Dynamic valve for electronic devices

Abstract

The present disclosure relates to dynamic valves for electronic devices. A portable electronic device is provided that includes a housing having a housing wall forming an internal chamber and a sound output port to an ambient environment, a transducer positioned within the internal chamber and dividing the internal chamber into a front volume chamber and a back volume chamber, the front volume chamber coupling a first side of the transducer to the sound output port, the back volume chamber coupled to a second side of the transducer, and an electromechanical valve including a plurality of flaps operable to open and close a through hole to the internal chamber, the front volume chamber, or the back volume chamber.

Description

[0001] Cross-reference to related applications

[0002] This application is a non-provisional application of co-pending U.S. Provisional Patent Application No. 63 / 245,570, filed on September 17, 2021 and incorporated herein by reference. Technical Field

[0003] One aspect of this disclosure relates to a dynamic valve assembly for an electronic device. Other aspects are also described and protection thereof is claimed. Background Technology

[0004] Portable communication or listening devices (e.g., smartphones, headsets, etc.) have one or more transducers located therein that convert an input electro-audio signal into a sound pressure level (SPL) wave output that can be heard by a user, or convert an SPL input into an electro-audio signal. Transducers (e.g., speakers) can be used to output SPL waves corresponding to the voice of a distant user (such as during a phone call), or to output SPL waves corresponding to sounds associated with a game the user wants to play or music they want to play. Due to the relatively thin profile of portable devices, the transducers are also relatively thin, which can make it difficult to maintain optimal sound quality. Summary of the Invention

[0005] One aspect of this disclosure relates to a dynamic valve that can be used to control the amount of leakage between the inner cavity and the environment. Typically, in the case of headphones, in some cases a perfect seal (high impedance) is desired, while in others a very open path (low impedance) is desired. Typically, in some cases, if the headphones fit relatively tightly within the ear and form a seal or at least a partial seal with the ear canal, the user may experience an undesirable occlusion effect. For example, during active noise control (ANC) or noise cancellation, a user may want the in-ear device to be isolated by passive isolation and ANC (closed valve), but when outdoors, permeability (open valve) may be desired, resulting in a more natural and lower occlusion effect when speaking. Therefore, this valve allows the amount of leakage to be dynamically controlled during system operation according to the desired leakage level and with low power consumption.

[0006] Typically, in some aspects, this disclosure relates to a portable electronic device (e.g., a wearable device such as headphones) including a housing having housing walls forming an internal chamber and an audio output port to the surrounding environment; a transducer positioned within the internal chamber and dividing the internal chamber into a front volume chamber and a rear volume chamber, the front volume chamber connecting a first side of the transducer to the audio output port and the rear volume chamber connecting a second side of the transducer; and an electromechanical valve including a plurality of flaps operable to open and close a through-hole to the internal chamber, the front volume chamber, or the rear volume chamber. In some aspects, the plurality of flaps are operable to open or close the through-hole to the surrounding environment when a voltage is applied. In other aspects, the through-hole includes a first opening and a second opening, and the plurality of flaps includes a first flap operable to open and close the first opening and a second flap operable to open and close the second opening. In some aspects, at least one of the plurality of vanes includes an electrode layer and a structural material layer, and the vane is coupled to a support member having a first portion perpendicular to the arrangement of the vanes. In some aspects, upon application of voltage, the vane transitions from a closed position to an open position, in which it is coupled to the first portion by electrostatic force. In some aspects, the support member further includes a second portion extending perpendicular to the first portion and positioned above the vane, and upon application of voltage, the vane is coupled to the second portion to close a through-hole. The vane may also include a piezoelectric layer coupled to the electrode layer. In some aspects, the electrode layer is a first electrode layer, and the vane further includes a second electrode layer coupled to the piezoelectric layer on a side opposite to the first electrode layer. In some aspects, the first portion of the support member includes a tapered portion that reduces the distance the vane moves to transition to the open position. In some aspects, the valve is a first valve, and the device further includes a second valve having a vane operable to open in a direction opposite to at least one of the plurality of vanes of the first valve upon transition to the open position to counteract the net air pressure generated by the first valve.

[0007] In another aspect, this disclosure relates to a valve assembly for a portable electronic device, the valve assembly including a support member coupled to a housing opening, the support member having an insulating layer; and an electromechanical flap movably coupled to the support member, the electromechanical flap including a first material layer and a second material layer, the first material layer comprising a metal, and wherein, upon application of a voltage, the electromechanical flap is operable to transition between a closed configuration in which the electromechanical flap covers the housing opening, and in an open configuration in which the electromechanical flap opens the housing opening. The first material layer comprising a metal may be an electrode layer, and the second material layer includes a structural material coupled to the first material layer, and the second material layer comprises polycrystalline silicon, silicon nitride, or monocrystalline silicon. In some aspects, the second material layer comprises a piezoelectric material. In some aspects, a third material layer comprising a metal is also provided. In some aspects, an insulating layer is coupled to a surface of the support member extending perpendicular to the housing opening, and the flap rotates about a hinge toward the insulating layer to the open configuration. In some aspects, an insulating layer is coupled to the surface of a support member extending parallel to the housing opening and positioned above the wing, wherein the wing rotates about a hinge toward the insulating layer to a closed configuration. In some aspects, the electromechanical wing includes a first electromechanical wing and a second electromechanical wing. The first and second electromechanical wings are independently operable to transition between a closed configuration and an open configuration, in which the first and second electromechanical wings cover the housing opening, and in the open configuration, the first and second electromechanical wings rotate toward the insulating layer of the support member. In some aspects, the opening includes a first opening and a second opening, and the first electromechanical wing is operable to transition between a closed configuration and an open configuration, in which the first electromechanical wing covers a first housing opening, and the second electromechanical wing is operable to transition between a closed configuration and an open configuration, in which the first electromechanical wing covers a second housing opening. In some respects, the support member includes a first end and a second end opposite to the first end, a first electromechanical flap connected to the first end, a second electromechanical flap connected to the second end, and wherein the second electromechanical flap opens in the opposite direction to the first electromechanical flap when switched to the open position to counteract the net air pressure generated by the first electromechanical flap.

