Unit for supplying a liquid, apparatus and method for processing a substrate using the unit

Abstract

The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes: a processing container having a processing space; a support unit configured to support a substrate at the processing space; a liquid supply unit for supplying a processing liquid to the substrate supported by the support unit, and wherein the liquid supply unit includes: a nozzle member for discharging the processing liquid; and a driving member for moving the nozzle member to an in-use position and a process position, wherein the nozzle member includes: a main body having a buffer space and a discharge port configured to discharge the processing liquid therein; and a rotating member for changing the main body between a first state and a second state by rotation, and wherein the first state is a state of holding the processing liquid injected into the buffer space so as not to flow to the discharge port, and the second state is a state of discharging the processing liquid injected into the buffer space to the outside of the main body through the discharge port.

Description

Technical Field

[0001] Embodiments of the inventive concept described herein relate to a liquid supply unit and a substrate processing apparatus and method having the liquid supply unit, and more specifically, to a substrate processing apparatus and method for processing a substrate by supplying liquid, and the liquid supply unit used therein. Background Technology

[0002] In semiconductor manufacturing processes, various processes are performed, such as photolithography, etching, ashing, thin film deposition, and cleaning. A cleaning process is performed before or after each process to remove various contaminants generated during each process. Typically, in the cleaning process, contaminants remaining on the substrate are removed using chemicals (solutions) such as chemical agents or rinsing solutions.

[0003] In cleaning processes using chemicals, chemicals heated to a preset temperature or higher are used. In one embodiment, if a chemical such as phosphoric acid (P2O5) is used, it needs to be heated to 200°C or higher. The device for supplying liquid to the substrate includes resin components such as filters. Furthermore, the configuration of the liquid supply device, which may include pumps and valves, has limitations in terms of heat resistance. Therefore, if chemicals are heated in the liquid supply device and supplied to the substrate, the heated chemicals may flow inside resin components such as filters, pumps with low heat resistance, and valves located in the liquid supply device, causing damage.

[0004] Furthermore, the support units of the substrate can be heated to indirectly heat the bottom of the substrate to heat the chemicals supplied to the substrate. However, this method is indirect, where the chemicals are not discharged onto the substrate at high temperatures, but rather discharged onto the substrate and then heated, thereby reducing process performance. Additionally, this method also suffers from the problem of increased amounts of chemicals supplied to the substrate. Summary of the Invention

[0005] Embodiments of the present invention provide a liquid supply unit for efficiently supplying processing liquid to a substrate, as well as a substrate processing apparatus and a substrate processing method having the liquid supply unit.

[0006] Embodiments of the present invention provide a liquid supply unit for raising the temperature of a processing liquid to a target temperature and supplying the processing liquid to a substrate, as well as a substrate processing apparatus and a substrate processing method having the liquid supply unit.

[0007] Embodiments of the present invention provide a liquid supply unit for effectively controlling the temperature of a processed liquid, as well as a substrate processing apparatus and a substrate processing method having the liquid supply unit.

[0008] Embodiments of the present invention provide a liquid supply unit for effectively removing vapor pressure generated in a process of raising the temperature of a processing liquid to a target temperature, as well as a substrate processing apparatus and a substrate processing method having the liquid supply unit.

[0009] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0010] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing container having a processing space; a support unit configured to support a substrate in the processing space; a liquid supply unit for supplying processing liquid to the substrate supported by the support unit, wherein the liquid supply unit includes: a nozzle member for discharging the processing liquid; and a drive member for moving the nozzle member to a standby position and a process position, wherein the nozzle member includes: a body having a buffer space therein and a discharge port configured to discharge the processing liquid; and a rotating member for changing the body between a first state and a second state by rotation, wherein the first state is a state in which processing liquid is held in the buffer space so that the processing liquid does not flow to the discharge port, and the second state is a state in which the processing liquid in the buffer space is discharged to the outside of the body through the discharge port.

[0011] In one embodiment, the bottom surface of the buffer space includes a sloping portion that slopes downward toward the ground in a direction away from the discharge port.

[0012] In one embodiment, the bottom surface of the buffer space further includes a horizontal portion that extends horizontally from the top of the inclined portion about the ground.

[0013] In one embodiment, the nozzle component further includes: a heating component for heating the treatment liquid injected into the buffer space; and an exhaust component for discharging the atmosphere from the buffer space.

[0014] In one embodiment, the liquid supply unit includes: a supply pipe for supplying processed liquid to a buffer space; and a supply valve for opening and closing the supply pipe.

[0015] In one embodiment, the body is provided with a material that is more heat-resistant than the supply valve.

[0016] In one embodiment, the substrate processing apparatus further includes a controller for controlling a liquid supply unit, wherein the controller controls a rotating member to rotate the body such that the tilt of the body varies between a first state and a second state.

[0017] In one embodiment, the bottom surface of the buffer space is configured to be inclined about the ground in a first state.

[0018] In one embodiment, the bottom surface of the buffer space is configured to be inclined at a smaller angle than in the first state or parallel to the ground in the second state.

[0019] In one embodiment, the processing liquid injected into the buffer space is provided as a single discharge onto a substrate supported by a support unit.

[0020] The present invention provides a liquid supply unit for supplying a processing liquid to a substrate. The liquid supply unit includes a nozzle member for discharging the processing liquid; and a drive member for moving the nozzle member to a standby position and a process position, wherein the nozzle member includes: a body having a buffer space therein and a discharge port configured to discharge the processing liquid; and a rotating member for rotating the body between a first state and a second state, wherein the first state is a state in which the processing liquid injected into the buffer space is held so that the processing liquid does not flow out from the discharge port, and the second state is a state in which the processing liquid injected into the buffer space is discharged to the outside of the body through the discharge port.

[0021] In one embodiment, the bottom surface of the buffer space includes: an inclined portion that slopes downward toward the ground in a direction away from the discharge port; and a horizontal portion that extends horizontally from the top of the inclined portion about the ground, wherein the discharge port is located at the horizontal portion.

