Novel limiting type silicon wafer bearing device

Abstract

This invention relates to the field of photovoltaic power generation, specifically disclosing a novel limiting silicon wafer support device, comprising a support frame and a carrier plate; the support frame is composed of a horizontal beam and a vertical beam; one side of the carrier plate along its length and / or width direction is locked to the horizontal beam and / or the vertical beam by a locking mechanism, while the opposite side is mounted on the horizontal beam and / or the vertical beam by a flexible mounting mechanism; the flexible mounting mechanism includes a first connector and an elastic element; one end of the first connector is connected to the carrier plate, and the other end of the first connector is provided with an elastic element; the first connector extends into the mounting cavity in the horizontal beam and / or the vertical beam, and the elastic force of the elastic element causes the first connector to pull the carrier plate taut in a direction away from the locking mechanism. This novel limiting silicon wafer support device can prevent the carrier plate from becoming taut during expansion and deformation, ensuring that the flatness of the carrier plate meets the requirements.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic power generation, and specifically to a novel limiting silicon wafer support device. Background Technology

[0002] Heterojunction solar cells require cleaning and texturing, chemical vapor deposition (CVD), physical vapor deposition (PVD), and screen printing. PVD, the latter, deposits a transparent conductive film on the silicon wafer surface, forming good ohmic contact, reducing carrier recombination efficiency, and passivating the surface. Magnetron sputtering is typically used for film deposition. Ions generated by an ion source are accelerated and focused in a high vacuum to form a high-speed ion beam that bombards the target surface. The ions exchange kinetic energy with the atoms on the solid surface, causing the atoms on the target surface to leave the target and deposit on the silicon wafer to form a thin film. The silicon wafer is placed in a vacuum chamber via a support device for film deposition. During the deposition process, the high temperature can cause the support device to expand and deform, altering its flatness and affecting the deposition effect on the silicon wafer.

[0003] To this end, Chinese invention patent CN 215266219U discloses a “limiting silicon wafer carrier device”, which includes a carrier frame and a carrier plate. The carrier plate is provided with a storage slot for storing silicon wafers and is disposed on the carrier frame. The carrier plate is fixedly connected to the carrier frame through a detachable connection structure. The carrier plate is provided with mounting holes for the detachable connection structure to pass through. The mounting holes form a telescopic gap with the detachable connection structure in the longitudinal or transverse direction. After the carrier plate expands due to heat, it expands and contracts through the telescopic gap, thereby limiting the unidirectional deformation of the carrier plate. This controls the positional accuracy of the carrier plate before and after thermal expansion, thereby improving the positional accuracy of the silicon wafer and improving the processing accuracy of the silicon wafer.

[0004] However, the aforementioned limiting silicon wafer carrier device provides a gap for expansion and contraction of the carrier plate through an elongated oval mounting hole. The detachable structure is a connecting screw, which is installed on the mounting hole to limit the carrier plate in a direction perpendicular to its plane. When the carrier plate expands and deforms, the movable side of the carrier plate can move (the direction of movement is consistent with the extension direction of the mounting hole) to adapt to the expansion and deformation, thereby ensuring the flatness of the carrier plate. However, the above solution still has the following problems: during the process of thermal expansion and deformation of the carrier plate, the expansion force of the carrier plate must first overcome the horizontal resistance brought by the vertical clamping force of the connecting screw before it can expand and stretch. That is, the expansion of the carrier plate in the horizontal direction is not completely free, which can easily lead to local tension during the expansion process, causing some parts of the carrier plate to arch and deform, thereby affecting the flatness of the carrier plate and thus affecting the processing quality of the silicon wafer. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a novel limiting silicon wafer carrier device. The carrier plate of the novel limiting silicon wafer carrier device can extend freely during the thermal expansion process, avoiding tension and local deformation, and ensuring that the carrier plate has high-precision flatness during processing.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is:

