An intelligent BDU

Abstract

The present invention provides an intelligent BDU, which includes an MCU; a daisy-chain communication module is communicatively connected to the daisy-chain communication port of the MCU one by one; a CAN communication module is communicatively connected to the MCU; several detection modules are communicatively connected to the daisy-chain communication module or the CAN communication module; a power supply module is electrically connected to the constant power output terminal of the battery pack, and the power supply module is also communicatively connected to the MCU, the daisy-chain communication module or the CAN communication module; the MCU, the daisy-chain communication module or the CAN communication module selectively wakes up the power supply module to supply power to the several detection modules. This solution has both a daisy-chain communication module and a CAN communication module at the same time, taking into account the communication ranges of different distances and having higher communication reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of high-voltage circuit equipment for new energy vehicles, and particularly to an intelligent BDU. Background Art

[0002] The battery energy distribution unit, also known as the battery cut-off unit, is an important component of the high-voltage circuit of new energy vehicles. It controls the power-on and power-off operations of the high-side electrical circuit and the charging and discharging processes of the battery cells.

[0003] Chinese Patent Application No. CN112550067A discloses a vehicle BDU system that uses a single daisy-chain communication link. Each battery cell parameter acquisition unit and battery pack parameter acquisition unit are serially arranged on this single daisy-chain communication link in sequence. Adjacent devices can communicate directly, which is suitable for short-distance communication. However, when a certain device on the daisy-chain communication link fails, the battery pack acquisition unit far from the central control unit will have a delay and fail to respond, resulting in a reduction in work efficiency and possible data transmission delay and inability to respond in a timely manner. Therefore, it is very necessary to provide an intelligent BDU that can combine the characteristics of short-distance communication and long-distance communication and has more stable communication. Summary of the Invention

[0004] In view of this, the present invention proposes an intelligent BDU that combines short-distance communication and long-distance communication and has more stable communication.

[0005] The technical solution of the present invention is realized as follows: The present invention provides an intelligent BDU, including

[0006] MCU;

[0007] A daisy-chain communication module (1) that is communicatively connected to the daisy-chain communication port of the MCU in one-to-one correspondence;

[0008] A CAN communication module (2) that is communicatively connected to the MCU;

[0009] A plurality of detection modules (4) that are communicatively connected to the daisy-chain communication module (1) or the CAN communication module (2);

[0010] A power supply module (3) that is electrically connected to the constant power output terminal of the battery pack. The power supply module (3) is also communicatively connected to the MCU, the daisy-chain communication module (1) or the CAN communication module (2). The MCU, the daisy-chain communication module (1) or the CAN communication module (2) selectively wakes up the power supply module (3) to supply power to the plurality of detection modules (4).

[0011] Based on the above technical solutions, preferably, the MCU includes a plurality of serial communication ports and GPIO ports. Each of the plurality of serial communication ports includes a clock output terminal, a signal chip select terminal, a data output terminal, and a data input terminal. The daisy chain communication module (1) includes a plurality of slave chips arranged in sequence. The clock input terminals of the plurality of slave chips are electrically connected to the clock output terminal of the serial communication port of the same MCU. The chip select terminals of the plurality of slave chips are electrically connected to the signal chip select terminal of the serial communication port of the same MCU. The input terminal of the slave chip at the head end of the daisy chain communication module (1) is electrically connected to the data output terminal of the serial communication port of the MCU. The output terminal of the current slave chip is electrically connected to the input terminal of the slave chip adjacent to it in sequence. The output terminal of the slave chip at the end of the daisy chain communication module (1) is electrically connected to the data input terminal of the serial communication port of the same MCU.

[0012] Preferably, the power supply module (3) includes a first power management chip IC1 and an isolated power supply unit. The power input terminal of the first power management chip IC1 is electrically connected to the constant power output terminal of the battery pack. The wake-up terminal IGN of the first power management chip IC1 is connected to the GPIO port of the MCU, at least one detection module (4), the wake-up output terminal of the vehicle-mounted VCU, the key ignition switch, or the CAN communication module (2). The first power management chip IC1 is also communicatively connected to a serial communication port of the MCU. The first power management chip IC1 includes a voltage output terminal, a fault protection failure output terminal FSN, and a reset signal output terminal RST. The voltage output terminal outputs a plurality of voltage signals. The voltage signals output by the first power management chip IC1 are used when the MCU, the daisy chain communication module (1), the CAN communication module (2), or the plurality of detection modules (4) are working. The isolated power supply unit is used to output a 12V voltage.

[0013] Preferably, the first power management chip IC1 further includes a sampling unit. The sampling unit is electrically connected to the wake-up output terminal of the vehicle-mounted VCU and at least one voltage output terminal of the first power management chip IC1. The sampling unit samples the output signals of the wake-up output terminal of the vehicle-mounted VCU or at least one voltage output terminal of the first power management chip IC1 and then returns them to the first power management chip IC1.

