A method and system for optimizing the preparation process of a transparent base circuit board

Abstract

The present invention relates to the field of data processing technology, and provides a method and system for optimizing the preparation process of a transparent base circuit board. The method comprises: obtaining a buffer layer coating channel and an etching layer coating channel; inputting the buffer layer coating channel for coating to generate a second-state transparent glass substrate, and etching the coated layer to generate a third-state transparent glass substrate; bonding to generate a fourth-state transparent glass substrate, and producing a predicted finished product probability; optimizing and obtaining exposure process control parameter optimization results and etching process control parameter optimization results, initializing the exposure processing channel, and processing to obtain the transparent base circuit board. The method solves the technical problems of high operational difficulty in optimizing the preparation process of the transparent base circuit board, unstable quality of the processed finished product, and inability to effectively guarantee the qualified rate of the finished product, thereby improving the operability of the preparation process optimization, reducing the operational difficulty of optimizing the preparation process of the transparent base circuit board, improving the stability of the quality of the processed finished product, and effectively guaranteeing the qualified rate of the finished product.

Description

Technical Field

[0001] The present invention relates to the technical field related to data processing, and in particular to a method and system for optimizing the preparation process of a transparent base circuit board. Background Art

[0002] Currently, transparent substrates for transparent circuit boards are mostly made of transparent glass, transparent PET film, transparent PI film, etc. Their functional circuits are mostly obtained by screen printing with conductive adhesive or using copper-clad laminates (transparent substrate and copper foil are pressed together with adhesive) and then obtained through traditional circuit board manufacturing processes.

[0003] Transparent circuit boards, created by screen-printing conductive adhesive onto transparent substrates (this process is currently only used on glass substrates), are unsuitable for high-power load circuits due to their high sheet resistance and low conductivity. They also suffer from poor adhesion and weather resistance, making them primarily used in consumer electronics. However, their quality remains unstable, resulting in a short product lifespan.

[0004] Transparent PCBs are first made by manufacturing a copper-clad laminate, then using traditional PCB manufacturing processes. However, due to the thermal stress differences between the transparent substrate, adhesive, and copper foil, the transparent PCBs can experience circuit displacement and poor adhesion during high-temperature processing. This can lead to peeling or breakage of the copper foil when used in transparent displays due to excessively thin circuits or thick copper foil. This makes the manufacturing process difficult to operate, quality control difficult, and yields low.

[0005] In summary, the prior art has technical problems such as the difficulty in optimizing the preparation process of transparent-based circuit boards, the unstable quality of finished products, and the inability to effectively guarantee the qualified rate of finished products. Summary of the Invention

[0006] The present application provides a method and system for optimizing the preparation process of transparent base circuit boards, aiming to solve the technical problems in the prior art of optimizing the preparation process of transparent base circuit boards, such as the difficulty in operation, the unstable quality of the processed finished products, and the inability to effectively guarantee the qualified rate of the finished products.

[0007] In view of the above problems, the embodiments of the present application provide a method and system for optimizing the preparation process of a transparent base circuit board.

[0008] The first aspect disclosed in the present application provides a method for optimizing the preparation process of a transparent base circuit board, wherein a preparation machine tool for the transparent base circuit board includes a PVD vacuum coating device, and the PVD vacuum coating device includes a buffer layer coating channel and an etching layer coating channel. The method comprises: obtaining a buffer layer coating channel and an etching layer coating channel according to the PVD vacuum coating device; inputting a transparent glass substrate in a first state into the buffer layer coating channel for coating to generate a transparent glass substrate in a second state; inputting the transparent glass substrate in the second state into the etching layer coating channel for coating to generate a transparent glass substrate in a third state; and inputting the etching line into the etching line. The circuit printed part is bonded to the third-state transparent glass substrate to generate a fourth-state transparent glass substrate; production prediction is performed based on exposure process control parameters and etching process control parameters to obtain a finished product probability; when the finished product probability is less than or equal to a probability threshold, the exposure process control parameters and the etching process control parameters are optimized to generate exposure process control parameter optimization results and etching process control parameter optimization results; after initializing an exposure processing channel based on the exposure process control parameter optimization result and initializing an etching processing channel based on the etching process control parameter optimization result, the fourth-state transparent glass substrate is processed to generate a transparent base circuit board.

[0009] Another aspect disclosed in the present application provides a preparation process optimization system for a transparent base circuit board, wherein the system includes: a coating channel acquisition module for acquiring a buffer layer coating channel and an etching layer coating channel according to a PVD vacuum coating device; a second-state substrate generation module for inputting a first-state transparent glass substrate into the buffer layer coating channel for coating to generate a second-state transparent glass substrate; a third-state substrate generation module for inputting the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate; and a fourth-state substrate generation module for bonding an etched circuit print and the third-state transparent glass substrate to generate a A fourth-state transparent glass substrate; a finished product probability acquisition module, used to make production predictions based on exposure process control parameters and etching process control parameters to obtain a finished product probability; a process control parameter optimization module, used to optimize the exposure process control parameters and the etching process control parameters when the finished product probability is less than or equal to a probability threshold, and generate exposure process control parameter optimization results and etching process control parameter optimization results; a processing module, used to initialize an exposure processing channel based on the exposure process control parameter optimization result, initialize an etching processing channel based on the etching process control parameter optimization result, and then process the fourth-state transparent glass substrate to generate a transparent base circuit board.

