Wafer drying equipment and method

Abstract

The present invention provides a wafer drying device and method, which relates to the field of semiconductor production technology. The device includes a cover body; a base plate, which is movably arranged below the cover body; a heating element, which is arranged on the inner wall of the cover body; a rotating mechanism, which includes a variable frequency motor and a rotating shaft, the middle part of which is rotatably connected to the base plate; a support member, one end of which is fixed to the rotating shaft; and a clamping mechanism for fixing the wafer. The method includes: fixing the wafer to be dried on the support member; moving the wafer to be dried fixed on the support member into the cover body; starting the dust collector, the exhaust fan and the variable frequency motor and maintaining them for a predetermined period of time; after drying the water remaining on the surface of the wafer to be dried and on the wiping plate, moving the base plate and the support member downward so that the wafer to be dried on the support member is moved outside the cover body; wiping off the water stains on the surface of the wafer to be dried; and placing the wafer to be dried in a designated position. The embodiment of the present invention can effectively improve the efficiency of removing water from the wafer surface through the combined action of mechanical and thermal radiation methods.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a wafer drying device and method. Background Art

[0002] Photolithography is an important step in the semiconductor device manufacturing process. Photolithography is a graphic copying technology. Simply put, photolithography is inspired by photography technology and uses the photosensitive properties of photoresist to accurately copy the pattern on the photolithography mask plate onto the photoresist coated on the wafer.

[0003] In order to ensure product quality, before applying photoresist to the wafer, the surface of the wafer must be cleaned first, and then the photoresist can be applied after the surface of the wafer is dried.

[0004] However, most current drying devices rely solely on thermal radiation to dry wafers, and the drying efficiency is not very high. Summary of the Invention

[0005] In view of the above situation, the present invention provides a wafer drying device and method, aiming to solve the technical problem that most current drying devices rely solely on heat radiation to dry wafers, and the drying efficiency is not very high.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a wafer drying device, which may mainly include:

[0008] The cover body is fixedly arranged and has an opening at the bottom, and the cover body has an air inlet and an air outlet that are interconnected;

[0009] A bottom plate is movably arranged below the cover body and is capable of blocking the lower opening of the cover body;

[0010] A heating element is arranged on the inner wall of the cover;

[0011] The rotating mechanism includes a variable frequency motor and a rotating shaft, wherein the middle portion of the rotating shaft is rotatably connected to the base plate;

[0012] A support member, one end of which is fixed to the rotating shaft and the other end of which extends radially along the rotating shaft; the base plate and the support member are capable of synchronously moving longitudinally;

[0013] The clamping mechanism includes an arc-shaped plate and a limiting column. The arc-shaped plate is fixed to the support member. A plurality of limiting protrusions are distributed on the inner side of the arc-shaped plate. The limiting protrusions are provided with slots matching the edges of the wafer. With the cooperation of the plurality of limiting protrusions, the wafer can only move in the direction close to the rotating shaft. The limiting column is longitudinally slidably connected to the support member. The limiting column can move upward under the action of a reset spring and abut against the circumference of the wafer to limit the movement of the wafer in the direction close to the rotating shaft.

[0014] The lifting mechanism is used to move the base plate and the support member longitudinally so that the wafer can enter and exit the cover.

[0015] In some embodiments of the present invention, a notch is provided on the support member, a guide block is fixed on the side wall of the notch, a guide groove matching the guide block is provided on the limiting column, and a reset spring is installed in the guide groove.

[0016] In some embodiments of the present invention, two opposite sides of the upper portion of the support are respectively connected to a rotating rod via a connecting shaft, and a wiping plate is fixed on the rotating rod, and one side of the wiping plate can contact the surface of the wafer.

[0017] In some embodiments of the present invention, the connecting shaft is transmission-connected to the limiting post, and when the limiting post moves longitudinally, the connecting shaft can rotate clockwise or counterclockwise.