[0014] Further preferably, the CAN communication module (2) has a URAT port and a CAN bus port. The enable terminal of the CAN communication module (2) is respectively electrically connected to the fault protection failure output terminal FSN and a GPIO port of the MCU. The URAT port of the CAN communication module (2) is communicatively connected to a serial communication port of the MCU. The output terminal INH of the CAN communication module (2) is electrically connected to the wake-up terminal IGN of the first power management chip IC1. The plurality of detection modules (4) are communicatively connected to the CAN bus port.

[0015] Further preferably, the several detection modules (4) include an analog signal detection unit (41) and a PWM signal detection unit (42); the MCU also has several ADC ports; a thermal failure sensor, several temperature sensors and a Hall sensor are further arranged in the BDU; the thermal failure sensor is arranged at the bus bar or contact position of the BDU; the several temperature sensors are arranged at different positions of the BDU; the Hall sensor is arranged at the constant power output end of the battery pack;

[0016] The input end of the analog signal detection unit (41) is electrically connected to the wake-up output end of the thermal failure sensor, the output end of the key ignition switch, the isolated power supply unit, the output ends of the several temperature sensors and the Hall sensor, and the output end of the analog signal detection unit (41) is electrically connected to different ADC ports of the MCU in one-to-one correspondence; the wake-up output end of the thermal failure sensor is electrically connected to the wake-up end IGN of the first power management chip IC1;

[0017] The input end of the PWM signal detection unit (42) is electrically connected to the high-side output end of the BDU, the output end of the airbag sensor and the output end of the thermal failure sensor, and the output end of the PWM signal detection unit (42) is electrically connected to different GPIO ports of the MCU in one-to-one correspondence.

[0018] Even more preferably, the several detection modules (4) further include an insulation test unit (43);

[0019] The insulation test unit (43) includes a first relay, a second relay, several resistors and a metering chip IC3; the several resistors are arranged in sequence with the head and the tail connected, the non-common end of the head resistor is electrically connected to the positive electrode of the battery pack, and the non-common end of the tail resistor is electrically connected to the negative electrode of the battery pack; the normally open contact of the first relay is respectively electrically connected to the negative electrode of the battery pack and the common end of the first resistor and the second resistor, the input end of the first relay is electrically connected to the ISO_det port of the MCU, the normally open contact of the second relay is electrically connected to the common end of the second resistor and the third resistor and the body ground, the coil of the second relay is electrically connected to the ISO_main port of the MCU; the common end of the third resistor and the fourth resistor is electrically connected to the analog-to-digital conversion port of the metering chip IC3; the communication port of the metering chip IC3 is communicatively connected to one serial input port of the MCU in correspondence;

[0020] More preferably, the several detection modules (4) further include a voltage and current detection unit (44); the voltage and current detection unit (44) includes a high-voltage measurement point signal conditioning unit (441) and a shunt resistor (442); the input end of the high-voltage measurement point signal conditioning unit (441) is electrically connected to different positions on the high side of the BDU, and the output end of the high-voltage measurement point signal conditioning unit (441) is electrically connected to different voltage input ends of the metering chip IC3 in one-to-one correspondence; the shunt resistor (442) is arranged on the high side of the BDU to obtain a sampling signal of the current on the high side and input it into the current sampling port of the metering chip IC3.

[0021] Preferably, it further includes a high and low side drive module (5); the high and low side drive module (5) includes a high and low side switch chip IC4 and a high side driver IC5; the serial communication port of the high and low side switch chip IC4 is correspondingly communicatively connected to a serial input port of the MCU; the power input end of the high and low side switch chip IC4 is electrically connected to the output end of the isolated power supply unit; the reset end of the high and low side switch chip IC4 is respectively electrically connected to the GPIO port of the MCU and the reset signal output end RST of the first power management chip IC1, and the output ends of the high and low side switch chip IC4 are respectively electrically connected to the high side relay, low side relay, high side interlock and thermal failure sensor of the BDU; the power input end of the high side driver IC5 is electrically connected to the output end of the isolated power supply unit, and the input end of the high side driver IC5 is respectively electrically connected to a GPIO end of the MCU and the fault protection failure output end FSN of the first power management chip IC1; the output end of the high side driver IC5 outputs at least one high side level signal.

[0022] An intelligent BDU provided by the present invention has the following beneficial effects compared with the prior art:

[0023] (1) By simultaneously setting the daisy chain communication module and the CAN communication module, multiple detection modules can communicate with the daisy chain communication module or the CAN communication module respectively, and the functions of different communication modules are divided: the daisy chain communication module mainly obtains the voltage and temperature information of the battery pack for internal communication of the BDU; the CAN communication module communicates with the vehicle VCU or in-vehicle domain controller to realize external communication of the BDU; each communication module meets the ISO26262 functional requirements, and when any fault occurs, it can store the fault code and alarm.