[0022] In one embodiment, the nozzle component further includes: a heating component configured to heat the treatment liquid injected into the buffer space; and an exhaust component for discharging the atmosphere from the buffer space.

[0023] In one embodiment, the liquid supply unit further includes a supply pipe for supplying the processed liquid to the buffer space; and a supply valve for opening and closing the supply pipe.

[0024] In one embodiment, the body is provided with a material that is more heat-resistant than the supply valve.

[0025] In one embodiment, the bottom surface of the buffer space is configured to slope toward the ground in a first state, and the bottom surface of the buffer space is configured to slope less than the slope in the first state or be parallel to the ground in a second state.

[0026] This invention provides a substrate processing method. The substrate processing method includes: supplying a processing liquid into a buffer space within a main body, keeping the processing liquid in the buffer space ready for use while the main body of the nozzle member is in a first state, changing the position of the main body to a second state, and discharging the processing liquid in the buffer space through a discharge port provided at the main body, wherein the first state is a state in which the processing liquid injected into the buffer space does not flow to the discharge port, and the second state is a state in which the processing liquid injected into the buffer space is discharged to the outside of the main body through the discharge port.

[0027] In one embodiment, the nozzle member is in a ready position before the substrate is loaded onto the support unit, and if the substrate is loaded onto the support unit, the nozzle member moves from the ready position to the process position, where the processing liquid is supplied to the buffer space.

[0028] In one embodiment, the amount of processing liquid supplied to the buffer space is the amount discharged onto the substrate in a single operation.

[0029] According to embodiments of the present invention, the processing liquid can be efficiently supplied to the substrate.

[0030] According to embodiments of the present invention, the temperature of the processing liquid can be raised to a target temperature and the processing liquid can be supplied to the substrate.

[0031] According to embodiments of the present invention, the temperature of the processed liquid can be effectively controlled.

[0032] According to embodiments of the present invention, vapor pressure generated during the process of raising the temperature of the liquid to a target temperature can be effectively removed.

[0033] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0034] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals refer to the same parts in the various drawings, and wherein:

[0035] Figure 1 An embodiment of the substrate processing apparatus of the present invention is illustrated schematically.

[0036] Figure 2 schematically shown Figure 1 The process room.

[0037] Figure 3 schematically shown Figure 2 The nozzle component.

[0038] Figure 4 This schematically illustrates the supply of processing liquid to Figure 3 The state of the buffer space.

[0039] Figure 5 The schematic diagram illustrates the processing of liquids in... Figure 3 The state of being heated in the buffer space.

[0040] Figure 6 The schematic diagram illustrates the processing of liquid from... Figure 3 The buffer space is discharged onto the substrate.

[0041] Figure 7 schematically shown Figure 2 Another embodiment of the liquid supply unit.

[0042] Figure 8 schematically shown Figure 2 Another embodiment of the liquid supply unit. Detailed Implementation

[0043] The inventive concept can be modified in various ways and can take many forms, and specific embodiments thereof will be shown and described in detail in the accompanying drawings. However, embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within the spirit and scope of the invention. Embodiments are provided to more fully explain the inventive concept to those skilled in the art. Therefore, the forms of the components in the drawings are exaggerated to emphasize a clearer description.

[0044] It should be understood that when an element or layer is referred to as "located in," "connected to," "attached to," or "covering" another element or layer, it may be directly located in, connected to, attached to, or cover the other element or layer, or there may be an intermediary element or layer. Conversely, when an element is referred to as "directly located in," "directly connected to," or "directly attached to" another element or layer, there is no intermediary element or layer. The same numbers refer to the same elements throughout the specification. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0045] Spatially related terms (e.g., "below," "under," "down," "above," "above," etc.) may be used herein for illustrative purposes, thereby describing the relationship of one element or feature to another element or feature as illustrated in the figures. It should be understood that spatially related terms are intended to cover different orientations of the device in use or operation other than those depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "under" other elements or features would be oriented "above" other elements or features. Thus, the term "below" can include both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other directions) and the spatially related descriptors used herein are interpreted accordingly.

[0046] In this embodiment, a process for liquid treatment of a substrate by supplying a liquid, such as a cleaning solution, onto the substrate will be described as an example. However, the embodiment is not limited to a cleaning process and can be applied to various processes that use liquid treatment to treat the substrate, such as etching, ashing, developing, etc.

[0047] In the following text, reference will be made to Figures 1 to 8 A detailed description of embodiments of the present invention is provided.

[0048] Figure 1 An embodiment of a substrate processing apparatus is schematically illustrated. (Reference) Figure 1 The substrate processing apparatus 1 includes a transposition module 10 and a processing module 20. According to an embodiment, the transposition module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the transposition module 10 and the processing module 20 are arranged is referred to as the first direction 2, the direction perpendicular to the first direction 2 when viewed from above is referred to as the second direction 4, and the direction perpendicular to the plane including both the first direction 2 and the second direction 4 is defined as the third direction 6.

[0049] The transposition module 10 transfers the substrate W from the container 100 in which the substrate W is stored to the processing module 20 that processes the substrate W. The transposition module 10 receives the substrate W that has already been processed at the processing module 20 and stores the substrate W in the container F. The longitudinal direction of the transposition module 10 is arranged in the second direction 4. The transposition module 10 has a loading port 110 and a transposition frame 120.

[0050] The container F of the storage substrate W is mounted on the loading port 110. The loading port 110 is located on opposite sides of the indexing frame 120. Multiple loading ports 110 can be provided, and these multiple loading ports 110 can be arranged in the direction along the second direction 4. The number of loading ports 110 can be increased or decreased depending on the processing efficiency of the processing module 20 and the available floor space.