[0008] The above overview does not include an exhaustive list of all aspects of this disclosure. It is contemplated that the invention encompasses all systems and methods that can be implemented by all suitable combinations of the aspects outlined above and the various aspects disclosed in the detailed embodiments below and specifically pointed out in the claims filed with this patent application. Such combinations have specific advantages not specifically described in the above overview. Attached Figure Description

[0009] Several aspects are illustrated in the accompanying drawings by way of example rather than limitation, and similar reference numerals in the drawings indicate similar elements. It should be noted that references to “a” or “an” aspect in this disclosure do not necessarily refer to the same aspect, and that they mean at least one.

[0010] Figure 1 A cross-sectional side view of one aspect of a portable electronic device and / or transducer assembly with a valve is shown.

[0011] Figure 2 It shows Figure 1 A perspective view of one aspect of the valve of a portable electronic device and / or transducer assembly.

[0012] Figure 3A It shows a closed configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0013] Figure 3B It shows the open configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0014] Figure 4A It shows a closed configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0015] Figure 4B It shows the open configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0016] Figure 5A It shows a closed configuration. Figure 2 A side perspective view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0017] Figure 5B It shows the open configuration. Figure 2 A side perspective view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0018] Figure 6A It shows the open configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0019] Figure 6B It shows a closed configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0020] Figure 7A It shows a closed configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0021] Figure 7B It shows the open configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0022] Figure 8A It shows a closed configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0023] Figure 8B It shows the open configuration. Figure 2 A cross-sectional side view of one aspect of a valve in a portable electronic device and / or transducer assembly.

[0024] Figure 9 It is shown that implementations thereof include Figure 1 A block diagram of one aspect of the electronic equipment of the transducer of the valve assembly shown in Figure 8. Detailed Implementation

[0025] In this section, we will explain several preferred aspects of this disclosure with reference to the accompanying drawings. Where the shape, relative position, and other aspects of the described components are not clearly defined, the scope of this disclosure is not limited to the components shown, which are for illustrative purposes only. Furthermore, while many details are set forth, it should be understood that some aspects of this disclosure can be implemented without these details. In other instances, well-known structures and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0026] The terminology used herein is for the purpose of describing particular aspects only and is not intended to limit this disclosure. Spatially related terms, such as “below,” “under,” “down,” “above,” “above,” etc., may be used herein for the convenience of describing the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. It should be understood that spatially related terms are intended to cover different orientations of the device during use or operation other than those shown in the drawings. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features may then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both the orientations above and below. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0027] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context otherwise indicates. It should be further understood that the terms “comprising”, “including”, “emphasize” define the presence of the stated feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or collections thereof.

[0028] The terms “or” and “and / or” as used herein should be interpreted as including or referring to any one or any combination thereof. Therefore, “A, B, or C” or “A, B, and / or C” means “any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or actions is inherently mutually exclusive in some way.

[0029] Figure 1A cross-sectional side view of one aspect of a valve assembly of a transducer located within a portable electronic device is shown. The electronic device 100 may include a housing, enclosure, or outer casing 102 that defines or encloses a chamber therein housing constituent electronic components of the electronic device 100. In some aspects, the device 100 is contemplated as a portable or mobile communication device, an in-ear device, a portable timer, or any other device in which a transducer may be implemented. The housing 102 may include a housing wall 104 that separates the surrounding environment from the enclosed space or internal chamber 106 formed within the housing 102. In some cases, the housing wall 104 completely isolates or seals all or part of the internal chamber 106 from the surrounding environment. For example, the housing wall 104 may form a waterproof or soundproof portion of the internal chamber 106 that is impermeable to water and / or air. The internal chamber 106 may have sufficient volume and / or size to accommodate constituent components of the electronic device 100. The housing wall 104 may also include one or more of acoustic ports 108. Acoustic port 108 can be, for example, a sound output port through which sound from a speaker located within the internal chamber 106 can be output. Alternatively, where a microphone is located near the housing acoustic interface 108, it can be a sound input port to allow sound input to the microphone.

[0030] Representatively, in Figure 1In one aspect, the housing acoustic port 108 is an acoustic port acoustically open to a transducer 110 positioned within the internal chamber 106. In some aspects, the transducer 110 can be any type of electroacoustic transducer capable of converting an electro-audio signal into sound or vice versa. Typically, the transducer 110 can be a loudspeaker or a miniature loudspeaker, for example, a miniaturized version of a megaphone that uses a moving coil motor to drive the sound output. Therefore, in some aspects, the transducer 110 may be referred to herein as a miniature loudspeaker. In other aspects, if the transducer 110 converts sound into an electro-audio signal, it may also be referred to herein as a microphone. In some aspects, the transducer 110 may be coupled to an inner wall 112 and is considered to divide the internal chamber 106 into a front volume chamber 106A and a rear volume chamber 106B surrounding the transducer 110. When the transducer 110 is a loudspeaker, the front volume chamber 106A may be formed as a chamber having a first volume (V1) surrounding the sound output surface or surface 110A of the transducer 110. The front volume chamber 106A (and the first volume V1) may be considered acoustically coupled to or otherwise open to the acoustic port 108. In this respect, sound pressure waves output from the surface 110A of the transducer 110 can pass through the front volume chamber 106A and exit through the acoustic port 108 to reach the surrounding environment 112. The rear volume chamber 106B may have a second volume (V2) and surround the rear side of the transducer 110 (e.g., the side of the transducer 110 opposite to the surface 110A).