[0024] (2) The power module is driven by the wake-up signal of an external module or other modules of the BDU, so as to be in a reliable wake-up working state, and can reliably perform short-circuit or closing operations during normal vehicle operation or in case of a fault.

[0025] (3) The detection module can obtain the signals of each sensor, PWM output signal, voltage and current signals on the high-side, or the insulation state of the battery pack, providing a basis for the state switching or state maintenance of the BDU. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0027] Figure 1 It is a structural block diagram of an intelligent BDU of the present invention;

[0028] Figure 2 It is a wiring schematic diagram of the daisy-chain communication module and the MCU of an intelligent BDU of the present invention;

[0029] Figure 3 It is a wiring schematic diagram of the CAN communication module, power supply module and MCU of an intelligent BDU of the present invention;

[0030] Figure 4 It is a wiring schematic diagram of the sampling part of the power supply module and the wake-up terminal of the first power management chip of an intelligent BDU of the present invention;

[0031] Figure 5 It is a partial wiring schematic diagram of the detection module of an intelligent BDU of the present invention;

[0032] Figure 6 It is a wiring schematic diagram of the analog signal detection unit of the detection module of an intelligent BDU of the present invention;

[0033] Figure 7 It is a wiring schematic diagram of the PWM signal detection unit of the detection module of an intelligent BDU of the present invention;

[0034] Figure 8 It is a wiring schematic diagram of the insulation test unit and voltage and current detection unit of the detection module of an intelligent BDU of the present invention;

[0035] Figure 9 It is a wiring schematic diagram of the high-voltage measurement point signal conditioning unit of the detection module of an intelligent BDU of the present invention;

[0036] Figure 10 It is a wiring schematic diagram of the high and low side drive module of an intelligent BDU of the present invention. Detailed Embodiments

[0037] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] As Figure 1 shown, the present invention provides an intelligent BDU, including

[0039] MCU;

[0040] The daisy-chain communication module 1 is communicatively connected to the daisy-chain communication port of the MCU one by one;

[0041] The CAN communication module 2 is communicatively connected to the MCU;

[0042] A plurality of detection modules 4 are communicatively connected to the daisy-chain communication module 1 and the CAN communication module 2; the detection module 4 is used to obtain the output state of the input or output part of the sensors built in or on the vehicle of the BDU, so as to provide a basis for maintaining or switching the state of the BDU;

[0043] The power module 3 is electrically connected to the constant power output terminal of the battery pack, and the power module 3 is also communicatively connected to the MCU, the daisy-chain communication module 1 or the CAN communication module 2; the MCU, the daisy-chain communication module 1 or the CAN communication module 2 selectively wakes up the power module 3 to supply power to the plurality of detection modules 4. Since both the daisy-chain communication module 1 and the CAN communication module 2 are provided, it is applicable to both short-distance communication with the internal modules of the current BDU and wired communication with vehicle-mounted devices over a larger range or communication distance. The daisy-chain communication module 1 is mainly used for information collection and data transmission inside the BDU, while the CAN communication module 2 is mainly used for the communication function between the BDU and external vehicle-mounted devices; by reasonably dividing the work between the two and connecting the same or different detection modules 4, it can avoid the problem of transmission delay of the backend devices caused by a fault in a certain link of the daisy-chain link, and the end daisy-chain link far from the MCU may have a large delay and cannot respond in time, ensuring the reliability and stability of the working state of the BDU. Both the daisy-chain communication module 1 or the CAN communication module 2 obtain the voltage and temperature information of the battery pack and communicate with the vehicle VCU or in-vehicle domain controller. The VCU or in-vehicle domain controller can better implement the power-on and power-off of the battery pack, the estimation of SOC, the battery charge and discharge strategy, and the management of battery safety according to the information provided by the intelligent BDU. The vehicle electrical architecture has realized the reconstruction of the electrical architecture due to the appearance of the intelligent BDU, and the BMS is omitted, and the cost savings are very obvious. Each communication module meets the requirements of ISO26262 function. When any fault occurs, it can store the fault code and give an alarm.

[0044] The MCU includes several serial communication ports and GPIO ports. All of the several serial communication ports include a clock output terminal, a signal chip select terminal, a data output terminal, and a data input terminal. The daisy-chain communication module 1 includes several slave chips arranged in sequence. The clock input terminals of the several slave chips are electrically connected to the clock output terminal of the serial communication port of the same MCU. The chip select terminals of the several slave chips are electrically connected to the signal chip select terminal of the serial communication port of the same MCU. The input terminal of the slave chip at the head of the daisy-chain communication module 1 is electrically connected to the data output terminal of the serial communication port of the MCU. The output terminal of the current slave chip is electrically connected to the input terminal of the slave chip adjacent to it in sequence. The output terminal of the slave chip at the end of the daisy-chain communication module 1 is electrically connected to the data input terminal of the serial communication port of the same MCU. The serial communication port of the MCU, such as the SPI port, can constitute the communication between the slave chips arranged in sequence, that is Figure 2 as shown in SLAVE1, SLAVE2,... The commands sent by the MCU can directly communicate between adjacent slave chips, with relatively low cost. The command sent from the DOUT port of the previous slave chip can be directly transmitted to the DIN port of the next adjacent slave chip, and the instruction reaching the corresponding slave chip can execute the corresponding command. If the CS pin of the corresponding slave chip is at a high level, there will be no output from the DOUT port of this slave chip. The MCU can use SPC574S64E3C, which is an automotive-grade 32-bit MCU with rich communication interfaces and general-purpose input / output interfaces GPIO.