[0018] In some embodiments of the present invention, a toothed plate is fixed on the support member, and a first gear and a second gear are provided in the limiting column. One side of the first gear is engaged with the toothed plate and the other side is engaged with the second gear. The second gear is fixed in the middle of the connecting shaft.

[0019] In some embodiments of the present invention, a first stop and a second stop are fixed on the limit column, the first stop is used to limit the rotation of the connecting shaft in the clockwise direction, and the second stop is used to limit the rotation of the connecting shaft in the counterclockwise direction, and the angle between the projections of the first stop and the second stop on the vertical plane is 90 degrees.

[0020] In some embodiments of the present invention, a dust collector is connected to the air inlet.

[0021] In some embodiments of the present invention, a cavity is provided in the side wall of the cover body, the air outlet is connected to the top of the cavity, an exhaust fan is installed outside the cover body, the inlet of the exhaust fan is connected to the interior of the cover body, and the outlet is connected to the lower part of the cavity.

[0022] In some embodiments of the present invention, a pressure limiting valve is installed on the gas outlet.

[0023] In a second aspect, the present invention provides a wafer drying method, which may mainly include the following steps:

[0024] S1: Press the limiting post to make the two wiping plates stand up, then pass the wafer to be dried between the two wiping plates, then partially insert the edge of the wafer to be dried into the slots of the multiple limiting protrusions, then release the limiting post, so that the limiting post moves upward under the action of the return spring and abuts against the circumference of the wafer to be dried, thereby fixing the wafer to be dried on the support member;

[0025] S2: Move the bottom plate and the support member upward so that the bottom plate blocks the lower opening of the cover body, and move the wafer to be dried fixed on the support member into the cover body;

[0026] S3: The dust collector, exhaust fan, and variable frequency motor are started and maintained for a predetermined period of time to dry out residual water on the surface of the wafer to be dried and the wiping board. The variable frequency motor can drive the wafer to be dried to rotate rapidly via the shaft to shake off the water on the surface of the wafer to be dried and the wiping board. The dust collector can filter dust from the outside air. The exhaust fan can guide the hot and humid air in the hood into the cavity of the hood. When the pressure in the cavity exceeds a preset value, the pressure limiting valve on the air outlet opens.

[0027] S4: After drying the remaining water on the surface of the wafer to be dried and the wiping plate, the bottom plate and the support member are moved downward, so that the wafer to be dried on the support member is moved outside the cover. At the same time, the heating element is kept working, and the dust collector, exhaust fan and variable frequency motor are turned off.

[0028] S5: First, press the limit pins to make the two wiping plates stand up, then move the wafer to be dried in the direction close to the rotation axis, so that the wafer to be dried passes between the two wiping plates to wipe off the water stains on the surface of the wafer to be dried;

[0029] S6: Place the dried wafer at a designated location;

[0030] S7: Take another wafer to be dried and repeat the above steps.

[0031] The embodiments of the present invention have at least the following advantages or beneficial effects:

[0032] 1. The embodiment of the present invention can effectively improve the efficiency of removing water from the wafer surface through the combined action of mechanical and thermal radiation methods.

[0033] 2. The clamping mechanism can fix the wafer while minimizing the contact area with the wafer, which helps to improve the drying effect of the wafer.

[0034] 3. The temperature inside the cover is relatively high. By moving the bottom plate and the support member longitudinally through the lifting mechanism, the wafer can be moved in and out of the cover, making it easier to take the wafer in and out of the cover.

[0035] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 This is a structural diagram of the wafer drying equipment;

[0038] Figure 2 Schematic diagram of the structure of the card slot;

[0039] Figure 3 for Figure 1 A partial enlarged view of position A in the middle;

[0040] Figure 4 It is a structural diagram of the limiting column, rotating rod and wiping plate.

