Treatment Method for Glue Oozing during Optical Component Bonding

Abstract

A method for treating overflowing glue in the bonding of optical components, the steps of which include: providing a first optical component, the bonding surface of the first optical component being divided into a central region and an edge region, the central region having a first surface free energy and the edge region having a second surface free energy; performing surface pretreatment on at least one of the central region and the edge region of the first optical component to make the first surface free energy higher than the second surface free energy; then coating liquid glue on the central region of the first optical component; finally, bonding a second optical component to the first optical component through the liquid glue and curing the liquid glue. During the bonding process, due to the difference in surface free energy, the liquid glue tends to flow towards the central region, which can avoid overflowing to the edge region and improve the efficiency of the bonding process.

Description

Technical Field

[0001] The present invention relates to a liquid glue bonding technology, and particularly to a method for treating overflow glue in the bonding of optical components. Background Art

[0002] At present, liquid glue (such as liquid optical glue) has been widely used in the manufacturing process of various optical components, mainly for bonding between optical substrates (such as glass lenses) and components (such as optical films or glass lenses, etc.). However, in the process of bonding optical components, due to the use of liquid glue for bonding, it is easy to have the problem of overflow glue residue at the edge part. Therefore, it is necessary to add a step of removing residual glue, using a solvent to wipe off the overflow glue on the non-main bonding area of the optical component, or, by using the method of applying dam glue, first forming a frame-shaped retaining wall with a higher viscosity coefficient colloid around the boundary of the area to be bonded on the optical component, so that when the optical component is bonded, the liquid glue will be restricted within the range of the dam glue to reduce the occurrence of overflow glue.

[0003] The above-mentioned method for treating edge overflow glue must add a solvent cleaning step or a dam glue coating and curing step in the bonding process, thus consuming process time and equipment costs, and at the same time greatly increasing the complexity of the process conditions. For example, bubbles are likely to be generated in the liquid glue or the retaining wall during the bonding of optical components, and it is also necessary to consider the waiting time for the solvent to volatilize, as well as the harm caused by the solvent volatilization to the environment or personnel, etc., thereby increasing the risk of product defects.

[0004] Therefore, the current industry urgently needs to seek a method for treating overflow glue in the bonding of optical components, so as to solve various difficulties and deficiencies encountered in the above-mentioned conventional technologies. Summary of the Invention

[0005] In view of this, the main object of the present invention is to provide a method for treating overflow glue in the bonding of optical components, by changing the relative surface free energy of a specific area on the surface of the optical component, it is possible to limit or control the flow direction of the liquid glue, thereby effectively reducing the situation of overflow glue.

[0006] To achieve the above object, the present invention provides a method for treating overflow glue in the bonding of optical components, and this method includes the following steps:

[0007] S10. Provide a first optical component, the bonding surface of the first optical component is divided into a central area and an edge area, the edge area surrounds the central area, the central area has a first surface free energy, and the edge area has a second surface free energy;

[0008] S20. Perform surface pretreatment on at least one of the central region and the edge region of the first optical component to make the free energy of the first surface higher than that of the second surface;

[0009] S30. Coat liquid glue on the central region of the first optical component; and

[0010] S40. Bond the second optical component to the first optical component through the liquid glue and cure the liquid glue. During the bonding process, the liquid glue tends to flow towards the central region and avoid overflowing to the edge region.

[0011] According to an embodiment of the present invention, the above step S20 includes the following steps:

[0012] S211. Cover the edge region of the first optical component with a shield;

[0013] S212. Perform surface pretreatment on the central region of the first optical component to increase the free energy of the first surface; and

[0014] S213. Remove the shield.

[0015] According to an embodiment of the present invention, the shield used in the above step S211 has at least one opening to form an overflow path in the edge region and provide a direction for the liquid glue to tend to drain towards the overflow path in step S40.

[0016] According to an embodiment of the present invention, the shield used in the above step S211 has at least one alignment hole to form at least one alignment pattern in step 212.

