A circuit board with a side edge segmented metal edge finish and a method of processing the same

Abstract

The application discloses a kind of side edge segmented metal edge-wrapping circuit board and processing method thereof, belong to circuit board metal edge-wrapping field, the method includes: overall edge-wrapping is carried out to the side edge of circuit board, vertical segmentation is carried out by drilling and milling;The parameters of T-shaped cutter are determined, and T-shaped cutter is made;Depth control milling is carried out along the side wall of edge-wrapping by T-shaped cutter to form horizontal segmentation.The T-shaped cutter specifically includes: shank, one end of the shank is fixedly connected with blade, and the end of the blade away from the shank is fixedly connected with a plurality of evenly distributed blade tips, the material of the T-shaped cutter is tungsten steel, and the blade tip of the T-shaped cutter is staggered three-edged.The application carries out vertical segmentation by drilling and milling after conventional overall edge-wrapping, then forms horizontal segmentation by special T-shaped cutter and specific parameters, and the circuit board with side wall metal edge-wrapping segmented in vertical and horizontal directions can be formed by such combination.

Description

Technical Field

[0001] This invention relates to the field of metal edging for circuit boards, specifically a circuit board with segmented metal edging on the sides and its processing method. Background Technology

[0002] For high-frequency and high-speed PCBs, it is often required to metallize part of the board's sidewalls to form metallized edge grooves, preventing high-speed or microwave signals from radiating out from the PCB edge. Additionally, this metallized edge structure improves grounding reliability and shielding effectiveness, reducing interference from localized circuitry. Most current metallization edge processes are designed for full-layer metallization, meaning the entire sidewall is metallized. Sometimes, due to design requirements, the edge metal is arrayed, segmenting it horizontally and vertically to achieve modular side soldering or contact functions; however, this type of process is currently uncommon.

[0003] Current partial edge-wrapping processes mainly involve edge-wrapping at specific levels. There are two main related technologies commonly used in the industry: Technique 1 involves first metallizing all layers of the edge, then performing controlled-depth milling to remove excess metallized edges before etching. However, the drawback of Technique 1, which uses controlled-depth milling to remove excess metallized edges, is that it can only be used for controlled-depth milling at the top or bottom layer, leaving a middle section, or vice versa. It cannot achieve a design where both the top and bottom edges are left segmented. Furthermore, the accuracy of conventional controlled-depth milling is affected by the plate thickness, resulting in varying milling depths. The straightness of the edge banding is insufficient. The second technique involves first preparing the edge banding on the core board, and then forming a blind groove by pressing non-flowing PP through a window. The prepared edge banding is sealed in the blind groove, and finally the blind groove cover is peeled off to reveal the edge banding pre-made on the core board, similar to the process of rigid-flex boards. However, the disadvantages of the second technique, which involves preparing the edge banding on the core board first and then pressing it, are that the process is longer and the cost is higher. It requires PP window opening and pre-cut seams on the sub-board, and there is a risk that the PP adhesive will overflow and cover the copper surface of the edge banding during the pressing process.

[0004] For some products designed with segmented side-edge metal edging, where the edging metal is distributed at the top and bottom ends, with certain spatial gaps in the middle and on the left and right, the controlled-depth milling method of Technique 1 cannot achieve horizontal segmentation. Technique 2, as described in the background art, requires separate edging of the top and bottom sub-boards, followed by lamination with a windowed PP sheet in the middle. This process is lengthy and costly. Furthermore, due to the fixed thickness of the PP sheet, it is difficult to precisely control the separation distance, making it impractical. Therefore, those skilled in the art provide a circuit board with segmented side-edge metal edging and its processing method to solve the problems mentioned in the background art. Summary of the Invention

[0005] The purpose of this invention is to provide a circuit board with side-segmented metal edging and its processing method. The method involves vertical segmentation by conventional integral edge edging followed by drilling and milling, and then horizontal segmentation by using a specially designed T-shaped tool combined with specific process parameters. This process can form a circuit board with side-wall metal edging that is evenly segmented in both vertical and horizontal directions, thereby solving the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A method for processing a circuit board with segmented metal edging on the sides includes:

[0008] The sides of the circuit board are edged together, and vertical segments are made by drilling and milling.

