Wafer loading apparatus and loading method

Abstract

The application relates to the technical field of semiconductor wafer processing, and discloses a wafer loading device and a loading method. The loading fixing system of the wafer loading device comprises a loading execution member and a fixing execution member; the loading execution member can load a wafer on a carrier assembly; and the fixing execution member can fix the carrier assembly after loading. A loading station corresponding to the loading execution member and a fixing station corresponding to the fixing execution member are arranged on a conversion workbench; the conversion workbench is rotationally arranged to convert the positions of the carrier assemblies arranged in the loading station and the fixing station; a conveying system is arranged on one side of the conversion workbench and comprises a bearing frame and a conveying execution member; the conveying execution member can place the carrier assemblies without loads on the bearing frame in the fixing station and place the carrier assemblies fixed after loading in the fixing station on the bearing frame; and a wafer positioning device can position the wafer to provide the wafer after positioning for the loading execution member. The application has higher working efficiency, better loading and fixing precision, and a more compact structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, and in particular to a wafer loading device and a loading method. BACKGROUND

[0002] The wafer is carried by a clamp (tray, seal ring, cover plate) and then enters an ICP process chamber for etching. The clamp carries 7-9 wafers at the same time. A passage is reserved at the bottom of the clamp for the passage of helium gas to cool the wafer and improve the process.

[0003] In the prior art, the wafer loading into the clamp is a purely manual operation, which includes the following steps: a wafer positioner is sleeved above a tray, a wafer is sucked by a vacuum suction pen and placed into a slot of the positioner, the positioner is carefully removed, a cover plate is slowly and accurately sleeved, fixed and turned over by 180 degrees, screws are screwed on the bottom of the tray (more than 30), the clamp system is turned over by 180 degrees and removed for standby. This process is complicated, low in efficiency, prone to wafer deviation and contamination, and requires high quality of operators.

[0004] Therefore, there is an urgent need for a wafer loading device and a loading method to solve the above problems. SUMMARY

[0005] Based on the above, the purpose of the present application is to provide a wafer loading device and a loading method, which are better in loading precision, higher in efficiency, and more compact in structure.

[0006] To achieve the above purpose, the present application adopts the following technical solutions:

[0007] The wafer loading device comprises:

[0008] A loading fixing system comprising a loading execution member and a fixing execution member, the loading execution member being capable of loading a wafer on a carrier assembly, and the fixing execution member being capable of fixing the carrier assembly after loading;

[0009] A conversion workbench provided with a loading station corresponding to the loading execution member and a fixing station corresponding to the fixing execution member, the conversion workbench being rotationally arranged to convert the position of the carrier assembly placed in the loading station and the fixing station;

[0010] A conveying system provided on one side of the conversion workbench, comprising a carrying frame and a conveying execution member, the conveying execution member being capable of placing the carrier assembly on the carrying frame on the empty loading station and placing the carrier assembly on the carrying frame after loading and fixing in the fixing station;

[0011] A wafer positioning system configured to position the wafer to provide the wafer after positioning for the loading execution member.

[0012] As a preferred solution of a chip loading device, the carrier assembly includes a carrier body and a cover plate, and the chip loading device also includes a cover plate picking and placing system, which can remove the cover plate before loading the chip and buckle the cover plate after loading.

[0013] As a preferred solution of the wafer loading device, the wafer loading device further includes a fixing part supply system, which is arranged on one side of the fixing actuator, and the fixing part supply system can supply fixing parts to the fixing actuator.

[0014] As a preferred solution of a chip loading device, the chip loading device also includes a chip supply system, and the chip supply system includes a chip placement table and a chip pick-up and placement component. The chip is placed on the chip placement table, and the chip pick-up and placement component can remove the chip from the chip placement table and place it on the chip positioning system.

[0015] As a preferred solution for a wafer loading device, the conversion workbench is provided with through holes corresponding to the loading station and the fixing station, and the conversion workbench is arranged to be raised and lowered. The conversion workbench is raised to support the carrier assembly, or lowered to place the carrier assembly at the loading station and the fixing station.