[0010] One or more technical solutions provided in this application have at least the following technical effects or advantages:

[0011] The method adopts the following steps: obtaining a buffer layer coating channel and an etching layer coating channel; inputting the buffer layer coating channel for coating to generate a second-state transparent glass substrate; inputting the etching layer coating channel for coating to generate a third-state transparent glass substrate; bonding to generate a fourth-state transparent glass substrate, performing production prediction, and obtaining a finished product probability; when the finished product probability is less than or equal to the probability threshold, optimizing the exposure process control parameters and the etching process control parameters, generating exposure process control parameter optimization results and etching process control parameter optimization results, initializing the exposure processing channel, processing the fourth-state transparent glass substrate, and generating a transparent base circuit board. This method realizes the production prediction method, obtains the finished product probability, optimizes and adjusts the process control parameters based on the finished product probability, improves the operability of the preparation process optimization of the transparent base circuit board, reduces the operational difficulty of the preparation process optimization of the transparent base circuit board, improves the quality stability of the processed finished product, and effectively guarantees the technical effect of the qualified rate of the finished product.

[0012] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A possible flow chart of a method for optimizing the preparation process of a transparent base circuit board is provided for the embodiment of the present application;

[0014] Figure 2 A schematic diagram of a possible process for generating a second-state transparent glass substrate in a method for optimizing a manufacturing process of a transparent-based circuit board is provided for an embodiment of the present application;

[0015] Figure 3 A schematic diagram of a possible process for generating a third-state transparent glass substrate in a method for optimizing a manufacturing process of a transparent-based circuit board is provided for an embodiment of the present application;

[0016] Figure 4 A possible structural schematic diagram of a transparent base circuit board preparation process optimization system is provided for an embodiment of the present application.

[0017] Explanation of the reference numerals: coating channel acquisition module 100, second state substrate generation module 200, third state substrate generation module 300, fourth state substrate generation module 400, finished product probability acquisition module 500, process control parameter optimization module 600, processing module 700. DETAILED DESCRIPTION

[0018] The overall idea of ​​the technical solution provided by this application is as follows:

[0019] The embodiments of the present application provide a method and system for optimizing the preparation process of transparent-base circuit boards, which solve the technical problems of high operational difficulty in optimizing the preparation process of transparent-base circuit boards, unstable quality of processed finished products, and inability to effectively guarantee the qualified rate of finished products. The method achieves the technical effect of obtaining the probability of a finished product by adopting a production prediction method, optimizing and adjusting process control parameters based on the probability of a finished product, improving the operability of optimizing the preparation process of transparent-base circuit boards, reducing the operational difficulty of optimizing the preparation process of transparent-base circuit boards, improving the stability of the quality of processed finished products, and effectively guaranteeing the qualified rate of finished products.

[0020] After introducing the basic principles of the present application, various non-limiting implementation methods of the present application will be specifically introduced in conjunction with the drawings in the specification.

[0021] Example 1

[0022] like Figure 1 As shown, an embodiment of the present application provides a method for optimizing the preparation process of a transparent base circuit board, wherein a preparation machine tool for the transparent base circuit board includes a PVD vacuum coating device, and the PVD vacuum coating device includes a buffer layer coating channel and an etching layer coating channel. The method includes:

[0023] S10: obtaining a buffer layer coating channel and an etching layer coating channel according to the PVD vacuum coating equipment;

[0024] S20: inputting the transparent glass substrate in the first state into the buffer layer coating channel for coating to generate a transparent glass substrate in the second state;

[0025] like Figure 2 As shown, step S20 includes the steps of:

[0026] S21: matching a buffer layer material type, a buffer layer thickness parameter, and a buffer layer area parameter according to the transparent glass substrate in the first state;

[0027] S22: Screening buffer layer coating control parameters based on the first cloud particle library according to the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter;

[0028] S23: Controlling the buffer layer coating channel with the buffer layer coating control parameter to coat the transparent glass substrate in the first state, to generate the transparent glass substrate in the second state.

[0029] Specifically, the preparation process is optimized for the pre-treatment-lamination-exposure-etching related process steps in the circuit board process, specifically including: the preparation machine tool includes a PVD vacuum coating equipment, the PVD vacuum coating equipment includes a buffer layer coating channel and an etching layer coating channel, the first cloud particle library is the historical data information recorded in the operation log of the transparent base circuit board preparation machine tool, any particle in the first cloud particle library represents a set of control parameters, each particle includes a trigger frequency, the second-state transparent glass substrate is the first-state transparent glass substrate after the buffer layer coating is completed, providing hardware support for the subsequent preparation of the transparent base circuit board;

[0030] According to the PVD vacuum coating equipment, a buffer layer coating channel (the buffer layer coating channel is used to perform the operation task of coating a buffer layer of titanium or titanium alloy or nickel on the glass substrate surface using a magnetron sputtering process) and an etching layer coating channel (the etching layer coating channel is used to perform the operation task of vacuum coating a copper film, and its thickness can be increased or decreased according to demand) are obtained;

