Display panel and manufacturing and repairing methods thereof

Abstract

The application relates to a display panel and a manufacturing method and a repairing method thereof, which comprises a substrate, a driving array arranged on one side of the substrate, a plurality of pairs of pad groups electrically connected with the driving array, and a positioning part arranged on the periphery of the pad groups; a plurality of light emitting elements, each of which is arranged on one side of the substrate and is electrically connected with a pair of the pad groups; a plurality of heat insulation parts, each of which is arranged on the substrate through the positioning part, the heat insulation part surrounds the light emitting element, and a reflective layer is arranged on one side of the heat insulation part facing the light emitting element; and an encapsulating layer, which comprises a first encapsulating part arranged between each of the light emitting elements and the heat insulation part, and a second encapsulating part arranged between each of the heat insulation parts. In the maintenance process, the heat insulation part can block the heat generated when the encapsulating glue is removed by heating, and the adjacent light emitting elements are protected.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and its manufacturing and repair methods. Background Technology

[0002] With the shrinking size of LED chips and the improvement of packaging technology, displays with a pixel pitch of 3mm (P3) are already common in the market. Further, with chip sizes reaching around 100μm, industrially termed miniLED, the pixel pitch can reach around 0.2mm (P2). MiniLED size essentially reaches the limit of commonly used LED manufacturing technologies, demonstrating significant advantages in brightness, contrast, and reliability. MicroLED further reduces chip size to below 50μm. Due to its small chip size, high integration, and self-emissive characteristics, MicroLED offers greater advantages over LCD and OLED displays in terms of brightness, resolution, contrast, energy consumption, lifespan, response speed, and thermal stability.

[0003] Currently, Micro / Mini LEDs are typically encapsulated directly using encapsulating adhesive after bonding. This method presents two main problems: First, the extremely close spacing between pixels and sub-pixels in Micro / Mini LEDs easily leads to color crosstalk, resulting in impure color display. Second, some Micro / Mini LED chips fail during the bonding and encapsulation process. Because the LEDs are already encapsulated and the spacing between them is extremely small, it is very difficult to remove and replace individual or a few failed chips, making repairing the encapsulated display panel very challenging. Removing the encapsulating adhesive layer requires removing a large area or the entire surface, affecting healthy LEDs surrounding the failed ones and easily causing damage, leading to additional faults and increased repair costs.

[0004] Therefore, how to avoid color crosstalk after packaging to achieve better display effects and reduce the difficulty of chip repair after packaging is an urgent problem to be solved. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a display panel and its manufacturing and repair methods, which aims to solve the problems of impure color display caused by color crosstalk and the difficulty of chip repair after LED packaging.

[0006] A display panel, comprising:

[0007] The substrate includes a drive array disposed on one side of the substrate, multiple pairs of pads electrically connected to the drive array, and a positioning portion disposed on the outer periphery of the pads.

[0008] A plurality of light-emitting elements are disposed on one side of the substrate and are electrically connected to a pair of pad groups respectively;

[0009] A plurality of heat insulation components, each heat insulation component being disposed on the substrate via the positioning portion, the heat insulation components being disposed around the light-emitting element, and a reflective layer being disposed on the side of the heat insulation components facing the light-emitting element;

[0010] The encapsulation layer includes a first encapsulation portion disposed between each of the light-emitting elements and the heat insulation component, and a second encapsulation portion disposed between each of the heat insulation components.