[0016] As a preferred solution for a chip loading device, two carriers are provided, and the two carriers are respectively provided on both sides of the transfer actuator, one of the carriers is used to place the empty carrier assembly, and the other carrier is used to place the loaded carrier assembly.

[0017] As a preferred solution of the wafer loading device, the loading station and the fixing station are configured to be rotatable at a preset angle.

[0018] As a preferred solution for a chip loading device, the chip positioning system includes a positioning station, a backlight and a positioning camera. The chip is placed on the positioning station, the backlight is arranged on one side of the positioning station, and the positioning camera is arranged on a side of the positioning station away from the backlight. The positioning camera is configured to obtain light from the backlight through the positioning edge of the chip.

[0019] As a preferred solution of the wafer loading device, the wafer positioning system further includes an adjustment module, and the adjustment module is configured to rotate the wafer so as to direct the positioning edge of the wafer toward a preset direction.

[0020] A wafer loading method, using the wafer loading device as described in any of the above solutions, the wafer loading method comprising:

[0021] The transfer actuator places the empty carrier assembly on the carrier rack to a fixed position on the conversion workbench;

[0022] The transfer table rotates to transfer the unloaded carrier assembly placed at the fixed station to the loading station;

[0023] The loading actuator loads the wafer positioned by the wafer positioning system onto the empty carrier assembly;

[0024] The transfer table rotates to transfer the loaded carrier assembly at the loading station to the fixed station;

[0025] The fixed actuator fixes the carrier assembly after loading;

[0026] The transfer actuator places the fixed carrier assembly on the carrier frame.

[0027] The beneficial effects of the present invention are:

[0028] The present invention provides a carrier rack for holding empty and loaded carrier assemblies; provides a transfer actuator for placing the empty carrier assembly on the carrier rack in a fixed position on a conversion workbench; and by rotating the conversion workbench, the carrier assembly at the loading station and the fixed station can be switched; after switching positions, the empty carrier assembly is placed at the loading station, and the loading actuator places the wafers positioned by the wafer positioning system on the carrier assembly in sequence; after placement, the conversion workbench rotates, and the loaded carrier assembly is transferred to the fixed station, and the fixing actuator fixes the loaded carrier assembly; finally, the transfer actuator transfers the loaded and fixed carrier assembly back to the carrier rack. The wafer loading device has higher working efficiency and better loading and fixing accuracy. At the same time, the wafer loading device has a more compact structure, which effectively reduces the volume of components, thereby reducing the occupied space of the entire device, making it more convenient to transport the device and utilize space in the workshop. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0030] Figure 1 It is a schematic diagram of a wafer loading device provided in a specific embodiment of the present invention.

[0031] In the picture:

[0032] 1. Loading and fixing system; 11. Loading execution parts; 12. Fixing execution parts;

[0033] 2. Conversion workbench; 21. Loading station; 22. Fixed station;

[0034] 3. Conveying system; 31. Carrying frame; 32. Conveying actuator;

[0035] 4. Wafer positioning system;

[0036] 5. Cover picking and placing system;

[0037] 6. Fixing parts supply system;

[0038] 7. Wafer supply system; 71. Placement table; 72. Wafer pick-and-place unit. DETAILED DESCRIPTION

[0039] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but are not to be construed as limiting the present invention.

[0040] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0041] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed or removable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0042] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0043] like Figure 1As shown, this embodiment provides a chip loading device, which includes a loading and fixing system 1, a conversion workbench 2, a conveying system 3 and a chip positioning system 4. The loading and fixing system 1 includes a loading actuator 11 and a fixing actuator 12. The loading actuator 11 can load the chip on the carrier assembly, and the fixing actuator 12 can fix the loaded carrier assembly; the conversion workbench 2 is provided with a loading station 21 corresponding to the loading actuator 11 and a fixing station 22 corresponding to the fixing actuator 12, and the conversion workbench 2 is rotatably set to switch the positions of the carrier assemblies placed at the loading station 21 and the fixing station 22; the conveying system 3 is arranged on one side of the conversion workbench 2, including a carrier 31 and a conveying actuator 32. The conveying actuator 32 can place the empty carrier assembly on the carrier 31 on the fixing station 22, and place the carrier assembly after loading and fixing at the fixing station 22 on the carrier 31; the chip positioning system 4 is configured to be able to position the chip to provide the positioned chip to the loading actuator 11.