[0009] Determine the parameters of the T-shaped tool and manufacture the T-shaped tool;

[0010] A T-shaped cutter is used to perform controlled-depth milling along the edge sidewall to form horizontal segments.

[0011] As a further aspect of the present invention: the T-shaped cutter specifically includes: a handle, one end of which is fixedly connected to a cutting edge, and the end of the cutting edge away from the handle is fixedly connected to a plurality of evenly distributed cutting tips. The material of the T-shaped cutter is tungsten steel, and the cutting tips of the T-shaped cutter are staggered three-sided cutting edges.

[0012] As a further embodiment of the present invention, the number of the cutting edges is 2-10.

[0013] As a further aspect of the present invention: the thickness of the cutting tip is marked as E, where E is 0.1-2 mm.

[0014] As a further aspect of the present invention: the cutting diameter of the blade tip is marked as D, where D is 4.1-4.4 mm.

[0015] As a further aspect of the present invention: the length from the other end of the blade to the tip of the blade is marked as G, where G is 3-10mm.

[0016] As a further aspect of the present invention: the overall edge wrapping of the circuit board side is specifically as follows:

[0017] In the preceding process, a dry film is applied to the surface of the circuit board under certain temperature and pressure conditions. Then, the film is aligned, and finally, ultraviolet light is used on the exposure machine to cause the unmasked dry film to undergo a polymerization reaction, forming the desired circuit pattern on the board surface. Then, the dry film that has not undergone polymerization is washed away by the action of the developing solution, while the dry film that has undergone polymerization is left on the board surface as a protective layer against etching. Finally, the copper without the protection of dry film is etched away by the action of the etching solution, and finally, the dry film on the copper surface is removed by the stripping solution to form the layers of copper conductors.

[0018] Lamination, under certain temperature and pressure, utilizes the resin flow characteristics of prepreg to fill the circuit and substrate. When the temperature reaches a certain level, a curing reaction occurs, thereby bonding the circuit layers together to form a multilayer circuit board.

[0019] Drilling: Using a drilling machine and drill bit, drill through holes at preset positions on the board surface to allow for the connection of lines between layers;

[0020] Milling the slotted hole involves using different milling cutters to create smooth sidewalls through rough milling and finish milling processes;

[0021] Copper plating involves depositing a layer of metallic copper, 0.5-1 μm thick, onto the non-conductive resin and glass fiber on the hole wall through a chemical oxidation-reduction reaction mechanism, facilitating subsequent copper plating processes.

[0022] Plate plating, through the principle of electrochemical plating, involves electroplating a 5-15μm thick layer of copper onto the surface of a plate and the walls of holes that have already been deposited with copper, in order to protect the very thin layer of chemical copper from being destroyed by subsequent processes and resulting in no copper in the holes.

[0023] The outer dry film is heated and pressurized to make it adhere tightly to the copper surface, and the circuit pattern required by the customer is exposed on the dry film through the image transfer principle.

[0024] Pattern plating involves thickening the copper in the circuits and holes to a preset standard and using tin as a protective layer to etch away the unused copper on the board surface, revealing the useful circuit patterns.

[0025] Second, drill holes at the preset positions in the vertical direction. According to the design of the edging metal interval, use a drill bit with the corresponding diameter to drill away the edging metal to form a segmented effect in the vertical direction. At the same time, use a small drill bit to cut the intersection of the arc and the straight line of the slot to form the boundary between the edging area and the non-edging area. If there are some burrs or copper wires at the cut edge of the drill bit and the metal, they can be removed in the next etching step to form a smooth interface.

[0026] Milling half-holes involves using a milling cutter to cut along the edge of the metal-plated groove before etching, removing the metal edges at both ends so that any metal burrs at the junction can be removed during etching to create a smooth transition.