[0051] Multiple slots (not shown) are formed at container F to store substrate W in a horizontally arranged state relative to the ground. Container F can be a sealed container, such as a front-opening integrated container (FOUP). Container F can be placed on loading port 110 by means of a conveying device (not shown), such as an overhead conveyor, overhead transporter, or automated guided vehicle, or by an operator.

[0052] An indexing track 192 and an indexing robot 194 are provided within the indexing frame 120. The indexing track 192 is configured such that its longitudinal direction runs along a second direction 4 within the indexing frame 120. The indexing robot 194 can transport substrate W. The indexing robot 194 can transport substrate W between the indexing module 10 and the buffer unit 220.

[0053] The indexing robot 194 may include an indexing hand 1940. A base plate W may be placed on the indexing hand 1940. The indexing hand 1940 may include an indexing base 1942 and a support unit 1944, the indexing base 1942 having an annular shape, wherein a portion of the circumference is symmetrically cut, and the support unit 1944 for moving the indexing base 1942. The configuration of the indexing hand 1940 is the same as or similar to that of the transfer hand described later. The indexing hand 1940 may be configured to move along an indexing track 192 in a second direction 4. Therefore, the indexing hand 1940 can move forward and backward along the indexing track 192. Furthermore, the indexing hand 1940 may be configured to be rotatable about a third direction 6 and to move along the third direction 6.

[0054] Controller 30 can control the substrate processing equipment. Controller 30 may include a process controller, which includes a microprocessor (computer) for controlling the substrate processing equipment, a user interface such as a keyboard through which an operator inputs commands to manage the substrate processing equipment, a display showing the operation of the substrate processing equipment, and a storage unit for storing processing plans (i.e., control programs for executing the processing technology of the substrate processing equipment by controlling the process controller, or programs for executing components of the substrate processing equipment based on data and processing conditions). Furthermore, the user interface and storage unit may be connected to the process controller. The processing plans may be stored in a storage medium in the storage unit, which may be a hard disk, a portable hard disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0055] The controller 30 can control the substrate processing equipment 1, thereby enabling it to perform the substrate processing methods explained below. For example, the controller 30 can control components provided to the process chamber 260, thereby enabling it to perform the substrate processing methods explained below.

[0056] Processing module 20 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The buffer unit 220 provides space in which substrates W placed into and removed from processing module 20 are temporarily held. The transfer chamber 240 provides space between the buffer unit 220 and the process chamber 260, and between the process chambers 260, for transferring substrates W. The process chamber 260 performs a liquid processing process on substrate W by supplying liquid to it. For example, the liquid processing process can be a cleaning process of cleaning the substrate with a cleaning solution. Chemical treatment, rinsing treatment, and drying treatment can all be performed on the substrate within the process chamber. Optionally, the process chamber for drying the substrate can be separate from the process chamber for performing liquid treatment.

[0057] A buffer unit 220 may be disposed between the indexing frame 120 and the transfer chamber 240. The buffer unit 220 may be disposed at one end of the transfer chamber 240. A slot (not shown) on which the substrate W rests is disposed within the buffer unit 220. Multiple slots (not shown) are spaced apart from each other along a third direction 6. The front and back of the buffer unit 220 are open. The front is the surface facing the indexing module 10, and the back is the surface facing the transfer chamber 240. The indexing robot 194 can access the buffer unit 220 through the front, while the transfer robot 244 can access the buffer unit 220 through the back, as will be described later.

[0058] The longitudinal direction of the transfer chamber 240 can be arranged in the first direction 2. Each process chamber 260 can be arranged on both sides of the transfer chamber 240. The process chamber 260 can be arranged on one side of the transfer chamber 240. The process chambers 260 and the transfer chamber 240 can be arranged along the second direction 4. According to an embodiment, the process chambers 260 can be arranged on both sides of the transfer chamber 240, and the process chambers 260 can be arranged in an AXB (A and B are natural numbers greater than 1 or 1) arrangement along the first direction 2 and the third direction 6, respectively. Here, A is the number of process chambers 260 arranged in a row along the first direction 2, and B is the number of process chambers 260 arranged in a row along the third direction 6. When four or six process chambers 260 are arranged on one side of the transfer chamber 240, the process chambers 260 can be arranged in a 2×2 or 3×2 arrangement. The number of process chambers 260 can be increased or decreased. Unlike the above, the process chambers 260 can be arranged only on one side of the transfer chamber 240. In addition, the process chamber 260 can be set as a single layer on one side and both sides of the transfer chamber 240.

[0059] The transfer chamber 240 includes a guide rail 242 and a transfer robot 244. The guide rail 242 is configured such that its longitudinal direction runs along a first direction 2 within the transfer chamber 240. The transfer robot 244 can be configured to move linearly along the first direction 2 on the guide rail 242. The transfer robot 244 transfers substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260.

[0060] The transfer robot 2440 includes a base 2442, a body 2444, and arms 2446. The base 2442 is mounted for movement along a guide rail 242 in a first direction 2. The body 2444 is coupled to the base 2442. The body 2444 is configured to move along a third direction 6 on the base 2442. Additionally, the body 2444 is configured to rotate on the base 2442. Arms 2446 are coupled to the body 2444, which is configured to move forward and backward about the body 2444. Multiple arms 2446 are configured to be individually actuated. The arms 2446 are stacked on top of each other and spaced apart along the third direction 6.

[0061] Process chamber 260 performs liquid processing on substrate W. For example, process chamber 260 may be a chamber that performs a cleaning process by supplying a cleaning solution to substrate W. In contrast, process chamber 260 may be a chamber that performs a wet etching process by supplying liquid plasma to remove a thin film from the substrate. Depending on the type of process used to process substrate W, process chamber 260 may have different structures. Alternatively, each process chamber 260 may have the same structure. Selectively, process chambers 260 may be divided into multiple groups, with process chambers 260 belonging to one group performing either a cleaning process or a wet etching process, while process chambers 260 belonging to another group may perform the other of a cleaning process or a wet etching process.