[0044] A carrier rack 31 is provided for holding empty and loaded carrier assemblies; a transfer actuator 32 is provided for placing the empty carrier assembly on the carrier rack 31 into a fixed position on the conversion workbench 2; the conversion workbench 2 is rotated to switch the positions of the carrier assemblies at the loading station 21 and the fixing station 22; after the switching positions, the empty carrier assembly is placed at the loading station 21, and the loading actuator 11 sequentially places the wafers positioned by the wafer positioning system 4 onto the carrier assembly; after placement, the conversion workbench 2 rotates, and the loaded carrier assembly is transferred to the fixing station 22, where the fixing actuator 12 fixes the loaded carrier assembly; finally, the transfer actuator 32 transfers the loaded and fixed carrier assembly back to the carrier rack 31. The wafer loading device has higher working efficiency and better loading and fixing accuracy. At the same time, the wafer loading device has a more compact structure, effectively reducing the volume of components, thereby reducing the space occupied by the entire device, making it more convenient to transport the device and utilize space in the workshop.

[0045] As an optional solution for the wafer loading device, two carriers 31 are provided, one on either side of the transfer actuator 32. Preferably, the two carriers 31 are symmetrically arranged relative to the transfer actuator 32. One carrier 31 is used to hold an empty carrier assembly, while the other carrier 31 is used to hold a loaded carrier assembly. Each carrier 31 is provided with multiple loading positions arranged in a sequence of vertical and horizontal positions, with the loading positions of the two carriers 31 correspondingly arranged. Furthermore, each loading position can hold a carrier assembly and is also equipped with a load sensor and an anti-collision sensor. The carrier assembly can only be transferred when all the sensors are in the correct state.

[0046] In this embodiment, the transmission actuator 32 is configured as a manipulator, which includes an X-axis module, a Z-axis module, and a θ-axis module. When the carrier assembly is transmitted, the corresponding modules of the three axes are linked to realize the transmission of the carrier assembly. For example, each axis is driven by a servo motor and can be driven by a structure such as a belt or a screw. Specifically, the X-axis module includes an X1 axis and an X2 axis, wherein the X1 axis can implement an adjustable stroke, and the X2 axis can implement a fixed stroke. The Z axis is divided into a Z1 axis and a Z2 axis, and the Z2 axis runs in proportion to the stroke of the Z1 axis, and the θ axis can rotate 360 ​​degrees. This design realizes a smaller volume of the transmission actuator 32 and makes the debugging of the transmission actuator 32 more flexible. Preferably, the execution end of the transmission actuator 32 is also provided with a carrier fixing module and a shedding detection module, which are respectively used for clamping and fixing the carrier assembly and detecting the carrier assembly, thereby ensuring the reliability of the transmission of the carrier assembly and effectively preventing the carrier assembly from falling off.

[0047] As an optional solution for the wafer loading device, the wafer loading device further includes a wafer supply system 7, which is configured to supply wafers to the wafer positioning system 4. Specifically, the wafer supply system 7 includes a wafer placement table 71 and a wafer pick-up and placement component 72. The wafer placement table 71 is used to hold wafers, and the wafer pick-up and placement component 72 can remove wafers from the wafer placement table 71 and place them on the wafer positioning system 4.

[0048] Furthermore, the wafer placement platform 71 is arranged in an arc shape, and the wafer pick-up and placement component 72 is arranged on the inner side of the arc-shaped wafer placement platform 71. Such an arrangement is conducive to reducing the pick-up and placement distance and pick-up and placement time of the wafer pick-up and placement component 72, and effectively improving the efficiency of picking up and placing wafers. Optionally, the wafer placement platform 71 is provided with multiple layers, and each layer is provided with multiple placement positions. Exemplarily, the wafer placement platform 71 is provided with two layers, upper and lower, with 10 placement positions on each layer, for a total of 20 placement positions. Preferably, the placement positions are compatible with wafers of various sizes to improve the applicability and versatility of the wafer loading device. In addition, each placement position has a jammer and a displacement sensor to prevent the wafer pick-up and placement component 72 from colliding, thereby ensuring that the wafer pick-up and placement component 72 can normally pick up and place wafers.

