Multi-line switching wire bonding method based on a manual wedge bonder

Abstract

The present invention relates to a multi-line switching wire bonding method based on a manual wedge bonder, and relates to the technical field of electronic packaging. The method includes: inputting a first lead corresponding to a first type of linear chip into a multi-line manual wedge bonder; executing a bonding program to bond the first type of linear chip; in response to the completion of the bonding of the first type of linear chip, inputting a lead corresponding to a second type of linear chip into the multi-line manual wedge bonder; executing a bonding program to bond the second type of linear chip; and withdrawing a second lead from the multi-line manual wedge bonder. By applying a multi-line manual wedge bonder and configuring a corresponding bonding program, during the bonding process of different types of linear chips, the process of bonding multi-type linear chips using a single machine is realized. This process uses a single device to meet the manufacturing process requirements of multi-type linear chips, reduces production costs, and improves the working efficiency of the bonding process.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and particularly to a multi-line switching wire bonding method based on a manual wedge bonder. Background Art

[0002] Wire bonding is a technology that uses metal filaments or tapes to interconnect a bare chip with the I / O pads of an electronic package or the exposed solder areas on a circuit board, and it is an important process in the field of electronic packaging. With the rapid development of electronic packaging technology, high-density packaging has become the mainstream in the market, and multi-functional and multi-variety bare chips have been developed and applied in various fields. The packaging of bare chips is inseparable from wire bonding. The wedge bonder realizes bonding through heating, pressurization, ultrasonic waves, etc., and uses high-temperature diffusion and plastic friction deformation to achieve bonding; because of its smaller pitch, lower arc height, and controllable arc length, it is beneficial to achieve radio frequency indicators and is widely used in the field of microwave multi-chip modules. After years of development, the wire bonding process (bonding process) has been relatively mature.

[0003] In the related art, when packaging multi-chip modules, a large number of bare chips are bonded together. Before bonding each type of chip, parameters need to be determined through experiments. Due to the pad differences of some chips, wires of different line types need to be used. Since the line type switching takes a long time, in order to ensure continuous production, there are two current methods: one is to equip multiple bonders, and each bonder only bonds one line type; the other is to use a single bonder to bond one type of line type chip and then stop the line, and after the line type is switched, bond another type of line type chip.

[0004] However, if the methods in the related art are used, when multiple bonders are equipped, the process cost is relatively high; if a single bonder is used, the process takes a long time. Therefore, the production cost of the wire bonding process using a bonder is relatively high, and the production efficiency is relatively low. Summary of the Invention

[0005] The purpose of the present invention is to overcome the deficiencies in the existing technology, thereby reducing the process cost of wire bonding using a bonder and improving the efficiency of the process. This technical solution is applied to a multi-line manual wedge bonder, which includes a compatible capillary, a first wire clamp, a second wire clamp, a first wire supply fixture, a second wire supply fixture, and a wire supply positioning shaft;

[0006] The compatible capillary is located at the bottom of the multi-line manual wedge bonder;

[0007] The first wire clamp corresponds to the first wire supply fixture to execute the first bonding process, and the first bonding process corresponds to 45° bonding;

[0008] The second wire clamp corresponds to the second wire supply fixture to execute the second bonding process, and the second bonding process corresponds to 90° bonding;

[0009] The manual wedge bonder has a bonding program built in;

[0010] A multi-line switching wire bonding method based on a manual wedge bonder includes:

[0011] Input the first lead corresponding to the first type of linear chip into the multi-line manual wedge bonder, and control the first lead to pass through the first wire supply fixture, the first wire clamp, and the compatible split blade;

[0012] Execute the bonding program to bond the first type of linear chip;

[0013] In response to the completion of the bonding of the first type of linear chip, withdraw the first lead from the multi-line manual wedge bonder;

[0014] Input the lead corresponding to the second type of linear chip into the multi-line manual wedge bonder, and control the second lead to pass through the second wire supply fixture, the second wire clamp, and the compatible split blade;

[0015] Execute the bonding program to bond the second type of linear chip;

[0016] In response to the completion of the bonding of the second type of linear chip, withdraw the second lead from the multi-line manual wedge bonder.

[0017] In an optional embodiment, after withdrawing the second lead from the multi-line manual wedge bonder in response to the completion of the bonding of the second type of linear chip, it includes:

[0018] Input the third lead corresponding to the third chip type into the multi-line manual bonder, and control the third lead to pass through the first wire supply fixture, the first wire clamp, and the first split blade;

[0019] Execute the bonding program to bond the third type of linear chip;

[0020] In response to the completion of the bonding of the third type of linear chip, withdraw the third lead from the multi-line manual wedge bonder.

[0021] In an optional embodiment, the wire types of the first lead, the second lead, and the third lead are adjacent.

[0022] In an optional embodiment, the material of the wire supply positioning shaft is brass.

[0023] In an optional embodiment, the multi-line manual wedge bonder further includes a first cantilever and a second cantilever;

[0024] The first wire supply fixture is fixedly connected to the wire supply positioning shaft through the first cantilever;

[0025] The second wire supply fixture is fixedly connected to the wire supply positioning shaft through the second cantilever.

