A DMD imaging device and a device based on DMD imaging

Abstract

The present invention provides a DMD imaging device and a DMD imaging device, comprising a housing, a DMD, and a circuit board. The DMD is mounted in a housing cavity defined in the housing, and the DMD and circuit board are electrically connected. The DMD imaging device also includes a graphene heat sink and a radiator, wherein the graphene heat sink has opposing first and second surfaces. The housing has an outer surface located outside the housing cavity, and the DMD has a main surface located outside the first connector. The graphene heat sink includes a first portion and a second portion, wherein the first surface of the first portion is fixed to the main surface, and the first surface of the second portion is fixed to the outer surface. The radiator is located on a side of the circuit board away from the DMD and is fixedly connected to the housing, with the edge of the radiator proximal to the side of the DMD contacting the second surface of the graphene heat sink. The DMD imaging device and the DMD imaging device have high heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of projection equipment, and in particular to a DMD imaging device and equipment based on DMD imaging. Background Art

[0002] Digital Light Processing (DLP) projection display has become one of the mainstream projection display methods.

[0003] DMD (Digital Micromirror Device) is the core component of digital light processing technology (DLP). In a DMD imaging device, light emitted by the optical illumination system is processed by the DMD before entering the optical system for final imaging. During operation, the DMD's temperature rises due to light exposure and heat generated by its own internal circuits. Excessively high DMD temperature will directly affect the operation of the DMD imaging device, so improving the DMD's heat dissipation efficiency is an urgent issue to be addressed. Summary of the Invention

[0004] Based on the above situation, the main purpose of the present invention is to provide a DMD imaging device and a device based on DMD imaging, which can improve the heat dissipation effect of the DMD in the DMD imaging device.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A DMD imaging device includes a housing, a DMD, and a circuit board. The housing defines a housing cavity, the DMD being mounted in the housing cavity. The DMD and the circuit board are respectively provided with a first connector and a second connector, the DMD and the circuit board being electrically connected via the first and second connectors. The DMD imaging device further includes a graphene heat sink and a heat sink, the graphene heat sink having opposing first and second surfaces. The housing has an outer surface located outside the housing cavity, and the DMD has a main surface located outside the first connector.

[0007] The graphene heat sink includes a first portion and a second portion, the second portion is farther away from the DMD than the first portion, the area of ​​the second portion is larger than the area of ​​the first portion, the first surface of the first portion is fixed to the main surface, and the first surface of the second portion is fixed to the outer surface;

[0008] The heat sink is located on a side of the circuit board away from the DMD and is fixedly connected to the housing. An edge of the heat sink close to the DMD contacts the second surface of the graphene heat sink. The heat sink contacts the second surface at the second portion, and the contact area is larger than the area of ​​the first portion.

[0009] The heat generated by the DMD during operation is transferred from the first portion of the graphene heat sink to the second portion, and then dissipated by the heat sink.

[0010] Preferably, the graphene heat sink includes a third portion, the third portion is located between the first portion and the second portion, and the first portion, the third portion and the second portion are distributed in a circumferential direction of the first connector or the second connector in a direction away from the first connector or the second connector;

[0011] The outer surface is parallel to the main surface, and the third portion includes a ridge formed in a direction perpendicular to the outer surface or the main surface.

[0012] Preferably, the graphene heat sink is fixed to the main surface and the outer surface via an adhesive layer;

[0013] The graphene heat sink includes a first graphene sub-heat sink and a second graphene sub-heat sink, and the first graphene sub-heat sink and the second graphene sub-heat sink are arranged on opposite sides of the first connector; the first part, the second part and the third part are each partially located on the first graphene sub-heat sink and the other part is located on the second graphene sub-heat sink.

[0014] Preferably, the first graphene sub-heat sink and the second graphene sub-heat sink each include a sheet main body and a first extension portion, an intermediate extension portion, and a second extension portion integrally formed with the sheet main body, the first extension portion, the intermediate extension portion, and the second extension portion are respectively arranged at intervals on the same side of the sheet main body, the first extension portion and the second extension portion are respectively arranged close to the ends of the sheet main body, the intermediate extension portion is located between the first extension portion and the second extension portion, the sheet main body and the first extension portion and the second extension portion are fixed to the outer surface, and are fixed at different positions on the outer surface, and at least a portion of the intermediate extension portion is fixed to the main surface.