[0049] In this embodiment, the wafer handling component 72 is configured as a robotic arm comprising an X-axis module, a Z-axis module, a θ-axis module, and a rotation module. When handling a wafer, the corresponding modules of the three axes work in concert to achieve wafer handling. The rotation module is used to flip the wafer. Exemplarily, each axis is driven by a servo motor, and transmission can be via a belt, a lead screw, or other structure.

[0050] Preferably, the wafer pick-and-place device 72 is further provided with a scanning sensor, which can be used to scan the position of the wafer in the placement position and the number of wafers, facilitating the control of the wafer loading device as a whole. Illustratively, the wafer pick-and-place device 72 is provided with a negative pressure pipeline, and the wafer is picked and placed by negative pressure, which is conducive to reducing the damage to the wafer.

[0051] As an optional solution of the wafer loading device, the wafer positioning system 4 comprises a positioning station, a backlight device and a positioning camera, the wafer is placed in the positioning station by the wafer pick-and-place device 72, the backlight device is arranged on one side of the positioning station, and the positioning camera is arranged on the side of the positioning station away from the backlight device, and the positioning camera is configured to obtain the light of the backlight device via the positioning edge of the wafer. Since the light at the positioning edge of the wafer can be transmitted, the positioning of the wafer can be realized by the backlight device and the positioning camera, compared with the mechanical positioning of the wafer in the prior art, on the one hand, the damage to the wafer is reduced, and on the other hand, the positioning accuracy is higher, and then a fine sealing ring (diameter 1200 μm) can be used to improve the area utilization rate of the wafer placement table 71.

[0052] Further, the wafer positioning system 4 further comprises an adjusting module, which is configured to rotate the wafer to direct the positioning edge of the wafer to a preset direction. It is worth mentioning that the wafer positioning system 4 can also not be provided with the adjusting module, and the adjustment of the direction of the wafer can be realized by the wafer pick-and-place device 72 or the loading execution device 11.

[0053] As an optional solution of the wafer loading device, the loading station 21 and the fixed station 22 on the conversion workbench 2 are symmetrically arranged, and the conversion workbench 2 is further provided with through holes corresponding to the loading station 21 and the fixed station 22, the conversion workbench 2 is arranged to be lifted, the conversion workbench 2 is lifted to support the carrier assembly, then the conversion workbench 2 is rotated to exchange the positions of the carrier assemblies on the loading station 21 and the fixed station 22, next the conversion workbench 2 is lowered to place the carrier assemblies on the loading station 21 and the fixed station 22, to complete the conversion of the positions of the carrier assemblies placed on the loading station 21 and the fixed station 22.

[0054] Specifically, the lifting and rotation of the conversion workbench 2 are realized by an X-axis module and a θ-axis module respectively, the X-axis module can be a belt and screw drive, and the θ-axis module can be a direct-drive motor with a speed reducer. The 360-degree rotation of the conversion workbench 2 can quickly and cyclically switch the carrier assemblies, realizing a flow automatic wafer loading process.

[0055] As an optional solution for a wafer loading device, the carrier assembly includes a carrier body and a cover plate. The carrier body is used to place the wafers, and the cover plate is fastened to the carrier body. Accordingly, the wafer loading device also includes a cover plate pick-up and placement system 5. When the empty carrier assembly is transferred to the loading station 21, the cover plate pick-up and placement system 5 removes the cover plate to facilitate the loading actuator 11 to place the wafers into the carrier body. After the multiple wafers on the carrier body are placed, the cover plate pick-up and placement system 5 fastens the cover plate. After the cover plate pick-up and placement system 5 fastens the cover plate, the conversion workbench 2 rotates again to transfer the carrier assembly after transferring the wafers and fastening the cover plate to the fixing station 22 to fix the cover plate and the carrier body.