[0027] The outer layer is etched using an alkaline etching solution, with tin as a protective layer. The exposed copper surface after the film is removed is etched away, and then the tin layer is removed with nitric acid, thus forming a flat, evenly segmented edge metal.

[0028] Solder resist characters are created by screen printing a layer of solder resist ink onto the board surface. After exposure and development, the pads and holes to be soldered are exposed, while other areas are covered with solder resist to prevent short circuits during soldering. A character layer is then screen-printed on the solder resist surface to serve as an identifier, facilitating subsequent component placement, repair, and identification.

[0029] Immersion gold plating involves applying gold to the surface of the edging metal to protect the copper surface and ultimately create the edging effect.

[0030] The subsequent processes include the following: electrical testing, which involves testing the circuit board for open and short circuits; PCB routing, which involves using a CNC machine tool to mechanically cut the circuit board to the required specifications and dimensions; and inspection, which is the final quality check performed during the manufacturing process.

[0031] As a further embodiment of the present invention: after the milling to form horizontal segments, the plate is then subjected to 1-2 chemical micro-etching treatments and dried to remove any metal burrs and debris that may be brought out by the milling cutter, thereby obtaining a neat segmented metal edge effect.

[0032] The present invention also discloses a circuit board with segmented metal edging on the side, which is manufactured by the above-described processing method.

[0033] Compared with the prior art, the beneficial effects of the present invention are:

[0034] 1. This application adopts conventional overall edge wrapping followed by drilling and milling to perform vertical segmentation, and then uses a special T-shaped tool in combination with specific process parameters to perform horizontal milling to form horizontal segmentation. By combining such process schemes, a circuit board with sidewall metal edge wrapping that is evenly segmented in both vertical and horizontal directions can be formed.

[0035] 2. This application is compatible with existing technical processes, and the process is basically the same as the existing edge-wrapping process. No extra processes are required. Only a special T-shaped cutter is used to perform controlled-depth side milling during forming, which simplifies the process and reduces costs compared with existing technologies. At the same time, it can realize the segmentation of the edge metal in the horizontal direction. When needed, it can also be divided into multiple segments (≥2 segments) to form a sidewall array-type metal contact structure. This is a rare process innovation in the industry, which provides a high degree of flexibility for the hardware modularization and multi-contact design of electronic devices. Attached Figure Description

[0036] Figure 1 A flowchart illustrating a processing method for a circuit board with segmented metal edging on the side;

[0037] Figure 2 This is a schematic diagram of a circuit board with segmented metal edging on the sides;

[0038] Figure 3 This is a side view of a circuit board with segmented metal edging.

[0039] Figure 4 Leave half of the structural view for the upper depth control of related technology one;

[0040] Figure 5 A structural view of the upper half of the lower control depth is provided for related technology one;

[0041] Figure 6 A structural view showing the middle section of the top and bottom milling depth control in related technology one;

[0042] Figure 7 This is a schematic diagram of the structure of the T-shaped tool of this application;

[0043] Figure 8 This is a side view of the T-shaped tool of this application;

[0044] Figure 9 A structural view of the circuit board of this application with multi-segment metal cladding;

[0045] Figure 10 A structural view of the circuit board for milling slots in this application;

[0046] Figure 11 A structural view of the circuit board during copper plating for this application;

[0047] Figure 12 A structural view of the circuit board during pattern electroplating for this application;

[0048] Figure 13 A structural view of the circuit board during the outer layer etching process of this application;

[0049] Figure 14 This is a structural view of the circuit board used in this application during the immersion gold plating process.