[0011] In the aforementioned display panel, a heat insulation component surrounds the light-emitting elements. Made of heat-insulating material, this component allows for the removal of the first encapsulation portion of the heat insulation component corresponding to a defective light-emitting element using methods such as laser heating. After removing the encapsulation adhesive, the defective light-emitting element can be replaced. During this process, the heat generated during adhesive removal is blocked by the heat insulation component, preventing damage to the encapsulation adhesive on other parts of the display panel's encapsulation layer. The remaining undamaged light-emitting elements remain intact, preventing the creation of new defective light-emitting elements during repair and avoiding additional malfunctions, thus saving repair costs. After replacing the light-emitting element, the heat insulation component, now free of encapsulation adhesive, is simply refilled, making repair quick and easy. Furthermore, the heat insulation component is positioned by a positioning part on the substrate, facilitating its installation and preventing displacement. Additionally, a reflective layer is provided on the side of the heat insulation component facing the light-emitting element. This reflective layer blocks light, preventing color crosstalk between adjacent light-emitting elements and avoiding impure color display, resulting in better display quality.

[0012] Based on the same inventive concept, this application also provides a method for manufacturing a display panel, comprising:

[0013] A substrate is provided, the substrate including a driving array disposed on one side of the substrate and a plurality of pairs of pads electrically connected to the driving array;

[0014] A positioning portion surrounding the pad group is provided on the side of the substrate where the pad group is located;

[0015] The chip electrodes of the light-emitting element are bonded to the pad assembly;

[0016] A heat insulation component is disposed on the substrate via the positioning part, the heat insulation component is disposed around the light-emitting element, and a reflective layer is disposed on the side of the heat insulation component facing the light-emitting element;

[0017] An encapsulation layer is provided, the encapsulation layer including a first encapsulation portion disposed between each of the light-emitting elements and the heat insulation component, and a second encapsulation portion disposed between each of the heat insulation components.

[0018] The aforementioned manufacturing method uses a heat-insulating component surrounding the light-emitting element. This component blocks the heat generated during the removal of the encapsulation layer, preventing damage to the encapsulation adhesive on other parts of the encapsulation layer. This protects adjacent, undamaged light-emitting elements, preventing the creation of new defective elements during repair and avoiding additional malfunctions, thus saving repair costs. Furthermore, the heat-insulating component is positioned by a positioning part on the substrate, ensuring it does not move during manufacturing and providing excellent positioning and limiting. Simultaneously, the reflective layer on the heat-insulating component blocks light, preventing color crosstalk between adjacent light-emitting elements, avoiding impure color display, and resulting in a better display effect on the display panel.

[0019] Based on the same inventive concept, this application also provides a repair method for repairing the display panel as described above, comprising:

[0020] Each of the light-emitting elements in the display panel is inspected to identify defective light-emitting elements;

[0021] The first encapsulation portion in the target heat insulation component corresponding to the defective light-emitting element is heated until the state of the first encapsulation portion changes;

[0022] Remove the first package portion and the defective light-emitting element after the state change;

[0023] A new light-emitting element and a new first encapsulation part are provided inside the target heat insulation component.

[0024] During the repair process, the heat insulation component within the display panel protects adjacent, undamaged light-emitting elements, preventing additional malfunctions and saving on repair costs. Furthermore, the heat insulation allows for the removal of only the encapsulating adhesive from the faulty area, significantly reducing the repair scope. This also results in better adhesive filling after replacing the faulty light-emitting element, making the repair process simple and quick. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a display panel provided in an embodiment of the present invention;

[0026] Figure 2 This is a schematic diagram of a substrate structure provided in an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of a structure in which a single light-emitting element is disposed within a heat insulation component according to an embodiment of the present invention;

[0028] Figure 4 A schematic diagram showing the first encapsulation portion after heating to remove the faulty part during the repair of a display panel, as provided in an embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram illustrating the removal of defective light-emitting elements during the repair of a display panel, as provided in an embodiment of the present invention.

[0030] Figure 6 This is a schematic diagram illustrating the replacement of a faulty light-emitting element during the repair of a display panel, as provided in an embodiment of the present invention.

[0031] Figure 7 A schematic diagram of a structure in which a positioning part is provided on a substrate according to an embodiment of the present invention;

[0032] Figure 8 Provided for embodiments of the present invention Figure 7 A schematic diagram of an example structure in a cross-sectional view (AA).