[0031] The first-state transparent glass substrate (cleaned transparent glass substrate) is input into the buffer layer coating channel for coating to generate the second-state transparent glass substrate, specifically including: the buffer layer material of the buffer layer coating channel is generally titanium, titanium alloy or nickel, the buffer layer material is required to have a thermal expansion coefficient between glass and copper and excellent thermal conductivity; according to the first-state transparent glass substrate, the corresponding buffer layer material type (which can be titanium, titanium alloy or nickel), buffer layer thickness parameter and buffer layer area parameter (corresponding to the area of ​​the first-state transparent glass substrate, if the first-state transparent glass substrate is irregular in shape, the area can be calculated) are matched. A fitting calculation is performed using a pinching method, which is a mathematical operation method and a conventional operation method for irregular-shaped areas); a buffer layer coating control parameter is screened in a first cloud particle library according to the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter; the buffer layer coating control parameter is used to control the buffer layer coating channel, and the first-state transparent glass substrate is coated using the buffer layer coating channel to complete the coating to generate the second-state transparent glass substrate, wherein the buffer layer is made of titanium, titanium alloy, or nickel (with a thermal expansion coefficient between glass and copper) to reduce internal stress generated by thermal expansion of glass and copper.

[0032] Step S22 includes the steps of:

[0033] S221: Inputting the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter into the first cloud particle library to obtain a plurality of buffer layer coating control particles;

[0034] S222: traversing the plurality of buffer layer coating control particles, extracting a plurality of groups: a buffer material sputtering position, a buffer material unit sputtering amount, a buffer material sputtering frequency, and a buffer material sputtering time;

[0035] S223: performing credibility evaluation on the plurality of buffer layer coating control particles according to the plurality of groups of trigger frequency characteristics of: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency, and buffer material sputtering time, to generate a plurality of particle support levels;

[0036] S224: Filtering the maximum particle support according to the multiple particle support degrees to generate the buffer layer coating control parameters.

[0037] Specifically, according to the buffer layer material type, the buffer layer thickness parameter and the buffer layer area parameter, based on the first cloud particle library, the buffer layer coating control parameters are screened, specifically including: the trigger frequency characteristic, that is, the trigger frequency of any set of data, trigger frequency / overall trigger frequency = credibility, the overall trigger frequency is the overall cumulative frequency value of the trigger frequency (not exceeding 100%), the multiple particle support degrees, that is, multiple groups arranged according to credibility: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency, credibility, the maximum particle support degree, that is, the group with the credibility arranged in the first place: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency, maximum credibility, the group with the credibility arranged in the first place of the buffer layer coating control parameters: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency;

[0038] The buffer layer material type, the buffer layer thickness parameter and the buffer layer area parameter are input into the search box of the first cloud-based particle library, and a restricted search is performed to obtain a plurality of buffer layer coating control particles; the plurality of buffer layer coating control particles are traversed, and the plurality of groups corresponding to the plurality of buffer layer coating control particles are extracted in turn: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency (buffer material unit sputtering amount, buffer material sputtering frequency and buffer material sputtering time can be mutually verified, that is, the buffer material unit sputtering amount and buffer material sputtering frequency are determined, and the buffer material sputtering time can be derived) and buffer material sputtering time; according to the trigger frequency characteristics of the plurality of groups: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency and buffer material sputtering time, the plurality of buffer layer coating control particles are credibility evaluated to generate a plurality of particle support degrees; according to the plurality of particle support degrees, the maximum particle support degree is screened to generate the buffer layer coating control parameters to provide support for ensuring the effectiveness of the buffer layer coating control parameters.

[0039] S30: inputting the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate;

[0040] like Figure 3 As shown, step S30 includes the steps of:

[0041] S31: matching copper film thickness parameters and copper film area parameters according to the transparent glass substrate in the second state;

[0042] S32: Screening etching layer coating control parameters based on the second cloud particle library according to the copper film thickness parameter and the copper film area parameter;

[0043] S33: Controlling the etching layer coating channel with the etching layer coating control parameter to coat the second-state transparent glass substrate to generate the third-state transparent glass substrate.

[0044] Specifically, the second-state transparent glass substrate is input into the etching layer coating channel for coating to generate a third-state transparent glass substrate, which specifically includes: performing parameter matching according to the second-state transparent glass substrate to obtain the copper film thickness parameter (the copper film thickness increases or decreases according to demand and can be set by the user end) and the copper film area parameter (corresponding to the area of ​​the first-state transparent glass substrate, if the first-state transparent glass substrate is irregular, the copper film area calculation can be fitted by the clamping method, and the irregular shape includes surface depression or surface protrusion); according to the copper film thickness parameter and the copper film area parameter, the copper film thickness parameter and the copper film area parameter are input into the second cloud particle library, and a restrictive search is performed to screen the etching layer coating control parameters; the etching layer coating channel is controlled by the etching layer coating control parameters, and the etching layer coating channel is used to coat the second-state transparent glass substrate, and the coating is completed to generate the third-state transparent glass substrate, providing a basis for subsequent operations.

