG2 in the Y direction. The conductive pattern 15 may also be rectangular when viewed from above in the XY direction. It is preferable that the conductive pattern 15 has a larger dimension than each electrode terminal 13 in terminal group TG1, but it is not limited thereto. For example, the width of the conductive pattern 15 in the X direction is larger than the width of each electrode terminal 13-1 to 13-n in the X direction. For example, the width of the conductive pattern 15 in the Y direction is larger than the width of each electrode terminal 13-1 to 13-n in the Y direction. For example, the conductive pattern 15 is formed of a material whose main component is a conductive material (e.g., containing at least one of copper, gold, silver, aluminum, nickel, etc.). The conductive pattern 15 is a material with a higher thermal conductivity than the resin constituting the sealing portion 16. Alternatively, if the thermal conductivity is greater than that of the sealing portion 16, the conductive pattern 15 may also be a non-conductive material.

[0035] The conductive pattern 15 is positioned to overlap with the controller chip 11 in surface 10a when viewed from the Z direction. For example, when viewed from the Z direction, the conductive pattern 15 contains the center of the controller chip 11 in the XY direction on its inner side. For example, the width of the conductive pattern 15 in the X direction is larger than the width of the controller chip 11 in the X direction. The conductive pattern 15 is configured to traverse the controller chip 11 in the X direction when viewed from the Z direction. For example, the width of the conductive pattern 15 in the Y direction is smaller than the width of the controller chip 11 in the Y direction. The conductive pattern 15 is configured to traverse the controller chip 11 in the Y direction when viewed from the Z direction. For example, when viewed from the Z direction, the end of the controller chip 11 on the -Y side may also be located between the end of the conductive pattern 15 on the -Y side and the terminal group TG2. It is preferable for the conductive pattern 15 to overlap with the controller chip 11, but it is not limited to this configuration.

[0036] The conductive pattern 15 may also have approximately the same dimensions as the sealing portion 16. The width of the conductive pattern 15 in the X direction may be approximately equal to the width of the sealing portion 16 in the X direction, or it may be the width of the sealing portion 16 after deducting the dimensional allowances for the +X and -X sides. The width of the conductive pattern 15 in the Y direction is smaller than the spacing between terminal groups TG1 and TG2 in the Y direction, for example, about half of that spacing. The distance between the -Y side end of the conductive pattern 15 and the terminal group TG2 is greater than the distance between the +Y side end of the conductive pattern 15 and the terminal group TG1 (for example, more than twice as far).

[0037] return Figure 1 The socket 20 has a cover 21, a wall 22, a wall 23, a base plate 24, a plate-shaped member 25, a connection terminal group TG11, and a connection terminal group TG12.

[0038] The substrate 24 is a plate-shaped component extending along the XY direction. The substrate 24 is formed, for example, from an insulating resin.

[0039] Wall portions 22 and 23 are respectively disposed on the surface 24a of the substrate 24. Wall portions 22 and 23 are two generally transverse U-shaped portions with their openings facing each other when viewed from above in an XY view. Wall portions 22 and 23 form a recessed space 20a. The width of the recessed space 20a in the X direction is approximately equal to the width of the memory card 10 in the X direction, and the width in the Y direction is approximately equal to the width of the memory card 10 in the Y direction.

[0040] A plate-shaped member 25 is disposed on the surface 24a of the substrate 24, located within the recessed space 20a. For example, the plate-shaped member 25 is disposed between the connection terminal group TG11 and the connection terminal group TG12 in the Y direction. The plate-shaped member 25 is disposed at a position capable of contacting the conductive pattern 15 of the memory card 10. The plate-shaped member 25 may also be rectangular in XY view. For example, the width of the plate-shaped member 25 in the X direction may be equal to the width of the conductive pattern 15 in the X direction. For example, the width of the plate-shaped member 25 in the Y direction may be smaller than the spacing between the connection terminal groups TG11 and TG12 in the Y direction. For example, the width of the plate-shaped member 25 in the Y direction may be equal to the width of the conductive pattern 15 in the Y direction.

[0041] The plate-shaped component 25 is formed of a thermally conductive material (TIM: Terminal Interface Material). The plate-shaped component 25 can be a thermally conductive sheet, a thermally conductive grease component, a thermally conductive adhesive component, a thermally conductive putty component, a phase change component, or a solder component. A thermally conductive sheet is a sheet-shaped component formed from resin filled with thermally conductive fillers. A thermally conductive grease component is a component formed by drying and curing a viscous liquid containing thermally conductive particles such as metal powder added to a resin such as silicone into a plate shape. A thermally conductive adhesive component is a component formed by drying and curing a thermally conductive adhesive into a plate shape. A thermally conductive putty component is a component formed by drying and curing a high-viscosity liquid material with thermal conductivity into a plate shape. A phase change component is a component formed by liquefying a phase change material with thermally conductive resin as its main component and then curing it into a plate shape. A solder component is a component formed by melting a solder alloy and then curing it into a plate shape.