[0017] According to an embodiment of the present invention, the surface pretreatment method in the above step S212 is corona discharge treatment, plasma treatment, flame treatment or ultraviolet ozone treatment.

[0018] According to an embodiment of the present invention, the above step S20 includes the following steps:

[0019] S221. Cover the central region of the first optical component with a shield;

[0020] S222. Perform surface pretreatment on the edge region of the first optical component to reduce the free energy of the second surface; and

[0021] S223. Remove the shield.

[0022] According to an embodiment of the present invention, the shield used in the above step S221 has at least one protrusion to form an overflow path in the edge region and provide a direction for the liquid glue to tend to drain towards the overflow path in step S40.

[0023] According to an embodiment of the present invention, the mask used in step S221 above has at least a pair of bit holes to form at least a pair of bit patterns in step 222.

[0024] According to an embodiment of the present invention, the surface pretreatment method of step S222 above is carried out by surface coating with a hydrophobic material.

[0025] According to an embodiment of the present invention, the hydrophobic material is polydimethylsiloxane (PDMS) or octadecyltrichlorosilane (OTS).

[0026] According to an embodiment of the present invention, the surface coating method above is spin coating, spraying, thermal deposition or chemical vapor deposition method.

[0027] According to an embodiment of the present invention, the surface pretreatment method of step S20 above is to form an interfacial tension gradient on the bonding surface of the first optical component, so that the interfacial tension of the bonding surface decreases from the central region to the edge region.

[0028] According to an embodiment of the present invention, the surface pretreatment method of step S20 above is carried out using a temperature gradient heating device.

[0029] According to an embodiment of the present invention, the temperature gradient heating device is an annular contact heating device or a plurality of IR non-contact heating devices.

[0030] According to an embodiment of the present invention, the surface pretreatment method of step S20 above is carried out using corona discharge treatment, plasma treatment, flame treatment, ultraviolet ozone treatment, surface coating, high-volatile solvent or gas local spraying method.

[0031] Compared with the prior art, the present invention has the following advantages:

[0032] (1) The present invention can overcome the problem that the existing method for treating edge glue overflow must add a frame glue coating and curing step or a solvent removal step during the bonding process, which greatly increases the production time and process complexity, and thus leads to a decrease in production yield.

[0033] (2) The present invention uses surface pretreatment of the optical component to cause a difference in surface free energy, which can control the flow direction of the liquid glue during the bonding process, so that the phenomenon of edge glue overflow is greatly improved.

[0034] (3) The present invention uses an optical component with a surface free energy difference, which can avoid the problem that air bubbles are easily generated in the liquid glue or frame glue in the case of not coating the frame glue, and does not need to use a solvent, so there is no waiting time required for solvent volatilization, and the lack of environmental protection concerns caused by the solvent can be improved.

[0035] The following is a detailed description through specific embodiments, and it will be easier to understand the purpose, technical content, features and achieved effects of the present invention. Description of the Drawings

[0036] Figure 1 It is a flowchart of the method for treating glue overflow in the bonding of optical components provided by the present invention.

[0037] Figures 2A to 2D It is a schematic diagram corresponding to each step in the method for treating glue overflow in the bonding of optical components provided by the present invention.

[0038] Figures 3A to 3C It is a schematic illustration of the surface pretreatment process in the first embodiment of the present invention.

[0039] Figures 4A to 4C It is a schematic illustration of the surface pretreatment process in the second embodiment of the present invention.

[0040] Figure 5 It is a schematic diagram of the bonding surface of the optical component with an interfacial tension gradient in the third embodiment of the present invention.

[0041] Figure 6 It is a schematic diagram of the flow of liquid glue on the bonding surface of the optical component with an interfacial tension gradient in the third embodiment of the present invention.

[0042] Figure 7A and Figure 7B They are respectively the mask used in the fourth embodiment of the present invention and its glue discharging situation.