[0015] Preferably, the first graphene sub-heat sink and the second graphene sub-heat sink each include a first end and a second end opposite to each other fixed on the outer surface, the first end of the first graphene sub-heat sink and the first end of the second graphene sub-heat sink are close to each other with a first gap therebetween, and the second end of the first graphene sub-heat sink and the second end of the second graphene sub-heat sink are close to each other with a second gap therebetween;

[0016] A first sealing strip and a second sealing strip are provided, wherein one end of the first sealing strip is fixed to the first end of the first graphene sub-heat sink, and the other end is fixed to the first end of the second graphene sub-heat sink, thereby sealing the first gap; one end of the second sealing strip is fixed to the second end of the first graphene sub-heat sink, and the other end is fixed to the second end of the second graphene sub-heat sink, thereby sealing the second gap;

[0017] The heat sink is provided with avoidance positions for accommodating the first sealing strip and the second sealing strip at positions corresponding to the first sealing strip and the second sealing strip.

[0018] Preferably, the accommodating cavity is rectangular, having a first long side, a second long side, a first short side and a second short side relative to each other, and there is a gap between the DMD side wall and the side wall of the accommodating cavity, and the arches on the two graphene heat sinks are respectively set to correspond to the gaps at the positions of the first long side and the second long side.

[0019] Preferably, a fixed limiter is provided in the gap parallel to the first short side and the second short side, and the fixed limiter cooperates with the convex and concave of the DMD to limit the position of the DMD, and an elastic member and a force conduction block are provided at the corner of the accommodating cavity. The shape of the surface of the force conduction block facing the DMD matches the shape of the DMD corner, and the surface facing the corner of the accommodating cavity is an inclined plane. The elastic member is fixedly connected to the shell, and one end passes through the outside of the shell to the inside of the shell and elastically abuts on the inclined plane, so that the force conduction block abuts at the corner of the DMD.

[0020] Preferably, the thickness of the graphene heat sink is 0.5-2 mm, and the height of the arch is 0.5-2.5 mm.

[0021] Preferably, the area of ​​the second portion is more than twice the area of ​​the first portion.

[0022] Preferably, the side of the heat sink close to the DMD includes a first region and a second region, the second region is arranged around the first region, the first region is provided with a groove, the second region is provided with a fixing hole, and a fixing member passes through the fixing hole to be fixedly connected to the housing;

[0023] A metal pressing plate with notches at both ends is provided on the side of the circuit board away from the DMD, and a positioning column is provided on the shell, and the positioning column passes through the circuit board and the notch; the pressing plate and at least part of the circuit board are accommodated in the groove; the size of the metal pressing plate under maximum elastic deformation is greater than or equal to the size of the groove.

[0024] Preferably, the circuit board is connected to an FPC, the FPC is electrically connected to the second connector, a wiring channel is provided on the area one for the FPC to be led out, a third sealing strip is provided on the second surface and / or the outer surface, and in the installed state, the third sealing strip is located in the wiring channel to seal the wiring channel.

[0025] In order to better solve the above technical problems, the present invention further provides a device based on DMD imaging, which includes a housing in which the above DMD imaging device is installed.

[0026] Preferably, the device is a 3D scanner, a 3D printing device or a projector.

[0027] The present invention provides the following beneficial effects: the present invention arranges a graphene heat sink between the DMD and the heat sink. The first surface of the first portion of the graphene heat sink contacts the main surface of the DMD, the first surface of the second portion of the graphene heat sink contacts the outer surface of the housing, the second portion having an area larger than the first portion, and the heat sink contacts the second surface of the second portion of the graphene heat sink, with the contact area larger than the first portion. Heat generated by the DMD is transferred from the first portion of the graphene heat sink to the second portion of the graphene heat sink, where it is then dissipated by the heat sink. First, because the graphene heat sink employed in the present invention serves as a heat transfer medium, graphene has a high thermal conductivity. When the graphene heat sink is installed, it does not need to be firmly pressed against the DMD, as with traditional heat sinks, resulting in improved reciprocating motion of the DMD under heat. Second, the graphene heat sink has a better thermal conductivity in the planar direction than in the direction perpendicular to the planar direction. By utilizing this excellent thermal conductivity in the planar direction, the present invention allows heat generated by the DMD to be rapidly transferred from the first portion to the second portion along the planar direction, effectively dissipating the heat generated by the DMD to a location away from the DMD. Furthermore, the heat sink contacts the second surface of the second portion, and the contact area is larger than the area of ​​the first portion. Heat can be transferred to the heat sink via a larger heat conduction area, thereby improving heat dissipation efficiency.

[0028] Other beneficial effects of the present invention will be explained through the introduction of specific technical features and technical solutions in the specific implementation methods. Those skilled in the art should be able to understand the beneficial technical effects brought about by the introduction of these technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0030] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the DMD imaging device provided by the present invention.

[0031] Figure 2 This is a schematic diagram of the exploded structure of an embodiment of the DMD imaging device provided by the present invention.