[0031] It has been recognized that, for example, the size, volume, pressure, or other aspects of the front volume chamber 106A or the rear volume chamber 106B can affect the acoustic performance of the transducer 110. Therefore, modifying the size, volume, and / or pressure of the front volume chamber 106A and / or the rear volume chamber 106B can be used to tune the acoustic performance of the transducer 110. For example, in some cases, it may be desirable for the front volume chamber 106A and / or the rear volume chamber 106B to be isolated from or sealed (e.g., with high impedance) from the surrounding environment 112 to achieve desired acoustic performance. In other cases, it may be desirable for the front volume chamber 106A and / or the rear volume chamber 106B to have a very open path (e.g., with low impedance) and a certain amount of leakage to the surrounding environment 112. In yet another aspect, it may be desirable for the front volume chamber 106A to have leakage or otherwise be open to the rear volume chamber 106B.

[0032] Accordingly, valve assemblies or valves 114, 116, and / or 118 may also be provided to discharge from the associated chambers. Valves 114, 116, and / or 118 may open and / or close through-holes or openings 120 from the front volume chamber 106A and / or the rear volume chamber 106B to the surrounding environment 112, or through-holes or openings 120 between the front volume chamber 106A and the rear volume chamber 106B. Typically, valve 114 may open and / or close the opening 120 forming through the wall 104 between the front volume chamber 106A and the surrounding environment 112. In other words, when valve 114 is open, the front volume chamber 106A may leak or discharge to the surrounding environment 112, and when valve 114 is closed, it prevents said leakage or discharge. Leakage or discharge from the front volume chamber 106A may be desirable if, for example, device 100 is an in-ear headphone sealed inside the user's ear, but a more open feel is desired. Valve 116 can open and / or close the opening 120 through the wall 104 between the rear volume chamber 106B and the surrounding environment 112. In other words, when valve 116 is open, the front volume chamber 106A can leak or discharge into the rear volume chamber 106B, and when valve 116 is closed, it prevents said leakage or discharge. Valve 118 can open and / or close the opening 120 through the wall 112 between the front volume chamber 106A and the rear volume chamber 106B. In this respect, when valve 118 is open, the rear volume chamber 106B can leak or discharge into itself, and when valve 118 is closed, it prevents said leakage or discharge. In another aspect, it is anticipated that one or more of valves 114, 116, 118 may be used to open and / or close openings (e.g., opening 120) to another type of acoustic chamber, such as openings to one or more acoustic resonators or attenuators connected to one or more of the previously discussed chambers or ports of the transducer.

[0033] In one aspect, one or more of valves 114, 116, and 118 may be electromechanical valves that open and / or close in response to an applied voltage. In this aspect, valves 114, 116, and 118 may be dynamically actuated to control leakage. In some aspects, one or more of valves 114, 116, and 118 may be microelectromechanical systems (MEMS) actuators or valves. Valves 114, 116, and 118 may be the same or different. In some aspects, one or more valves may provide the advantages of: bi-stability, low-power switching from on / off states, digitization for controlling the percentage or amount of open area for discharge, and / or silent operation. Reference will now be made to... Figures 2 to 8B Describe several representative configurations used for valves 114, 116, and 118.

[0034] Representatively, Figure 2 Showing from Figure 1 An enlarged top perspective view of a representative valve. In this respect, Figure 2 A valve 114 is shown for opening / closing an opening 120 formed in the housing wall 104. However, it should be understood that while valve 114 is specifically discussed, one or more of valves 116 and / or 118 may be identical to valve 114, and thus the description provided herein also applies. Figure 1 This is not any other valve disclosed herein. As can be seen from this view, opening 120 includes a plurality of openings 220, and valve 114 includes a plurality of flaps 214 configured to open / close a corresponding one of the openings 220. Typically, the openings 220 can be an array of openings 220 that together constitute opening 120. In this respect, the openings 220 can be relatively small, for example, from about 1 mm to about 3 mm. Similarly, valve 114 includes an array of flaps 214 positioned above a corresponding one of the openings 220 to open / close each opening 220 as needed. For example, the combination of openings 220 and flaps 214 can constitute a 4×4 valve array, as shown, but more or fewer valves may be included in this array. For example, valves can be arranged in 5×5 arrays, 6×6 arrays, etc. However, it should be understood that valves may be arranged or patterned in ways other than arrays as needed. Furthermore, it should be understood that although a square opening 120 and / or fin 214 are shown, other polygonal or non-polygonal shapes and sizes of opening 120 and / or fin 214 (e.g., triangular, rectangular, circular, etc.) are conceivable. The size and shape of opening 120 and fin 214 should be complementary, such that fin 214 has a sufficient size and / or shape to cover opening 220 in a closed configuration and to reveal opening 220 in an open configuration. It is also understood that, in some respects, each of fins 214 can be individually controlled by applying a voltage, such that some fins can be opened (e.g., not covering the corresponding opening 220), while other fins can be closed (e.g., covering the corresponding opening 220), depending on the desired emission level. The opening and / or closing of fins 214 can be controlled by applying a voltage in parallel or individually to provide variable impedance control. For example, in some respects, applying voltage can be used to open fin 214, but once open, it can be considered "latched" and can remain latched while reducing power to almost zero. In this respect, valve 114 consumes a relatively low amount of power when transitioning between open / closed states or configurations.