[0033] Figure 9 Provided for embodiments of the present invention Figure 7 A schematic diagram of another example structure in the AA section view;

[0034] Figure 10 Provided for embodiments of the present invention Figure 7 A schematic diagram of another example structure in the AA section view;

[0035] Figure 11 This is a schematic diagram of another structure provided by the embodiment of the present invention, which includes a positioning part on a substrate.

[0036] Figure 12 Provided for embodiments of the present invention Figure 11 A schematic diagram of an example structure in a BB cross-sectional view;

[0037] Figure 13 Provided for embodiments of the present invention Figure 11 A schematic diagram of another example structure in the BB cross-sectional view;

[0038] Figure 14 This is a schematic diagram of another structure of the display panel provided in an embodiment of the present invention;

[0039] Figure 15 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0040] Figure 16 A flowchart illustrating a method for repairing a display panel according to an embodiment of the present invention;

[0041] Explanation of reference numerals in the attached figures:

[0042] 1-Substrate, 101-Positioning part, 102-Positioning groove, 103-Boss, 104-One side of the substrate, 2-Light-emitting element, 3-Heat insulation component, 4-Encapsulation layer, 5-Reflective layer, 6-Light-absorbing layer, 7-Reflective layer, 8-Diffusing particles, 9-Light-transmitting cover plate. Detailed Implementation

[0043] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0045] Currently, with extremely small spacing between chips, it is very difficult to remove and replace one or a few failed chips individually, making the repair of the encapsulated display panel extremely difficult. When removing the encapsulating adhesive layer, it can only be removed over a large area or the entire surface. The unfailed LED chips located around the failed LED chips will be affected, easily causing damage to the originally unfailed LED chips, leading to additional faults and increasing repair costs.

[0046] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0047] This embodiment provides a display panel, which can be, but is not limited to, a display panel with small-pitch light-emitting elements, such as a MicroLED display panel or a MiniLED display panel. The aforementioned display panel can be used in terminals such as televisions, monitors, and mobile phones, and can be applied to home display, medical display, decorative display, transportation display, and advertising display fields. The above applications are merely a few examples exemplified in this embodiment, and it should be understood that the application of the display module in this embodiment is not limited to the fields exemplified above.

[0048] like Figures 1-3 As shown, the display panel includes:

[0049] The substrate 1 includes a driving array disposed on one side 104 of the substrate 1, multiple pairs of pads electrically connected to the driving array, and a positioning portion 101 disposed on the outer periphery of the pads. The substrate 1 may be a light-transmitting substrate 1, such as a glass substrate 1; or it may be a non-light-transmitting substrate 1, such as a PCB board. This embodiment does not make a specific limitation.

[0050] A plurality of light-emitting elements 2 are disposed on one side 104 of the substrate 1 and electrically connected to a pair of pads respectively; it is understood that the light-emitting elements 2 may be, but are not limited to, LED chips, including P-type semiconductors, N-type semiconductors, and an active layer located between the P-type semiconductors and N-type semiconductors.

[0051] Several heat insulation components 3 are provided, each heat insulation component 3 is disposed on the substrate 1 via a positioning part 101, the heat insulation components 3 are disposed around the light-emitting element 2, and a reflective layer 5 is disposed on the side of the heat insulation component 3 facing the light-emitting element 2. The heat insulation component 3 is a part with heat insulation function made of heat insulation material.

[0052] The encapsulation layer 4 includes a first encapsulation portion disposed between each light-emitting element 2 and a heat-insulating element 3, and a second encapsulation portion disposed between each heat-insulating element 3. The encapsulation layer 4 can be formed by molding with, but is not limited to, encapsulating adhesive, and can be removed by heating.