[0007] A novel limiting silicon wafer support device includes a support frame and a carrier plate disposed on the support frame. The support frame is a frame structure composed of horizontal beams and vertical beams. One side of the carrier plate along its length and / or width direction is locked to the horizontal beam and / or the vertical beam by a locking mechanism, while the opposite side is mounted on the horizontal beam and / or the vertical beam by a flexible mounting mechanism. Multiple sets of locking mechanisms and flexible mounting mechanisms are provided, and they correspond one-to-one. The flexible mounting mechanism includes a first connector and an elastic element. One end of the first connector is connected to the carrier plate, and the other end of the first connector is provided with the elastic element. The horizontal beam and / or the vertical beam has a mounting cavity corresponding to the flexible mounting mechanism. The first connector extends into the mounting cavity. One end of the elastic element acts on the inner wall of the mounting cavity, and the other end acts on the first connector. The elastic force of the elastic element causes the first connector to pull the carrier plate away from the locking mechanism.

[0008] Preferably, the first connector includes a first hook and a connecting bolt. The carrier plate has a first mounting groove, and the hook portion of the first hook is fastened to the first mounting groove. A threaded hole is provided on the side of the first hook away from the hook portion. The connecting bolt passes through the crossbeam and / or the longitudinal beam and connects to the threaded hole. The elastic element is a spring, which is sleeved on the connecting bolt. One end of the spring acts on the inner wall of the crossbeam and / or the longitudinal beam, and the other end acts on the bolt head of the connecting bolt. The spring force causes the first hook to tighten the carrier plate.

[0009] Preferably, the support frame includes two parallel vertical beams and three parallel horizontal beams, wherein the three parallel horizontal beams are located on both sides and the middle of the vertical beams, thereby forming two spaces for installing the carrier plates. Correspondingly, there are two sets of carrier plates, and the two sets of carrier plates are located in the two spaces respectively.

[0010] Preferably, there are two sets of locking mechanisms and two sets of flexible mounting mechanisms; the two sets of flexible mounting mechanisms are installed on the crossbeams on both sides, while the two sets of locking mechanisms are installed on both sides of the crossbeam in the middle. Each set of locking mechanisms consists of multiple locking mechanisms, which are equidistant from each other along the length of the crossbeam. Correspondingly, each set of flexible mounting mechanisms also consists of multiple flexible mounting mechanisms, which are equidistant from each other along the length of the crossbeam. On each carrier plate, each flexible mounting mechanism has a locking mechanism opposite to it.

[0011] Preferably, the locking mechanism includes a second connector, wherein the second connector includes a second hook; the second hook is embedded in the crossbeam located in the middle, and the hook portion of the second hook hooks onto the carrier plate, and the carrier plate is provided with a second mounting groove at a position corresponding to the hook portion of the second hook.

[0012] Preferably, in each set of carrier plates, except for the first and second mounting slots located in the middle, the first and second mounting slots located on both sides extend along the length direction of the crossbeam, thereby forming deformation gaps that allow the carrier plates to undergo expansion deformation along the length direction of the crossbeam.

[0013] Preferably, the vertical beam is provided with limiting blocks on both sides to prevent the carrier plate from deforming in a direction perpendicular to its plane. There are multiple sets of limiting blocks, which are arranged at equal intervals along the length of the vertical beam. Each set of limiting blocks is provided with a limiting groove, which extends along the length of the vertical beam.

[0014] Preferably, there is a deformation gap between the limiting groove of each set of limiting blocks and the carrier plate, which allows the carrier plate to undergo expansion deformation along the length direction of the crossbeam.

[0015] Preferably, a connecting platform is provided at the connection between the crossbeam and the vertical beam, the connecting platform is installed on the vertical beam, and the end of the crossbeam is installed on the connecting platform via a flange.