[0026] In an alternative embodiment, the bonding process includes at least two bonding sub - processes;

[0027] Among the at least two bonding sub - processes, the first bonding sub - process corresponds to the bonding process of the first linear chip, and the second bonding sub - process corresponds to the bonding process of the second linear chip.

[0028] The beneficial effects brought by the technical solution provided by the present invention at least include:

[0029] By applying a multi - linear manual wedge bonder and configuring the corresponding bonding program, during the bonding process of different types of linear chips, by accessing the leads in different ways and corresponding to the lead access methods, different bonding program settings are executed to realize the bonding process of multiple types of linear chips using a single machine. This process uses a single device to meet the manufacturing process requirements of multiple types of linear chips, reduces production costs, and improves the working efficiency of the bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0031] Figure 1 FIG. shows a schematic structural diagram of a multi - linear manual wedge bonder provided by an exemplary embodiment of the present application.

[0032] Figure 2 FIG. shows a close - up schematic diagram of a cantilever, a wire supply fixture, and a contribution positioning shaft provided by an exemplary embodiment of the present application.

[0033] Figure 3 FIG. shows a schematic flowchart of a multi - linear switching lead bonding method based on a manual wedge bonder provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] To make the objectives, technical solutions, and advantages of the present invention clearer, the following will further describe the embodiments of the present invention in detail with reference to the drawings.

[0035] The multi - linear switching lead bonding method based on a manual wedge bonder described in the present application needs to be executed in combination with a multi - linear manual wedge bonder. Figure 1 FIG. shows a schematic structural diagram of a multi - linear manual wedge bonder provided by an exemplary embodiment of the present application. Please refer to Figure 1, the multi-line manual wedge bonding machine includes a compatible bonding tool 101, a first wire clamp 102, a second wire clamp 103, a first wire supply fixture 104, a second wire supply fixture 105, and a wire supply positioning shaft 106. The first wire clamp corresponds to the first wire supply fixture to perform a first bonding process, and the first bonding process corresponds to a 45° bonding. The second wire clamp corresponds to the second wire supply fixture to perform a second bonding process, and the second bonding process corresponds to a 90° bonding.

[0036] In an embodiment of the present application, both the first wire clamp and the second wire clamp are located near the compatible bonding tool. The first bonding process described in the embodiment of the present application is a 45° bonding process, and the second bonding process described in the embodiment of the present application is a 90° bonding process. Therefore, the first wire clamp, the first wire supply fixture, and the compatible bonding tool are combined to perform the 45° bonding process, and the second wire clamp, the second wire supply fixture, and the compatible bonding tool are combined to perform the 90° bonding process. In the embodiment of the present application, the compatible bonding tool can shear at least two different types of leads.

[0037] In the embodiment of the present application, the material of the wire supply positioning shaft is brass, and the wire supply positioning shaft is used to position the two wire supply clamps. In one example, a groove is provided above the wire supply positioning shaft, and protrusions are provided below the first wire supply fixture and the second wire supply fixture. Through the matching of the groove and the protrusion, the matching connection between the wire supply fixture and the wire supply positioning shaft is realized.

[0038] In an alternative embodiment, please refer to Figure 2 , the multi-line manual wedge bonding machine further includes a first cantilever 107 and a second cantilever 108. The first wire supply fixture is fixedly connected to the wire supply positioning shaft through the first cantilever; the second wire supply fixture is fixedly connected to the wire supply positioning shaft through the second cantilever.

[0039] It should be noted that the multi-line manual wedge bonding machine described in the present application is implemented as a semi-automatic bonding machine, which is equipped with a bonding program, and the bonding program can implement some processes of the wire type chip bonding process flow. In the embodiment of the present application, the bonding program can be entered by burning after the multi-line manual wedge bonding machine is prepared. Then, during the use of the multi-line manual wedge bonding machine, when the device is started, the corresponding bonding program can be executed.

[0040] Combined with the above description, Figure 3 shows a schematic flow chart of a multi-line switching lead bonding method based on a manual wedge bonding machine provided by an exemplary embodiment of the present application. The method includes:

[0041] Step 301, input the first lead corresponding to the first type of wire type chip into the multi-line manual wedge bonding machine, and control the first lead to pass through the first wire supply fixture, the first wire clamp, and the compatible bonding tool.

[0042] This process is used to perform the process of 45° bonding. At this time, the lead wire passes through the first wire supply fixture, the first wire clamp, and the compatible capillary. Optionally, there is a cutting edge corresponding to the first lead wire in the compatible capillary. In one example, the diameter of the first lead wire is 18μm.

[0043] Step 302, execute the bonding program to bond the first type of linear chip.

[0044] This process is the bonding process of the first type of linear chip.

[0045] Step 303, in response to the completion of the bonding of the first type of linear chip; withdraw the first lead wire from the multi-line manual wedge bonder.

[0046] In the embodiment of the present application, after the bonding of the first type of linear chip is completed, the staff performs a manual process to withdraw the first lead wire.