[0041] icon:

[0042] 1- housing, 11- air inlet, 12- air outlet, 121- pressure limiting valve, 13- cavity, 14- drain pipe, 141- drain valve,

[0043] 2- bottom plate,

[0044] 3- Heating element,

[0045] 41- variable frequency motor, 42- rotating shaft,

[0046] 5-support, 51-notch, 52-guide block,

[0047] 6-clamping mechanism, 61-arc plate, 611-limiting protrusion, 612-slot, 62-limiting column, 621-guide groove, 622-first stopper, 623-second stopper, 63-return spring, 64-connecting shaft, 65-rotating rod, 66-wiping plate, 67-tooth plate, 68-first gear, 69-second gear,

[0048] 7-lifting mechanism, 71-lifting cylinder, 72-mounting plate, 73-support rod,

[0049] 8-Dust collector,

[0050] 9-exhaust fan, 91-first duct, 92-second duct. DETAILED DESCRIPTION

[0051] In the following, only certain exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the embodiments of the present invention.

[0052] In the description of the embodiments of the present invention, it should be understood that the terms "middle", "longitudinal", "lateral", "upper", "lower", "front", "back", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "radial", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0054] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0055] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. Example

[0056] Please refer to Figures 1-4 In the first aspect, this embodiment provides a wafer drying device, which mainly includes: a cover body 1, a base plate 2, a heating element 3, a rotating mechanism, a supporting member 5, a clamping mechanism 6 and a lifting mechanism 7.

[0057] The cover body 1 is fixed and has an opening at the bottom. The cover body 1 has an air inlet 11 and an air outlet 12 that are connected to each other, so that the hot and humid air in the cover body 1 can be discharged from the air outlet 12 .

[0058] The heating element 3 is arranged on the inner wall of the cover 1, and can convert electrical energy into thermal energy and dry the water on the surface of the wafer by thermal radiation.

[0059] The bottom plate 2 is movably arranged below the cover body 1 and can block the lower opening of the cover body 1 to reduce the loss of heat energy when drying the wafers.

[0060] The rotating mechanism may mainly include a variable frequency motor 41 and a rotating shaft 42 which are transmission-connected. The middle portion of the rotating shaft 42 is rotationally connected to the base plate 2 .

[0061] There can be multiple support members 5, which are arranged horizontally, with one end fixed to the rotating shaft 42 and the other end extending radially along the rotating shaft 42; the base plate 2 and the support member 5 can move longitudinally synchronously, and the frequency conversion motor 41 can drive the support member 5 to rotate rapidly.

[0062] The clamping mechanism 6 can mainly include a curved plate 61 and a limiting post 62. The curved plate 61 is fixed to the support 5. A plurality of limiting protrusions 611 are distributed on the inner side of the curved plate 61. The limiting protrusions 611 are provided with a slot 612 that matches the edge of the wafer. With the cooperation of the plurality of limiting protrusions 611, the wafer can only move in the direction close to the rotating shaft 42. The limiting post 62 is located between the curved plate 61 and the rotating shaft 42. The limiting post 62 is longitudinally slidably connected to the support 5. The limiting post 62 can move upward under the action of the return spring 63 and abut against the circumference of the wafer to limit the movement of the wafer in the direction close to the rotating shaft 42. The clamping mechanism 6 can fix the wafer while minimizing the contact area between the wafer and the wafer, which helps to improve the drying effect of the wafer.

[0063] The lifting mechanism 7 is used to longitudinally move the base plate 2 and the support member 5 to allow wafers to enter and exit the housing 1. The temperature inside the housing 1 is relatively high, and the lifting mechanism 7 longitudinally moves the base plate 2 and the support member 5 to allow wafers to enter and exit the housing 1, making it easier to place and retrieve wafers outside the housing 1.

[0064] This embodiment can effectively improve the efficiency of removing water from the wafer surface through the combined action of mechanical and thermal radiation methods. Specifically, the variable frequency motor 41 of the rotating mechanism can first drive the wafer to rotate rapidly in the cover 1, and use centrifugal force to shake off most of the water on the wafer, so as to reduce the time required for the heating element 3 to dry the wafer through thermal radiation, and then make the wafer rotate slowly and uniformly in the cover 1 so that each wafer is heated evenly, thereby improving the drying effect of the wafer.