[0045] such as Figure 3 and Figure 4 as shown, the power supply module 3 includes a first power management chip IC1 and an isolated power supply unit. The power input terminal of the first power management chip IC1 is electrically connected to the constant power output terminal of the battery pack. The wake-up terminal IGN of the first power management chip IC1 is connected to the GPIO port of the MCU, at least one detection module 4, the wake-up output terminal of the vehicle-mounted VCU, the key ignition switch, or the CAN communication module 2. The first power management chip IC1 is also communicatively connected to a serial communication port of the MCU. The first power management chip IC1 includes a voltage output terminal, a fault protection failure output terminal FSN, and a reset signal output terminal RST. The voltage output terminal outputs several voltage signals. The voltage signals output by the first power management chip IC1 are used when the MCU, the daisy-chain communication module 1, the CAN communication module 2, or several detection modules 4 are working. The isolated power supply unit is used to output a 12V voltage.

[0046] by Figure 3It can be known that VBAT is a constant power input signal from the battery pack. FSN is the output terminal of the fault protection failure, and RST is the output terminal of the reset signal; VDD5, VCC5, VCC, Vsensor1, and Vsensor2 output different 5V signals, and UBR is a DC voltage above 12V. The WAKEUP part of the first power management chip IC1, as Figure 4 shown, that is, the wake-up terminal IGN is simultaneously controlled by multiple signals, such as the VCU_WK signal input from the wake-up output terminal of the vehicle-mounted VCU, the KEY_ON signal from the key ignition switch, the MCU_WK signal from the GPIO0 port of the MCU, the SMOKE_WK signal from the detection module 4, and the INH signal input from the CAN communication module 2. When any one of the input high-level signals passes through the voltage division of the resistor R47 and the resistor R48, it serves as the input signal of IGN to wake up the first power management chip IC1, so that it outputs different voltage signals for different modules to use.

[0047] The power-on logic of the wake-up terminal IGN is as follows: 1) When the VCU_WK signal, the KEY_ON signal, or the SMOKE_WK signal is all at a high level, at this time, the first power management chip IC1 outputs VCC for the MCU to use, and the MCU continuously outputs a high-level MCU_WK signal to keep the wake-up terminal IGN at a high-level state; 2) When the VCU_WK signal, the KEY_ON signal, and the SMOKE_WK signal are all at a low level, and the INH signal of the CAN communication module 2 is at a high level, at this time, the first power management chip IC1 is woken up to output VCC, and the MCU continuously outputs a high-level MCU_WK signal to keep the wake-up terminal IGN at a high-level state; 3) When the VCU_WK signal, the KEY_ON signal, the SMOKE_WK signal, and the INH signal of the CAN communication module 2 are all at a low level, the slave chip on the daisy chain communication module 1 outputs a high-level signal to the MCU, and the MCU itself outputs a high-level MCU_WK signal or drives the CAN communication module 2 to output a high-level INH signal to keep the first power management chip IC1 in a wake-up state.

[0048] The power-off logic of the wake-up terminal IGN is as follows: After the key is removed, the KEY_ON signal is at a low level. After the MCU obtains no voltage or current signal on the high-side through several detection modules 4, it outputs a low-level MCU_WK signal to the wake-up terminal IGN, so that the first power management chip IC1 enters the sleep state.

[0049] The output terminal FSN of the fault protection failure is electrically connected to the enable terminal of the CAN communication module 2 and the enable terminals of the slave chips of the daisy chain communication module 1. As Figure 2As shown, the enable terminals EN of the slave chips of different daisy-chain communication modules 1 are respectively determined by the output signal of the fault protection failure output terminal FSN and the output states of different GPIO ports of the MCU. Here, an AND gate is used, that is, when both the FSN and different GPIO ports of the MCU, such as GPIO17, GPIO18, or GPIO19, are at high level, the slave chip is enabled. Of course, a triode or MOS transistor structure can also be used here. The GPIO port of the MCU outputs a control level, and the output signal of the fault protection failure output terminal FSN is connected to the collector of the triode or the drain of the MOS transistor. The enable terminal EN of the slave chip is connected to the emitter of the triode or the source of the MOS transistor, which can also achieve a similar switching effect.

