Thermal sensitive printing sheet integrated circuit etching pre-treatment apparatus

Abstract

The present application relates to the technical field of heat-sensitive printing sheet production, and discloses a heat-sensitive printing sheet integrated circuit etching pre-treatment device, which comprises a device shell, an opening and closing assembly, at least two partition plates, a substrate placing table with lifting, rotating and overturning functions, a vacuum adsorption assembly, a heating and baking component, a glue application mechanism, a multifunctional spraying mechanism and a waste liquid collecting and discharging component. The device shell is sequentially divided into a substrate processing cavity, a heating cavity and a waste liquid collecting cavity from top to bottom by the at least two partition plates. The substrate placing table is installed with the vacuum adsorption assembly. The heating and baking component is used for transferring the heat of an electric heater to the inside of the substrate processing cavity. The glue application mechanism is used for dripping glue solution on the surface of a heat-sensitive printing sheet substrate. The multifunctional spraying mechanism is used for spraying the substrate. The waste liquid collecting and discharging component comprises a plurality of liquid falling pipes. The inside of the device shell is installed with a liquid discharging control member. The bottom of the waste liquid collecting cavity is communicated with a liquid discharging pipe provided with a valve. The present application has high processing efficiency and saves space by using an integrated device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat-sensitive printing sheet production, in particular to a heat-sensitive printing sheet integrated circuit etching pre-treatment device. BACKGROUND

[0002] In the production of heat-sensitive printing sheets, integrated circuits need to be printed on the heat-sensitive printing sheet substrate. The printing of integrated circuits requires a complete set of complex processes such as gluing, exposure, development, and etching. The existing heat-sensitive printing sheet substrate integrated circuits usually use multiple independent devices to implement each process step, and a matching conveying mechanism is provided to move the heat-sensitive printing sheet substrate. In particular, when cleaning, developing, rinsing, and removing the glue of the heat-sensitive printing sheet substrate, different cavities or grooves are used to spray or immerse the heat-sensitive printing sheet substrate. The equipment occupies a large space area, and after the cleaning process and the development and rinsing process, the heat-sensitive printing sheet substrate needs to be dried. The drying equipment and the spraying equipment are independent of each other. The conveying process of the substrate occupies a considerable part of the substrate printing time. During the transfer process of the cleaned or rinsed substrate, the residual liquid on the surface of the substrate will drip onto the surface of the equipment, causing stains. Some solutions may corrode the equipment material, reducing the service life of the equipment. If the solution is dried additionally, it will further increase the processing time of the heat-sensitive printing sheet substrate.

[0003] Based on the above considerations, we propose a heat-sensitive printing sheet integrated circuit etching pre-treatment device. An integrated device is used to prepare the substrate before etching, reducing the movement of the substrate and the occupied space of the substrate processing equipment. SUMMARY

[0004] (I) Technical problems solved

[0005] In view of the deficiencies of the prior art, the present application provides a heat-sensitive printing sheet integrated circuit etching pre-treatment device to solve the problems of the prior art presented in the background.

[0006] (II) Technical solutions

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a heat-sensitive printing sheet integrated circuit etching pre-treatment device, comprising a device shell, further comprising:

[0008] An opening and closing assembly, the opening and closing assembly comprising a first electric cylinder and a closing plate, a taking and placing opening for taking and placing the heat-sensitive printing sheet substrate is formed on the device shell, the first electric cylinder is installed on the top of the device shell, the output end of the first electric cylinder is fixedly connected with the closing plate, and the closing plate is located at the taking and placing opening and closes the same;

[0009] At least two partition plates are fixedly connected in the interior of the equipment shell, and sequentially divide the equipment shell from top to bottom into a substrate processing cavity, a heating cavity and a waste liquid collecting cavity;

[0010] The substrate placing table has lifting, rotating and overturning functions, and is provided with a vacuum adsorption assembly for adsorbing and fixing the heat-sensitive printing sheet substrate.

[0011] The heating and baking part comprises an electric heater, a heat-conducting plate and a fan, the electric heater is installed in the interior of the heating cavity, the heat-conducting plate is fixedly installed on the top of the electric heater and used for transferring the heat of the electric heater to the interior of the substrate processing cavity, the top end of the heat-conducting plate is flush with the bottom wall of the substrate processing cavity, and the fan is installed in the interior of the substrate processing cavity.

[0012] The glue coating mechanism is used for dripping glue solution on the surface of the heat-sensitive printing sheet substrate, and comprises a photoresist storage tank, a conveying pump and a dripping head, the photoresist storage tank is installed on the equipment shell, the suction inlet of the conveying pump is communicated with the photoresist storage tank, and the delivery outlet of the conveying pump is communicated with the dripping head.