[0062] In the following embodiments of the present invention, a liquid processing process for processing substrate W by supplying liquid from process chamber 260 to substrate W will be described as an example.

[0063] Figure 2 schematically shown Figure 1 An example of a process chamber. See [reference]. Figure 2 The process chamber 260 includes an outer shell 2610, a processing container 2620, a support unit 2630, and a liquid supply unit 3000.

[0064] The housing 2610 has a space therein. The housing 2610 is generally in the form of a cuboid. The processing container 2620, the support unit 2630, and the liquid supply unit 3000 are disposed within the housing 2610.

[0065] The processing container 2620 has a processing space with a top opening. The substrate W is processed with liquid within the processing space. A support unit 2630 supports the substrate W and rotates it within the processing space. A liquid supply unit 3000 supplies liquid to the substrate W supported by the support unit 2630. The liquid can be of various types and can be supplied to the substrate W sequentially.

[0066] According to one embodiment, the processing container 2620 has a guide wall 2621 and a plurality of recovery containers 2623, 2625, and 2627. Each of the recovery containers 2623, 2625, and 2627 separates and recovers a different liquid from the liquid used for substrate processing. Each recovery container 2623, 2625, and 2627 has a recovery space for recovering the liquid used for substrate processing. The guide wall 2621 and each recovery container 2623, 2625, and 2627 are arranged in an annular form around the support unit 2630. During the liquid processing process, the liquid dispersed by the rotation of the substrate W is introduced into the recovery spaces of the recovery containers 2623, 2625, and 2627 through inlets 2623a, 2625a, and 2627a, respectively, as described later. Different types of processing liquids can flow into each recovery container.

[0067] According to one embodiment, the processing container 2620 has a guide wall 2621, a first recycling container 2623, a second recycling container 2625, and a third recycling container 2627. The guide wall 2621 is arranged in an annular shape around the support unit 2630, and the first recycling container 2623 is arranged in an annular shape around the guide wall 2621. The second recycling container 2625 is arranged in an annular shape around the first recycling container 2623, and the third recycling container 2627 is arranged in an annular shape around the second recycling container 2625. The space between the first recycling container 2623 and the guide wall 2621 serves as a first inlet 2623a for introducing liquid. The space between the first recycling container 2623 and the second recycling container 2625 serves as a second inlet 2625a for introducing liquid. The space between the second recycling container 2625 and the third recycling container 2627 serves as a third inlet 2627a for introducing liquid. The second entrance 2625a is located above the first entrance 2623a, and the third entrance 2627a may be located above the second entrance 2625a.

[0068] The space between the bottom end of the guide wall 2621 and the first recovery container 2623 serves as a first outlet 2623b, through which fumes and gaseous gases generated from the liquid are discharged. The space between the bottom end of the first recovery container 2623 and the second recovery container 2625 serves as a second outlet 2625b, through which fumes and gaseous gases generated from the liquid are discharged. The space between the bottom end of the second recovery container 2625 and the third recovery container 2627 serves as a third outlet 2627b, through which fumes and gaseous gases generated from the liquid are discharged. The fumes and gaseous gases discharged from the first outlet 2623b, the second outlet 2625b, and the third outlet 2627b are discharged through an exhaust unit 2650, described later.

[0069] The support unit 2630 includes a rotary chuck 2631, a support pin 2633, a chuck pin 2635, a rotation shaft 2637, and a first driver 2639. The rotary chuck 2631 has a top surface, which is generally circular when viewed from above. The diameter of the top surface of the rotary chuck 2631 may be larger than the diameter of the substrate W.

[0070] Multiple support pins 2633 may be provided. The support pins 2633 are disposed on the edge portion of the top surface of the rotary chuck 2631, spaced apart from each other at predetermined intervals, and protrude upward from the rotary chuck 2631. The support pins 2633 support the edge of the rear surface of the substrate W, such that the substrate W is spaced apart from the top surface of the rotary chuck 2631 by a predetermined distance.

[0071] Multiple chuck pins 2635 can be provided. The chuck pins 2635 are positioned further away from the center of the rotary chuck 2631 than the support pins 2633. The chuck pins 2635 protrude from the top surface of the rotary chuck 2631. The chuck pins 2635 support the side portion of the substrate W, preventing lateral displacement or wobbling of the substrate W when it rotates. The chuck pins 2635 are movable between a ready position and a supported position along the radial direction of the rotary chuck 2631. The ready position is the position further away from the center of the rotary chuck 2631 compared to the supported position. When the substrate W is loaded or unloaded on the support unit 2630, the chuck pins 2635 are in the ready position; when a process is performed on the substrate W, the chuck pins 2635 are in the supported position to support the substrate W and prevent lateral displacement or wobbling of the substrate W. In the supported position, the chuck pins 2635 are in contact with the side of the substrate W.

[0072] A rotating shaft 2637 is coupled to a rotating chuck 2631. The rotating shaft 2637 can be coupled to the bottom surface of the rotating chuck 2631. The rotating shaft 2637 is configured to rotate by receiving power from a first driver 2639. The first driver 2639 rotates the rotating shaft 2637, thereby rotating the rotating chuck 2631. The first driver 2639 can change the rotational speed of the rotating shaft 2637. The first driver 2639 can be a motor providing the driving force. However, the inventive concept is not limited thereto, and various modifications can be made to known devices for providing driving force.

[0073] Exhaust line 2650 discharges fumes and gases generated in the processing space. Exhaust line 2650 discharges fumes and gases generated during liquid processing of substrate W. Exhaust line 2650 may be connected to the bottom surface of processing container 2620. In one embodiment, exhaust line 2650 may be positioned between the rotation axis 2637 of support unit 2630 and the inner wall of processing container 2620. Pressure reducing unit (not shown) is provided at exhaust line 2650. Fumes and gases generated during liquid processing of substrate W are discharged from the processing space to the outside of the processing space through pressure reducing unit.