[0032] Figure 3 An embodiment of the DMD imaging device provided by the present invention is a schematic diagram showing the local structure of the accommodating cavity.

[0033] Figure 4 for Figure 3 Enlarged schematic diagram of part A.

[0034] Figure 5 A preferred embodiment of the DMD imaging device provided by the present invention is a cross-sectional schematic diagram showing a graphene heat sink.

[0035] Figure 6 A schematic diagram of the graphene heat sink structure of a preferred embodiment of the DMD imaging device provided by the present invention.

[0036] Figure 7 This is another structural schematic diagram of a graphene heat sink in one embodiment of the DMD imaging device provided by the present invention.

[0037] Figure 8 This is another structural schematic diagram of a graphene heat sink in one embodiment of the DMD imaging device provided by the present invention.

[0038] Figure 9 An embodiment of the DMD imaging device provided by the present invention is a schematic structural diagram showing a first sealing strip and a second sealing strip.

[0039] Figure 10 An embodiment of the DMD imaging device provided by the present invention is an exploded schematic diagram showing a circuit board.

[0040] Figure 11 An embodiment of the DMD imaging device provided by the present invention is a structural schematic diagram showing a heat sink.

[0041] Explanation of the accompanying drawings: 1. Shell; 11. Accommodating cavity; 111. First long side; 112. Second long side; 113. First short side; 114. Second short side; 12. Outer surface; 13. Fixed stopper; 131. Positioning column; 14. Elastic member; 141. Force transmission block; 1411. Inclined plane; 2. DMD; 21. First connector; 22. Main surface; 3. Graphene heat sink; 31. First surface; 32. Second surface; 33. First portion; 34. Second portion; 35. Third portion; 351. Arch; 36. First graphene sub-heat sink; 361. Sheet body; 362. First extension portion; 363. Middle extension portion; 364. 4. Second extension portion; 365. First end of the first graphene sub-heat sink; 366. Second end of the first graphene sub-heat sink; 37. Second graphene sub-heat sink; 371. First end of the second graphene sub-heat sink; 372. Second end of the second graphene heat sink; 38. First gap; 381. First sealing strip; 39. Second gap; 391. Second sealing strip; 4. Circuit board; 41. Second connector; 42. Elastic pressing piece; 421. Notch; 43. FPC; 5. Radiator; 51. Area 1; 511. Groove; 512. Wiring channel; 513. Third sealing strip; 52. Area 2; 521. Fixing hole; 53. Avoidance position. DETAILED DESCRIPTION

[0042] The present invention is described below based on the following embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0043] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0044] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include," "comprising," and similar words should be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to."

[0045] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0046] See attached Figure 1 and Figure 2The present invention provides a DMD imaging device, which includes a housing 1, a DMD2, a graphene heat sink 3, a circuit board 4, and a radiator 5. The DMD2 is installed in the housing 1, the circuit board 4 is arranged on the side of the DMD2 away from the housing 1, and the radiator 5 is installed on the side of the circuit board 4 away from the DMD2. The graphene heat sink 3 is arranged between the housing 1 and the circuit board 4, and one side of the graphene heat sink 3 is fixed to both the housing 1 and the DMD2, while the other side is in contact with the radiator 5. The housing 1 protects the DMD2 from damage, the DMD2 is electrically connected to the circuit board 4 to transmit electrical signals, and the radiator 5 dissipates the heat generated by the DMD2. The graphene heat sink 3 is in contact with the radiator 5 and the DMD2 at the same time to improve the heat dissipation efficiency of the DMD2.

[0047] Reference Figure 3 and Figure 4 The shell 1 has an outer surface 12, and a housing cavity 11 is provided on the shell 1. The outer surface 12 is located at the periphery of the housing cavity 11. The housing cavity 11 is roughly rectangular, and has a first long side 111, a second long side 112, a first short side 113, and a second short side 114 relative to each other. The roughly rectangular DMD2 is placed in the housing cavity 11, and there is a gap between the DMD2 and the side wall of the housing cavity 11. A fixed limiter 13 fixedly connected to the shell 1 is provided in the housing cavity 11. The fixed limiter 13 is provided in the gap parallel to the first short side 113 and the second short side 114. The fixed limiter 13 cooperates with the DMD2 in a concave-convex manner to limit the position of the DMD2. A positioning column 131 for limiting the circuit board 4 is provided in the shell 1. The positioning column 131 is provided on the fixed limiter 13 and is integrally formed with the fixed limiter 13. An elastic member 14 and a force conduction block 141 are provided at the corner of the accommodating cavity 11 (that is, the corner of DMD2). The side of the force conduction block 141 facing DMD2 matches the corner shape of DMD2. The surface of the force conduction block 141 facing the corner of the accommodating cavity 11 is an inclined plane 1411. The elastic member 14 is fixedly connected to the shell 1. One end of the elastic member 14 passes through from the outside of the shell 1 to the inside of the shell 1 and elastically abuts against the inclined plane 1411, so that the force conduction block 141 abuts against the corner of DMD2. The elastic member 14 and the force conduction block 141 can position DMD2 and allow DMD2 to move due to thermal expansion and contraction, and the reciprocating motion is good, that is, when thermal expansion and contraction occur at different times, the motion tends to be consistent.

