A flow guide device in a semiconductor shower plate

Abstract

The present invention provides a flow guide device in a semiconductor spray plate. The spray plate comprises an upper cover plate and a spray panel which are sealed and connected at the side circumference. The spray gas is introduced from the air inlet in the center of the upper cover plate and then sprayed to the surface of the semiconductor to be processed through multiple holes on the spray panel. The flow guide device is arranged between the air inlet of the upper cover plate and the spray panel. The main body of the flow guide device is a cone, and the bottom is installed on the spray panel through a supporting device. The side circumference of the cone is outwardly diffused from top to bottom to guide the gas entering the air inlet to various places on the spray panel.

Description

Technical Field

[0001] The invention relates to a semiconductor process equipment device, in particular to a flow guide device in a semiconductor shower plate. Background Art

[0002] In the semiconductor processing process, such as the thin film deposition process, a shower plate is used to spray gas onto the semiconductor surface to be processed. In the spray chamber inside the shower plate, how to enhance the uniformity of the gas flow inside the chamber is crucial to improving the process quality of the product.

[0003] To solve the problem of uneven airflow distribution in the spray chamber, the method used in the prior art is mostly to install a deflector under the cover of the spray plate. When the gas flows from the gas channel on the upper cover plate through these deflectors, the gas flows away from the center of the chamber to a certain extent, which alleviates the problem of gas concentration in the center of the general spray plate, and then high density in the center and low density at the edge.

[0004] However, these deflectors are generally fixed to the support component above the cover plate by threads, and cannot form a symmetrical structure at the end of the gas channel. On the one hand, the support component will block part of the falling airflow, affecting the airflow distribution in the center of the spray plate. On the other hand, the existing installation method of the deflector cannot achieve uniform flow guidance in all directions, and there is still the problem of uneven airflow distribution.

[0005] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of a flow guide device in a semiconductor shower plate. By changing the fixed installation position and installation method of the original flow guide device, the gas entering the shower plate can enter all parts of the shower chamber unimpeded, thereby making the distribution of the process gas inside the cavity more uniform. Summary of the invention

[0006] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0007] In order to overcome the above-mentioned defects existing in the prior art, the present invention provides a guide device in a semiconductor spray plate, which comprises an upper cover plate and a spray panel which are sealed and connected at the side. The spray gas is introduced through the air inlet in the center of the upper cover plate and then sprayed onto the surface of the semiconductor to be processed through multiple holes on the spray panel. The guide device is arranged between the air inlet of the upper cover plate and the spray panel. The main body of the guide device is a cone, and the bottom is installed on the spray panel through a supporting device. The side surface of the cone is outwardly diffused from top to bottom so as to guide the gas entering the air inlet to various places of the spray panel.

[0008] In one embodiment, preferably, in the guide device in the semiconductor shower plate provided by the present invention, the top of the cone is engaged with the output shaft of the motor device arranged on the shower plate, and the supporting device is fixedly installed with the shower panel through a bearing device to realize the rotation of the guide device through the drive of the motor device.

[0009] In one embodiment, optionally, in the flow guide device in the semiconductor shower plate provided by the present invention, the cone is divided into two sections from top to bottom, an upper cone and a lower frustum, the inclination angle of the lower frustum is greater than the inclination angle of the upper cone, and the inclination angle is the angle between the side surface and the central axis.

[0010] In one embodiment, preferably, in the guide device in the semiconductor shower plate provided by the present invention, a plurality of vertical slots are evenly distributed along the circumference on the lower side of the guide device so that the gas reaching the surface of the guide device falls into the bottom of the guide device through the slots.

[0011] In one embodiment, preferably, in the flow guide device in the semiconductor shower plate provided by the present invention, the inclination angle of the upper cone is 40° to 80°, and the inclination angle of the lower cone is 120° to 170°.

[0012] In one embodiment, preferably, in the guide device in the semiconductor shower plate provided by the present invention, the height of the upper cone accounts for 50% to 60% of the total height of the guide device, the height of the lower cone accounts for 10% to 20% of the total height of the guide device, and the supporting device accounts for 25% to 35% of the total height of the guide device.

[0013] In one embodiment, preferably, in the flow guide device in the semiconductor shower plate provided by the present invention, the diameter of the junction between the upper cone and the lower frustum accounts for 55% to 65% of the diameter of the widest part of the flow guide device.

[0014] In one embodiment, optionally, in the guide device in the semiconductor shower plate provided by the present invention, the radial length of the slot is 1 / 3 to 1 / 2 of the radius of the widest part of the guide device, the width of the slot is 2 mm to 6 mm, and the number of the slots is 6 to 10.