[0074] Airflow supply unit 2660 supplies airflow to the interior space of housing 2610. Airflow supply unit 2660 can supply downward airflow to the interior space. Airflow supply unit 2660 can be installed at housing 2610. Airflow supply unit 2660 can be installed above processing container 2620 and support unit 2630. The gas supplied to the interior space of housing 2610 through airflow supply unit 2660 forms a downward airflow within the interior space. Gas byproducts generated by the processing within the processing space are discharged to the outside of housing 2610 by the downward airflow through exhaust line 2650. Airflow supply unit 2660 can be configured as a fan filter unit.

[0075] Liquid supply unit 3000 supplies liquid to substrate W supported by support unit 2630. Multiple liquid supply units 3000 may be provided. Each of the multiple liquid supply units 3000 can supply a different type of liquid to substrate W. According to an embodiment, each of the liquid supply units 3000 can supply a first processing liquid and a second processing liquid, respectively. In one embodiment, the first processing liquid and the second processing liquid can be any of chemicals, rinsing solutions, and organic solvents. For example, chemicals may include dilute sulfuric acid peroxide (H2SO4), phosphoric acid (P2O5), hydrofluoric acid (HF), and ammonium hydroxide (NH4OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropanol (IPA). Hereinafter, the case where the liquid supply unit 3000 supplies phosphoric acid to substrate W will be described as an example. Hereinafter, the phosphoric acid supplied to substrate W will be referred to as the processing liquid.

[0076] Figure 3 schematically shown Figure 2 The nozzle component. (Refer to...) Figure 2 and Figure 3 The liquid supply unit 3000 may include a nozzle component 3001, a drive component 3002, and a supply component (not shown). The nozzle component 3001 discharges the processed liquid onto the substrate W. The nozzle component 3001 discharges the processed liquid toward the top surface of the substrate W supported by the support unit 2630. The nozzle component 3001 may include a body 3100, a connecting pipe 3140, a heating component 3180, an exhaust component 3190, and a rotating component 3200.

[0077] The body 3100 may have a buffer space B therein. The body 3100 may be made of a heat-resistant material. Furthermore, the body 3100 may be made of a material with stronger heat resistance than the filter 3900 described later. In one embodiment, the body 3100 may be made of a material including quartz. Processing fluid supplied from the connecting pipe 3140 described later may be stored in the buffer space B. The processing fluid stored in the buffer space B may be heated to a set temperature by the heating member 3180 described later. The buffer space B may include a first side surface 3121, a bottom surface 3122, a second side surface 3123, and a top surface 3124.

[0078] The first side surface 3121 forming the buffer space B can be formed in a direction perpendicular to the ground. The connecting pipe 3140 can be connected to the first side surface 3121. The side wall of the body 3100 facing the first side wall 3121 can be connected to the support arm 3300, which will be described later.

[0079] The bottom surface 3122 forming the buffer space B can contact the first side surface 3121. The bottom surface 3122 can contact the second side surface 3123. The bottom surface 3122 can be formed to be generally inclined when viewed from the front. The bottom surface 3122 can include an inclined portion 3122a and a horizontal portion 3122b. One end of the inclined portion 312a can contact the first side surface 3121. The other end of the inclined portion 3122a can contact the horizontal portion 3122b. When viewed from the front, the inclined portion 3122a can be inclined upward about the ground in a direction away from the first side surface 3121. The horizontal portion 3122b can be formed horizontally about the ground. One end of the horizontal portion 3122b can contact the inclined portion 3122a. The horizontal portion 3122b can extend from the top of the inclined portion 3122a in a horizontal direction about the ground. The discharge port 3160, which will be described later, can be formed at the horizontal portion 3122b.

[0080] The second side surface 3123 forming the buffer space B can be formed in a direction perpendicular to the ground. One end of the second side surface 3123 can contact the discharge port 3160. The other end of the second side surface 3123 can contact the top surface 3124.

[0081] The top surface 3124 forming the buffer space B can be formed in a direction horizontal to the ground. One end of the top surface 3124 can contact the second side surface 3123. The other end of the top surface 3124 can contact the first side surface 3121. The exhaust member 3190, which will be described later, can be connected to the top surface 3124.

[0082] A connecting pipe 3140 can be connected to a first side surface 3121 forming the buffer space B. The connecting pipe 3140 can communicate with a supply member (not shown) through which the processed liquid flows, as described later. Therefore, the connecting pipe 3140 can supply the processed liquid to the buffer space B. The connecting pipe 3140 can be configured as a resilient pipe. In one embodiment, the connecting pipe 3140 can be configured as a flexible pipe. Alternatively, the connecting pipe 3140 can be configured as a coil. When the body 3100 is rotated by the rotating member 3200, as described later, the connecting pipe 3140 can be stretched and / or compressed according to changes in the position of the body 3100. In the above embodiment of the invention, the connection of the connecting pipe 3140 to the first side surface 3121 is described by way of example, but the inventive concept is not limited thereto. The connecting pipe 3140 can be connected to various locations capable of supplying the processed liquid to the buffer space B.

[0083] The discharge port 3160 discharges the processing liquid in the injection buffer space B onto the substrate W supported on the support unit 2630. The discharge port 3160 is formed below the body 3100. In one embodiment, the discharge port 3160 may be formed as an opening. For example, the discharge port 3160 may be formed as an opening penetrating the bottom portion of the body 3100. The discharge port 3160 may be formed as penetrating the bottom portion of the body 3100 at the horizontal portion 3122b of the bottom surface 3122 to form the buffer space B. Unlike the above example, the discharge port 3160 may be formed as an opening penetrating the bottom of the body 3100, and may further be provided with a spraying member communicating with the opening. The processing liquid in the injection buffer space B can be discharged onto the substrate from the spraying member communicating with the opening.