[0043] Figure 8A and Figure 8B They are respectively the mask used in the fifth embodiment of the present invention and its glue discharging situation.

[0044] Figure 9A and Figure 9B They are respectively the mask used in the sixth embodiment of the present invention and its glue discharging situation.

[0045] Figure 10A and Figure 10B They are respectively the mask used in the seventh embodiment of the present invention and its glue discharging situation.

[0046] Reference Numerals:

[0047] 1... The first optical component 44... Alignment pattern

[0048] 11... Bonding surface 5... Mask

[0049] 12... Central region 51... Protrusion

[0050] 13... Edge region 52... Overflow path

[0051] 2…Liquid glue 53…Alignment hole

[0052] 3…Second optical component 54…Alignment pattern

[0053] 4…Shield 53…Flow path

[0054] 41…Opening 54…Recovery container

[0055] 42…Overflow path S10 - S40…Steps

[0056] 43…Alignment hole Detailed implementation manner

[0057] The present invention will be described in detail below in conjunction with specific embodiments, which will help those with ordinary knowledge in the technical field to which the present invention belongs to further understand the present invention.

[0058] The technical solutions adopted in the embodiments of the present invention are only examples unless otherwise specified, and should not be used to limit the present invention. It must be noted that, except for those specifically indicated, the ordinal numbers such as "first" and "second" described in the present invention are only used to distinguish multiple components with the same name, and do not indicate that there is a rank, level, execution order, or process order between them. Without conflict, the embodiments in the present invention and the features in the embodiments can be combined arbitrarily. Unless otherwise specified, all technical and scientific terms used in the present invention have the same meaning as commonly understood by those with ordinary knowledge in the technical field to which the present invention belongs.

[0059] As described in the prior art, the current conventional method for dealing with edge glue overflow in the optical component bonding process increases the production time and process complexity, thereby resulting in a problem of poor production yield. To solve the above technical problems, the basic idea of the present invention is to provide a method for dealing with glue overflow in optical component bonding. By using optical components with different surface free energies, the flow direction of liquid glue during the bonding process can be effectively controlled, so as to improve the problem of edge glue overflow; and this difference in surface free energy can be caused by various surface pretreatment methods, which can adopt a simplified process and may use inexpensive equipment, and can avoid the troubles caused by using frame glue and solvent cleaning, reducing the risk of product defects.

[0060] Please refer to Figure 1 , which is a flowchart of the method for dealing with glue overflow in optical component bonding provided by the present invention; at the same time, please refer to Figures 2A to 2D , which shows a schematic diagram corresponding to each step in the method for dealing with glue overflow in optical component bonding provided by the present invention. The following details each step in the method for dealing with glue overflow in optical component bonding of the present invention.

[0061] First, see step S10, as Figure 2AAs shown, a first optical component 1 is provided. The bonding surface 11 of the first optical component 1 is divided into a central region 12 and an edge region 13, and the edge region 13 surrounds the central region 12. In this step S1, assuming that the surface free energy of each part of the bonding surface 11 of the first optical component 1 is the same, the first surface free energy is equal to the second surface free energy.

[0062] Next, referring to step S20, as Figure 2B shown, at least one of the central region 12 and the edge region 13 (represented by the central region 12 in the figure) of the first optical component 1 is subjected to surface pretreatment to make the first surface free energy higher than the second surface free energy. In the present invention, in this step S20, the first surface free energy of the central region 12 can be increased by a surface pretreatment method, or the second surface free energy of the edge region 13 can be decreased, or the first surface free energy of the central region 12 can be increased and the second surface free energy of the edge region 13 can be decreased. In the present invention, the surface pretreatment method of this step S20 can increase the first surface free energy of the central region through corona discharge treatment, plasma treatment, flame treatment or ultraviolet ozone treatment. The surface pretreatment method of this step S20 can also reduce the second surface free energy of the edge region by coating a hydrophobic material on the surface. In addition, the surface pretreatment method of this step S20 can also form an interfacial tension gradient on the bonding surface 11 of the first optical component 1 so that the interfacial tension of the bonding surface 11 decreases from the central region 12 to the edge region 13, resulting in an increase in the first surface free energy of the central region 12 and a decrease in the second surface free energy of the edge region 13.