[0042] The connection terminal group TG11 is disposed on the inner surface of the wall portion 23 on the -Y side, within the recessed space 20a. The connection terminal group TG11 includes a plurality of connection terminals 26-1 to 26-n. The plurality of connection terminals 26-1 to 26-n are disposed at positions that can contact the plurality of electrode terminals 13-1 to 13-n of the terminal group TG1 in the memory card 10. When the memory card 10 is installed, each connection terminal 26-1 to 26-n protrudes from the inner surface of the wall portion 23 on the -Y side toward the -Y side and +Z side toward the position that can contact the electrode terminal 13.

[0043] The connection terminal group TG12 is disposed on the inner surface of the wall portion 22 on the +Y side, within the recessed space 20a. The connection terminal group TG12 includes a plurality of connection terminals 27-1 to 27-m. The plurality of connection terminals 27-1 to 27-m are disposed at positions that can contact the plurality of electrode terminals 14-1 to 14-m of the terminal group TG2 in the memory card 10. When the memory card 10 is installed, each connection terminal 27-1 to 27-m protrudes from the inner surface of the wall portion 22 on the +Y side toward the +Y and +Z sides toward the position where it can contact the electrode terminal 14.

[0044] The cover 21 is rotatably mounted on both ends of the wall portion 22 in the X direction on the Y side. For example... Figure 2A As shown, the cover 21 is opened by pulling it up towards the +Z side, thus opening the recessed space 20a. In this state, the memory card 10 is inserted into the recessed space 20a, and the memory card 10 is installed in the socket 20. Figure 2B As shown, the cover 21 closes the recessed space 20a by pulling it down towards the -Z side. In this state, the memory card 10 is housed in the socket 20, and the installation of the memory card 10 into the socket 20 is completed.

[0045] The cover 21, by its own weight or in a closed state, engages with a predetermined engagement portion of the wall portion 22 or wall portion 23, thereby enabling the memory card 10 to be pressed towards the -Z side. Accompanying this, as... Figure 2B As shown, each electrode terminal 13 of terminal group TG1 on the surface 10a of memory card 10 is in contact with the connection terminal 26 of connection terminal group TG11. Each electrode terminal 14 of terminal group TG2 on the surface 10a of memory card 10 is in contact with the connection terminal 27 of connection terminal group TG12.

[0046] Therefore, the memory card 10 can communicate with the host via terminal group TG1, connecting terminal group TG11, and / or via terminal group TG2, connecting terminal group TG12, to perform operations such as reading and writing data relative to the memory chip. During this operation, the controller chip 11 in the memory card 10 will generate heat.

[0047] At this time, the conductive pattern 15 on the surface 10a of the memory card 10 comes into contact with the plate-shaped member 25. Thus, as... Figure 2B As indicated by the dashed arrow, the heat generated by the controller chip 11 in the memory card 10 can be efficiently dissipated through the conductive pattern 15 and the plate-shaped component 25.

[0048] As described above, in this embodiment, in the memory system 1, a planar conductive pattern 15 is provided on the surface 10a of the memory card 10, at a position overlapping with the controller chip 11 when viewed from the Z direction. Furthermore, the socket 20 has a thermally conductive plate-like member 25 at a position where it can contact the conductive pattern 15. When the memory card 10 is installed in the socket 20, the conductive pattern 15 contacts the plate-like member 25. Therefore, the heat generated by the controller chip 11 in the memory card 10 can be efficiently dissipated via the conductive pattern 15 and the plate-like member 25.

[0049] Alternatively, the memory card 10 may omit the conductive pattern 15. In this case, also within the memory system 1, such as... Figure 2A as well as Figure 2B As shown, by making the thermally conductive plate-shaped component 25 contact the memory card 10 when the memory card 10 is installed in the socket 20, the heat can be efficiently dissipated when the controller chip 11 inside the memory card 10 generates heat.

[0050] In addition, as a first variation of the implementation method, such as Figure 5 As shown, the socket 120 of the memory system 101 may also have a heat dissipation structure 130. Figure 5 This is a perspective view showing the configuration of the memory system 101 of the first modified embodiment. The heat dissipation structure 130 is in contact with the plate-shaped member 25. The heat dissipation structure 130 has a structure suitable for heat dissipation, for example, having a plurality of heat sinks 128-1 to 128-k, 128-(k+1) to 128-2k and a plurality of heat sinks 129-1 to 129-n, 129-(n+1) to 129-2n.