[0015] In one embodiment, preferably, in the guide device in the semiconductor shower plate provided by the present invention, the diameter of the widest part of the guide device is 1.3 to 1.7 times the diameter of the air inlet, and the top tip of the cone is flush with the end of the air inlet or extends into the air inlet.

[0016] In one embodiment, optionally, in the flow guide device in the semiconductor shower plate provided by the present invention, the height of the flow guide device is 40 mm to 60 mm, and the width is 40 mm to 60 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 It is a schematic diagram of the assembly structure and a partial enlarged diagram of a flow guide device in a semiconductor shower plate according to the prior art;

[0019] Figure 2 yes Figure 1 A gas flow field distribution diagram of the semiconductor shower plate guide device of the prior art in the spray chamber when in use;

[0020] Figure 3 is a schematic diagram of the assembly structure of a flow guide device in a semiconductor shower plate according to an embodiment of the present invention;

[0021] Figure 4 is a schematic diagram of the structure of a flow guide device in a semiconductor shower plate according to an embodiment of the present invention; and

[0022] Figure 5 FIG. 4 is a schematic diagram of the structure of a flow guide device in a semiconductor shower plate according to another embodiment of the present invention.

[0023] For the sake of clarity, a brief description of the reference numerals is given below:

[0024] 101 Upper cover

[0025] 102 Sprinkler Panel

[0026] 103 diversion device

[0027] 104 Support components

[0028] 105 Gas Channel

[0029] 300 spray plate

[0030] 301 upper cover

[0031] 302 Sprinkler Panel

[0032] 303 Air Inlet

[0033] 304 diversion device

[0034] 3041 support device

[0035] 400 diversion device

[0036] 401 Upper Cone

[0037] 402 Lower stage

[0038] 403 Support device

[0039] 500 diversion device

[0040] 501 Upper cone

[0041] 502 Lower stage

[0042] 503 support device

[0043] 504 slots DETAILED DESCRIPTION

[0044] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0047] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0048] Figure 1 The present invention is a schematic diagram of the assembly structure and a partial enlarged diagram of a flow guide device in a semiconductor shower plate according to the prior art.

[0049] In order to enhance the uniformity of the airflow in the spray plate during the semiconductor spray process, a flow guide device 103 is provided between the upper cover plate 101 and the spray panel 102 of the spray plate. The flow guide device 103 is generally fixed below the upper cover plate 101. Figure 1 As shown, in order to install the guide device 103 , a support component 104 , such as a support arm structure, is added to the upper cover plate 101 , and the guide device 103 is fixedly installed below the support component 104 .

[0050] When the reaction gas is injected into the shower plate from the gas channel 105, however, it is easy to understand that the support component 104 will block part of the falling gas flow. At the same time, the guide devices 103 are fixed to the support component 104 by threads, and a symmetrical guide structure cannot be formed at the end of the gas channel 105, which weakens the effect of the guide device 103 on uniform gas distribution.

[0051] Therefore, although the flow guide device 103 in the prior art helps the gas to flow away from the center of the chamber to a certain extent, alleviating the problem of gas concentration in the center of a general shower plate, followed by high density in the center and low density at the edge, there are still unavoidable structural disadvantages that affect the uniform distribution of the airflow.

[0052] Figure 2 yes Figure 1 A gas flow field distribution diagram in a spray chamber when the semiconductor shower plate guide device of the prior art is in use.

[0053] Please refer to Figure 2, different shades of color represent different gas distribution concentrations, Figure 2 It can be clearly seen that Figure 1 Although the guide device shown has alleviated to some extent the problem that the gas in the original spray plate is concentrated in the center, and then the gas density in the center is high and the density at the edge is low, due to the installation limitations of the guide device, the problem of uneven gas still exists locally, and the uniformity of gas distribution in the spray chamber cannot be effectively improved, affecting the process quality and product yield.

[0054] In order to overcome the above-mentioned defects of the prior art, the present invention provides a flow guide device in a semiconductor spray plate. By changing the fixed installation position and installation method of the original flow guide device, the gas entering the spray plate can enter all parts of the spray chamber unimpeded, thereby making the distribution of the process gas inside the cavity more uniform.

[0055] Figure 3 The figure is a schematic diagram of the assembly structure of the flow guide device in the semiconductor shower plate according to one embodiment of the present invention.

[0056] Please refer to Figure 3 In the flow guide device in the semiconductor shower plate provided by the present invention, the shower plate 300 includes an upper cover plate 301 and a shower panel 302 which are sealed and connected to each other at the side, and the shower gas is introduced from the central air inlet 303 of the upper cover plate 301 and then sprayed from the multiple holes on the shower panel 302 to the surface of the semiconductor to be processed.