[0063] Then, referring to step S30, as Figure 2C shown, the liquid adhesive 2 is coated on the central region 12 of the first optical component 1. This liquid adhesive 2 can be a liquid optical adhesive.

[0064] Then, referring to step S40, as Figure 2D shown, the second optical component 3 is bonded to the first optical component 1 through the liquid adhesive 2 and the liquid adhesive 2 is cured. During the bonding process, since the first surface free energy of the central region 12 is higher than the second surface free energy of the edge region 13, the liquid adhesive 2 will tend to flow towards the central region 12 with a relatively higher surface free energy and is not likely to overflow to the edge region 13 with a relatively lower surface free energy, thus effectively avoiding the formation of edge glue overflow.

[0065] Furthermore, assume that the first optical component 1 is an ideal elliptical flat lens, and assume that the surface free energy of each part of the fitting surface 11 of the first optical component 1 is the same. In an ideal state, during the fitting process, the liquid glue 2 will be extruded and flow evenly from the center of the first optical component 1 in all directions. During the fitting process, glue overflow will occur first in the y-axis direction, while there is a lack of glue in the x-axis direction. If the surface free energy of the edge region 13 is relatively low, the liquid glue 2 will tend to move in the middle region 12 with the same surface free energy (higher than that of the edge region 13) and is not likely to flow to the edge region 13 (see Figure 2D ). Theoretically, as long as there is a difference in surface free energy between the central region 12 and the edge region 13, the purpose of suppressing the flow of the liquid glue 2 can be achieved. Preferably, the greater the difference in surface free energy between the central region 12 and the edge region 13, the better, and the more the phenomenon of edge glue overflow can be avoided.

[0066] In the present invention, both the first optical component 1 and the second optical component 3 can be in the form of optical lenses. Optical lenses usually use polymethyl methacrylate (PMMA), polycarbonate (PC), cycloolefin polymer (COP), cycloolefin copolymer (COC) as materials, and their water contact angles are about between 75 - 100°. Specifically, the water contact angles of PMMA, COC, and COP are 80.2°, 90.9°, and 91.9° respectively. These values are only for reference, and the actual situation may vary slightly due to chemical composition, surface morphology, material conditions, measurement methods, etc. Furthermore, the second optical component 3 can also be surface pretreated on the fitting surface like the first optical component 1 to generate a difference in surface free energy, thereby strengthening the control of the tendency of the liquid glue 2 to flow towards the central region and greatly reducing the probability of edge glue overflow.

[0067] The following further details and verifies the effects of how the present invention creates a difference in surface free energy between the central region and the edge region in the above step 20 through the first to fifth embodiments, but it should not be construed as a limitation on the protection scope of the present invention.

[0068] First Embodiment

[0069] Please refer to Figures 3A to 3C , which shows the schematic situation of the surface pretreatment process in the first embodiment of the present invention. First, in step S211, as shown in Figure 3A , the edge region 13 of the first optical component 1 is covered with a mask 4, while the central region 12 is not covered; the mask 4 can be, for example, a PI tape or a PDMS film. Then, in step S212, as shown in Figure 3BAs shown, the central region 12 of the first optical component 1 is subjected to surface pretreatment to increase the first surface free energy of the central region 12, while the edge region 13 is not treated, and the second surface free energy will maintain the original surface free energy, so that the first surface free energy is higher than the second surface free energy. Then, in step S213, as Figure 3C shown, the mask 4 is removed. After that, the liquid adhesive 2 coating and bonding processes of the above steps S30 and S40 can be started in the central region 12. This surface free energy difference can make the liquid adhesive 2 tend to concentrate in the central region 12, and slow down the occurrence of adhesive overflow.