[0053] In the aforementioned display panel, the heat insulation component 3 surrounds the light-emitting element 2. The heat insulation component 3 is made of heat-insulating material. If a defective light-emitting element appears, the first encapsulation portion in the target heat insulation component corresponding to the defective light-emitting element can be removed using heating methods such as laser heating. Figure 4 After removing the encapsulating adhesive with a laser, the defective light-emitting element can be replaced, such as... Figure 5 During this process, the heat generated when removing the encapsulating adhesive is blocked by the heat insulation component 3, preventing it from affecting the encapsulating adhesive on the remaining parts of the encapsulation layer 4 on the display panel. The remaining undamaged light-emitting elements remain intact, avoiding the generation of new defective light-emitting elements during repair and preventing additional malfunctions, thus saving repair costs. After removing the defective light-emitting element 2, a good light-emitting element is replaced, such as... Figure 6 As shown. After replacing the light-emitting element, simply refill the heat insulation component (after removing the encapsulating adhesive) with encapsulating adhesive, making maintenance quick and easy. Furthermore, the display panel uses the positioning part 101 on the substrate 1 to position the heat insulation component 3, facilitating its installation and preventing displacement. Moreover, the heat insulation component 3 has a reflective layer 5 on the side facing the light-emitting element 2. This reflective layer 5 blocks light, preventing color crosstalk between adjacent light-emitting elements 2 and avoiding impure color display, resulting in better display quality.

[0054] In this embodiment, as Figure 1 , Figure 3One light-emitting element 2 can be surrounded within a heat insulation component 3, thus providing heat insulation and blocking for each light-emitting element 2. In some applications, several light-emitting elements 2 can also be set in a heat insulation component 3, thereby reducing the area affected by heat generated during maintenance.

[0055] To achieve good heat insulation during maintenance, the end of the heat insulation component 3 away from the substrate 1 is higher than the end of the light-emitting element 2 away from the substrate 1, or the end of the heat insulation component 3 away from the substrate 1 is flush with the end of the light-emitting element 2 away from the substrate 1. In this embodiment, the end of the heat insulation component 3 away from the substrate 1 may be higher than or flush with the active layer of the end of the light-emitting element 2 away from the substrate 1.

[0056] In this embodiment, the heat insulation component 3 is an annular structure with openings at the top and bottom. The cross-section of the heat insulation component 3 parallel to the surface of the substrate 1 can be, but is not limited to, rectangular; for example, it can also be circular, elliptical, polygonal, or other irregularly shaped structures. The heat insulation component 3 can be formed by compression molding, and the heat insulation material can be silicate, aerogel felt, etc. During manufacturing, the heat insulation components 3 can be sequentially aligned and placed on the front side of the substrate 1, or multiple or even all the heat insulation components 3 can be first fixed onto a peelable film according to the arrangement position of the light-emitting elements 2 on the substrate 1, and then the heat insulation components 3 on the film can be aligned with the light-emitting elements 2 on the substrate 1, so that the heat insulation components 3 are placed on the substrate 1 at once, and finally the film can be peeled off. This embodiment does not specifically limit this.

[0057] In order to quickly position the heat insulation component 3 during the manufacturing process, a number of positioning parts 101 corresponding to the light-emitting elements 2 can be provided on the front side of the substrate 1. The positioning parts 101 cooperate with the heat insulation component 3 to position the heat insulation component 3 on the outer periphery of the light-emitting elements 2.

[0058] In one example, the positioning part 101 may be a positioning groove 102 provided in the substrate 1, with the opening of the positioning groove 102 facing the light-emitting surface of the display panel, and the end of the heat insulation member 3 near the substrate 1 embedded in the positioning groove 102. Figure 7 , Figure 8 As shown, the positioning groove 102 can be a complete annular structure surrounding the light-emitting element 2, with the lower end of the annular heat insulation member 3 directly inserted into the annular groove to form a positioning; or, as... Figure 11 , Figure 12 As shown, the positioning groove 102 can also be a plurality of groove structures. The lower end of the heat insulation component 3 is provided with a plurality of downwardly extending protrusions. During manufacturing, the protrusions at the lower end of the heat insulation component 3 are inserted into the groove structure to form a positioning. In this example, the grooves can be formed by laser processing or etching.