[0013] The multifunctional spraying mechanism comprises a clean water bucket and a plurality of solution storage tanks, the clean water bucket and the solution storage tanks are installed on the top end of the equipment shell, cleaning solution, developing solution, rinsing solution and degumming solution are respectively contained in the interiors of corresponding solution storage tanks, the bottom of the solution storage tank is communicated with a liquid outlet pipe provided with a valve, the liquid outlet pipe extends into the interior of the equipment shell and is communicated with a spray head, a water pump is installed on the top end of the equipment shell, the water pumping end of the water pump is communicated with the bottom of the water bucket, the water outlet end of the water pump extends into the interior of the equipment shell and is communicated with a water spraying pipe, and the bottom of the water spraying pipe is communicated with a plurality of spray nozzles.

[0014] The waste liquid collecting and discharging part comprises a plurality of liquid falling pipes, the top and bottom of the liquid falling pipe are respectively communicated with the substrate processing cavity and the waste liquid collecting cavity, the interior of the equipment shell is provided with a liquid discharging control member for opening and closing the liquid falling pipe to make the solution fall, and the bottom of the waste liquid collecting cavity is communicated with a liquid discharging pipe provided with a valve.

[0015] In order to realize the lifting, rotating and overturning of the substrate placing table, a lifting assembly, a rotating assembly and an overturning assembly are fixedly installed in the interior of the equipment shell.

[0016] The lifting assembly is used for adjusting the height of the thermal printing sheet substrate, realizing the conversion of the states of the thermal printing sheet substrate such as spraying, immersion and baking, and the lifting assembly comprises a second electric cylinder and a rotating seat, the second electric cylinder is fixedly installed in the interior of the substrate processing cavity, and the rotating seat is fixedly installed at the output end of the second electric cylinder.

[0017] The rotating assembly is used for driving the substrate placing table and the thermal printing sheet substrate to rotate, and performing the glue uniformizing operation, the rotating assembly comprises a first motor, a driving gear and a driven gear, the first motor is fixedly installed on the rotating seat, the driving gear is fixedly connected with the output end of the first motor, the driven gear is rotationally connected with the rotating seat, and the driven gear is engaged with the driving gear.

[0018] The turnover assembly is used for turning over the substrate placing table and the thermal printing sheet substrate in the vertical direction, and adjusting the angle of the thermal printing sheet substrate in cooperation with the rotating assembly, so that the solution is more uniformly sprayed on the surface of the thermal printing sheet substrate, the turnover assembly comprises a connecting frame and a second motor, the connecting frame is fixedly connected with the driven gear, the other end of the connecting piece is fixedly connected with the substrate placing table, the substrate placing table is rotationally connected with the connecting frame through a shaft, the second motor is installed on the connecting frame, and the output end of the second motor is fixedly connected with the shaft and used for driving the substrate placing table to turn over.

[0019] In order to position the thermal printing sheet substrate at the center position of the substrate placing table, a positioning piece for positioning the substrate is installed in the interior of the equipment shell, the positioning piece comprises a plurality of third electric cylinders and a plurality of positioning blocks, the positioning blocks are fixedly installed at the output ends of the third electric cylinders, the positioning blocks are in contact with the thermal printing sheet substrate, and are used for positioning the thermal printing sheet substrate, meanwhile, the positioning blocks are in the shape of a pyramid, at least one edge of the positioning blocks is in contact with the thermal printing sheet substrate, and is used for scraping off the edge glue bead of the thermal printing sheet substrate.

[0020] In order to realize the adsorption and fixation of the thermal printing sheet substrate, the vacuum adsorption assembly comprises a vacuum generator and a plurality of vacuum nozzles, the substrate placing table is fixedly installed with a mounting shell, the vacuum generator is installed in the interior of the mounting shell, the plurality of vacuum nozzles are communicated through a plurality of communication pipes, the communication pipes are installed on the substrate placing table through a plurality of clamping rings, and the vacuum generator is communicated with the communication pipes.

[0021] Further, the liquid discharging control piece comprises a fourth electric cylinder and a plurality of sealing blocks, the sealing blocks are in sealing sliding fit with the top of the liquid falling pipe, the fourth electric cylinder is installed in the interior of the equipment shell, a lifting frame is connected with the output end of the fourth electric cylinder, a plurality of connecting rods are fixedly connected with the top of the lifting frame, the connecting rods pass through the liquid falling pipe and are connected with the sealing blocks.

[0022] In order to facilitate the solution accumulation at the liquid falling pipe, realize the quick falling collection of waste solution, the communication between the liquid falling pipe and the substrate processing cavity forms a downward recess, and the sealing block is slidingly installed in the recess.

[0023] For the protection of the fourth electric cylinder, the inside of the waste liquid collecting cavity is fixedly connected with a protective shell, and the fourth electric cylinder is installed in the inside of the protective shell.

[0024] In order to filter the colloid and solid waste in the waste liquid, a plurality of mounting ports are formed on the waste liquid collecting cavity, and a plurality of assembled filter boxes are slidingly installed in the mounting ports. The plurality of assembled filter boxes are assembled in contact with each other to form a large filter box matched with the waste liquid collecting cavity. The bottom of the assembled filter box is provided with a filter screen for filtering the colloid and solid waste in the waste liquid.