[0065] The above roughly describes the main components and working principles of wafer drying equipment. The following will explain the wafer drying equipment in more detail.

[0066] In order to facilitate the synchronous longitudinal movement of the base plate 2 and the support member 5, the lifting mechanism 7 can mainly include a lifting cylinder 71, a mounting plate 72 and a support rod 73. The frequency conversion motor 41 is installed on the mounting plate 72. The mounting plate 72 is connected to the base plate 2 through the support rod 73. The lifting cylinder 71 can move the mounting plate 72 up or down.

[0067] In order to facilitate the longitudinal sliding connection of the limiting column 62 on the support member 5, a notch 51 is provided on the support member 5, a guide block 52 is fixed on the side wall of the notch 51, a guide groove 621 matching the guide block 52 is provided on the limiting column 62, and a return spring 63 is installed in the guide groove 621.

[0068] In the case of not using pure water to clean the wafer, there may be water stains on the surface of the wafer after it is dried, and the water stains need to be wiped off. In order to facilitate wiping off the water stains on the wafer, the front and rear sides of the upper part of the support member 5 ( Figure 1 The two wafers (shown in the front and rear directions) are each connected to a rotating rod 65 via a connecting shaft 64. A wiping plate 66 is fixed to the rotating rod 65, one side of which is capable of contacting the surface of the wafer. To remove the dried wafer from the clamping mechanism 6, the limiting post 62 is pressed to raise the two wiping plates 66. The dried wafer is then moved in a direction close to the connecting shaft 64, passing between the two wiping plates 66 to wipe away any water stains on the surface of the wafer.

[0069] In this embodiment, preferably, the connecting shaft 64 is in transmission connection with the limiting column 62. When the limiting column 62 moves longitudinally, the connecting shaft 64 can rotate clockwise or counterclockwise. Specifically, a toothed plate 67 is fixed on the support member 5, and a first gear 68 and a second gear 69 are provided in the limiting column 62. One side of the first gear 68 is engaged with the toothed plate 67, and the other side is engaged with the second gear 69. The second gear 69 is fixed to the middle of the connecting shaft 64. The first gear 68 plays a role of reversing, pressing the limiting column 62. When the limiting column 62 moves downward, the connecting shaft 64 drives the two rotating rods 65 and the two wiping plates 66 to rotate counterclockwise to stand up the two wiping plates 66. Since the two wiping plates 66 will stand up when the limiting column 62 is pressed during the process of taking and placing the wafer, when the wafer to be dried is placed in the clamping mechanism 6, the wiping plates 66 can also be used to wipe off the front and back sides of the wafer ( Figure 1 The water on the wafer and the wiping plate 66 can be further removed by the centrifugal effect of rotation, and then the wafer and the wiping plate 66 can be dried by the heating element 3.

[0070] More specifically, a first stopper 622 and a second stopper 623 are fixed to the limiting column 62. The first stopper 622 is used to limit the rotation of the connecting shaft 64 in the clockwise direction ( Figure 1 The second stopper 623 is used to limit the rotation of the connecting shaft 64 in the counterclockwise direction, and the angle between the projections of the first stopper 622 and the second stopper 623 on the vertical plane is 90 degrees.

[0071] The air inlet 11 is connected to a dust collector 8 to prevent dust-laden gas from entering the housing 1 through the air inlet 11 and adhering to the wafers when the wafers are dried.

[0072] A cavity 13 is defined within the sidewall of the housing 1, with an air outlet 12 communicating with the top of the cavity 13. An exhaust fan 9 is mounted outside the housing 1, with its inlet communicating with the interior of the housing 1 via a first conduit 91 and its outlet communicating with the lower portion of the cavity 13 via a second conduit 92. The exhaust fan 9 directs the hot and humid air within the housing 1 into the cavity 13, thereby exhausting the hot and humid air within the housing 1. Furthermore, since the cavity 13 is filled with hot and humid air, it provides a certain degree of insulation.