[0016] Preferably, the connecting platform is also provided with a groove to prevent the carrier plate from deforming in a plane perpendicular to the carrier plate.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. When the novel limiting silicon wafer carrier device of the present invention expands and deforms during high temperature, taking expansion and deformation along the length of the vertical beam as an example, since one side of the carrier plate is fixed to the crossbeam by a locking mechanism, the carrier plate can only expand and deform towards the other side. Since this side is tightened and fixed by a flexible mounting mechanism, the tension force of the elastic element in the flexible mounting mechanism is consistent with the direction of the expansion and deformation of the carrier plate. Thus, under the action of the tension force of the flexible mounting mechanism, the expansion and deformation of the carrier plate is completely free. That is, under normal conditions, the tension force of the elastic element can keep the carrier plate in a pre-tightened state, and when thermal expansion occurs, the carrier plate can freely expand and extend towards the flexible mounting mechanism in real time, so that local expansion and deformation will not occur. This can well ensure the flatness of the carrier plate, thereby ensuring the processing quality of the silicon wafer on the carrier plate.

[0019] 2. The elastic element in the flexible mounting mechanism of the novel limiting silicon wafer carrier device of the present invention can also ensure that the first connecting member will not loosen or fall off. In addition, it can also ensure that the flexible mounting mechanism always pulls one side of the carrier plate, so that the surface of the carrier plate is in a tensioned state, thereby preventing the carrier plate from moving during silicon wafer processing. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the novel limiting silicon wafer support device of the present invention.

[0021] Figure 2 and Figure 3 for Figure 1 A magnified view of a portion of point A in the image, where... Figure 3 This is a magnified view of a portion of the image after the carrier plate has been removed.

[0022] Figure 4 and Figure 5 for Figure 1 A magnified view of a section at point B in the middle, where... Figure 5 This is a magnified view of a portion of the image after the carrier plate has been removed.

[0023] Figure 6 This is a top view of the novel limiting silicon wafer support device of the present invention.

[0024] Figure 7 and Figure 8 for Figure 6 A magnified view of a section at point C, in which... Figure 8 This is a magnified view of a portion of the image after the carrier plate has been removed.

[0025] Figure 9 for Figure 6 A magnified view of a section at point D.

[0026] Figure 10 for Figure 6 A magnified view of a section at point E in the middle.

[0027] Figure 11 for Figure 6 A magnified view of a section at point F.

[0028] Figure 12 This is a schematic diagram of the installation of the flexible mounting mechanism.

[0029] Figure 13 This is a three-dimensional structural diagram of the flexible installation mechanism.

[0030] Figure 14 and Figure 15 This is a three-dimensional structural diagram of the locking mechanism from two different perspectives. Detailed Implementation

[0031] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0032] See Figures 1-15 The novel limiting silicon wafer carrier device of the present invention includes a carrier frame 1 and a carrier plate 2 disposed on the carrier frame 1.

[0033] See Figures 1-15 The supporting frame 1 is a frame structure composed of a horizontal beam 101 and a vertical beam (which can be a guide rail 3). In this embodiment, the supporting frame 1 includes two parallel vertical beams and three parallel horizontal beams 101. The three parallel horizontal beams 101 are located on both sides and the middle of the vertical beams, thus forming two spaces for installing the carrier plate 2. Correspondingly, there are two sets of carrier plates 2, and the two sets of carrier plates 2 are located in the two spaces respectively.

[0034] See Figures 1-15 One side of the carrier plate 2 along its length and / or width is locked to the crossbeam 101 and / or the longitudinal beam by a locking mechanism, while the opposite side is mounted to the crossbeam 101 and / or the longitudinal beam by a flexible mounting mechanism 6; that is, there are three mounting methods:

[0035] (1) The locking mechanism is set on the middle crossbeam 101, and the flexible installation mechanism 6 is set on the two side crossbeams 101;

[0036] (2) The locking mechanism is set on the middle crossbeam 101 and the vertical beam on one side, while the flexible installation mechanism 6 is set on the two crossbeams 101 and the vertical beam on the other side.