[0051] For example, heat sinks 128-1 to 128-k are disposed on the -Y side of the plate-shaped member 25, separated from each other and arranged in the X direction. Each heat sink 128-1 to 128-k extends in a plate shape in the YZ direction. Each heat sink 128-1 to 128-k contacts the -Y side of the plate-shaped member 25 and protrudes from the -Y side of the plate-shaped member 25 in the -Y direction. The -Z side end of each heat sink 128-1 to 128-k may also contact the surface 24a of the substrate 24.

[0052] For example, heat sinks 128-(k+1)~128-2k are disposed on the +Y side of the plate-shaped member 25, separated from each other and arranged in the X direction. Each heat sink 128-(k+1)~128-2k extends in a plate shape along the YZ direction. Each heat sink 128-(k+1)~128-2k contacts the +Y side of the plate-shaped member 25 and protrudes from the +Y side of the plate-shaped member 25 in the +Y direction. The -Z side end of each heat sink 128-(k+1)~128-2k may also contact the surface 24a of the substrate 24.

[0053] For example, heat sinks 129-1 to 129-n are disposed on the +X side of the plate-shaped member 25, separated from each other and arranged in the Y direction. Each heat sink 129-1 to 129-n extends in a plate shape along the XZ direction. Each heat sink 129-1 to 129-n contacts the +X side of the plate-shaped member 25 and protrudes from the +X side of the plate-shaped member 25 in the +X direction. The -Z side end of each heat sink 129-1 to 129-n may also contact the surface 24a of the substrate 24.

[0054] For example, heat sinks 129-(n+1)~129-2n are disposed on the -X side of the plate-shaped member 25, separated from each other and arranged in the Y direction. Each heat sink 129-(n+1)~129-2n extends in a plate shape along the XZ direction. Each heat sink 129-(n+1)~129-2n contacts the -X side of the plate-shaped member 25 and protrudes from the -X side of the plate-shaped member 25 in the -X direction. The end of each heat sink 129-(n+1)~129-2n on the -Z side may also contact the surface 24a of the substrate 24.

[0055] like Figure 6A , Figure 6B As shown, the memory card 10 is inserted into the recessed space 20a with its surface 10a facing the socket 120, thereby enabling it to be installed in the socket 120. Figure 6A as well as Figure 6B This is a diagram showing the installation and heat dissipation of the memory card 10 in the first variation of the implementation. Figure 6A , Figure 6B Equivalent to cutting with a C-C line Figure 5 The cross-section. Figure 6A This shows the state before the memory card 10 was installed. Figure 6B This shows the status of memory card 10 being installed.

[0056] When the memory card 10 is in the socket 120, the controller chip 11 generates heat. In contrast, the surface 10a of the memory card 10, when viewed from the Z direction, has a planar conductive pattern 15 overlapping the controller chip 11. Furthermore, the socket 120 has a thermally conductive plate-like member 25 at a location that can contact the conductive pattern 15, and also has a heat dissipation structure 130. When the memory card 10 is in the socket 120, the conductive pattern 15 contacts the plate-like member 25. Thus, as... Figure 6BAs shown by the dashed line, the heat generated by the controller chip 11 in the memory card 10 can be efficiently dissipated via the conductive pattern 15, the plate-shaped component 25, and the heat dissipation structure 130. Specifically, as a heat dissipation path, a new path is added: controller chip 11 → conductive pattern 15 → plate-shaped component 25 → substrate 24 → gas near substrate 24. This improves heat dissipation efficiency.

[0057] In addition, as a second variation of the implementation method, such as Figure 7 As shown, the socket 220 of the memory system 201 can also replace the plate-shaped component 25 (see reference). Figure 1 It has a thin plate-shaped component 225, and further has a heat dissipation structure 230. Figure 7 This is a perspective view showing the configuration of the memory system 201 according to the second variation of the embodiment. The heat dissipation structure 230 may also be disposed between the plate-shaped member 225 and the substrate 24 in the Z direction, contacting both the plate-shaped member 225 and the substrate 24. The heat dissipation structure 230 has a structure suitable for heat dissipation, for example, having multiple heat sinks 228-1 to 228-k.