[0084] Heating member 3180 heats the processing liquid injected into buffer space B. Heating member 3180 raises the temperature of the processing liquid injected into buffer space B to a set temperature. Heating member 3180 heats body 3100, thereby heating the processing liquid supplied in buffer space B. For example, if the processing liquid supplied to buffer space B is phosphoric acid, heating member 3180 can heat the processing liquid to 200°C or higher. Heating member 3180 can be mounted on body 3100. In one embodiment, heating member 3180 can be mounted on the bottom wall of body 3100 facing the bottom surface 3122 forming buffer space B. For example, heating member 3180 can be embedded in the bottom wall of body 3100 facing inclined portion 3122a. Heating member 3180 can be configured as a heater. The heater can be configured as a heating resistor to which current is applied. However, the inventive concept is not limited thereto, and heating member 3180 can be configured as a heater having a heating pattern surrounding the outer surface of body 3100. In an embodiment, the heating element 3180 may be installed at each location on the outer surface of the body 3100 to heat the body 3100.

[0085] Exhaust component 3190 vents the atmosphere from buffer space B. Exhaust component 3190 can vent high-temperature steam generated during the heating of the processing liquid injected into buffer space B. Exhaust component 3190 can be mounted above body 3100. Exhaust component 3190 may include exhaust pipe 3192 and pressure reducing pump 3194. Exhaust pipe 3192 provides a path for the high-temperature steam to flow through. One end of exhaust pipe 3192 can be connected to the top portion of body 3100. One end of exhaust pipe 3192 can be connected to the top surface 3124 forming buffer space B. The other end of exhaust pipe 3192 can be connected to the top wall of housing 2610. Therefore, the high-temperature steam flowing through exhaust pipe 3192 can be discharged to the outside of housing 2610. However, the inventive concept is not limited thereto, and the other end of exhaust pipe 3192 can be connected to exhaust line 2650 and can also discharge fumes generated in the processing space. Pressure reducing pump 3194 can provide negative pressure to the interior of exhaust pipe 3192. The pressure reducing pump 3194 can be modified in various ways and configured as a known device to provide negative pressure.

[0086] The rotating member 3200 can change the position of the main body 3100. The rotating member 3200 can change the tilt angle of the main body 3100. The rotating member 3200 can rotate the main body 3100. The rotating member 3200 can be mounted at the end of the support arm 3300, which will be described later. The rotating member 3200 can be connected to the main body 3100. The rotating member 3200 can be connected to the side wall of the main body 3100. For example, the rotating member 3200 can be connected to the bottom end of the side wall of the main body 3100 facing the first side surface 3121. When viewed from the front, the rotating member 3200 can rotate the main body 3100 about a dotted line passing through the support arm 3300 as its central axis. The rotating member 3200 can be configured as a motor. The rotating member 3200 can be modified in various ways using a known motor that provides the driving force.

[0087] In the above-described embodiments of the present invention, the rotating member 3200 is configured as a motor to rotate the main body 3100, but the inventive concept is not limited thereto. The rotating member 3200 may include a motor and a shaft. The motor may be mounted on the bottom surface of the housing 2610. Both ends of the shaft may be connected to the inner circumferential surfaces of bearings. One end of the shaft may be connected to the motor, and the other end of the shaft may be connected to a bearing housing, which is connected to the side wall of the main body 3100. Therefore, the rotating member 3200 can be rotated by driving the motor.

[0088] The rotating member 3200 can rotate the main body 3100 between a first state and a second state. The first state is a state where the treatment liquid injected into the buffer space B does not flow to the discharge port 3160. In the first state, the bottom surface 3122 forming the buffer space B can be inclined relative to the ground. In one embodiment, in the first state, the inclined portion 3122a can be inclined relative to the ground. In the second state, the treatment liquid injected into the buffer space B is discharged to the outside of the main body 3100 through the discharge port 3160. In the second state, the bottom surface 3122 forming the buffer space B can be configured to be smoother than the inclination of the bottom surface 3122 in the first state. In the second state, the inclination of the inclined portion 3122a can be smoother than the inclination of the inclined portion 3122a in the first state. Optionally, in the second state, the bottom surface 3122 can be configured to be parallel to the ground. In the second state, the inclined portion 3122a can be configured to be parallel to the ground.

[0089] The drive member 3002 can move the nozzle member 3001 to a process position and a standby position. The process position can be the position where the nozzle member 3001 faces the substrate W supported by the support unit 2630. The standby position can be the position where the nozzle member 3001 is away from the process position. The drive member 3002 may include a support arm 3300, a support shaft 3400, and an arm driver 3500.

[0090] A support arm 3300 is connected to the top end of a support shaft 3400. The support arm 3300 extends vertically from the support shaft 3400. A nozzle member 3001 can be coupled to the support arm 3300. For example, a rotating member support arm 3200 can be connected to the end of the support arm 3300. The support arm 3300 can support the body 3100 via the rotating member 3200. The support arm 3300 can be configured to move forward and backward in its longitudinal direction. When viewed from above, the nozzle member 3001 can swing to align with the central axis of the substrate W.

[0091] Support shaft 3400 is located on one side of processing container 2620. Support shaft 3400 is rod-shaped, with its longitudinal direction facing the third direction 6. Support shaft 3400 can be rotated by arm actuator 3500. As support shaft 3400 rotates, nozzle member 3001 can swing together with support arm 3300. Nozzle member 3100 can swing to move between a process position and a standby position.

[0092] A supply component (not shown) supplies the processing liquid to the nozzle component 3001. The supply component (not shown) may be a pipe. The supply component (not shown) may be connected to the connecting pipe 3140. A supply part (not shown) allows the processing liquid to flow to the connecting pipe 3140. The supply part (not shown) is located inside the support arm 3300.

[0093] The substrate processing method according to an embodiment of the present invention will be described in detail below. The substrate processing method described below can be performed by the process chamber 260 described above. Furthermore, the controller 30 can control the components of the process chamber 260 so that the process chamber 260 can perform the substrate processing method described below. For example, the controller 30 can generate a control signal for controlling the liquid supply unit 3000, so that the components of the process chamber 260 can perform the substrate processing method described below.