[0048] As an embodiment, the structure of the accommodating cavity 11 is not necessarily rectangular, and can be regular or irregular in shape. It is understood that the shape of the accommodating cavity 11 can be changed according to the shape of the housing 1 or the placement of components such as the DMD 2, and the so-called long side can also be adaptively adjusted to a short side.

[0049] As an embodiment, no gap is required between DMD 2 and the sidewalls of cavity 11. It is understood that cavity 11 only needs to be large enough to fully accommodate DMD 2. Industrially produced components have certain tolerances, which allow for movement due to thermal expansion and contraction.

[0050] As an embodiment, the positioning post 131 is not necessarily connected to the fixed stopper 13. The positioning post 131 can be independently arranged in the accommodating cavity 11 to position the circuit board 4 by increasing its length.

[0051] As an embodiment, other elastic material support structures can also be used to position DMD2 in the accommodating chamber 11. For example, elastic material support structures capable of supporting DMD2 can be provided in the gaps parallel to the first long side 111 and the first short side 113. The elastic material support structure can be a separate force transmission block 141 and elastic member 14. Furthermore, the elastic material (elastic plunger) support structure is in rigid contact with DMD2, facilitating the controllable movement of DMD2 due to thermal deformation. As another embodiment, the positioning of DMD2 in the accommodating chamber 11 can also adopt any existing solution, such as DMD2 being fixed to the accommodating chamber by a tight fit, or by a concave-convex fit.

[0052] Reference Figure 5 A first connector 21 is provided on the side of DMD2 close to the circuit board 4. DMD2 is electrically connected to the circuit board 4 through the first connector 21. DMD2 has a main surface 22 located on the periphery of the first connector 21. The main surface 22 is parallel to the outer surface 12. The main surface 22 and the outer surface 12 can be fixed to one side of the graphene heat sink 3 at the same time. The graphene heat sink 3 is fixed to the main surface 22 and the outer surface 12 through an adhesive layer (not shown in the figure).

[0053] As an embodiment, the position of the first connector 21 can be adjusted according to the position of the circuit board 4, and the position of the main surface 22 changes with the change of the position of the first connector 21. For example, the first connector 21 is arranged parallel to the first short side 113 and the dimension in the extension direction of the first short side 113 is equal to the dimension of the DMD2 in the extension direction of the first short side 1133. Then the main surface 22 is the DMD2 surface located on both sides of the first connector 21, and this part of the surface is considered to be the surface located on the periphery of the first connector 21.

[0054] It is understandable that the main surface 22 and the outer surface 12 do not necessarily need to be parallel, and it is only necessary to ensure that a graphene heat sink 3 can contact the main surface 22, the outer surface 12 and the heat sink 5 at the same time.

[0055] As an embodiment, the graphene heat sink 3 is not limited to being fixed to the main surface 22 and the outer surface 12 by gluing, and other fixing structures may also be used to achieve fixed connection.

[0056] Please continue to refer to Figure 5 As an embodiment, the graphene heat sink 3 has a first surface 31 and a second surface 32 that are opposite to each other. The first surface 31 is arranged toward the housing 1 and the DMD 2 , and the second surface 32 is arranged toward the radiator 5 .

[0057] As an embodiment, the thickness of the graphene heat sink 3 is 0.5-2 mm. It is understood that the thickness of the graphene heat sink 3 is not necessarily within the above range. The thickness of the graphene heat sink 3 can be adjusted according to actual heat dissipation requirements and can also be adjusted according to the assembly requirements of the housing 1 and the radiator 5.

[0058] As an example, refer to Figure 5 and Figure 6 The graphene heat sink 3 includes a first portion 33, a second portion 34, and a third portion 35. The second portion 34 is located farther from the DMD 2 than the first portion 33, and the third portion 35 is located between the first portion 33 and the second portion 34. The first portion 33, the third portion 35, and the second portion 34 are distributed circumferentially away from the first connector 21. The area of ​​the second portion 34 is larger than that of the first portion 33, and is more than twice the area of ​​the first portion 33. The first surface 31 of the first portion 33 is fixed to the main surface 22, and the first surface 31 of the second portion 34 is fixed to the outer surface 12. The edge of the heat sink 5 near the side of the DMD 2 contacts the second surface 32 of the graphene heat sink 3. The contact area between the heat sink 5 and the second surface 32 is located in the second portion 34, and the contact area is larger than the area of ​​the first portion 33.