[0025] (Three) beneficial effects

[0026] Compared with the known prior art, the application provides a thermal printing sheet integrated circuit etching pretreatment equipment, which has the following beneficial effects:

[0027] In the application, the thermal printing sheet substrate is placed on the substrate placing table, the thermal printing sheet substrate can be fixed by the vacuum adsorption assembly, the thermal printing sheet substrate can be dried and baked by the heating baking part, the thermal printing sheet substrate can be cleaned by the multifunctional spraying mechanism, the glue solution can be dropped on the surface of the thermal printing sheet substrate by the gluing mechanism, the substrate placing table drives the thermal printing sheet substrate to rotate, so that the glue solution is uniformly coated on the surface of the thermal printing sheet substrate, and the multifunctional spraying mechanism sprays developing solution and washing liquid on the thermal printing sheet substrate. Compared with the prior art, the scheme can integrate the gluing, exposure, development and pre-baking process steps in the internal part of the integrated equipment, reduces the transmission of the thermal printing sheet substrate, has higher processing efficiency, and saves space by using the integrated equipment. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can obtain other drawings according to these drawings without creating any creative labor.

[0029] Figure 1 It is a partial sectional view of the three-dimensional structure of the application.

[0030] Figure 2 It is a partial enlarged structure schematic view of A in the application. Figure 1 ​

[0031] Figure 3 is a perspective view of the structure of the present application;

[0032] Figure 4 is a perspective view of the structure of the present application from another angle;

[0033] Figure 5 is a perspective view of the structure of the present application Figure 4 is a partial enlarged view of B in the structure of the present application;

[0034] Figure 6 is a perspective view of the structure of the present application

[0035] Figure 7 is a perspective view of the structure of the present application

[0036] Figure 8 is a perspective view of the structure of the present application Figure 7 is a partial enlarged view of C in the structure of the present application;

[0037] Figure 9 is a perspective view of the structure of the present application

[0038] The numbers in the figures represent respectively:

[0039] 1, device shell; 2, partition plate; 3, base plate placing table; 4, protective shell; 5, assembled filter box;

[0040] 100, opening and closing assembly; 101, first electric cylinder; 102, closing plate;

[0041] 200, heating and baking part; 201, electric heater; 202, heat-conducting plate; 203, fan;

[0042] 300, glue applying mechanism; 301, photoresist storage tank; 302, delivery pump;

[0043] 400, multifunctional spraying mechanism; 401, clean water bucket; 402, solution storage tank; 403, liquid outlet pipe; 404, water pump; 405, water spraying pipe;

[0044] 500, waste liquid collection and discharge part; 501, liquid falling pipe; 502, liquid discharge pipe;

[0045] 600, lifting assembly; 601, second electric cylinder; 602, rotating seat;

[0046] 700, rotating assembly; 701, first electric motor; 702, driving gear; 703, driven gear;

[0047] 800, turnover assembly; 801, connecting frame; 802, second motor;

[0048] 900, positioning member; 901, third electric cylinder; 902, positioning block;

[0049] 1000, vacuum suction assembly; 1001, vacuum generator; 1002, vacuum suction nozzle;

[0050] 1100, liquid discharge control member; 1101, fourth electric cylinder; 1102, sealing block. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0052] EMBODIMENT

[0053] Please refer to Figures 1 to 9 , the heat-sensitive printing sheet integrated circuit etching pre-treatment equipment includes equipment shell 1, opening and closing assembly 100, substrate placing table 3, heating baking part 200, gluing mechanism 300, multifunctional spraying mechanism 400 and waste liquid collection and discharge part 500, at least two partition plates 2 are fixedly connected in the inside of the equipment shell 1, the equipment shell 1 is sequentially separated into a substrate processing cavity, a heating cavity and a waste liquid collection cavity from top to bottom, a plurality of observation openings are provided at the substrate processing cavity, and transparent observation windows are installed in the observation openings, so that the processing condition of the heat-sensitive printing sheet substrate can be observed.

[0054] Please refer to Figure 1 , Figure 3 and Figure 4 , the substrate processing cavity of the equipment shell 1 is provided with a taking and placing opening for taking and placing the heat-sensitive printing sheet substrate, and the substrate processing cavity is provided with an opening and closing assembly 100 for opening and closing the taking and placing opening, the opening and closing assembly 100 includes a first electric cylinder 101 and a sealing plate 102, the first electric cylinder 101 is installed at the top of the equipment shell 1, the output end of the first electric cylinder 101 and the sealing plate 102 are fixedly connected, the sealing plate 102 is located at the taking and placing opening and seals the same, the sealing plate 102 can be lifted by the first electric cylinder 101, the sealing of the taking and placing opening can be removed, the heat-sensitive printing sheet substrate can be taken and placed, the sealing plate 102 can be lowered to seal the taking and placing opening, so that the spatter of the solution in the cleaning, developing or washing process is avoided, the dust-free environment in the inside of the equipment shell 1 is maintained, and the printing of the heat-sensitive printing sheet substrate is not affected.