[0050] Figure 4 The first power management chip IC1 also includes a sampling unit; the sampling unit is electrically connected to the wake-up output terminal of the vehicle-mounted VCU and at least one voltage output terminal of the first power management chip IC1. The sampling unit samples the output signal of the wake-up output terminal of the vehicle-mounted VCU or at least one voltage output terminal of the first power management chip IC1 and then returns it to the first power management chip IC1. The sampling unit provides the ability to monitor some wake-up signals and output voltage signals. That is, the first power management chip IC1 can obtain the sampling signals AN_VCU_WK, AN_Vsensor1, and AN_Vsensor2 of VCU_WK, Vsensor1, and Vsensor2 through a voltage division circuit. The sampling signals are sent into the ADC module built in the first power management chip IC1, and according to the magnitude of the sampling signals, it is inferred whether VCU_WK, Vsensor1, and Vsensor2 meet the requirements.

[0051] Similarly, as Figure 3 As shown, the CAN communication module 2 has a URAT port and a CAN bus port. The enable terminals of the CAN communication module 2 are respectively electrically connected to the fault protection failure output terminal FSN and a GPIO port of the MCU; the URAT port of the CAN communication module 2 is communicatively connected to a serial communication port of the MCU; the output terminal INH of the CAN communication module 2 is electrically connected to the wake-up terminal IGN of the first power management chip IC1; several detection modules 4 are communicatively connected to the CAN bus port. The output signal of the fault protection failure output terminal FSN or the signal of the CAN1_EN port of the MCU can enable the CAN communication module 2 to keep it in a reliable working state.

[0052] As Figure 5As shown in FIG. 7 , the detection modules 4 include an analog signal detection unit 41 and a PWM signal detection unit 42. The MCU also has several ADC ports. The BDU is also provided with a thermal failure sensor, several temperature sensors, and a Hall sensor. The thermal failure sensor is provided at a copper bus or contact position of the BDU, and the thermal failure sensor is replaced by a SMOKE. The temperature sensors are provided at different positions of the BDU. The Hall sensor is provided at the normal power output end of the battery pack, and the symbol of the Hall sensor is HALL.

[0053] The input end of the analog signal detection unit 41 is electrically connected to the wake-up output end of the thermal failure sensor, the output end of the key ignition switch, the isolated power supply unit, several temperature sensors and the output end of the Hall sensor. The output end of the analog signal detection unit 41 is electrically connected to different ADC ports of the MCU in a one-to-one correspondence; the wake-up output end of the thermal failure sensor is electrically connected to the wake-up end IGN of the first power management chip IC1.

[0054] Specific as Figure 5 and 6 As shown, the thermal failure sensor's wake-up output, SMOKE_WK, passes through a surge absorption and voltage divider circuit formed by a TPS transistor, resistors R34, R35, and capacitor C56 to generate the AN_SMOKE_WK signal. Similarly, the ignition key's output input, KEY_ON, generates the AN_KEY_ON signal. The isolated power supply unit's output voltage, UBR, passes through a voltage divider circuit formed by resistors R28 and R30 to generate the AN_UBR signal. The corresponding circuits for several temperature sensors and Hall effect sensors are similar, all using pull-up resistors and voltage divider resistors to generate the corresponding temperature signals, AN_TEMP, and Hall effect sensor processing signals, AN_HALL. I_A_RES is a reserved port. The AN_SMOKE_WK, AN_UBR, AN_KEY_ON, AN_TEMP, and AN_HALL signals are all electrically connected to the MCU's built-in ADC ports.

[0055] The input end of the PWM signal detection unit 42 is electrically connected to the high-side output end of the BDU, the output end of the airbag sensor, and the output end of the thermal failure sensor. The output end of the PWM signal detection unit 42 is electrically connected to different GPIO ports of the MCU in a one-to-one correspondence. Figure 5 and Figure 7As shown, the signal I_F_HV_BACK obtained from the high-side interlock output terminal HSD_HVIL is pulled up and voltage-divided to obtain the level signal DI_HV_BACK. The same applies to the other recording circuits. The output signal I_F_SRS / Emer of the airbag sensor is correspondingly converted into the level signal DI_SRS / Emer, and the output signal I_F_SMOKE of the thermal failure sensor is correspondingly converted into the level signal DI_SMOKE. Similarly, I_F_RES is a reserved port. These level signals are all sent to different GPIO ports of the MCU, such as GPIO4, GPIO5, GPIO6, and GPIO7.

[0056] As Figure 8 As shown, several detection modules 4 further include an insulation test unit 43; the insulation test unit 43 is used to test the insulation state of the positive or negative pole of the battery pack.