[0059] In another example, the positioning part 101 is a boss 103 disposed on the outer periphery of the light-emitting element 2, such as Figure 7 , Figure 9As shown, the boss 103 can be a complete annular structure surrounding the light-emitting element 2. During manufacturing, the lower end of the heat insulation component 3 is fitted onto the aforementioned boss structure for positioning; or the lower end of the heat insulation component 3 is fitted within the annular boss structure for positioning; or, as... Figure 11 , Figure 13 As shown, the boss 103 can also be a structure of multiple bosses. The lower end of the heat insulation component 3 is provided with multiple grooves. During manufacturing, the multiple bosses 103 are inserted into the grooves at the lower end of the heat insulation component 3 to form a positioning.

[0060] In another example, such as Figure 10 As shown, the positioning part 101 can be a combination of a groove structure and a boss structure provided on the outer periphery of the light-emitting element 2. The lower end of the heat insulation member 3 forms an uneven lower end surface by providing a groove, and the uneven lower end surface fits into the concave and convex positioning part 101 to form a positioning.

[0061] The positioning part 101 not only enables rapid positioning of the heat insulation component 3, but also limits the heat insulation component 3 in subsequent processes, preventing displacement of the heat insulation component 3. In some application scenarios, the heat insulation component 3 may not be positioned using the positioning part 101 on the substrate 1. For example, the heat insulation component 3 can be fixed to the substrate 1 by directly applying or attaching adhesive to the lower end of the heat insulation component 3.

[0062] To prevent color crosstalk between adjacent light-emitting elements 2, the heat insulation component 3 in this embodiment can be made of a material with heat insulation and light-blocking functions; alternatively, the heat insulation component 3 can be made of heat-insulating material, and a reflective layer 5 can be formed on the inner side of the heat insulation component 3 facing the light-emitting element 2. This achieves both heat insulation and prevents side light from the light-emitting element 2 from entering adjacent light-emitting elements 2 and causing color crosstalk, thus avoiding impure color display and improving the display effect. In this embodiment, the reflective layer 5 can reflect the side light emitted by the light-emitting element 2, improving light utilization. The reflective layer 5 also acts as a light-blocking layer, blocking the side light from the light-emitting element 2 to prevent color crosstalk. The reflective layer 5 can be made by plating a metal layer, such as copper, silver, aluminum, etc., and this embodiment does not impose specific limitations.

[0063] When the substrate 1 is a glass substrate 1, a reflective layer 7 is provided on the side of the glass substrate away from the light-emitting element 2. The reflective layer 7 can be fabricated in the same way as the reflective layer 5, which can also improve the light utilization rate and increase the display brightness of the display panel.

[0064] To achieve a blackening effect and improve display contrast, this embodiment may provide a light-absorbing layer 6 between adjacent heat insulation components 3, with the light-absorbing layer 6 and the light-emitting element 2 located on the same side of the substrate 1. This light-absorbing layer 6 can be made of a black light-absorbing material, such as inkjet printing with black ink, or a layer of black adhesive can be directly applied. This embodiment does not impose specific limitations.

[0065] To improve the viewing angle of the product, the encapsulation layer 4 is provided with diffusion particles. These diffusion particles can be located on the surface of the encapsulation layer 4 or incorporated within it; this embodiment does not limit this. The diffusion particles diffuse the light emitted by the light-emitting element, thereby improving the viewing angle of the display panel. The diffusion particles can be formed using, but are not limited to, an imprinting process.

[0066] like Figure 1 As shown, the encapsulation layer 4 includes a first encapsulation portion disposed between each light-emitting element 2 and the heat insulation component 3, and a second encapsulation portion disposed between each heat insulation component 3. The first and second encapsulation portions may be higher than the heat insulation components, thereby forming a complete encapsulating adhesive layer on the substrate 1. This encapsulating adhesive layer fixes the heat insulation component 3 and the light-emitting element 2, and also seals the light-emitting element 2, providing protection and isolating it from water and oxygen. The encapsulation layer 4 can be made of LED encapsulating adhesives such as epoxy resin or silicone resin. In some applications, such as... Figure 14 The encapsulation part of the encapsulation layer may not be higher than the heat insulation component 3. A light-transmitting cover plate 9 is fixed above the light-emitting element to form a seal. In this case, in order to better fix the heat insulation component 3, the heat insulation component 3 can be glued to the front side of the substrate 1.