[0055] Please refer to Figures 7 to 8 The substrate placing table 3 has the functions of lifting, rotating and overturning. The substrate placing table 3 is provided with a vacuum suction assembly 1000 for fixing and suction of the thermal printing sheet substrate. The vacuum suction assembly 1000 comprises a vacuum generator 1001 and a plurality of vacuum nozzles 1002. The substrate placing table 3 is fixedly provided with a mounting shell. The vacuum generator 1001 is mounted in the mounting shell. The plurality of vacuum nozzles 1002 are communicated through a communication pipe which is mounted on the substrate placing table 3 through a plurality of clamping rings. The vacuum generator 1001 is communicated with the communication pipe. The vacuum generator 1001 is provided with a matched mobile power supply. The mobile power supply is also mounted in the mounting shell. The mounting shell is a sealed structure and can provide waterproof protection for the vacuum generator 1001 and the mobile power supply. Another port of the vacuum generator 1001 is communicated with a pipeline. A hole matched with the pipeline is formed in the mounting shell. The pipeline extends to the outside to realize the communication between the vacuum generator 1001 and the outside. The thermal printing sheet substrate is placed on the top of the plurality of vacuum nozzles 1002. The vacuum nozzles 1002 are vacuumized by the vacuum generator 1001. The thermal printing sheet substrate is suctioned on the substrate placing table 3. The air flow direction is changed by the valve of the vacuum generator 1001 to change the suction into blowing. The suction of the thermal printing sheet substrate can be released. The thermal printing sheet substrate can be taken and placed. The heights of the plurality of vacuum nozzles 1002 are the same to ensure the levelness and stability of the thermal printing sheet substrate.

[0056] In order to position the thermal printing sheet substrate at the center position of the substrate placing table 3, a positioning member 900 for positioning the substrate is mounted in the equipment shell 1. The positioning member 900 comprises a plurality of third electric cylinders 901 and a plurality of positioning blocks 902. The positioning blocks 902 are fixedly mounted on the output ends of the third electric cylinders 901. The positioning blocks 902 are in contact with the thermal printing sheet substrate for positioning the thermal printing sheet substrate. Meanwhile, the positioning blocks 902 are in the shape of a pyramid. At least one edge of the positioning blocks 902 is in contact with the thermal printing sheet substrate for scraping off the edge beads of the thermal printing sheet substrate. The extension direction of the third electric cylinders 901 is the radial direction of the substrate placing table 3 and the thermal printing sheet substrate. The positioning blocks 902 can be driven to approach or move away from the center position of the substrate placing table 3 by the third electric cylinders 901 so as to be in contact with the thermal printing sheet substrate. The plurality of third electric cylinders 901 are synchronously extended and retracted to limit the thermal printing sheet substrate at the center position of the substrate placing table 3. Then, the thermal printing sheet is suctioned and fixed by the vacuum nozzles 1002 driven by the vacuum generator 1001.

[0057] In order to realize the lifting, rotation and overturning of the substrate placing table 3, the inside of the equipment shell 1 is fixedly installed with a lifting assembly 600, a rotating assembly 700 and an overturning assembly 800; the lifting assembly 600 is used for adjusting the height of the heat-sensitive printing sheet substrate, realizing the conversion of the heat-sensitive printing sheet substrate spraying, immersion and baking states, and the lifting assembly 600 comprises a second electric cylinder 601 and a rotating seat 602, the second electric cylinder 601 is fixedly installed inside the substrate processing cavity, and the rotating seat 602 is fixedly installed at the output end of the second electric cylinder 601; the rotating assembly 700 is used for driving the substrate placing table 3 and the heat-sensitive printing sheet substrate to rotate in the horizontal direction, and performing the glue uniformizing operation, and the rotating assembly 700 comprises a first motor 701, a driving gear 702 and a driven gear 703, the first motor 701 is fixedly installed on the rotating seat 602, the driving gear 702 and the output end of the first motor 701 are fixedly connected, the driven gear 703 and the rotating seat 602 are rotationally connected, and the driven gear 703 and the driving gear 702 are engaged; the overturning assembly 800 is used for overturning the substrate placing table 3 and the heat-sensitive printing sheet substrate in the vertical direction, and cooperating with the rotating assembly 700 to adjust the angle of the heat-sensitive printing sheet substrate, so that the solution is more uniformly sprayed on the surface of the heat-sensitive printing sheet substrate, and the overturning assembly 800 comprises a connecting frame 801 and a second motor 802, the connecting frame 801 and the driven gear 703 are fixedly connected, the other end of the connecting piece and the substrate placing table 3 are fixedly connected, the substrate placing table 3 is rotationally connected with the connecting frame 801 through a shaft, the second motor 802 is installed on the connecting frame 801, and the output end of the second motor 802 and the shaft are fixedly connected and used for driving the substrate placing table 3 to overturn; the second electric cylinder 601 can drive the rotating seat 602 and the substrate placing table 3 to lift, the first motor 701 can drive the driving gear 702 to rotate and drive the driven gear 703 and the substrate placing table 3 to rotate in the horizontal position, the substrate placing table 3 drives the heat-sensitive printing sheet substrate to be in the horizontal state, the output end of the first motor 701 is connected with a speed reducer, the rotating speed of the first motor 701 can be adjusted, so that the rotating speed of the heat-sensitive printing sheet substrate is controlled, and the shaft and the substrate placing table 3 can be driven by the second motor 802 to overturn in the vertical direction, and the vertical angle of the heat-sensitive printing sheet substrate is adjusted.