[0035] Representatively, Figures 3A to 3B Showing from Figure 2 A cross-sectional side view of one aspect of the valve assembly. Specifically, Figures 3A to 3B Showing from Figure 2This describes a representative aspect of valve 114. However, it should be understood that while valve 114 is specifically discussed, one or more of valves 116 and / or 118 may be identical to valve 114, and thus the description provided herein also applies to any other valve disclosed herein. Referring now to valve 114, it can be seen from this view that valve 114 includes at least one flap 214 connected to support member 302 via hinge 306. It should be recognized that although the term "flap" is used herein, flap 214 can be any structure suitable for opening and / or closing opening 220 as discussed herein. Flap 214 and / or support member 302 may include materials that allow flap 214 to open and / or close relative to opening 220 when voltage and electrostatic forces are applied. Typically, flap 214 may include a first material layer 214A made of metallic material and a second material layer 214B made of structural material. In some aspects, the flap 214 may also include an optional material layer 214C, which is identical to the second material layer 214B, and a first material layer 214A may be sandwiched between layers 214B and 214C. The materials of layers 214A to 214B and the optional layer 214C can be any MEMS material. For example, the first material layer 214A may be made of a metallic material, including but not limited to gold, aluminum, etc. In some aspects, the first material layer 214A may be referred to herein as an electrode layer, or may include electrodes. The second material layer 214B and material layer 214C may be made of structural materials, including but not limited to polycrystalline silicon, silicon nitride, silicon carbide, monocrystalline silicon, or generally polymer MEMS materials. The first material layer 214A and the second material layer 214B may be fixedly attached to each other (e.g., using adhesives during processing operations) to form the flap 214. In some aspects, material layer 214C may be fixedly attached to the side of the first material layer 214A opposite to the second material layer 214B to provide environmental protection and / or better stress control of the flap 214. The flap 214 may include a first end 310 that is considered to be freely movable between open and / or closed positions, and a second end 312 coupled to hinge 306 and driving the free end 310 to move. In some aspects, hinge 306 may include a spring or biasing mechanism 314 that biases the flap 214 toward a closed or horizontal position in which the flap 214 covers the opening 220, such as... Figure 3A As shown. In this respect, in Figure 3AIn the static state shown (e.g., without any applied voltage), the flap 214 will remain closed or otherwise positioned such that it is covering the opening 220. However, applying a sufficient voltage to the flap 214 will create an attractive force between the flap 214 and the support member 302, overcoming the biasing force of the hinge 306. This, in turn, causes the flap 214 to move or rotate (as indicated by the arrow) toward the support member 302 to an open position (or vertical position), in which it does not cover the opening 220 and is latched to the support member 302 due to electrostatic force, as shown. Figure 3B As shown.

[0036] In this respect, the support member 302 may include a material that allows the flap 214 to rotate toward and latch onto the support member 302 when a force is applied. Typically, the support member 302 may be a vertical extension (or wall) of a substrate or housing wall and includes an insulating material 308 attached to the side or surface facing the flap 214. For example, the support member 302 may be considered to extend perpendicular to the opening 220, as shown. In some aspects, the support member 302 may be made of monocrystalline silicon, quartz, or glass, and the insulating material 308 may be, for example, a layer of alumina or silicon dioxide. When a voltage is applied to the flap 214, the voltage will slowly begin to apply a force to the flap 214. The voltage may be continuously increased until an attractive force is generated that causes the flap 214 to move or rotate toward and latch onto the support member 302. It should also be understood that once latched, the flap 214 can remain latched while the power is reduced to almost zero due to electrostatic forces. However, once the voltage drops to a certain threshold, the spring / mechanical force of hinge 306 will overcome the electrostatic force, causing the flap 214 to rotate back. Figure 3A The closed position is shown. In this respect, it is understood that, in order to open / close flap 214, there is a critical voltage available for maintaining flap 214 open, and when the voltage is reduced, there is a certain hysteresis that occurs, allowing flap 214 to remain latched for a period of time using the generated electrostatic force. However, at some point, this is overcome by the biasing force of hinge 306, and flap 214 will return to the closed position. For example, to open flap 214, up to about 50 volts can be applied to flap 214, which can then be reduced to 40 volts while flap 214 remains latched. Upon further reducing the voltage to 30 volts, flap 214 may remain latched for a period of time due to the hysteresis until the spring force finally overcomes any remaining force, causing flap 214 to rotate back to the closed position. In some aspects, the device may have an application-specific integrated circuit (ASIC) 222 that is adjacent to and connected to flap 214 and is used to apply the voltage necessary for dynamic control of flap 214.

[0037] Referring now in more detail to support member 302, in some aspects, support member 302 may be a wall or structure extending from housing wall 104 into the internal cavity 106 defined by housing wall 104. For example, support member 302 may be a wall or structure coupled to housing wall and / or a base or other material in which valve assembly is implemented, or formed of housing wall and / or a base or other material in which valve assembly is implemented. Support member 302 may extend vertically from a portion of housing wall 104 defining opening 220. In some aspects, another support member 304 may also be provided and extend vertically from a portion of housing wall 104 defining opening 220. Support members 302 and 304 may surround opening 220. In some aspects, support members 302, 304 may be an integrally formed wall or structure partially or completely surrounding opening 220. In this respect, support members 302, 304 may form an internal cavity below opening 220, and the flap 214 may be received therein when it moves toward support member 302 (e.g., to an open or vertical position), as previously discussed. Figure 3B As shown. As from Figure 3A As can be further seen, when the fin 214 is closed, the internal cavity 106 of the housing is closed or sealed from the surrounding environment 112. On the other hand, when the fin 214 is in the open position, such as Figure 3B As shown, the internal chamber 106 is open to or shares volume with the surrounding environment 112. As previously described, the opening and closing of the flaps 214 can be dynamically controlled. Additionally, refer to... Figure 2 Each vane 214 in the vane array constituting valve 114 can be individually controlled, thereby allowing selection of the total open area to match the desired leakage. For example, if maximum opening or leakage is desired, all vanes 214 can be opened, while if less leakage is desired, some vanes 214 can be opened and others can be closed.