[0057] The insulation test unit 43 includes a first relay, a second relay, several resistors, and a metering chip IC3; the several resistors are sequentially connected end to end. The non-common end of the first resistor at the head end is electrically connected to the positive pole of the battery pack, and the non-common end of the last resistor at the tail end is electrically connected to the negative pole of the battery pack; the normally open contacts of the first relay are respectively electrically connected to the negative pole of the battery pack and the common end of the first resistor R1 and the second resistor R2. The input end of the first relay is electrically connected to the ISO_det port of the MCU. The normally open contact of the second relay is electrically connected to the common end of the second resistor R2 and the third resistor R3 and the body ground. The coil of the second relay is electrically connected to the ISO_main port of the MCU; the common end of the third resistor R3 and the fourth resistor R4 is electrically connected to the analog-to-digital conversion port of the metering chip IC3; the communication port of the metering chip IC3 is correspondingly communicatively connected to a serial input port of the MCU. The first relay and the second relay are the box parts shown in the figure. The input signals of the first relay and the second relay come from the ISO_det port of the MCU and the ISO_main port of the MCU respectively.

[0058] When insulation detection is required, the ISO_main port of the MCU outputs a low level, and the positive and negative poles of the battery pack are disconnected from the body ground.

[0059] When insulation testing is required, the ISO_main port outputs a high level, the normally open contact of the second relay closes, and the vehicle body ground is connected to the positive and negative poles of the battery pack. 1) At this time, if the ISO_det port is low, the battery pack positive electrode insulation resistance R+ is connected in parallel with the first resistor R1 and the second resistor R2 in series, that is, R+ / / (R1+R2). The battery pack negative electrode insulation resistance R- is connected in parallel with the third resistor R3 and the fourth resistor R4 in series, and R- / / (R3+R4). Since R1=R2=R3=3M ohms, let R1=R2=R3=R, and the voltage Uan_vx1 obtained at the AN_VX terminal is U*[(R / / R-) / (R / / R-+2R / / R+)]*R4 / (R4+R); 2) Output the ISO_det port high. The battery pack's negative electrode insulation resistance R- is connected in parallel with the second resistor R2 and the third and fourth resistors R3 and R4 connected in series. At this time, the voltage obtained at the AN_VX terminal, Uan_vx2=U*[R / / R- / / (R+R4) / (R / / R- / / (R+R4)+R+)]*R4 / (R4+R); U is the open-circuit voltage of the battery pack. By combining the two equations, the battery pack's positive electrode insulation resistance R+ and negative electrode insulation resistance R- can be calculated.

[0060] like Figure 8 and 9 As shown, several detection modules 4 also include a voltage and current detection unit 44; this voltage and current detection unit 44 includes a high-voltage measurement point signal conditioning unit 441 and a shunt 442. The input of the high-voltage measurement point signal conditioning unit 441 is electrically connected to different locations on the high-side of the BDU, and the output of the high-voltage measurement point signal conditioning unit 441 is electrically connected to different voltage inputs of the metering chip IC3 in a one-to-one correspondence. The shunt 442 is located on the high-side of the BDU, obtains a sampling signal of the high-side current, and inputs it into the current sampling port of the metering chip IC3. The metering chip IC3 in this solution can be selected from the LTC2949 chip from Analog Devices. The high-voltage measurement point signal conditioning unit 441 shown in the figure has five input signals: VA, VD, VC, VG, and VI. After voltage division and RC filtering through serially arranged resistors, the five signals AN_VA, AN_VD, AN_VC, AN_VG, and AN_VI are output to the metering chip IC3. Each detection module 4 of this solution can communicate with the CAN communication module 2 and the MCU through the CAN bus, or can choose to join the ring link formed by the daisy-chain communication module 1 and the MCU through its own SPI port to achieve redundant channel transmission. Even if one communication method fails, reliable communication can still be carried out in time.

[0061] A number of detection modules 4 connected to the daisy-chain communication module 1 perform two-way signal transmission one by one in a ring topology. When the MCU issues an instruction to the daisy-chain communication module 1 at time T1, the slave chips on the daisy chain sequentially execute the corresponding instructions. At the same time, the MCU will count the information returned by each slave chip after executing the corresponding instruction. If the delay between the arrival time T2 of the information returned by a certain slave chip and the time T1 is greater than the time delay threshold T, then the slave chip and the slave chips behind it are selected to communicate with the MCU, VCU or in-vehicle domain controller through the CAN bus, so as to avoid the problem of untimely communication caused by excessive delay in a certain link of the daisy-chain communication, which affects the reliability of the communication actions of the BDU or other in-vehicle devices. The units of the above T1, T2, and T are seconds or milliseconds.

[0062] The ISO26262 "Functional Safety of Road Vehicles" international standard is a standard related to the safety of the electronic and electrical systems of passenger cars. This standard describes and defines the possible dangerous behaviors and fault codes of passenger cars, including new energy vehicles, that may be caused by the electronic and electrical systems of passenger cars. By setting the codes of relevant faults, it is possible to know which link has what problem; fault codes, the severity of the faults and possible consequences, combined with the mutually redundant daisy-chain communication and CAN communication constructed above, are to better eliminate the phenomenon of untimely or excessive delay in instruction transmission, so that after a vehicle accidentally collides, it can timely feedback the corresponding sensing detection signals, prompt the BDU to act in time, and avoid the further occurrence of accidents.