[0094] Figure 4 This schematically illustrates the supply of processing liquid to Figure 3 The state of the buffer space. (Refer to...) Figure 4 Before the substrate W is mounted on the support unit 2630, the nozzle member 3001 is in a standby position. The standby position can be a position where it does not face the support unit 2630 when viewed from above. When the nozzle member 3001 is in the standby position, the supply member (not shown) supplies processing liquid into the buffer space B.

[0095] If the nozzle component 3001 is in the standby position, the main body 3100 can be in a first state. The first state is a state in which the treatment liquid injected into the buffer space B does not flow towards the discharge port 3160. In the first state, the bottom surface 3122 forming the buffer space B can be inclined relative to the ground. For example, in the first state, the inclined portion 3122a can be inclined relative to the ground. Therefore, even if the treatment liquid is supplied to the buffer space B of the main body 3100 in the first state, the treatment liquid will not flow through the discharge port 3160 due to the inclination formed by the inclined portion 3122a.

[0096] The processing liquid supplied to buffer space B can be supplied to point A, which is the limit level at which the processing liquid does not flow through discharge port 3160. The amount of processing liquid supplied to point A can correspond to the single discharge amount on substrate W when substrate W is later loaded onto support unit 2630.

[0097] Figure 5 The schematic diagram illustrates the processing of liquids in... Figure 3 The buffer space is heated. (Reference) Figure 5The processing liquid supplied to buffer space B is heated to a set temperature. The processing liquid supplied to buffer space B is heated to the set temperature by heating element 3180. Nozzle element 3001 is in a standby position until the processing liquid supplied to buffer space B is heated to the set temperature. For example, if the processing liquid supplied to buffer space B is phosphoric acid, heating element 3180 can heat body 3100 until the temperature of phosphoric acid reaches 200°C or higher. High-temperature steam generated during the process of heating the processing liquid in buffer space B is discharged through exhaust element 319 connected to the top portion of body 3100. Therefore, damage to nozzle element 3001 due to high-temperature steam pressure during heating can be prevented.

[0098] Figure 6 It schematically shows that in Figure 3 The buffer space is where the processing liquid is discharged onto the substrate. (Refer to...) Figure 6 The substrate W is mounted on the support unit 2830, and the nozzle member 3001 moves from a standby position to a process position. If the substrate W is mounted on the support unit 2830, the nozzle member 3001 is rotated by the drive member 3002 to move to a process position facing the substrate W supported on the support unit 2630. Before the nozzle member 3001 moves from the standby position to the process position, the processing liquid in the injection buffer space B can be heated to a set temperature. However, the inventive concept is not limited to this; the processing liquid in the injection buffer space B can be heated to a set temperature after the nozzle member 3001 moves to the process position and before the processing liquid is discharged onto the substrate W.

[0099] The nozzle member 3001, having moved to the process position, stops at the process position facing the substrate W. If the nozzle member 3001 stops, the main body 3100 changes to a second state by rotating the rotation member 3200. In the second state, the processing liquid injected into the buffer space B is discharged to the outside of the main body 3100 through the discharge port 3160. In the second state, the bottom surface 3122 forming the buffer space B can be configured to be smoother than the slope of the bottom surface 3122 in the first state. In the second state, the slope of the inclined portion 3122a can be smoother than the slope of the inclined portion 3122a in the first state. Optionally, in the second state, the bottom surface 3122 can be configured to be parallel to the ground. In the second state, the inclined portion 3122a can be configured to be parallel to the ground. Therefore, the processing liquid heated to a set temperature can be discharged from the heat-resistant buffer space B onto the substrate W rotating on the support unit 2630.

[0100] According to the embodiments described above based on the present invention, by heating the treatment liquid in a buffer space B with strong heat resistance, damage to components with weak heat resistance disposed in the liquid supply device can be minimized. Furthermore, since the high-temperature vapor pressure generated during the process of heating the treatment liquid in the buffer space B can be effectively discharged, damage to components due to high-temperature vapor pressure can be minimized. Additionally, by directly discharging the treatment liquid heated to a set temperature from the buffer space B onto the substrate W, the substrate W can be effectively processed.

[0101] In addition to the liquid supply unit and rotating member according to the above embodiments, a liquid supply unit according to another embodiment described below is similarly provided. Therefore, the description of the overlapping configuration will be omitted below.

[0102] Figure 7 It is a schematic representation Figure 2 A diagram of another embodiment of the liquid supply unit. (Refer to...) Figure 7 A rotating member 3200 can be mounted on the top of the support shaft 3400. The rotating member 3200 can be mounted on the top of the support shaft 3400 to provide rotational force to the support arm 3300. The rotating member 3200 can be configured as a known motor providing the rotational force. The rotating member 3200 can rotate the support arm 3300 in the up / down direction. A nozzle member 3001 can be fixedly mounted on one end of the support arm 3300. The rotating member 3200 causes the support arm 3300 to rotate, and the nozzle member 3001, fixedly mounted on the support arm 3300, can rotate in the up / down direction by the rotation of the support arm 3300. Therefore, the position of the body 3100 can change between a first state and a second state.

[0103] Figure 8 It is a schematic representation Figure 2 A diagram of another embodiment of the liquid supply unit. (Refer to...) Figure 8 The rotating member 3200 may include a first rotating member 3220 and a second rotating member 3240. The first rotating member 3220 may be mounted on the top end of the support shaft 3400. The first rotating member 3220 may be mounted on the top end of the support shaft 3400 to provide rotational force to the support arm 3300. The first rotating member 3220 may be configured as a known motor providing the rotational force. The first rotating member 3220 may cause the support arm 3300 to rotate from bottom to top in a first direction.