[0038] Figures 4A to 4B Showing from Figure 2 A cross-sectional side view of another side of the valve assembly. Specifically, Figures 4A to 4B Showing from Figure 2 Representative aspects of valve 114. Figures 4A to 4B The valve 114 shown is basically similar to the reference valve. Figures 3A to 3BThe valve is described because it includes a flap 214 connected to a support member 302 via a hinge 306. Similar to the flaps previously discussed, flap 214 may include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). The support member 302 may include an insulating material 308 attached to the side or surface of the support member 302 facing the flap 214. In this respect, when a voltage is applied as previously discussed, it will cause the flap 214 to rotate toward the support member 302 in the direction of the arrow. The flap 214 rotates until it contacts the support member 302 and latches onto the support member 302, as previously discussed.

[0039] However, in this configuration, support member 302 (and support member 304) may include an angled, inclined, or tapered configuration, such that the distance that the flap 214 must move to contact and latch onto support member 302 is not tapered relative to the support member (e.g., as...). Figures 3A to 3B The distance (shown in the diagram) is reduced. Specifically, the inner surface 402 of the support member 302 facing the inner chamber may be inclined outward at the end furthest from the flap 214. For example, the support member 302 may have a first width dimension (W1) at the end closest to the flap 214 and increase to a second width dimension (W2) at the end furthest from the flap 214. The inclination or angle of the support member 302 reduces the distance between the support member 302 and the support member 304 from a first distance D1 (at the top of the chamber) to a second distance D2 (at the bottom of the chamber). This further reduces the distance that the flap 214 must move to contact the support member 302 and reach the open / latched position. For example, in the previous configuration, the flap 214 must move across the entire distance D1 to contact the support member, while in this configuration, the flap 214 only needs to move across the distance D2 to contact the support member 302. It should also be understood that, since the distance that the vane 214 needs to move to reach the open / latch position is reduced, the voltage required to reach the open / latch position can also be reduced.

[0040] Now for reference Figures 5A to 5B , Figures 5A to 5B A side perspective view of another side of the valve assembly is shown. Specifically, Figures 5A to 5B Showing from Figure 2Representative aspects of valve 114. Valve 114 is similar to the valves previously discussed; however, in this configuration, valve 114 includes a plurality of flaps 514A, 514B, 514C, 514D, 514E, and 514F arranged above opening 220. Opening 220 may be formed in housing wall 104 and, in this respect, has a hexagonal shape as shown. Each of the flaps 514A-F may be triangular in shape and is attached at its widest end to housing 104 and / or surrounding support members 502, 504, 506 via hinge 524. In this respect, the point of each of the triangular flaps 514A-F faces the center of opening 220, and when they are arranged together above opening 220 as shown, they form a hexagonal shape similar to opening 220. Figure 4A Shown are flaps 514A-F in a closed configuration, in which they cover or are otherwise considered to close opening 220, such that the internal chamber 106 is closed from the surrounding environment 112. To open flaps 514A-F, a voltage as previously discussed is applied, causing flaps 514A-F to rotate inward and toward the inner surface of a corresponding one of the support members 502, 504, 506 to which they are attached. Flaps 514A-F, hinge 524, and support members 502, 504, 506 can be substantially similar to the flaps, hinges, and support members previously discussed, thereby generating an electrostatic force when the voltage is applied, which pulls flaps 514A-F inward toward support members 502, 504, 506. In this respect, although not shown, an insulating layer can be formed on the intersecting surfaces of support members 502, 504, 506, similar to those previously referenced. Figures 3A to 3B Those discussed. Then, the flaps 514A-F can remain latched to one of the corresponding support members 502, 504, 506 until the force is less than the biasing force of hinge 524. At that point, the biasing force of hinge 524 overcomes the electrostatic force and turns the flaps 514A-F back to their original positions. Figure 4A The closed configuration is shown. As previously discussed, each of the vanes 514A-F can be individually controlled, thus all can be closed, all can be opened, or only some of the vanes 514A-F can be closed / opened, depending on the desired leakage level. It should also be understood that although a single valve assembly 114 and opening 220 are shown in housing 104, as previously referenced... Figure 2 The array of valve assembly 114 and opening 220 under discussion.

[0041] Figures 6A to 6B Showing from Figure 2 A cross-sectional side view of another side of the valve assembly. Specifically, Figures 6A to 6B Showing from Figure 2 Representative aspects of valve 114. Figures 6A to 6BThe valve 114 shown is basically similar to the reference valve. Figures 3A to 4B The valve is described because it includes a flap 214 connected to a support member 302 via a hinge 306. Similar to the flaps previously discussed, flap 214 may include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). The flap 214 is attached to the support member 302 at one end 312 via the hinge 306, and the other end 310 near the support member 304 can be considered a free end. The support member 302 may include an insulating material or layer 308 attached to the side facing the flap 214.