[0037] (3) The locking mechanism is set on the vertical beam on one side, and the flexible installation mechanism 6 is set on the vertical beam on the other side;

[0038] In this embodiment, since guide rails 3 are provided on the outer sides of both vertical beams to facilitate the conveying device to transport the novel limiting silicon wafer carrier device of the present invention to the processing station, this embodiment adopts the first method, that is, the locking mechanism is installed on both sides of the middle crossbeam 101, and the flexible mounting mechanism 6 is installed on the crossbeams 101 on both sides for installing and fixing the two carrier plates 2; that is: there are two sets of locking mechanisms and two sets of flexible mounting mechanisms 6; the two sets of flexible mounting mechanisms 6 are installed on the crossbeams 101 on both sides, and the two sets of locking mechanisms are installed on both sides of the crossbeam 101 in the middle. Each set of locking mechanisms consists of multiple locking mechanisms, which are equidistantly arranged along the length direction of the crossbeam 101; correspondingly, each set of flexible mounting mechanisms 6 also consists of multiple flexible mounting mechanisms, which are equidistantly arranged along the length direction of the crossbeam 101, and the two correspond one to one.

[0039] See Figures 1-15 The flexible mounting mechanism 6 includes a first connector and an elastic element. One end of the first connector is connected to the carrier plate 2, and the other end of the first connector is provided with the elastic element. The crossbeam 101 and / or the longitudinal beam are provided with mounting cavities at locations corresponding to the flexible mounting mechanism. The first connector extends into the mounting cavity. One end of the elastic element acts on the inner wall of the mounting cavity, and the other end acts on the first connector. The elastic force of the elastic element causes the first connector to pull the carrier plate 2 away from the locking mechanism.

[0040] In this embodiment, the first connector includes a first hook 603 and a connecting screw 601. The elastic element is a spring 602. The carrier plate 2 is provided with a first mounting groove 202. The hook portion of the first hook 603 is hooked onto the first mounting groove 202. A threaded hole is provided on the side of the first hook 603 away from the hook portion. The connecting screw 601 passes through the crossbeam 101 and / or the longitudinal beam and connects to the threaded hole. The spring 602 is sleeved on the connecting screw 601, and one end of the spring 602 acts on the inner wall of the crossbeam 101 and / or the longitudinal beam, while the other end acts on the bolt head of the connecting screw 601. The elastic force of the spring 602 causes the first hook 603 to tighten the carrier plate 2. With the above arrangement, one side of the carrier plate 2 is fixed to the intermediate crossbeam 101, while the other side is tightened by the elastic force of the spring 602. Compared with the existing bearing device, it has the following advantages:

[0041] (1) When the novel limiting silicon wafer carrier device of the present invention expands and deforms during high temperature, taking the expansion and deformation along the length of the vertical beam as an example, since one side of the carrier plate 2 is fixed by the intermediate crossbeam 101, the carrier plate 2 can only expand and deform towards the other side. Since this side is tightened by the flexible mounting mechanism 6, the tightening force of the flexible mounting mechanism 6 is consistent with the expansion and deformation direction of the carrier plate 2. In this way, under the action of the tightening force, the expansion and deformation of the carrier plate 2 is smoother, and no tension phenomenon occurs in various parts of the carrier plate 2. This can well ensure the flatness of the carrier plate 2, thereby ensuring the processing accuracy of the silicon wafer on the carrier plate 2.

[0042] (2) By rotating the connecting screw 601, the initial compression of the spring 602 can be adjusted, thereby adjusting the initial tension of the flexible mounting mechanism 6 on the carrier plate 2. Before processing, the initial tension can be set by calculating the maximum expansion deformation of the carrier plate 2 during processing, thereby ensuring that the expansion deformation of the carrier plate 2 is within a controllable range.

[0043] (3) The spring 602 in the flexible installation mechanism 6 can also ensure that the connecting screw 601 does not loosen or fall off; in addition, it also ensures that the flexible installation mechanism 6 always pulls one side of the carrier plate 2, so that the surface of the carrier plate 2 is in a tensioned state, thereby preventing the carrier plate 2 from moving.