[0058] Please refer to Figures 1 to 3The heating and baking part 200 comprises an electric heater 201, a heat-conducting plate 202 and a fan 203. The electric heater is installed inside the heating cavity. The heat-conducting plate 202 is fixedly installed on the top of the electric heater 201 and is used to transfer the heat of the electric heater 201 to the inside of the substrate processing cavity. The heat-conducting plate 202 is provided with a heat-conducting opening on the top of the partition plate 2. The top end of the heat-conducting plate 202 is flush with the bottom wall of the substrate processing cavity. The fan 203 is installed inside the substrate processing cavity. The heat-conducting plate 202 can be heated by the electric heater 201. The substrate placing table 3 can be lowered by the second electric cylinder 601. The heat-sensitive printing sheet substrate can be turned over by the second motor 802, so that the heat-sensitive printing sheet substrate is in contact with or close to the heat-conducting plate 202. The heat-conducting plate 202 bakes the heat-sensitive printing sheet substrate. The air flow inside the substrate processing cavity can be accelerated by the fan 203, so that the drying and baking efficiency of the heat-sensitive printing sheet substrate is improved.

[0059] It should be noted that the electric heater 201 can be set to a desired temperature, and the heat-conducting plate 202 is heated to the desired temperature. The inside of the substrate processing cavity is provided with a temperature sensor and a temperature controller. The temperature sensor can monitor the temperature inside the substrate processing cavity. The temperature controller mainly performs cooling to restore the inside of the substrate processing cavity to room temperature or the required temperature for substrate processing after drying and baking. At the same time, the temperature controller mainly cools the liquid outlet pipe 403 to reduce the deterioration of the solution caused by heating. At the same time, a heat insulation mechanism can be provided inside the substrate processing cavity. The heat insulation plate is driven by the electric cylinder to separate the heating and baking part 200 and the heat-sensitive head substrate area from other areas during the heating process of the electric heater 201, so as to reduce the influence of high temperature on other areas. When other processing is performed, the heat insulation plate is moved to other positions by the electric cylinder to reduce the obstruction to processing. The equipment shell 1 is made of a material with high temperature resistance and poor heat conductivity, so as to avoid damage to the equipment caused by high temperature.

[0060] Please refer to Figure 3 and Figure 6The glue coating mechanism 300 is used for dripping glue solution to the surface of the thermal printing sheet substrate, and the glue coating mechanism 300 comprises a photoresist storage tank 301, a delivery pump 302 and a dripping head. The photoresist storage tank 301 is mounted on the equipment housing 1. The suction inlet of the delivery pump 302 is communicated with the photoresist storage tank 301. The delivery outlet of the delivery pump 302 is communicated with the dripping head. The photoresist is stored in the photoresist storage tank 301. The photoresist can be pumped out by the delivery pump 302 and pumped to the dripping head. The photoresist is dripped at the center position of the thermal printing sheet substrate. The thermal printing sheet substrate is rotated by the rotating assembly 700. The photoresist is uniformly coated on the surface of the thermal printing sheet substrate under the action of centrifugal force. In addition, the equipment housing 1 is internally provided with an element for driving the movement of the dripping head. An electric cylinder can be selected. The dripping head is moved to above the center position of the thermal printing sheet substrate by the electric cylinder during the glue coating process. The photoresist is dripped at the center position of the thermal printing sheet substrate. In addition to this time, the electric cylinder drives the dripping head to be away from the thermal printing sheet substrate to avoid hindering the rotation of the thermal printing sheet substrate and other processing processes. The delivery pump 302 and the dripping head are communicated by a hose. The movement of the dripping head by the electric cylinder can be realized.

[0061] It should be noted that the exposure chamber can be communicated with the sidewall of the substrate processing chamber. The exposure system is arranged in the exposure chamber. The electric cylinder is mounted at the exposure chamber. The electric cylinder drives the exposure system to move to the thermal printing sheet substrate. The transparent observation window can use color-changing glass to shield the light in the substrate processing chamber. The first electric cylinder 101 drives the closing plate 102 to rise to open the taking and placing opening. The thermal printing sheet substrate after the pre-baking is taken out and sent into the interior of the exposure machine for exposure. After the exposure is completed, the thermal printing sheet substrate is continuously mounted on the substrate placing table 3 for subsequent processing.