[0056] Specifically, the cover plate picking and placing system 5 includes a lifting axis module and a translation axis module, which are respectively used to drive the negative pressure suction cup to lift and translate, so as to achieve the removal and fastening of the cover plate. Exemplarily, each axis is driven by a servo motor and can be driven by a structure such as a belt or a screw. The cover plate picking and placing system 5 also includes a negative pressure suction cup, which is used to adsorb the cover plate. Preferably, the cover plate picking and placing system 5 also includes a pick-and-place cover recognition module, specifically including a CCD camera, which collects, locates and calibrates position information before removing the cover plate, and collects position information again after the cover plate needs to be fastened, and compares the two position information to ensure the accuracy of fastening the cover plate.

[0057] As an optional solution for the wafer loading system, both the loading station 21 and the fixing station 22 are configured to rotate at preset angles. This rotation can be achieved by a direct-drive motor, enabling a 360-degree rotation of the carrier assembly placed on the loading station 21 or fixing station 22. Furthermore, the preset angle for each rotation is related to the wafer placement position and the position to be fixed on the carrier assembly, and can be set by those skilled in the art based on actual needs.

[0058] Furthermore, a negative pressure fixing module is provided on the loading station 21. By providing the negative pressure fixing module, the carrier body is fixed, which facilitates the cover plate picking and placing system 5 to pick up and place the cover plate, and at the same time ensures the stability of the carrier body when the transfer actuator executes the transfer of chips and the fixing actuator 12 fixes the cover plate.

[0059] Preferably, the loading station 21 is also equipped with a positioning module, which includes a CCD camera and a backlight assembly. The backlight assembly can be set to have adjustable light intensity. Before the cover plate pick-up and placement system 5 removes the cover plate, the CCD camera captures an image of the carrier assembly and analyzes and locates it. The cover plate pick-up and placement system 5 then removes the cover plate. When the loading actuator 11 loads the wafer, the CCD camera captures an image of each wafer placement position and analyzes and locates it, allowing for more accurate wafer loading. In addition, after the cover plate is transferred and fastened, the CCD camera can also capture the impact of the cover plate and analyze the positioning to ensure accuracy when the fixing actuator 12 subsequently fixes the cover plate.

[0060] In this embodiment, the wafer loading apparatus further includes a fastener supply system 6, disposed on one side of the fastener actuator 12. The fastener supply system 6 is capable of supplying fasteners to the fastener actuator 12. Exemplarily, the fasteners are screws, and the fastener supply system 6 stores a large number of screws. The fastener supply system 6 can also arrange and position the screws as they are supplied. Preferably, the fastener supply system 6 also includes a counter and an insufficient sensor to monitor the number of installed screws and the number of remaining screws, respectively, to ensure reliable screw supply.

[0061] Specifically, the fixing station 22 is provided with a centering module to position the carrier assembly at the fixing station 22. Optionally, the centering module is positioned by a three-jaw positioning cylinder. The three-jaw positioning cylinder can not only center the carrier assembly, but also fix the carrier assembly, facilitating the stability of the carrier assembly during fixing, and effectively preventing loading or fixing failures caused by the positioning of the carrier assembly.

[0062] This embodiment also discloses a chip loading method, which adopts the wafer loading device as described in any of the above schemes, and the chip loading method includes: the transfer actuator 32 transfers the empty carrier assembly from the carrier frame 31 to the fixed station 22 of the conversion workbench 2; the conversion workbench 2 rotates to transfer the empty carrier assembly to the loading station 21; the cover pick-up and placement system 5 takes the cover of the carrier assembly; the chip supply system 7 supplies the chip to the chip positioning system 4, and the chip positioning system 4 positions the chip; the loading actuator 11 places the positioned chip on the carrier body; the cover pick-up and placement system 5 snaps the cover of the carrier assembly; the conversion workbench 2 rotates to transfer the loaded carrier assembly to the fixed station 22; the fixing part supply system 6 supplies fixing parts to the fixing actuator 12, and the fixing actuator 12 fixes the cover of the carrier assembly; finally, the carrier assembly loaded and fixed by the transfer actuator 32 is transferred from the fixed station 22 of the conversion workbench 2 to the carrier frame 31.