[0057] like Figure 3 As shown, the guide device 304 is arranged between the air inlet 303 of the upper cover plate 301 and the spray panel 302. The main body of the guide device 304 is a cone, and its bottom is installed on the spray panel 302 through a supporting device 3041. The side surface of the cone is outwardly diffused from top to bottom to guide the gas entering the air inlet 303 to various places of the spray panel 302.

[0058] Different from Figure 1 The guide device in the prior art shown is installed on the supporting component of the upper cover plate and then blocks part of the air intake channel. The guide device provided by the present invention is fixedly connected to the spray panel 302 at the bottom, so that the assembly of the guide device 304 is independent of the air intake channel on the upper cover plate 301, and will not block the airflow in the air intake channel. The guide device 304 is a symmetrical structure at the end of the air intake channel, which can achieve uniform airflow guidance in all directions.

[0059] exist Figure 3 In the illustrated embodiment, the support device 3041 is a support rod at the bottom center of the guide device 304, and the support rod can be fixedly mounted to the spray panel 302 by various means such as screwing, clamping, riveting or welding, which is not specifically limited here.

[0060] It is easily understood by those skilled in the art that the specific form and installation method of the supporting device are only illustrated here for the purpose of illustrating the structure and assembly of the guide device in the semiconductor spray plate provided by the present invention, and is not used to limit the protection scope of the present invention. Other structures or connection methods that can realize the installation and assembly between the guide device and the spray panel can be applied to the guide device in the semiconductor spray plate provided by the present invention, and should also be included in the protection scope of the present invention.

[0061] Furthermore, in a preferred embodiment, the top of the cone of the guide device can be meshed with the output shaft of the motor device provided on the spray plate, and the support device can be fixedly installed with the spray panel through a bearing device, so that the rotation of the guide device can be achieved through the drive of the motor device. The motor device can be a micro DC motor with adjustable speed, and the setting of the rotation function of the guide device can change the flow field distribution of the gas in the cavity, further enhance the uniform guiding effect of the airflow, and improve the effect and quality of the spraying process.

[0062] Figure 4 FIG. 4 is a schematic diagram of the structure of a flow guide device in a semiconductor shower plate according to an embodiment of the present invention.

[0063] Please refer to Figure 4 In one embodiment, the guide device 400 in the semiconductor shower plate provided by the present invention is divided into two sections from top to bottom: an upper cone 401 and a lower cone 402. The inclination angle of the lower cone 402 can be greater than the inclination angle of the upper cone 401, and the inclination angle is the angle between the side and the central axis.

[0064] For example, the upper cone 401 may have an inclination angle of 40° to 80°, and the lower cone 402 may have an inclination angle of 120° to 170°. The difference in inclination angles at both ends may allow the side surface of the entire flow guide device to diffuse outward from top to bottom, thereby evenly guiding the reaction gas in the central air inlet channel to all directions.

[0065] Those skilled in the art can understand that the shape of the side surface of the flow guide device is only exemplified here for the purpose of better explaining the device structure of the flow guide device in the semiconductor shower panel provided by the present invention. Specifically, it is to illustrate the effect of the overall side surface of the flow guide device diffusing outward from top to bottom to guide the gas entering the air inlet to various parts of the shower panel, rather than to limit the protection scope of the present invention. In fact, other structures that can play a similar role, such as a concave side surface, can also be applied to the flow guide device in the semiconductor shower panel provided by the present invention, and should also be included in the protection scope of the present invention.

[0066] Can be combined Figure 3 , Figure 4 Further, in a preferred embodiment, the diameter of the widest part of the flow guide device can be 1.3 to 1.7 times the diameter of the air inlet, and the top tip of the cone can be flush with the end of the air inlet or extend into the air inlet. The top tip of the cone extending into the air inlet can be more convenient for connection with the motor device to achieve the rotation function.

[0067] For example, the height of the flow guide device in the semiconductor shower plate provided by the present invention may be 40 mm to 60 mm, and the width may be 40 mm to 60 mm.

[0068] For further matching, you can continue to refer to Figure 4 The height of the upper cone 401 can account for 50% to 60% of the total height of the guide device 400, the height of the lower truncated cone 102 can account for 10% to 20% of the total height of the guide device 400, and the support device 403 can account for 25% to 35% of the total height of the guide device 400. The diameter of the junction between the upper cone 401 and the lower truncated cone 402 accounts for 55% to 65% of the diameter of the widest part of the guide device 400.

[0069] Those skilled in the art can understand that these size ratios are for better achieving the effect of the flow guide device provided by the present invention to uniformly guide the airflow in all directions, and are not intended to limit the protection scope of the present invention. In fact, the specific size of the flow guide device in the semiconductor shower plate provided by the present invention can be adaptively adjusted according to the size of the specific components in the process equipment to which it is applied.