[0104] The second rotating member 3240 can be mounted on one end of the support arm 2642. The second rotating member 3240 can be connected to the main body 3100. The second rotating member 3240 can be connected to the side wall of the main body 3100. For example, the second rotating member 3240 can be connected to the bottom end of the side wall of the main body 3100 facing the first side surface 3121. When viewed from the front, the second rotating member 3240 can rotate the main body 3100 about a dotted line passing through it as a central axis. The rotating member 3240 can be configured as a motor. The rotating member 3240 can be modified in various ways using a known motor that provides the driving force. The second rotating member 3240 can rotate the main body 3100 from top to bottom in a second direction.

[0105] If the processing liquid in the injection buffer space B is discharged onto the substrate W, the second rotating member 3240 can rotate the main body 3100 in the second direction to discharge the heated processing liquid onto the substrate W through the discharge port 3160. If the second rotating member 3240 rotates in the second direction, the first rotating member 3220 can rotate in the first direction to correct the position of the processing liquid discharged on the substrate W, so that the processing liquid accurately impacts the preset discharge point on the substrate W.

[0106] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand any effects not mentioned from the specification and drawings.

[0107] Although preferred embodiments of the inventive concept have been described and illustrated so far, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to whom the inventive concept relates can implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and these modifications should not be interpreted separately from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, comprising: A processing container that has processing space; A support unit configured to support a substrate at the processing space; as well as A liquid supply unit for supplying processing liquid to a substrate supported by the support unit, and The liquid supply unit includes: Nozzle component for discharging the treated liquid; and A drive component for moving the nozzle component to a standby position and a process position, and The nozzle component includes: A main body having a buffer space within it, and the main body having a discharge port configured to discharge the processed liquid; and A rotating component, used to change the body between a first state and a second state by rotation, and The first state refers to maintaining the treated liquid injected into the buffer space to prevent the treated liquid from flowing towards the discharge port. The second state is the state in which the treatment liquid injected into the buffer space is discharged to the outside of the main body through the discharge port, and The nozzle component further includes: Heating element for heating the processing liquid injected into the buffer space; and An exhaust component for discharging the atmosphere from the buffer space.

2. The substrate processing apparatus according to claim 1, wherein, The bottom surface of the buffer space includes a sloping portion that slopes downward toward the ground in a direction away from the discharge port.

3. The substrate processing apparatus according to claim 2, wherein, The bottom surface of the buffer space also includes a horizontal portion that extends horizontally from the top of the inclined portion about the ground.

4. The substrate processing apparatus according to claim 1, wherein, The liquid supply unit includes: A supply pipe for supplying the processed liquid to the buffer space; and A supply valve, used to open and close the supply pipe.

5. The substrate processing apparatus according to claim 4, wherein, The main body is provided with a material that has stronger heat resistance than the supply valve.

6. The substrate processing apparatus according to claim 2 or 3, further comprising a controller for controlling the liquid supply unit, and in, The controller controls the rotating component to rotate the main body, causing the tilt of the main body to change between the first state and the second state.

7. The substrate processing apparatus according to claim 6, wherein, The bottom surface of the buffer space is configured to be inclined about the ground in the first state.

8. The substrate processing apparatus according to claim 7, wherein, The bottom surface of the buffer space is configured to be inclined at a smaller angle than in the first state or parallel to the ground in the second state.

9. The substrate processing apparatus as described in claim 8, wherein, The processing liquid injected into the buffer space is provided as a single discharge onto the substrate supported by the support unit.

10. A liquid supply unit for supplying processing liquid to a substrate, comprising: A nozzle component for discharging the treated liquid; as well as A drive component for moving the nozzle component to a standby position and a process position, and The nozzle component includes: A main body having a buffer space within it, and the main body having a discharge port configured to discharge the processed liquid; and A rotating component, used to change the body between a first state and a second state by rotation, and The first state refers to maintaining the treated liquid injected into the buffer space to prevent the treated liquid from flowing out of the discharge port. The second state is the state in which the treatment liquid injected into the buffer space is discharged to the outside of the main body through the discharge port, and The nozzle component further includes: Heating element for heating the processing liquid injected into the buffer space; and An exhaust component for discharging the atmosphere from the buffer space.

11. The liquid supply unit according to claim 10, wherein, The bottom surface of the buffer space includes: The inclined portion, which slopes downward toward the ground in a direction away from the discharge port; and The horizontal portion extends horizontally from the top of the inclined portion about the ground, and The discharge port is located at the horizontal portion.

12. The liquid supply unit according to claim 10, wherein, The liquid supply unit also includes: A supply pipe for supplying the processed liquid to the buffer space; and A supply valve, used to open and close the supply pipe.

13. The liquid supply unit according to claim 12, wherein, The main body is provided with a material that has stronger heat resistance than the supply valve.

14. The liquid supply unit according to claim 11, wherein, The bottom surface of the buffer space is configured to slope toward the ground in the first state, and the bottom surface of the buffer space is configured to slope less than the slope in the first state or be parallel to the ground in the second state.

15. A substrate processing method, comprising: The processing liquid is supplied to the buffer space within the main body, and while the main body of the nozzle component is in a first state, the processing liquid in the buffer space is made ready for use. The position of the main body is then changed to a second state, and the processing liquid in the buffer space is discharged through a discharge port located on the main body. The first state refers to maintaining the treated liquid injected into the buffer space to prevent the treated liquid from flowing towards the discharge port. The second state is the state in which the treatment liquid injected into the buffer space is discharged to the outside of the main body through the discharge port, and The substrate processing method further includes: heating the processing liquid injected into the buffer space in the first state.

16. The substrate processing method according to claim 15, wherein, Before the substrate is loaded onto the support unit, the nozzle member is in a standby position, and if the substrate is loaded onto the support unit, the nozzle member moves from the standby position to the process position, where the processing liquid is supplied to the buffer space.

17. The substrate processing method according to claim 15 or 16, wherein, The amount of the processing liquid supplied to the buffer space is the amount discharged onto the substrate in a single operation.

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