[0063] Such as Figure 10As shown in the figure, the intelligent BDU of this solution further includes a high and low side drive module 5; the high and low side drive module 5 includes a high and low side switch chip IC4 and a high side driver IC5; the serial communication port of the high and low side switch chip IC4 is correspondingly communicatively connected to a serial input port of the MCU; the power input end of the high and low side switch chip IC4 is electrically connected to the output end of the isolated power supply unit; the reset end of the high and low side switch chip IC4 is respectively electrically connected to the GPIO port of the MCU and the reset signal output end RST of the first power management chip IC1. The output end of the high and low side switch chip IC4 is respectively electrically connected to the high side relay, low side relay, high side interlock and thermal failure sensor of the BDU. The reset end of the high and low side switch chip IC4 can also be connected to the GPIO port of the MCU and the reset signal output end RST of the first power management chip IC1 in the form of a triode and a MOS tube. The connection method is similar to the connection method of the enable end EN of the slave chip of the aforementioned daisy chain communication module 1, and will not be elaborated here. The drive signal of the high side relay is HSD_OUT; the drive signal of the low side relay is LSD_OUT; the high side interlock output signal is the aforementioned HSD_HVIL; the drive signal of the thermal failure sensor is HSD_SMOKE. HSD_RL and LSD_RL are respectively reserved high side output and reserved low side output to realize the drive function of devices or modules on different voltage sides.

[0064] The power input end of the high side driver IC5 is electrically connected to the output end of the isolated power supply unit. The input end of the high side driver IC5 is respectively electrically connected to a GPIO port of the MCU and the fault protection failure output end FSN of the first power management chip IC1; the output end of the high side driver IC5 outputs at least one high side level signal. The ports GPIO9, GPIO10, GPIO11 and GPIO12 of the MCU are channel selection inputs, corresponding to different output channels of the high side driver IC5. The ports GPIO13, GPIO14, GPIO15 and GPIO16 of the MCU and the fault protection failure output end FSN of the first power management chip IC1 respectively determine the input signals input to the high side driver IC5. Here, an AND gate is used. Similarly, a connection method similar to that of the triode or MOS tube of the enable end EN of the slave chip of the aforementioned daisy chain communication module 1 can be used, and will not be elaborated here.

[0065] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An intelligent BDU, characterized in that, including MCU; A daisy-chain communication module (1) which is communicatively connected to the daisy-chain communication ports of the MCU in a one-to-one correspondence; A CAN communication module (2) which is communicatively connected to the MCU; A plurality of detection modules (4) which are communicatively connected to the daisy-chain communication module (1) or the CAN communication module (2); A power supply module (3) which is electrically connected to the constant power output terminal of the battery pack, and the power supply module (3) is also communicatively connected to the MCU, the daisy-chain communication module (1) or the CAN communication module (2); The MCU, the daisy-chain communication module (1) or the CAN communication module (2) selectively wakes up the power supply module (3) to supply power to the plurality of detection modules (4); The MCU includes a plurality of serial communication ports and GPIO ports, and the plurality of serial communication ports each include a clock output terminal, a signal chip select terminal, a data output terminal and a data input terminal; The daisy-chain communication module (1) includes a plurality of slave chips arranged in sequence, the clock input terminals of the plurality of slave chips are electrically connected to the clock output terminal of the serial communication port of the same MCU, the chip select terminals of the plurality of slave chips are electrically connected to the signal chip select terminal of the serial communication port of the same MCU, the input terminal of the slave chip at the head end of the daisy-chain communication module (1) is electrically connected to the data output terminal of the serial communication port of the MCU, the output terminal of the current slave chip is electrically connected to the input terminal of the slave chip adjacent to it in sequence, and the output terminal of the slave chip at the end of the daisy-chain communication module (1) is electrically connected to the data input terminal of the serial communication port of the same MCU.

2. The intelligent BDU according to claim 1, wherein, The power supply module (3) includes a first power management chip IC1 and an isolated power supply unit; The power input terminal of the first power management chip IC1 is electrically connected to the constant power output terminal of the battery pack, the wake-up terminal IGN of the first power management chip IC1 is connected to the GPIO port of the MCU, at least one detection module (4), the wake-up output terminal of the vehicle-mounted VCU, the key ignition switch or the CAN communication module (2); The first power management chip IC1 is also communicatively connected to a serial communication port of the MCU; The first power management chip IC1 includes a voltage output terminal, a fault protection failure output terminal FSN and a reset signal output terminal RST, and the voltage output terminal outputs a plurality of voltage signals; The voltage signals output by the first power management chip IC1 are used when the MCU, the daisy-chain communication module (1), the CAN communication module (2) or the plurality of detection modules (4) work; The isolated power supply unit is used to output 12V voltage.