[0070] In this embodiment, the surface pretreatment method in this step S212 can be carried out through corona discharge treatment, plasma treatment, flame treatment or ultraviolet ozone treatment (UV / O3 treatment) to increase the first surface free energy of the central region 12.

[0071] Second Embodiment

[0072] Please refer to Figures 4A to 4C , which is a schematic illustration of the surface pretreatment process in the second embodiment of the present invention. First, in step S221, as Figure 4A shown, the central region 12 of the first optical component 1 is covered with a mask 5, while the edge region 13 is not covered; the mask 5 can be, for example, a PI tape or a PDMS film. Then, in step S222, as Figure 4B shown, the edge region 13 of the first optical component 1 is subjected to surface pretreatment to reduce the second surface free energy of the edge region 13, while the central region 12 is not treated, and the first surface free energy will maintain the original surface free energy, so that the second surface free energy is lower than the first surface free energy. Then, in step S223, as Figure 4C shown, the mask 5 is removed. After that, the liquid adhesive 2 coating and bonding processes of the above steps S30 and S40 can be started in the central region 12. The surface pretreatment in this step S222 makes the wettability of the liquid adhesive 2 to the edge region 13 extremely poor. Therefore, it is difficult for the liquid adhesive 2 to stay in the edge region 13, and the occurrence of adhesive overflow is slowed down.

[0073] In this embodiment, the surface pretreatment method in this step S222 can reduce the second surface free energy of the edge region 13 by coating a hydrophobic material on the surface. In this embodiment, the hydrophobic material can be polydimethylsiloxane (PDMS) or octadecyltrichlorosilane (OTS). In this embodiment, the surface coating method in this step S222 can be spin coating, spraying, thermal deposition or chemical vapor deposition.

[0074] Third Embodiment

[0075] Please refer to Figure 5 , which is a schematic diagram of the bonding surface of the optical component with an interfacial tension gradient in the third embodiment of the present invention. In step S20, in this embodiment, an interfacial tension gradient is formed on the bonding surface 11 of the first optical component 1, so that the interfacial tension of the bonding surface 11 decreases from the central region 12 to the edge region 13. After that, the liquid glue 2 coating and bonding processes of steps S30 and S40 can be started in the central region 12. According to the Marangoni effect, when there is a surface tension gradient at the interface between two phases, this effect will occur and cause mass transfer phenomena. As Figure 6 shown, the surface pretreatment in this step S20 creates an interfacial tension gradient on the bonding surface 11, so that the liquid glue 2 will spontaneously flow towards the center with a higher surface tension. Therefore, when the liquid glue 2 is extruded and flows out during the bonding process, the outflow of the liquid glue 2 can be controlled to a certain extent, thereby reducing the state of glue overflow.

[0076] In this embodiment, the surface pretreatment method in this step S20 can be carried out using a temperature gradient heating device. The temperature gradient heating device can be an annular contact heating device or multiple IR non-contact heating devices arranged in the edge region 13, and its heating intensity is set so that the inside is lower than the outside, making the temperature of the edge region 13 higher and decreasing towards the central region 12. In addition, this embodiment is not limited to temperature control. An interfacial tension gradient can also be created through other surface treatment methods. For example, based on the surface pretreatment methods of the first embodiment or the second embodiment, corona discharge treatment, plasma treatment, flame treatment, ultraviolet ozone treatment, surface coating, local spraying of highly volatile solvents or gases can be used, and the interfacial tension gradient can be created through condition control. For example, based on the second embodiment, the OTS molecular density distribution can be regulated, or based on the first embodiment, a plasma energy difference can be created during plasma treatment.