[0059] The third portion 35 includes a protrusion 351 formed perpendicular to the outer surface 12 or main surface 22. The height of the protrusion 351 is 0.5-2.5 mm. When the DMD 2 moves back and forth due to thermal expansion and contraction, it moves the first portion 33 with it, causing deformation of the graphene heat sink 3. The protrusion 351 provides a margin for deformation of the graphene heat sink 3. It is understood that the protrusion 351 can be arched toward the circuit board 4 or away from the circuit board 4. In one embodiment, the protrusion 351 is formed by bending the graphene heat sink 3.

[0060] The heat generated by the operation of DMD2 is transferred from the first part 33 of the graphene heat sink 3 to the second part 34, and then directly dissipated by the heat sink 5. When dissipating heat from DMD2, the heat sink 5 is in direct contact with the graphene heat sink 3 to improve the thermal conductivity. It can be understood that the heat sink 5 is not limited to one or more components. For example, the heat sink 5 structure shown in Figure 2 can also be used in conjunction with heat dissipation structures made of other materials (such as metal heat sink blocks) to dissipate heat. The metal heat sink blocks are arranged on the Figure 2 Between the middle-shaped heat sink 5 and the graphene heat sink 3, the metal heat sink block can be considered as a part of the heat sink 5.

[0061] The DMD imaging device provided by the present invention utilizes a graphene heat sink 3 as a heat transfer medium. Graphene exhibits excellent thermal conductivity and, simply by contact with the DMD 2, can meet the DMD 2's heat dissipation requirements. This eliminates the need for pressing a silicone heat sink or similar material onto the DMD 2 via a compression mechanism, as is commonly done in the prior art. The DMD 2's reciprocating motion under heat is enhanced in the present invention. A first surface 31 of the graphene heat sink 3 adheres to the outer surface 12 of the housing 1 and the main surface 22 of the DMD 2. A second surface 32 of the graphene heat sink 3 contacts the radiator 5, and the contact area is greater than the area of ​​the first portion 33 of the graphene heat sink 3 secured to the main surface 22 of the DMD 2. The graphene heat sink 3 exhibits superior thermal conductivity in the planar direction compared to that in the perpendicular direction. The present invention utilizes this excellent thermal conductivity in the planar direction to rapidly transfer heat generated by the DMD 2 from the first portion 33 to the second portion 34 along the planar direction, effectively dissipating the heat generated by the DMD 2 to a location away from the DMD 2. The heat sink 5 contacts the second surface 32 of the second portion 34 , and the contact area is larger than the area of ​​the first portion 33 . Heat can be transferred to the heat sink 5 via a larger heat conduction area, thereby improving heat dissipation efficiency.

[0062] As an embodiment, the graphene heat sink 3 may not include the third portion 35 , and the first portion 33 is directly connected to the second portion 34 .

[0063] As an embodiment, the area of ​​the second part 34 is not necessarily more than twice that of the first part 33. It is understandable that the area of ​​the second part 34 can be changed according to the area of ​​the outer surface 12 and the size of the radiator 5. The area of ​​the second part 34 is larger than the first part 33, which can improve the heat transfer efficiency. However, the area of ​​the second part 34 is more than twice that of the first part 33, which has a better effect on improving the heat transfer efficiency.

[0064] As an embodiment, the height of the arch 351 does not have to be within the above-mentioned range. It is understandable that the height of the arch 351 of the graphene heat sink 3 can be adaptively adjusted according to the gap between the accommodating cavity 11 and the DMD2 and / or the displacement caused by thermal expansion and contraction, and can also be adjusted according to the different thicknesses of the graphene heat sink 3 itself.

[0065] Reference Figure 2 and Figure 6 To facilitate installation, the graphene heat sink 3 includes a first graphene sub-heat sink 36 and a second graphene sub-heat sink 37. The first graphene sub-heat sink 36 and the second graphene sub-heat sink 37 are arranged on opposite sides of the first connector 21. Part of the first portion 33, the second portion 34 and the third portion 35 are each located on the first graphene sub-heat sink 36 and the other part is located on the second graphene sub-heat sink 37. The first graphene sub-heat sink 36 and the second graphene sub-heat sink 37 each include a sheet body 361 and a first extension portion 362, an intermediate extension portion 363, and a second extension portion 364 integrally formed with the sheet body 361. The first extension portion 362, the intermediate extension portion 363, and the second extension portion 364 are respectively arranged at intervals on the same side of the sheet body 361. The first extension portion 362 and the second extension portion 364 are respectively arranged near opposite ends of the sheet body 361. The intermediate extension portion 363 is located between the first extension portion 362 and the second extension portion 364. The sheet body 361 and the first extension portion 362 and the second extension portion 364 are fixed to the outer surface 12, and are fixed at different positions on the outer surface 12. At least a portion of the intermediate extension portion 363 is fixed to the main surface 22.