[0062] Please refer to Figures 1 to 6The multifunctional spraying mechanism 400 comprises a clean water tank 401 and a plurality of solution storage tanks 402, the clean water tank 401 and the solution storage tanks 402 are both mounted at the top end of the equipment shell 1, the cleaning solution, the developing solution, the rinsing solution and the stripping solution are respectively contained in the corresponding solution storage tanks 402, the bottom of the solution storage tank 402 is communicated with the liquid outlet pipe 403 with a valve, the liquid outlet pipe 403 extends into the inside of the equipment shell 1 and is communicated with the spray head, the water pump 404 is mounted at the top end of the equipment shell 1, the water pump 404 is communicated with the bottom of the water tank, the water outlet of the water pump 404 extends into the inside of the equipment shell 1 and is communicated with the water spraying pipe 405, the bottom of the water spraying pipe 405 is communicated with a plurality of nozzles, the opening and closing of the liquid outlet pipe 403 can be controlled through the valve, so that the corresponding solution flows from the inside of the solution storage tank 402 to the nozzle and sprays on the surface of the thermal printing sheet substrate, and the corresponding cleaning, developing, rinsing or stripping operation is carried out, specifically, the inside of each solution storage tank 402 contains acetone solution, isopropyl alcohol or ethanol solution, water-soluble alkaline developing solution, deionized water and organic solvent or solution with corrosion to photoresist, the thermal printing sheet substrate is cleaned by using acetone solution; then isopropyl alcohol or ethanol is used for cleaning; the water-soluble alkaline developing solution is used for developing treatment, if the spraying type treatment mode is used, the thermal printing sheet substrate can be at a higher position, if the immersion type treatment mode is used, the thermal printing sheet substrate can be lowered to a lower position, so that the developing solution accumulates at the bottom of the substrate treatment cavity and immerses the thermal printing sheet substrate, and the developing treatment is carried out; after the developing is completed, the thermal printing sheet substrate should be immediately rinsed by using deionized water to avoid that the residual developing solution continues to corrode the photoresist; after the pattern transfer, the photoresist is no longer needed and needs to be completely removed, the photoresist is dissolved or corroded by using the organic solvent or the solution with corrosion to the photoresist, so that the purpose of stripping is achieved, but the precondition is to select the stripping solution which does not damage the thermal printing sheet substrate, if the immersion type developing treatment mode is used, the water pump 404 is started to pump the clean water to the atomizing spray head, the inside of the substrate treatment cavity is rinsed, the waste liquid flows into the inside of the waste liquid collecting cavity through the liquid falling pipe 501, then the inside of the substrate treatment cavity is dried by the electric heater 201, so as to avoid the influence on the developing quality caused by the reaction with the developing solution, and the speed of each solution flow can be controlled through the valve.

[0063] It should be noted that the first motor 701, the second motor 802, the second electric cylinder 601 and the third electric cylinder 901 all have a waterproof function, which can avoid damage to electrical components during the spraying process, or a waterproof and corrosion-resistant shell can be provided outside the electrical components, or a waterproof and corrosion-resistant coating can be applied to reduce damage to electrical components, and the driven gear 703 is a hollow structure, which can reduce the obstruction to the solution spraying.

[0064] Please refer to Figure 1 and Figure 9The waste liquid collecting and discharging part 500 comprises a plurality of liquid falling pipes 501, the top and bottom of the liquid falling pipes 501 are communicated with the substrate processing cavity and the waste liquid collecting cavity respectively, the communication part of the liquid falling pipes 501 and the substrate processing cavity forms a downward recess, the inside of the equipment shell 1 is provided with a liquid discharging control member 1100 for realizing the opening and closing of the liquid falling pipes 501 so as to make the solution fall, the liquid discharging control member 1100 comprises a fourth electric cylinder 1101 and a plurality of sealing blocks 1102, the sealing blocks 1102 and the top of the liquid falling pipes 501, i.e. the recess, are in sealing sliding fit, the fourth electric cylinder 1101 is installed in the inside of the equipment shell 1, the output end of the fourth electric cylinder 1101 is connected with a lifting frame, the top of the lifting frame is fixedly connected with a plurality of connecting rods, the connecting rods pass through the liquid falling pipes 501 and are connected with the sealing blocks 1102, the bottom of the waste liquid collecting cavity is communicated with a liquid discharging pipe 502 provided with a valve, the fourth electric cylinder 1101 can drive the plurality of sealing blocks 1102 to lift, the sealing blocks 1102 can be lifted to release the sealing of the liquid falling pipes 501, the used liquid can fall into the inside of the waste liquid collecting cavity through the gap between the liquid falling pipes 501 and the sealing blocks 1102, the fourth electric cylinder 1101 drives the sealing blocks 1102 to descend to seal the liquid falling pipes 501, so as to avoid the falling of the solution, thereby forming liquid accumulation and immersing the heat-sensitive printing plate substrate.