[0042] However, in this configuration, the wing 214 moves in the opposite direction when a voltage is applied to close the opening 220. Typically, the wing 214 can be connected to the support member 302 via a reverse hinge 306. The reverse hinge 306 can orient the wing 214 towards... Figure 6A The horizontal position shown is offset, which in this case is the open position. The support member 304 may include a second upper portion or latching portion 604 perpendicular to the first lower portion, which extends perpendicular to the opening 220, as shown. For example, portion 604 may be arranged such that it extends above the free end 310 of the flap 214 and parallel to the opening 220, while the lower portion of the support member 304 extends below the opening 220. Typically, in this aspect, the support member 304 may be an "L"-shaped structure, wherein the latching portion 604 extends above the free end 310 of the flap 314, and the remainder extends below the opening 220. The latching portion 604 may include an insulating material 608 and a structural material 608. When a voltage is applied, the flap 214... Figure 6A The open (horizontal) position shown rotates upward toward the latch portion 604. The flap 214 rotates upward until it contacts the latch portion 604, which in turn closes the opening 220, as... Figure 6B As shown. The wing 214 can remain in the closed position until the electrostatic force is overcome by the biasing force of the hinge 306, causing the wing 214 to move back. Figure 6A The open (horizontal) position is shown. Because it is similar to... Figures 4A to 4B With this configuration, the wing 214 does not need to move as far to contact the latch portion 604; therefore, the voltage required to change the wing 214 from the open position to the closed position can be reduced. Additionally, once in... Figure 6B In the closed or latched position, the flap 214, as previously discussed, will remain in place for a period of time without the application of voltage, thus power consumption is virtually zero when held in the closed / latched position. Further, it can be understood that another advantage of this configuration is that the latch portion 604 acts as a mechanical stop to prevent mechanical failure under high pressure input.

[0043] Figures 7A to 7B Showing from Figure 2 A cross-sectional side view of another side of the valve assembly. Specifically, Figures 7A to 7B Showing from Figure 2 Representative aspects of valve 114. Figures 7A to 7B The valve 114 shown is basically similar to the reference valve. Figures 3A to 3B The valve described includes a flap 214 connected to a support member 302 via a hinge 306. Similar to the flaps previously discussed, flap 214 may include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). In this configuration, flap 214 also includes a third material layer 714B and a fourth material layer 714B. For example, the third material layer 714B may be a piezoelectric layer, and the fourth material layer 714B may be a metallic layer. In some aspects, the first material or metallic layer 214A may be considered a common electrode, and the fourth material or metallic layer 714A may be considered a counter electrode. Similar to the previously discussed configuration, the assembly may also include a support member 302 and a support member 304. Support member 302 may include an insulating material 308 attached to the side facing flap 214. In this aspect, when a voltage is applied as previously discussed, flap 214 will rotate toward support member 302 in the direction of the arrow. The wing 214 rotates until it contacts the support member 302 and latches onto the support member 302, as previously discussed.

[0044] Referring now more specifically to wing 214, the addition of a third material layer 714A comprising piezoelectric material and a fourth material layer 714B comprising electrodes provides a combined actuation mechanism that further helps reduce voltage requirements. For example, a combination of capacitive / piezoelectric or capacitive / thermal dual piezoelectric wafer actuation mechanisms can be used to actuate wing 214 to reduce voltage requirements. Typically, the piezoelectric layer of the third material layer 714A can provide a significant bending force that can be used to induce initial movement of wing 214 at a reduced voltage. For example, in a configuration without a piezoelectric layer, a relatively significant voltage is required to move wing 214 from a rotation angle of 0–30 degrees. Adding the third material layer 714A, which includes a piezoelectric layer, allows for an initial application of a relatively small voltage, which causes wing 214 to bend slightly due to the deflection of the piezoelectric material. This slight bending provides initial rotational initiation to wing 214 at a lower voltage compared to the previously discussed configuration. After this initial rotational initiation at a reduced voltage, the voltage can be increased to fully rotate wing 214 to the latched position. However, compared to valves without a piezoelectric layer, the total voltage required to open / close the vane 214 is considered to be reduced.

[0045] Figures 8A to 8B Showing from Figure 2 A cross-sectional side view of another side of the valve assembly. Specifically, Figures 8A to 8BShowing from Figure 2 Representative aspects of valve 114. Figures 8A to 8B The valve 114 shown is basically similar to the reference valve. Figures 3A to 3B The valve is described because it includes a flap 214 connected via a hinge 306 to a support member 302 and a second support member 304. The support member 302 may include an insulating layer 308A (e.g., an alumina layer) as previously discussed. Similar to the flaps previously discussed, the flap 214 may include a first material layer 214A (e.g., a metallic material layer) and a second material layer 214B (e.g., a structural material layer). As previously described, when a voltage is applied, the flap 214... Figure 8A The closed (horizontal) configuration shown is transformed into Figure 8B The open (vertical) configuration shown.

[0046] However, in this configuration, valve 114 also includes a counter-blade 814 that counteracts the net air pressure generated by the valve during transitions to a hollow sound that may occur due to the opening / closing of blade 214. Typically, in some aspects, when blade 214 is open, it may push some air toward the chamber 802 to which it is connected, which may be audible to the user. To avoid this, a second blade 814 may be provided to open in a reverse and / or counteracting arrangement to counteract this airflow from blade 214. In this respect, blade 814 may be connected to the bottom end 816 of support member 304 via hinge 806. Blade 814 may be similar to the previously discussed blade 214, as it includes a first material layer 814A (e.g., a metallic material layer) and a second material layer 814B (e.g., a structural material layer). Additionally, similar to the support member 302 to which blade 214 is connected, the support member 304 to which blade 814 is connected may include an insulating layer 308B. The hinge 806 connecting the flap 814 to the support member 304 can be similar to hinge 306, as it includes a biasing mechanism or spring 808 for biasing the flap 814 to a closed position. However, in this configuration, hinge 806 operates in the opposite direction to hinge 306 and allows the flap 814 to open / close in the direction opposite to that of the flap 214. Typically, when a voltage is applied, hinge 806 allows the flap 814 to open in the direction of arrow 810 (towards the support member 304), which is opposite to the direction of the flap 214 shown by arrow 812 (towards the support member 302). This is used for transitioning to... Figure 8BIn a representative process during the opening configuration, which counteracts the net air pressure generated by vane 214, vane 814 also opens when vane 214 opens. The flow generated by the opening of both vanes 214 and 814 will form an destructive sound wave. This will further reduce the transition sound pressure level (SPL) to a level inaudible to the user. An exemplary manufacturing process for forming this dual-valve configuration would be to form two MEMS wafers with vanes / hinges at one end and then join them together at the opposite ends.