[0050] In the diagram: 101, handle; 102, blade; 103, blade tip. Detailed Implementation

[0051] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0052] As mentioned in the background section of this application, for some products designed with segmented side edging metal solutions (such as...) Figure 2 and Figure 3As shown), the edging metal is distributed at both the top and bottom ends, with a certain spatial spacing cut out in the middle and on both sides. This type of design cannot achieve horizontal segmentation using the controlled-depth milling method of Technique 1. The drawback of Technique 1, which uses controlled-depth milling to remove excess layers of metallized edging, is that it can only be used for controlled-depth milling at the top or bottom layer, leaving a middle section, or controlling depth at the bottom and leaving the upper half, or controlling depth at the top and leaving the half. Designs that leave segmented edging at both the top and bottom ends cannot be achieved (e.g., Figure 4 , Figure 5 and Figure 6 As shown in the figure, the second technique in the background technology requires two sub-boards to be edged separately and then laminated in the middle with a windowed PP. The process is long and costly. At the same time, because the thickness of PP is fixed, it is difficult to accurately control the separation distance, so it is also difficult to achieve a segmentation gap distance scheme similar to that specified in the lower right figure.

[0053] To address the aforementioned issues, this application discloses a circuit board with side-segmented metal edging and its processing method. The method involves vertical segmentation via conventional integral edging followed by drilling and milling, and then horizontal segmentation via a specially designed T-shaped tool combined with specific process parameters. This process scheme allows for the formation of a circuit board with side-walled metal edging that is evenly segmented in both vertical and horizontal directions.

[0054] The following will describe in detail, with reference to the accompanying drawings, how the solution of this application solves the above-mentioned technical problems.

[0055] Please refer to Figure 1 This application discloses a method for processing a circuit board with segmented metal edging on the sides, including:

[0056] The sides of the circuit board are edged together, and vertical segments are made by drilling and milling.

[0057] Determine the parameters of the T-shaped tool and manufacture the T-shaped tool;

[0058] A T-shaped cutter is used to perform controlled-depth milling along the edge sidewall to form horizontal segments.

[0059] Preferred, such as Figure 7 and Figure 8 As shown, the T-shaped cutter specifically includes: a handle 101, one end of which is fixedly connected to a cutting edge 102, and the end of the cutting edge 102 away from the handle 101 is fixedly connected to a plurality of evenly distributed cutting tips 103. The material of the T-shaped cutter is tungsten steel, and the cutting tips 103 of the T-shaped cutter are staggered three-sided cutting edges.

[0060] Preferably, the number of the cutting edges 103 is 2-10. A smaller number of cutting edges 103 results in a larger chip removal groove and better chip removal. In combination with the selection of the cutting edge thickness, a thicker cutting edge is preferred if the number of cutting edges 103 is smaller.

[0061] Preferably, the thickness of the blade tip 103 is marked as E, where E is 0.1-2mm and can be set according to the customer's designed dividing gap distance.

[0062] Preferably, the cutting diameter of the cutting tip 103 is marked as D, where D is 4.1-4.4 mm. It should be noted that, based on the designed segmented groove depth (around 0.05-0.2 mm), on the one hand, it is necessary to cut the edge metal (generally copper thickness less than 0.03 mm), and on the other hand, it is not possible to cut too deep to avoid splitting the plate. Based on this, by adding the clearance diameter C (around 4 mm), it can be known that the cutting diameter can be set to around 4.1-4.4 mm.

[0063] Preferably, the length from the other end of the blade 102 to the tip 103 is marked as G, where G is 3-10mm and is generally set according to the plate thickness. The plate thickness is generally between 0.5-4.0mm, so it is generally preferred to select an effective blade length of about 3-10mm.

[0064] Preferably, the step of wrapping the entire edge of the circuit board is as follows:

[0065] In the preceding process, a dry film is applied to the surface of the circuit board under certain temperature and pressure conditions. Then, the film is aligned, and finally, ultraviolet light is used on the exposure machine to cause the unmasked dry film to undergo a polymerization reaction, forming the desired circuit pattern on the board surface. Then, the dry film that has not undergone polymerization is washed away by the action of the developing solution, while the dry film that has undergone polymerization is left on the board surface as a protective layer against etching. Finally, the copper without the protection of dry film is etched away by the action of the etching solution, and finally, the dry film on the copper surface is removed by the stripping solution to form the layers of copper conductors.