[0066] As a variation, refer to Figure 7 The graphene heat sink 3 may not be provided with the first extension portion 362 and / or the second extension portion 364 , and the sheet body 361 may be directly fixed to the outer surface 12 , and the intermediate extension portion 363 may be at least partially fixed to the main surface 22 .

[0067] As an embodiment, the graphene heat sink 3' is provided as a whole, for example Figure 8 The shape of the graphene heat sink 3 can be a "U" shape, including a first portion 33' in contact with the main surface 22, a second portion 34' in contact with the outer surface 12, and further including a third portion located between the first and second portions. It is understood that the shape of the graphene heat sink 3 can be varied based on the shape of the DMD 2, the shape of the housing 1, and the positional relationship between the two. As long as the graphene heat sink 3 can be simultaneously fixed to the main surface 22 and the outer surface 12 and in contact with the heat sink 5, any requirement will be met.

[0068] As an example, refer to Figure 2 and Figure 9The first and second graphene sub-heat sinks 36 and 37 each include opposing first and second ends fixed to the outer surface 12. When two graphene sub-heat sinks are used to dissipate heat from the DMD 2, a gap is left between the two graphene sub-heat sinks for ease of installation. Specifically, the first end 365 of the first graphene sub-heat sink 36 and the first end 371 of the second graphene sub-heat sink 37 are positioned close together, with a first gap 38 between them. Furthermore, the second end 366 of the first graphene sub-heat sink 36 and the second end 372 of the second graphene sub-heat sink 37 are positioned close together, with a second gap 39 between them. First and second sealing strips 381 and 391 are provided at positions corresponding to the first and second gaps 38 and 39, respectively. One end of the first sealing strip 381 is fixed to the first end 365 of the first graphene sub-heat sink 36, and the other end is fixed to the first end 371 of the second graphene sub-heat sink 37, thereby sealing the first gap 38. One end of the second sealing strip 382 is fixed to the second end 366 of the first graphene sub-heat sink 36, and the other end is fixed to the second end 372 of the second graphene sub-heat sink 37, thereby sealing the second gap 39. The heat sink 5 has a relief position 53 corresponding to the first and second sealing strips 381, 391, to accommodate the first and second sealing strips 381, 391. By providing the first and second sealing strips 381, 391, respectively, to seal the first and second gaps 38, 39, dust and impurities can be prevented from entering the accommodating cavity 11. The relief position 53 allows the heat sink 1 to be in close contact with the second surface 32, thereby reducing the ingress of impurities and dust into the housing 1.

[0069] As an example, refer to Figure 2 and Figure 10 A second connector 41 and an FPC 43 are provided on the circuit board 4. The DMD2 is electrically connected to the second connector 41 via the first connector 21, thereby achieving electrical connection between the DMD2 and the circuit board 4. The FPC 43 is also electrically connected to the second connector 41. An elastic pressure piece 42 with notches 421 at both ends is provided on the side of the circuit board 4 away from the DMD2. Positioning posts 131 extend through the circuit board 4 and the notches 421 to locate the relative positions of the components. The elastic pressure piece 42 can press the circuit board 4 and the DMD2 into close contact, and the elastic pressure piece 42 made of a deformable material (such as a curved metal piece) can allow the DMD2 to expand and contract due to heat and cold.

[0070] Reference Figure 11The side of the heat sink 5 near the DMD 2 includes region 1 51 and region 2 52. Region 2 52 is arranged around region 1 51. Region 1 51 is provided with a groove 511. The elastic pressing piece 42 and the circuit board 4 are at least partially accommodated in the groove 511. The size of the elastic pressing piece 42 at maximum deformation is greater than or equal to the size of the groove 511. Region 1 51 is also provided with a wiring channel 512 for leading out the FPC 43. A third sealing strip 513 is provided on the second surface 32 and / or the outer surface 12. In the installed state, the third sealing strip 513 is located in the wiring channel 512 to seal the wiring channel 512. A fixing hole 521 is provided on the surface of region 2 52. A fixing member passes through the fixing hole 521 to be fixedly connected to the housing 1. The fixing member can be a screw, a rivet, but is not limited thereto.