[0063] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. Wafer loading device, characterized in that, include: A loading and fixing system (1) comprises a loading actuator (11) and a fixing actuator (12), wherein the loading actuator (11) can load a wafer onto a carrier assembly, and the fixing actuator (12) can fix the loaded carrier assembly; a conversion workbench (2) on which a loading station (21) corresponding to the loading actuator (11) and a fixing station (22) corresponding to the fixing actuator (12) are provided, wherein the conversion workbench (2) is rotatably arranged to switch the positions of the carrier components placed at the loading station (21) and the fixing station (22); A conveying system (3) is provided on one side of the conversion workbench (2), comprising a carrier (31) and a conveying actuator (32), wherein the conveying actuator (32) is capable of placing the unloaded carrier assembly on the carrier (31) on the fixed station (22), and placing the loaded and fixed carrier assembly on the fixed station (22) on the carrier (31); The wafer positioning system (4) is configured to position the wafer so as to provide the positioned wafer to the loading execution part (11).

2. The wafer loading device according to claim 1, wherein: The carrier assembly includes a carrier body and a cover plate, and the chip loading device also includes a cover plate picking and placing system (5). The cover plate picking and placing system (5) can remove the cover plate before loading the chip and buckle the cover plate after loading.

3. The wafer loading device according to claim 1, wherein: The wafer loading device further comprises a fixing part supply system (6) which is arranged on one side of the fixing actuator (12), and the fixing part supply system (6) can supply fixing parts to the fixing actuator (12).

4. The wafer loading device according to claim 1, wherein: The wafer loading device further comprises a wafer supply system (7), wherein the wafer supply system (7) comprises a wafer placement platform (71) and a wafer pick-up and placement component (72), wherein the wafer is placed on the wafer placement platform (71), and the wafer pick-up and placement component (72) can remove the wafer from the wafer placement platform (71) and place it on the wafer positioning system (4).

5. The wafer loading device according to claim 1, wherein: The conversion workbench (2) is provided with through holes corresponding to the loading station (21) and the fixing station (22). The conversion workbench (2) is arranged to be raised and lowered. The conversion workbench (2) is raised to support the carrier assembly, or lowered to place the carrier assembly at the loading station (21) and the fixing station (22).

6. The wafer loading device according to claim 1, wherein: Two carrier racks (31) are provided, and the two carrier racks (31) are respectively provided on both sides of the transmission actuator (32), wherein one of the carrier racks (31) is used to place the empty carrier assembly, and the other carrier rack (31) is used to place the loaded carrier assembly.

7. The wafer loading device according to claim 1, wherein: The loading station (21) and the fixing station (22) are configured to be rotatable at a preset angle.

8. The wafer loading device according to claim 1, wherein: The chip positioning system (4) includes a positioning station, a backlight component and a positioning camera, the chip is placed on the positioning station, the backlight component is arranged on one side of the positioning station, the positioning camera is arranged on a side of the positioning station away from the backlight component, and the positioning camera is configured to obtain light from the backlight component through the positioning edge of the chip.

9. The wafer loading device according to claim 8, wherein: The chip positioning system (4) further comprises an adjustment module, wherein the adjustment module is configured to rotate the chip so as to orient the positioning edge of the chip toward a preset direction.

10. A wafer loading method, characterized in that: Using the wafer loading device according to any one of claims 1 to 9, the wafer loading method comprises: The transfer actuator (32) places the unloaded carrier assembly on the carrier (31) on the fixed station (22) of the conversion workbench (2); The transfer workbench (2) rotates to transfer the unloaded carrier assembly placed at the fixed station (22) to the loading station (21); The loading actuator (11) loads the wafer positioned by the wafer positioning system (4) onto the empty carrier assembly; The transfer workbench (2) rotates to transfer the loaded carrier assembly placed at the loading station (21) to the fixed station (22); A fixed actuator (12) fixes the loaded carrier assembly; The transport actuator (32) places the fixed carrier assembly on the carrier frame (31).

Images