[0070] Figure 5 FIG. 4 is a schematic diagram of the structure of a flow guide device in a semiconductor shower plate according to another embodiment of the present invention.

[0071] Please refer to Figure 5 In a preferred embodiment, the lower side of the guide device 500 in the semiconductor shower plate provided by the present invention has a plurality of vertical slots 504 evenly distributed along the circumference so that the gas reaching the surface of the guide device 500 can fall into the bottom of the guide device 500 through the slots.

[0072] For example, Figure 5 As shown, the main part of the guide device 500 in the semiconductor shower plate provided by the present invention can still be divided into two parts: an upper cone 501 and a lower truncated cone 502. A support device 503 is also provided at the bottom center. Figure 4 The difference from the embodiment shown is that the guide device 500 in this embodiment has multiple vertical slots 504 evenly distributed on the side circumference of the lower truncated cone 502 .

[0073] It is easy to understand that the presence of the slots 504 allows the reaction gas flowing to the surface of the guide device 500 to pass through the slots 504 and fall directly below the guide device 500, thereby increasing the gas density directly below the guide device 500, that is, at the center of the spray plate, thereby avoiding the problem of uneven gas distribution caused by the structure of the guide device 500 itself blocking the vertical fall of the airflow, and further improving the uniformity of the distribution of the spray gas in various places in the spray chamber, thereby improving the process effect and quality, improving the product yield, and avoiding the loss of process products caused by uneven deposition.

[0074] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A flow guide device in a semiconductor spray plate, the spray plate comprising an upper cover plate and a spray panel connected by a side circumference seal, the spray gas is introduced from the central air inlet of the upper cover plate and then sprayed from a plurality of holes on the spray panel to the surface of the semiconductor to be processed, The guide device is arranged between the air inlet of the upper cover plate and the spray panel. The main body of the guide device is a cone, and the bottom of the guide device is mounted on the spray panel through a supporting device. The cone includes an upper cone and a lower cone from top to bottom, the inclination angle of the lower cone is greater than the inclination angle of the upper cone, the inclination angle is the angle between the side surfaces of the upper cone and the lower cone and the central axis of the spray plate, and the side circumference of the cone is outwardly diffused from top to bottom to guide the gas entering the air inlet to various places on the spray panel.

2. The flow guiding device according to claim 1, characterized in that: A plurality of vertical slots are evenly distributed along the circumferential direction on the lower side of the guide device so that the gas reaching the surface of the guide device can fall into the bottom of the guide device through the slots.

3. The flow guiding device according to claim 1, characterized in that: The inclination angle of the upper cone is 40° to 80°, and the inclination angle of the lower cone is 120° to 170°.

4. The flow guiding device according to claim 1, characterized in that: The height of the upper cone accounts for 50% to 60% of the total height of the guide device, the height of the lower cone accounts for 10% to 20% of the total height of the guide device, and the supporting device accounts for 25% to 35% of the total height of the guide device.

5. The flow guiding device according to claim 1, characterized in that: The diameter of the junction between the upper cone and the lower cone accounts for 55% to 65% of the diameter of the widest part of the flow guide device.

6. The flow guiding device according to claim 2, characterized in that: The length of the slot in the radial direction is 1 / 3 to 1 / 2 of the radius of the widest part of the guide device, the width of the slot is 2 mm to 6 mm, and the number of the slot is 6 to 10.

7. The flow guiding device according to claim 1, characterized in that: The diameter of the widest part of the flow guide device is 1.3 to 1.7 times the diameter of the air inlet, and the top tip of the cone is flush with the end of the air inlet or extends into the air inlet.

8. The flow guiding device according to claim 1, characterized in that: The height of the flow guide device is 40 mm to 60 mm, and the width is 40 mm to 60 mm.

9. A flow guide device in a semiconductor spray plate, the spray plate comprising an upper cover plate and a spray panel connected by a side circumference seal, the spray gas is introduced from the central air inlet of the upper cover plate and then sprayed from a plurality of holes on the spray panel to the surface of the semiconductor to be processed, The guide device is arranged between the air inlet of the upper cover plate and the spray panel. The main body of the guide device is a cone, and the bottom of the guide device is mounted on the spray panel through a supporting device. The side surface of the cone is diffused outward from top to bottom to guide the gas entering the air inlet to various places of the spray panel. The top of the cone is meshed with the output shaft of the motor device arranged on the spray plate, and the support device is fixedly installed with the spray panel through a bearing device, so that the rotation of the guide device is realized by the drive of the motor device.

Images