[0071] As an embodiment, the position at which the third sealing strip 513 is set can change due to the size change of the graphene heat sink 3. For example, if the wiring channel 512 does not have a graphene heat sink 3 at the position of the outer surface 12 corresponding to the wiring channel 512, it is only necessary to fix the third sealing strip 513 on the outer surface 12; if the wiring channel 512 corresponds to the outer surface 12 and the graphene heat sink 3 completely covers the outer surface 12, it is only necessary to fix the third sealing strip 513 on the second surface 32; if the wiring channel 512 corresponds to the outer surface 12 and only has a part of the graphene heat sink 3, it is necessary to set the third sealing strip 513 on both the outer surface 12 and the second surface 32 to seal the wiring channel 512 to prevent dust and impurities from entering the shell 1.

[0072] It can be understood that the present invention provides a DMD imaging device, including a shell, a DMD and a circuit board, the shell having a accommodating cavity, the DMD being installed in the accommodating cavity, the DMD and the circuit board being respectively provided with a first connector and a second connector, the DMD and the circuit board being electrically connected through the first connector and the second connector, characterized in that: the DMD imaging device also includes a graphene heat sink and a radiator, the graphene heat sink having a first surface and a second surface relative to each other; the shell having an outer surface located on the periphery of the accommodating cavity, and the DMD having a main surface located on the periphery of the first connector.

[0073] The graphene heat sink includes a first portion and a second portion, the second portion is farther away from the DMD than the first portion, the area of ​​the second portion is larger than the area of ​​the first portion, the first surface of the first portion is fixed to the main surface, and the first surface of the second portion is fixed to the outer surface;

[0074] The radiator is located on a side of the circuit board away from the DMD and is fixedly connected to the housing, and the edge of the radiator close to the side of the DMD contacts the second surface of the graphene heat sink. The position where the radiator contacts the second surface is located in the second part, and the contact area is larger than the area of ​​the first part.

[0075] The heat generated by the DMD during operation is transferred from the first portion of the graphene heat sink to the second portion, and then dissipated by the heat sink.

[0076] In a second aspect, the present application also provides a device based on DMD imaging, comprising a housing in which the above-mentioned DMD imaging device is installed.

[0077] The device based on DMD imaging can be a 3D scanner, a 3D printing device or a projector. When the current DMD imaging device dissipates heat from the DMD, the DMD has poor movement consistency under thermal expansion and contraction, which will cause certain errors in the DMD's working imaging. This error is not obvious in the projection equipment used for daily projection, but when it is used in 3D scanners, 3D printing equipment and other equipment with high precision requirements (sensitive to temperature), such errors will affect the working results of the 3D scanners, 3D printing equipment and the like. However, the DMD imaging device provided by the present invention uses a graphene heat sink with good thermal conductivity, so there is no need for a heat sink pressing structure with a large pressure. The DMD can move freely when it expands and contracts, and the consistency of movement is improved, eliminating the errors caused by the thermal expansion and contraction of the DMD.

[0078] Those skilled in the art will appreciate that, provided there is no conflict, the above preferred solutions can be freely combined and superimposed.

[0079] It should be understood that the above-mentioned embodiments are merely illustrative and non-restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by those skilled in the art to the above-mentioned details will be included in the scope of the claims of the present invention.

Claims

1. A DMD imaging device comprising a housing, a DMD, and a circuit board, wherein the housing defines a housing cavity, the DMD being mounted in the housing cavity, the DMD and the circuit board being respectively provided with a first connector and a second connector, the DMD and the circuit board being electrically connected via the first connector and the second connector, characterized in that: The DMD imaging device further includes a graphene heat sink and a heat sink, wherein the graphene heat sink has a first surface and a second surface opposite to each other; the housing has an outer surface located at the periphery of the accommodating cavity, and the DMD has a main surface located at the periphery of the first connector; The graphene heat sink includes a first portion and a second portion, the second portion is farther away from the DMD than the first portion, the area of ​​the second portion is larger than the area of ​​the first portion, the first surface of the first portion is fixed to the main surface, and the first surface of the second portion is fixed to the outer surface; The heat sink is located on a side of the circuit board away from the DMD and is fixedly connected to the housing. An edge of the heat sink close to the DMD contacts the second surface of the graphene heat sink. The heat sink contacts the second surface at the second portion, and the contact area is larger than the area of ​​the first portion. The heat generated by the DMD operation is transferred from the first portion of the graphene heat sink to the second portion, and then dissipated by the heat sink; The thermal conductivity of the graphene heat sink in the plane extension direction is better than the thermal conductivity in the direction perpendicular to the plane extension direction; The heat sink is not in contact with the first portion; The graphene heat sink includes a third portion, the third portion is located between the first portion and the second portion, and the first portion, the third portion, and the second portion are distributed in a circumferential direction of the first connector or the second connector in a direction away from the first connector or the second connector; The outer surface is parallel to the main surface, and the third portion includes a ridge formed in a direction perpendicular to the outer surface or the main surface.