[0067] Another optional embodiment of the present invention:

[0068] This embodiment provides a method for manufacturing a display panel, such as... Figure 15 As shown, it includes:

[0069] A substrate is provided, the substrate including a drive array disposed on one side of the substrate and multiple pairs of pads electrically connected to the drive array.

[0070] A positioning part is provided on the side of the substrate where the pad group is provided. The specific structure and processing method of the positioning part are the same as those in the previous embodiment, and will not be described again here.

[0071] The chip electrodes of the light-emitting element are bonded to the pad assembly. In this embodiment, the pad assembly on substrate 1 is bonded to the chip electrodes on the light-emitting element 2 via bonding material. The bonding material is a conductive material, which can be solder or anisotropic conductive adhesive. The solder should be a material with a low melting point, such as gold-tin alloy, indium, or indium tin oxide.

[0072] The heat insulation component is positioned on the substrate via a positioning part, and the heat insulation component surrounds the light-emitting element. A reflective layer is disposed on the side of the heat insulation component facing the light-emitting element. In this embodiment, the fit between the substrate 1 and the heat insulation component 3, as well as the fabrication and arrangement of the heat insulation component 3, are the same as in the previous embodiment, and will not be described again here.

[0073] An encapsulation layer is provided, comprising a first encapsulation portion disposed between each light-emitting element and a heat-insulating component, and a second encapsulation portion disposed between each heat-insulating component.

[0074] The above manufacturing method uses a heat insulation component 3 surrounding the light-emitting element 2. The heat insulation component 3 blocks the heat generated during the removal of the encapsulation layer 4, preventing damage to the encapsulation adhesive on other parts of the encapsulation layer 4. This protects adjacent, undamaged light-emitting elements, preventing the creation of new defective light-emitting elements during repair and avoiding additional malfunctions, thus saving repair costs. Furthermore, the heat insulation component is positioned by the positioning part 101 on the substrate 1, ensuring it does not move during manufacturing and providing good positioning and limiting. Simultaneously, the reflective layer 5 on the heat insulation component 3 blocks light, preventing color crosstalk between adjacent light-emitting elements 2, avoiding impure color display, and improving the display panel's display effect.

[0075] Another optional embodiment of the present invention:

[0076] This embodiment provides a repair method for repairing the display panel described above, such as... Figure 16 As shown, it includes:

[0077] Each of the light-emitting elements in the display panel is inspected to identify defective light-emitting elements. In this embodiment, after a defective light-emitting element is detected, a mark can be made at the corresponding location of the defective light-emitting element to facilitate subsequent repair.

[0078] The first encapsulation portion of the target heat insulation component corresponding to the defective light-emitting element is heated until the state of the first encapsulation portion changes. Because the heat insulation component 3 has a heat insulation function, such as... Figure 4 As shown, this design prevents the encapsulating adhesive in adjacent areas of the defective light-emitting element from vaporizing or melting due to heat. When removing the adhesive by heating, only the encapsulating adhesive in the heat insulation component corresponding to the defective area is removed, thereby protecting the adjacent light-emitting elements that have not failed.

[0079] Remove the first package portion and the defective light-emitting element after the state change;

[0080] A new light-emitting element and a new first encapsulation part are provided inside the target heat insulation component.

[0081] In this embodiment, the heating method for the first encapsulation portion in the target heat insulation component corresponding to the defective light-emitting element can be, but is not limited to, laser heating. Laser heating vaporizes the first encapsulation portion in the target heat insulation component, changing its state from solid to gaseous. In some examples, other heating methods can also be used to melt or soften the first encapsulation portion, and then the encapsulating adhesive after the state change can be manually removed.