[0058] The plate-shaped component 225 can also be thinned to the point that the thickness of the plate-shaped component 225 is approximately equal to the sum of the Z-direction widths of each heat sink 228 and the thickness of the plate-shaped component 25. The plate-shaped component 225 can be a heat-conducting sheet material thinned by grinding, a heat-conducting lubricating grease component thinned by grinding, a heat-conducting adhesive component thinned by grinding, a heat-conducting putty component thinned by grinding, a phase change component thinned by grinding, or a solder component thinned by grinding.

[0059] Heat sinks 228-1 to 228-k are separated from each other and arranged in the X direction. Each heat sink 228-1 to 228-k extends in a plate-like shape along the YZ direction. When viewed from above in the XY direction, each heat sink 228-1 to 228-k protrudes from the side of the plate-like member 225 on the -Y side in the -Y direction and from the side of the plate-like member 225 on the +Y side in the +Y direction. The end of each heat sink 228-1 to 228-k may contact the surface of the plate-like member 225 on the -Z side, or the end of the plate-like member 225 on the -Z side may contact the surface 24a of the substrate 24.

[0060] like Figure 8A , Figure 8B As shown, the memory card 10 is inserted into the recess 20a with its surface 10a facing the socket 220, thereby enabling it to be installed in the socket 220. Figure 8A , Figure 8BThis is a diagram showing the installation and heat dissipation of the memory card 10 in the second variation of the implementation. Figure 8A , Figure 8B Equivalent to cutting with the D-D line Figure 7 The cross-section. Figure 8A This shows the state before the memory card 10 was installed. Figure 8B This shows the status of memory card 10 being installed.

[0061] When the memory card 10 is in the socket 220, the controller chip 11 generates heat. In response, a planar conductive pattern 15 is provided on the surface 10a of the memory card 10, overlapping the controller chip 11 when viewed from the Z direction. Furthermore, the socket 220 has a thermally conductive plate-like member 225 at a location where it can contact the conductive pattern 15, and also has a heat dissipation structure 230. When the memory card 10 is in the socket 220, the conductive pattern 15 contacts the plate-like member 225. Thus, as... Figure 8B As shown by the dashed line, the heat generated by the controller chip 11 in the memory card 10 can be efficiently dissipated via the conductive pattern 15, the plate-shaped component 225, and the heat dissipation structure 230. Specifically, as a heat dissipation path, a new path is added between the controller chip 11 → conductive pattern 15 → plate-shaped component 225 → heat dissipation structure 230 → substrate 24 → "gas near substrate 24". This improves heat dissipation efficiency.

[0062] In addition, as a third variation of the implementation method, such as Figure 9 as well as Figure 10 As shown, the conductive pattern 315 of the memory card 310 of the memory system 301 and the plate-shaped component 325 of the socket 320 can also ensure their Y-direction width to a wide extent possible. Figure 9 This is a perspective view showing the configuration of the memory system 301 in the third variation of the implementation. Figure 10 This is a top view showing the configuration of the memory card 310 in the third variation of the embodiment.

[0063] like Figure 10 As shown, when viewed from the Z direction, the Y-direction width of the conductive pattern 315 can also be the same as the Y-direction width of the controller chip 11. The Y-side end of the conductive pattern 315 can also be located between the Y-side end of the controller chip 11 and the terminal group TG2. Correspondingly, the area of ​​the overlapping region between the conductive pattern 315 and the controller chip 11 is larger than the area of ​​the overlapping region between the conductive pattern 315 and the controller chip 11 (refer to...). Figure 3 )big.

[0064] The width of the conductive pattern 315 in the Y direction is approximately equal to the Y-direction spacing between terminal groups TG1 and TG2. For example, the width of the conductive pattern 315 in the Y direction is greater than half the spacing between terminal groups TG1 and TG2 in the Y direction. For example, the distance between the end of the conductive pattern 315 on the -Y side and the terminal group TG2 is approximately the same as the distance between the end of the conductive pattern 315 on the +Y side and the terminal group TG1.

[0065] The plate-shaped member 325 can contact the conductive pattern 315 of the memory card 310. For example, the width of the plate-shaped member 325 in the X direction is equal to the width of the conductive pattern 315 in the X direction. For example, the width of the plate-shaped member 325 in the Y direction is smaller than the spacing between the connection terminal group TG11 and the connection terminal group TG12 in the Y direction. For example, the width of the plate-shaped member 325 in the Y direction is equal to the width of the conductive pattern 315 in the Y direction.

[0066] Memory card 310 Figure 11A , Figure 11B As shown, the memory card 310 can be installed in the socket 320 by inserting it into the recess 20a with its surface 10a facing the socket 320. Figure 11 is a diagram showing the heat dissipation of the memory card 310 in the third variation of the embodiment. Figure 11A , Figure 11B Equivalent to cutting with the E-E line Figure 9 The subsequent cross-section. Figure 11A This shows the state before the memory card 310 was installed. Figure 11B This indicates that memory card 310 is installed.