[0045] S40: bonding the etched circuit print and the third-state transparent glass substrate to form a fourth-state transparent glass substrate;

[0046] S50: Perform production prediction based on exposure process control parameters and etching process control parameters to obtain a finished product probability;

[0047] Step S50 includes the steps of:

[0048] S51: When the exposure process control parameters are input into the finished product probability identification model, the exposure finished product probability identification layer is activated and the exposure finished product probability is output;

[0049] S52: When the etching process control parameters are input into the finished product probability identification model, activating the etching finished product probability identification layer and outputting the etching finished product probability;

[0050] S53: Merge the exposure finished product probability and the etching finished product probability to obtain the finished product probability.

[0051] Specifically, a robotic arm is used to bond an etched circuit print (commonly used, such as photoelectrochemical etching, i.e., using a resist to prepare an etched circuit print) and the third-state transparent glass substrate (the etched circuit print and the third-state transparent glass substrate are bonded together, and the bonding of the etched circuit print and the third-state transparent glass substrate does not rely on an adhesive medium, and the thermal conductivity is greatly improved), generating a fourth-state transparent glass substrate, and a magnetron sputtering vacuum coating process is used (after the etched circuit print and the third-state transparent glass substrate are bonded together, a magnetron sputtering vacuum coating process is used to form a thin film on the surface to protect the stability of the bonding between the etched circuit print and the third-state transparent glass substrate), wherein the metal ion particle size reaches the nanometer level, achieving superb adhesion to the transparent substrate;

[0052] Performing production prediction based on exposure process control parameters and etching process control parameters to obtain finished product probability, specifically comprising: building the finished product probability identification model (the finished product probability identification model includes an exposure finished product probability identification layer and an etching finished product probability identification layer), the finished product probability identification model is based on a BP network model, using historical exposure process control parameters and historical exposure finished product results, historical etching process control parameters and historical etching finished product results as training data sets, and using the historical exposure finished product results and historical etching finished product results as supervision data sets, performing supervised training on the BP network model, and determining the finished product probability identification model when the model tends to be stable;

[0053] When the exposure process control parameters are input into the finished product probability identification model, the finished product probability identification layer is synchronously activated (the historical exposure process control parameters include multiple groups of exposure process parameters and finished product probability identification information, and the finished product probability identification layer is the middle network layer of the finished product probability identification model), and the finished product probability is output (the finished product probability identification information is the ratio of the number of finished products in the data group of the analysis time period of the group of exposure process parameters to the total product data volume);

[0054] When the etching process control parameters are input into the finished product probability identification model, the etching finished product probability identification layer is synchronously activated (the historical etching process control parameters include multiple groups of etching process parameters and etching finished product probability identification information, and the etching finished product probability identification layer is the intermediate network layer of the finished product probability identification model), and the etching finished product probability is output (the etching finished product probability identification information is the ratio of the number of finished products in the data group of the analysis time period of the group of etching process parameters / the total product data volume); the exposure finished product probability and the etching finished product probability are fused (the joint probability is calculated, preferably, the two are independent of each other and directly multiplied, preferably satisfying the data law of the exposure-etching stage) to obtain the finished product probability, to provide support for ensuring the stability of the finished product probability.

[0055] S60: When the finished product probability is less than or equal to a probability threshold, optimizing the exposure process control parameters and the etching process control parameters to generate exposure process control parameter optimization results and etching process control parameter optimization results;

[0056] Step S60 includes the steps of:

[0057] S61: when the finished product probability is less than or equal to the probability threshold, setting a plurality of exposure process parameter variable intervals and a plurality of etching process parameter variable intervals according to the exposure process control parameters and the etching process control parameters;

[0058] S62: performing a control variable analysis based on the finished product probability identification model according to the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals to generate a kth finished product probability;

[0059] S63: When the kth finished product probability is greater than the probability threshold, setting the kth exposure process control parameter to the exposure process control parameter optimization result, and setting the kth etching process control parameter to the etching process control parameter optimization result;

[0060] S64: When the kth finished product probability is less than or equal to the probability threshold, determine whether the kth finished product probability is less than the k-1th finished product probability;

[0061] S65: If it is not less than, add the k-1th exposure process control parameter and the k-1th etching process control parameter into the eliminated data group, continue to iterate based on the kth exposure process control parameter and the kth etching process control parameter, and output the optimal solution when the preset number of times is met, and set it as the exposure process control parameter optimization result and the etching process control parameter optimization result.