2. The DMD imaging device according to claim 1, wherein: The graphene heat sink is fixed to the main surface and the outer surface via an adhesive layer; The graphene heat sink includes a first graphene sub-heat sink and a second graphene sub-heat sink, and the first graphene sub-heat sink and the second graphene sub-heat sink are arranged on opposite sides of the first connector; the first part, the second part and the third part are each partially located on the first graphene sub-heat sink and the other part is located on the second graphene sub-heat sink.

3. The DMD imaging device according to claim 2, wherein: The first graphene sub-heat sink and the second graphene sub-heat sink each include a sheet body and a first extension portion, an intermediate extension portion, and a second extension portion integrally formed with the sheet body. The first extension portion, the intermediate extension portion, and the second extension portion are respectively arranged at intervals on the same side of the sheet body. The first extension portion and the second extension portion are respectively arranged close to the ends of the sheet body. The intermediate extension portion is located between the first extension portion and the second extension portion. The sheet body and the first extension portion and the second extension portion are fixed to the outer surface and are fixed at different positions on the outer surface. At least a portion of the intermediate extension portion is fixed to the main surface.

4. The DMD imaging device according to claim 2, wherein: The first graphene sub-heat sink and the second graphene sub-heat sink each include a first end and a second end fixed to the outer surface, the first end of the first graphene sub-heat sink and the first end of the second graphene sub-heat sink being close to each other with a first gap therebetween, and the second end of the first graphene sub-heat sink and the second end of the second graphene sub-heat sink being close to each other with a second gap therebetween; A first sealing strip and a second sealing strip are provided, wherein one end of the first sealing strip is fixed to the first end of the first graphene sub-heat sink, and the other end is fixed to the first end of the second graphene sub-heat sink, thereby sealing the first gap; one end of the second sealing strip is fixed to the second end of the first graphene sub-heat sink, and the other end is fixed to the second end of the second graphene sub-heat sink, thereby sealing the second gap; The heat sink is provided with avoidance positions for accommodating the first sealing strip and the second sealing strip at positions corresponding to the first sealing strip and the second sealing strip.

5. The DMD imaging device according to claim 2, wherein: The accommodating cavity is rectangular, having a first long side, a second long side, a first short side and a second short side relative to each other. There is a gap between the DMD side wall and the side wall of the accommodating cavity, and the arches on the two graphene heat sinks are respectively arranged corresponding to the gaps at the positions of the first long side and the second long side.

6. The DMD imaging device according to claim 5, wherein: A fixed limiter is provided at the gap parallel to the first short side and the second short side, and the fixed limiter cooperates with the convex and concave of the DMD to limit the position of the DMD. An elastic member and a force conduction block are provided at the corner of the accommodating cavity. The shape of the surface of the force conduction block facing the DMD matches the shape of the DMD corner, and the surface facing the corner of the accommodating cavity is an inclined plane. The elastic member is fixedly connected to the shell, and one end passes through the outside of the shell to the inside of the shell and elastically abuts on the inclined plane, so that the force conduction block abuts at the corner of the DMD.

7. The DMD imaging device according to claim 1, wherein: The thickness of the graphene heat sink is 0.5-2 mm, and the height of the arch is 0.5-2.5 mm.

8. The DMD imaging device according to claim 1, wherein: The area of ​​the second portion is more than twice the area of ​​the first portion.

9. The DMD imaging device according to any one of claims 1 to 8, wherein: The side of the heat sink close to the DMD includes a first area and a second area, the second area is arranged around the first area, the first area is provided with a groove, the second area is provided with a fixing hole, and the fixing member passes through the fixing hole and is fixedly connected to the housing; A metal pressing plate with notches at both ends is provided on the side of the circuit board away from the DMD, and a positioning column is provided on the shell, and the positioning column passes through the circuit board and the notch; the pressing plate and at least part of the circuit board are accommodated in the groove; the size of the metal pressing plate under maximum elastic deformation is greater than or equal to the size of the groove.

10. The DMD imaging device according to claim 9, wherein: The circuit board is connected to an FPC, which is electrically connected to the second connector. A wiring channel is provided on area one for leading out the FPC. A third sealing strip is provided on the second surface and / or the outer surface. In the installed state, the third sealing strip is located in the wiring channel to seal the wiring channel.

11. A DMD imaging device comprising a housing, characterized in that: The DMD imaging device according to any one of claims 1 to 10 is installed in the housing.

12. The DMD imaging device according to claim 11, wherein: The device is a 3D scanner, a 3D printing device or a projector.

Images