[0073] A pressure limiting valve 121 is installed on the air outlet 12. Through the setting of the pressure limiting valve 121, the air pressure and temperature in the cavity 13 are relatively high. On the one hand, this can enhance the heat preservation effect of the cavity 13. On the other hand, due to the high air pressure and temperature in the cavity 13, the temperature inside the cover body 1 is relatively high. When water is thrown onto the inner side of the cover body 1 under the action of centrifugation, the water can be quickly dried.

[0074] Since the hot and humid air in the cavity 13 has a high water content, the hot and humid air will condense and gather at the bottom of the cavity 13 when it cools down. Therefore, a drain pipe 14 is connected to the bottom of the cavity 13, and a drain valve 141 is installed on the drain pipe 14 to facilitate the discharge of condensed water at the bottom of the cavity 13.

[0075] In a second aspect, this embodiment provides a wafer drying method, which uses the above-mentioned wafer drying equipment. The method may mainly include the following steps:

[0076] S1: Press the limiting post 62 to make the two wiping plates 66 stand upright, then pass the wafer to be dried between the two wiping plates 66. Then, partially insert the edge of the wafer to be dried into the slots 612 of the multiple limiting protrusions 611. Then release the limiting post 62, so that the limiting post 62 moves upward under the action of the return spring 63 and abuts against the circumference of the wafer to be dried, thereby fixing the wafer to be dried on the support member 5.

[0077] S2: Move the bottom plate 2 and the support member 5 upward, so that the bottom plate 2 blocks the lower opening of the cover 1, and moves the wafer to be dried fixed on the support member 5 into the cover 1;

[0078] S3: The dust collector 8, exhaust fan 9, and variable frequency motor 41 are started and kept running for a predetermined period of time to dry out the water remaining on the surface of the wafer to be dried and the wiping plate 66. The variable frequency motor 41 can drive the wafer to be dried to rotate rapidly via the rotating shaft 42 to shake off the water on the surface of the wafer to be dried and the wiping plate 66. The dust collector 8 can filter dust from the outside air. The exhaust fan 9 can guide the hot and humid air in the cover body 1 into the cavity 13 of the cover body 1. When the pressure in the cavity 13 exceeds a preset value, the pressure limiting valve 121 on the air outlet 12 opens.

[0079] S4: After the remaining water on the surface of the wafer to be dried and on the wiping plate 66 is dried, the bottom plate 2 and the support member 5 are moved downward, so that the wafer to be dried on the support member 5 is moved outside the housing 1. At the same time, the heating element 3 is kept operating, and the dust collector 8, the exhaust fan 9 and the variable frequency motor 41 are turned off.

[0080] S5: First, the limiting pillars 62 are pressed to make the two wiping plates 66 stand upright, and then the wafer to be dried is moved in a direction close to the rotating shaft 42 so that the wafer to be dried passes between the two wiping plates 66 to wipe away water stains on the surface of the wafer to be dried;

[0081] S6: Place the dried wafer at a designated location;

[0082] S7: Take another wafer to be dried and repeat the above steps.

[0083] It can be seen from the above content that the wafer drying method provided in this embodiment can not only effectively improve the efficiency of removing water from the wafer surface, but also remove water stains on the wafer surface.