[0062] Specifically, when the finished product probability is less than or equal to a probability threshold, the exposure process control parameters and the etching process control parameters are optimized to generate exposure process control parameter optimization results and etching process control parameter optimization results, specifically including: when the finished product probability is less than or equal to the probability threshold (the probability threshold is a preset parameter indicator), according to the exposure process control parameters and the etching process control parameters, reverse deduction is performed one by one to set multiple exposure process parameter variable intervals (variable value intervals of exposure position, angle, time, frequency, light intensity, etc.) and multiple etching process parameter variable intervals (variable value intervals of etching position, duration, illumination angle, illumination intensity, positive and negative voltage deviation of anode and cathode, etc.); according to the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals, a control variable analysis is performed based on the finished product probability identification model to generate the kth finished product probability;

[0063] When the k-th finished product probability is greater than the probability threshold, directly using the k-th exposure process control parameter and the k-th etching process control parameter of the k-th finished product, setting the k-th exposure process control parameter to the exposure process control parameter optimization result, and setting the k-th etching process control parameter to the etching process control parameter optimization result;

[0064] When the k-th finished product probability is less than or equal to the probability threshold, determine whether the k-th finished product probability is less than the k-1-th finished product probability; if the k-th finished product probability is not less than the k-1-th finished product probability (the k-th finished product is not inferior to the k-1-th finished product), add the k-1-th exposure process control parameter and the k-1-th etching process control parameter to the eliminated data group (if the preset elimination time is exceeded, the data exceeding the storage time is directly deleted from the eliminated data group), and continue to iterate based on the k-th exposure process control parameter and the k-th etching process control parameter (if the k-th finished product probability is less than the k-th -1 finished product probability (the kth finished product is inferior to the k-1th finished product), the kth exposure process control parameter and the kth etching process control parameter are added to the eliminated data group, and iteration is continued based on the k-1th exposure process control parameter and the k-1th etching process control parameter), and when the preset number of times is met, the optimal solution is output (the optimal solution is that the exposure process control parameter and the etching process control parameter appear with a high probability), and the optimal solution is set as the exposure process control parameter optimization result and the etching process control parameter optimization result, to provide support for the operability and yield of the exposure process and the etching process.

[0065] Step S62 includes the steps of:

[0066] S621: Randomly extracting a first type of variable according to the multiple exposure process parameter variable intervals, wherein the first type of variable includes a single control parameter variable or multiple control parameter variables;

[0067] S622: Randomly extracting a second type of variable according to the multiple etching process parameter variable intervals, wherein the second type of variable includes a single control parameter variable or multiple control parameter variables;

[0068] S623: Combining the first type variables and the second type variables to generate a kth group of process control parameters;

[0069] S624: Input the kth group of process control parameters into the finished product probability identification model to generate the kth finished product probability.

[0070] Specifically, according to the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals, a control variable analysis is performed based on the finished product probability identification model to generate the kth finished product probability, specifically including: randomly extracting (random extraction is an existing technology, and the parameter variables randomly fall in the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals, ensuring the randomness of the parameter variables) first type variables according to the multiple exposure process parameter variable intervals, the first type variables include a single control parameter variable or multiple control parameter variables; randomly extracting second type variables according to the multiple etching process parameter variable intervals, the second type variables include a single control parameter variable or multiple control parameter variables; combining the first type variables and the second type variables to generate the kth group of process control parameters; inputting the kth group of process control parameters as input data into the finished product probability identification model, performing control variable analysis (historical experience data analysis of control variables, the historical experience data including historical exposure process control parameters and historical etching process control parameters) through the finished product probability identification model to obtain the kth finished product probability and provide a reference for data substitution operation.

[0071] Step S623 includes the following steps:

[0072] S623-1: Set the first type variable as a variable to generate a first subgroup of the kth group of process control parameters;

[0073] S623-2: Set the second type variable as a variable to generate a second subgroup of the kth group of process control parameters;

[0074] S623-3: Set the first type variable and the second type variable as variables to generate a third subgroup of the kth group of process control parameters;

[0075] S623 - 4 : Add the first subgroup of the kth group of process control parameters, the second subgroup of the kth group of process control parameters, and the third subgroup of the kth group of process control parameters into the kth group of process control parameters.

[0076] Specifically, the first type of variables and the second type of variables are combined to generate the kth group of process control parameters, which specifically includes: setting the first type of variables as the variables of the carrier program in the exposure processing channel to generate the first subgroup of the kth group of process control parameters; setting the second type of variables as the variables of the carrier program in the etching processing channel to generate the second subgroup of the kth group of process control parameters; setting the first type of variables and the second type of variables as the common variables of the carrier programs in the exposure processing channel and the etching processing channel to generate the third subgroup of the kth group of process control parameters; adding the first subgroup of the kth group of process control parameters, the second subgroup of the kth group of process control parameters and the third subgroup of the kth group of process control parameters into the kth group of process control parameters to facilitate subsequent variable setting.

[0077] S70: Initializing an exposure processing channel according to the exposure process control parameter optimization result, initializing an etching processing channel according to the etching process control parameter optimization result, and then processing the fourth state transparent glass substrate to generate a transparent base circuit board.

[0078] Specifically, a processing initialization operation is performed, and an exposure processing channel is initialized according to the optimization result of the exposure process control parameters. An etching processing channel is initialized according to the optimization result of the etching process control parameters. After the processing initialization is completed, the fourth-state transparent glass substrate is processed according to the initialized exposure processing channel and the initialized etching processing channel to generate a transparent-based circuit board. This greatly improves the control of the production process quality of the transparent-based circuit board, eliminates the probability instability of the finished product caused by manual adjustment, and improves the rationality and accuracy of the production process control of the transparent-based circuit board.