3. The intelligent BDU according to claim 2, characterized in that, The first power management chip IC1 further includes a sampling part; The sampling part is electrically connected to the wake-up output terminal of the vehicle-mounted VCU and at least one voltage output terminal of the first power management chip IC1, and the sampling part samples the output signal of the wake-up output terminal of the vehicle-mounted VCU or at least one voltage output terminal of the first power management chip IC1 and then returns it to the first power management chip IC1.

4. An intelligent BDU according to claim 2, characterized in that, The CAN communication module (2) has a URAT port and a CAN bus port. The enable terminals of the CAN communication module (2) are electrically connected to the fault protection failure output terminal FSN and a GPIO port of the MCU respectively; the URAT port of the CAN communication module (2) is communicatively connected to a serial communication port of the MCU; the output terminal INH of the CAN communication module (2) is electrically connected to the wake-up terminal IGN of the first power management chip IC1; several detection modules (4) are communicatively connected to the CAN bus port.

5. An intelligent BDU according to claim 4, characterized in that, The several detection modules (4) include an analog signal detection unit (41) and a PWM signal detection unit (42); the MCU also has several ADC ports; a thermal failure sensor, several temperature sensors and a Hall sensor are further arranged in the BDU; the thermal failure sensor is arranged at the bus bar or contact position of the BDU; the several temperature sensors are arranged at different positions of the BDU; the Hall sensor is arranged at the constant power output terminal of the battery pack; The input terminal of the analog signal detection unit (41) is electrically connected to the wake-up output terminal of the thermal failure sensor, the output terminal of the key ignition switch, the isolated power supply unit, the output terminals of the several temperature sensors and the Hall sensor, and the output terminal of the analog signal detection unit (41) is electrically connected to different ADC ports of the MCU in one-to-one correspondence; The wake-up output terminal of the thermal failure sensor is electrically connected to the wake-up terminal IGN of the first power management chip IC1; The input terminal of the PWM signal detection unit (42) is electrically connected to the high-side output terminal of the BDU, the output terminal of the airbag sensor and the output terminal of the thermal failure sensor, and the output terminal of the PWM signal detection unit (42) is electrically connected to different GPIO ports of the MCU in one-to-one correspondence.

6. An intelligent BDU according to claim 5, characterized in that, The several detection modules (4) further include an insulation test unit (43); The insulation test unit (43) includes a first relay, a second relay, several resistors and a metering chip IC3; the several resistors are arranged in sequence with the head and tail connected. The non-common terminal of the head resistor is electrically connected to the positive electrode of the battery pack, and the non-common terminal of the tail resistor is electrically connected to the negative electrode of the battery pack; the normally open contact of the first relay is electrically connected to the negative electrode of the battery pack and the common terminal of the first resistor and the second resistor respectively. The input terminal of the first relay is electrically connected to the ISO_det port of the MCU. The normally open contact of the second relay is electrically connected to the common terminal of the second resistor and the third resistor and the vehicle body ground. The coil of the second relay is electrically connected to the ISO_main port of the MCU; the common terminal of the third resistor and the fourth resistor is electrically connected to the analog-to-digital conversion port of the metering chip IC3; the communication port of the metering chip IC3 is communicatively connected to a serial input port of the MCU in correspondence.

7. An intelligent BDU according to claim 6, characterized in that, The several detection modules (4) further include a voltage and current detection unit (44); the voltage and current detection unit (44) includes a high-voltage measurement point signal conditioning unit (441) and a shunt resistor (442); the input end of the high-voltage measurement point signal conditioning unit (441) is electrically connected to different positions on the high side of the BDU, and the output end of the high-voltage measurement point signal conditioning unit (441) is electrically connected in one-to-one correspondence with different voltage input ends of the metering chip IC3; the shunt resistor (442) is arranged on the high side of the BDU, obtains a sampling signal of the current on the high side, and inputs it into the current sampling port of the metering chip IC3.

8. An intelligent BDU according to claim 2, characterized in that, It further includes a high and low side driving module (5); the high and low side driving module (5) includes a high and low side switch chip IC4 and a high side driver IC5; the serial communication port of the high and low side switch chip IC4 is communicatively connected to a serial input port of the MCU in correspondence; the power input end of the high and low side switch chip IC4 is electrically connected to the output end of the isolated power supply unit; the reset end of the high and low side switch chip IC4 is respectively electrically connected to the GPIO port of the MCU and the reset signal output end RST of the first power management chip IC1, and the output end of the high and low side switch chip IC4 is respectively electrically connected to the high side relay, low side relay, high side interlock and thermal failure sensor of the BDU; the power input end of the high side driver IC5 is electrically connected to the output end of the isolated power supply unit, and the input end of the high side driver IC5 is respectively electrically connected to a GPIO port of the MCU and the fault protection failure output end FSN of the first power management chip IC1; the output end of the high side driver IC5 outputs at least one high side level signal.

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