[0066] Lamination, under certain temperature and pressure, utilizes the resin flow characteristics of prepreg to fill the circuit and substrate. When the temperature reaches a certain level, a curing reaction occurs, thereby bonding the circuit layers together to form a multilayer circuit board.

[0067] Drilling: Using a drilling machine and drill bit, drill through holes at preset positions on the board surface to allow for the connection of lines between layers;

[0068] Milling grooves involves using different milling cutters to create smooth sidewalls through rough milling and finish milling processes, such as... Figure 10 As shown;

[0069] Copper plating involves depositing a layer of metallic copper, 0.5-1 μm thick, onto the non-conductive resin and glass fiber layers on the hole walls through a chemical oxidation-reduction reaction mechanism. This facilitates subsequent copper plating processes. Figure 11 As shown;

[0070] Plate plating, through the principle of electrochemical plating, involves electroplating a 5-15μm thick layer of copper onto the surface of a plate and the walls of holes that have already been deposited with copper, in order to protect the very thin layer of chemical copper from being destroyed by subsequent processes and resulting in no copper in the holes.

[0071] The outer dry film is heated and pressurized to make it adhere tightly to the copper surface, and the circuit pattern required by the customer is exposed on the dry film through the image transfer principle.

[0072] Pattern plating involves thickening the copper plating in the circuitry and holes to a predetermined standard, then using tin as a protective layer to etch away unused copper from the board surface, revealing the usable circuit patterns. Figure 12 As shown;

[0073] Second, drill holes at the preset positions in the vertical direction. According to the design of the edging metal interval, use a drill bit with the corresponding diameter to drill away the edging metal to form a segmented effect in the vertical direction. At the same time, use a small drill bit to cut the intersection of the arc and the straight line of the slot to form the boundary between the edging area and the non-edging area. If there are some burrs or copper wires at the cut edge of the drill bit and the metal, they can be removed in the next etching step to form a smooth interface.

[0074] Milling half-holes involves using a milling cutter to cut along the edge of the metal-plated groove before etching, removing the metal edges at both ends so that any metal burrs at the junction can be removed during etching to create a smooth transition.

[0075] The outer layer is etched using an alkaline etching solution, employing tin as a protective layer to etch away the exposed copper surface after the film is removed. Then, nitric acid is used to remove the tin layer, resulting in a flat, evenly segmented edge metal, such as... Figure 13 As shown;

[0076] Solder resist characters are created by screen printing a layer of solder resist ink onto the board surface. After exposure and development, the pads and holes to be soldered are exposed, while other areas are covered with solder resist to prevent short circuits during soldering. A character layer is then screen-printed on the solder resist surface to serve as an identifier, facilitating subsequent component placement, repair, and identification.

[0077] Immersion gold plating involves applying gold to the surface of the edging metal to protect the copper surface and ultimately create an edging effect, such as... Figure 14 As shown;

[0078] The subsequent processes include the following: electrical testing, which involves testing the circuit board for open and short circuits; PCB routing, which involves using a CNC machine tool to mechanically cut the circuit board to the required specifications and dimensions; and inspection, which is the final quality check performed during the manufacturing process.

[0079] Preferably, after the milling process forms horizontal segments, the plate is then subjected to 1-2 chemical micro-etching treatments and dried to remove any metal burrs or debris that may be brought out by the milling cutter, thus obtaining a neat segmented metal edge effect.

[0080] The present invention also discloses a circuit board with segmented metal edging on the side, which is manufactured by the above-described processing method.

[0081] To further illustrate the present invention, the following describes in detail, with reference to embodiments, a light valve device and its preparation method provided by the present invention.

[0082] Example 1: Fabricating a sidewall structure with two sections each on the top and bottom, and left and right sides.