[0077] Fourth Embodiment

[0078] Please refer to Figure 7A and Figure 7B , which are the shield and its glue discharge situation used in the fourth embodiment of the present invention respectively. As Figure 7A shown, this embodiment is based on the first embodiment, and at least one opening 41 is provided in the shield 4 used in step S211. In the figure, the number of openings 41 is one, but in fact it is not limited to this. The shield 4 covers the edge region 13, and the edge region 13 corresponding to the opening 41 is not covered, as Figure 7BAs shown, this uncovered edge area 13 will increase its surface free energy after the surface pretreatment in step S212 to form an overflow path 42, such that during the liquid adhesive 2 coating and laminating processes in steps S30 and S40, the excess liquid adhesive 2 tends to be discharged in the direction of the overflow path 42.

[0079] Fifth Embodiment

[0080] Please refer to Figure 8A and Figure 8B , which are the shield used in the fifth embodiment of the present invention and its glue discharging situation respectively. As Figure 8A shown, this embodiment is based on the second embodiment, and a part of the shield 5 used in step S221 is extended to the edge area 13 to form at least one protrusion 51. In the figure, the number of protrusions 51 is three, but in practice, it is not limited thereto. The shield 5 covers the central area 12, while the protrusion 51 covers the edge area 13. As Figure 8B shown, this edge area 13 covered by the protrusion 51 will not be subjected to surface pretreatment in step S212, so its surface free energy will not be reduced, and an overflow path 52 is formed, such that during the liquid adhesive 2 coating and laminating processes in steps S30 and S40, the excess liquid adhesive 2 tends to be discharged in the direction of the overflow path 52.

[0081] Meanwhile, the fourth and fifth embodiments can be externally cooperated with designed diversion paths 53 and recovery containers 54, etc. (see Figure 8B ), to save costs and the cleaning time of jigs / machines, etc. The shapes of the above openings 41 and protrusions 51 are not limited. For example, the opening 41 can be straight, gradually expanding or gradually contracting, and the formed overflow paths 42 and 52 can be non-flat, such as inclined surfaces.

[0082] Sixth Embodiment

[0083] Please refer to Figure 9A and Figure 9B , which are the shield used in the sixth embodiment of the present invention and its glue discharging situation respectively. As Figure 9A shown, this embodiment is based on the fourth embodiment, and at least one pair of alignment holes 43 are provided on the shield 4 used in step S211. In the figure, the number of alignment holes 43 is two, but in practical applications, the positions, sizes, and numbers of the alignment holes 53 are not limited thereto. The edge area 13 corresponding to the alignment holes 43 is not covered. As Figure 9B shown, this uncovered edge area 13 will form an alignment pattern 44 after the surface pretreatment in step S212, which is suitable for alignment during subsequent assembly processes or any procedures that require alignment.

[0084] Seventh Embodiment

[0085] Please refer to Figure 10A and Figure 10B , which are the shield and its degumming situation used in the fifth embodiment of the present invention respectively. As Figure 10A shown, this embodiment is based on the fifth embodiment, and at least a pair of alignment holes 53 are provided in the shield 5 used in step S221. In the figure, the number of alignment holes 53 is three, two of which are located inside the shield 5 and one is located in the protruding portion 51. However, in actual applications, the position, size, and number of the alignment holes 53 are not limited to this. The area corresponding to the alignment holes 53, as Figure 10B shown, the central area 12 corresponding to the two alignment holes 53 and the edge area 13 corresponding to one alignment hole 53 are not covered. The central area 12 and the edge area 13 covered by the alignment holes 53 will not be subjected to surface pretreatment in step S212, and an alignment pattern 54 is formed, which is suitable for alignment in the subsequent assembly process or any process that requires alignment. In summary, for the method for treating glue overflow in the bonding of the optical component provided by the present invention, by performing surface pretreatment on the optical component to cause a surface free energy difference between the central area and the edge area, the liquid glue can be controlled to tend to flow towards the central area during the bonding process and is not easily outflow to the edge area, thereby improving the situation of edge glue overflow. At the same time, the present invention does not need to use a solvent to remove the overflow glue, there is no waiting time required for solvent volatilization, and the lack of environmental protection concerns caused by the solvent can be improved. It is also not necessary to coat the frame glue, and the problem that the liquid glue or the frame glue is likely to generate bubbles can be avoided, thereby improving the efficiency of the bonding process and reducing the production cost.