[0067] When the memory card 310 is in operation with the socket 320 installed, the controller chip 11 generates heat. In contrast, the surface 10a of the memory card 310, when viewed from the Z direction, has a planar conductive pattern 315 overlapping the controller chip 11. Furthermore, the socket 320 has a thermally conductive plate-like member 325 at a location where it can contact the conductive pattern 315. With the memory card 310 installed in the socket 320, the conductive pattern 315 contacts the plate-like member 325. Both the conductive pattern 315 and the plate-like member 325 have a relatively wide Y-direction width, within a possible range. Therefore, the contact area between the conductive pattern 315 and the plate-like member 325 is larger than the contact area between the conductive pattern 15 and the plate-like member 25 (see reference). Figure 2B The result is, as Figure 11B As indicated by the dashed arrow, the heat generated by the controller chip 11 in the memory card 310 can be efficiently dissipated via the conductive pattern 315 and the plate-shaped component 325. That is, the heat dissipation path may have a smaller curvature and a shorter distance. This improves heat dissipation efficiency.

[0068] (Other implementation methods)

[0069] (a) In the above embodiments, integral conductive patterns 15 and 315 are illustrated, but predetermined terminal groups can be used instead. For example, in memory card 410, terminal groups for testing (TEST) are sometimes provided for pre-shipment inspection and / or post-shipment inspection. The testing terminal groups include multiple pad electrodes, each formed of a conductive material, and can therefore also be used for heat dissipation. For example, ... Figure 12 As shown, multiple pad electrodes 4151-1 to 4151-s (s is any integer greater than 2) used in product testing of memory card 410 can also be used as conductive patterns 415 for heat dissipation. Figure 12 This diagram illustrates the configuration of the memory card 410 in another embodiment. In this case, the pad electrodes 4151 used for testing can also be internally electrically connected to the controller chip 11. Therefore, the heat from the controller chip 11 can be dissipated to the outside more effectively. Figure 12 The number, location, and size of the pad electrodes in the image are just examples and are not necessarily limited to this. Figure 12 As shown.

[0070] While several embodiments of the invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents as set forth in the claims.

Claims

1. A memory system comprising: Memory card; and The socket is capable of housing the memory card. The memory card has: Memory chip; Controller chip; The housing, which houses the memory chip and the controller chip, has a first main surface and a second main surface disposed on the opposite side of the first main surface; The first terminal group includes a plurality of electrode terminals arranged along a first direction within the first main surface; The second terminal group includes a plurality of electrode terminals arranged along the first direction within the first main surface, and A planar conductive pattern is disposed between the first terminal group and the second terminal group on the first main surface, having a size larger than both the electrode terminals in the first and second terminal groups. The socket has: The first connection terminal group includes a plurality of connection terminals that can respectively contact the electrode terminals in the first terminal group; The second connection terminal group includes a plurality of connection terminals that can respectively contact the electrode terminals in the second terminal group; A thermally conductive plate-shaped component is disposed between the first connecting terminal group and the second connecting terminal group at a position corresponding to the conductive pattern. The width of the thermally conductive plate-shaped component in the first direction is equal to the width of the conductive pattern in the first direction, and the width of the thermally conductive plate-shaped component in the second direction is equal to the width of the conductive pattern in the second direction. A substrate is provided for the first connection terminal group, the second connection terminal group, and the plate-shaped component; A first wall portion is disposed on the surface of the substrate; The second wall portion is disposed on the surface of the substrate and is opposite to the first wall portion; as well as The cover is rotatably mounted on the first wall portion. With the memory card installed in the socket, The cover portion fits into the first wall portion and the second wall portion. The first terminal group is in contact with the first connection terminal group. The second terminal group is in contact with the second connection terminal group. The plate-shaped component makes surface contact with the conductive pattern. The first terminal group, the second terminal group, and the lower surface of the conductive pattern are located on the same plane. The conductive pattern overlaps with the controller chip in such a way that, when viewed from above, the center of the controller chip is included on the inside.

2. The memory system according to claim 1, The planar shape of the conductive pattern is equal to the planar shape of the plate-shaped component.

3. The memory system according to claim 1, The plate-shaped component is a heat-conducting sheet.

4. The memory system according to claim 1, The socket also has a heat dissipation structure that contacts the plate-shaped component.

5. The memory system according to claim 4, The heat dissipation structure includes a plurality of heat sinks protruding from the sides of the plate-shaped component.

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