[0079] In summary, the method and system for optimizing the manufacturing process of a transparent substrate circuit board provided in the embodiments of the present application have the following technical effects:

[0080] 1. Due to the adoption of obtaining a buffer layer coating channel and an etching layer coating channel; inputting the buffer layer coating channel for coating to generate a second-state transparent glass substrate, inputting the etching layer coating channel for coating to generate a third-state transparent glass substrate; bonding to generate a fourth-state transparent glass substrate, performing production prediction, and obtaining a finished product probability; when the finished product probability is less than or equal to the probability threshold, optimizing the exposure process control parameters and the etching process control parameters, generating exposure process control parameter optimization results and etching process control parameter optimization results, initializing the exposure processing channel, processing the fourth-state transparent glass substrate, and generating a transparent base circuit board, the present application provides a transparent base circuit board preparation process optimization method and system, which realizes the use of production prediction to obtain the finished product probability, optimizes and adjusts the process control parameters based on the finished product probability, improves the operability of the transparent base circuit board preparation process optimization, reduces the operational difficulty of the transparent base circuit board preparation process optimization, improves the stability of the quality of the processed finished product, and effectively ensures the technical effect of the qualified rate of the finished product.

[0081] 2. When the exposure process control parameters are input into the finished product probability identification model, the exposure finished product probability identification layer is activated and the exposure finished product probability is output; when the etching process control parameters are input into the finished product probability identification model, the etching finished product probability identification layer is activated and the etching finished product probability is output; probability fusion is performed to obtain the finished product probability, providing support for ensuring the stability of the finished product probability.

[0082] Example 2

[0083] Based on the same inventive concept as the method for optimizing the preparation process of a transparent base circuit board in the aforementioned embodiment, Figure 4 As shown, an embodiment of the present application provides a system for optimizing the preparation process of a transparent base circuit board, wherein the system includes:

[0084] The coating channel acquisition module 100 is used to acquire the buffer layer coating channel and the etching layer coating channel according to the PVD vacuum coating equipment;

[0085] The second-state substrate generating module 200 is configured to input the first-state transparent glass substrate into the buffer layer coating channel for coating to generate a second-state transparent glass substrate;

[0086] The third-state substrate generating module 300 is configured to input the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate;

[0087] A fourth-state substrate generating module 400 is configured to bond the etched circuit print to the third-state transparent glass substrate to generate a fourth-state transparent glass substrate;

[0088] A finished product probability obtaining module 500 is used to perform production prediction based on exposure process control parameters and etching process control parameters to obtain a finished product probability;

[0089] A process control parameter optimization module 600 is configured to optimize the exposure process control parameters and the etching process control parameters when the finished product probability is less than or equal to a probability threshold, and generate exposure process control parameter optimization results and etching process control parameter optimization results;

[0090] The processing module 700 is used to initialize the exposure processing channel according to the exposure process control parameter optimization result, initialize the etching processing channel according to the etching process control parameter optimization result, and then process the fourth state transparent glass substrate to generate a transparent base circuit board.

[0091] Furthermore, the system includes:

[0092] a buffer layer data matching module, configured to match a buffer layer material type, a buffer layer thickness parameter, and a buffer layer area parameter according to the transparent glass substrate in the first state;

[0093] A first control parameter screening module is used to screen the buffer layer coating control parameters based on the first cloud particle library according to the buffer layer material type, the buffer layer thickness parameter and the buffer layer area parameter;

[0094] The first coating operation module is configured to control the buffer layer coating channel to coat the transparent glass substrate in the first state using the buffer layer coating control parameter to generate the transparent glass substrate in the second state.

[0095] Furthermore, the system includes:

[0096] a control particle acquisition module, configured to input the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter into the first cloud particle library to acquire a plurality of buffer layer coating control particles;

[0097] A traversal extraction module is used to traverse the plurality of buffer layer coating control particles and extract a plurality of groups: a buffer material sputtering position, a buffer material unit sputtering amount, a buffer material sputtering frequency, and a buffer material sputtering time;

[0098] a support generation module, configured to perform credibility evaluation on the plurality of buffer layer coating control particles according to the plurality of groups of trigger frequency characteristics of: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency, and buffer material sputtering time, and generate a plurality of particle support degrees;

[0099] The buffer layer coating control parameter generation module is used to screen the maximum particle support according to the multiple particle support degrees and generate the buffer layer coating control parameters.

[0100] Furthermore, the system includes:

[0101] a parameter matching module, configured to match a copper film thickness parameter and a copper film area parameter according to the transparent glass substrate in the second state;

[0102] A second control parameter screening module is used to screen the etching layer coating control parameters based on the second cloud particle library according to the copper film thickness parameter and the copper film area parameter;

[0103] The second coating operation module is configured to control the etching layer coating channel to coat the second-state transparent glass substrate using the etching layer coating control parameters to generate the third-state transparent glass substrate.

[0104] Furthermore, the system includes:

[0105] An exposure finished product probability output module is configured to activate an exposure finished product probability identification layer and output an exposure finished product probability when the exposure process control parameters are input into a finished product probability identification model;

[0106] An etching finished product probability output module is used to activate the etching finished product probability identification layer and output the etching finished product probability when the etching process control parameters are input into the finished product probability identification model;

[0107] A probability fusion module is used to fuse the exposure finished product probability and the etching finished product probability to obtain the finished product probability.