[0065] It needs to be supplemented that the inside of the waste liquid collecting cavity is fixedly connected with a protective shell 4, the fourth electric cylinder 1101 is installed in the inside of the protective shell 4, and the waste liquid collecting cavity is made of anticorrosive material, or an anticorrosive coating is coated on the inner wall of the waste liquid collecting cavity, so as to avoid corrosion and damage, and a liquid scraping assembly can also be arranged at the bottom of the substrate processing cavity, for example, an electric cylinder is used to drive a scraping plate to move or a motor is used to drive the scraping plate to rotate, so as to scrape the residual liquid at the bottom of the substrate processing cavity into the liquid falling pipes 501, thereby reducing the residual solution.

[0066] A plurality of mounting holes are arranged on the waste liquid collecting cavity, a plurality of assembled filter boxes 5 are slidingly mounted in the mounting holes, the plurality of assembled filter boxes 5 are assembled in contact with each other to form a large filter box matched with the waste liquid collecting cavity, the assembled filter boxes 5 are detachably connected with the waste liquid collecting cavity through bolts or connected with the waste liquid collecting cavity through a magnet group, the sealing property between the assembled filter boxes 5 and the mounting holes is good, so as to avoid waste liquid flowing out, and the bottom of the assembled filter boxes 5 is provided with a filter screen for filtering the colloid and solid waste in the waste liquid.

[0067] The heat-sensitive printing sheet integrated circuit etching pre-treatment equipment is in a dust-free workshop when processing the heat-sensitive printing sheet substrate. First, the first electric cylinder 101 is started to drive the closing plate 102 to rise, the heat-sensitive printing sheet substrate is placed on the top of the substrate placing table 3, the initial substrate placing table 3 is in a horizontal state, the vacuum suction nozzle 1002 is in a vertical upward state, the third electric cylinder 901 is started to drive the positioning block 902 to position the heat-sensitive printing sheet substrate at the center position of the substrate placing table 3, then the vacuum generator 1001 is started to make the vacuum suction nozzle 1002 adsorb and fix the heat-sensitive printing sheet substrate, then the third electric cylinder 901 is controlled to drive the positioning block 902 to move away from the heat-sensitive printing sheet substrate, the second motor 802 is started to drive the heat-sensitive printing sheet substrate to turn over by 180 degrees, then the second electric cylinder 601 drives the heat-sensitive printing sheet substrate to descend close to the heat-conducting plate 202, the electric heater 201 and the fan 203 are started, the electric heater 201 heats the heat-conducting plate 202, the heating temperature of the electric heater 201 is set to heat the heat-sensitive printing sheet substrate at 150-200 ℃ for several minutes (2-3 minutes), at the same time, the fan 203 accelerates the flow of hot air to remove the water vapor on the surface of the heat-sensitive printing sheet substrate, in this process, the electric cylinder can drive the heat insulation plate to move above the rotating assembly 700 to separate the heat-sensitive printing sheet substrate and the liquid feeding pipe above, then the temperature controller is used to cool the inside of the substrate processing cavity to normal temperature, the valve of the solution storage tank 402 containing acetone solution is opened, the acetone solution is sent to the nozzle to spray on the surface of the heat-sensitive printing sheet substrate, in the spraying process, the second electric cylinder 601, the first motor 701 and the second motor 802 can be started to make the heat-sensitive printing sheet substrate ascend and descend and rotate between the horizontal position and the vertical position, so that the solution is uniformly and fully sprayed on the surface of the heat-sensitive printing sheet substrate, then the valve is closed, the solution storage tank 402 containing isopropyl alcohol or ethanol solution is started to make the isopropyl alcohol or ethanol solution spray on the surface of the heat-sensitive printing sheet substrate for cleaning, in the spraying process, the fourth electric cylinder 1101 drives the closing block 1102 to be away from the liquid falling pipe 501, the solution falls into the inside of the waste liquid collecting cavity, then the motor or the electric cylinder drives the scraper to scrape the residual liquid to the liquid falling pipe 501 to make it fall down, the fourth electric cylinder 1101 is controlled to drive the closing block 1102 to descend to close the liquid falling pipe 501, the electric heater 201 is started to dry the heat-sensitive printing sheet substrate and the inside of the substrate processing cavity, the delivery pump 302 is started to drop photoresist on the surface of the heat-sensitive printing sheet substrate, in this process, the heat-sensitive printing sheet substrate is in a horizontal state, at the same time, the first motor 701 drives the substrate placing table 3 and the heat-sensitive printing sheet substrate to rotate, so that the photoresist is uniformly coated on the surface of the heat-sensitive printing sheet substrate, then the third electric cylinder 901 is controlled to drive the positioning block 902 to contact the edge of the heat-sensitive printing sheet substrate, the heat-sensitive printing sheet substrate rotates, the positioning block 902 can scrape off the photoresist on the edge of the heat-sensitive printing sheet substrate,Then the electric heater 201 and the fan 203 are started, the hot sensitive printing plate substrate is pre-baked, the electric cylinder is started to drive the exposure system to move to the corresponding position, the pre-baked hot sensitive printing plate substrate is exposed, or the hot sensitive printing plate substrate is taken out and sent into the inside of the exposure machine for exposure processing, then it is reinstalled on the substrate placing table 3, then the valve of the solution storage tank 402 containing the developing liquid is opened, the developing liquid is sprayed on the surface of the hot sensitive printing plate substrate, or the liquid falling pipe 501 is closed by the closing block 1102, the hot sensitive printing plate substrate is lowered to a lower position, the developing liquid is accumulated at the bottom of the substrate processing cavity, the hot sensitive printing plate substrate is immersed and developed, then the valve of the solution storage tank 402 containing the deionized water is opened, the deionized water is sprayed on the surface of the hot sensitive printing plate substrate for rinsing, then the electric heater 201 is started to bake the hot sensitive printing plate substrate, the baked hot sensitive printing plate substrate is taken out and sent to the inside of the etching machine for etching, the etched hot sensitive printing plate substrate is reinstalled on the substrate placing table 3, the hot sensitive printing plate substrate is sprayed with the degreasing liquid or immersed in the degreasing liquid for degreasing treatment, then the printed hot sensitive printing plate is collected, the filter screen filters the impurities in the waste liquid, the valve on the liquid discharge pipe 502 is opened, the waste liquid in the waste liquid collecting cavity is discharged and further treated, the assembled filter box 5 is disassembled, the impurities are collected and further treated.