[0044] See Figures 1-15 The first hook 603 includes a hook portion and a connecting portion. The threaded hole is provided on the connecting portion. The crossbeam 101 is provided with a guide groove at a position corresponding to the connecting portion to limit and guide the movement of the first hook 603, so that the tension of the first hook 603 can act horizontally on the carrier plate 2.

[0045] See Figures 1-15The locking mechanism includes a second connector, which is a second hook 5. The second hook 5 is welded to the crossbeam 101 located in the middle, and the hook portion of the second hook 5 hooks onto the carrier plate 2. The carrier plate 2 is provided with a second mounting groove 201 at the position corresponding to the hook portion of the second hook 5. In each set of carrier plates 2, in addition to the first mounting groove 202 and the second mounting groove 201 located in the middle, the first mounting groove 202 and the second mounting groove 201 located on both sides extend along the length direction of the crossbeam 101, thereby forming a deformation gap 203 that allows the carrier plate 2 to undergo expansion deformation along the length direction of the crossbeam 101. With the above configuration, the carrier plate 2 can expand and deform along the length of the crossbeam 101. Since the hooks of the first hook 603 and the second hook 5 located in the middle respectively engage with the first mounting groove 202 and the second mounting groove 201 of the carrier plate 2, meaning there is no deformation gap 203 in the first mounting groove 202 and the second mounting groove 201 located in the middle, when expansion and deformation occur, the carrier plate 2 will expand and deform to both sides with the middle of the carrier plate 2 as the dividing point. This not only ensures that the expansion and deformation on both sides of the carrier plate 2 is more uniform, but also helps to reduce the size of each... The dimensions of the deformation gaps 203 in the first mounting groove 202 and the second mounting groove 201, for example, if the maximum deformation of the carrier plate 2 is 1cm, then if the carrier plate 2 is fixed on one side and the other side is used to accommodate the expansion and deformation of the carrier plate 2, then the deformation gaps 203 in each first mounting groove 202 and the second mounting groove 201 will be 1cm; however, by adopting the "fixed in the middle and expanded and deformed on both sides" method of the present invention, the deformation gaps 203 in each first mounting groove 202 and the second mounting groove 201 are reduced to 0.5cm, which helps to ensure the compact structure of the novel limiting silicon wafer support device of the present invention.

[0046] See Figures 1-15 The vertical beam has limiting blocks 7 on both sides to prevent the carrier plate 2 from deforming perpendicular to its plane. There are multiple sets of limiting blocks 7, which are equidistantly arranged along the length of the vertical beam. Each set of limiting blocks 7 has a limiting groove 701 that extends along the length of the vertical beam. By setting the limiting blocks 7, the expansion deformation of the carrier plate 2 perpendicular to its surface can be avoided. In addition, there is a deformation gap between the limiting groove 701 of each set of limiting blocks 7 and the carrier plate 2, which allows the carrier plate 2 to expand and deform along the length of the crossbeam 101. The function of the deformation gap is the same as that of the deformation gap 203 mentioned above, which allows the carrier plate 2 to expand and deform along the length of the crossbeam 101.

[0047] See Figures 1-15A connecting platform 4 is provided at the connection point between the crossbeam 101 and the vertical beam. The connecting platform 4 is mounted on the vertical beam, and the end of the crossbeam 101 is mounted on the connecting platform 4 via a flange. In addition, the connecting platform 4 is also provided with a groove to prevent the carrier plate 2 from deforming in a direction perpendicular to its plane. The function of the groove is the same as that of the limiting groove 701.