[0083] In this embodiment, the circuit board is a 4-layer board with a thickness of 2.0mm. The actual implementation is not limited by the number of layers, and the process is applicable to PCBs of all layers. However, for depth control accuracy, it is preferable for boards thicker than 0.5mm. The circuit board is processed using the above method. In the slot milling step, the sidewalls to be edged are first rough-milled with a 1.2mm cutter, and then finished with a 0.6mm milling cutter to create smooth sidewalls. In the second drilling step, the metal at the junction of the two arcs is cut off with a 0.15-0.2mm drill bit. The middle segment is drilled out according to design requirements; in this example, a 0.85mm drill bit is used to remove the middle metal, creating a vertical segmentation effect. In the half-hole milling step, a 0.6-0.8mm cutter is used to mill away the metal edges at both ends of the metallized slot that do not require metal edge coverage. When determining the parameters of the T-shaped cutter, this embodiment uses a tungsten steel three-flute T-shaped cutter based on the design requirements of a plate thickness of 2.0mm and a milling groove depth of 0.05-0.2mm. The cutter has a cutting edge thickness of 0.6mm (E), a cutting edge diameter of 4.2mm (D), and an effective cutting edge length of 5mm (G). Other parameters include: the shank diameter (A) of the shank 101 is D3, the clearance diameter (C) of the cutting edge 102 is D2, and the total length (B) of the T-shaped cutter is 3.7mm. When forming the horizontal segments, the milling cutter path is designed such that the horizontal distance between the center of the milling strip and the side edge is half the cutting edge diameter, which is set to 2.1mm in this embodiment. The center segment gap is 0.6mm. Based on a plate thickness of 2.0mm, the spindle down-milling depth is set to 1.0mm to ensure the effective cutting edge is in the middle of the plate thickness. This allows for milling along the side wall path according to a specific path and down-dipping height, ultimately cutting away a certain gap in the horizontal edge metal to divide it in two, creating the effect of horizontal segmentation. Figure 2 As shown. (In other cases, different milling spindle depths can be set by combining the plate thickness and the height of the desired segmented groove from the upper plate surface to create different segmented effects.)

[0084] This invention employs conventional integral edge banding followed by drilling and milling for vertical segmentation, and then uses a specially designed T-shaped cutter, combined with specific process parameters, to perform horizontal milling to form horizontal segments. This process combination creates a circuit board with evenly segmented sidewall metal edges in both vertical and horizontal directions. Furthermore, this invention is compatible with existing technologies, and the process is essentially the same as existing edge banding processes, requiring no additional steps. It only requires depth-controlled side milling using a specially designed T-shaped cutter during forming, simplifying the process and reducing costs compared to existing technologies. Simultaneously, it can achieve horizontal segmentation of the edge metal, and when necessary, it can be divided into multiple segments (≥2 segments, such as...). Figure 9 As shown, a sidewall array of metal contact structures is formed, which is a rare technological innovation in the industry. This provides a high degree of flexibility for the hardware modularization and multi-contact design of electronic devices.

[0085] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

[0086] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A method for processing a circuit board with segmented metal edging on the sides, characterized in that, include: The sides of the circuit board are edged together, and vertical segments are made by drilling and milling. Determine the parameters of the T-shaped tool and manufacture the T-shaped tool; A T-shaped cutter is used to perform controlled-depth milling along the edge sidewall to form horizontal segments; The T-shaped cutter specifically includes: a handle, one end of which is fixedly connected to a cutting edge, and the cutting edge is located away from the handle. The T-shaped cutter is fixedly connected to several evenly distributed cutting edges. The material of the T-shaped cutter is tungsten steel, and the cutting edges of the T-shaped cutter are staggered. The tooth has three cutting edges; The number of the cutting tips is 2-10; The thickness of the cutting tip is marked as E, where E is 0.1-2 mm; The cutting diameter of the blade tip is marked as D, where D is 4.1-4.4 mm; The length from the other end of the blade to the tip is marked as G, where G is 3-10mm.