[0047] As discussed previously, this article references Figures 1 to 8B Any one or more valve assemblies in the disclosed valve assembly can be dynamically controlled by applying a voltage to control the amount of leakage between the chambers or volumes to which they are connected. For example, any one or more valve assemblies in the valve assembly can dynamically open to connect a front or rear volume chamber of the transducer to the surrounding environment surrounding the chamber and / or device housing in which the transducer is implemented. In other aspects, any one or more valve assemblies in the valve assembly can dynamically open to connect a front volume chamber to a rear volume chamber of the transducer. It should also be understood that while the valve assemblies are described as opening / closing the individual chambers associated with the transducer, they can be used to open / close or otherwise connect any chamber in which it is desired to dynamically control leakage between the chambers or different volumes.

[0048] Figure 9 A block diagram of one aspect of the electronics in which the transducer and / or valve assemblies discussed earlier can be implemented is shown. Figure 9 As shown, device 900 can be any type of portable device in which the transducer and / or valve assembly disclosed herein may be expected, such as a handset (e.g., an in-ear handset, hearing aid, etc.), a mobile phone, a personal digital assistant, a portable timer, or other portable device. Device 900 may include storage device 902. Storage device 902 may include one or more different types of storage devices, such as hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory), volatile memory (e.g., battery-based static or dynamic random access memory), etc.

[0049] Processing circuitry 904 can be used to control the operation of device 900. Processing circuitry 904 can be based on a processor, such as a microprocessor and other suitable integrated circuits. Using a suitable arrangement, processing circuitry 904 and storage device 902 are used to run software on device 900, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. Processing circuitry 904 and storage device 902 can be used to implement suitable communication protocols. Communication protocols that can be implemented using processing circuitry 904 and storage device 902 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol – sometimes referred to as...). Protocols for other short-range wireless communication links, such as Protocols, protocols used to process 3G or 4G communication services (e.g., using wideband code division multiple access technology), 2G cellular telephone communication protocols, etc.

[0050] To minimize power consumption, processing circuitry 904 may include power management circuitry to implement power management functions. For example, processing circuitry 904 may be used to adjust the gain settings of amplifiers (e.g., RF power amplifier circuitry) on device 900. Processing circuitry 904 may also be used to regulate the power supply voltage supplied to portions of the circuitry on device 900. For example, a higher DC power supply voltage may be supplied to active circuitry, and a lower DC power supply voltage may be supplied to less active or inactive circuitry. If desired, processing circuitry 904 may be used to implement control schemes in which the power amplifier circuitry is adjusted to accommodate transmission power level requests received from the wireless network.

[0051] Input / output device 906 can be used to allow data to be supplied to device 900 and to allow data to be supplied from device 900 to external devices. Display screens, microphone acoustic ports, speaker acoustic ports, and docking ports are examples of input / output device 906. For example, input / output device 906 may include user input / output device 608, such as buttons, touchscreens, joysticks, click wheels, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, etc. Users can provide commands through user input device 908 to control the operation of device 900. Display and audio device 910 may include a liquid crystal display (LCD) screen or other screen, light-emitting diodes (LEDs), and other components that present visual information and status data. Display and audio device 910 may also include audio equipment, such as speakers, and other devices for creating sound. Display and audio device 910 may include audio-visual interface equipment, such as jacks, and other connectors for external headphones and monitors.

[0052] Wireless communication device 912 may include communication circuitry, such as radio frequency (RF) transceiver circuitry formed by one or more integrated circuits, power amplifier circuitry, passive RF components, an antenna, and other circuitry for processing RF wireless signals. Light (e.g., infrared communication) may also be used to transmit wireless signals. Typically, in the case of a speaker acoustic port, the speaker may be associated with the port and communicate with an RF antenna for transmitting signals from a remote user to the speaker.

[0053] return Figure 9 Device 900 can communicate with external devices such as accessory 914, computing equipment 916, and wireless network 918, as shown in paths 920 and 922. Path 920 may include wired and wireless paths. Path 922 may be a wireless path. Accessory 914 may include headphones (e.g., wireless cellular headphones or audio headsets) and audio-visual equipment (e.g., wireless speakers, game controllers, or other equipment for receiving and playing audio and video content), peripheral devices such as wireless printers or cameras, etc.

[0054] Computing device 916 can be any suitable computer. Using a suitable arrangement, computing device 916 can be a computer with an associated wireless access point (router) or an internal or external wireless network card establishing a wireless connection with device 900. The computer can be a server (e.g., an internet server), a local area network computer with or without internet access, a user's own personal computer, a peer-to-peer device (e.g., another portable electronic device), or any other suitable computing device.

[0055] Wireless network 918 may include any suitable network equipment, such as cellular phone base stations, cellular towers, wireless data networks, computers associated with the wireless network, etc. For example, wireless network 918 may include network management equipment that monitors the wireless signal strength of wireless handheld devices (cellular phones, handheld computing devices, etc.) communicating with network 918.