[0084] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. The embodiments and features of the embodiments of this application may be combined arbitrarily without conflict. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A wafer drying device, characterized in that: include: A cover body is fixedly arranged and has an opening at the bottom, and the cover body has an air inlet and an air outlet that are interconnected; a bottom plate movably disposed below the cover body and capable of blocking a lower opening of the cover body; A heating element is provided on the inner wall of the cover; A rotating mechanism, comprising a variable frequency motor and a rotating shaft, wherein the middle portion of the rotating shaft is rotatably connected to the base plate; a support member, one end of which is fixed to the rotating shaft and the other end of which extends radially along the rotating shaft; the base plate and the support member are capable of synchronously moving longitudinally; The clamping mechanism includes an arc-shaped plate and a limiting column; the arc-shaped plate is fixed to the support member, and a plurality of limiting protrusions are distributed on the inner side of the arc-shaped plate. The limiting protrusions are provided with a slot matching the edge of the wafer. Under the cooperation of the plurality of limiting protrusions, the wafer can only move in the direction close to the rotating shaft; the limiting column is longitudinally slidably connected to the support member, and the limiting column can move upward under the action of a reset spring and abut on the circumference of the wafer to limit the movement of the wafer in the direction close to the rotating shaft; a lifting mechanism for longitudinally moving the base plate and the support member so that the wafer can enter and exit the cover; The support member is provided with a notch, a guide block is fixed on the side wall of the notch, the limiting column is provided with a guide groove matching the guide block, and the return spring is installed in the guide groove; Two opposite sides of the upper portion of the support member are respectively connected to a rotating rod via a connecting shaft, and a wiping plate is fixed on the rotating rod, and one side of the wiping plate can contact the surface of the wafer; The connecting shaft is in transmission connection with the limiting post, and when the limiting post moves longitudinally, the connecting shaft can rotate clockwise or counterclockwise; A toothed plate is fixed on the support member, and a first gear and a second gear are provided in the limiting column. One side of the first gear is engaged with the toothed plate, and the other side is engaged with the second gear. The second gear is fixed to the middle of the connecting shaft. A first stop block and a second stop block are fixed on the limiting column. The first stop block is used to limit the rotation of the connecting shaft in the clockwise direction, and the second stop block is used to limit the rotation of the connecting shaft in the counterclockwise direction. The angle between the projections of the first stop block and the second stop block on the vertical plane is 90 degrees.

2. The wafer drying equipment according to claim 1, characterized in that: The air inlet is connected to a dust collector.

3. The wafer drying equipment according to claim 1 or 2, characterized in that: A cavity is provided in the side wall of the cover body, the air outlet is communicated with the top of the cavity, an exhaust fan is installed outside the cover body, the inlet of the exhaust fan is communicated with the inside of the cover body, and the outlet is communicated with the lower part of the cavity.

4. The wafer drying equipment according to claim 3, characterized in that: A pressure limiting valve is installed on the air outlet.

5. A wafer drying method, using the wafer drying device according to claim 1, characterized in that: The wafer drying method includes the following steps: S1: Press the limiting post to make the two wiping plates stand up, then pass the wafer to be dried between the two wiping plates, then partially insert the edge of the wafer to be dried into the slots of the multiple limiting protrusions, then release the limiting post, so that the limiting post moves upward under the action of the return spring and abuts against the circumference of the wafer to be dried, thereby fixing the wafer to be dried on the support member; S2: Move the bottom plate and the support member upward so that the bottom plate blocks the lower opening of the cover body, and move the wafer to be dried fixed on the support member into the cover body; S3: Starting the dust collector, exhaust fan, and variable frequency motor for a predetermined time to dry the water remaining on the surface of the wafer to be dried and the wiping board; The variable frequency motor can drive the wafer to be dried to rotate rapidly through the shaft to shake off the water on the surface of the wafer to be dried and the wiping board. The dust collector can filter the dust in the outside air. The exhaust fan can guide the hot and humid air in the hood into the cavity of the hood. When the pressure in the cavity exceeds the preset value, the pressure limiting valve on the air outlet opens. S4: After drying the remaining water on the surface of the wafer to be dried and the wiping plate, the bottom plate and the support member are moved downward, so that the wafer to be dried on the support member is moved outside the cover. At the same time, the heating element is kept working, and the dust collector, exhaust fan and variable frequency motor are turned off. S5: First, press the limit pins to make the two wiping plates stand up, then move the wafer to be dried in the direction close to the rotation axis, so that the wafer to be dried passes between the two wiping plates to wipe off the water stains on the surface of the wafer to be dried; S6: Place the dried wafer at a designated location; S7: Take another wafer to be dried and repeat the above steps.

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