2. The processing method of a circuit board with segmented metal edging according to claim 1, characterized in that, The The entire side edge of the circuit board is wrapped with a edging, as detailed below: In the preceding process, a dry film is applied to the surface of the circuit board under specific temperature and pressure conditions, followed by film alignment, and finally exposure on an exposure machine. By irradiating with ultraviolet light, the unmasked dry film of the film undergoes a polymerization reaction, forming the desired circuit pattern on the board surface. Then, through... The developer washes away the dry film that has not undergone polymerization, while the dry film that has undergone polymerization remains on the plate surface as etching. The anti-corrosion protective layer is etched away by the etching solution, removing the copper without dry film protection. Finally, it is removed by stripping solution. The dry film on the copper surface forms layers of copper conductors; Lamination, under certain temperature and pressure conditions, utilizes the resin flow characteristics of prepreg to fill circuits and substrates. When it reaches a certain point, a curing reaction occurs, which bonds the various circuit layers together to form a multilayer circuit board; Drilling: Using a drilling machine and drill bit, drill through holes at preset positions on the board surface to allow for the connection of lines between layers; Milling the slotted hole involves using different milling cutters to create smooth sidewalls through rough milling and finish milling processes; Copper plating, through a chemical oxidation-reduction reaction mechanism, deposits a layer of resin and glass fiber onto the non-conductive parts of the hole wall. A layer of metallic copper, 0.5-1μm thick, is used to facilitate subsequent copper electroplating processes. Plate plating, through electrochemical principles, involves electroplating a 5-15μm thick layer of copper onto the surface of a plate and the walls of its holes that have already been deposited with copper to preserve its integrity. Protect the very thin layer of chemical copper from being damaged by subsequent processes, preventing the holes from being copper-free; The outer dry film is bonded tightly to the copper surface by heating and pressurizing, and the customer's image is then exposed on the dry film using the principle of image transfer. Required circuit diagram; Pattern electroplating increases the copper thickness of circuits and holes to a preset standard, and uses tin as a protective layer to etch away unused copper from the board surface. Drop it to reveal the useful circuit diagram; For the second drilling, drill away the edge trim at the predetermined vertical position, according to the designed spacing of the edge metal, using a drill bit of appropriate diameter. The metal is used to create a segmented effect in the vertical direction; at the same time, a small drill bit is used to cut the intersection of the arc and the straight line of the slot to form an edge. The boundary between the enclosed and non-enclosed areas; if there are burrs or copper wires at the edge where the drill bit cuts the metal, these will be removed during the subsequent etching step. Creates a smooth interface; Milling of half-holes: Before etching, use a milling cutter to cut along the edge of the groove that has been plated with metal, and mill the areas at both ends where no metal edging is needed. Remove the burrs from the metal edges at the junction during etching to create a smooth transition; The outer layer etching uses an alkaline etching solution, employing tin as a protective layer, to etch away the exposed copper surface after the film removal process, followed by etching with nitric acid. Removing the tin layer creates a flat, evenly segmented metal edging. Solder resist characters are created by screen printing a layer of solder resist ink onto the board surface, followed by exposure and development to expose the characters to be soldered. The plate and holes are covered with a solder mask layer to prevent short circuits during soldering; a character layer is then silkscreened onto the solder mask surface. It serves as an identification feature, facilitating subsequent patch application, repair, and identification; Immersion gold plating involves applying gold to the surface of the edging metal to protect the copper surface and ultimately create the edging effect. The subsequent processes include the following: electrical testing, i.e., performing open and short circuit tests on the circuit board; and routing, i.e., using CNC machine tools... Mechanical cutting cuts the circuit board to the required specifications and dimensions; inspection is the final quality check performed during the manufacturing process.

3. The processing method of a circuit board with segmented metal edging according to claim 1, characterized in that, The After milling to form horizontal segments, the sheet metal is then subjected to 1-2 chemical micro-etching treatments and dried, removing the metal carried out by the milling cutter. By removing rough edges and debris, a neat, segmented metal edge finish can be achieved.

4. A circuit board with segmented metal edging on the sides, characterized in that, The circuit board with segmented metal edging on the side adopts the following... It is processed by the processing method according to any one of claims 1 to 3.

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