[0056] While certain aspects have been described and illustrated in the accompanying drawings, it should be understood that such aspects are merely illustrative of the broad disclosure and not limiting, and that this disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications will be apparent to those skilled in the art. Therefore, the description is to be regarded as exemplary and not restrictive. For example, although a loudspeaker is specifically disclosed herein, the valves disclosed herein can be used with other types of transducers (e.g., microphones). Furthermore, in some aspects, the valve can be used to open / close an opening to an acoustic resonator or attenuator coupled to the transducer. Moreover, although portable electronic devices such as mobile communication devices are described herein, any of the valve and transducer configurations previously described can be implemented in tablet computers, personal computers, laptop computers, notebook computers, headphones, etc. Furthermore, to assist the Patent Office and any reader of any patent granted with respect to this application in interpreting the appended claims, the applicant wishes to indicate that they do not intend any appended claims or claim elements to reference 35U.SC112(f) unless “means for…” or “steps for…” is expressly used in a particular claim.

Claims

1. A portable electronic device comprising: a housing having a housing wall forming an interior chamber and a sound output port to an ambient environment; a transducer positioned within the interior chamber and dividing the interior chamber into a front volume chamber and a back volume chamber, the front volume chamber coupling a first side of the transducer to the sound output port, the back volume chamber coupled to a second side of the transducer; and an electro-mechanical valve including a flap coupled to the housing wall by a hinge and operable to rotate about the hinge to open and close a through hole to the interior chamber, the front volume chamber, or the back volume chamber, and the hinge biases the flap to a closed position, wherein the housing wall has a first width that increases to a second width in a direction away from the hinge to form a ramped surface and reduce a voltage required to transition the flap to an open position in which the flap is coupled to the ramped surface, and wherein the flap includes an electrode layer fixedly attached to a layer of structural material, and the flap maintains a flat shape when rotated about the hinge to close the through hole.

2. The portable electronic device of claim 1, wherein the flap is one of a plurality of flaps operable to open or close the through hole to the ambient environment.

3. The portable electronic device of claim 1, wherein the through hole includes a first opening and a second opening, and the flap is a first flap operable to open and close the first opening, and a second flap is operable to open and close the second opening.

4. The portable electronic device of claim 1, wherein the hinge couples the flap to a first portion of the housing wall arranged perpendicular to the flap, the flap being perpendicular to the first portion when the through hole is closed.

5. The portable electronic device of claim 4, wherein upon application of the voltage, the flap transitions from a closed position to an open position in which the flap is coupled to the ramped surface by an electrostatic force.

6. The portable electronic device of claim 4, wherein the housing wall further includes a second portion extending perpendicular to the first portion and positioned above the flap, and upon application of a voltage, the flap is coupled to the second portion to close the through hole.

7. The portable electronic device of claim 4, wherein the flap further includes a piezoelectric layer coupled to the electrode layer.

8. The portable electronic device of claim 7, wherein the electrode layer is a first electrode layer, and the flap further includes a second electrode layer coupled to an opposite side of the piezoelectric layer from the first electrode layer.

9. The portable electronic device of claim 1, wherein the valve is a first valve, and the device further includes a second valve having a flap operable to open in an opposite direction from the flap of the first valve to cancel a net air pressure generated by the first valve when transitioning to an open position. ​ 10. A valve assembly for a portable electronic device, the valve assembly comprising: a support member coupled to a housing opening, the support member having an insulating layer; and an electromechanical flap movably coupled to the support member by a hinge, the electromechanical flap including an electrode layer fixedly attached to a layer of structural material, and wherein upon application of a voltage, the electromechanical flap is operable to rotate about the hinge while maintaining a flat shape to transition between a closed configuration in which the electromechanical flap covers the housing opening and an open configuration in which the electromechanical flap uncovers the housing opening, and the hinge biases the flap to the closed configuration, wherein the support member includes a first width that increases to a second width in a direction away from the hinge to form a sloped surface and reduce a voltage required to transition the flap to the open configuration in which the flap is coupled to the sloped surface.

11. The valve assembly of claim 10, wherein the layer of structural material includes polysilicon, silicon nitride, or single crystal silicon.

12. The valve assembly of claim 10, wherein the layer of structural material includes a piezoelectric material.

13. The valve assembly of claim 12, further comprising a third material layer, wherein the third material layer includes a metal.

14. The valve assembly of claim 10, wherein the insulating layer is coupled to the sloped surface and the flap rotates about the hinge toward the insulating layer to the open configuration.

15. The valve assembly of claim 10, wherein the insulating layer is coupled to a surface of the support member that extends parallel to the housing opening and is positioned above the flap, and wherein the flap rotates about the hinge toward the insulating layer to the closed configuration.

16. The valve assembly of claim 10, wherein the electromechanical flap includes a first electromechanical flap and a second electromechanical flap.

17. The valve assembly of claim 16, wherein the first electromechanical flap and the second electromechanical flap are independently operable to transition between a closed configuration in which the first electromechanical flap and the second electromechanical flap cover the housing opening and an open configuration in which the first electromechanical flap and the second electromechanical flap rotate toward the insulating layer of the support member.

18. The valve assembly of claim 16, wherein the opening includes a first opening and a second opening, and the first electromechanical flap is operable to transition between a closed configuration in which the first electromechanical flap covers the first opening and the open configuration, and the second electromechanical flap is operable to transition between a closed configuration in which the first electromechanical flap covers the second opening and the open configuration.

19. The valve assembly of claim 16, wherein the support member includes a first end and a second end opposite the first end, the first electromechanical flap is coupled to the first end, the second electromechanical flap is coupled to the second end, and wherein the second electromechanical flap opens in an opposite direction from the first electromechanical flap when transitioning to the open configuration to counteract the net air pressure created by the first electromechanical flap.

Images