[0068] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermal sensitive printing sheet integrated circuit etching pre-treatment apparatus comprising an apparatus housing (1), characterised in that, Also include: The substrate placing table (3) with lifting, rotating and overturning functions is provided with a vacuum adsorption assembly (1000) for adsorbing and fixing the heat-sensitive printing sheet substrate; The heating and baking component (200) is used for drying or baking the heat-sensitive printing sheet substrate; The glue applying mechanism (300) is used for dripping glue solution on the surface of the heat-sensitive printing sheet substrate; The multifunctional spraying mechanism (400) includes a flushing part and a solution spraying part, the flushing part is used for spraying clean water in the inside of the equipment shell (1) to clean it, and the solution spraying part is used for spraying cleaning solution, developing solution, flushing solution and degumming solution on the surface of the heat-sensitive printing sheet substrate respectively; The equipment shell (1) is divided into a substrate processing cavity, a heating cavity and a waste liquid collecting cavity by at least two partition plates (2), the waste liquid collecting cavity is communicated with the substrate processing cavity through a plurality of liquid falling pipes (501), and the bottom of the waste liquid collecting cavity is communicated with a liquid discharge pipe (502) provided with a valve. The inside of the equipment shell (1) is provided with a lifting assembly (600), a rotating assembly (700) and an overturning assembly (800), the lifting assembly (600) is used for adjusting the height of the heat-sensitive printing sheet substrate, realizing the conversion of the spraying and immersion states of the heat-sensitive printing sheet substrate, the rotating assembly (700) is used for driving the heat-sensitive printing sheet substrate to rotate and perform glue uniformizing operation, and the overturning assembly (800) is used for overturning the substrate placing table (3) and the heat-sensitive printing sheet substrate in the vertical direction and adjusting the angle of the heat-sensitive printing sheet substrate in cooperation with the rotating assembly (700), so that the solution is uniformly sprayed on the surface of the heat-sensitive printing sheet substrate.

2. The thermal printing sheet integrated circuit etching pretreatment apparatus according to claim 1, characterized by, The liquid discharge control member (1100) includes a fourth electric cylinder (1101) and a plurality of sealing blocks (1102), the sealing blocks (1102) are in sealing sliding fit with the top of the liquid falling pipe (501), and the fourth electric cylinder (1101) is installed in the inside of the equipment shell (1).

3. The thermal printing sheet integrated circuit etching pretreatment apparatus according to claim 2, characterized by, The inside of the equipment shell (1) is provided with a positioning member (900) for positioning the heat-sensitive printing sheet substrate, the positioning member (900) includes a plurality of third electric cylinders (901) and a plurality of positioning blocks (902), the positioning blocks (902) are fixedly installed at the output ends of the third electric cylinders (901), and the positioning blocks (902) are in contact with the heat-sensitive printing sheet substrate and used for positioning the heat-sensitive printing sheet substrate.

4. The thermal printing sheet integrated circuit etching pretreatment apparatus according to claim 3, characterized by The lifting assembly (600) can also be used to drive the heat-sensitive printing sheet substrate to approach or move away from the heating and baking component (200), so as to dry or bake the heat-sensitive printing sheet substrate.

5. The thermal printing sheet integrated circuit etching pretreatment apparatus according to claim 4, characterized by The communication position of the liquid falling pipe (501) and the substrate processing cavity forms a downward recess.

6. The thermal printing sheet integrated circuit etching pretreatment apparatus according to claim 5, wherein A plurality of assembled filter boxes (5) are slidingly installed in the waste liquid collecting cavity for filtering the waste liquid.

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