[0086] However, the above are only the preferred embodiments of the present invention and are not used to limit the scope of implementation of the present invention. Therefore, all equivalent changes or modifications made according to the features and spirit described in the scope of the application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A method for treating overflow glue in optical component bonding, characterized in that It includes the following steps: S10. Provide a first optical component. The bonding surface of the first optical component is divided into a central region and an edge region. The edge region surrounds the central region. The central region has a first surface free energy, and the edge region has a second surface free energy. S20. Perform surface pretreatment on at least one of the central region and the edge region of the first optical component to make the first surface free energy higher than the second surface free energy. S30. Coat a liquid adhesive on the central region of the first optical component; and S40. Bond a second optical component to the first optical component through the liquid adhesive and cure the liquid adhesive. During the bonding process, the liquid adhesive tends to flow towards the central region and avoid overflowing to the edge region. Among them, the surface pretreatment method in step S20 is to form an interfacial tension gradient on the bonding surface of the first optical component, so that the interfacial tension of the bonding surface decreases from the central region to the edge region.

2. The method for processing the overflow glue in the optical component bonding according to claim 1, wherein Step S20 includes the following steps: S211. Cover the edge region of the first optical component with a mask; S212. Perform surface pretreatment on the central region of the first optical component to increase the first surface free energy; and S213. Remove the mask.

3. The method for treating the overflow glue in the optical component bonding according to claim 2, wherein, The mask used in step S211 has at least one opening to form an overflow path in the edge region and provide a direction for the liquid adhesive to tend to drain towards the overflow path in step S40.

4. The processing method for overflow glue in bonding of the optical component according to claim 2, wherein, The mask used in step S211 has at least one alignment hole to form at least one alignment pattern in step 212.

5. The method for treating the overflow glue in the optical component bonding according to claim 2, wherein, The surface pretreatment method in step S212 is corona discharge treatment, plasma treatment, flame treatment or ultraviolet ozone treatment.

6. The method for processing the overflow glue in the optical component bonding according to claim 1, wherein, Step S20 includes the following steps: S221. Cover the central region of the first optical component with a mask; S222. Perform surface pretreatment on the edge region of the first optical component to reduce the second surface free energy; and S223. Remove the mask.

7. The method for treating the overflow glue in the optical component bonding according to claim 6, characterized in that, The mask used in step S221 has at least one protrusion to form an overflow path in the edge region and provide a direction for the liquid adhesive to tend to drain towards the overflow path in step S40.

8. The method for treating the overflow glue in the optical component bonding according to claim 6, wherein, The mask used in step S221 has at least one alignment hole to form at least one alignment pattern in step 222.

9. The method for treating the overflow glue in the optical component bonding according to claim 6, wherein The surface pretreatment method in step S222 is carried out by surface coating with a hydrophobic material.

10. The method for processing the overflow glue in the optical component bonding according to claim 9, wherein, The hydrophobic material is polydimethylsiloxane or octadecyltrichlorosilane.

11. The processing method for the overflow glue in the optical component bonding according to claim 9, wherein The surface coating method is spin coating, spraying, thermal deposition or chemical vapor deposition method.

12. The processing method for the overflow glue of the optical component bonding according to claim 1, characterized in that, The surface pretreatment method in step S20 is carried out using a temperature gradient heating device.

13. The processing method for glue overflow in the optical component bonding according to claim 12, characterized in that, The temperature gradient heating device is an annular contact heating device or multiple IR non-contact heating devices.

14. The processing method for the glue overflow in the optical component bonding according to claim 1, wherein The surface pretreatment method in step S20 is carried out using corona discharge treatment, plasma treatment, flame treatment, ultraviolet ozone treatment, surface coating, high-volatility solvent or gas local spraying method.

Images