[0048] The above are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above content. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A novel limiting silicon wafer support device, characterized in that, The system includes a support frame and a carrier plate disposed on the support frame. The support frame is a frame structure composed of horizontal beams and vertical beams. One side of the carrier plate along its length and / or width is locked to the horizontal beam and / or the vertical beam by a locking mechanism, while the opposite side is mounted on the horizontal beam and / or the vertical beam by a flexible mounting mechanism. Multiple sets of locking mechanisms and flexible mounting mechanisms are provided, and they correspond one-to-one. The flexible mounting mechanism includes a first connector and an elastic element. One end of the first connector is connected to the carrier plate, and the other end of the first connector is provided with the elastic element. The horizontal beam and / or the vertical beam has a mounting cavity corresponding to the flexible mounting mechanism. The first connector extends into the mounting cavity. One end of the elastic element acts on the inner wall of the mounting cavity, and the other end acts on the first connector. The elastic force of the elastic element causes the first connector to pull the carrier plate away from the locking mechanism. The first connector includes a first hook and a connecting bolt. A first mounting groove is provided on the carrier plate. The hook portion of the first hook is fastened to the first mounting groove. A threaded hole is provided on the side of the first hook away from the hook portion. The connecting bolt passes through the crossbeam and / or the vertical beam and connects to the threaded hole. The elastic element is a spring, which is sleeved on the connecting bolt. One end of the spring acts on the inner wall of the crossbeam and / or the vertical beam, and the other end acts on the bolt head of the connecting bolt. The spring force causes the first hook to pull the carrier plate tight. The locking mechanism includes a second connector, wherein the second connector includes a second hook; the second hook is embedded in a crossbeam located in the middle, and the hook portion of the second hook hooks onto the carrier plate, and the carrier plate is provided with a second mounting groove at a position corresponding to the hook portion of the second hook; In each set of carrier plates, except for the first and second mounting slots located in the middle, the first and second mounting slots located on both sides extend along the length direction of the crossbeam, thereby forming deformation gaps that allow the carrier plates to undergo expansion deformation along the length direction of the crossbeam.

2. The novel limiting silicon wafer support device according to claim 1, characterized in that, The support frame includes two parallel vertical beams and three parallel horizontal beams. The three parallel horizontal beams are located on both sides and the middle of the vertical beams, thus forming two spaces for installing the carrier plates. Correspondingly, there are two sets of carrier plates, and the two sets of carrier plates are located in the two spaces respectively.

3. The novel limiting silicon wafer support device according to claim 2, characterized in that, There are two sets of locking mechanisms and two sets of flexible mounting mechanisms. The two sets of flexible mounting mechanisms are installed on the crossbeams on both sides, while the two sets of locking mechanisms are installed on both sides of the crossbeam in the middle. Each set of locking mechanisms consists of multiple locking mechanisms, which are arranged equidistantly along the length of the crossbeam. Correspondingly, each set of flexible mounting mechanisms also consists of multiple flexible mounting mechanisms, which are arranged equidistantly along the length of the crossbeam. On each carrier plate, each flexible mounting mechanism has a locking mechanism opposite to it.

4. The novel limiting silicon wafer support device according to claim 3, characterized in that, The vertical beam has limiting blocks on both sides to prevent the carrier plate from deforming in a direction perpendicular to its plane. There are multiple sets of limiting blocks, which are equidistantly arranged along the length of the vertical beam. Each set of limiting blocks has a limiting groove that extends along the length of the vertical beam.

5. The novel limiting silicon wafer support device according to claim 4, characterized in that, There is a deformation gap between the limiting groove of each set of limiting blocks and the carrier plate, which allows the carrier plate to expand and deform along the length direction of the crossbeam.

6. The novel limiting silicon wafer support device according to claim 1, characterized in that, A connecting platform is provided at the connection between the crossbeam and the vertical beam. The connecting platform is installed on the vertical beam, and the end of the crossbeam is installed on the connecting platform via a flange.

7. The novel limiting silicon wafer support device according to claim 6, characterized in that, The connecting platform is also provided with a groove to prevent the carrier plate from deforming in a direction perpendicular to the plane of the carrier plate.

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