[0047] Step 304, input the lead wire corresponding to the second type of linear chip into the multi-line manual wedge bonder, and control the second lead wire to pass through the second wire supply fixture, the second wire clamp, and the compatible capillary.

[0048] Step 305, execute the bonding program to bond the second type of linear chip.

[0049] This process is used to perform the process of 90° bonding. At this time, the lead wire passes through the second wire supply fixture, the second wire clamp, and the compatible capillary. Optionally, there is a cutting edge corresponding to the second lead wire in the compatible capillary. In one example, the diameter of the second lead wire is 20μm.

[0050] Step 306, in response to the completion of the bonding of the second type of linear chip, withdraw the second lead wire from the multi-line manual wedge bonder.

[0051] Optionally, after withdrawing the second lead wire from the multi-line manual wedge bonder, the third lead wire corresponding to the third chip type can also be input into the multi-line manual bonder, and control the third lead wire to pass through the first wire supply fixture, the first wire clamp, and the first capillary. Then, execute the bonding program to bond the third type of linear chip. And after the bonding is completed, in response to the completion of the bonding of the third type of linear chip, withdraw the third lead wire from the multi-line manual wedge bonder. That is, the multi-line manual wedge bonder can perform the bonding process for different types of linear chips according to different lead wires and different bonding modes introduced by the user. In one example, the diameter of the third lead wire corresponding to the third type of linear chip is 25μm.

[0052] It should be noted that the bonding process includes at least two bonding sub-processes. Among the at least two bonding sub-processes, the first bonding sub-process corresponds to the bonding process of the first linear chip, and the second bonding sub-process corresponds to the bonding process of the second linear chip. Corresponding to the bonding requirement for the third linear chip, multiple types of sub-processes should be configured in the bonding process accordingly.

[0053] In summary, the method provided by the embodiment of the present application applies a multi-linear manual wedge bonder and configures a corresponding bonding process. During the bonding process of different types of linear chips, by accessing leads in different ways and corresponding to the lead access methods, different bonding process settings are executed to achieve the bonding process of multiple types of linear chips using a single machine. This process uses a single device to meet the manufacturing process requirements of multiple types of linear chips, reduces production costs, and improves the working efficiency of the bonding process.

[0054] The above are only optional embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A multi-line switching wire bonding method based on a manual wedge bonder, characterized in that, the method is applied to a multi-line manual wedge bonder, and the multi-line manual wedge bonder includes a compatible capillary, a first wire clamp, a second wire clamp, a first wire supply fixture, a second wire supply fixture, and a wire supply positioning shaft; the compatible capillary is located at the bottom of the multi-line manual wedge bonder; the first wire clamp corresponds to the first wire supply fixture to execute a first bonding process, and the first bonding process corresponds to 45° bonding; the second wire clamp corresponds to the second wire supply fixture to execute a second bonding process, and the second bonding process corresponds to 90° bonding; the manual wedge bonder is built-in with a bonding program; the method includes: input a first lead corresponding to a first type of linear chip into the multi-line manual wedge bonder, and control the first lead to pass through the first wire supply fixture, the first wire clamp, and the compatible capillary; execute the bonding program to bond the first type of linear chip; in response to the completion of the bonding of the first type of linear chip, withdraw the first lead from the multi-line manual wedge bonder; input a lead corresponding to a second type of linear chip into the multi-line manual wedge bonder, and control the second lead to pass through the second wire supply fixture, the second wire clamp, and the compatible capillary; execute the bonding program to bond the second type of linear chip; in response to the completion of the bonding of the second type of linear chip, withdraw the second lead from the multi-line manual wedge bonder.

2. The multi-line switching wire bonding method based on a manual wedge bonder according to claim 1, characterized in that, after the step of in response to the completion of the bonding of the second type of linear chip, withdrawing the second lead from the multi-line manual wedge bonder, it includes: input a third lead corresponding to a third chip type into the multi-line manual bonder, and control the third lead to pass through the first wire supply fixture, the first wire clamp, and the first capillary; execute the bonding program to bond the third type of linear chip; in response to the completion of the bonding of the third type of linear chip, withdraw the third lead from the multi-line manual wedge bonder.

3. The multi-line switching wire bonding method based on a manual wedge bonder according to claim 1, characterized in that, the wire types of the first lead, the second lead, and the third lead are adjacent.

4. The multi-line switching wire bonding method based on a manual wedge bonder according to claim 1, characterized in that, the material of the wire supply positioning shaft is brass.

5. The multi-line switching wire bonding method based on a manual wedge bonder according to claim 1, characterized in that, the multi-line manual wedge bonder further includes a first cantilever and a second cantilever; the first wire supply fixture is fixedly connected to the wire supply positioning shaft through the first cantilever; the second wire supply fixture is fixedly connected to the wire supply positioning shaft through the second cantilever.

6. The multi-line switching wire bonding method based on a manual wedge bonder according to claim 1, characterized in that, the bonding program includes at least two bonding sub-programs; Among at least two of the bonding subroutines, the first bonding subroutine corresponds to the bonding process of the first type of linear chip, and the second bonding subroutine corresponds to the bonding process of the second type of linear chip.

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