[0108] Furthermore, the system includes:

[0109] a parameter variable interval setting module, configured to set a plurality of exposure process parameter variable intervals and a plurality of etching process parameter variable intervals according to the exposure process control parameters and the etching process control parameters when the finished product probability is less than or equal to the probability threshold;

[0110] a control variable analysis module, configured to perform control variable analysis based on the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals and the finished product probability identification model to generate a kth finished product probability;

[0111] a parameter optimization result setting module, configured to set the kth exposure process control parameter to the exposure process control parameter optimization result, and set the kth etching process control parameter to the etching process control parameter optimization result, when the kth finished product probability is greater than the probability threshold;

[0112] A finished product probability judgment module is used to judge whether the kth finished product probability is less than the k-1th finished product probability when the kth finished product probability is less than or equal to the probability threshold;

[0113] A parameter iteration module is used to add the k-1th exposure process control parameter and the k-1th etching process control parameter into the eliminated data group if it is not less than, continue to iterate based on the kth exposure process control parameter and the kth etching process control parameter, and output the optimal solution when the preset number of times is met, which is set as the exposure process control parameter optimization result and the etching process control parameter optimization result.

[0114] Furthermore, the system includes:

[0115] A first random extraction module is configured to randomly extract a first type of variable according to the plurality of exposure process parameter variable intervals, wherein the first type of variable includes a single control parameter variable or multiple control parameter variables;

[0116] A second random extraction module is configured to randomly extract a second type of variable according to the plurality of etching process parameter variable intervals, wherein the second type of variable includes a single control parameter variable or multiple control parameter variables;

[0117] a variable combination module, configured to combine the first type of variables and the second type of variables to generate a kth group of process control parameters;

[0118] The kth finished product probability generation module is used to input the kth group of process control parameters into the finished product probability identification model to generate the kth finished product probability.

[0119] Furthermore, the system includes:

[0120] a first subgroup generating module, configured to set the first type of variables as variables to generate a first subgroup of the kth group of process control parameters;

[0121] a second subgroup generating module, configured to set the second type variable as a variable to generate a kth group of process control parameters of the second subgroup;

[0122] a third subgroup generating module, configured to set the first type variables and the second type variables as variables to generate a kth group of process control parameters, a third subgroup;

[0123] The process control parameter adding module is used to add the first subgroup of the kth group of process control parameters, the second subgroup of the kth group of process control parameters and the third subgroup of the kth group of process control parameters into the kth group of process control parameters.

[0124] Any step of the method described above can be stored as a computer instruction or program in an unlimited computer memory, and can be called and recognized by an unlimited computer processor to implement any method in the embodiments of the present application, without any unnecessary restrictions.

[0125] Furthermore, the terms "first" or "second" as described above may not only represent an order relationship but may also represent a specific concept and / or refer to the selection of multiple elements individually or collectively. Obviously, those skilled in the art may make various modifications and variations to this application without departing from the scope of this application. Thus, if such modifications and variations fall within the scope of this application and its equivalents, this application is intended to include such modifications and variations.

Claims

1. A method for optimizing the preparation process of a transparent base circuit board, characterized in that: A machine tool for preparing a transparent base circuit board, the machine tool comprising a PVD vacuum coating device, the PVD vacuum coating device comprising a buffer layer coating channel and an etching layer coating channel, comprising: According to the PVD vacuum coating equipment, a buffer layer coating channel and an etching layer coating channel are obtained; Inputting the transparent glass substrate in the first state into the buffer layer coating channel for coating to generate a transparent glass substrate in the second state; inputting the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate; Bonding the etched circuit print and the third-state transparent glass substrate to form a fourth-state transparent glass substrate; Make production predictions based on exposure process control parameters and etching process control parameters to obtain the probability of finished products; When the finished product probability is less than or equal to a probability threshold, optimizing the exposure process control parameters and the etching process control parameters to generate exposure process control parameter optimization results and etching process control parameter optimization results; After initializing the exposure processing channel according to the exposure process control parameter optimization result and initializing the etching processing channel according to the etching process control parameter optimization result, the fourth state transparent glass substrate is processed to generate a transparent base circuit board.

2. The method according to claim 1, wherein The step of inputting the transparent glass substrate in the first state into the buffer layer coating channel for coating to generate the transparent glass substrate in the second state comprises: According to the transparent glass substrate in the first state, matching the buffer layer material type, buffer layer thickness parameter and buffer layer area parameter; Screening buffer layer coating control parameters based on the first cloud particle library according to the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter; The buffer layer coating control parameter is used to control the buffer layer coating channel to coat the transparent glass substrate in the first state to generate the transparent glass substrate in the second state.