[0082] During the replacement of light-emitting element 2, such as Figure 5 , Figure 6 As shown, the heat insulation component 3 also serves as a barrier to prevent damage to adjacent light-emitting elements during the replacement process.

[0083] During the repair process, the heat insulation component within the display panel protects adjacent, undamaged light-emitting elements, preventing additional malfunctions and saving on repair costs. Furthermore, the heat insulation allows for the removal of only the encapsulating adhesive from the faulty area, significantly reducing the repair scope. This also results in better adhesive filling after replacing the faulty light-emitting element, making the repair process simple and quick.

[0084] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A display panel, characterized in that, include: The substrate includes a drive array disposed on one side of the substrate, multiple pairs of pads electrically connected to the drive array, and a positioning portion disposed on the outer periphery of the pads. A plurality of light-emitting elements are disposed on one side of the substrate and are electrically connected to a pair of pad groups respectively; A plurality of heat insulation components, each heat insulation component being disposed on the substrate via the positioning portion, the heat insulation components being disposed around the light-emitting element, and a reflective layer being disposed on the side of the heat insulation components facing the light-emitting element; The encapsulation layer includes a first encapsulation portion disposed between each of the light-emitting elements and the heat insulation component, and a second encapsulation portion disposed between each of the heat insulation components.

2. The display panel as described in claim 1, characterized in that, The positioning part includes a positioning groove disposed in the substrate, the groove opening of the positioning groove facing the light-emitting surface of the display panel, and the end of the heat insulation member near the substrate is embedded in the positioning groove.

3. The display panel as described in claim 1, characterized in that, The heat insulation component has a rectangular cross-section parallel to the surface of the substrate.

4. The display panel as described in any one of claims 1-3, characterized in that, The end of the heat insulation component away from the substrate is higher than the end of the light-emitting element away from the substrate, or the end of the heat insulation component away from the substrate is flush with the end of the light-emitting element away from the substrate.

5. The display panel as described in any one of claims 1-3, characterized in that, A light-absorbing layer is provided between adjacent heat insulation components, and the light-absorbing layer and the light-emitting element are located on the same side of the substrate.

6. The display panel as described in any one of claims 1-3, characterized in that, The substrate is a glass substrate, and a reflective layer is provided on the side of the glass substrate away from the light-emitting element.

7. The display panel as described in any one of claims 1-3, characterized in that, The encapsulation layer contains diffusing particles.

8. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate including a driving array disposed on one side of the substrate and a plurality of pairs of pads electrically connected to the driving array; A positioning portion surrounding the pad group is provided on the side of the substrate where the pad group is located; The chip electrodes of the light-emitting element are bonded to the pad assembly; A heat insulation component is disposed on the substrate via the positioning part, the heat insulation component is disposed around the light-emitting element, and a reflective layer is disposed on the side of the heat insulation component facing the light-emitting element; An encapsulation layer is provided, the encapsulation layer including a first encapsulation portion disposed between each of the light-emitting elements and the heat insulation component, and a second encapsulation portion disposed between each of the heat insulation components.

9. A repair method for repairing a display panel as described in any one of claims 1-7, characterized in that, include: Each of the light-emitting elements in the display panel is inspected to identify defective light-emitting elements; The first encapsulation portion in the target heat insulation component corresponding to the defective light-emitting element is heated until the state of the first encapsulation portion changes; Remove the first package portion and the defective light-emitting element after the state change; A new light-emitting element and a new first encapsulation part are provided inside the target heat insulation component.

10. The repair method as described in claim 9, characterized in that, The step of heating the first encapsulation portion in the target heat insulation component corresponding to the defective light-emitting element until the state of the first encapsulation portion changes includes: The first encapsulation portion in the target heat insulation component is heated by laser to vaporize the first encapsulation portion.

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