3. The method according to claim 2, wherein The step of screening the buffer layer coating control parameters based on the first cloud particle library according to the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter includes: Inputting the buffer layer material type, the buffer layer thickness parameter, and the buffer layer area parameter into the first cloud-based particle library to obtain a plurality of buffer layer coating control particles; Traversing the plurality of buffer layer coating control particles, extracting a plurality of groups: a buffer material sputtering position, a buffer material unit sputtering amount, a buffer material sputtering frequency, and a buffer material sputtering time; performing credibility evaluation on the plurality of buffer layer coating control particles according to the plurality of groups of trigger frequency characteristics of: buffer material sputtering position, buffer material unit sputtering amount, buffer material sputtering frequency, and buffer material sputtering time, to generate a plurality of particle support levels; The maximum particle support is screened according to the multiple particle support degrees to generate the buffer layer coating control parameters.

4. The method according to claim 1, wherein The step of inputting the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate comprises: According to the transparent glass substrate in the second state, matching the copper film thickness parameter and the copper film area parameter; According to the copper film thickness parameter and the copper film area parameter, based on the second cloud particle library, the etching layer coating control parameters are screened; The etching layer coating control parameter is used to control the etching layer coating channel to coat the second-state transparent glass substrate to generate the third-state transparent glass substrate.

5. The method according to claim 1, wherein Production prediction is performed based on exposure process control parameters and etching process control parameters to obtain the probability of finished product, including: When the exposure process control parameters are input into the finished product probability identification model, the exposure finished product probability identification layer is activated and the exposure finished product probability is output; When the etching process control parameters are input into the finished product probability identification model, the etching finished product probability identification layer is activated and the etching finished product probability is output; The exposure finished product probability and the etching finished product probability are combined to obtain the finished product probability.

6. The method according to claim 5, wherein When the finished product probability is less than or equal to a probability threshold, optimizing the exposure process control parameters and the etching process control parameters to generate exposure process control parameter optimization results and etching process control parameter optimization results, including: When the finished product probability is less than or equal to the probability threshold, setting a plurality of exposure process parameter variable intervals and a plurality of etching process parameter variable intervals according to the exposure process control parameters and the etching process control parameters; According to the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals, performing a control variable analysis based on the finished product probability identification model to generate a kth finished product probability; When the kth finished product probability is greater than the probability threshold, setting the kth exposure process control parameter to the exposure process control parameter optimization result, and setting the kth etching process control parameter to the etching process control parameter optimization result; When the kth finished product probability is less than or equal to the probability threshold, determining whether the kth finished product probability is less than the k-1th finished product probability; If it is not less than, add the k-1th exposure process control parameter and the k-1th etching process control parameter into the eliminated data group, continue to iterate based on the kth exposure process control parameter and the kth etching process control parameter, and output the optimal solution when the preset number of times is met, which is set as the exposure process control parameter optimization result and the etching process control parameter optimization result.

7. The method according to claim 6, wherein The step of performing a control variable analysis based on the multiple exposure process parameter variable intervals and the multiple etching process parameter variable intervals and the finished product probability identification model to generate a kth finished product probability includes: Randomly extracting a first type of variable according to the multiple exposure process parameter variable intervals, wherein the first type of variable includes a single control parameter variable or multiple control parameter variables; Randomly extracting a second type of variable according to the multiple etching process parameter variable intervals, wherein the second type of variable includes a single control parameter variable or multiple control parameter variables; combining the first type of variables and the second type of variables to generate a kth group of process control parameters; The kth group of process control parameters is input into the finished product probability identification model to generate the kth finished product probability.

8. The method according to claim 7, wherein The combining of the first type variables and the second type variables to generate the kth group of process control parameters includes: The first type of variable is set as a variable to generate a first subgroup of the kth group of process control parameters; The second type of variable is set as a variable to generate a second subgroup of the kth group of process control parameters; The first type variable and the second type variable are set as variables to generate a third subgroup of the kth group of process control parameters; The first subgroup of the kth group of process control parameters, the second subgroup of the kth group of process control parameters, and the third subgroup of the kth group of process control parameters are added to the kth group of process control parameters.

9. A transparent base circuit board preparation process optimization system, characterized in that: A method for optimizing the preparation process of a transparent base circuit board according to any one of claims 1 to 8, comprising: A coating channel acquisition module is used to acquire a buffer layer coating channel and an etching layer coating channel according to a PVD vacuum coating device; A second-state substrate generating module, configured to input the first-state transparent glass substrate into the buffer layer coating channel for coating to generate a second-state transparent glass substrate; A third-state substrate generating module, configured to input the second-state transparent glass substrate into the etching layer coating channel for coating to generate a third-state transparent glass substrate; a fourth-state substrate generating module, configured to bond the etched circuit print and the third-state transparent glass substrate to generate a fourth-state transparent glass substrate; A finished product probability acquisition module is used to make production predictions based on exposure process control parameters and etching process control parameters to obtain the finished product probability; a process control parameter optimization module, configured to optimize the exposure process control parameters and the etching process control parameters when the finished product probability is less than or equal to a probability threshold, and generate an exposure process control parameter optimization result and an etching process control parameter optimization result; The processing module is used to initialize the exposure processing channel according to the exposure process control parameter optimization result, initialize the etching processing channel according to the etching process control parameter optimization result, and then process the fourth state transparent glass substrate to generate a transparent base circuit board.

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